TWI806605B - Wafer classification system and wafer classification method - Google Patents

Abstract

A wafer classification system and a wafer classification method are presented. The system has a conveying device, a gripping device, multiple wafer storage boxes, and a control device. The multiple wafer storage boxes are divided into a good wafer zone, an unclassified defective wafer zone, and a classified defective wafer zone. The classified defective wafer zone has multiple defective zones respectively corresponding to multiple defective types. The good wafer is delivered to the good wafer zone. The defective wafer is delivered to the unclassified defective wafer zone and its defective type is recorded. The system further executes a classifying process on the defective wafers in the unclassified defective wafer zone to take the defective wafer, and delivers the defective wafers to the defective zone based on a classifying result.

Description

Wafer sorting system and wafer sorting method

The present invention is related to a system and a method, in particular to a wafer sorting system and a wafer sorting method.

Existing wafer sorting machines can store good-quality wafers into good-quality boxes according to wafer detection results, and store bad-quality wafers into corresponding bad-quality boxes according to their defect types.

However, there are quite a variety of types of wafer defects, such as scratches, warped areas, abnormal thickness, abnormal edges, breakage, and the like.

When a bad product box is set for each type of defect to store, the number of good product boxes will be greatly reduced.

When the defective wafers of all defect types are randomly stored in the same defective box, the defective wafers must be sorted manually or by using an expensive wafer sorter.

Please refer to FIG. 1A and FIG. 1B . FIG. 1A is a schematic diagram of the operation of a conventional wafer sorter. FIG. 1B is a schematic diagram of an operation result of a conventional wafer sorter.

In order to classify good wafers and inferior wafers of different types of defects, the wafer sorter 10 must independently set up storage boxes for good products and all types of defects, and send the inspected wafers 11 to the corresponding storage box.

For example, if the wafer sorting machine 10 can be provided with eight groups of wafer storage boxes at most, when four types of defects are to be classified, the wafer sorting machine 10 must be provided with four groups of inferior product boxes 101-104, which means Only four groups of good product boxes 105-108 can be set at most.

As shown in FIG. 1B , defective wafers of different defect types NG1 , NG2 , NG3 , and NG4 are sorted into different defective boxes 101 - 104 .

However, generally speaking, due to the extremely high yield rate of the wafer manufacturing process, the wafer sorter 10 must frequently replace the empty good product boxes 105 - 108 because the capacity of the good product boxes 105 - 108 is too small.

Moreover, due to the low probability of producing defective wafers, the use efficiency of the four sets of defective boxes 101 - 104 is too low and occupies a large number of positions.

Therefore, the existing wafer sorting machine has the problem of “need to set a large number of inferior product boxes to place inferior wafers of different defect types, and reduce the number of good product boxes that can be installed”.

Please refer to Figure 1C and Figure 1D. FIG. 1C is a schematic diagram of the operation of a conventional wafer sorter. FIG. 1D is a schematic diagram of an operation result of a conventional wafer sorter.

In another existing wafer sorting machine 12, the defective wafers are not classified, but the defective wafers of all defect types are stored in the same defective box 128 without classification, which greatly increases the The number of good product boxes 121-127.

Specifically, the wafer sorter 12 can send the inspected wafers 13 to the good product boxes 121 - 127 or the bad product box 128 through the conveying device 120 according to the quality inspection results.

As shown in FIG. 1D , all defective wafers of defect types NG1 , NG2 , NG3 , NG4 , and NG5 are mixedly stored in the same defective box 128 .

The above situation makes it necessary for the user to manually sort the defective wafers of different defect types in the defective box 128 after the wafer sorting, or use an expensive wafer sorting machine to classify them, which greatly increases labor costs, Time cost and equipment cost.

Therefore, the existing wafer sorting machine has the problem of "storing all types of inferior wafers in the same inferior product box without sorting, and after the sorting is completed, the inferior products in the box must be sorted by manpower or additional sorting equipment." sorting of wafers into bad boxes of different defect types”.

Therefore, the existing wafer sorter has the above-mentioned problems, and a more effective solution is urgently needed to be proposed.

The main purpose of the present invention is to provide a wafer sorting system and a wafer sorting method, which can mix and store inferior wafers with different defect types, and automatically classify them after the inspection is completed.

