CN116936451A - Semiconductor wafer processing and fixing device and method - Google Patents
Semiconductor wafer processing and fixing device and method Download PDFInfo
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- CN116936451A CN116936451A CN202311022766.5A CN202311022766A CN116936451A CN 116936451 A CN116936451 A CN 116936451A CN 202311022766 A CN202311022766 A CN 202311022766A CN 116936451 A CN116936451 A CN 116936451A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 32
- 238000012545 processing Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000003825 pressing Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims description 13
- 230000007246 mechanism Effects 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 8
- 241000252254 Catostomidae Species 0.000 claims description 7
- 230000002146 bilateral effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 81
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 235000013550 pizza Nutrition 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a semiconductor wafer processing and fixing device and a fixing method, and relates to the technical field of processing and fixing devices. According to the utility model, the slide block can be driven to move through the rotation of the driving disk, and the pressing sheet can be synchronously moved up and down, so that the up-down, left-right limiting of the wafer can be synchronously performed, the fixing effect is better, and meanwhile, the cost of purchasing other driving tools is saved.
Description
Technical Field
The utility model relates to the technical field of processing and fixing devices, in particular to a semiconductor wafer processing and fixing device and a semiconductor wafer processing and fixing method.
Background
A semiconductor integrated circuit is an electronic component in which many elements are integrated into one chip to process and store various functions. Since semiconductor integrated circuits are produced by fabricating a plurality of identical circuits on a thin substrate of a wafer, the wafer is the basis of the semiconductor as if dough was first made before adding ingredients in the preparation of pizza. The wafer is a disk formed by slicing a single crystal column made of silicon (Si), gallium arsenide (GaAs), or the like. Most wafers are made of silicon extracted from sand. There is a lot of silicon on earth, which can be stably supplied, and the silicon has the characteristics of no toxicity and environmental protection.
The wafer slice after slicing needs to be cut, the wafer containing a plurality of chips is cut into wafer particles, so that subsequent processes or functional tests are facilitated, the wafer is a fragile object, mechanical feeding and positioning operations are generally adopted, an outer ring is generally arranged at the outer edge of the wafer before feeding, the wafer is fixed, a clamp is used for fixing the outer ring, the wafer is prevented from being damaged, the mechanical arm generally supports the wafer from the bottom and transfers the wafer to a cutting position during feeding, and finally the wafer is stably put down, and the fixing structure is used for limiting and fixing the edge position of the wafer to prevent the wafer from shaking, so that the cutting operation is performed.
A fixing device for processing a semiconductor wafer, such as the patent number of CN218927561U, which relates to the technical field of wafer fixing. The utility model comprises a base, a fixed disc and a fixed assembly, wherein a moving strip is arranged on the base, and a movable block is arranged on the moving strip in a sliding manner. According to the utility model, the driving sources of the fixing assemblies are operated to drive the fixing plates to approach each other until the fixing plates are about to contact the wafer, then the power sources of the fixing plates are started to operate to drive the adjusting plates to press down, the adjusting plates press down to drive the springs and the pressing plates to press down, and the pressing plates press down to apply pressure to the wafer, so that the wafer is fixed on the fixing plate.
In the above patent, when clamping the wafer, the wafer needs to be placed on the tray, the clamping operation can be realized by driving the four air pumps, a plurality of air pumps are needed to be used for matching in the clamping process, more purchase cost is needed to be consumed, the clamping process needs to be adjusted transversely and longitudinally, one step can not be realized, the clamping time is longer, meanwhile, the tray is in a complete circular structure, the wafer needs to be placed in the tray entirely, during loading, if a mechanical arm is adopted to lift the wafer from the lower part, the loading and unloading can be carried out in a manner of sucking from the top sucking disc type, but sucking discs can possibly lead to abrasion of the surface of the wafer, so that the product quality is reduced, and on the other hand, when the lifting loading is used, the contact surface of some mechanical supporting shovels and the wafer lacks an anti-slip function, so that the slip displacement condition of the wafer can be caused in the wafer transferring process.
