CN115513105B - Multi-size integrated epitaxial wafer device - Google Patents
Multi-size integrated epitaxial wafer device Download PDFInfo
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- CN115513105B CN115513105B CN202211463175.7A CN202211463175A CN115513105B CN 115513105 B CN115513105 B CN 115513105B CN 202211463175 A CN202211463175 A CN 202211463175A CN 115513105 B CN115513105 B CN 115513105B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Abstract
The invention belongs to the field of semiconductors, and particularly relates to a multi-size integrated epitaxial wafer device which comprises a fixed base, a connecting pipe and a first circular gear, wherein a fixed frame is fixedly welded on the fixed base, a driving assembly is installed on the fixed frame, an adsorption positioning assembly is installed on the connecting pipe, a servo motor is fixedly welded on the fixed base, a filter screen plate and an exhaust fan are fixedly welded on the connecting pipe, a third circular gear is connected onto the second circular gear in a meshed mode, and automatic positioning separation assemblies are installed on the second circular gear and the third circular gear.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a multi-size integrated epitaxial wafer device.
Background
The semiconductor lighting is used as a novel high-efficiency solid light source, has the advantages of long service life, energy conservation, environmental protection, safety and the like, the application field of the semiconductor lighting is rapidly expanding, the core of the semiconductor lighting is a Light Emitting Diode (LED), a light emitting layer is generally added between an N-type layer and a P-type layer of a PN junction in order to increase the luminous efficiency of the LED, the specific structure of the LED is mainly formed by sequentially growing the N-type layer, an active region and the P-type layer on a substrate by an epitaxial growth method, the GaN-based LED generally grows on a heterogeneous substrate of Si, siC or sapphire and the like because a low-cost GaN homogeneous substrate does not exist, the sapphire substrate is the most widely used, a large number of substrates are simultaneously placed in manufacturing equipment by using a collecting device, the N-type layer is manufactured by the epitaxial growth method, the materials of the light emitting layer and the P-type LED epitaxial wafer are called LED epitaxial wafers, LED devices can be manufactured on the LED epitaxial wafers by conventional semiconductor processes of preparing an N electrode, a P electrode, an isolation protective layer and the like, and the conventional collecting equipment for producing the epitaxial wafers has some problems.
Because the substrate is circular mostly, and the diameter of different substrates is different, therefore conventional set device is in the use, can not carry out convenient stable batch formula to the substrate of different diameters and adsorb fixedly, can not fix the whole absorption of set device in manufacturing equipment simultaneously, and then can not guarantee follow-up epitaxial wafer growth state's stability and safety, and epitaxial wafer after the work of growing, the set device can not carry out convenient stable batch formula to the substrate and break away from the work, and then can not guarantee that the staff is follow-up convenient and high-efficient to the work of taking of epitaxial wafer, consequently need provide a many sizes set epitaxial wafer device and satisfy user's demand.
Disclosure of Invention
The present invention has been made in view of the problems in the conventional multi-size collective epitaxial wafer device.
To solve the above technical problem, according to an aspect of the present invention, the present invention provides the following technical solutions: the utility model provides a many sizes set epitaxial wafer device, includes unable adjustment base, connecting pipe and first circular gear, welded fastening has fixed frame on the unable adjustment base, install drive assembly on the fixed frame, install on the connecting pipe and adsorb locating component, welded fastening has servo motor on the unable adjustment base, welded fastening has filter plate and exhaust fan on the connecting pipe, the bolt is installed and is heated electric pipe on filter plate's the bottom face, the meshing is connected with second circular gear on the first circular gear, the meshing is connected with third circular gear on the second circular gear, all install automatic positioning on second circular gear and the third circular gear and break away from the subassembly.
As a preferable aspect of the multi-size collective epitaxial wafer apparatus according to the present invention, wherein: the drive assembly is including fixed pipe and connecting rod, fixed pipe welded fastening is on fixed frame, it has seted up the card hole to run through on the fixed pipe, connecting rod and the equal spacing sliding connection of connecting pipe are in fixed intraductal, the top welded fastening of connecting rod has the layer board, the bottom of connecting rod is connected for rotating with the top of connecting pipe, welded fastening has flexible kelly on the connecting rod, welded fastening has fixed spring in the flexible kelly, the top welded fastening of connecting pipe has reset spring, the reset spring cover is established on the connecting pipe, first circular gear welded fastening is on fixed pipe.
