CN117415034A - High-precision wafer sorting machine - Google Patents
High-precision wafer sorting machine Download PDFInfo
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- CN117415034A CN117415034A CN202311743958.5A CN202311743958A CN117415034A CN 117415034 A CN117415034 A CN 117415034A CN 202311743958 A CN202311743958 A CN 202311743958A CN 117415034 A CN117415034 A CN 117415034A
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- 230000008093 supporting effect Effects 0.000 claims abstract description 39
- 238000001514 detection method Methods 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 33
- 238000001179 sorption measurement Methods 0.000 claims abstract description 32
- 238000010030 laminating Methods 0.000 claims abstract description 6
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 28
- 235000012431 wafers Nutrition 0.000 description 139
- 230000000712 assembly Effects 0.000 description 6
- 238000000429 assembly Methods 0.000 description 6
- 238000007599 discharging Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000007689 inspection Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C2501/00—Sorting according to a characteristic or feature of the articles or material to be sorted
- B07C2501/0063—Using robots
Abstract
The invention discloses a high-precision wafer sorting machine, which belongs to the technical field of wafer sorting, and comprises a sorting body, wherein a sorting chamber is arranged in the sorting body, a moving table and a detection assembly are arranged in the sorting chamber, and the detection assembly is arranged above the moving table; the mobile station is provided with an adsorption component; the adsorption component comprises a support disc, the bottom of the support disc is matched with the mobile station, and the inside of the support disc is communicated with an air passage inside the mobile station; the outside cover of supporting disk is equipped with first sucking disc, and first sucking disc is including being used for the laminating portion with the mobile station butt, and the upper surface of laminating portion disposes the supporting part that upwards extends, and the supporting part disposes the through-hole. The invention sets the adsorption component to accurately position the wafer, can improve the levelness and stability of the wafer in the detection process, and can prevent the wafer from deforming, thereby ensuring the reliability of the detection result and improving the accuracy of the wafer sorting.
Description
Technical Field
The invention belongs to the technical field of wafer sorting, and particularly relates to a high-precision wafer sorting machine.
Background
In the process of manufacturing wafers, the wafers need to be detected to judge whether the wafers are qualified, wherein the qualified wafers enter the subsequent flow, the unqualified wafers generally comprise wafers in various different states, and different modes of processing are required for different wafers. The existing wafer sorting mode generally divides the wafers into two types of qualified and unqualified wafers, and can not divide the unqualified wafers respectively, so that the use is inconvenient.
The invention patent with TWI806605B provides a wafer sorting system and a wafer sorting method, wherein the system is provided with a conveying device, a grabbing device, a plurality of wafer storage boxes and a control device. The plurality of wafer storage boxes are divided into a good product area, a non-classified inferior product area and a classified inferior product area. The classified inferior product area has a plurality of defect areas corresponding to a plurality of defect types, respectively. And conveying the good product wafers to the good product area by the system, recording the flaw types of the bad product wafers, and conveying the bad product wafers to the non-classification bad product area. The system also performs classification processing on the plurality of inferior wafers without the classified inferior regions to take the inferior wafers and conveys the inferior wafers to corresponding defective regions in the classified inferior regions based on classification results. The invention can greatly increase the capacity of the good product area and realize the full-automatic wafer sorting function.
However, the above-mentioned wafer sorting apparatus and sorting method cannot achieve accurate positioning of the wafer, and transfer of the wafer between different inspection sites easily causes positional deviation, thereby easily affecting reliability of inspection results.
Disclosure of Invention
The invention aims to provide a high-precision wafer sorting machine which is simple in structure and easy to operate, and can accurately position wafers, so that the levelness and stability of the wafers in the detection process are improved, and the accuracy of wafer sorting is further improved.
The technical scheme adopted by the invention for achieving the purpose is as follows:
the high-precision wafer sorting machine comprises a sorting body, wherein a sorting chamber is arranged in the sorting body, a moving table and a detection assembly are arranged in the sorting chamber, and the detection assembly is arranged above the moving table; further, the sorting body is provided with a feeding port for feeding and a plurality of discharging ports for discharging; the inside of the sorting chamber is provided with a manipulator which can be matched with an industrial personal computer, and the industrial personal computer can control the mechanical transfer among the wafer feeding port, the moving table and the discharging port according to the detection result of the detection component, so that the sorting of the wafers is realized. The detection assembly can be configured with a plurality of detection sites, and the mobile station can carry the wafer to move between different detection sites for detecting different indexes of the wafer.
