CN110733140B - Sapphire wafer cutting equipment and process - Google Patents
Sapphire wafer cutting equipment and process Download PDFInfo
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- CN110733140B CN110733140B CN201911022763.5A CN201911022763A CN110733140B CN 110733140 B CN110733140 B CN 110733140B CN 201911022763 A CN201911022763 A CN 201911022763A CN 110733140 B CN110733140 B CN 110733140B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
Abstract
The invention discloses sapphire wafer cutting equipment and a process, which comprise a first support plate, a second support plate, a bottom plate, a U-shaped support plate, a side sliding plate, a strip-shaped groove, a long cylinder, a first cylinder, a strip-shaped cutter, a second cylinder, an L-shaped plate, a ring frame, a bearing, a ring gear, a short cylinder, a screw rod, a servo motor, a driving gear, a ball, a first sucker, a third cylinder, a threaded long rod, a second sucker, a threaded deep hole and a circular plate. According to the invention, two ends of a sapphire crystal bar to be cut are conveniently fixed through two corresponding suckers and a connecting structure, and meanwhile, the effect of gradually feeding materials to a cutting structure can be achieved under the pushing action of the third cylinder and the assistance of the balls on the push rod of the first cylinder, and the same part of the sapphire crystal bar can be cut by starting the second cylinder to push the connected strip-shaped cutter to stretch the cutter stage by stage, so that the condition of cutter clamping can be avoided, the same cutting amount every time is ensured, the problem that the cut sapphire crystal wafer falls off can be avoided, and the yield is improved.
Description
Technical Field
The invention relates to cutting equipment and a cutting process, in particular to sapphire wafer cutting equipment and a sapphire wafer cutting process, and belongs to the technical field of sapphire wafer cutting application.
Background
The wafer is one of the main raw materials of the LED, is the luminous component of the LED, the most core part of the LED, the quality of the wafer directly determines the performance of the LED, the wafer is composed of III and V group compound semiconductor substances, and when the LED is packaged, the wafer materials are arranged on a wafer film in order, such as a sapphire wafer.
In the process of cutting the sapphire crystal bar into a plurality of sapphire wafers, because the situation of cutter clamping can occur due to improper operation of a cutting blade, after the sapphire crystal bar is cut into the sapphire crystal bar, the feeding speed is low, the sapphire crystal bar is discontinuous or part of cutting equipment is short of a feeding structure, and paired sapphire crystal bars are cut into the sapphire crystal bar, so that the sapphire crystal bar is accidentally dropped and damaged in the separation moment. Therefore, a sapphire wafer cutting apparatus and process are proposed to solve the above problems.
Disclosure of Invention
The present invention is directed to a sapphire wafer cutting apparatus and process for solving the above problems.
The invention realizes the purpose through the following technical scheme, and the sapphire wafer cutting equipment comprises a long cylinder, a clamping mechanism, an extension cutting mechanism and a driving mechanism, wherein the annular surface of the long cylinder is in sliding connection with two corresponding strip-shaped grooves through two side sliding plates, the two strip-shaped grooves are formed in the end surfaces of two ends of a U-shaped support plate, and one end of a threaded long rod is rotatably arranged at the other end in each strip-shaped groove;
the clamping mechanism comprises a first air cylinder, four screw rods and a third air cylinder, the third air cylinder is installed on the end face of one end of the long cylinder, a push rod of the third air cylinder is provided with a first sucker, the number of the first air cylinders is four, the four first air cylinders are annularly installed at one end of the annular face of the long cylinder, balls are installed on the end face of one end of the push rod of the first air cylinder in a rolling mode, the screw threads penetrate through the middle position of the inner circular wall of the short cylinder, and one end of each screw rod is rotatably provided with a second sucker;
the stretching and cutting mechanism comprises a strip-shaped cutter, the top end of the strip-shaped cutter is installed at one end of a push rod of a second cylinder, the strip-shaped cutter is connected with the corresponding part of the inner annular wall of the end opening of the short cylinder in a sliding mode, the second cylinder is installed on a transverse plate of the L-shaped plate, and the second cylinder is connected with a pneumatic controller and a micro air pump which are installed on the short cylinder through a hose;
the driving mechanism comprises a ring gear, the ring gear is assembled at one end of the short cylinder and is meshed with a driving gear, the driving gear is installed at one end of a shaft rod of the servo motor, and the servo motor is installed on one side of the first supporting plate;
one end of the strip-shaped groove is communicated with the side wall of the U-shaped support plate, a threaded deep hole is formed in the bottom of one side wall of the side sliding plate, and the threaded deep hole is in threaded connection with the threaded long rod.
