CN211788955U - Silicon wafer clamping mechanism - Google Patents
Silicon wafer clamping mechanism Download PDFInfo
- Publication number
- CN211788955U CN211788955U CN202020526642.6U CN202020526642U CN211788955U CN 211788955 U CN211788955 U CN 211788955U CN 202020526642 U CN202020526642 U CN 202020526642U CN 211788955 U CN211788955 U CN 211788955U
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- Prior art keywords
- fixed
- silicon chip
- cylinder
- motor
- fixed frame
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 49
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 49
- 239000010703 silicon Substances 0.000 title claims abstract description 49
- 230000007246 mechanism Effects 0.000 title claims abstract description 46
- 238000013519 translation Methods 0.000 claims abstract description 13
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 14
- 230000006378 damage Effects 0.000 abstract description 5
- 208000027418 Wounds and injury Diseases 0.000 abstract description 2
- 208000014674 injury Diseases 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 23
- 241000252254 Catostomidae Species 0.000 description 9
- 238000012545 processing Methods 0.000 description 5
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- -1 and meanwhile Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a silicon chip fixture, including translation mechanism, slewing mechanism and fixed establishment, slewing mechanism connects the bottom at translation mechanism, fixed establishment connects the bottom at slewing mechanism, translation mechanism includes fixed frame, fixed frame passes through the fixed plate and the outside fixed connection of top surface, the one end of fixed frame is connected with first motor, the output of first motor is connected with to rotate and connects in the inside lead screw of fixed frame, the lateral wall cover of lead screw is established and is connected with the slider, slewing mechanism includes the link, the link is connected in the front side of slider along vertical direction, the bottom of link is connected with the fixed block. The utility model discloses a set up a plurality of air pumps in the fixed disk, with the sucking disc laminating back on the silicon chip, the air pump passes through the connecting pipe and takes out the air in connecting cylinder and the sucking disc for atmospheric pressure attaches sucking disc and silicon chip pressure together, reaches the effect of centre gripping silicon chip, and the sucking disc is little to the silicon chip injury, and the silicon chip of being convenient for is processed.
Description
Technical Field
The utility model belongs to the technical field of the silicon chip processing, especially, relate to a silicon chip fixture.
Background
Because monocrystalline silicon has relatively higher photoelectric conversion efficiency than polycrystalline silicon, and meanwhile, polycrystalline silicon wafers have material cost similar to that of monocrystalline silicon, the high-efficiency monocrystalline silicon solar cell further replaces the market of polycrystalline silicon solar cells.
The prior art has the following problems: when the silicon wafer is processed into the monocrystalline silicon wafer, the silicon wafer needs to be clamped and fixed, and the silicon wafer is easy to damage when the silicon wafer is clamped by the clamping mechanism in the prior art because the silicon wafer is fragile, so that the silicon wafer is not beneficial to processing the silicon wafer.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a through sucking disc absorption silicon chip and portable fixture that turns to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a silicon chip fixture, includes translation mechanism, slewing mechanism and fixed establishment, slewing mechanism connects in translation mechanism's bottom, fixed establishment connects in slewing mechanism's bottom.
Translation mechanism includes fixed frame, fixed frame passes through the fixed plate and the outside fixed connection of top surface, and the one end of fixed frame is connected with first motor, the output of first motor is connected with and rotates the lead screw of connecting in fixed frame inside, the lateral wall cover of lead screw is established and is connected with the slider.
Slewing mechanism includes the link, the link is connected in the front side of slider along vertical direction, and the bottom of link is connected with the fixed block, and the inner of fixed block is connected with the bearing, the inboard cover of bearing is established and is connected with the connecting axle, the one end that the bearing was kept away from to the connecting axle is connected with the belt pulley, and the rear side of slider is connected with the second motor, the output cover of second motor is equipped with drive belt pulley pivoted belt, the lateral wall cover of connecting axle is established and is connected with the sleeve, telescopic bottom and fixed establishment fixed connection.
The fixing mechanism comprises connecting cylinders, air pumps and a fixed disk, the outer side wall of the fixed disk is connected with a plurality of connecting cylinders and each connecting cylinder, the bottom ends of the connecting cylinders are connected with suckers for adsorbing silicon wafers, the inner part of the fixed disk is connected with a plurality of air pumps, and each air pump is connected with a connecting pipe used for ventilating the corresponding connecting cylinder.
