CN117245800A - Cutting equipment for semiconductor packaging production - Google Patents
Cutting equipment for semiconductor packaging production Download PDFInfo
- Publication number
- CN117245800A CN117245800A CN202311130591.XA CN202311130591A CN117245800A CN 117245800 A CN117245800 A CN 117245800A CN 202311130591 A CN202311130591 A CN 202311130591A CN 117245800 A CN117245800 A CN 117245800A
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- CN
- China
- Prior art keywords
- cutting
- cylinder
- gear
- plate
- semiconductor
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005520 cutting process Methods 0.000 title claims abstract description 74
- 239000004065 semiconductor Substances 0.000 title claims abstract description 60
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 6
- 230000005540 biological transmission Effects 0.000 claims description 12
- 230000007246 mechanism Effects 0.000 claims description 11
- 238000005498 polishing Methods 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 abstract description 53
- 239000013078 crystal Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Abstract
The invention discloses cutting equipment for semiconductor packaging production, which relates to the technical field of cutting equipment and comprises a conveying frame, wherein a conveying belt is arranged at the top of the conveying frame, a plurality of through holes are uniformly formed in the conveying belt, and a supporting plate is fixedly arranged on the conveying frame and positioned between the conveying belts. The invention can cut semiconductor wafers with different diameters into semiconductor wafers with different sizes, and has strong practicability. According to the invention, the first air cylinder is started to push the base plate to move, the arc-shaped notch is matched with the sucker to form an integral supporting plane, so that the semiconductor wafer is supported during cutting, the stress of the semiconductor wafer is ensured to be uniform, and the semiconductor wafer is prevented from being broken in the cutting process; and through starting cylinder III, drive the lifter plate and descend, the pressure disk contacts with semiconductor crystal dome portion earlier, extrudes, cooperates with the supporting plane, guarantees its in-process of cutting, and the atress is inhomogeneous can not appear, can not break.
Description
Technical Field
The invention relates to the technical field of cutting equipment, in particular to cutting equipment for semiconductor package production.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because of its circular shape, and when a semiconductor package is to be performed, a dicing device is required to dice the wafer, and the dicing device can effectively dice the wafer to obtain a desired silicon wafer.
In application number 2020222092016, a cutting device for semiconductor packaging is commonly used, and the technical problem to be solved is that the cutting head of the existing cutting device is difficult to detach and install and inconvenient to replace; however, this cutting apparatus also has the following drawbacks: in the cutting process, the wafers with different sizes are inconvenient to cut into different sizes; in addition, in the cutting process, the specified position is conveyed by a conveying belt, and then the wafer is supported for cutting, so that the wafer is broken due to the fact that the wafer is not well supported, and resource waste is caused.
Disclosure of Invention
The invention aims to provide cutting equipment for semiconductor package production, which solves the following technical problems: in the cutting process, the wafers with different sizes are inconvenient to cut into different sizes; in addition, in the cutting process, the specified position is conveyed by a conveying belt, and then the wafer is supported for cutting, so that the wafer is broken due to the fact that the wafer is not well supported, and resource waste is caused.
The aim of the invention can be achieved by the following technical scheme:
the cutting equipment for semiconductor packaging production comprises a conveying frame, wherein a conveying belt is arranged at the top of the conveying frame, a plurality of through holes are uniformly formed in the conveying belt, a supporting plate is fixedly arranged on the conveying frame and between the conveying belts, a cylinder IV is arranged at the center of the top of the supporting plate, a sucker is fixedly arranged on a piston rod of the cylinder IV, and the diameter of the sucker is smaller than that of the through holes;
the side plates are arranged on two sides of the top of the conveying frame, the air cylinders III are fixedly arranged on the inner sides of the two side plates, the cutting mechanisms are fixedly arranged on piston rods of the air cylinders III and used for cutting semiconductors.
As a further scheme of the invention: the cutting mechanism comprises a lifting plate arranged on a cylinder III, a gear II is connected to the bottom of the lifting plate in a rotating mode, the gear II is meshed with the gear I and driven by a motor, a hollow tube is fixedly arranged at the bottom of the gear II, a rotating disc is fixedly arranged at the bottom of the hollow tube, a screw is arranged on the peripheral surface of the rotating disc in an array mode, a telescopic plate is vertically arranged on one side of the screw, and a plurality of cutting knives and polishing blocks are arranged at the bottoms of the telescopic plates in a crossed mode.