Preferably, the periphery of the circular suction port of the second sucker is fixed in the middle hole structure of the circular plate, and the second sucker and the first sucker are consistent in structural composition.
Preferably, the bottom of the U-shaped support plate is arranged on the surface of the top of the bottom plate, and one side of the top of the bottom plate is provided with the bottom end of a second support plate.
Preferably, the second support plate is arranged at the bottom of the annular surface of the annular frame, the annular frame is rotatably connected with the short cylinder through a bearing, and the bearing is assembled in the middle of the short cylinder.
Preferably, the annular surface at the port of the short cylinder is provided with a through hole, and the through hole is mutually connected with the strip-shaped cutter in a sliding manner.
Preferably, a connecting strip block is installed on one side of the vertical plate of the L-shaped plate and is in sliding connection with a connecting strip groove formed in one side wall of the strip-shaped cutter.
Preferably, the central axis of the first sucker coincides with the central axis of the second sucker, and the suction surface of the corresponding sucker is fixedly adsorbed to the corresponding smooth end surface of the column rod.
Preferably, the process for cutting the sapphire wafer by the sapphire wafer cutting apparatus comprises the following steps:
firstly, fixing a cylindrical sapphire crystal bar: the smooth end face of the sapphire crystal bar is fixedly connected with a third cylinder through a first sucking disc and is positioned in the long cylinder, and meanwhile, four first cylinders which are distributed annularly are started to slightly cling to the annular face of the sapphire crystal bar through rolling of balls, so that the sapphire crystal bar to be cut into circular pieces can be fixed;
secondly, adjusting and fixing: adjusting the distance between the inner side wall of the strip-shaped cutter and the adsorption surface of the second sucker according to the thickness of the cut sapphire wafer, wherein the distance is the thickness of the cut sapphire wafer, and the other end of the fixed sapphire crystal bar is pushed to gradually extend into the end opening of the short cylinder and be mutually adsorbed and fixed with the second sucker by starting the third cylinder, so that the two ends of the sapphire crystal bar can be simultaneously fixed;
thirdly, adjusting the cutter: the blade end of the connected strip-shaped cutter is pushed to be attached to the corresponding position of the annular surface of the sapphire crystal bar in an extending state by starting the second cylinder;
fourthly, cutting: the servo motor is started to operate to drive the short cylinder connected with the driving gear and the ring gear and the connecting part of the short cylinder to rotate at a proper speed, and meanwhile, the strip-shaped cutter is divided into a plurality of times of equal feed lengths under the action of the controlled second air cylinder, so that the sapphire crystal bar can be cut in a circulating and gradual mode, and the condition of cutter clamping is avoided;
fifthly, taking out the slices: after the sapphire wafer is to be cut and separated, an operator rotates the threaded long rod to drive the two side sliding plates and the long cylinder to move rightwards under the mutual action of force, so that the sapphire wafer bar can be separated from the cut sapphire wafer, and the space for taking out the sapphire wafer is reserved;
and sixthly, repeating the operation mode for cutting a plurality of sapphire crystal bars into a plurality of sapphire crystal wafers in a limited and reasonable mode.