The mobile station is provided with an adsorption component for adsorbing the wafer; the adsorption component comprises a supporting disk, the bottom of the supporting disk is matched with the mobile station, and the inside of the supporting disk is communicated with the internal gas circuit of the mobile station.
The outside cover of supporting disk is equipped with annular first sucking disc, and first sucking disc is including being used for the laminating portion with mobile station butt, and laminating portion's upper surface disposes the supporting part that upwards inclines and extends, and the supporting part disposes the through-hole.
By adopting the technical scheme, in the process of sorting the wafers in the sorting machine, the wafers are firstly transferred onto the mobile station by using the mechanical arm, and are adsorbed and positioned by the adsorption component, so that the synchronous movement of the wafers and the mobile station is realized, the contact tightness between the wafers and the mobile station in the detection and transfer processes can be improved, the dislocation or the deviation of the wafers is prevented, the levelness and the stability of the wafers are improved, the wafers are prevented from deforming, the reliability of the detection result is further ensured, and the accuracy of the wafer sorting is improved.
According to one embodiment of the invention, a first extension ring is arranged on the side of the top of the first sucker, and a second sucker extending upwards is arranged on the upper surface of the first extension ring.
According to one embodiment of the invention, the inside of the support disc is provided with an air flow channel which penetrates up and down; the upper surface of the supporting disc is provided with supporting bars which are of arc-shaped structures, and a plurality of supporting bars are arranged around the periphery of the airflow channel.
Therefore, the wafer is placed on the mobile station to be in contact with the adsorption component, and the first sucker and the second sucker deform and compress in the process of exhausting the air in the supporting disc and the inner air channel of the mobile station, so that the lower surface of the wafer can be abutted with the supporting strip on the upper surface of the supporting disc. The setting of support bar makes there is the clearance between wafer and the supporting disk for the air flue of supporting disk and mobile station inside is in the intercommunication state all the time with the through-hole of first sucking disc supporting part, can prevent the wafer deformation. In addition, the upper surface of the support bar is flat and smooth, and can be used for adjusting the levelness of the wafer, so that the problem of inaccurate detection data caused by inconsistent levelness after the wafer is adsorbed is avoided.
According to one embodiment of the invention, the upper surface of the mobile station is provided with a calibration assembly, the calibration assembly comprises a base plate, a rotating plate and a limiting plate, the base plate is arranged above the rotating plate, the rotating plate is connected with the mobile station, and the rotating plate can rotate; the rotating plate is coaxially arranged with the mobile station and is rotationally connected, the limiting plate can be circumferentially arranged on the periphery of the base plate and the rotating plate in a circumferential array mode, one end of the limiting plate is connected with the rotating plate through the first rod body, and the other end of the limiting plate is connected with the base plate through the elastic piece.
Therefore, the wafer can be precisely positioned by using the calibration assembly, and the wafer can be prevented from being misplaced in the transfer or detection process. Specifically, after the standby manipulator shifts the wafer to the substrate upper surface of mobile station top, through motor drive revolving board rotation, the revolving board drives first body of rod displacement at the rotation in-process, and then impels the elastic component to take place deformation for limiting plate displacement, a plurality of limiting plates that encircle to lay remove in step, and with the outside edge contact of wafer, carry out the position adjustment to the wafer in the removal in-process, ensure the center coincidence of wafer and mobile station's center, and realize the centre gripping fixed effect to the wafer through the limiting plate, improve stability.
According to one embodiment of the invention, a calibration column is arranged on one side of the limiting plate, which is away from the mobile station, the calibration column comprises a vertically arranged rotating short shaft, the bottom end of the rotating short shaft is rotationally connected with the limiting plate, and a rotating sleeve is arranged on the top end of the rotating short shaft.
Preferably, the rotating sleeve is made of flexible materials such as silica gel, rubber and the like.
Therefore, when the position of the wafer is adjusted by the calibration assembly, the side of the calibration column is abutted against the outer edge of the wafer, and the rotation of the rotating sleeve is realized by utilizing the rotation short shaft, so that rolling contact is formed in the process of contacting the wafer, and the occurrence of adverse conditions such as crushing, burrs and the like on the side edge of the wafer caused by the problems of contact strength, contact angle and the like between the two can be avoided.