In a preferred embodiment, the bottom end of the sleeve is connected with an air cylinder for driving the fixed disc to ascend and descend, and the fixed disc is fixedly connected with the bottom surface of the output end of the air cylinder.
In a preferred embodiment, a micro electric push rod is correspondingly connected between the fixed disc and the plurality of connecting cylinders, and two ends of the micro electric push rod are fixedly connected with the connecting cylinders and the fixed disc respectively.
In a preferred embodiment, the top end and the bottom end of the cylinder are both connected with mounting plates, and the cylinder is detachably connected with the sleeve and the fixed disc through the corresponding mounting plates respectively.
In a preferred embodiment, the length of the connecting tube is greater than that of the miniature electric push rod.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses a set up a plurality of air pumps in the fixed disk, after laminating the sucking disc on the silicon chip, the air pump takes out the air in connecting cylinder and sucking disc through the connecting pipe for atmospheric pressure attaches sucking disc and silicon chip pressure together, reaches the effect of centre gripping silicon chip, and the sucking disc is little to the damage of silicon chip, is convenient for silicon chip processing;
the utility model discloses a set up the second motor on the slider, the output of second motor rotates and transmits kinetic energy for the connecting axle through the belt, and the connecting axle rotates and drives the sucking disc and rotate to reach the effect of adjusting silicon chip angle, the lead screw rotates and drives slider horizontal migration, reaches the effect of adjusting silicon chip horizontal position, reaches the effect of the adjusting position of being convenient for.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic overall structure diagram of the present invention;
FIG. 2 is an enlarged view of the rotating mechanism and the fixing mechanism of FIG. 1;
FIG. 3 is an enlarged view of the fixing mechanism shown in FIG. 2 according to the present invention;
fig. 4 is a top view of the fixing mechanism of fig. 3 according to the present invention;
in the figure: 1. a translation mechanism; 2. a connecting frame; 3. a fixed block; 4. a cylinder; 5. a fixing mechanism; 51. a connecting cylinder; 52. a suction cup; 53. a miniature electric push rod; 54. an air pump; 55. fixing the disc; 56. a connecting pipe; 6. a fixing frame; 7. a first motor; 8. a slider; 9. a screw rod; 10. a second motor; 11. a belt; 12. a belt pulley; 13. a connecting shaft; 14. a bearing; 15. a sleeve.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
Referring to fig. 1-4, the present invention provides the following technical solutions: the utility model provides a silicon chip fixture, includes translation mechanism 1, slewing mechanism and fixed establishment 5, and slewing mechanism connects in translation mechanism 1's bottom, and fixed establishment 5 connects in slewing mechanism's bottom.
Translation mechanism 1 is including fixed frame 6, and fixed frame 6 is connected with first motor 7 through the fixed plate and the outside fixed connection of top surface, and the one end of fixed frame 6, and the output of first motor 7 is connected with and rotates to be connected in the inside lead screw 9 of fixed frame 6, and the lateral wall cover of lead screw 9 is established and is connected with slider 8.
Slewing mechanism includes link 2, link 2 is connected at the front side of slider 8 along vertical direction, the bottom of link 2 is connected with fixed block 3, the inner of fixed block 3 is connected with bearing 14, bearing 14's inboard cover is established and is connected with connecting axle 13, connecting axle 13 keeps away from the one end of bearing 14 and is connected with pulley 12, slider 8's rear side is connected with second motor 10, the output cover of second motor 10 is equipped with drive pulley 12 pivoted belt 11, connecting axle 13's lateral wall cover is established and is connected with sleeve 15, sleeve 15's bottom and 5 fixed connection of fixed establishment.
The fixing mechanism 5 comprises connecting cylinders 51, air pumps 54 and a fixed disk 55, the outer side wall of the fixed disk 55 is connected with a plurality of connecting cylinders 51, the bottom end of each connecting cylinder 51 is connected with a suction cup 52 for adsorbing a silicon wafer, the inside of the fixed disk 55 is connected with a plurality of air pumps 54, and the output end of each air pump 54 is connected with a connecting pipe 56 for ventilating the corresponding connecting cylinder 51.
