CN114735467A - Feeding method and system for multilayer detection equipment - Google Patents
Feeding method and system for multilayer detection equipment Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 77
- 238000001514 detection method Methods 0.000 title abstract description 32
- 238000012360 testing method Methods 0.000 claims abstract description 273
- 239000000463 material Substances 0.000 claims abstract description 46
- 238000003860 storage Methods 0.000 claims abstract description 32
- 238000007689 inspection Methods 0.000 claims description 44
- 230000002159 abnormal effect Effects 0.000 claims description 40
- 238000012544 monitoring process Methods 0.000 claims description 27
- 230000007246 mechanism Effects 0.000 claims description 17
- 230000008439 repair process Effects 0.000 claims description 12
- 238000003556 assay Methods 0.000 claims description 10
- 238000012546 transfer Methods 0.000 claims description 5
- 230000005856 abnormality Effects 0.000 claims description 4
- 230000004044 response Effects 0.000 claims description 4
- 239000000872 buffer Substances 0.000 claims description 3
- 230000032258 transport Effects 0.000 description 12
- 230000008569 process Effects 0.000 description 11
- 230000008901 benefit Effects 0.000 description 8
- 230000009471 action Effects 0.000 description 5
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 230000001960 triggered effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012160 loading buffer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
- B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
The invention relates to a feeding method and a feeding system for multilayer detection equipment, which can firstly judge the state of a testing machine and then carry out position retrieval by adopting a fuzzy judgment mode so as to improve the feeding efficiency. The multilayer detection equipment comprises a lifting elevator and a plurality of layers of test platforms correspondingly stacked on one side of the lifting elevator, and each layer of test platform is provided with a circulation manipulator and a plurality of testing machines. The feeding method for the multi-layer detection equipment comprises the following steps: carrying out fuzzy judgment on whether each layer of test platform is in an idle state or not so as to determine that the test platform with the idle tester is used as a target layer, and transferring the material disc to be tested to a temporary storage area of the target layer; and accurately judging the position of an idle tester in the target layer so as to control the circulation manipulator of the target layer to convey the chip in the material tray to be tested from the temporary storage area to a station corresponding to the idle tester.
Description
Technical Field
The invention relates to the technical field of chip detection, in particular to a feeding method and a feeding system for multilayer detection equipment.
Background
In recent years, with the rapid development of semiconductor technology, higher chip detection efficiency is required. Although the efficiency problem of chip detection can be solved by a high-speed developed automatic production mode under the large background of the national strategy of the current industrial 4.0, once a certain part of the existing machine equipment fails, the working efficiency and the effect of the whole machine equipment are affected. It is well known in the chip inspection industry that chips need to be transported inside a tester for testing. Because the layout of the traditional horizontally arranged testing machine and the transport line occupies too large equipment area and is very wasteful, the existing equipment develops a three-dimensional rack and a multi-layer structure instead, and the purpose of improving the productivity is achieved. For example, existing equipment provides a vertically-transported manipulator for use with multiple testers arranged in a column.
However, although the existing equipment structurally improves the utilization rate of the three-dimensional space, the feeding method matched with the existing equipment needs to be further optimized, such as when to feed materials in more complicated multi-layer space? When the elevator is moving? Which layer is sent first, etc., directly affects the overall capacity (UPH) of the device. For example, the existing inspection equipment usually inspects the states of all the testers one by one to determine the idle testers and the positions thereof, and then directly transports the chips to be inspected to the stations corresponding to the idle testers by using the vertically transported manipulator, but this way not only needs to monitor the states of numerous testers to screen out the idle testers, but also needs to control the manipulator to transport the chips to be inspected to the stations corresponding to the idle testers after determining the specific positions of the idle testers, which increases the complexity of software programming and hardware installation and greatly reduces the overall productivity of the equipment.
Disclosure of Invention
An advantage of the present invention is to provide a feeding method and system for a multi-layer testing apparatus, which can greatly improve the productivity of the testing apparatus.
Another advantage of the present invention is to provide a feeding method and a system thereof for a multi-layer inspection apparatus, wherein in an embodiment of the present invention, the feeding method for the multi-layer inspection apparatus can determine the state of the tester first by using a fuzzy determination method, and then perform a position search, so as to improve feeding efficiency.
Another advantage of the present invention is to provide a feeding method for a multi-layer inspection apparatus and a system thereof, wherein in an embodiment of the present invention, the feeding method for a multi-layer inspection apparatus can adopt a close feeding to maximize the apparatus capacity in case that different layers are idle at the same time.
Another advantage of the present invention is to provide a feeding method for a multi-layer inspection apparatus and a system thereof, wherein in an embodiment of the present invention, the feeding method for a multi-layer inspection apparatus can directly monitor the state of a testing machine at the end, so as to unify the objects determined on a software program, thereby facilitating programming.
Another advantage of the present invention is to provide a feeding method for a multi-layer inspection apparatus and a system thereof, wherein in an embodiment of the present invention, the feeding method for a multi-layer inspection apparatus can determine whether an abnormal node exists according to a beat time of each node, so as to improve stability of the entire apparatus.