Further, a sliding piece is arranged between the limiting plate and the mobile station; the sliding piece comprises a first sleeve body and a second sleeve body which are coaxially sleeved, and the second sleeve body is arranged in the first sleeve body and can move up and down along the axis. The top of the first sleeve body is connected with the lower surface of the limiting plate, and the bottom of the second sleeve body is movably connected with the upper surface of the mobile station through balls. Preferably, a first spring is arranged in the first sleeve body, and the first spring is sleeved outside the second sleeve body. One end of the first spring is fixedly connected with the top of the first sleeve body, and the other end of the first spring is connected with the side wall of the second sleeve body, so that the second sleeve body deforms relative to the first spring in the process of moving up and down of the first sleeve body, and the functions of buffering, vibration reduction and limiting can be achieved.
According to one embodiment of the invention, a moving assembly is arranged below the moving platform, and the moving assembly can drive the moving platform to reciprocate in the sorting chamber.
Further, the moving assembly comprises a first sliding rail extending in the X direction and a second sliding rail extending in the Y direction, the moving platform is in sliding connection with the first sliding rail and can move back and forth along the length direction of the first sliding rail, and the first sliding rail can drive the moving platform to move back and forth along the length direction of the second sliding rail.
The mobile assembly assists the mobile platform to move between different areas in the sorting chamber, so that different detection sites can be arranged at different positions in the sorting chamber, and detection of different indexes is realized.
Compared with the prior art, the invention has the following beneficial effects:
1. by arranging a plurality of adsorption assemblies on the mobile station, the wafers are adsorbed from multiple positions, so that the synchronous movement of the wafers and the mobile station can be realized, the levelness of the wafers can be ensured, and the accuracy and the reliability of the detection result can be ensured; and the first sucker, the supporting bar and other structures are matched to prevent the wafer from bending and deforming;
2. by arranging the calibration assembly on the mobile station, the wafer is clamped, and the side surface of the wafer can be prevented from being damaged; the coaxiality of the wafer and the mobile station can be improved by using the calibration assembly, and accurate positioning is realized, so that the accuracy of a detection result is ensured;
3. the rotating short shaft in the calibration assembly is matched with the rotating sleeve, so that rolling contact can be formed when the rotating short shaft is contacted with the side surface of the wafer, and the situations of crushing, burrs and the like on the side surface of the wafer can be avoided.
Therefore, the high-precision wafer sorting machine has a simple structure and is easy to operate, the wafer can be precisely positioned, the levelness and the stability of the wafer in the detection process are improved, and the accuracy of wafer sorting is further improved.
Drawings
Fig. 1 is a schematic view showing the overall structure of a high-precision wafer sorter according to embodiment 1 of the present invention;
FIG. 2 is a schematic diagram of the internal structure of the high-precision wafer sorter shown in FIG. 1;
FIG. 3 is a schematic view of the moving assembly of FIG. 1;
fig. 4 is a schematic diagram of a matching structure of a mobile station and an adsorption assembly according to embodiment 1 of the present invention;
FIG. 5 is a schematic cross-sectional view of the mating structure of the mobile station and the suction assembly of FIG. 4;
FIG. 6 is a schematic view of the enlarged partial structure of the portion A in FIG. 5;
FIG. 7 is a schematic view of the adsorption module shown in FIG. 4;
FIG. 8 is a schematic cross-sectional view of the support plate of FIG. 7;
fig. 9 is a schematic diagram showing a matching structure of a mobile station and a calibration assembly of a high-precision wafer sorter according to embodiment 2 of the present invention;
FIG. 10 is a schematic bottom view of the calibration assembly of FIG. 9;
FIG. 11 is a schematic view of the alignment post of FIG. 10;
fig. 12 is a schematic view of the slider shown in fig. 10.
Reference numerals: a sorting body 10; a feed port 11; a feed opening 12; a robot arm 13; an industrial personal computer 14; a moving assembly 15; a detection assembly 16; a mobile station 20; a groove 21; an auxiliary line 22; an adsorption assembly 30; a support plate 31; an air flow channel 32; a support bar 33; a first suction cup 41; a support portion 42; a bonding part 43; a through hole 44; a first extension ring 45; a second suction cup 46; a second extension ring 47; a calibration assembly 50; a substrate 51; a rotating plate 52; a limiting plate 53; a first rod body 54; an elastic member 55; a calibration column 56; rotating the stub shaft 57; a swivel 58; a slider 60; a first sleeve 61; a second sleeve 62; a first spring 63; balls 64.