The invention has the beneficial effects that:
1. the cutting device is reasonable in structural design, two ends of a sapphire crystal bar to be cut are conveniently fixed through the two corresponding suckers and the connecting structure, meanwhile, the effect of gradually feeding materials to the cutting structure can be achieved under the pushing action of the third air cylinder and the assistance of the balls on the push rod of the first air cylinder, and the feeding length of each time is consistent with the thickness of a cut sapphire crystal wafer.
2. The cutting device is compact in structural design, the strip-shaped cutter is pushed to stretch the cutter to cut the same part of the sapphire crystal bar by stages by starting the second air cylinder, the condition of cutter clamping can be avoided, meanwhile, the strip-shaped cutter can perform annular cutting around the same part of the sapphire crystal bar, and the same cutting amount of each time is ensured.
3. According to the invention, the end face of the sapphire crystal bar to be separated is always adsorbed and fixed by the second sucker, so that the problem that the cut sapphire crystal wafer falls off can be avoided, and the yield is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a perspective view of the overall structure of the present invention;
FIG. 2 is a cross-sectional view of the overall structure of the present invention;
FIG. 3 is a partial cross-sectional view of a U-shaped plate of the present invention;
FIG. 4 is a schematic view of the connection structure of the second suction cup and the circular plate according to the present invention.
In the figure: 1. the device comprises a first support plate, a second support plate, a base plate, a U-shaped support plate, a side sliding plate, a strip-shaped groove, a long cylinder, a first cylinder, a strip-shaped cutter, a second cylinder, a first cylinder, a second cylinder, a first L-shaped plate, a second cylinder, a second L-shaped plate, a second cylinder, a third cylinder, a second L-shaped plate, a third cylinder, a bearing, a third cylinder, a.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Referring to fig. 1-4, a sapphire wafer cutting apparatus comprises a long cylinder 7, a clamping mechanism, a stretch-cutting mechanism and a driving mechanism, wherein the annular surface of the long cylinder 7 is slidably connected with two corresponding strip-shaped grooves 6 through two side sliding plates 5, the two strip-shaped grooves 6 are formed in the end surfaces of two ends of a U-shaped support plate 4, and one end of a threaded long rod 22 is rotatably mounted at the other end in each strip-shaped groove 6;
the clamping mechanism comprises first air cylinders 8, screw rods 16 and third air cylinders 21, the third air cylinders 21 are installed on the end face of one end of the long cylinder 7, first sucking discs 20 are installed on push rods of the third air cylinders 21, the number of the first air cylinders 8 is four, the four first air cylinders 8 are annularly installed at one end of the annular face of the long cylinder 7, balls 19 are installed on the end faces of the push rods of the first air cylinders 8 in a rolling mode, the screw rods 16 penetrate through the middle position of the inner circular wall of the short cylinder 15 in a threaded mode, and second sucking discs 23 are installed at one ends of the screw rods 16 in a rotating mode;
the stretching and cutting mechanism comprises a strip-shaped cutter 9, the top end of the strip-shaped cutter 9 is installed at one end of a push rod of a second cylinder 10, the strip-shaped cutter 9 is connected in a sliding mode and penetrates through the corresponding part of the inner annular wall of the port of the short cylinder 15, the second cylinder 10 is installed on a transverse plate of the L-shaped plate 11, and the second cylinder 10 is connected with a pneumatic controller and a micro air pump which are installed on the short cylinder 15 through hoses;
the driving mechanism comprises a ring gear 14, the ring gear 14 is assembled at one end of a short cylinder 15, the ring gear 14 is in meshed connection with a driving gear 18, the driving gear 18 is installed at one end of a shaft rod of a servo motor 17, and the servo motor 17 is installed on one side of the first support plate 1;
one end of the strip-shaped groove 6 is communicated with the side wall of the U-shaped support plate 4; the bottom of one side wall of the side sliding plate 5 is provided with a threaded deep hole 24, and the threaded deep hole 24 is in threaded connection with the threaded long rod 22.
The periphery of the circular suction port of the second sucker 23 is fixed in the middle hole structure of the circular plate 25, and the second sucker 23 and the first sucker 20 are consistent in structure composition.