In one embodiment, a wafer sorting system includes a conveying device, a conveying device, a grabbing device, a plurality of wafer storage boxes and a control device. The conveying device is used to convey a plurality of wafers. The grabbing device is used to grab the wafer. The plurality of wafer storage boxes are at least divided into a good product area, an unclassified inferior product area and a classified inferior product area, wherein the classified inferior product area includes a plurality of defect areas corresponding to a plurality of defect types respectively. The control device is electrically connected to the conveying device and the grasping device, and is set to control the conveying device to transport the good-quality wafer to the good-quality area when the wafer is a good-quality wafer, and when the wafer is a good-quality wafer, In the case of inferior wafers, record the defect type of the inferior wafers, and control the conveying device to transport the inferior wafers to the unclassified inferior area. The control device is configured to base the unclassified inferior product area on the basis of the plurality of defect types performing a sorting process on the plurality of inferior wafers to determine the defective area corresponding to each inferior wafer, and controlling the grabbing device and the conveying device to take the inferior wafer from the unclassified inferior wafer area round, and transport the inferior wafer to the defect area of the classified inferior area.

In one embodiment, a wafer sorting method includes: a) controlling a conveying device in a control device to transport each of a plurality of wafers to a good product area or an unclassified inferior product area; b) in the When the wafer is a good product wafer, store the good product wafer in the good product area; c) when the wafer is a bad product wafer, record the defect type of the bad product wafer, and store the bad product wafer depositing wafers into the unclassified inferior area; d) performing a sorting process on the plurality of inferior wafers in the unclassified inferior area based on the plurality of defect types in a plurality of defect areas in a classified inferior area Determine the defect area corresponding to each of the inferior wafers; and, e) control a grabbing device and the conveying device to take each of the inferior wafers from the unclassified inferior area, and transport the inferior wafer Circle to the determined defect area.

The invention can greatly increase the capacity of the good product area and realize the automatic wafer sorting function.

10, 12: Existing wafer sorting system

100, 120: conveying device

101-104, 128: Inferior box

105-108, 121-127: good product box

11, 13: Wafer

2: Wafer sorting system

20: Control device

21: Conveying device

210, 211: Auxiliary conveying device

22: Grabbing device

230-237:Wafer storage box

24: Feeding device

240-245: box to be tested

25: Detection device

26: storage device

27: Man-machine interface

28: Communication device

3: Wafer

30-36: Wafer position

40: Quality classification control module

41: Defect classification control module

42: Mobile Control Module

43:Detection control module

44: Taking film control module

50: Feeding stage

51: Detection stage

52: Sorting stage

60, 61: lifting device

NG1, NG2, NG3, NG4, NG5: types of defects

S10-S12: sorting steps

S20-S25: Sorting processing steps

S30-S32: sorting execution steps

FIG. 1A is a schematic diagram of the operation of a conventional wafer sorter.

FIG. 1B is a schematic diagram of an operation result of a conventional wafer sorter.

FIG. 1C is a schematic diagram of the operation of a conventional wafer sorter.

FIG. 1D is a schematic diagram of an operation result of a conventional wafer sorter.

FIG. 2 is a structural diagram of a wafer sorting system according to an embodiment of the present invention.

FIG. 3 is a schematic diagram of the operation of a wafer sorting system according to an embodiment of the present invention.

FIG. 4 is a structure diagram of a wafer sorting system according to an embodiment of the present invention.

FIG. 5 is a structural diagram of a control device according to an embodiment of the present invention.

FIG. 6 is a schematic diagram of the operation of a wafer sorting system according to an embodiment of the present invention.

FIG. 7 is a schematic diagram of sorting results of a wafer sorting system according to an embodiment of the present invention.

FIG. 8 is a schematic diagram of sorting results of a wafer sorting system according to an embodiment of the present invention.

FIG. 9 is a schematic diagram of sorting results of a wafer sorting system according to an embodiment of the present invention.

FIG. 10 is a partial schematic diagram of a wafer sorting system according to an embodiment of the present invention.

FIG. 11 is a partial flowchart of a wafer sorting method according to an embodiment of the present invention.

FIG. 12 is a partial flowchart of a wafer sorting method according to an embodiment of the present invention.

FIG. 13 is a partial flowchart of a wafer sorting method according to an embodiment of the present invention.

FIG. 14 is a partial flowchart of a wafer sorting method according to an embodiment of the present invention.

A preferred embodiment of the present invention will be described in detail below in conjunction with the drawings.

The present invention proposes a wafer sorting system and sorting method. During the detection process, the present invention sends defective wafers to the unclassified defective product area, and records the storage location and defect type.

After the inspection is completed, the present invention performs classification processing on all defective wafers based on defect types to determine the classification position of each defective wafer in the inferior product area.