Detailed Description
The technical scheme of the invention is further described in detail below with reference to the detailed description and the accompanying drawings. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Example 1
Fig. 1 to 8 schematically show a high-precision wafer sorter according to an embodiment of the present invention. As shown in the figure, the device comprises a box-type sorting body 10, wherein a sorting chamber is arranged in the sorting body 10, a moving table 20 and a detection assembly 16 are arranged in the sorting chamber, and the detection assembly 16 is arranged above the moving table 20; further, the sorting body 10 is provided with a feed opening 11 for feeding and a plurality of discharge openings 12 for discharging; the inside of the sorting chamber is provided with a manipulator 13, the manipulator 13 can be matched with the industrial personal computer 14, and the industrial personal computer 14 can control the machinery to transfer the wafers among the feeding port 11, the moving table 20 and the discharging port 12 according to the detection result of the detection component 16, so that the sorting of the wafers is realized. The inspection assembly 16 may be configured with a plurality of inspection sites and the mobile station 20 may move the wafer between different inspection sites for inspecting different indices of the wafer. A moving assembly 15 is arranged below the moving stage 20, and the moving assembly 15 can drive the moving stage 20 to reciprocate in the sorting chamber. The moving assembly 15 includes a first sliding rail extending in the X-direction and a second sliding rail extending in the Y-direction, and the moving table 20 is slidably connected to the first sliding rail. The first sliding rail is matched with the servo motor and can drive the mobile station 20 to move back and forth along the length direction of the first sliding rail; the second slide rail cooperates with the servo motor to drive the first slide rail and the moving table 20 to reciprocate along the length direction of the second slide rail. The moving assembly 15 assists the moving platform 20 to move between different areas of the interior of the sorting chamber, so that different detection sites can be arranged at different positions of the interior of the sorting chamber, and detection of different indexes can be achieved.
The mobile station 20 is provided with an adsorption assembly 30 for adsorbing the wafer; the adsorption assembly 30 includes a support plate 31, the bottom of the support plate 31 is matched with the mobile station 20, and the inside of the support plate 31 is communicated with the air path inside the mobile station 20. Further, a groove 21 is disposed on the upper surface of the mobile station 20, the bottom of the supporting plate 31 is embedded in the groove 21, an air flow channel 32 penetrating up and down is disposed in the supporting plate 31, an auxiliary pipeline 22 is disposed in the mobile station 20, the auxiliary pipeline 22 is connected with an air pump, and the air flow channel 32 is communicated with the auxiliary pipeline 22.
The support plate 31 is externally fitted with a first annular suction cup 41, the first suction cup 41 includes a fitting portion 43 for abutting against the mobile station 20, a support portion 42 extending obliquely upward is disposed on the upper surface of the fitting portion 43, and a through hole 44 is disposed in the support portion 42.
A first extension ring 45 connected to the support plate of the first chuck 41 is disposed on the side of the top of the first chuck 41, and a second chuck 46 extending upward is disposed on the upper surface of the first extension ring 45 and is used for abutting against the wafer. Further, a second outward extending ring 47 may be provided on the bottom side of the first suction cup 41, and the second extending ring 47 is connected to the attaching portion 43 of the first suction cup 41 for attaching to the upper surface of the mobile station 20. The support plate 31 is provided with support bars 33 on an upper surface thereof, the support bars 33 are of an arc-shaped structure, and a plurality of support bars 33 are circumferentially arranged at the periphery of the air flow passage 32 with gaps between adjacent support bars 33.
In particular, the wafer is in contact with the top of the first chuck 41, and in particular can be in contact with the second chuck 46. The first extension ring 45 has a certain supporting effect on the second suction cup 46. The first suction cup 41 and the second suction cup 46 can be made of flexible materials such as silica gel or rubber, and air between the first suction cup 41 and the wafer can be sucked by utilizing an air channel inside the mobile table 20 and the supporting disc 31 through connecting the pump body, so that the first suction cup 41 and the second suction cup 46 are caused to deform, and the wafer is driven to move towards the direction of the supporting disc 31 until the wafer is tightly attached to the supporting bar 33 on the upper surface of the supporting disc 31. The second sucking disc 46 is isolated at the bottom of the wafer to form a region communicated with the air flow channel 32, so that when the air near the wafer is sucked through the air flow channel 32 and the auxiliary pipeline 22, the second sucking disc 46 is compressed and deformed under the negative pressure effect and is attached to the wafer, the contact area between the adsorption component 30 and the wafer can be enlarged, the adsorption effect is ensured, and the wafer is prevented from falling off. Thus, the leveling of the wafer can be achieved by using the flat upper surface of the support plate 31, and the stability of the wafer can be improved by the suction force.