Disclosure of Invention
The utility model aims to solve the problems of inconvenient clamping and fixing operation on a wafer and high purchase cost in the prior art.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a semiconductor wafer processing fixing device and fixing method, includes the workstation, the workstation top is equipped with the constant head tank, be equipped with in the constant head tank and support positioning mechanism, workstation top one side is equipped with the material loading frame that is used for placing the wafer, the wafer outside is pasted and is equipped with the outer loop, go up the work loading frame with between the constant head tank be equipped with the arm above the workstation, the arm output is equipped with the bracket, the bracket is U type structure and both ends with the support is held up to outer loop below, bracket both ends top is equipped with the sucking disc, support positioning mechanism includes clamping part and tray, the tray top is equipped with the spacing groove, tray bilateral symmetry is equipped with bar breach, the both sides of outer loop extend to bar breach department, the clamping part is equipped with two and symmetry sets up on the tray, the clamping part includes spout, driving disc, slider and slider, the spout is equipped with two and symmetry sets up tray edge, the slider block sliding sets up in the spout, the driving disc rotates the setting down the driving disc is located through the centre of rotation, the driving disc is close to the driving disc is located through the driving axle, the driving disc sets up through the driving disc is located down by the driving axle, the driving disc is close to the driving disc.
As a preferred implementation mode, the inside supporting shoe that is equipped with of constant head tank, the motor sets up the supporting shoe top, the motor lateral wall pass through the fixed axle with tray lower extreme assembly connection, the top of driving disk with the tray below rotates to be connected, through driving the motor, drives the driving disk and rotates, can drive the slider and carry out displacement slip in the spout, and the motor linkage sets up on the supporting shoe this moment, and the tray passes through fixed axle and motor outer wall linkage, therefore when motor drive, only the driving disk rotates.
As a preferred implementation mode, the both ends of connecting strip respectively with the below of driving disk with the below rotation of slider is connected, the lower extreme of drive shaft extends outside in the slider, the one end of connecting strip with the lower extreme linkage setting of drive shaft, when the driving disk rotates, can drive the one end that connecting strip and driving disk are connected and take place the displacement, consequently the both ends of connecting strip need take place to rotate with driving disk and slider, take place to rotate between connecting strip and the slider, can just in time with the drive shaft linkage, can provide pivoted power to the drive shaft, saved the cost of purchasing other driving apparatus, simultaneously through the rotation of driving disk, can drive the slider and remove, carry out synchronous reciprocating to the preforming, realize going on in step about the wafer spacing can be synchronous for fixed effect is better.
As a preferred implementation mode, the outside symmetry of tray is equipped with the extension piece, the spout sets up the position department between extension piece and the tray, the spout is located one end in the extension piece is not linked together with the outside each other, through the extension piece that sets up, can increase the length of spout to the slider of being convenient for removes longer distance in the spout, when dismantling, can shift out the spacing groove with slider and preforming completely for the wafer can be unloaded above the tray.
As a preferred implementation mode, the inside assembly groove that is equipped with of slider, the assembly inslot slides from top to bottom and is equipped with the slider, the slider with preforming assembly linkage sets up, the one side that the slider set up is equipped with the pinion rack including, the assembly inslot rotation is equipped with the long gear, the long gear with the pinion rack meshing sets up, the long gear passes through the drive shaft drive rotates, drives the long gear through the drive shaft rotation, and then drives the pinion rack and reciprocate, can realize driving the operation of reciprocating of preforming, realize pressing fixed to the wafer.
As a preferred implementation mode, the slider is kept away from one side central point of preforming puts and is equipped with the centre tank, the pinion rack sets up the centre tank one side, the long gear sets up in the centre tank and with the inside swivelling joint of slider, the one end of long gear pass through the conical gear with the upper end meshing setting of drive shaft, through rotating the drive shaft, drive conical gear and long gear rotation, the long gear and the drive shaft vertical setting of this moment, the long gear rotation drives the pinion rack that sets up with it meshing and reciprocates.
As a preferred implementation mode, be equipped with the circular slot above the bracket both ends, the circular slot is equipped with a plurality of, the sucking disc assembly sets up the circular slot is in with the outer loop adsorbs the back the medial surface of sucking disc flushes with the bracket surface, through the circular slot of setting up, is convenient for assemble the sucking disc, makes between outer loop and the bracket have the clearance after avoiding the sucking disc to adsorb, causes transferring wafer in-process, and the wafer takes place the possibility that rocks.