To achieve at least the above and other advantages and in accordance with the purpose of the present invention, as well as other advantages and objects, there is provided a feeding method for a multi-tier inspection apparatus, wherein the multi-tier inspection apparatus includes a lift and a plurality of test platforms respectively stacked at one side of the lift, and each test platform is provided with a circulation robot and a plurality of testers, the feeding method for a multi-tier inspection apparatus including the steps of:
fuzzily judging whether each layer of test platform is in an idle state or not to determine that the test platform with the idle test machine is used as a target layer, so that the material tray to be tested is transferred to a temporary storage area of the target layer; and
and accurately judging the position of an idle tester in the target layer so as to control the circulation manipulator of the target layer to convey the chip in the material tray to be tested from the temporary storage area to a station corresponding to the idle tester.
According to an embodiment of the application, the step of fuzzily judging whether each layer of test platform is in an idle state to determine that the test platform with the idle test machine is used as a target layer, so that the material tray to be tested is transferred to a temporary storage area of the target layer comprises the following steps:
monitoring the state of the tester through the first type of sensor, and taking the state or set value of the tester in each layer of test platform as the layer state value of each layer of test platform;
determining a test platform with an idle tester as the target layer based on the layer state value of each layer of test platform; and
and controlling the elevator to transfer the material tray to be tested to the temporary storage area of the target layer for queuing.
According to one embodiment of the application, the tester of each layer of test platform comprises a first type of tester for performing a first test on the chip and a second type of tester for performing a second test on the chip, and the layer state value of each layer of test platform is equal to the product of the state values of the first type of tester in each layer of test platform.
According to an embodiment of the present application, in the step of determining, based on the layer state value of each layer of test platforms, that a test platform of an idle tester exists as the target layer:
when two or more target layers exist, the material tray to be detected is conveyed from bottom to top nearby.
According to an embodiment of the present application, the step of accurately determining the position of the idle tester in the target layer to control the circulation manipulator of the target layer to transport the chip in the tray to be tested from the temporary storage area to the station corresponding to the idle tester includes the steps of:
retrieving the state value of each first type tester in the target layer, and taking the first type tester with the state value of zero as the idle tester; and
and controlling the circulation manipulator of the target layer to convey the chip in the material tray to be tested from the temporary storage area to the station corresponding to the idle tester.
According to an embodiment of the present application, the method for feeding a multi-layer detection apparatus further comprises:
and judging the states of the second type of tester and the first type of tester in each layer of test platform in sequence so as to convey the chips tested by the first type of tester to a station corresponding to the idle second type of tester by controlling the flow manipulator in each layer of test platform.
According to an embodiment of the present application, the step of sequentially determining the states of the second type of tester and the first type of tester in each layer of test platform to transport the chips tested by the first type of tester to the station corresponding to the idle second type of tester by controlling the flow manipulator in each layer of test platform includes the steps of:
monitoring the state of a second type of testing machine through a first type of sensor to determine whether an idle second type of testing machine exists;
responding to the second type of idle testing machine, and monitoring whether a chip which is tested by the first type of testing machine exists in a testing platform corresponding to the second type of idle testing machine or not through a sensor; and
and responding to the existence of the chip which completes the first test, and controlling a circulation manipulator of the test platform to convey the chip which completes the first test to a station corresponding to the idle second type test machine.
According to an embodiment of the present application, the method for feeding a multi-layer testing apparatus further comprises the steps of:
monitoring whether all the test machines are abnormal or not through a second type of sensor so as to trigger an alarm mechanism when the machines are abnormal; the step of monitoring whether all the testers have abnormity through the second type of sensors so as to trigger an alarm mechanism when the abnormity exists comprises the following steps:
monitoring whether all the testers are abnormal or not through the second type of sensors;
responding to the existence of the abnormal testing machine, judging the abnormal type of the abnormal testing machine, and determining an alarm level according to the abnormal type;
responding to the alarm level to be an artificial intervention alarm, and controlling the test equipment to stop to carry out artificial repair; and
and controlling the test equipment to automatically repair in response to the alarm grade being the non-manual intervention alarm.
According to an embodiment of the present application, the method for feeding a multi-layer detection apparatus further comprises:
and judging whether an abnormal beat occurs or not by recording the beat time of each node so as to further trigger an alarm mechanism when the abnormal beat exists.
According to another aspect of the present application, an embodiment of the present application further provides a feeding system for a multi-tier inspection apparatus, wherein the multi-tier inspection apparatus includes a lift and a plurality of test platforms respectively stacked on one side of the lift, and each test platform is provided with a circulation robot and a plurality of testing machines, the feeding system for the multi-tier inspection apparatus includes:
the state determining module is used for judging whether each layer of test platform is in an idle state in a fuzzy manner so as to determine that the test platform with the idle test machine is used as a target layer, and the material disc to be tested is transferred to the temporary storage area of the target layer; and
and the position determining module is used for accurately judging the position of the idle tester in the target layer so as to control the circulation manipulator of the target layer to convey the chip in the material tray to be tested from the temporary storage area to the station corresponding to the idle tester.