In addition, the second sucking disc 46 will press down the first sucking disc 41 to further improve the adsorption stability by the adsorption pressure after the second sucking disc 46 is deformed, and the supporting portion 42 of the first sucking disc 41 is provided with the through hole 44, so that the air channel inside the supporting disc 31 can extract air from the direction of the side of the first sucking disc 41, the bottom of the wafer and the peripheral air can be sucked, and the wafer can be prevented from being deformed due to overlarge suction force. The first sucking disc 41 can play a certain suction force in the process of sucking the bottom of the wafer by the air flow channel 32 externally connected with the pump body; however, due to the arrangement of the through holes 44, the suction force of the first suction cup 41 will also disappear after the suction force from the circulation channel of the supporting disk 31 is removed, so that the wafer deformation caused by the excessive suction force can be avoided. In addition, the through holes 44 enable the air outside the first sucker 41 to flow due to negative pressure in the air channel exhausting process inside the supporting disc 31, so that the balance degree of the air around the wafer is improved, and particularly, the situation that the local temperature of the wafer is too high and the inaccurate detection result caused by unbalanced ambient temperature in the detection process is avoided.
Further, the adjacent adsorption assemblies 30 may be connected by providing a connection rod body or the like on the first extension ring 45. In this way, the first extension ring 45 is provided with the connecting rod, so that the plurality of adsorption modules 30 can be linked. Specifically, the second sucker 46 and the first extension ring 45 drive the wafer to move downwards under the action of suction in the process of sucking the gas below the wafer through the airflow channel 32, and the arrangement of the connecting rod bodies enables the adjacent adsorption assemblies 30 to synchronously lift, so that the consistency of vertical displacement of different positions of the wafer is ensured, the stress balance of the wafer between different positions under the action of negative pressure can be ensured, the integrity of the wafer structure is further ensured, and defects such as bending, deformation and the like are avoided.
During the process of exhausting the air passage in the support disc 31 and the mobile station 20, the first sucker 41 and the second sucker 46 deform and compress, so that the lower surface of the wafer can be abutted against the support bar 33 on the upper surface of the support disc 31. The supporting bars 33 are arranged to enable a gap to exist between the wafer and the supporting disc 31, so that the supporting disc 31 and the air passage inside the mobile table 20 are always communicated with the through holes 44 of the supporting part 42 of the first sucker 41, and the wafer can be prevented from being deformed. In addition, the upper surface of the supporting bar 33 is flat and smooth, and can be used for adjusting the levelness of the wafer, so that the problem of inaccurate detection data caused by inconsistent levelness after the wafer is adsorbed is avoided.
Example 2
Fig. 9 to 12 schematically show a high-precision wafer sorter according to another embodiment of the present invention, which is different from example 1 in that:
the upper surface of the mobile station 20 is provided with a calibration assembly 50, the calibration assembly 50 comprises a base plate 51, a rotating plate 52 and a limiting plate 53, the base plate 51 is arranged above the rotating plate 52, the rotating plate 52 is connected with the mobile station 20, and the rotating plate 52 can rotate; the rotating plate 52 and the moving table 20 are coaxially arranged and rotationally connected, the limiting plate 53 can be circumferentially arranged on the periphery of the base plate 51 and the rotating plate 52 in a circumferential array mode, one end of the limiting plate 53 is connected with the rotating plate 52 through the first rod body 54, and the other end of the limiting plate 53 is connected with the base plate 51 through the elastic element 55. Specifically, the elastic member 55 may be a spring, a spring plate, or a special-shaped structure with elasticity. Preferably, the limiting plate 53 is an arc plate, and the convex surface of the arc plate is disposed outward. Referring to fig. 9 and 10, one end of the limiting plate 53 is rotatably connected to the first rod 54, and the other end is fixedly connected to the elastic member 55; one end of the first rod body 54, which is far away from the limiting plate 53, is fixedly connected with the rotating plate 52, and one end of the elastic piece 55, which is far away from the limiting plate 53, is fixedly connected with the base plate 51 through a connecting block.