As a preferred implementation mode, be equipped with in the bracket with the inside groove that the circular slot intercommunication set up, be equipped with the cylinder in the inside groove, the cylinder output with sucking disc outside terminal surface assembly is connected, through the cylinder that sets up, is convenient for carry out automatic absorption and unclamp the operation to the sucking disc, through the extension cylinder, promotes the sucking disc to outer loop department remove with the cylinder for sucking disc and outer loop adsorb, can separate sucking disc and outer loop on the contrary.
As a preferred implementation mode, the outer loop top is equipped with the supporting pad, the supporting pad is equipped with a plurality ofly, and is a plurality of the supporting pad is the rubber pad, through a plurality of supporting pads that set up, when the extension cylinder of being convenient for drives the sucking disc and upwards pushes away, probably can jack up the outer loop, and during the jack-up, only the supporting pad contacts with the support of upper strata in the material loading frame, avoids outer loop or wafer and the inside phenomenon of taking place extrusion friction of material loading frame, has guaranteed the quality of wafer.
The utility model also provides a method for processing and fixing the semiconductor wafer, which comprises the following steps:
s1, placing a wafer with an outer ring in an upper material frame, driving a mechanical arm, moving a bracket at the output end of the mechanical arm to the position of the upper material frame, and inserting the bracket below a wafer, wherein the bracket is positioned below the outer ring at the outer side of the wafer;
s2, driving a sucker, adsorbing the lower part of an outer ring through the sucker, driving a mechanical arm to be transferred to the position right above a tray, stably placing a wafer on the tray, inflating the sucker to separate the sucker from the outer ring, and taking down the bracket, wherein the whole wafer and the outer ring are positioned in a limit groove;
s3, driving the first motor to drive the driving disc to rotate, driving the long gear to rotate due to the fact that the sliding block slides in the sliding groove, when the driving disc rotates, the connecting bar can be driven to be displaced from one end connected with the driving disc in a rotating mode, the whole length of the connecting bar is unchanged, the sliding block can be driven to slide in the sliding groove in a displacement mode, the two sliding blocks can be driven to synchronously move in opposite directions or reversely, the wafer is clamped or loosened, one end of the connecting bar, away from the driving disc, is linked with the driving shaft in the sliding block, the long gear is driven to rotate, then the toothed plate is driven to move up and down, up and down movement of the pressing piece is achieved, and up and down positioning is carried out on the outer ring.
Compared with the prior art, the utility model has the advantages and positive effects that,
1. according to the utility model, the slide block can be driven to move through the rotation of the driving disk, and the pressing sheet can be synchronously moved up and down, so that the up-down, left-right limiting of the wafer can be synchronously performed, the fixing effect is better, and meanwhile, the cost of purchasing other driving tools is saved.
2. According to the utility model, the length of the sliding groove can be increased through the arranged extension block, so that the sliding block can conveniently move in the sliding groove for a longer distance, and the sliding block and the pressing piece can be completely moved out of the limit groove during disassembly, so that the wafer can be discharged above the tray.
3. According to the utility model, the automatic adsorption and release operation of the sucker is facilitated through the arranged air cylinder, and the air cylinder is extended to push the sucker to move towards the outer ring, so that the sucker is adsorbed to the outer ring, and otherwise, the sucker can be separated from the outer ring.
4. According to the utility model, through the plurality of supporting pads, when the extension cylinder drives the sucker to push upwards, the outer ring can be jacked up, and when jacking is performed, only the supporting pads are in contact with the support at the upper layer in the feeding frame, so that the phenomenon that the outer ring or the wafer is in extrusion friction with the inside of the feeding frame is avoided, and the quality of the wafer is ensured.
Drawings
FIG. 1 is a perspective view of a semiconductor wafer processing and fixing apparatus and method according to the present utility model;
FIG. 2 is a schematic view of a supporting and positioning mechanism of a semiconductor wafer processing and fixing device and method according to the present utility model;
FIG. 3 is a bottom perspective view of a support positioning mechanism for a semiconductor wafer processing fixture and method of the present utility model;
FIG. 4 is a bottom view of a clamping member of a semiconductor wafer processing fixture and method of the present utility model;
FIG. 5 is a schematic view of the internal structure of a slider of a semiconductor wafer processing and fixing apparatus and method according to the present utility model;
FIG. 6 is a schematic diagram illustrating the assembly of a slider and a long gear in a semiconductor wafer processing and fixing apparatus and method according to the present utility model;
FIG. 7 is a schematic diagram of the assembly of a carrier and a wafer for a semiconductor wafer processing and fixing apparatus and method according to the present utility model;
FIG. 8 is a schematic diagram of a carrier for a semiconductor wafer processing fixture and method of the present utility model;
fig. 9 is an enlarged schematic view of a structure a in fig. 8 of a semiconductor wafer processing and fixing device and a fixing method according to the present utility model.