The bottom of the U-shaped support plate 4 is arranged on the surface of the top of the bottom plate 3, and the bottom end of the second support plate 2 is arranged on one side of the top of the bottom plate 3.
The second support plate 2 is arranged at the bottom of the annular surface of the ring frame 12, the ring frame 12 is rotatably connected with the short cylinder 15 through a bearing 13, and the bearing 13 is assembled in the middle of the short cylinder 15.
And a through hole is formed in the annular surface at the port of the short cylinder 15 and is in mutual sliding connection with the strip-shaped cutter 9.
A connecting strip block is installed on one side of a vertical plate of the L-shaped plate 11, and the connecting strip block is in sliding connection with a connecting strip groove formed in one side wall of the strip-shaped cutter 9.
The central axis of the first sucker 20 coincides with the central axis of the second sucker 23, and the suction surface of the corresponding sucker is fixedly adsorbed with the corresponding smooth end surface of the column rod.
The process for cutting the sapphire wafer by the sapphire wafer cutting equipment comprises the following steps:
firstly, fixing a cylindrical sapphire crystal bar: fixedly connecting the smooth end face of the sapphire crystal bar with a third cylinder 21 through a first sucking disc 20 and locating the smooth end face in a long cylinder 7, starting four first cylinders 8 which are distributed annularly, rolling through balls 19 and slightly attaching and pressing the cylinders on the annular face of the sapphire crystal bar, and fixing the sapphire crystal bar to be cut into circular sheets;
secondly, adjusting and fixing: the distance between the inner side wall of the strip-shaped cutter 9 and the adsorption surface of the second sucker 23 is adjusted according to the thickness of the cut sapphire wafer, the distance is equal to the thickness of the cut sapphire wafer, and the other end of the fixed sapphire crystal bar is pushed to gradually extend into the port of the short cylinder 15 by starting the third air cylinder 21 and is mutually adsorbed and fixed with the second sucker 23, so that the two ends of the sapphire crystal bar can be simultaneously fixed;
thirdly, adjusting the cutter: the blade end of the connected strip-shaped cutter 9 is pushed to be attached to the corresponding position of the ring surface of the sapphire crystal bar by starting the second cylinder 10 to be in an extension state;
fourthly, cutting: the servo motor 17 is started to operate to drive the short cylinder 15 connected with the driving gear 18 and the ring gear 14 and the connected part of the short cylinder to rotate at a proper speed, and meanwhile, the strip-shaped cutter 9 is divided into a plurality of times of equivalent feed lengths under the action of the controlled second air cylinder 10, so that the sapphire crystal bar can be sliced in a circulating and gradual mode, and the condition of cutter clamping is avoided;
fifthly, taking out the slices: after the sapphire wafers are to be cut and separated, an operator rotates the threaded long rod 22 to drive the two side sliding plates 5 and the long cylinder 7 to move rightwards under the mutual action of force, so that the sapphire crystal bars can be separated from the cut sapphire wafers, the distance between the sapphire wafers which can be taken out is reserved, and the sapphire wafers and the second sucking disc 23 are always fixedly adsorbed, so that the phenomenon that the sapphire wafers fall off can be avoided;
and sixthly, repeating the operation mode for cutting a plurality of sapphire crystal bars into a plurality of sapphire crystal wafers in a limited and reasonable mode.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (8)