Therefore, the wafer can be precisely positioned by the calibration assembly 50, and the wafer can be prevented from being misplaced in the transferring or detecting process. Specifically, after the standby manipulator 13 transfers the wafer to the upper surface of the substrate 51 above the mobile station 20, the rotating plate 52 is driven by the motor to rotate, and the rotating plate 52 drives the first rod body 54 to displace in the rotating process, so that the elastic element 55 is caused to deform, the limiting plates 53 displace, the plurality of limiting plates 53 distributed in a surrounding manner synchronously move and contact with the outer side edges of the wafer, the position of the wafer is adjusted in the moving process, the center of the wafer is ensured to coincide with the center of the mobile station 20, the clamping and fixing effect on the wafer is realized through the limiting plates 53, and the stability is improved. In addition, the plurality of limiting plates 53 are synchronously close to or far away from the axle center in the process of rotating the rotating plate 52, so that inclination of the wafer caused by uneven stress can be avoided, and levelness of the wafer in the clamping process of the calibration assembly 50 can be ensured.
The side of limiting plate 53 facing away from mobile station 20 is provided with calibration post 56, calibration post 56 includes the rotation minor axis 57 of vertical setting, rotates the bottom and the limiting plate 53 rotation of minor axis 57 to be connected, rotates the top of minor axis 57 and is provided with the swivel 58. Preferably, the rotating sleeve 58 is made of flexible materials such as silica gel, rubber, etc.
Therefore, when the position of the wafer is adjusted by the calibration assembly 50, the calibration column 56 can be abutted against the outer edge of the wafer from the side, and the rotation of the rotating sleeve 58 is realized by the rotation short shaft 57, so that rolling contact is formed in the process of contacting the wafer, and the occurrence of defects such as crushing and burrs on the side edge of the wafer caused by the problems of contact force, contact angle and the like between the two can be avoided.
Further, a slider 60 is disposed between the stopper plate 53 and the movable table 20; the sliding member 60 includes a first sleeve body 61 and a second sleeve body 62 coaxially sleeved, an opening is provided at the bottom of the first sleeve body 61, and the second sleeve body 62 is provided inside the first sleeve body 61 and is capable of moving up and down along the axis. The top of the first sleeve 61 is connected to the lower surface of the limiting plate 53, and the bottom of the second sleeve 62 is movably connected to the upper surface of the mobile station 20 through balls 64. Preferably, the first spring 63 is disposed inside the first sleeve 61, and the first spring 63 is sleeved outside the second sleeve 62. One end of the first spring 63 is fixedly connected with the top of the first sleeve body 61, and the other end of the first spring 63 is connected with the side wall of the second sleeve body 62, so that the first spring 63 deforms in the process that the second sleeve body 62 moves up and down relative to the first sleeve body 61, and the functions of buffering, vibration reduction and limiting can be achieved.
The limiting plate 53 is in rolling fit with the surface of the mobile station 20 in the moving process by the arrangement of the sliding piece 60, particularly the arrangement of the ball 64, so that on one hand, the limiting plate 53 is promoted to move smoothly and smoothly, and blocking is prevented; on the other hand, the stress unbalance in the moving process of the limiting plate 53 can be avoided, the levelness of the limiting plate 53 is kept, and further, the accurate adjustment of the position of the wafer is realized. The cooperation of the first spring 63 and the ball 64 can cope with the external air flow impact or collision, and can avoid the limit plate 53 from generating great vibration, so that the limit plate moves stably, and the wafer is ensured to be stressed uniformly in the position adjustment process.