Legend description:
1. a work table; 2. a positioning groove; 3. a wafer; 4. a feeding frame; 5. an outer ring; 6. a mechanical arm; 7. a bracket; 8. a suction cup; 911. a clamping member; 912. a tray; 101. a limit groove; 102. a strip-shaped notch; 111. a chute; 112. a drive plate; 113. a slide block; 114. tabletting; 12. a drive shaft; 13. a connecting strip; 14. a motor; 15. a support block; 16. a fixed shaft; 17. an extension block; 181. an assembly groove; 182. a slider; 183. a toothed plate; 184. a long gear; 185. a central slot; 186. a bevel gear; 19. a circular groove; 20. a cylinder; 21. and a support pad.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-9, the present utility model provides a technical solution: the utility model provides a semiconductor wafer processing fixing device and fixed method, including workstation 1, workstation 1 top is equipped with constant head tank 2, be equipped with in the constant head tank 2 and support positioning mechanism, workstation 1 top one side is equipped with the last work or material rest 4 that is used for placing wafer 3, the outside paste of wafer 3 is equipped with outer loop 5, be equipped with arm 6 above workstation 1 between last work or material rest 4 and constant head tank 2, arm 6 output is equipped with bracket 7, bracket 7 is U type structure and both ends and outer loop 5 below support, bracket 7 both ends top is equipped with sucking disc 8, support positioning mechanism includes clamping part 911 and tray 912, tray 912 top is equipped with spacing groove 101, tray 912 bilateral symmetry is equipped with bar breach 102, the both sides of outer loop 5 extend to bar breach 102 department, clamping part 911 is equipped with two and the symmetry sets up on tray 912, clamping part 911 includes spout 111, driving disc 112, slider 113 and preforming 114, spout 111 is equipped with two and the symmetry sets up in tray 912 edge department, slider 113 block sliding sets up in spout 111, driving disc 112 rotates and sets up in tray 912 center position and is equipped with inside driving shaft 12 and driving disc 113 is connected with driving disc 12 through driving shaft 12, driving disc 12 is located at driving disc 12 center position, driving disc 12 is close to driving disc 114 center position is passed through, driving disc 12 is connected with driving disc 114.
In one embodiment, one end of the connecting strip 13 is connected to the underside of the drive disk 112 in a snap-fit rotation.
In another embodiment, one end of the connecting bar 13 is connected to the underside of the drive disk 112 by a bearing turning fit.
As shown in fig. 1-9, the supporting block 15 is disposed in the positioning slot 2, the motor 14 is disposed above the supporting block 15, the side wall of the motor 14 is assembled and connected with the lower end of the tray 912 through the fixing shaft 16, the upper side of the driving disk 112 is rotationally connected with the lower side of the tray 912, the driving disk 112 is driven to rotate by driving the motor 14, and the sliding block 113 can be driven to slide in the sliding slot 111, at this time, the motor 14 is disposed on the supporting block 15 in a linkage manner, and the tray 912 is linked with the outer wall of the motor 14 through the fixing shaft 16, so that only the driving disk 112 rotates when the motor 14 is driven.
As shown in fig. 1-9, two ends of the connecting strip 13 are respectively connected with the lower part of the driving disc 112 and the lower part of the sliding block 113 in a rotating way, the lower end of the driving shaft 12 in the sliding block 113 extends outwards, one end of the connecting strip 13 is in linkage with the lower end of the driving shaft 12, when the driving disc 112 rotates, one end of the connecting strip 13 connected with the driving disc 112 can be driven to displace, therefore, two ends of the connecting strip 13 need to rotate with the driving disc 112 and the sliding block 113, the connecting strip 13 and the sliding block 113 rotate, can just be linked with the driving shaft 12, can provide rotating power for the driving shaft 12, saves the cost of purchasing other driving appliances, and simultaneously can drive the sliding block 113 to move and synchronously move up and down by driving the sliding block 113, so that the up-down and left-right limiting of the wafer 3 can be synchronously performed, and the fixing effect is better.