1. A sapphire wafer cutting apparatus, characterized in that: the device comprises a long cylinder (7), a clamping mechanism, an extension cutting mechanism and a driving mechanism, wherein the annular surface of the long cylinder (7) is in sliding connection with two corresponding strip-shaped grooves (6) through two side sliding plates (5), the two strip-shaped grooves (6) are formed in the end surfaces of two ends of a U-shaped support plate (4), and one end of a threaded long rod (22) is rotatably mounted at the other end in each strip-shaped groove (6);
the clamping mechanism comprises a first air cylinder (8), a screw rod (16) and three air cylinders (21), the three air cylinders (21) are installed on the end face of one end of the long cylinder (7), a push rod of each third air cylinder (21) is provided with a first sucker (20), the number of the first air cylinders (8) is four, the four first air cylinders (8) are annularly installed at one end of the annular face of the long cylinder (7), balls (19) are installed on the end face of one end of the push rod of each first air cylinder (8) in a rolling mode, the screw rod (16) penetrates through the middle position of the inner circular wall of the short cylinder (15) in a threaded mode, and one end of the screw rod (16) is rotatably provided with a second sucker (23);
the stretching and cutting mechanism comprises a strip-shaped cutter (9), the top end of the strip-shaped cutter (9) is installed at one end of a push rod of a second cylinder (10), the strip-shaped cutter (9) is connected with a corresponding part of an inner annular wall of a port of the short cylinder (15) in a sliding mode, the second cylinder (10) is installed on a transverse plate of the L-shaped plate (11), and the second cylinder (10) is connected with a pneumatic controller and a micro air pump which are installed on the short cylinder (15) through a hose;
the driving mechanism comprises a ring gear (14), the ring gear (14) is assembled at one end of the short cylinder (15), the ring gear (14) is meshed with a driving gear (18), the driving gear (18) is installed at one end of a shaft rod of a servo motor (17), and the servo motor (17) is installed on one side of the first support plate (1);
one end of the strip-shaped groove (6) is communicated with the side wall of the U-shaped support plate (4), a threaded deep hole (24) is formed in the bottom of one side wall of the side sliding plate (5), and the threaded deep hole (24) is in threaded connection with the threaded long rod (22).
2. The sapphire wafer dicing apparatus of claim 1, wherein: the periphery of the circular suction port of the second sucker (23) is fixed in the middle hole structure of the circular plate (25), and the second sucker (23) and the first sucker (20) are consistent in structure composition.
3. The sapphire wafer dicing apparatus of claim 1, wherein: the bottom of the U-shaped support plate (4) is arranged on the surface of the top of the bottom plate (3), and the bottom end of the second support plate (2) is arranged on one side of the top of the bottom plate (3).
4. The sapphire wafer dicing apparatus of claim 3, wherein: the second support plate (2) is arranged at the bottom of the annular surface of the annular frame (12), the annular frame (12) is rotatably connected with the short cylinder (15) through a bearing (13), and the bearing (13) is assembled in the middle of the short cylinder (15).
5. The sapphire wafer dicing apparatus of claim 1, wherein: the ring-shaped surface at the port of the short cylinder (15) is provided with a through hole, and the through hole is mutually connected with the strip-shaped cutter (9) in a sliding way.
6. The sapphire wafer dicing apparatus of claim 1, wherein: a connecting strip block is installed on one side of a vertical plate of the L-shaped plate (11), and the connecting strip block is in sliding connection with a connecting strip groove formed in one side wall of the strip-shaped cutter (9).
7. The sapphire wafer dicing apparatus of claim 1, wherein: the central axis of the first sucker (20) is superposed with the central axis of the second sucker (23), and the suction surface of the corresponding sucker is fixedly adsorbed with the corresponding smooth end surface of the column rod.