Drawings
FIG. 1 is a schematic flow diagram of a feeding method for a multi-layer assay device according to one embodiment of the present invention;
FIG. 2 is a schematic flow chart showing a status determination step in the feeding method for a multi-layer assay apparatus according to the above-described embodiment of the present invention;
FIG. 3 is a schematic flow chart illustrating a position determining step in the feeding method for a multi-layer detecting apparatus according to the above embodiment of the present invention;
FIG. 4 is a schematic flow chart illustrating the flow control step in the feeding method for a multi-layered inspection apparatus according to the above embodiment of the present invention;
FIG. 5 is a schematic flow chart illustrating an anomaly monitoring step in the feeding method for a multi-layer inspection apparatus according to the above embodiment of the present invention;
FIG. 6 shows a transfer example of the feeding method for a multi-layer assay device according to the above-described embodiment of the present invention;
FIG. 7 shows a conveyance example of the feeding method for a multi-layer inspection apparatus according to the above-described embodiment of the present invention;
FIG. 8 is a schematic view showing an upper stream of the feeding method for a multi-layer assay apparatus according to the above example of the present invention;
FIG. 9 shows an alarm flow diagram of the feeding method for a multi-layered inspection apparatus according to the above example of the present invention;
FIG. 10 is a block diagram schematic of a feeding system for a multi-layered assay device, according to one embodiment of the present invention.
Description of the main element symbols: 10. a feeding system for the multi-layer inspection apparatus; 11. a state determination module; 12. a location determination module; 13. a circulation control module; 14. an anomaly monitoring module; 15. and a beat algorithm module.
The present invention is described in further detail with reference to the drawings and the detailed description.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "mounted on" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. When an element is referred to as being "secured to" another element, it can be directly secured to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.
In the chip inspection industry, chips need to be transported to the interior of a tester for testing. Because the layout of the traditional horizontally arranged testing machine and the transport line occupies too large equipment area and is very wasteful, the existing equipment develops a three-dimensional rack and a multi-layer mechanism instead to achieve the purpose of improving productivity. However, although the existing equipment structurally improves the utilization rate of the three-dimensional space by configuring the vertical/vertical conveying manipulator, the loading method matched with the existing equipment needs to be further optimized, particularly in a more complicated multi-layer space, when the material is fed, when the elevator moves, and which layer is fed first, which influences the UPH of the whole equipment.
In order to solve the above problems, the present application provides a feeding method and system for a multi-layer detection device, which can set fuzzy judgment during feeding to judge idle states of all testing machines based on the structures of an elevator material shuttle and a plurality of flow manipulators in the multi-layer detection device, and then precisely position the idle testing machines of each layer to determine which testing machine is idle, so as to send a chip material shuttle to a target layer, so that a programming logic is executed according to the steps of judging the state first and then performing position retrieval, thereby facilitating programming simplification and improving efficiency.
Specifically, referring to fig. 1 to 5, an embodiment of the present invention provides a feeding method for a multi-layered inspection apparatus, wherein the multi-layered inspection apparatus may include a lift and a plurality of test platforms respectively stacked at one side of the lift, and each test platform is provided with a circulation robot and a plurality of testing machines, and the feeding method for the multi-layered inspection apparatus may include the steps of:
s100: carrying out fuzzy judgment on whether each layer of test platform is in an idle state or not so as to determine that the test platform with the idle tester is used as a target layer, and transferring the material disc to be tested to a temporary storage area of the target layer; and
s200: and accurately judging the position of an idle tester in the target layer so as to control the circulation manipulator of the target layer to convey the chip in the material tray to be tested from the temporary storage area to a station corresponding to the idle tester.
It is worth noting that compared with the existing chip detection method, the feeding method for the multilayer detection device breaks through the space limitation, meanwhile, the material taking and discharging actions are carried out in parallel, and conflict is avoided in the parallel process. Particularly, in the process of conveying the material tray to be tested into the target layer, the material tray to be tested is designed into a queuing and warehousing mode, namely the material tray to be tested is queued in the temporary storage area of the target layer and then enters a corresponding testing machine for testing, so that efficient material supply is completed.
More specifically, as shown in fig. 2, the step S100 of the feeding method for a multi-layer testing apparatus of the present application may include the steps of:
s110: monitoring the states of the testers through the sensors to take the states or set values of all the testers in each layer of test platform as the layer state value of each layer of test platform;
s120: determining a test platform with an idle test machine as the target layer based on the layer state value of each layer of test platform; and
s130: and controlling the elevator to transfer the material tray to be tested to the temporary storage area of the target layer for queuing.
It should be noted that the feeding method for the multilayer detection device has a prospective overall judgment function, that is, only the test machines of all layers are subjected to idle judgment (namely, whether the test machines are empty or not is judged), and the positions of the idle test machines are not searched (namely, where the empty is not searched), so that the upper computer only needs to directly detect the sensors of the test machine stations of each layer, and the method belongs to network screening of fuzzy judgment and takes the judged result as the action guide of the later part. In other words, the feeding method for the multilayer detection device takes the test platform with the idle tester as the target layer through fuzzy judgment, and then determines the position of the idle tester in the target layer without determining the position of the idle tester from all testers, so that the method is beneficial to reducing the calculation amount of feeding each time and is convenient to improve the feeding efficiency.
