CN117085955A

CN117085955A - Wafer sorting system and wafer sorting method

Info

Publication number: CN117085955A
Application number: CN202210524259.0A
Authority: CN
Inventors: 何国诚; 陈正锴; 赵玄巽; 林修纬; 龚圣翔; 汤逢成; 廖伟捷; 宋柏辰
Original assignee: Delta Electronics Inc
Current assignee: Delta Electronics Inc
Priority date: 2022-05-13
Filing date: 2022-05-13
Publication date: 2023-11-21

Abstract

The invention provides a wafer sorting system and a wafer sorting method. The system is provided with a conveying device, a grabbing device, a plurality of wafer storage boxes and a control device. The plurality of wafer storage boxes are divided into a good product area, a non-classified inferior product area and a classified inferior product area. The classified inferior product area has a plurality of defect areas corresponding to a plurality of defect types, respectively. And conveying the good product wafers to the good product area by the system, recording the flaw types of the bad product wafers, and conveying the bad product wafers to the non-classification bad product area. The system also performs classification processing on the plurality of inferior wafers without the classified inferior regions, takes the inferior wafers, and conveys the inferior wafers to the corresponding defective regions in the classified inferior regions based on the classification result. The invention can greatly increase the capacity of the good product area and realize the full-automatic wafer sorting function.

Description

Wafer sorting system and wafer sorting method

Technical Field

The present invention relates to systems and methods, and more particularly, to a wafer sorting system and a wafer sorting method.

Background

The existing wafer sorting machine can store good wafers into good boxes according to the detection results of the wafers, and store bad wafers into corresponding bad boxes according to the defect types of the bad wafers.

However, there are a considerable variety of defect types of wafers, such as scratches, warpage, thickness anomalies, edge anomalies, breakage, and the like.

When a bad product box is arranged for each flaw type to be stored, the number of good product boxes can be greatly reduced.

When the defective wafers of all defect types are arbitrarily stored in the same defective box, the defective wafers must be classified by a manual method or by using a costly wafer classifier.

Please refer to fig. 1A and fig. 1B. Fig. 1A is a schematic diagram illustrating an operation of a conventional wafer sorter. Fig. 1B is a schematic diagram of the operation result of a conventional wafer sorter.

In order to classify good wafers and bad wafers of different defect types, the wafer sorter 10 must set storage boxes independently for good and all defect types, and send the inspected wafers 11 to the corresponding storage boxes by the conveying device 100.

For example, if the wafer sorter 10 can set up eight sets of wafer storage cassettes at most, when four defect types are to be sorted, the wafer sorter 10 must set up four sets of defective cassettes 101-104, which makes it possible to set up only four sets of good cassettes 105-108 at most.

As shown in fig. 1B, the bad wafers of different defect types NG1, NG2, NG3, and NG4 are classified into different bad cassettes 101-104.

However, in general, the wafer sorter 10 has to replace empty pods frequently due to the small capacity of pods 105-108 due to the extremely high yield of wafer processing.

Moreover, the four sets of bad cassettes 101-104 are inefficient to use and occupy a large number of positions due to the lower probability of producing bad wafers.

Therefore, the existing wafer sorter has the problem that a large number of inferior product boxes are required to be arranged for placing inferior product wafers with different flaw types, and the number of settable good product boxes is reduced.

Please refer to fig. 1C and fig. 1D. Fig. 1C is a schematic diagram illustrating an operation of a conventional wafer sorter. Fig. 1D is a schematic diagram of the operation result of a conventional wafer sorter.

In another conventional wafer sorter 12, the defective wafers are not sorted, but defective wafers of all defect types are stored in the same defective cassette 128 without sorting, which greatly increases the number of good cassettes 121-127.

Specifically, the wafer sorter 12 may send the inspected wafers 13 to the good cassettes 121 to 127 or the bad cassettes 128 through the conveying device 120 according to the quality inspection result.