8. A process for cutting a sapphire wafer using the sapphire wafer cutting apparatus of any one of claims 1-7, wherein: the process comprises the following steps:
firstly, fixing a cylindrical sapphire crystal bar: the smooth end face of the sapphire crystal bar is fixedly connected with a third cylinder (21) through a first sucking disc (20) and is positioned in a long cylinder (7), and meanwhile, four first cylinders (8) which are distributed annularly are started to slightly cling to the annular face of the sapphire crystal bar through rolling balls (19) in a rolling manner, so that the sapphire crystal bar to be cut into circular sheets can be fixed;
secondly, adjusting and fixing: the distance between the inner side wall of the strip-shaped cutter (9) and the adsorption surface of the second sucker (23) is adjusted according to the thickness of the cut sapphire wafer, the distance is the thickness of the cut sapphire wafer, and the other end of the fixed sapphire crystal bar is pushed to gradually extend into the port of the short cylinder (15) and be mutually adsorbed and fixed with the second sucker (23) by starting the third air cylinder (21), so that the two ends of the sapphire crystal bar can be simultaneously fixed;
thirdly, adjusting the cutter: the blade end of the connected strip-shaped cutter (9) is pushed to be attached to the corresponding position of the ring surface of the sapphire crystal bar by starting the second cylinder (10) to be in an extending state;
fourthly, cutting: a servo motor (17) is started to operate to drive a short cylinder (15) connected with a driving gear (18) and a ring gear (14) and a connecting part of the short cylinder to rotate at a proper speed, and meanwhile, a strip-shaped cutter (9) is divided into a plurality of times of equal feed lengths under the action of a controlled second air cylinder (10), so that the sapphire crystal bar can be cut in a circulating and gradual mode, and the condition of cutter clamping is avoided;
fifthly, taking out the slices: after the sapphire wafers are to be cut and separated, an operator rotates the threaded long rod (22) to drive the two side sliding plates (5) and the long cylinder (7) to move rightwards under the mutual action of force, so that the sapphire crystal bars can be separated from the cut sapphire wafers, the distance between the sapphire wafers which can be taken out is reserved, and the sapphire wafers and the second sucking disc (23) are always fixedly adsorbed, so that the sapphire wafers can be prevented from falling;
and sixthly, repeating the operation mode for cutting a plurality of sapphire crystal bars into a plurality of sapphire crystal wafers in a limited and reasonable mode.
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| CN201911022763.5A CN110733140B (en) | 2019-10-25 | 2019-10-25 | Sapphire wafer cutting equipment and process |
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| CN201911022763.5A CN110733140B (en) | 2019-10-25 | 2019-10-25 | Sapphire wafer cutting equipment and process |
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Families Citing this family (2)
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| CN112697492B (en) * | 2020-12-07 | 2022-07-05 | 苏州布克斯包装有限公司 | Sampling cutter for adhesive tape production detection |
| CN113172782A (en) * | 2021-05-17 | 2021-07-27 | 伍路旺 | Single-chip microcomputer wafer slicing device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005041155A (en) * | 2003-07-24 | 2005-02-17 | Nachi Fujikoshi Corp | Processing apparatus of thin film material |
| CN101367255A (en) * | 2008-08-28 | 2009-02-18 | 无锡开源机床集团有限公司 | Driven wheel structure of numerical control cutting machine for cutting silicon wafer |
| CN206277533U (en) * | 2016-12-06 | 2017-06-27 | 浙江晶盛机电股份有限公司 | A kind of workbench rocking equipment for sapphire wafer multi-line cutting machine |
| CN206588489U (en) * | 2016-12-27 | 2017-10-27 | 天津曼科科技有限公司 | A kind of solar energy silicon crystal chip automatic gas cutting machine |
| CN206764898U (en) * | 2017-06-12 | 2017-12-19 | 佛山市翠微自动化科技有限公司 | A kind of plastic pipe fitting cutting machine structure dust exhaust apparatus |
| CN209256461U (en) * | 2018-06-19 | 2019-08-16 | 温州天迪铝业有限公司 | Aluminium alloy aluminium bar process equipment |
| CN208663921U (en) * | 2018-07-26 | 2019-03-29 | 深圳市仨腾电子有限公司 | A kind of wiring board cutting device for processing convenient for controlling Cutting Length |
| CN110026826B (en) * | 2018-09-30 | 2024-04-16 | 浙江晶盛机电股份有限公司 | Full-automatic monocrystalline silicon rod cutting and grinding combined machining integrated equipment and application method thereof |
| CN209452881U (en) * | 2018-12-12 | 2019-10-01 | 天津中玻北方新材料有限责任公司 | A kind of follow-on transverse cutting unit |
| CN209364781U (en) * | 2019-01-08 | 2019-09-10 | 安徽爱信自动化机械有限公司 | A kind of process equipment of plastic tube |
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