As a preferable aspect of the multi-size collective epitaxial wafer apparatus according to the present invention, wherein: the diameter of fixed pipe is greater than the diameter of connecting pipe, the top central point at the connecting pipe is fixed to the connecting rod, flexible kelly symmetric distribution is in the both sides of connecting rod, flexible kelly and card hole one-to-one, circular-arc is personally submitted on the top of flexible kelly.
As a preferable aspect of the multi-size collective epitaxial wafer apparatus according to the present invention, wherein: adsorb locating component includes the sealing washer, sealing washer screwed connection is on the bottom face of connecting pipe, spacing sliding connection has first rubber piston in the connecting pipe, first rubber piston fixed connection is on the top of servo motor output shaft, servo motor's the spacing sliding connection of output shaft is on the sealing washer, the screwed connection has a filter screen section of thick bamboo on the connecting pipe, the connecting pipe is connected with the connecting cylinder through sealed bearing, bolted connection has the conveyer pipe on the connecting cylinder, bolted connection has rubber hose on the conveyer pipe, rubber hose's bottom bolted connection has rubber suction cup, rubber suction cup's top fixed connection is on unable adjustment base's bottom face.
As a preferable aspect of the multi-size collective epitaxial wafer apparatus according to the present invention, wherein: the diameter of sealing washer is greater than the diameter of servo motor output shaft, the diameter and the thickness of filter screen section of thick bamboo equal with the diameter and the thickness of connecting pipe respectively, the length of filter screen section of thick bamboo is less than the length of connecting cylinder, angular distribution such as conveyer pipe is on the connecting cylinder, the rubber hose equidistance distributes on the connecting cylinder, rubber hose and rubber suction cup one-to-one.
As a preferable aspect of the multi-size collective epitaxial wafer apparatus according to the present invention, wherein: the electric heating pipe is spiral, the second circular gear is distributed on the first circular gear at equal angles, and the third circular gear is symmetrically distributed on two sides of the second circular gear.
As a preferable aspect of the multi-size collective epitaxial wafer apparatus according to the present invention, wherein: the automatic positioning separation assembly comprises a collecting barrel, the collecting barrel is respectively welded and fixed on a central shaft of the second circular gear and a central shaft of the third circular gear, a rubber frame is connected to the collecting barrel through screws, a rubber plate is connected to the rubber frame through screws, a grading groove is formed in the rubber plate, and shunting fan blades are welded and connected to the outer surface of the collecting barrel.
As a preferable aspect of the multi-size collective epitaxial wafer apparatus according to the present invention, wherein: the internal diameter of rubber slab is greater than the internal diameter of a collection section of thick bamboo, the classifying trough equidistance distributes on the rubber slab, the diameter of classifying trough is from top to bottom degressive step by step.
As a preferable aspect of the multi-size collective epitaxial wafer apparatus according to the present invention, wherein: the filter screen plate is characterized in that a second rubber piston is connected to the inner portion of the collecting cylinder in a limiting sliding mode, a supporting rod is connected to the bottom end of the second rubber piston through a screw, the bottom end of the supporting rod is fixed to the top end face of the filter screen plate in a welding mode, the collecting cylinder is connected to the connecting screen plate in a rotating mode, and the connecting screen plate is connected to the fixing pipe in a rotating mode.
As a preferable aspect of the multi-size collective epitaxial wafer apparatus according to the present invention, wherein: the collecting cylinder corresponds to the supporting rods one by one through the second rubber pistons, the supporting rods are fixed at the center of the bottom of the second rubber pistons, and the length of each supporting rod is greater than that of the collecting cylinder.