In addition, each layer of test platform usually needs to test different performances of the chip through different testers. Optionally, each layer of test platform may include a first type of tester and a second type of tester, where the first type of tester is used to perform a first test on a chip first, and the second type of tester is used to perform a second test on the chip later. In other words, after the tray to be tested is transferred to the temporary storage area of the target layer, the chips carried in the tray to be tested are firstly transferred to the first type of tester for the first test, and then transferred to the second type of tester for the second test. In this way, the feeding method for the multilayer detection device according to the present application only needs to determine the state of the test platform according to the state of the first type of testing machine, and does not need to consider the state of the second type of testing machine, which is beneficial to reducing the use of sensors.
Preferably, in step S110 of the present application, the layer state value of each layer of test platform is equal to the state or set value of all the first type testers in the layer of test platform. Accordingly, in the step S120, at least one idle first type tester is necessarily determined to exist in the target layer.
Illustratively, the 0/1 signal indicates the idle/occupied status of each first type tester, that is, when the first type tester is in the occupied status, the state value of the first type tester is 1; when the first type of tester is in the idle state, the state value of the first type of tester is 0. When at least one first type of tester exists in a certain layer of test platform and is in the idle state, the state of the layer of test platform is defined as the idle state, so that the state or set value of all the first type of testers in each layer of test platform refers to the product of the state values of all the first type of testers in the layer of test platform and is equal to the layer state value of the layer of test platform. In other words, when at least one idle first type tester exists in a certain layer of test platform, the product of the state values of all the first type testers in the layer of test platform is equal to 0, that is, the layer state value of the layer of test platform is equal to 0, which indicates that the layer of test platform is in an idle state and needs to be loaded on the layer of test platform; and only when all the first type of test machines in a certain layer of test platform are in an occupied state, namely no idle first type of test machine exists, the product of the state values of all the first type of test machines in the layer of test platform is equal to 1, namely the layer state value of the layer of test platform is equal to 1, the layer of test platform is in an occupied state, and the layer of test platform does not need to be loaded.
It is noted that, in the step S120 of the feeding method for a multi-layer assay apparatus of the present application: and when two or more target layers exist, conveying the material disc to be detected nearby. In other words, when the number of the test platforms with the layer state value of zero is more than one, the elevator is controlled to convey the material tray to be tested to the test platform which is closest to the conveying platform of the elevator by adopting the principle of near conveying, so that the time consumption of the material tray to be tested in the conveying process is minimum, and the UPH of the test device is improved to the maximum extent.
For example, the transport platform of the elevator is usually close to the ground, i.e. the transport platform of the elevator is closest to the lowest test platform. In other words, the distance between the test platform on the lower layer and the conveying platform is usually smaller than the distance between the test platform on the upper layer and the conveying platform, and the approach conveying principle mentioned in the present application can be implemented, but not limited to, to satisfy the test platform on the lower layer first and then satisfy the test platform on the upper layer, so that the overall time consumption of the tray to be tested during the conveying process is minimized, so as to maximize the UPH of the testing apparatus.
Preferably, in the step S120: when two or more target layers exist, the material tray to be detected is conveyed from bottom to top nearby.
In addition, after the tray to be tested is transferred to the temporary storage area of the target layer for queuing, the specific position of the idle tester in the target layer needs to be determined so as to control the circulation manipulator of the target layer to transport the chips in the tray to be tested from the temporary storage area to the station (such as a preheating area) corresponding to the idle tester. It is understood that each layer of inspection platform may include a plurality of preheating zones, and the preheating zones correspond to the first type of tester and the second type of tester one by one, so that before chips are transported to the corresponding tester for testing, the chips are preheated in the corresponding preheating zones, which helps to improve the testing accuracy.
It should be noted that the ratio of the number of the first type of tester and the second type of tester in each layer of test platform is inversely proportional to the ratio of the test speed between the first type of tester and the second type of tester, so as to reduce the standby time of the testers and further improve the productivity. For example, when the testing speed of the second type of tester is three times that of the first type of tester, each inspection platform layer may include three first type of testers and one second type of tester to achieve optimal testing efficiency. It is understood that the test speed mentioned in the present application may be, but is not limited to, the number of chips implemented to complete the test per unit time.
According to the above-mentioned embodiment of the present application, as shown in fig. 3, the step S200 of the feeding method for a multi-layer detection apparatus of the present application may include the steps of:
s210: retrieving the state value of each first type of tester in the target layer, and taking the first type of tester with the state value of zero as the idle tester; and
s220: and controlling the circulation manipulator of the target layer to convey the chips in the material tray to be tested from the temporary storage area to the station corresponding to the idle tester.
It can be understood that after the chip is transported to the preheating zone corresponding to the idle first type testing machine, the preheating zone heats the chip, and then the preheated chip is transported to the idle first type testing machine for the first test.
It is noted that in the chip inspection industry, conventional equipment typically employs a vertically-moving robot to move spatially in conjunction with a row of multiple testers. As is known, the efficiency of two serial actions is far lower than the parallel efficiency, the efficiency of one elevator shuttle making spatial movement is far lower than the parallel efficiency of one elevator and a plurality of circulation manipulators, and one elevator and a plurality of circulation manipulators need a set of optimization method in the judgment process, namely, where to install and carry out sensor detection, which step is judged first, and then which step is judged to influence the complexity of software in programming and hardware installation, so that the optimization of the action process of the related equipment directly influences the efficiency improvement of the equipment. In order to solve the problems, the sensor can be directly installed at the tail end position corresponding to the testing machine, and only the state of the testing machine is judged in the whole feeding process, so that the use of the sensor in the process is reduced as much as possible, the targets judged on a software program are unified, namely the state is judged first, and then the position is searched, and the programming is simpler and more convenient.