In this embodiment: through set up a plurality of air pumps 54 in fixed disk 55, after sucking disc 52 is laminated on the silicon chip, air pump 54 takes out the air in connecting cylinder 51 and sucking disc 52 through connecting pipe 56, make the interior vacuum that is of sucking disc 52, make atmospheric pressure attach sucking disc 52 and silicon chip pressure together, reach the effect of centre gripping silicon chip, sucking disc 52 is little to the silicon chip injury, be convenient for process the silicon chip, through set up second motor 10 on slider 8, the output of second motor 10 rotates and transmits kinetic energy for connecting axle 13 through belt 11, connecting axle 13 rotates and drives sucking disc 52 and rotate, thereby reach the effect of adjusting the silicon chip angle, the output of first motor 7 rotates and drives lead screw 9 and rotate, thereby drive slider 8 along lead screw 9 horizontal migration, reach the effect of adjusting silicon chip horizontal position, reach the effect of being convenient for adjusting the position and processing and transporting.
Specifically, the bottom end of the sleeve 15 is connected with an air cylinder 4 for driving the fixed disk 55 to ascend and descend, and the fixed disk 55 is fixedly connected with the bottom surface of the output end of the air cylinder 4; the output end of the cylinder 4 goes up and down and drives the fixed disc 55 and the sucker 52 to go up and down, so that the effect of adjusting the vertical position of the silicon wafer is achieved, and the silicon wafer is convenient to process.
Specifically, a micro electric push rod 53 is correspondingly connected between the fixed disc 55 and the plurality of connecting cylinders 51, and two ends of the micro electric push rod 53 are fixedly connected with the connecting cylinders 51 and the fixed disc 55 respectively; when the output end of the miniature electric push rod 53 stretches, the connecting cylinder 51 can be driven to adjust the horizontal position, so that the coverage area of the plurality of suckers 52 is adjusted, the fixing mechanism 5 can clamp silicon wafers with different sizes, and the effect of facilitating clamping is achieved.
Specifically, the top end and the bottom end of the cylinder 4 are both connected with mounting plates, and the cylinder 4 is detachably connected with the sleeve 15 and the fixed disc 55 through the corresponding mounting plates; the air cylinder 4 can be fixed by the mounting plate and the bolt, and can be disassembled to replace the air cylinders 4 of different types, so that the liftable length of the fixing disc 55 can be adjusted.
Specifically, the length of the connecting tube 56 is greater than that of the micro electric push rod 53; after the output end of the miniature electric push rod 53 is extended, the distance between the connecting cylinder 51 and the fixed disc 55 is increased, and the connecting pipe 56 can be prevented from being broken or falling off because the length of the connecting pipe 56 is greater than that of the miniature electric push rod 53.
The utility model discloses a theory of operation and use flow: the output end of the first motor 7 rotates to drive the screw rod 9 to rotate, thereby driving the slide block 8 to horizontally move along the screw rod 9, enabling the plurality of suckers 52 to be located above the silicon wafer, the output end of the air cylinder 4 to descend, enabling the suckers 52 to be in contact with the silicon wafer, after the air pump 54 is started, air in the connecting cylinder 51 and the suckers 52 is pumped out through the connecting pipe 56, enabling the suckers 52 to be in vacuum, enabling the suckers 52 and the silicon wafer to be pressed and attached together by atmospheric pressure, achieving the effect of clamping the silicon wafer, the suckers 52 have little damage to the silicon wafer, facilitating the processing of the silicon wafer, the output end of the second motor 10 rotates and transmits kinetic energy to the connecting shaft 13 through the belt 11, the connecting shaft 13 rotates to drive the suckers 52 to rotate, thereby achieving the effect of adjusting the angle of the silicon wafer, when the output end of, so that the fixing mechanism 5 can clamp silicon wafers with different sizes, and the effect of facilitating clamping is achieved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. The utility model provides a silicon chip fixture, includes translation mechanism (1), slewing mechanism and fixed establishment (5), its characterized in that: the rotating mechanism is connected to the bottom of the translation mechanism (1), and the fixing mechanism (5) is connected to the bottom of the rotating mechanism;
the translation mechanism (1) comprises a fixed frame (6), the fixed frame (6) is fixedly connected with the outside through a fixed plate on the top surface, one end of the fixed frame (6) is connected with a first motor (7), the output end of the first motor (7) is connected with a lead screw (9) which is rotatably connected inside the fixed frame (6), and a sliding block (8) is sleeved and connected on the outer side wall of the lead screw (9);
the rotating mechanism comprises a connecting frame (2), the connecting frame (2) is connected to the front side of the sliding block (8) in the vertical direction, the bottom end of the connecting frame (2) is connected with a fixed block (3), the inner end of the fixed block (3) is connected with a bearing (14), a connecting shaft (13) is sleeved and connected to the inner side of the bearing (14), one end, far away from the bearing (14), of the connecting shaft (13) is connected with a belt pulley (12), the rear side of the sliding block (8) is connected with a second motor (10), the output end of the second motor (10) is sleeved and connected with a belt (11) for driving the belt pulley (12) to rotate, a sleeve (15) is sleeved and connected to the outer side wall of the connecting shaft (13), and the bottom end of the sleeve (15);
fixed establishment (5) are including connecting cylinder (51), air pump (54) and fixed disk (55), the lateral wall of fixed disk (55) is connected with a plurality of connecting cylinders (51), every the bottom of connecting cylinder (51) all is connected with sucking disc (52) of absorption silicon chip, and the internal connection of fixed disk (55) has a plurality of air pumps (54), every the output of air pump (54) all is connected with and is used for connecting pipe (56) to ventilating in corresponding connecting cylinder (51).