As shown in fig. 1D, all of the defective wafers of the defect types NG1, NG2, NG3, NG4, and NG5 are stored in the same defective cassette 128 in a mixed manner.

The above situation makes it necessary for the user to manually sort the inferior wafers of different defect types of the inferior cassette 128 after the wafer sorting, or to sort the inferior wafers by using an expensive wafer sorter, thereby greatly increasing the labor cost, time cost and equipment cost.

Therefore, the conventional wafer sorter has a problem in that "all types of defective wafers are stored in the same defective cassette without sorting, and the defective wafers of the cassette must be sorted into defective cassettes of different defect types by manpower or additional sorting equipment after sorting is completed.

Accordingly, the above-mentioned problems exist in the conventional wafer sorting machine, and a more effective solution is needed.

Disclosure of Invention

The main objective of the present invention is to provide a wafer sorting system and a wafer sorting method, which can mix and store inferior wafers with different defect types and automatically sort the inferior wafers after detection.

In one embodiment, a wafer sorting system includes a conveyor, a gripper, a plurality of wafer cassettes, and a controller. The conveying device is used for conveying a plurality of wafers. The grabbing device is used for grabbing the wafer. The wafer storage boxes are at least divided into a good product area, a non-classified inferior product area and a classified inferior product area, wherein the classified inferior product area comprises a plurality of flaw areas respectively corresponding to a plurality of flaw types. The control device is electrically connected with the conveying device and the grabbing device and is set to control the conveying device to convey the good product wafer to the good product area when the wafer is the good product wafer, record the defect type of the bad product wafer when the wafer is the bad product wafer and control the conveying device to convey the bad product wafer to the non-classification bad product area. The control device is configured to perform a classification process on the plurality of defective wafers of the non-classified defective area based on the plurality of defect types to determine the defective area corresponding to each defective wafer, control the gripping device and the conveying device to take the defective wafer from the non-classified defective area, and convey the defective wafer to the defective area of the classified defective area.

In one embodiment, a wafer sorting method includes: a) Controlling a conveying device to convey each of the plurality of wafers to a good product area or a non-classified bad product area by a control device; b) When the wafer is a good wafer, storing the good wafer in the good area; c) When the wafer is a defective wafer, recording the defect type of the defective wafer, and storing the defective wafer in the non-classified defective area; d) Performing a classification process on the inferior wafers of the non-classified inferior zone based on the defect types to determine the defect zone corresponding to each inferior wafer among the defect zones of the classified inferior zone; and e) controlling a grabbing device and the conveying device to take each inferior wafer from the non-classified inferior product area and conveying the inferior product wafer to the determined defect area.

The invention can greatly increase the capacity of the good product area and realize the full-automatic wafer sorting function.

Drawings

Fig. 1A is a schematic diagram illustrating an operation of a conventional wafer sorter.

Fig. 1B is a schematic diagram of the operation result of a conventional wafer sorter.

Fig. 1C is a schematic diagram illustrating an operation of a conventional wafer sorter.

Fig. 1D is a schematic diagram of the operation result of a conventional wafer sorter.

Fig. 2 is a schematic diagram of a wafer sorting system according to an embodiment of the invention.

Fig. 3 is a schematic diagram illustrating operation of a wafer sorting system according to an embodiment of the invention.

Fig. 4 is a schematic diagram of a wafer sorting system according to an embodiment of the invention.

Fig. 5 is a schematic diagram of a control device according to an embodiment of the present invention.

Fig. 6 is a schematic diagram illustrating operation of a wafer sorting system according to an embodiment of the invention.

Fig. 7 is a schematic diagram of a sorting result of a wafer sorting system according to an embodiment of the invention.

Fig. 8 is a schematic diagram of a sorting result of a wafer sorting system according to an embodiment of the invention.

Fig. 9 is a schematic diagram of a sorting result of a wafer sorting system according to an embodiment of the invention.