Further, since the step S100 corresponds to the elevator and the circulation robot is parallel to the elevator, the present application can perform the work control of the circulation robot while performing the step S100. According to the operation of the circulation manipulator, because the testing speed of the first type of testing machine is lower than that of the second type of testing machine, and a larger number of first type of testing machines are adopted to make up for the difference of the speeds, the testing speed of the second type of testing machine becomes a capacity bottleneck, so that when the operation of the circulation manipulator is controlled, the state of the second type of testing machine is preferentially detected, and then the state of the first type of testing machine is detected, so that the second type of testing machine is preferentially supplemented, and the equipment efficiency is improved to the maximum extent.
Specifically, as shown in fig. 1, the feeding method for a multi-layer testing apparatus of the present application may further include the steps of:
s300: and judging the states of the second type of tester and the first type of tester in each layer of test platform in sequence so as to convey the chips tested by the first type of tester to a station corresponding to the idle second type of tester by controlling the flow manipulator in the layer of test platform. It should be understood that although the present application indicates the steps as S100, S200, and S300, the present application does not represent the sequence of the above steps, and in fact, the step S100 is parallel to the step S300; of course, the subsequent steps S400 and S500 also do not indicate a sequential order.
More specifically, as shown in fig. 4, the step S300 of the feeding method for a multi-layer testing apparatus of the present application may include the steps of:
s310: monitoring the state of a second type of testing machine through a first type of sensor to determine whether an idle second type of testing machine exists;
s320: responding to the second type of idle testing machine, and monitoring whether a chip which is tested by the first type of testing machine exists in a testing platform corresponding to the second type of idle testing machine or not through a sensor; and
s330: and responding to the existence of the chip which completes the first test, and controlling a circulation manipulator of the test platform to convey the chip which completes the first test to a station corresponding to the idle second type test machine.
In other words, in addition to loading the idle first type of test machine, the present application needs to make a judgment about the idle second type of test machine, and if the idle second type of test machine occurs and there is a chip that has been tested by the first type of test machine, the present application further controls the circulation manipulator of the target layer to transport the chip that has completed the first test to the preheating area corresponding to the second type of test machine, so as to perform preheating again and perform the second test.
It is worth noting that, in addition to monitoring whether the testing machine is in an idle state, the method for feeding multilayer type detection equipment according to the present application needs to monitor whether the testing machine is abnormal, so that the method for feeding multilayer type detection equipment according to the present application can use two types of sensors to monitor the idle state and the abnormal problem of the testing machine, so as to improve the normal operation of the feeding process and improve the stability of the testing equipment. For example, in the present application, in the selection of the sensors, a first type of sensor for monitoring the state of the tester and a second type of sensor for detecting an abnormality of the tester may be provided at end positions corresponding to the tester, respectively. In other words, the sensors mentioned in the above steps of the present application are all implemented as the first type of sensor, and are respectively used for monitoring the states of the first type of tester and the second type of tester to determine whether the first type of tester and the second type of tester are in an idle state. The second type of sensor of the present application mainly monitors whether the testing machine is abnormal or not, and triggers an alarm mechanism when the abnormality is found. For example, the second type of sensor of the present application may be used to monitor whether a chuck occurs in a testing machine or whether overlapping emptying occurs in a station, and once the chuck occurs or the overlapping emptying occurs, an alarm mechanism is triggered.
Specifically, according to the above-mentioned embodiment of the present application, as shown in fig. 1, the feeding method for a multi-layer testing apparatus may further include the steps of:
s400: and monitoring whether all the test machines have abnormity through a second type of sensor so as to trigger an alarm mechanism when the abnormity exists.
More specifically, as shown in fig. 5, the step S400 of the feeding method for a multi-layer assay apparatus may include the steps of:
s410: monitoring whether all the test machines are abnormal or not through a second type of sensor;
s420: responding to the abnormal testing machine, judging the abnormal type of the abnormal testing machine, and determining an alarm level according to the abnormal type;
s430: responding to the alarm level to be an artificial intervention alarm, and controlling the test equipment to stop to carry out artificial repair; and
s440: and controlling the test equipment to automatically repair in response to the alarm grade being the non-manual intervention alarm.
For example, once the chuck problem occurs, repeated feeding is still performed when a previous station has a material, a manual intervention alarm is triggered, the test equipment is controlled to be stopped to perform manual repair, the chip or even the equipment is prevented from being damaged, and the feeding safety is improved.
It should be noted that, in the feeding method for a multilayer inspection apparatus of the present application, it is usually only possible to monitor whether a testing machine is abnormal through the second type of sensor, and it is not possible to directly monitor whether an abnormality occurs in the transportation of a circulation manipulator and the transportation of a lift elevator, so that in order to improve the stability of the whole apparatus, the feeding method for a multilayer inspection apparatus of the present application may further determine whether an abnormal beat occurs by recording the beat time of each node, so as to trigger an alarm mechanism when an abnormal beat occurs.