Compared with the prior art, the invention has the beneficial effects that:
1. be provided with the automatic positioning and break away from the subassembly, utilize each hierarchical groove on the rubber slab to carry out convenient stable spacing work of placing to the epitaxial wafer of different specifications size, place stable back at the device afterwards, utilize drive assembly can drive the automatic downstream of second rubber piston, and then can carry out the fixed work of absorption of automatic stabilization to the epitaxial wafer of placing on the rubber slab, thereby can guarantee the stability of the follow-up manufacture work of epitaxial wafer, the same reason, after taking the device, utilize drive assembly can drive the automatic upward movement of second rubber piston, and then can upwards promote the automatic work of breaking away from of the epitaxial wafer of placing on the rubber slab, thereby can guarantee the follow-up work of taking of epitaxial wafer convenient and high-efficient, the use convenience and the high efficiency of collection device have been improved effectively.
2. Be provided with and adsorb locating component, the device is placed stably the back, utilize reset spring can drive the connecting pipe upward movement, inside first rubber piston can upwards carry out stable relative motion in the connecting pipe, utilize the motion of first rubber piston, can carry out automatic extraction with the air in the rubber suction cup through the rubber hose on the conveyer pipe, utilize the negative pressure in each rubber suction cup can be fixed the absorption of the whole automatic stabilization of device in the device, and then can guarantee the stability and the safety of epitaxial wafer follow-up production manufacturing work.
3. Be provided with drive assembly, the staff only needs the layer board upward movement of taking, and the layer board can drive the connecting pipe upward movement through the connecting rod this moment, and then can drive simultaneously and adsorb locating component and automatic positioning and break away from the subassembly, and utilize the cooperation in flexible kelly and card hole to guarantee the stability of connecting rod fixed state, and then can guarantee the whole operating condition's of device stability, effectively improved the work efficiency of device.
4. Be provided with exhaust fan and reposition of redundant personnel flabellum, the rotation that utilizes exhaust fan and each reposition of redundant personnel flabellum can be with the stable even transport of hot-air to each epitaxial wafer department that electric heating pipe heating produced, and utilize first circular gear, the meshing between second circular gear and the third circular gear, the revolution is carried out in the time of can driving each epitaxial wafer rotation, and then the heating uniformity and the stability of epitaxial wafer can further be improved, thereby can guarantee the stability of each epitaxial wafer follow-up production manufacturing work, the use variety and the stability of device have been increased.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor. Wherein:
FIG. 1 is a schematic view of an overall three-dimensional structure of a multi-dimensional integrated epitaxial wafer device according to the present invention;
FIG. 2 is a schematic perspective view of a rubber plate of a multi-dimension integrated epitaxial wafer device according to the present invention;
FIG. 3 is a schematic perspective view of a filter cartridge of a multi-sized epitaxial wafer assembly of the present invention;
FIG. 4 is a schematic diagram of an overall front view of a multi-dimension integrated epitaxial wafer apparatus according to the present invention;
FIG. 5 is a schematic view of a first rubber piston of a multi-size integrated epitaxial wafer apparatus according to the present invention;
FIG. 6 is a schematic view of a telescopic clamping rod of a multi-size epitaxial wafer collecting device according to the present invention;
FIG. 7 is a schematic view of a spring retaining structure of a multi-dimension integrated epitaxial wafer device according to the present invention;
FIG. 8 is a schematic top view of a third circular gear of a multi-dimension integrated epitaxial wafer apparatus of the present invention;
FIG. 9 is a schematic top view of a seal ring for a multi-dimensional integrated epitaxial wafer device according to the present invention;
FIG. 10 is a schematic top view of an electrical heating tube of a multi-dimensional integrated epitaxial wafer device of the present invention;
FIG. 11 is a schematic view of a manifold cylinder of a multi-size manifold epitaxial wafer apparatus according to the present invention;
FIG. 12 is a schematic top view of a multi-dimension integrated epitaxial wafer device with a graded trench according to the present invention;
FIG. 13 is a schematic top view of a multi-dimension integrated epitaxial wafer device splitter blade according to the present invention.
