CN217280702U

CN217280702U - Film sticking machine for wafer

Info

Publication number: CN217280702U
Application number: CN202220918683.9U
Authority: CN
Inventors: 李辉; 黄宗禹; 廖小明
Original assignee: Chengdu Timemaker Crystal Technology Co ltd
Current assignee: Chengdu Timemaker Crystal Technology Co ltd
Priority date: 2022-04-20
Filing date: 2022-04-20
Publication date: 2022-08-23
Anticipated expiration: 2032-04-20

Abstract

The utility model discloses a sticking film machine for wafer, the on-line screen storage device comprises a base, the top fixed mounting of base has the mounting bracket, elevating assembly is installed at the top of mounting bracket, the adjustable shelf is installed to elevating assembly's expansion end, the subassembly is cut to the interior bottom installation of adjustable shelf membrane, the bottom symmetry of adjustable shelf is rotated and is connected with two guide rolls, pressing components is installed to the bottom of adjustable shelf, the both sides of adjustable shelf all are equipped with the tensioning subassembly, two one side that the adjustable shelf was kept away from to the tensioning subassembly is equipped with respectively and unreels roller and wind-up roll, and unreels roller and wind-up roll all with rotate between the mounting bracket and be connected. The utility model discloses in, through lifting unit, adjustable shelf, guide roll, pressing components, removal subassembly, membrane cutting assembly, the rod of rolling up and unreeling the rod that sets up, can carry out the pad pasting to the wafer automatically, not only can improve pad pasting efficiency, also can guarantee the pad pasting quality simultaneously, be favorable to the wafer later stage to cut the grain operation.

Description

Film sticking machine for wafer

Technical Field

The utility model relates to a wafer technical field especially relates to a sticking film machine for wafer.

Background

The wafer is composed of group III and group V compound semiconductor materials. The wafer needs to be filmed by a film sticking machine in the production process, so that the wafer can be completely cut through in the dicing process;

at present, the film sticking machine for the wafer basically adopts manual film sticking, so that the film sticking efficiency is low, the film sticking quality is poor, and the later-stage grain cutting effect of the wafer is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a film sticking machine for wafers.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a sticking film machine for wafer, includes the base, the top fixed mounting of base has the mounting bracket, lifting unit is installed at the top of mounting bracket, lifting unit's expansion end is installed the adjustable shelf, the subassembly is cut to the interior bottom installation of adjustable shelf membrane, the bottom symmetry of adjustable shelf rotates and is connected with two guide rolls, pressing component is installed to the bottom of adjustable shelf, the both sides of adjustable shelf all are equipped with the tensioning subassembly, two one side that the adjustable shelf was kept away from to the tensioning subassembly is equipped with respectively unreels roller and wind-up roll, and unreels roller and wind-up roll all with the mounting bracket between rotate be connected, install the removal subassembly jointly between mounting bracket and the base, the workstation is installed at the top of removal subassembly.

Further, the lifting component comprises a first telescopic rod and two limiting rods, the first telescopic rod is fixedly installed at the top of the installation frame and is in sliding connection with the installation frame, the movable end of the first telescopic rod and the bottom of the limiting rods are fixedly connected with the movable frame, and the movable frame can be driven to ascend or descend.

Further, the pressing component comprises two fixing seats, the fixing seats are fixedly connected with the movable frame, the first motor and the second motor are fixedly connected with one end of each fixing seat, the screw rod is connected to the inside of each fixing seat in a rotating mode, the screw rod is fixedly connected with the driving shaft of the corresponding first motor, the outer surface of the screw rod is connected with a sliding seat in a threaded mode, the sliding seat is connected with the fixing seats in a sliding mode, the rubber roller is connected between the sliding seats in a rotating mode, the films can be attached to the wafers, and meanwhile air bubbles are prevented from occurring.

Furthermore, the membrane cutting assembly comprises a second telescopic rod, the second telescopic rod is fixedly installed at the inner top of the movable frame, a rotary cylinder is fixedly installed at the movable end of the second telescopic rod, an installation rod is fixedly installed at the movable end of the rotary cylinder, membrane cutters are installed at two ends of the installation rod, membranes can be cut, and separation of the membranes is facilitated.

Further, two the tensioning subassembly all includes the fixed plate, and fixed connection between fixed plate and the mounting bracket, two spring telescopic links of the inclined plane bottom symmetry fixedly connected with of fixed plate, two common fixed mounting has the tensioning roller between the spring telescopic link, can guarantee the rate of tension of membrane, avoids the membrane to take place to relax.

Further, the movable assembly comprises a mounting seat, the mounting seat is fixedly connected with the base and the mounting frame and is connected with the workbench in a sliding mode, a second motor is fixedly mounted on one side of the outer surface of the mounting seat, two synchronous belt wheels are rotatably connected to the inner portion of the mounting seat, a driving shaft of the second motor is fixedly connected with the adjacent synchronous belt wheels, and the synchronous belt wheels are connected with synchronous belts together and fixedly connected with the workbench, so that the workbench can be driven to move conveniently.