In this embodiment, after the wafer is transferred from the loading port 11 to the mobile station 20 by the standby manipulator 13, the wafer is clamped and position-adjusted by the calibration assembly 50, then the gas under the wafer is pumped by the adsorption assembly 30, so as to realize the adsorption positioning of the wafer, and then the wafer is detected by the detection assembly 16. Correspondingly, in the process of detecting and releasing the wafer, the external pump body is closed first, the adsorption of the second sucker 46 and the first sucker 41 in the adsorption component 30 to the wafer is canceled, and then the clamping of the calibration component 50 to the wafer is canceled, so that the wafer can be transferred through the manipulator 13. In the groove, the calibration column 56 and the limiting plate 53 in the calibration assembly 50 displace along with the rotation of the rotating plate 52, the limiting plate 53 can also contact with the nearby adsorption assembly 30 during the movement process, especially the balls 64 in the sliding member 60 roll on the surface of the moving table 20 during the movement process, the adsorption state of the contacted first sucker 41 and second sucker 46 can be rapidly damaged when the adsorption assembly 30 is contacted, the linkage of a plurality of adsorption assemblies 30 is realized through the structures such as connecting rod bodies among the adsorption assemblies 30, and the separation effect of the adsorption assemblies 30 and wafers is improved.
Conventional operations in the operation steps of the present invention are well known to those skilled in the art, and are not described herein.
While the foregoing embodiments have been described in detail in connection with the embodiments of the invention, it should be understood that the foregoing embodiments are merely illustrative of the invention and are not intended to limit the invention, and any modifications, additions, substitutions and the like made within the principles of the invention are intended to be included within the scope of the invention.
Claims (7)
1. The high-precision wafer sorting machine comprises a sorting body (10), wherein a sorting chamber is arranged in the sorting body (10), a moving table (20) and a detection assembly (16) are arranged in the sorting chamber, and the detection assembly (16) is arranged above the moving table (20); it is characterized in that the method comprises the steps of,
the mobile station (20) is provided with an adsorption assembly (30); the adsorption assembly (30) comprises a support disc (31), the bottom of the support disc (31) is matched with the mobile station (20), and the inside of the support disc (31) is communicated with the internal gas path of the mobile station (20);
the outside cover of supporting disk (31) is equipped with first sucking disc (41), first sucking disc (41) include be used for with laminating portion (43) of mobile station (20) butt, the upper surface of laminating portion (43) disposes supporting part (42) that upwards extend, supporting part (42) disposes through-hole (44).
2. A high precision wafer sorter as in claim 1 wherein,
a first extension ring (45) is arranged on the side of the top of the first sucker (41), and a second sucker (46) extending upwards is arranged on the upper surface of the first extension ring (45).
3. A high precision wafer sorter as in claim 1 wherein,
an air flow channel (32) penetrating up and down is arranged in the support disc (31); the upper surface of supporting disk (31) is provided with support bar (33), support bar (33) are arc structure, support bar (33) encircle the configuration in the periphery of air current passageway (32).
4. A high precision wafer sorter as in claim 1 wherein,
the mobile station (20) is provided with a calibration assembly (50), the calibration assembly (50) comprises a base plate (51), a rotating plate (52) and a limiting plate (53), the base plate (51) is arranged above the rotating plate (52), the rotating plate (52) is connected with the mobile station (20), and the rotating plate (52) can rotate; the limiting plate (53) is arranged around the periphery of the base plate (51) and the rotating plate (52), one end of the limiting plate (53) is connected with the rotating plate (52) through a first rod body (54), and the other end of the limiting plate (53) is connected with the base plate (51) through an elastic piece (55).
5. The high-precision wafer separator as claimed in claim 4, wherein,
one side of limiting plate (53) deviating from mobile station (20) is provided with calibration post (56), calibration post (56) are including vertical rotation minor axis (57) that set up, the bottom of rotation minor axis (57) with limiting plate (53) rotate and be connected, the top of rotation minor axis (57) is provided with swivel (58).
6. A high precision wafer sorter as in claim 1 wherein,
a moving assembly (15) is arranged below the moving platform (20), and the moving assembly (15) can drive the moving platform (20) to reciprocate in the sorting chamber.