Reference numbers in the figures: 1. a fixed base; 2. a fixing frame; 3. a drive assembly; 301. a fixed tube; 302. clamping holes; 303. a connecting rod; 304. a support plate; 305. a telescopic clamping rod; 306. a fixed spring; 4. a connecting pipe; 5. a return spring; 6. an adsorption positioning component; 601. a seal ring; 602. a first rubber piston; 603. a screen cylinder; 604. a connecting cylinder; 605. a delivery pipe; 606. a rubber hose; 607. a rubber suction cup; 7. a servo motor; 8. a filter screen plate; 9. an electric heating tube; 10. an exhaust fan; 11. a first circular gear; 12. a second circular gear; 13. a third circular gear; 14. automatically positioning the detachment assembly; 1401. a collecting cylinder; 1402. a rubber frame; 1403. a rubber plate; 1404. grading grooves; 1405. a second rubber piston; 1406. a support bar; 15. shunting fan blades; 16. the net plate is connected.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced otherwise than as specifically described herein, and it will be appreciated by those skilled in the art that the present invention may be practiced without departing from the spirit and scope of the present invention and that the present invention is not limited by the specific details disclosed below.
Next, the present invention is described in detail with reference to the drawings, and in the detailed description of the embodiments of the present invention, the cross-sectional view illustrating the structure of the device is not enlarged partially in general scale for the convenience of illustration, and the drawings are only exemplary, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
Examples
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1 and 4, a multi-size integrated epitaxial wafer device comprises a fixed base 1, a connecting pipe 4 and a first circular gear 11, wherein a fixed frame 2 is welded and fixed on the fixed base 1, a driving component 3 is installed on the fixed frame 2, an adsorption positioning component 6 is installed on the connecting pipe 4, a servo motor 7 is welded and fixed on the fixed base 1, a filter screen plate 8 and an exhaust fan 10 are welded and fixed on the connecting pipe 4, an electric heating pipe 9 is installed on the bottom end face of the filter screen plate 8 through a bolt, a second circular gear 12 is connected to the first circular gear 11 in a meshing manner, a third circular gear 13 is connected to the second circular gear 12 in a meshing manner, and automatic positioning disengaging components 14 are installed on the second circular gear 12 and the third circular gear 13.
When stably placing the device, utilize drive assembly 3 can drive simultaneously and adsorb locating component 6 and the work of automatic positioning break away from subassembly 14, when carrying out stable absorption fixed work to the device, the device can carry out automatic stable absorption fixed work to each epitaxial wafer, thereby can guarantee the stability of the follow-up manufacturing work of epitaxial wafer, the same thing, when taking to the device whole, utilize automatic positioning break away from subassembly 14 can promote the automatic upwards promotion of epitaxial wafer and break away from, and then can guarantee the convenient and high-efficient of the follow-up work of taking of epitaxial wafer, the use convenience and the high efficiency of device have effectively been improved, and utilize the rotation of exhaust fan 10 can be with stable even transport to each epitaxial wafer department of the hot-air that electric heating pipe 9 heating produced, and then can guarantee the stability of the follow-up production manufacturing work of each epitaxial wafer, the use variety and the stability of device have been increased.
As shown in fig. 4 and 6, in this embodiment, the driving assembly 3 includes a fixed pipe 301 and a connecting rod 303, the fixed pipe 301 is welded and fixed on the fixed frame 2, a clamping hole 302 has been opened and penetrated through on the fixed pipe 301, the equal spacing sliding connection of connecting rod 303 and connecting pipe 4 is in fixed pipe 301, the top welded and fixed of connecting rod 303 has a layer board 304, the bottom of connecting rod 303 is connected for rotating with the top of connecting pipe 4, welded and fixed has a flexible clamping rod 305 on the connecting rod 303, shown in combination with fig. 7, welded and fixed with a fixed spring 306 in the flexible clamping rod 305, the top welded and fixed of connecting pipe 4 has a return spring 5, the return spring 5 cover is established on connecting pipe 4, first circular gear 11 is welded and fixed on fixed pipe 301.
The diameter of fixed pipe 301 is greater than the diameter of connecting pipe 4, and connecting rod 303 is fixed at the top central point of connecting pipe 4, and flexible kelly 305 symmetric distribution is in the both sides of connecting rod 303, and flexible kelly 305 and card hole 302 one-to-one, the top of flexible kelly 305 personally submits circular-arcly.