Specifically, as shown in fig. 1, the feeding method for detecting the multilayer parallel chips in the present application may further include the steps of:
s500: and judging whether an abnormal beat occurs or not by recording the beat time of each node so as to further trigger an alarm mechanism when the abnormal beat exists.
For example, the beat time of each node recorded in the present application may include, but is not limited to: the time of the elevator transferring the material tray to be tested and the time of the circulation manipulator carrying the chip. Of course, in other examples of the present application, the time for transporting the material tray to the material shuttle or the time for transporting the material tray from the material shuttle to the elevator may also be implemented as the takt time of the node, so as to determine whether there is an abnormal takt by comparing the reference takt time or the previously recorded takt time. It can be understood that the alarm level can be determined according to the node where the abnormal beat is located or the time of the abnormal beat, so that the subsequent repairing mode can be determined according to the corresponding alarm level.
It should be noted that, as shown in fig. 6 and 7, taking ABCD as an example to represent multiple test platforms respectively, when the material tray to be tested is transported to the material loading buffer area of the four test platforms of ABCD by the elevator respectively, the transporting process of the circulation manipulator in each test platform is as follows: a. conveying the chip stored in the temporary storage area to a preheating area corresponding to the first type of test machine so as to heat the surface of the chip; b. after the preheated chip is conveyed to the first type of testing machine to carry out the first test, the chip which finishes the first test is conveyed to a preheating area corresponding to the second type of testing machine so as to preheat the surface of the chip again; then, conveying the preheated chip to the second type of testing machine for a second test; c. and conveying the chips which are subjected to the second test to a blanking temporary storage area, and conveying the chips subjected to detection to the next station from the blanking temporary storage areas in the four ABCD test platforms through a lifting elevator. It can be understood that compared with the traditional vertical lifting manipulator, the movement of the circulation manipulator adopted by the application is optimized to be smooth XY + rotation movement, the spatial layout is optimized, and the problems that the capacity is limited to the lifting movement and hidden danger exists in the lifting acceleration and deceleration are solved through the horizontal acceleration and deceleration with the best stability.
Illustratively, as shown in fig. 8, a round of the feeding process for the multi-layer detection apparatus of the present application is as follows: when the feeding starts, the detection stations are distributed according to the tasks; judging whether the current detection machine is idle or not; if so, the feeding system starts feeding to convey the chip to be detected to the elevator; judging which layer of detection machine is idle so that the material tray to be detected can be respectively conveyed to the A/B/C/D layer through the elevator; at the moment, the action of each node is prejudged according to the material-free state of the A/B/C/D layer and time accounting so as to execute an alarm mechanism; after the chip is moved to the buffer area/temporary storage area of the target layer, judging whether a detector A (namely a first type tester) is in an idle state or not, if not, waiting, and if so, controlling the manipulator to carry the chip to a preheating area in front of the tester so as to enter a first test after preheating; and judging whether a detector B (namely a second type of tester) is in an idle state or not, if not, waiting, and if so, controlling the manipulator to convey the chip from the tester A to the tester B so as to carry out a second test until the test is finished.
As shown in fig. 9, the alarm mechanism of the feeding method for a multi-layer inspection apparatus of the present application has the following flow: triggering an alarm mechanism according to the judgment of the state of the material shuttle (the detection result of a second type sensor can be obtained, and the beat time of each node can also be obtained); judging whether manual intervention repair is needed or manual intervention is not needed through an upper computer according to the set alarm types and the set severity levels; if manual intervention repair is required, shutdown is performed for manual review repair.
It is worth mentioning that according to another aspect of the present application, as shown in fig. 10, an embodiment of the present application further provides a feeding system 10 for a multi-tier type detection apparatus, wherein the multi-tier type detection apparatus may include a lift elevator and a plurality of testing platforms correspondingly stacked on one side of the lift elevator, and each testing platform is provided with a circulation manipulator and a plurality of testing machines, and the feeding system 10 for the multi-tier type detection apparatus may include a state determination module 11 and a position determination module 12 communicably connected to each other, wherein the state determination module 11 is configured to fuzzily determine whether each testing platform is in an idle state to determine that the testing platform of the idle testing machine exists as a target tier, so that a tray to be tested is transferred to a buffer of the target tier; and the position determining module 12 is configured to accurately determine a position of an idle tester in the target layer, so as to control the circulation manipulator of the target layer to transport the chip in the tray to be tested from the temporary storage area to a station corresponding to the idle tester.
It is noted that in an example of the present application, the state determination module 11 may be further configured to acquire the state of the tester monitored via the first type of sensor, so as to use the state or set value of the tester in each layer of the test platform as the layer state value of each layer of the test platform; determining a test platform with an idle tester to serve as the target layer based on the layer state value of each layer of test platform; and controlling the elevator to transfer the material tray to be tested to the temporary storage area of the target layer for queuing.
In addition, in an example of the present application, the position determination module 12 may be further configured to retrieve the state value of each first type tester in the target layer, so as to use the first type tester with a state value of zero as the idle tester; and controlling the circulation manipulator of the target layer to convey the chips in the material tray to be tested to the station corresponding to the idle tester from the temporary storage area.
According to the above embodiment of the present application, the feeding system 10 for a multilayer inspection apparatus as shown in fig. 10 may further include a flow control module 13, configured to successively determine states of the second type testing machine and the first type testing machine in each layer of the testing platform, so as to transport a chip that has been tested by the first type testing machine to a station corresponding to an idle second type testing machine by controlling a flow manipulator in each layer of the testing platform.