Finally, each inferior wafer is moved from the unsorted position of the unclassified inferior area to the sorted position of the classified inferior area.

Please refer to Figure 2 and Figure 3. FIG. 2 is a structural diagram of a wafer sorting system according to an embodiment of the present invention. FIG. 3 is a schematic diagram of the operation of a wafer sorting system according to an embodiment of the present invention.

The wafer sorting system 2 of this embodiment includes a conveying device 21 , a gripping device 22 and a control device 20 electrically connected to the above devices.

The wafer sorting system 2 may also include multiple wafer storage boxes. FIG. 3 takes eight groups of wafer storage boxes 230-237 as an example.

The wafer storage boxes 230-237 can be at least divided into a good product area, an unsorted bad product area and a sorted bad product area. These areas may be located in the same wafer storage box or in different wafer storage boxes without limitation.

The good product area is used to store good product wafers whose test results are good products.

The unclassified inferior product area is used to temporarily store inferior wafers whose detection results are inferior products.

The sorted bad product area is used to store the sorted bad product wafers.

Specifically, the classified defective area may include a plurality of defect areas respectively corresponding to a plurality of defect types, that is, different defect areas are used to store inferior wafers of different defect types.

In the example of FIG. 3, the wafer storage boxes 230-235 are set as the good product area, the wafer storage box 236 is set as the unclassified inferior product area, and the wafer storage box 237 is set as the classified inferior product area, but not limited by this.

In another example, part of the wafer storage box 236 (such as 1-10 floors) is set as a good product area, and another part (such as after the 11th floor) is set as an unclassified inferior product area, that is, the good product area and the unclassified area The bad product area can be set in the same wafer storage box 236 .

The conveying device 21 is used to convey the wafer 3 , for example, the inspected wafer 3 is sent to a good product area (such as position 30 ) or an unclassified inferior product area (such as position 31 ) according to the detection result.

In one embodiment, the conveying device 21 includes a conveying belt device, which can transport the wafers smoothly through the conveying belt.

The grabbing device 22 is used for grabbing wafers, for example grabbing wafers from an unsorted inferior product area.

In one embodiment, the grabbing device 22 includes a suction cup for picking up the wafer.

It is worth mentioning that the conveying device 21 can only deliver the wafer to the designated position of the wafer storage box, and cannot take out the wafer from the wafer storage box. In this regard, the present invention adds a grabbing device 22 to take out wafers from the non-sorted inferior products area.

The control device 20 is, for example, an industrial control computer, a control box, etc., and may include a CPU, GPU, MCU, FPGA, SoC or other controller circuits.

The control device 20 is set to determine whether the storage location is a good product area or an unclassified inferior product area based on the detection results of each wafer during the detection process.

Specifically, the control device 20 is set to control the conveying device 21 to transport the good product wafer to the wafer storage box 230 (position 30) in the good product area when the detection result is a good product wafer, and when the detection result is a bad product wafer , record the defect type of the defective wafer, and control the conveying device 21 to transport the defective wafer to the wafer storage box 236 (position 31) in the unclassified inferior product area.

Moreover, after the inspection is completed, the control device 20 is set to determine the classification position of each inferior wafer in the classified inferior area according to the inspection result (defect type) of the inferior wafer.

Specifically, the control device 20 is set to perform classification processing on a plurality of defective wafers in the non-classified defective area based on a plurality of defect types, so as to determine the defective area corresponding to each defective wafer, and control the grasping device 22 The conveying device 21 is used to take inferior wafers of various defect types from the unclassified defective area, and transport the inferior wafers of various types to the determined defect area.

In one embodiment, the non-sorted inferior product area and the classified inferior product area are independent wafer storage boxes instead of sharing the same wafer storage box.

For example, the plurality of wafer storage boxes may include a first wafer storage box and a second wafer storage box. The first wafer storage box is set as an unclassified bad product area, and the second wafer storage box is set as a sorted bad product area.

In one embodiment, as shown in FIG. 3 , the first wafer storage box (wafer storage box 236 ) and the second wafer storage box (wafer storage box 237 ) can be disposed on different sides of the conveying device 21 .

In one embodiment, as shown in FIG. 3 , the wafer sorting system 2 may include auxiliary conveying devices 210 and 211 electrically connected to the control device 20, such as conveyor belts connected between wafer storage boxes 230-237, Its delivery direction can be different from the main channel of the delivery device 21 .