The structure of the driving component 3 ensures the stability of the working state of the reset spring 5 on the connecting pipe 4, so that the stability of the subsequent reset work on the connecting pipe 4 can be ensured, and the use efficiency and stability of the device are effectively improved.
As shown in fig. 5, in this embodiment, the adsorption positioning assembly 6 includes a sealing ring 601, the sealing ring 601 is screwed on the bottom end surface of the connecting pipe 4, a first rubber piston 602 is connected in the connecting pipe 4 in a limited sliding manner, the first rubber piston 602 is fixedly connected on the top end of the output shaft of the servo motor 7, the output shaft of the servo motor 7 is connected on the sealing ring 601 in a limited sliding manner, a filter screen cylinder 603 is connected on the connecting pipe 4 in a screwed manner, the connecting pipe 4 is connected with a connecting cylinder 604 through a sealing bearing, a delivery pipe 605 is connected on the connecting cylinder 604 in a screwed manner, a rubber hose 606 is connected on the delivery pipe 605 in a screwed manner, a rubber suction cup 607 is connected on the bottom end of the rubber hose 606 in a screwed manner, and the top end of the rubber suction cup 607 is fixedly connected on the bottom end surface of the fixing base 1.
As shown in fig. 3, 4 and 5, the diameter of the sealing ring 601 is larger than the diameter of the output shaft of the servo motor 7, the diameter and the thickness of the filter screen cylinder 603 are respectively equal to the diameter and the thickness of the connecting pipe 4, the length of the filter screen cylinder 603 is smaller than the length of the connecting pipe 604, as shown in fig. 9, the conveying pipes 605 are distributed on the connecting pipe 604 at equal angles, the rubber hoses 606 are distributed on the connecting pipe 604 at equal intervals, and the rubber hoses 606 are in one-to-one correspondence with the rubber suction cups 607.
Utilize each rubber suction cup 607 can guarantee the whole stability and the safety of placing the state of device, and then can guarantee the stability and the safety of epitaxial wafer follow-up production manufacturing work, increased the use variety and the stability of device.
As shown in fig. 8 and 10, in this embodiment, the electric heating tube 9 is spiral, the second circular gear 12 is distributed on the first circular gear 11 at equal angles, and the third circular gear 13 is symmetrically distributed on two sides of the second circular gear 12, so that the heating efficiency can be effectively improved by using the spiral electric heating tube 9, and the subsequent heating operation of the epitaxial wafer can be ensured to be fast and stable.
As shown in fig. 2, 8 and 11, in this embodiment, the automatic positioning disengaging assembly 14 includes a collecting cylinder 1401, the collecting cylinder 1401 is welded and fixed on the central axis of the second circular gear 12 and the central axis of the third circular gear 13, respectively, a rubber frame 1402 is screwed on the collecting cylinder 1401, a rubber plate 1403 is screwed in the rubber frame 1402, a grading groove 1404 is opened on the rubber plate 1403, and a splitter blade 15 is welded and connected on the outer surface of the collecting cylinder 1401.
As shown in fig. 8 and fig. 11, a second rubber piston 1405 is connected in a limited sliding manner in the collecting cylinder 1401, a supporting rod 1406 is connected to a bottom end screw of the second rubber piston 1405, a bottom end of the supporting rod 1406 is welded and fixed to a top end face of the filter screen plate 8, the collecting cylinder 1401 is rotatably connected to the connection screen plate 16, and the connection screen plate 16 is rotatably connected to the fixing tube 301.
Through the limitation of the specific structure of the automatic positioning and separating assembly 14, the stability of the limiting sliding operation of the second rubber piston 1405 in the collecting cylinder 1401 is ensured, the convenience and the high efficiency of the subsequent positioning and placing and the automatic separating operation of the epitaxial wafer can be further ensured, and the working efficiency of the device is effectively improved.