As shown in fig. 1-9, the outer side of the tray 912 is symmetrically provided with extension blocks 17, the sliding groove 111 is arranged at a position between the extension blocks 17 and the tray 912, one end of the sliding groove 111 positioned in the extension block 17 is not communicated with the outside, and the length of the sliding groove 111 can be increased by the arranged extension blocks 17, so that the sliding block 113 can move in the sliding groove 111 for a longer distance, and the sliding block 113 and the pressing sheet 114 can be completely moved out of the limit groove 101 during disassembly, so that the wafer 3 can be unloaded above the tray 912.
As shown in fig. 1-9, an assembly groove 181 is formed in the slider 113, a sliding piece 182 is arranged in the assembly groove 181 in a vertically sliding manner, the sliding piece 182 is arranged in an assembly linkage manner with the pressing piece 114, a toothed plate 183 is arranged on one surface of the sliding piece 182, a long gear 184 is rotationally arranged in the assembly groove 181, the long gear 184 is meshed with the toothed plate 183, the long gear 184 is driven to rotate through a driving shaft 12, the long gear 184 is driven to rotate through the driving shaft 12, the toothed plate 183 is driven to move up and down, the operation of driving the pressing piece 114 to move up and down can be achieved, and the press fit fixation of the wafer 3 is achieved.
As shown in fig. 1-9, a central groove 185 is formed in a central position of a surface of the sliding piece 182, which is far away from the pressing piece 114, a toothed plate 183 is arranged on one surface of the central groove 185, a long gear 184 is arranged in the central groove 185 and is rotationally connected with the inside of the sliding block 113, one end of the long gear 184 is meshed with the upper end of the driving shaft 12 through a conical gear 186, the conical gear 186 and the long gear 184 are driven to rotate through rotating the driving shaft 12, the long gear 184 is vertically arranged with the driving shaft 12 at this time, and the long gear 184 rotates to drive the toothed plate 183 which is meshed with the long gear 184 to move up and down.
As shown in fig. 1-9, circular grooves 19 are formed above two ends of the bracket 7, the circular grooves 19 are provided with a plurality of suckers 8, the suckers 8 are assembled and arranged in the circular grooves 19, the inner side surfaces of the suckers 8 adsorbed by the outer ring 5 are flush with the surface of the bracket 7, the suckers 8 are convenient to assemble through the arranged circular grooves 19, gaps between the outer ring 5 and the bracket 7 are avoided after the suckers 8 are adsorbed, and the possibility of shaking of the wafer 3 in the process of transferring the wafer 3 is caused.
As shown in fig. 1-9, an inner groove communicated with the circular groove 19 is arranged in the bracket 7, an air cylinder 20 is arranged in the inner groove, the output end of the air cylinder 20 is assembled and connected with the outer side end surface of the sucker 8, the sucker 8 is convenient to automatically adsorb and loosen through the arranged air cylinder 20, and the air cylinder 20 is stretched to push the sucker 8 to move towards the outer ring 5, so that the sucker 8 is adsorbed to the outer ring 5, and conversely, the sucker 8 can be separated from the outer ring 5.
As shown in fig. 1-9, the support pad 21 is disposed above the outer ring 5, the support pad 21 is plural, and the plural support pads 21 are rubber pads, so that when the extension cylinder 20 drives the suction cup 8 to push upwards, the outer ring 5 may be jacked up, and when jacked up, only the support pad 21 contacts with the support at the upper layer in the feeding frame 4, thereby avoiding the phenomenon that the outer ring 5 or the wafer 3 and the feeding frame 4 are in extrusion friction, and ensuring the quality of the wafer 3.