Wherein, the auxiliary conveying device 211 connected between the first wafer storage box 236 and the second wafer storage box 237 is used to transport inferior wafers from the first wafer storage box 236 to the second wafer storage box 237, That is, from the unclassified inferior product area to the classified inferior product area.

Please refer to FIG. 2 to FIG. 4 . FIG. 4 is a structure diagram of a wafer sorting system according to an embodiment of the present invention.

Compared with the wafer sorting system 2 of FIG. 3, the wafer sorting system 2 of FIG. / or communication device 28 .

The feeding device 24 may include a plurality of feeding grabbing devices and a plurality of boxes to be inspected. A plurality of boxes to be inspected is used to store a plurality of wafers to be inspected. The feeding and grabbing devices may include suction cups for grabbing a plurality of wafers from a plurality of boxes to be inspected to the conveying device 21 , so that the conveying device 21 conveys the plurality of wafers to the inspecting device 25 .

The inspection device 25 is used for inspecting a plurality of wafers to generate inspection results for each wafer.

The aforementioned inspection results are used to indicate whether the quality of the wafer is a good wafer or a bad wafer, and can further indicate the defect type when it is indicated as a bad wafer.

Wafer detection and the generation of detection results are existing technologies, and the details are irrelevant to the technology of the present invention. Any existing wafer detection technology can be used to provide the detection results described in the present invention. The present invention uses its detection results for classification .

The storage device 26 may include transient storage media such as RAM and non-transitory storage media such as hard disk, flash memory, ROM, and EEPROM, for storing data, such as non-category positions, classification positions, and mapping relationships described later.

The human-machine interface 27 may include input interfaces such as a keyboard, mouse, and touch panel, and output interfaces such as a display, a printer, and a speaker, for interacting with users.

The communication device 28 is, for example, a wired/wireless network interface, a serial transmission module, etc., and is used to connect to an external computer and perform data transmission. For example, an external computer can be connected through the communication device 28 to obtain detection-related data or upload classification results.

See Figures 2 through 5. FIG. 5 is a structural diagram of a control device according to an embodiment of the present invention.

In one embodiment, the control device 20 may include a quality classification control module 40, a defect classification control module 41, a movement control module 42, a detection control module 43, and a slice control module 44 for realizing different functions. .

The quality classification control module 40 is configured to determine the position of the good product area of the wafer or the unclassified position of the unclassified bad product area based on whether the detection result of each wafer is a good product or a bad product.

The defect sorting control module 41 is configured to determine the sorting position of defective wafers of various defect types in the sorted defective area (such as the aforementioned second wafer storage box). The aforementioned classification positions belong to the defective area corresponding to the defective wafer.

The defect classification control module 41 is also set to calculate the sum of the number of wafers of each of the plurality of defect types among the plurality of inferior wafers in the unclassified inferior area (such as the aforementioned first wafer storage box) , Based on the number of multiple wafers of multiple defect types, allocate the range of each defective area in the classified defective area (such as the second wafer storage box), and set multiple defective wafers in the unclassified defective area (such as the second wafer storage box) The mapping relationship between a plurality of unclassified positions of a wafer storage box) and a plurality of sorted positions of the classified inferior product area (such as the second wafer storage box).

The movement control module 42 is set to control the grabbing device 22 to pick up the defective wafer from one of the multiple non-sorting positions, determine the sorting position of the defective wafer based on the mapping relationship and the non-sorting position, and control the conveying device 21 Transporting the defective wafers to the sorting position determined by the classified inferior products area.

The inspection control module 43 is configured to control the inspection device 25 to inspect the wafers to be inspected, so as to obtain the inspection results of each wafer.

The chip taking control module 44 is set to control the feeding device to take the wafer to be inspected to the conveying device 21 .

It is worth mentioning that the modules shown in FIG. 5 are connected to each other (either electrical connection or information connection), and can be hardware modules (such as electronic circuit modules, integrated circuit modules, SoC, etc.), software modules or a mix of software and hardware modules, without limitation.

When the above-mentioned module is a software module (such as firmware, operating system or application program), the storage device 26 may include a non-transitory computer-readable recording medium, and the aforementioned non-transitory computer-readable recording medium stores a computer program , the computer program records computer-executable program codes, and when the control device 20 executes the aforementioned program codes, the control functions of the aforementioned modules can be realized.

See Figures 2 through 6. FIG. 6 is a schematic diagram of the operation of a wafer sorting system according to an embodiment of the present invention.

In this embodiment, the operation of the wafer sorting system 2 can be divided into a feeding phase 50 , a testing phase 51 , and a sorting phase 52 .