As shown in fig. 12, in the present embodiment, the inner diameter of the rubber plate 1403 is larger than that of the collecting cylinder 1401, the classifying slots 1404 are equidistantly distributed on the rubber plate 1403, and the diameters of the classifying slots 1404 gradually decrease from top to bottom.
The collection cylinder 1401 is in one-to-one correspondence with the supporting rods 1406 through the second rubber pistons 1405, the supporting rods 1406 are fixed at the center of the bottom of the second rubber pistons 1405, the length of the supporting rods 1406 is larger than that of the collection cylinder 1401, adverse effects of the supporting rods 1406 on the collection cylinder 1401 can be effectively avoided, and then the stability of the follow-up automatic separation work of epitaxial wafers can be guaranteed, so that the convenience and the high efficiency of the follow-up production manufacturing work of the epitaxial wafers can be guaranteed.
It should be noted that, the present invention is a multi-size assembly epitaxial wafer apparatus, firstly, a worker can hold the supporting plate 304 by hand and pull the supporting plate 304 upward, at this time, the supporting plate 304 can drive the connecting pipe 4 to stably move upward through the connecting rod 303, at this time, the connecting pipe 4 can drive the filter screen plate 8 to stably move upward under the action of the movement of the filter screen plate 8, and under the action of the movement of the filter screen plate 8, the supporting rods 1406 can drive the second rubber pistons 1405 to stably move upward in the corresponding assembly cylinders 1401 at the same time, until the connecting rod 303 drives the telescopic clamping rods 305 on both sides to move to the clamping holes 302 on the fixed pipe 301, at this time, the telescopic clamping rods 305 can automatically extend outward through the fixed springs 306 and stably clamp into the clamping holes 302, at this time, the filter screen plate 8 can move upward to a stable position, and then the worker can place the epitaxial wafers to be manufactured on the second rubber pistons 1405 in the rubber frames 1402 respectively.
At this moment, the worker can hold the supporting plate 304 by hand, and continue to pull the supporting plate 304 upwards, at this moment, the worker can lift the whole device, and then the worker can place the whole device in the manufacturing equipment, and after placing the whole device in the manufacturing equipment, the worker can push the telescopic clamping rod 305 by inward extrusion, until the telescopic clamping rod 305 is inwards compressed to separate from the clamping hole 302, at this moment, the worker can drive the connecting pipe 4 to downwards perform automatic stable motion in the fixing pipe 301 under the effect of the return spring 5, and can drive the filter screen plate 8 to downwards move under the effect of the motion of the connecting pipe 4, at this moment, under the effect of the motion of the filter screen plate 8, each second rubber piston 1405 can be driven by each supporting rod 1406 to simultaneously and downwards stably move in the corresponding collecting cylinder 1401, at this moment, under the effect of the motion of the second rubber piston 1405, the epitaxial wafer can be driven to downwards move to the rubber plate 1403 in the rubber frame 1402, at this moment, each grading groove 1403 on the rubber plate 1404 can be used for convenient and stable spacing work of the epitaxial wafers of different specifications, and the second rubber piston 1405 can be continuously moved downwards, and then, and the automatic negative pressure extraction of the air extraction in the rubber frame 1402 can be ensured to be formed in the subsequent rubber frame 1402, and the automatic stable work of the subsequent rubber frame 1402, and the subsequent rubber frame 1402 can be carried out.
And in the downward movement process of the connecting pipe 4, the first rubber piston 602 inside the connecting pipe can perform upward stable relative movement in the connecting pipe 4, at this time, under the action of the relative movement of the first rubber piston 602, the air in the rubber suction cups 607 is automatically extracted through the filter screen cylinder 603, the connecting cylinder 604, the conveying pipe 605 and the rubber hoses 606 by using the sealing of the sealing ring 601 and the movement of the first rubber piston 602, and the whole device can be automatically and stably adsorbed and fixed in the device by using the negative pressure in each rubber suction cup 607, so that the stability and safety of the subsequent production and manufacturing work of the epitaxial wafer can be ensured.