Working principle:
s1, placing a wafer 3 provided with an outer ring 5 in an upper material frame 4, driving a mechanical arm 6, moving a bracket 7 at the output end of the mechanical arm 6 to the position of the upper material frame 4, and inserting the bracket 7 below one wafer 3, wherein the bracket 7 is positioned below the outer ring 5 outside the wafer 3;
s2, driving a sucker 8, adsorbing the lower part of the outer ring 5 through the sucker 8, driving and transferring the mechanical arm 6 to the position right above the tray 912, stably placing the wafer 3 on the tray 912, inflating the sucker 8 to separate the sucker 8 from the outer ring 5, and taking down the bracket 7, wherein the whole of the wafer 3 and the outer ring 5 is positioned in the limit groove 101;
s3, driving the first motor 14 to drive the driving disc 112 to rotate, as the sliding blocks 113 slide in the sliding grooves 111, when the driving disc 112 rotates, the connecting strips 13 can be driven to displace with one end rotationally connected with the driving disc 112, the whole length of the connecting strips 13 is unchanged, the sliding blocks 113 can be driven to displace and slide in the sliding grooves 111, the two sliding blocks 113 can be driven to synchronously move in opposite directions or reversely move to clamp or loosen the wafer 3, one end of the connecting strips 13 far away from the driving disc 112 is linked with the driving shaft 12 in the sliding blocks 113, the long gear 184 is driven to rotate, the toothed plate 183 is driven to move up and down, the up-and-down movement of the pressing sheets 114 is realized, and the outer ring 5 is positioned up and down.
The present utility model is not limited to the above-mentioned embodiments, and any equivalent embodiments which can be changed or modified by the technical content disclosed above can be applied to other fields, but any simple modification, equivalent changes and modification made to the above-mentioned embodiments according to the technical substance of the present utility model without departing from the technical content of the present utility model still belong to the protection scope of the technical solution of the present utility model.
Claims (10)
1. The utility model provides a semiconductor wafer processing fixing device, includes workstation (1), workstation (1) top is equipped with constant head tank (2), be equipped with in constant head tank (2) and support positioning mechanism, a serial communication port, workstation (1) top one side is equipped with goes up work or material rest (4) that are used for placing wafer (3), the outside paste of wafer (3) is equipped with outer loop (5), go up work or material rest (4) with be equipped with arm (6) above workstation (1) between constant head tank (2), arm (6) output is equipped with bracket (7), bracket (7) are U type structure and both ends with support is held up to outer loop (5) below, bracket (7) both ends top is equipped with sucking disc (8), support positioning mechanism includes clamping piece (911) and tray (912), tray (912) top are equipped with spacing groove (101), tray (912) bilateral symmetry is equipped with breach (102), the both sides of outer loop (5) extend to clamping piece (911) are equipped with bar-shaped slide (112) and clamping piece (114) are equipped with bar-shaped slide (112) and clamping piece (112), the utility model discloses a tray, including tray (912), slider (113), slider (112), slider (111) are equipped with two and symmetry setting tray (912) edge, slider (113) block slides and sets up in spout (111), driving disk (112) rotate and set up tray (912) below central point puts department, slider (113) inside is equipped with drive shaft (12), driving disk (112) edge pass through connecting strip (13) with drive shaft (12) lower extreme rotation is connected, preforming (114) slide from top to bottom and set up slider (113) are close to one side of tray (912) central point put, preforming (114) are passed through drive shaft (12) drive sets up, driving disk (112) are passed through motor (14) drive.
2. The semiconductor wafer processing fixture of claim 1, wherein: the positioning groove (2) is internally provided with a supporting block (15), the motor (14) is arranged above the supporting block (15), the side wall of the motor (14) is assembled and connected with the lower end of the tray (912) through a fixed shaft (16), and the upper part of the driving disc (112) is rotationally connected with the lower part of the tray (912).
3. A semiconductor wafer processing fixture according to claim 2, wherein: the two ends of the connecting strip (13) are respectively connected with the lower part of the driving disc (112) and the lower part of the sliding block (113) in a rotating way, the lower end of the driving shaft (12) in the sliding block (113) extends outwards, and one end of the connecting strip (13) is in linkage arrangement with the lower end of the driving shaft (12).
4. A semiconductor wafer processing fixture according to claim 3, wherein: extension blocks (17) are symmetrically arranged on the outer sides of the trays (912), sliding grooves (111) are formed in positions between the extension blocks (17) and the trays (912), and one ends of the sliding grooves (111) located in the extension blocks (17) are not communicated with the outside.
5. The semiconductor wafer processing fixture of claim 4, wherein: the inside assembly groove (181) that is equipped with of slider (113), the slip is equipped with slider (182) from top to bottom in assembly groove (181), slider (182) with preforming (114) assembly linkage sets up, one side including slider (182) set up is equipped with pinion rack (183), assembly groove (181) internal rotation is equipped with pinion rack (184), pinion rack (184) with pinion rack (183) meshing sets up, pinion rack (184) are passed through drive shaft (12) drive rotates.