7. The high-precision wafer separator as claimed in claim 6, wherein,
the moving assembly (15) comprises a first sliding rail extending in the X direction and a second sliding rail extending in the Y direction, the moving platform (20) is in sliding connection with the first sliding rail and can move back and forth along the length direction of the first sliding rail, and the first sliding rail can drive the moving platform (20) to move back and forth along the length direction of the second sliding rail.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117747526A (en) * | 2024-02-21 | 2024-03-22 | 无锡星微科技有限公司 | Wafer sorting guide machine |
| CN117747526B (en) * | 2024-02-21 | 2024-05-17 | 无锡星微科技有限公司 | Wafer sorting guide machine |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010109106A (en) * | 2008-10-30 | 2010-05-13 | Kyocera Corp | Suction cup and vacuum suction apparatus |
| CN103531511A (en) * | 2012-07-04 | 2014-01-22 | 上海微电子装备有限公司 | Sucking disc, wafer bearing stage using same and wafer adsorption method |
| US20170176299A1 (en) * | 2014-12-31 | 2017-06-22 | Nuctech Company Limited | Sample injection device and method for sample collection and sample thermal desorption, and trace detection apparatus |
| CN107186518A (en) * | 2017-06-19 | 2017-09-22 | 中国工程物理研究院化工材料研究所 | Flexible fast regulating vacuum cup suitable for Machining energetic materials |
| CN210628263U (en) * | 2019-07-30 | 2020-05-26 | 扬州续笙新能源科技有限公司 | Sucking disc of silicon wafer sorting machine |
| CN210650183U (en) * | 2019-08-20 | 2020-06-02 | 浙江晶特光学科技有限公司 | Wafer sucking disc and wafer finishing impression fixing device |
| CN215866440U (en) * | 2021-08-23 | 2022-02-18 | 苏州精濑光电有限公司 | Wafer appearance detection equipment |
| TWI806605B (en) * | 2022-05-13 | 2023-06-21 | 台達電子工業股份有限公司 | Wafer classification system and wafer classification method |
| CN116581077A (en) * | 2023-05-19 | 2023-08-11 | 杭州长川科技股份有限公司 | Alignment device, wafer detection system and wafer alignment method |
| CN116936451A (en) * | 2023-08-15 | 2023-10-24 | 杭州熙驰科技有限公司 | Semiconductor wafer processing and fixing device and method |
| CN116995012A (en) * | 2023-09-08 | 2023-11-03 | 北京精雕科技集团有限公司 | Automatic positioning device for wafer processing |
| CN117103202A (en) * | 2023-10-18 | 2023-11-24 | 无锡星微科技有限公司杭州分公司 | Multi-degree-of-freedom motion control platform |
-
2023
- 2023-12-19 CN CN202311743958.5A patent/CN117415034B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010109106A (en) * | 2008-10-30 | 2010-05-13 | Kyocera Corp | Suction cup and vacuum suction apparatus |
| CN103531511A (en) * | 2012-07-04 | 2014-01-22 | 上海微电子装备有限公司 | Sucking disc, wafer bearing stage using same and wafer adsorption method |
| US20170176299A1 (en) * | 2014-12-31 | 2017-06-22 | Nuctech Company Limited | Sample injection device and method for sample collection and sample thermal desorption, and trace detection apparatus |
| CN107186518A (en) * | 2017-06-19 | 2017-09-22 | 中国工程物理研究院化工材料研究所 | Flexible fast regulating vacuum cup suitable for Machining energetic materials |
| CN210628263U (en) * | 2019-07-30 | 2020-05-26 | 扬州续笙新能源科技有限公司 | Sucking disc of silicon wafer sorting machine |
| CN210650183U (en) * | 2019-08-20 | 2020-06-02 | 浙江晶特光学科技有限公司 | Wafer sucking disc and wafer finishing impression fixing device |
| CN215866440U (en) * | 2021-08-23 | 2022-02-18 | 苏州精濑光电有限公司 | Wafer appearance detection equipment |
| TWI806605B (en) * | 2022-05-13 | 2023-06-21 | 台達電子工業股份有限公司 | Wafer classification system and wafer classification method |
| CN116581077A (en) * | 2023-05-19 | 2023-08-11 | 杭州长川科技股份有限公司 | Alignment device, wafer detection system and wafer alignment method |
| CN116936451A (en) * | 2023-08-15 | 2023-10-24 | 杭州熙驰科技有限公司 | Semiconductor wafer processing and fixing device and method |
| CN116995012A (en) * | 2023-09-08 | 2023-11-03 | 北京精雕科技集团有限公司 | Automatic positioning device for wafer processing |
| CN117103202A (en) * | 2023-10-18 | 2023-11-24 | 无锡星微科技有限公司杭州分公司 | Multi-degree-of-freedom motion control platform |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117747526A (en) * | 2024-02-21 | 2024-03-22 | 无锡星微科技有限公司 | Wafer sorting guide machine |
| CN117747526B (en) * | 2024-02-21 | 2024-05-17 | 无锡星微科技有限公司 | Wafer sorting guide machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117415034B (en) | 2024-03-12 |
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