In the feeding stage 50 , a plurality of boxes 240 - 245 to be inspected are respectively loaded with wafers 3 to be inspected. The feeding and grabbing device can move the wafers 3 to be inspected from the boxes 240 - 245 to be inspected to the conveying device 21 (such as the position 33 ).

In the inspection stage 51 , the conveying device 21 sends the wafer 3 to be inspected to the inspection device 25 (position 34 ) for inspection, so as to confirm whether the wafer 3 is defective through visual inspection, and generate inspection results.

Next, the conveying device 21 prepares to send the inspected wafer 3 to the wafer storage boxes 230-237 (position 35).

In the sorting stage 52, the conveying device 21 is controlled according to the detection result to transport the detected good product wafer to the good product area (position 30) through the auxiliary conveying device 210, such as storing it in the wafer storage box 230-235, or sending the detected good product wafer The inferior wafers are transported to the unclassified inferior area (position 31 ) through the auxiliary conveying device 211 , such as stored in the wafer storage box 236 .

Then, the sorting process is performed to determine the position of each inferior wafer in the classified inferior area, such as the wafer storage box 237, and the inferior wafer is sucked from the non-sorted inferior area (position 31) through the grabbing device 22, And the defective wafers are transported to the designated sorting position (position 32 ) in the sorted defective area through the auxiliary conveying device 211 .

Thereby, the present invention can automatically complete the classification and storage of wafers, and can provide a larger capacity of good-quality wafers.

Please refer to FIG. 2 to FIG. 7 . FIG. 7 is a schematic diagram of a sorting result of a wafer sorting system according to an embodiment of the present invention.

As shown in the figure, all defective wafers of defect types NG1, NG2, NG3 and NG4 are mixedly stored in the wafer storage box 236 in the unsorted defective area. Moreover, after the sorting is completed, the defective wafers of different defect types NG1 , NG2 , NG3 , and NG4 are arranged in the wafer storage box 237 in order.

In one embodiment, the sorted inferior wafers can be stored sequentially according to their defect types, such as in the order of NG1 → NG2 → NG3 → NG4 → NG5, and inferior wafers of the same defect type are continuously is stored.

In one embodiment, the present invention can sequentially record multiple unclassified locations in the unclassified inferior product area and defect types of the inferior wafers stored therein in a multi-dimensional array or serially.

Moreover, a sorted array or series is generated by performing a sorting algorithm on the array elements or series nodes, and the mapping relationship is obtained by comparing the position changes of the array elements or series nodes before and after sorting.

The aforementioned sorting algorithm can be an existing sorting algorithm, such as selection sorting (Selection Sorting), insertion sorting (Insertion Sorting), bubble sorting (Bubble Sorting), Shell sorting (Shell Sorting), shaking sorting ( Shaker Sorting), Quick Sorting (Quick Sorting), but not limited to this.

In one embodiment, the present invention can count the total number of defective wafers of each defect type one by one, and move all the defective wafers of each defect type to the classified defective area in sequence.

In one embodiment, the present invention can assign different values to different defect types, such as 0-10, 0-100, -10-10, etc., sort these values, and establish a mapping relationship according to the positions before and after sorting.

In one embodiment, the present invention can put the first bad wafer from the unclassified bad product area into the classified bad product area, and put other bad product wafers of the same defect type into the sorted bad product area neighborhood of the area.

Then, put the second inferior wafer (such as a different defect type from the first inferior wafer) into the classified inferior area, and put other inferior wafers of the same defect type into the classified Adjacent to the inferior product area.

Please refer to FIG. 2 to FIG. 8 . FIG. 8 is a schematic diagram of a sorting result of a wafer sorting system according to an embodiment of the present invention.

As shown in the figure, all defective wafers of defect types NG1, NG2, NG3 and NG4 are mixedly stored in the wafer storage box 236 in the unsorted defective area. Moreover, after the sorting is completed, the defective wafers of different defect types NG1 , NG2 , NG3 , and NG4 are arranged in the wafer storage box 237 in order.

In this embodiment, when the wafer storage box 237 of the classified inferior product area is used to store inferior wafers of different defect types, a plurality of areas (defective areas) of the wafer storage case 237 are used to store different defects respectively. Inferior wafers of defect type.

In addition, in order to effectively distinguish and separate multiple defective areas, there may be division marks between the multiple storage areas of the wafer storage box 237 that has classified the defective areas. Partition marks can be, for example, empty layers, foreign objects (such as plugged into wafer models), colors, patterns, text (such as through stickers or spraying to mark visual marks on each storage area), and/or electronic annotations (such as placing The number of layers of each NG type is directly recorded in the computer), etc.