In one example of the present application, the flow control module 13 is further configured to acquire a status of monitoring the second type of tester via the first type of sensor to determine whether there is an idle second type of tester; responding to the second type of idle testing machine, and monitoring whether a chip which is tested by the first type of testing machine exists in a testing platform corresponding to the second type of idle testing machine or not through a sensor; and responding to the existence of the chip which completes the first test, and controlling the circulation manipulator of the test platform to convey the chip which completes the first test to a station corresponding to the idle second type test machine.
According to the above-mentioned embodiment of the present application, as shown in fig. 10, the feeding system 10 for a multi-layer testing apparatus may further include an anomaly monitoring module 14 for monitoring all testing machines for anomalies by a second type of sensor to trigger an alarm mechanism when anomalies exist.
In one example of the present application, the anomaly monitoring module 14 is further configured to monitor all testing machines for anomalies via the second type of sensor; responding to the existence of the abnormal testing machine, judging the abnormal type of the abnormal testing machine, and determining an alarm level according to the abnormal type; responding to the alarm level to be an artificial intervention alarm, and controlling the test equipment to stop to carry out artificial repair; and controlling the test equipment to automatically repair in response to the alarm level being a non-manual intervention alarm.
According to the above embodiment of the present application, as shown in fig. 10, the feeding system 10 for a multi-layer detection apparatus may further include a beat algorithm module 15, configured to determine whether an abnormal beat occurs by recording beat times of each node, so as to further trigger an alarm mechanism when the abnormal beat exists.
It is noted that the flow robot controlled by the feeding system 10 for a multi-layer inspection apparatus of the present application may, but is not limited to, suck or pick chips by suction nozzles or clamping jaws. It can be understood that when the circulation manipulator adopts the suction nozzle mode to absorb the chip, the suction nozzle that adopts can be vacuum suction nozzle, also can be magnetic suction nozzle, as long as can absorb the chip can, this application is no longer repeated to this.
In addition, although the feeding method and system for a multi-layer inspection apparatus according to the above embodiments of the present application are described by taking an inspection chip as an example to illustrate features and advantages of the present application, the method and system are merely exemplary, and in other examples of the present application, the method and system for a multi-layer inspection apparatus can be used to inspect other objects, and can also achieve the effect of improving productivity.
All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A feeding method for a multi-layered inspection apparatus including a lift and a plurality of test platforms stacked correspondingly on one side of the lift, and each of the test platforms is provided with a circulation robot and a plurality of testing machines, the feeding method for a multi-layered inspection apparatus comprising the steps of:
carrying out fuzzy judgment on whether each layer of test platform is in an idle state or not so as to determine that the test platform with the idle tester is used as a target layer, and transferring the material disc to be tested to a temporary storage area of the target layer; and
and accurately judging the position of an idle tester in the target layer so as to control the circulation manipulator of the target layer to convey the chip in the material tray to be tested from the temporary storage area to a station corresponding to the idle tester.
2. The feeding method for multi-layer testing equipment according to claim 1, wherein the step of fuzzily judging whether each layer of test platform is in an idle state to determine that the test platform of the idle tester exists as a target layer, so that the tray to be tested is transferred to the temporary storage area of the target layer comprises the steps of:
monitoring the state of the tester through the first type of sensor, and taking the state or set value of the tester in each layer of test platform as the layer state value of each layer of test platform;
determining a test platform with an idle tester as the target layer based on the layer state value of each layer of test platform; and
and controlling the elevator to transfer the material tray to be tested to the temporary storage area of the target layer for queuing.
3. The method of feeding multi-layer inspection apparatus of claim 2, wherein the testers of each level of the test platform include a first type tester for performing a first test on a chip and a second type tester for performing a second test on a chip, and the level state value of each level of the test platform is equal to the product of the state values of the first type testers in each level of the test platform.
4. The feeding method for a multilayer inspection apparatus according to claim 3, wherein in said step of determining that there is a test platform of an idle tester as the target layer based on the layer state value of each layer of test platforms:
when two or more target layers exist, the material tray to be detected is conveyed from bottom to top nearby.
5. The feeding method for multi-layer inspection apparatus according to claim 3 or 4, wherein the step of precisely determining the position of the idle tester in the target layer to control the circulation robot of the target layer to transport the chips in the tray to be inspected from the buffer area to the station corresponding to the idle tester comprises the steps of:
retrieving the state value of each first type tester in the target layer, and taking the first type tester with the state value of zero as the idle tester; and
and controlling the circulation manipulator of the target layer to convey the chip in the material tray to be tested from the temporary storage area to the station corresponding to the idle tester.
6. The method of feeding for a multi-layer assay device according to claim 3 or 4, further comprising the steps of:
and judging the states of the second type of tester and the first type of tester in each layer of test platform in sequence so as to convey the chips tested by the first type of tester to a station corresponding to the idle second type of tester by controlling the flow manipulator in each layer of test platform.