As a further scheme of the invention: the lifting plate is characterized in that a servo motor is rotationally connected to the center of the top of the lifting plate, a transmission shaft is fixedly installed on an output shaft of the servo motor, the transmission shaft penetrates through the hollow tube and extends into the rotating disc, a bevel gear I is fixedly installed at one end, far away from the servo motor, of the transmission shaft, the bevel gear I is meshed with a plurality of bevel gears II, a thread sleeve is fixedly installed on the bevel gears II, and a screw is connected to the internal threads of the thread sleeve.
As a further scheme of the invention: the bottom of rotary disk rotates and is connected with T type guide post, the bottom of T type guide post is pegged graft and is had the pressure disk, T type guide post just is located between rotary disk and the pressure disk and has cup jointed the spring.
As a further scheme of the invention: the novel conveying device is characterized in that first air cylinders are arranged on two sides of the inner wall of the conveying frame, base plates are fixedly arranged on piston rods of the first air cylinders, arc-shaped openings matched with the suckers are formed in the base plates, and baffle plates are arranged on three sides of the tops of the base plates.
As a further scheme of the invention: the conveying frame is provided with a conveying belt, a second cylinder is symmetrically arranged above the conveying belt, a guide plate is fixedly arranged on a piston rod of the second cylinder, and the guide plate is of an L-shaped structure.
The invention has the beneficial effects that:
the invention can cut semiconductor wafers with different diameters into semiconductor wafers with different sizes, and has strong practicability.
According to the invention, the first air cylinder is started to push the base plate to move, the arc-shaped notch is matched with the sucker to form an integral supporting plane, so that the semiconductor wafer is supported during cutting, the stress of the semiconductor wafer is ensured to be uniform, and the semiconductor wafer is prevented from being broken in the cutting process; the lifting plate is driven to descend by starting the air cylinder III, the pressure plate is firstly contacted with the top of the semiconductor crystal dome to be extruded and matched with the supporting plane, so that uneven stress and breakage can not occur in the cutting process of the semiconductor crystal dome;
according to the invention, the cutting knife is started to contact with the semiconductor wafer, the first gear is driven to drive the second gear to rotate, the cutting knife is driven to cut, after the cutting is completed, the cutting knife is regulated by the telescopic plate, the polishing block descends, and the periphery of the cut semiconductor wafer is polished.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic view of the overall structure of a cutting apparatus of the present invention;
FIG. 2 is a schematic view of the overall structure of the cutting mechanism of the present invention;
FIG. 3 is a schematic view of the internal structure of the cutting mechanism of the present invention;
FIG. 4 is a schematic side view of the cutting apparatus of the present invention;
fig. 5 is a schematic view of the surface structure of the carrier of the present invention.
In the figure: 1. a carriage; 11. a conveyor belt; 12. a through hole; 13. a side plate; 14. a first cylinder; 15. a second cylinder; 16. a guide plate; 17. a backing plate; 18. a third cylinder; 19. a support plate; 110. a fourth cylinder; 111. a suction cup; 112. arc-shaped openings; 113. a baffle; 2. a cutting mechanism; 21. a lifting plate; 22. a servo motor; 23. a first gear; 24. a second gear; 25. a hollow tube; 26. a rotating disc; 27. a screw; 28. a telescoping plate; 29. a cutting knife; 210. polishing the block; 211. a guide post; 212. a pressure plate; 213. a transmission shaft; 214. bevel gears I; 215. bevel gears II; 216. and (5) a threaded sleeve.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1-5, the invention discloses a cutting device for semiconductor package production, which comprises a conveying frame 1, wherein a conveying belt 11 is arranged at the top of the conveying frame 1, a plurality of through holes 12 are uniformly formed in the conveying belt 11, a supporting plate 19 is fixedly arranged on the conveying frame 1 and positioned between the conveying belts 11, a fourth cylinder 110 is arranged at the center of the top of the supporting plate 19, a sucker 111 is fixedly arranged on a piston rod of the fourth cylinder 110, the diameter of the sucker 111 is smaller than that of the through hole 12, and the sucker 111 conveniently penetrates through the through hole 12 to suck a semiconductor wafer;
the side plates 13 are arranged on two sides of the top of the conveying frame 1, the three air cylinders 18 are fixedly arranged on the inner sides of the two side plates 13, the cutting mechanism 2 is fixedly arranged on the piston rods of the three air cylinders 18, and the cutting mechanism 2 is used for cutting semiconductors.