Please refer to FIG. 2 to FIG. 9 . FIG. 9 is a schematic diagram of a sorting result of a wafer sorting system according to an embodiment of the present invention.

As shown in the figure, all defective wafers of defect types NG1 and NG2 are mixedly stored in the wafer storage box 236 in the unsorted defective area. Moreover, after the sorting is completed, the defective wafers of the defect type NG1 are stored in the wafer storage box 237 , and the defective wafers of the defect type NG2 are stored in another wafer storage box 238 .

In this embodiment, a set of wafer storage boxes is used to store defective wafers of one type of defect.

For example, the wafer sorting system 2 can first discharge all defective wafers of the defect type NG1 into the wafer storage box 237 .

Then, the user can replace the wafer storage box 237 with an empty wafer storage box 238 . Furthermore, the wafer sorting system 2 can discharge all defective wafers of the defect type NG2 into the wafer storage box 238 , and so on.

Please refer to FIG. 2 to FIG. 10 . FIG. 10 is a partial schematic diagram of a wafer sorting system according to an embodiment of the present invention.

In one embodiment, the wafer sorting system 2 may include a lifting device, which can be used to adjust the height of any wafer storage box 236-237, the conveying device 21 (including the auxiliary conveying device 210-211), so that the conveying The wafers on the device 21 or the auxiliary conveying devices 210-211 reach the specified storage height in the wafer storage box, that is, the height of the sorting position or the non-sorting position.

For example, when the lifting device is arranged on the conveying device 21, in addition to adjusting the height (position 36) of the inferior wafers conveyed, the picking height of the picking device 22 can also be indirectly adjusted, so that unclassified inferior wafers can be taken. Failed wafers (position 31) for each height of the wafer storage box 236 in the quality area.

In another example, when the lifting device 60 is installed in the wafer storage box 236 of the unclassified inferior product area, the height of the position 31 can be adjusted to match the height of the pick-up device 22 for picking up inferior wafers.

In another example, when the lifting device 61 is installed in the wafer storage box 237 of the sorted defective area, the height of the position 32 can be adjusted to match the height of the conveying device 21 for receiving defective wafers.

Please refer to FIG. 2 to FIG. 11 . FIG. 11 is a partial flowchart of a wafer sorting method according to an embodiment of the present invention.

The wafer sorting method in each embodiment of the present invention can be implemented by the wafer sorting system in any embodiment.

The wafer sorting method of this embodiment may include steps S10-S13.

In step S10 , the control device 20 controls the transport device 21 through the quality classification control module 40 to transport each of the plurality of wafers to a good product area or an unclassified inferior product area.

In step S11, the control device 20 uses the defect classification control module 41 to perform classification processing on the plurality of inferior wafers in the unclassified inferior area based on the plurality of defect types, so as to determine each inferior wafer in the plurality of defect areas The corresponding defect area.

In one embodiment, multiple defective areas of the classified defective area can be set in the same wafer storage box. The control device 20 can determine the classification position (such as layer number or position code) of each defective wafer in the wafer storage box. The aforementioned classification positions belong to the defective area corresponding to the defective wafer.

In step S12, the control device 20 controls the grabbing device 22 and the conveying device 21 through the movement control module 42 to pick up each defective wafer from the unclassified defective product area, and transport the defective wafer to the determined defect area.

The invention can greatly increase the capacity of the good product area and realize the automatic wafer sorting function.

Please refer to FIG. 2 to FIG. 12 . FIG. 12 is a partial flowchart of a wafer sorting method according to an embodiment of the present invention.

Step S10 of the wafer sorting method of this embodiment may include steps S20-S25.

In step S20 , the control device 20 obtains the inspection results of each wafer through the quality classification control module 40 .

In step S21 , the control device 20 judges whether the currently processed wafer is a good product or not based on the obtained detection result through the quality classification control module 40 .

If the wafer is a good product, step S22 is performed. In step S22, the control device 20 controls the conveying device 21 through the quality classification control module 40 to store the good-quality wafers in the good-quality area.

Then execute step S23. In step S23 , the control device 20 judges through the quality sorting control module 40 whether there is a next wafer that needs to be sorted and stored, that is, judges whether the inspection of all wafers is completed.

If there is no next wafer to be stored, then end. Otherwise, the control device 20 executes step S20 again.