7. The feeding method for multi-layer testing apparatus according to claim 6, wherein said step of sequentially determining the states of the second type testing machine and the first type testing machine in each layer of testing platform to transport the chips tested by the first type testing machine to the station corresponding to the idle second type testing machine by controlling the flow manipulator in each layer of testing platform comprises the steps of:
monitoring the state of a second type of testing machine through a first type of sensor to determine whether an idle second type of testing machine exists;
responding to the second type of idle testing machine, and monitoring whether a chip which is tested by the first type of testing machine exists in a testing platform corresponding to the second type of idle testing machine or not through a sensor; and
and responding to the existence of the chip which completes the first test, and controlling a circulation manipulator of the test platform to convey the chip which completes the first test to a station corresponding to the idle second type test machine.
8. The feeding method for a multi-layer assay device according to any one of claims 1 to 4, further comprising the steps of:
monitoring whether all the test machines are abnormal or not through a second type of sensor so as to trigger an alarm mechanism when the machines are abnormal;
the step of monitoring whether all the test machines have abnormity through the second type of sensor so as to trigger an alarm mechanism when the abnormity exists comprises the following steps:
monitoring whether all the testing machines have abnormality through the second type of sensor;
responding to the existence of the abnormal testing machine, judging the abnormal type of the abnormal testing machine, and determining an alarm level according to the abnormal type;
responding to the alarm level to be an artificial intervention alarm, and controlling the test equipment to stop to carry out artificial repair; and
and controlling the test equipment to automatically repair in response to the alarm grade being the non-manual intervention alarm.
9. The feeding method for a multi-layer assay device according to any one of claims 1 to 4, further comprising the steps of:
and judging whether an abnormal beat occurs or not by recording the beat time of each node so as to further trigger an alarm mechanism when the abnormal beat exists.
10. A feeding system for a multi-layered inspection apparatus, wherein the multi-layered inspection apparatus comprises a lift and a plurality of test platforms stacked correspondingly on one side of the lift, and each test platform is provided with a circulation robot and a plurality of testing machines, characterized in that the feeding system for the multi-layered inspection apparatus comprises, communicably connected to each other:
the state determining module is used for judging whether each layer of test platform is in an idle state in a fuzzy manner so as to determine that the test platform with the idle test machine is used as a target layer, and the material disc to be tested is transferred to the temporary storage area of the target layer; and
and the position determining module is used for accurately judging the position of the idle tester in the target layer so as to control the circulation manipulator of the target layer to convey the chip in the material tray to be tested from the temporary storage area to the station corresponding to the idle tester.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116666249A (en) * | 2023-07-28 | 2023-08-29 | 广东长兴半导体科技有限公司 | Wafer testing method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206038789U (en) * | 2016-08-11 | 2017-03-22 | 深圳市昌宝机电设备有限公司 | Full -automatic aging test system |
| CN106546903A (en) * | 2016-10-14 | 2017-03-29 | 歌尔科技有限公司 | A kind of frock test system and frock test control method |
| CN108169933A (en) * | 2017-12-15 | 2018-06-15 | 苏州华兴源创电子科技有限公司 | A kind of liquid crystal panel detecting method and system |
| CN109132526A (en) * | 2018-10-26 | 2019-01-04 | 苏州富强科技有限公司 | A kind of workpiece feeding device and workpiece feeding method |
| CN109238653A (en) * | 2018-08-17 | 2019-01-18 | 张家港康得新光电材料有限公司 | A kind of detection method, device, computer readable storage medium and computer equipment |
| CN113777336A (en) * | 2021-09-08 | 2021-12-10 | 广州赛特智能科技有限公司 | Automatic detection system and method for biological specimen |
| CN113998451A (en) * | 2021-11-12 | 2022-02-01 | 苏州华兴源创科技股份有限公司 | Test equipment |
-
2022
- 2022-02-25 CN CN202210181595.XA patent/CN114735467A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206038789U (en) * | 2016-08-11 | 2017-03-22 | 深圳市昌宝机电设备有限公司 | Full -automatic aging test system |
| CN106546903A (en) * | 2016-10-14 | 2017-03-29 | 歌尔科技有限公司 | A kind of frock test system and frock test control method |
| CN108169933A (en) * | 2017-12-15 | 2018-06-15 | 苏州华兴源创电子科技有限公司 | A kind of liquid crystal panel detecting method and system |
| CN109238653A (en) * | 2018-08-17 | 2019-01-18 | 张家港康得新光电材料有限公司 | A kind of detection method, device, computer readable storage medium and computer equipment |
| CN109132526A (en) * | 2018-10-26 | 2019-01-04 | 苏州富强科技有限公司 | A kind of workpiece feeding device and workpiece feeding method |
| WO2020082506A1 (en) * | 2018-10-26 | 2020-04-30 | 苏州富强科技有限公司 | Workpiece feeding device and workpiece feeding method |
| CN113777336A (en) * | 2021-09-08 | 2021-12-10 | 广州赛特智能科技有限公司 | Automatic detection system and method for biological specimen |
| CN113998451A (en) * | 2021-11-12 | 2022-02-01 | 苏州华兴源创科技股份有限公司 | Test equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116666249A (en) * | 2023-07-28 | 2023-08-29 | 广东长兴半导体科技有限公司 | Wafer testing method |
| CN116666249B (en) * | 2023-07-28 | 2024-01-26 | 广东长兴半导体科技有限公司 | Wafer testing method |
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