Then, the worker can turn on the servo motor 7 by controlling, at this time, the servo motor 7 can drive the connecting pipe 4 on the sealing ring 601 to stably rotate through the output shaft, at this time, in the rotating process of the connecting pipe 4, the connecting cylinder 604 connected by using the sealing bearing can effectively prevent the rotation of the connecting pipe 4 from causing adverse effects on the conveying pipe 605, the rubber hose 606 and the rubber sucker 607, and in the rotating process of the connecting pipe 4, the collecting cylinders 1401 on the supporting rods 1406 can be driven to stably rotate through the filter screen plate 8, and under the rotating action of each collecting cylinder, the linking screen plate 16 can be driven to stably rotate on the fixed pipe 301, and in the rotating process of each collecting cylinder 1401, each second circular gear 12 can be driven to stably rotate in an engaged manner on the first circular gear 11, and in the rotating process of each second circular gear 12, each third circular gear 13 can be driven to stably rotate in an engaged manner, and further, it can be ensured that each collecting cylinder 1401 rotates while each linking screen plate 16 rotates, the exhaust fan 10 can be driven to stably rotate, and the heat distribution fan blades 15 produced and heat distribution fins can be stably distributed on the heating pipes.
After the epitaxial wafer is manufactured, the worker only needs to pull the supporting plate 304 upwards again, at this time, the supporting plate 304 can drive the connecting pipe 4 to move stably upwards through the connecting rod 303, at this time, the filtering net plate 8 can be driven to move stably upwards under the action of the connecting pipe 4, and under the action of the filtering net plate 8, each second rubber piston 1405 can be driven to move stably upwards in the corresponding collecting cylinder 1401 through each supporting rod 1406, until the connecting rod 303 drives the telescopic clamping rods 305 on the two sides to move to the clamping holes 302 on the fixing pipe 301, at this time, the telescopic clamping rods 305 can automatically extend outwards through the fixing springs 306, and are stably clamped into the clamping holes 302, at this time, the filtering net plate 8 can move upwards to a stable position, and then under the action of the second rubber pistons 1405, the epitaxial wafer placed on the rubber plate can be automatically pushed upwards to be separated, so that convenience and high efficiency of subsequent taking work of the epitaxial wafer can be guaranteed, meanwhile, under the action of the connecting pipe 4, the relative movement of the first rubber piston 602 can enable air to pass through the filtering cylinder 603, the connecting cylinder 1403, the air pressure conveying pipe 605 and the rubber hose 606, and the sucking disc can be conveniently taken by the whole sucking disc 607, and conveniently.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the various features of the disclosed embodiments of the invention may be used in any combination, provided that no structural conflict exists, and the combinations are not exhaustively described in this specification merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (2)
1. The utility model provides a many sizes collection epitaxial wafer device, includes unable adjustment base (1), connecting pipe (4) and first circular gear (11), its characterized in that: the automatic positioning and disconnecting device is characterized in that a fixed frame (2) is fixedly welded on the fixed base (1), a driving assembly (3) is installed on the fixed frame (2), an adsorption positioning assembly (6) is installed on the connecting pipe (4), a servo motor (7) is fixedly welded on the fixed base (1), a filter screen plate (8) and an exhaust fan (10) are fixedly welded on the connecting pipe (4), an electric heating pipe (9) is installed on the bottom end face of the filter screen plate (8) through a bolt, a second circular gear (12) is connected to the first circular gear (11) in a meshed mode, a third circular gear (13) is connected to the second circular gear (12) in a meshed mode, and automatic positioning and disconnecting assemblies (14) are installed on the second circular gear (12) and the third circular gear (13);
the driving assembly (3) comprises a fixed pipe (301) and a connecting rod (303), the fixed pipe (301) is welded and fixed on the fixed frame (2), a clamping hole (302) is formed in the fixed pipe (301) in a penetrating mode, the connecting rod (303) and the connecting pipe (4) are connected in the fixed pipe (301) in a limiting mode in a sliding mode, a supporting plate (304) is welded and fixed to the top end of the connecting rod (303), the bottom end of the connecting rod (303) is rotatably connected with the top end of the connecting pipe (4), a telescopic clamping rod (305) is welded and fixed to the connecting rod (303), a fixed spring (306) is welded and fixed to the inner portion of the telescopic clamping rod (305), a reset spring (5) is welded and fixed to the top end of the connecting pipe (4), the reset spring (5) is sleeved on the connecting pipe (4), and the first circular gear (11) is welded and fixed to the fixed pipe (301);