2. The wafer clamping mechanism of claim 1, wherein: the bottom end of the sleeve (15) is connected with a cylinder (4) for driving the fixed disc (55) to ascend and descend, and the fixed disc (55) is fixedly connected with the bottom surface of the output end of the cylinder (4).
3. The wafer clamping mechanism of claim 1, wherein: the micro electric push rods (53) are correspondingly connected between the fixed disc (55) and the connecting cylinders (51), and two ends of each micro electric push rod (53) are fixedly connected with the connecting cylinders (51) and the fixed disc (55) respectively.
4. The wafer clamping mechanism of claim 2, wherein: the top and the bottom of cylinder (4) all are connected with the mounting panel, and cylinder (4) can be dismantled with sleeve (15) and fixed disk (55) respectively through the mounting panel that corresponds and be connected.
5. The wafer clamping mechanism of claim 1, wherein: the length of the connecting pipe (56) is larger than that of the miniature electric push rod (53).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020526642.6U CN211788955U (en) | 2020-04-13 | 2020-04-13 | Silicon wafer clamping mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020526642.6U CN211788955U (en) | 2020-04-13 | 2020-04-13 | Silicon wafer clamping mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211788955U true CN211788955U (en) | 2020-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020526642.6U Expired - Fee Related CN211788955U (en) | 2020-04-13 | 2020-04-13 | Silicon wafer clamping mechanism |
Country Status (1)
| Country | Link |
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| CN (1) | CN211788955U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112736021A (en) * | 2021-01-19 | 2021-04-30 | 意诚新能(苏州)科技有限公司 | Clamping device of ultra-thin silicon chip |
| CN112744395A (en) * | 2021-01-27 | 2021-05-04 | 温州职业技术学院 | Flexible spider hand for blister package medicine board |
| CN115513105A (en) * | 2022-11-22 | 2022-12-23 | 浙江晶睿电子科技有限公司 | Multi-size integrated epitaxial wafer device |
| CN115547901A (en) * | 2021-06-29 | 2022-12-30 | 北京华卓精科科技股份有限公司 | A device for transporting silicon wafers |
-
2020
- 2020-04-13 CN CN202020526642.6U patent/CN211788955U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112736021A (en) * | 2021-01-19 | 2021-04-30 | 意诚新能(苏州)科技有限公司 | Clamping device of ultra-thin silicon chip |
| CN112744395A (en) * | 2021-01-27 | 2021-05-04 | 温州职业技术学院 | Flexible spider hand for blister package medicine board |
| CN115547901A (en) * | 2021-06-29 | 2022-12-30 | 北京华卓精科科技股份有限公司 | A device for transporting silicon wafers |
| CN115547901B (en) * | 2021-06-29 | 2025-09-02 | 北京华卓精科科技股份有限公司 | Silicon wafer transmission device |
| CN115513105A (en) * | 2022-11-22 | 2022-12-23 | 浙江晶睿电子科技有限公司 | Multi-size integrated epitaxial wafer device |
| CN115513105B (en) * | 2022-11-22 | 2023-02-28 | 浙江晶睿电子科技有限公司 | A multi-size collective epitaxial wafer device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201027 Termination date: 20210413 |