FIG. 10 is a schematic diagram of a portion of a wafer sort system according to one embodiment of the present invention.

Fig. 11 is a partial flow chart of a wafer sort method according to an embodiment of the invention.

Fig. 12 is a partial flow chart of a wafer sort method according to an embodiment of the present invention.

Fig. 13 is a partial flow chart of a wafer sort method according to an embodiment of the present invention.

Fig. 14 is a partial flow chart of a wafer sort method according to an embodiment of the present invention. Wherein reference numerals are as follows:

10. 12: existing wafer sorting system

100. 120: conveying device

101-104, 128: inferior box

105-108, 121-127: good product box

11. 13: wafer with a plurality of wafers

2: wafer sorting system

20: control device

21: conveying device

210. 211: auxiliary conveying device

22: grabbing device

230-237: wafer storage box

24: feeding device

240-245: box to be detected

25: detection device

26: storage device

27: human-machine interface

28: communication device

3: wafer with a plurality of wafers

30-36: wafer position

40: quality classification control module

41: flaw classification control module

42: mobile control module

43: detection control module

44: sheet taking control module

50: feeding stage

51: detection stage

52: sorting stage

60. 61: lifting device

NG1, NG2, NG3, NG4, NG5: type of flaw

S10-S12: sorting step

S20-S25: sequencing process step

S30-S32: sequencing the execution steps

Detailed Description

The preferred embodiment of the present invention will be described in detail with reference to the drawings.

The invention provides a wafer sorting system and a sorting method, wherein in the detection process, inferior wafers are sent to an inferior product area without classification, and the storage position and the defect type are recorded.

After the detection is completed, the method performs classification processing on all the inferior wafers based on the defect types to determine classification positions of the inferior wafers in the inferior product-like areas.

And finally, each inferior wafer is moved from the non-classification position of the non-classification inferior product region to the classification position of the classified inferior product region.

Please refer to fig. 2 and fig. 3. Fig. 2 is a schematic diagram of a wafer sorting system according to an embodiment of the invention. Fig. 3 is a schematic diagram illustrating operation of a wafer sorting system according to an embodiment of the invention.

The wafer sorting system 2 of the present embodiment includes a conveying device 21, a gripping device 22, and a control device 20 electrically connected to the above devices.

The wafer sort system 2 may also include a plurality of wafer storage cassettes. Fig. 3 illustrates eight sets of wafer cassettes 230-237.

The wafer cassettes 230-237 may be divided into at least a good area, a no-classification bad area, and a classified bad area. These regions may be located in the same wafer cassette or in different wafer cassettes, without limitation.

The good product area is used for storing good product wafers with good detection results.

The non-classification inferior product area is used for temporarily storing inferior product wafers with inferior products as detection results.

The classified inferior product area is used for storing inferior product wafers which are classified.

Specifically, the classified inferior product regions may include a plurality of defect regions corresponding to a plurality of defect types, respectively, i.e., different defect regions are used for storing inferior product wafers of different defect types.

In the example of fig. 3, the wafer cassettes 230-235 are set to good areas, the wafer cassette 236 is set to no-sort-bad areas, and the wafer cassette 237 is set to sorted-bad areas, but is not so limited.

In another example, a portion (e.g., 1-10 layers) of the wafer cassette 236 is set as a good area, and another portion (e.g., after 11 layers) is set as a no-classification bad area, i.e., the good area and the no-classification bad area may be disposed in the same wafer cassette 236.

The conveying device 21 is used for conveying the wafer 3, for example, conveying the detected wafer 3 to a good product area (such as a position 30) or a non-classified bad product area (such as a position 31) according to the detection result.

In one embodiment, the conveyor 21 comprises a conveyor belt device by which the wafer is conveyed smoothly.

The gripping device 22 is used to grip a wafer, for example, from a non-classified defective area.