6. The semiconductor wafer processing fixture of claim 5, wherein: the sliding piece (182) is far away from a center position of one face of the pressing piece (114) and is provided with a center groove (185), the toothed plate (183) is arranged on one face of the center groove (185), the long gear (184) is arranged in the center groove (185) and is rotationally connected with the inside of the sliding block (113), and one end of the long gear (184) is meshed with the upper end of the driving shaft (12) through the bevel gear (186).
7. The semiconductor wafer processing fixture of claim 1, wherein: circular grooves (19) are formed in the upper portions of two ends of the bracket (7), a plurality of circular grooves (19) are formed, the suckers (8) are assembled and arranged in the circular grooves (19), and the inner side faces of the suckers (8) adsorbed by the outer ring (5) are flush with the surface of the bracket (7).
8. The semiconductor wafer processing fixture of claim 7, wherein: an inner groove communicated with the round groove (19) is formed in the bracket (7), an air cylinder (20) is arranged in the inner groove, and the output end of the air cylinder (20) is connected with the outer side end face of the sucker (8) in an assembling mode.
9. The semiconductor wafer processing fixture of claim 8, wherein: the outer ring (5) top is equipped with supporting pad (21), supporting pad (21) are equipped with a plurality ofly, a plurality of supporting pad (21) are the rubber pad.
10. A method of fixing a semiconductor wafer process, characterized in that a semiconductor wafer process fixing apparatus according to any one of claims 1 to 9 is used, comprising the steps of:
s1, placing a wafer provided with an outer ring (5) in an upper material frame (4), driving a mechanical arm (6), moving a bracket (7) at the output end of the mechanical arm (6) to the position of the upper material frame (4), and inserting the bracket into the position below a wafer, wherein the bracket (7) is positioned below the outer ring (5) at the outer side of the wafer (3);
s2, driving a sucker (8), adsorbing the lower part of the outer ring (5) through the sucker (8), driving and transferring the mechanical arm (6) to the position right above the tray (912), stably placing the wafer (3) on the tray (912), inflating the sucker (8), separating the sucker (8) from the outer ring (5), and taking down the bracket (7), wherein the whole of the wafer (3) and the outer ring (5) is positioned in the limit groove (101);
s3, driving the first motor (14) to drive the driving disc (112) to rotate, because the sliding block (113) slides in the sliding groove (111), when the driving disc (112) rotates, one end of the connecting strip (13) which is rotationally connected with the driving disc (112) can be driven to displace, the whole length of the connecting strip (13) is unchanged, the sliding block (113) can be driven to displace and slide in the sliding groove (111), the two sliding blocks (113) can be driven to synchronously move in opposite directions or reversely, the wafer (3) is clamped or loosened, one end of the connecting strip (13) which is far away from the driving disc (112) is linked with the driving shaft (12) in the sliding block (113), the long gear (184) is driven to rotate, and then the toothed plate (183) is driven to move up and down, so that the pressing piece (114) moves up and down, and the outer ring (5) is positioned up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311022766.5A CN116936451A (en) | 2023-08-15 | 2023-08-15 | Semiconductor wafer processing and fixing device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311022766.5A CN116936451A (en) | 2023-08-15 | 2023-08-15 | Semiconductor wafer processing and fixing device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116936451A true CN116936451A (en) | 2023-10-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311022766.5A Withdrawn CN116936451A (en) | 2023-08-15 | 2023-08-15 | Semiconductor wafer processing and fixing device and method |
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| Country | Link |
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| CN (1) | CN116936451A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117415034A (en) * | 2023-12-19 | 2024-01-19 | 无锡星微科技有限公司杭州分公司 | High-precision wafer sorting machine |
-
2023
- 2023-08-15 CN CN202311022766.5A patent/CN116936451A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117415034A (en) * | 2023-12-19 | 2024-01-19 | 无锡星微科技有限公司杭州分公司 | High-precision wafer sorting machine |
| CN117415034B (en) * | 2023-12-19 | 2024-03-12 | 无锡星微科技有限公司杭州分公司 | High-precision wafer sorting machine |
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Application publication date: 20231024 |
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