The cutting mechanism 2 comprises a lifting plate 21 arranged on a cylinder III 18, a gear II 24 is rotatably connected to the bottom of the lifting plate 21, the gear II 24 is in meshed connection with a gear I23, the gear I23 is driven by a motor, a hollow pipe 25 is fixedly arranged at the bottom of the gear II 24, a rotating disk 26 is fixedly arranged at the bottom of the hollow pipe 25, a screw 27 is arranged on the peripheral surface of the rotating disk 26 in an array manner, a telescopic plate 28 is vertically arranged on one side of the screw 27, and cutting knives 29 and polishing blocks 210 are crossly arranged at the bottoms of the telescopic plates 28;
the motor is started to drive the first gear 23 to rotate, the first gear 23 drives the second gear 24 to rotate, the hollow pipe 25 is driven to rotate, the hollow pipe 25 drives the rotating disk 26 to rotate, the rotating disk 26 drives the cutting knife 29 and the polishing block 210 to rotate, and cutting and polishing are performed firstly.
The heights of the cutting knife 29 and the polishing block 210 are adjusted through the expansion plate 28, the cutting knife 29 is firstly used for cutting and forming, then the cutting knife 29 is reset, the polishing block 210 descends, the periphery of the cut semiconductor wafer is polished, and the peripheral face of the cut semiconductor wafer is sharp, so that the damage to personnel caused by the cut semiconductor wafer is avoided.
The center department of top of lifter plate 21 rotates and is connected with servo motor 22, is convenient for rotate the in-process of rotation at cutting knife 29, sanding block 210, servo motor 22 also can rotate, fixed mounting has transmission shaft 213 on servo motor 22's the output shaft, transmission shaft 213 runs through hollow tube 25 and extends to in the rotary disk 26, the one end fixed mounting of transmission shaft 213 keeping away from servo motor 22 has bevel gear one 214, bevel gear one 214 and a plurality of bevel gears two 215 meshing are connected, fixed mounting has thread bush 216 on bevel gear two 215, the inside threaded connection of thread bush 216 has screw rod 27.
The servo motor 22 is started to drive the transmission shaft 213 to rotate, the transmission shaft 213 drives the bevel gear I214 to rotate, then drives the bevel gear II 215 to rotate, the bevel gear II 215 drives the threaded sleeve 216 to rotate, the threaded sleeve 216 drives the screw rod 27 to rotate, then the expansion plate 28 drives the cutting knife 29 and the polishing block 210 to move synchronously, and semiconductor wafers with different diameters are cut conveniently.
The bottom of the rotary disk 26 is rotatably connected with a T-shaped guide column 211, the bottom of the T-shaped guide column 211 is inserted with a pressure disk 212, and a spring is sleeved between the rotary disk 26 and the pressure disk 212 through the T-shaped guide column 211; by the arrangement of the T-shaped guide post 211, the pressure plate 212 is not driven to rotate when the rotary disk 26 rotates; meanwhile, in the cutting process, the pressure plate 212 is contacted with the surface of the semiconductor wafer, so that the semiconductor wafer can be extruded, and uneven stress and easy damage of the semiconductor wafer in the cutting process are avoided.
Example 2
On the basis of embodiment 1, a first cylinder 14 is installed on two sides of the inner wall of the conveying frame 1, a base plate 17 is fixedly installed on a piston rod of the first cylinder 14, an arc-shaped opening 112 matched with a sucker 111 is formed in the base plate 17, and a baffle 113 is installed on three sides of the top of the base plate 17.
Then the first cylinder 14 is started to push the backing plate 17 to move, the arc-shaped notch 112 is matched with the sucker 111 to form an integral supporting plane, and further, when the semiconductor wafer is cut, the semiconductor wafer is supported, so that the stress of the semiconductor wafer is ensured to be uniform, and the semiconductor wafer is prevented from being broken in the cutting process; and the baffle 113 plays a good protective role in the cutting and polishing process, and can collect scraps.
The conveying frame 1 is symmetrically provided with a second cylinder 15 above the conveying belt 11, a piston rod of the second cylinder 15 is fixedly provided with a guide plate 16, and the guide plate 16 is of an L-shaped structure.
And the second cylinder 15 is started to drive the guide plate 16 to move, so that the semiconductor wafers are limited when arriving, and the semiconductor wafers with different sizes are conveniently processed.
The working principle of the invention is as follows: placing a semiconductor wafer on the conveyor belt 11, wherein the diameter of the wafer is larger than that of the through holes 12, so that the semiconductor wafer is convenient to convey; when the semiconductor wafer is conveyed to the sucker 111, the fourth cylinder 110 is started to drive the sucker 111 to ascend, suck the semiconductor wafer and then continue to ascend for a certain distance;
then the first cylinder 14 is started to push the backing plate 17 to move, the arc-shaped notch 112 is matched with the sucker 111 to form an integral supporting plane, and further, when the semiconductor wafer is cut, the semiconductor wafer is supported, so that the stress of the semiconductor wafer is ensured to be uniform, and the semiconductor wafer is prevented from being broken in the cutting process;
then, the third cylinder 18 is started to drive the lifting plate 21 to descend, the pressing plate 212 is firstly contacted with the top of the semiconductor wafer to extrude and matched with the supporting plane, so that non-uniform stress and breakage can not occur in the cutting process, the cutting knife 29 is further driven to contact with the semiconductor wafer, the first gear 23 is then driven to drive the second gear 24 to rotate, the cutting knife 29 is further driven to cut, after the cutting is completed, the cutting knife 29 is regulated by the telescopic plate 28, the polishing block 210 descends to polish the periphery of the cut semiconductor wafer, and the periphery of the cut semiconductor wafer is sharp, so that personnel damage caused by the cutting knife is avoided.