Furthermore, surface one side fixed mounting of mounting bracket has two third motors, and the drive shaft of two third motors respectively with unreel between roller and the wind-up roll fixed connection, be convenient for drive the wind-up roll and unreel the roller and rotate.

The utility model has the advantages that:

1. the utility model discloses when using, this sticking film machine for wafer through the lifting unit, adjustable shelf, guide roll, pressing components, removal subassembly, membrane cutting assembly, the rod of rolling up and unreeling the rod that sets up, can carry out the pad pasting to the wafer automatically, not only can improve pad pasting efficiency, also can guarantee the pad pasting quality simultaneously, is favorable to the wafer later stage to cut the grain operation.

2. The utility model discloses when using, this sticking film machine for wafer through the tensioning subassembly that sets up, can guarantee the rate of tension of membrane, avoids the membrane to take place to relax.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a cross-sectional view of the present invention;

FIG. 3 is a schematic structural view of the film cutting assembly of the present invention;

fig. 4 is a schematic structural view of the pressing assembly of the present invention;

fig. 5 is a schematic view of the structure of the moving assembly of the present invention.

Illustration of the drawings:

1. a base; 11. a mounting frame; 2. a work table; 3. a moving assembly; 31. a mounting seat; 32. a synchronous pulley; 33. a synchronous belt; 34. a second motor; 4. unwinding rollers; 5. a tension assembly; 51. a tension roller; 52. a fixing plate; 53. a spring telescopic rod; 6. pressing the components; 61. a screw rod; 62. a slide base; 63. a fixed seat; 64. a first motor; 65. a rubber roller; 7. a lifting assembly; 71. a first telescopic rod; 72. a limiting rod; 8. a film cutting assembly; 81. a rotating cylinder; 82. a second telescopic rod; 83. mounting a rod; 84. a film cutter; 9. a movable frame; 91. a guide roller; 10. and (7) winding the roller.

Detailed Description

Fig. 1 and fig. 2 show, relate to a sticking film machine for wafer, including base 1, base 1's top fixed mounting has mounting bracket 11, lifting unit 7 is installed at the top of mounting bracket 11, lifting unit 7's expansion end installs adjustable shelf 9, adjustable shelf 9's interior bottom is installed the membrane and is cut subassembly 8, adjustable shelf 9's bottom symmetry is rotated and is connected with two guide rolls 91, pressing component 6 is installed to adjustable shelf 9's bottom, adjustable shelf 9's both sides all are equipped with tensioning assembly 5, one side that two tensioning assembly 5 kept away from adjustable shelf 9 is equipped with respectively unreeling roller 4 and wind-up roll 10, and unreeling roller 4 and wind-up roll 10 all with the mounting bracket 11 between rotate and be connected, install removal subassembly 3 between mounting bracket 11 and the base 1 jointly, workstation 2 is installed at removal subassembly 3's top.

The lifting assembly 7 comprises a first telescopic rod 71 and two limiting rods 72, the first telescopic rod 71 is fixedly installed at the top of the mounting frame 11, the limiting rods 72 are connected with the mounting frame 11 in a sliding mode, and the movable end of the first telescopic rod 71 and the bottom of the limiting rods 72 are fixedly connected with the movable frame 9.

Two tensioning assembly 5 all include fixed plate 52, and fixed connection between fixed plate 52 and the mounting bracket 11, and two spring telescopic links 53 of the inclined plane bottom symmetry fixedly connected with of fixed plate 52, common fixed mounting has tensioning roller 51 between two spring telescopic links 53.

Two third motors are fixedly mounted on one side of the outer surface of the mounting frame 11, and driving shafts of the two third motors are fixedly connected with the unwinding roller 4 and the winding roller 10 respectively.

As shown in fig. 3, the film cutting assembly 8 includes a second telescopic rod 82, the second telescopic rod 82 is fixedly installed at the inner top of the movable frame 9, a rotating cylinder 81 is fixedly installed at the movable end of the second telescopic rod 82, an installation rod 83 is fixedly installed at the movable end of the rotating cylinder 81, and film cutters 84 are installed at two ends of the installation rod 83.

As shown in fig. 4, the pressing assembly 6 includes two fixing bases 63, and fixed connection is provided between the fixing bases 63 and the movable frame 9, first motors 64 are respectively fixedly connected to one ends of the two fixing bases 63, the inside of the two fixing bases 63 is respectively connected with a screw rod 61 in a rotating manner, and fixed connection is provided between the screw rod 61 and a driving shaft of the adjacent first motor 64, sliding bases 62 are respectively connected to the outer surfaces of the two screw rods 61 in a threaded manner, and sliding connections are provided between the sliding bases 62 and the fixing bases 63, and rubber rollers 65 are respectively connected between the two sliding bases 62 in a rotating manner.

As shown in fig. 5, the moving assembly 3 includes a mounting seat 31, and the mounting seat 31 is connected with the base 1 and the mounting frame 11 and is connected with the workbench 2 in a sliding manner, a second motor 34 is fixedly mounted on one side of the outer surface of the mounting seat 31, two synchronous pulleys 32 are connected to the mounting seat 31 in a symmetrical manner, a driving shaft of the second motor 34 is connected with the adjacent synchronous pulleys 32 in a fixed manner, the two synchronous pulleys 32 are connected with a synchronous belt 33, and the synchronous belt 33 is connected with the workbench 2 in a fixed manner.