If it is determined in step S21 that the wafers are inferior and good, then step S24 is executed. In step S24 , the control device 20 records the defect types of the defective wafers through the quality classification control module 40 .

In one embodiment, the control device 20 can record the unclassified position and defect type of the inferior wafer in the unclassified inferior area.

In one embodiment, when the entire wafer storage box is set as an unclassified inferior area, the control device 20 can record the defect types of the inferior wafers stored in each layer of the wafer storage box, such as in an array or Record in sequence.

In step S25 , the control device 20 controls the conveying device 21 through the quality classification control module 40 to store the inferior wafers in the unclassified inferior area.

Thereby, the present invention can effectively store various types of wafers and record their quality.

Please refer to FIG. 2 to FIG. 13 . FIG. 13 is a partial flowchart of a wafer sorting method according to an embodiment of the present invention.

Step S11 of the wafer sorting method of this embodiment may include steps S30-S32.

In step S30, the control device 20 uses the defect classification control module 41 to calculate the total amount of wafers of each of the plurality of defect types in the plurality of inferior wafers in the unclassified inferior area to obtain the number of defect types. multiple wafer quantities.

In step S31, the control device 20 assigns the range of each defect area to the wafer storage box in the classified inferior product area based on the number of wafers of multiple defect types through the defect classification control module 41, as specified in the planning of each defect area The number of layers required.

In step S32, the control device 20 sets the mapping relationship between a plurality of unclassified positions in the unclassified inferior area and a plurality of classified positions in the classified inferior area through the defect classification control module 41. .

The above-mentioned mapping relationship can be stored in the storage device 26 , through the above-mentioned mapping relationship, the control device 20 can know the classification position of each inferior wafer after sorting and sorting.

Thereby, the present invention can effectively plan classification positions and ensure correct classification results.

Please refer to FIG. 2 to FIG. 14 . FIG. 14 is a partial flowchart of a wafer sorting method according to an embodiment of the present invention.

In step S40 , the control device 20 controls the gripping device 22 through the movement control module 42 to pick up inferior wafers from one of the multiple non-sorting positions and place them on the conveying device 21 .

In step S41 , the control device 20 uses the movement control module 42 to determine the sorted location of the defective wafer based on the mapping relationship and the current non-sorted location of the defective wafer.

In step S42, the control device 20 controls the conveying device 21 through the movement control module 42 to transport the defective wafer to the sorting position determined by the sorted defective area.

In step S43 , the control device 20 judges through the movement control module 42 whether there is a next defective wafer that needs to be sorted and stored, that is, judges whether the detection of all defective wafers is completed.

If there is no next wafer to be stored, then end. Otherwise, the control device 20 executes step S40 again.

The present invention uses two-stage classification, that is, during the inspection, it is quickly divided into good products and inferior products according to the quality, and after the inspection is completed, it is subdivided into different defect groups according to the type of defect, which can avoid slowing down the detection speed or reducing the storage of good products due to the classification of inferior products Capacity, and can achieve detailed and accurate classification without human assistance.

The above descriptions are only preferred specific examples of the present invention, and are not intended to limit the patent scope of the present invention. Therefore, all equivalent changes made by using the content of the present invention are all included in the scope of the present invention in the same way. Chen Ming.

21: Conveying device

210-211: Auxiliary conveying device

22: Grabbing device

230-237:Wafer storage box

3: Wafer

30-32: Wafer position

Claims (13)