The foregoing describes one embodiment of the present invention in detail, but the description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by the present invention.
Claims (6)
1. The utility model provides a semiconductor packaging production is with cutting equipment, includes carriage (1), the top of carriage (1) is provided with and is provided with conveyer belt (11), a plurality of through-holes (12) have evenly been seted up on conveyer belt (11), on carriage (1) and be located between conveyer belt (11) fixed mounting have backup pad (19), the top center department of backup pad (19) is provided with cylinder IV (110), fixed mounting has sucking disc (111) on the piston rod of cylinder IV (110), sucking disc (111) diameter is less than the diameter of through-hole (12);
side plates (13) are arranged on two sides of the top of the conveying frame (1), three air cylinders (18) are fixedly arranged on the inner sides of the two side plates (13), cutting mechanisms (2) are fixedly arranged on piston rods of the three air cylinders (18), and the cutting mechanisms (2) are used for cutting semiconductors.
2. The cutting device for semiconductor package production according to claim 1, wherein the cutting mechanism (2) comprises a lifting plate (21) mounted on a third cylinder (18), a second gear (24) is rotatably connected to the bottom of the lifting plate (21), the second gear (24) is meshed with the first gear (23), the first gear (23) is driven by a motor, a hollow tube (25) is fixedly mounted at the bottom of the second gear (24), a rotary disc (26) is fixedly mounted at the bottom of the hollow tube (25), a screw (27) is arranged on the outer circumferential surface array of the rotary disc (26), a telescopic plate (28) is vertically mounted on one side of the screw (27), and cutting knives (29) and polishing blocks (210) are mounted at the bottoms of the telescopic plates (28) in a crossed manner.
3. The cutting device for semiconductor package production according to claim 2, wherein a servo motor (22) is rotatably connected to the top center of the lifting plate (21), a transmission shaft (213) is fixedly installed on an output shaft of the servo motor (22), the transmission shaft (213) penetrates through the hollow tube (25) and extends into the rotating disc (26), a bevel gear I (214) is fixedly installed at one end, far away from the servo motor (22), of the transmission shaft (213), the bevel gear I (214) is in meshed connection with a plurality of bevel gears II (215), a threaded sleeve (216) is fixedly installed on the bevel gears II (215), and a screw (27) is connected to internal threads of the threaded sleeve (216).
4. The cutting device for semiconductor package production according to claim 2, wherein the bottom of the rotating disc (26) is rotatably connected with a T-shaped guide post (211), the bottom of the T-shaped guide post (211) is inserted with a pressing disc (212), and the T-shaped guide post (211) is positioned between the rotating disc (26) and the pressing disc (212) in a sleeved mode and is connected with a spring.
5. The cutting device for semiconductor package production according to claim 1, wherein the first air cylinder (14) is installed on two sides of the inner wall of the conveying frame (1), the base plate (17) is fixedly installed on a piston rod of the first air cylinder (14), an arc-shaped opening (112) matched with the sucker (111) is formed in the base plate (17), and the baffle (113) is installed on three sides of the top of the base plate (17).
6. The cutting device for semiconductor package production according to claim 1, wherein a second cylinder (15) is symmetrically arranged on the conveying frame (1) and above the conveying belt (11), a guide plate (16) is fixedly arranged on a piston rod of the second cylinder (15), and the guide plate (16) is of an L-shaped structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311130591.XA CN117245800A (en) | 2023-09-04 | 2023-09-04 | Cutting equipment for semiconductor packaging production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311130591.XA CN117245800A (en) | 2023-09-04 | 2023-09-04 | Cutting equipment for semiconductor packaging production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117245800A true CN117245800A (en) | 2023-12-19 |
Family
ID=89136029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311130591.XA Pending CN117245800A (en) | 2023-09-04 | 2023-09-04 | Cutting equipment for semiconductor packaging production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117245800A (en) |
-
2023
- 2023-09-04 CN CN202311130591.XA patent/CN117245800A/en active Pending
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