When the film sticking machine for wafers is used, firstly, a tension ring and a wafer are placed on a workbench 2, then a second motor 34 drives an adjacent synchronous belt wheel 32 to rotate, thereby driving a synchronous belt 33 to rotate, thereby driving the workbench 2 to move until the workbench 2 moves to the bottom of a movable frame 9, then a first telescopic rod 71 drives the movable frame 9 to move downwards until a film is stuck on the tension ring, then a first motor 64 drives a screw rod 61 to rotate, thereby driving a rubber roller 65 to move through a sliding seat 62, so that the film is stuck on the tension ring and the wafer, then a second telescopic rod 82 drives a rotary cylinder 81, a mounting rod 83 and a film cutter 84 to move downwards until the film cutter 84 is contacted with the film, then the rotary cylinder 81 drives the mounting rod 83 to rotate, thereby cutting and separating the film through the film cutter 84, then the film cutting component 8 is reset, then a lifting component 7 drives the movable frame 9 to reset, then the third motor drive unreels roller 4 and wind-up roll 10 and rotates to make the membrane remove, tensioning assembly 5 keeps the tensility of membrane when the adjustable shelf 9 removes, then drives workstation 2 through removal subassembly 3 and resets, takes off the wafer afterwards.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. The utility model provides a sticking film machine for wafer, includes base (1), its characterized in that: the film cutting machine is characterized in that a mounting frame (11) is fixedly mounted at the top of the base (1), a lifting assembly (7) is mounted at the top of the mounting frame (11), a movable frame (9) is mounted at the movable end of the lifting assembly (7), a film cutting assembly (8) is mounted at the inner bottom of the movable frame (9), two guide rollers (91) are symmetrically and rotatably connected to the bottom of the movable frame (9), a pressing assembly (6) is mounted at the bottom of the movable frame (9), tensioning assemblies (5) are arranged on two sides of the movable frame (9), an unwinding roller (4) and a winding roller (10) are respectively arranged on one side, far away from the movable frame (9), of each tensioning assembly (5), the unwinding roller (4) and the winding roller (10) are rotatably connected with the mounting frame (11), and a moving assembly (3) is jointly mounted between the mounting frame (11) and the base (1), the top of the moving assembly (3) is provided with a workbench (2).

2. The film sticking machine for wafer according to claim 1, characterized in that: lifting unit (7) include first telescopic link (71) and two gag lever posts (72), and first telescopic link (71) fixed mounting is at the top of mounting bracket (11), and sliding connection between gag lever post (72) and mounting bracket (11), the expansion end of first telescopic link (71) and the bottom of gag lever post (72) all with activity frame (9) between fixed connection.

3. The film sticking machine for wafer according to claim 1, characterized in that: pressing components (6) include two fixing bases (63), and fixed connection, two between fixing base (63) and adjustable shelf (9) the equal fixedly connected with first motor (64) of one end of fixing base (63), two the inside of fixing base (63) all rotates and is connected with lead screw (61), and fixed connection, two between the drive shaft of lead screw (61) and adjacent first motor (64) the equal threaded connection in surface of lead screw (61) has slide (62), and sliding connection, two between slide (62) and fixing base (63) rotate jointly between slide (62) and be connected with rubber roller (65).

4. The film sticking machine for wafers as claimed in claim 1, wherein: subassembly (8) is cut to membrane includes second telescopic link (82), and second telescopic link (82) fixed mounting is at the interior top of adjustable shelf (9), the expansion end fixed mounting of second telescopic link (82) has revolving cylinder (81), the expansion end fixed mounting of revolving cylinder (81) has installation pole (83), membrane cutter (84) are all installed at the both ends of installation pole (83).

5. The film sticking machine for wafers as claimed in claim 1, wherein: two tensioning assembly (5) all include fixed plate (52), and fixed connection between fixed plate (52) and mounting bracket (11), two spring telescopic links (53) of the inclined plane bottom symmetry fixedly connected with of fixed plate (52), two common fixed mounting has tensioning roller (51) between spring telescopic link (53).

6. The film sticking machine for wafers as claimed in claim 1, wherein: remove subassembly (3) including mount pad (31), and between mount pad (31) and base (1) and mounting bracket (11) fixed connection and with sliding connection between workstation (2), surface one side fixed mounting of mount pad (31) has second motor (34), the inside symmetry of mount pad (31) is rotated and is connected with two synchronous pulley (32), and fixed connection between the drive shaft of second motor (34) and adjacent synchronous pulley (32), two synchronous pulley (32) are connected with synchronous belt (33) jointly, and fixed connection between synchronous belt (33) and workstation (2).

7. The film sticking machine for wafers as claimed in claim 1, wherein: two third motors are fixedly mounted on one side of the outer surface of the mounting frame (11), and driving shafts of the two third motors are fixedly connected with the unwinding roller (4) and the winding roller (10) respectively.