A wafer sorting system, comprising: a conveying device for conveying a plurality of wafers; a grasping device for grasping the wafers; a plurality of wafer storage boxes, at least divided into a good product area, a a classified inferior product area and a classified inferior product area, wherein the classified inferior product area includes a plurality of defect areas corresponding to a plurality of defect types; and a control device electrically connected to the conveying device and the grasping device, and is It is set to control the conveying device to transport the good wafer to the good product area when the wafer is a good product wafer, and record the defect type of the bad product wafer when the wafer is a bad product wafer , and control the conveying device to transport the inferior wafer to the unclassified inferior area; wherein, the control device is set to execute the plurality of inferior wafers in the unclassified inferior area based on the plurality of defect types a sorting process to determine the defect area corresponding to each of the inferior wafers, controlling the grabbing device and the conveying device to take the inferior wafer from the unclassified inferior area and transport the inferior wafer to the defective area of the classified inferior product area. The wafer sorting system as described in Claim 1, further comprising: a detection device, electrically connected to the control device, for detecting the plurality of wafers to generate a detection result for each of the wafers, wherein the detection result It is used to indicate that the wafer is the good wafer or the inferior wafer, and includes the defect type when indicating the inferior wafer; and a feeding device, the feeding device includes a plurality of feeding and grabbing devices and a plurality of boxes to be inspected, the plurality of boxes to be inspected are used to store the plurality of wafers, and the plurality of feeding and grasping devices are used to grab the plurality of wafers from the plurality of boxes to be inspected to the conveying device , so that the plurality of wafers are transported to the detection device. The wafer sorting system as described in claim 1, wherein the plurality of wafer storage boxes include a first wafer storage box and a second wafer storage box, the first wafer storage box is set as the In the sorted inferior product area, the second wafer storage box is set as the classified inferior product area, and the first wafer storage box and the second wafer storage box are disposed on different sides of the conveying device. The wafer sorting system as described in Claim 3, further comprising: an auxiliary conveying device whose conveying direction is different from that of the conveying device, for conveying the defective wafer from the first wafer storage box to the the second wafer storage box; and a lifting device, used to adjust the height of at least one of the first wafer storage box, the second wafer storage box and the auxiliary conveying device, so that the wafer reaches a level storage height. The wafer sorting system as described in claim 3, wherein the second wafer storage box is set with the plurality of defect areas, and includes at least one partition mark for separating the plurality of defect areas; wherein, the control device Including a defect classification control module, which is set to determine a classification position of each inferior wafer in the second wafer storage box, wherein the classification position belongs to the defective area corresponding to the inferior wafer; wherein, The defect classification control module is further configured to calculate the number of wafers of the plurality of defect types among the plurality of inferior wafers in the first wafer storage box, based on the number of the plurality of defect types The number of wafers is allocated to the range of each defect area in the second wafer storage box, and the plurality of inferior wafers are set to the second wafer storage in a plurality of unclassified positions in the first wafer storage box A mapping relationship between the plurality of classification positions of the boxes. The wafer sorting system as described in claim 5, wherein the control device includes a movement control module, configured to control the grabbing device to pick up the waste from one of the plurality of non-sorting positions. The control device determines the sorting position based on the mapping relationship and the non-sorting position, and controls the conveying device to transport the inferior wafer to the sorting position in the classified inferior area. A method for sorting wafers, comprising: a) controlling a conveying device in a control device to transport each of a plurality of wafers to a good product area or an unclassified inferior product area; c) when the wafer is a defective wafer, record a defect type of the defective wafer, and store the defective wafer in the unclassified defective area; d) performing a sorting process on the plurality of inferior wafers in the unclassified inferior area based on the plurality of defect types to determine each of the inferior products in a plurality of defect areas in a classified inferior area The defect area corresponding to the wafer; and e) controlling a grabbing device and the conveying device to take each of the inferior wafers from the unclassified inferior area, and transport the inferior wafer to the determined defect district. The wafer sorting method as described in Claim 7, wherein the step c) includes recording an unclassified position and the defect type of the inferior wafer in the unclassified inferior area. The wafer sorting method as described in Claim 7, wherein at least one wafer storage box is set as the unclassified inferior product area; wherein, the step c) includes recording the This defect type for bad wafers. The wafer sorting method as described in claim 7, wherein the defective areas of the sorted inferior product area are set in a wafer storage box; Wherein, the step d) includes determining a classification position of each defective wafer in the wafer storage box, wherein the classification position belongs to the defective area corresponding to the defective wafer. The wafer sorting method as described in claim 10, wherein the unclassified inferior product area is set in another wafer storage box; wherein the step d) includes: d1) the plurality of wafers in the unclassified inferior product area In the inferior wafers, calculate the plurality of wafer quantities of the plurality of defect types; d2) allocate each of the wafer storage boxes in the classified inferior product area based on the plurality of wafer quantities of the plurality of defect types the range of the defective area; and d3) setting a mapping relationship between the plurality of unclassified positions of the plurality of inferior wafers in the unclassified inferior area to the plurality of sorted positions of the classified inferior area. The wafer sorting method as described in claim 11, wherein the step e) includes: e1) controlling the grasping device to pick up the defective wafer from one of the plurality of non-sorting positions; e2) in the control The device determines the sorting position based on the mapping relationship and the non-sorting position; and e3) controlling the conveying device to transport the inferior wafer to the sorting position in the sorted inferior area. The wafer sorting method as described in claim 10, wherein the step d) further includes setting at least one partition mark on the wafer storage box, wherein the at least one partition mark is used to separate the plurality of defective regions.

Images