the diameter of the fixed pipe (301) is larger than that of the connecting pipe (4), the connecting rod (303) is fixed at the center of the top of the connecting pipe (4), the telescopic clamping rods (305) are symmetrically distributed on two sides of the connecting rod (303), the telescopic clamping rods (305) correspond to the clamping holes (302) one by one, and the top end surface of each telescopic clamping rod (305) is arc-shaped;
the adsorption positioning assembly (6) comprises a sealing ring (601), the sealing ring (601) is connected to the bottom end face of a connecting pipe (4) through a screw, a first rubber piston (602) is connected to the inside of the connecting pipe (4) in a limiting and sliding mode, the first rubber piston (602) is fixedly connected to the top end of an output shaft of a servo motor (7), the output shaft of the servo motor (7) is connected to the sealing ring (601) in a limiting and sliding mode, a filter screen cylinder (603) is connected to the connecting pipe (4) through a sealing bearing, a connecting cylinder (604) is connected to the connecting cylinder (604) through a sealing bearing, a conveying pipe (605) is connected to the connecting cylinder (604) through a bolt, a rubber hose (606) is connected to the conveying pipe (605) through a bolt, a rubber suction cup (607) is connected to the bottom end of the rubber hose (606) through a bolt, and the top end of the rubber suction cup (607) is fixedly connected to the bottom end face of the fixed base (1);
the diameter of the sealing ring (601) is larger than that of an output shaft of the servo motor (7), the diameter and the thickness of the filter screen cylinder (603) are respectively equal to those of the connecting pipe (4), the length of the filter screen cylinder (603) is smaller than that of the connecting cylinder (604), the conveying pipe (605) is distributed on the connecting cylinder (604) at equal angles, the rubber hoses (606) are distributed on the connecting cylinder (604) at equal intervals, and the rubber hoses (606) correspond to the rubber suckers (607) one to one;
the automatic positioning and disengaging assembly (14) comprises a collecting cylinder (1401), the collecting cylinder (1401) is respectively welded and fixed on the central shaft of the second circular gear (12) and the central shaft of the third circular gear (13), a rubber frame (1402) is connected to the collecting cylinder (1401) through screws, a rubber plate (1403) is connected to the rubber frame (1402) through screws, a grading groove (1404) is formed in the rubber plate (1403), and a shunting fan blade (15) is welded and connected to the outer surface of the collecting cylinder (1401);
the inner diameter of the rubber plate (1403) is larger than that of the collecting cylinder (1401), the grading grooves (1404) are distributed on the rubber plate (1403) at equal intervals, and the diameters of the grading grooves (1404) are gradually reduced from top to bottom;
a second rubber piston (1405) is connected in the collecting cylinder (1401) in a limiting and sliding manner, a supporting rod (1406) is connected to the bottom end of the second rubber piston (1405) in a screw manner, the bottom end of the supporting rod (1406) is fixedly welded to the top end face of the filter screen plate (8), the collecting cylinder (1401) is rotatably connected to a connecting screen plate (16), and the connecting screen plate (16) is rotatably connected to the fixed pipe (301);
the collecting cylinder (1401) corresponds to the supporting rod (1406) one by one through the second rubber piston (1405), the supporting rod (1406) is fixed at the center of the bottom of the second rubber piston (1405), and the length of the supporting rod (1406) is larger than that of the collecting cylinder (1401).
2. A multi-dimension collective epitaxial wafer apparatus according to claim 1, wherein: the electric heating pipe (9) is spiral, the second circular gears (12) are distributed on the first circular gears (11) at equal angles, and the third circular gears (13) are symmetrically distributed on two sides of the second circular gears (12).
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| CN114914182B (en) * | 2022-07-18 | 2022-10-25 | 浙江晶睿电子科技有限公司 | Silicon chip processing device for semiconductor packaging processing |
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