In one embodiment, the gripping device 22 includes a chuck for sucking up the wafer.

It should be noted that the transporting device 21 can only transport the wafer to the designated position of the wafer cassette, and cannot take the wafer out of the wafer cassette. In this regard, the present invention is to add a gripping device 22 to take out wafers from the non-classified defective areas.

The control device 20, such as an industrial control computer, control box, etc., may include CPU, GPU, MCU, FPGA, soC or other controller circuitry.

The control device 20 is configured to determine the storage position as a good product region or a no-classification bad product region based on the detection result of each wafer during the detection process.

Specifically, the control device 20 is configured to control the conveying device 21 to convey the good wafer to the wafer storage box 230 (position 30) of the good area when the detection result is the good wafer, and to record the defect type of the bad wafer and control the conveying device 21 to convey the bad wafer to the wafer storage box 236 (position 31) of the non-classified bad area when the detection result is the bad wafer.

After the inspection, the control device 20 is configured to determine the classification position of each defective wafer in the classified defective area based on the inspection result (defect type) of the defective wafer.

Specifically, the control device 20 is configured to determine defective areas corresponding to the respective defective wafers by performing classification processing on the plurality of defective wafers having no classification defective areas based on the plurality of defect types, and to control the gripping device 22 and the conveying device 21 to take the defective wafers having various defect types from the non-classification defective areas and to convey the various defective wafers to the determined defective areas.

In one embodiment, the non-sorted defective area and the sorted defective area are separate wafer cassettes, rather than sharing the same wafer cassette.

For example, the plurality of wafer cassettes may include a first wafer cassette and a second wafer cassette. The first wafer storage cassette is set to a no-classification defective area, and the second wafer storage cassette is set to a classified defective area.

In one embodiment, as shown in fig. 3, a first wafer cassette (wafer cassette 236) and a second wafer cassette (wafer cassette 237) may be disposed on different sides of the transport apparatus 21.

In one embodiment, as shown in fig. 3, the wafer sorting system 2 may include auxiliary conveyors 210, 211 electrically connected to the control device 20, such as conveyor belts connected between the wafer cassettes 230-237, which may have a different conveying direction than the main path of the conveyor 21.

The auxiliary conveying device 211 connected between the first wafer storage box 236 and the second wafer storage box 237 is used for conveying the inferior wafers from the first wafer storage box 236 to the second wafer storage box 237, namely from the non-classified inferior product area to the classified inferior product area.

Referring to fig. 2 to 4, fig. 4 is a schematic diagram of a wafer sorting system according to an embodiment of the invention.

In comparison with the wafer sorting system 2 of fig. 3, the wafer sorting system 2 of fig. 4 may further include a feeding device 24, a detecting device 25, a storage device 26, a man-machine interface 27 and/or a communication device 28 electrically connected to the control device 20.

The feeding device 24 may comprise a plurality of feeding gripping devices and a plurality of cartridges to be tested. The plurality of boxes to be detected are used for storing a plurality of wafers to be detected. The plurality of loading grippers may include suction cups for gripping a plurality of wafers from the plurality of cassettes to be inspected to the conveyor 21, so that the conveyor 21 conveys the plurality of wafers to the inspection device 25.

The inspection device 25 is used for inspecting a plurality of wafers to generate inspection results of each wafer.

The detection result is used for indicating that the quality of the wafer is a good wafer or a bad wafer, and can further indicate the defect type when the quality of the wafer is a bad wafer.

The wafer inspection and the generation of inspection results are related art, and the details thereof are not related to the technology of the present invention, and any existing wafer inspection technology can be used to provide the inspection results according to the present invention, and the present invention classifies the inspection results.

The storage device 26 may include a transient storage medium such as RAM and a non-transient storage medium such as a hard disk, a flash memory, a ROM, an EEPROM, etc. for storing data such as a non-sort location, a sort location, and a mapping relationship described below.

The human-computer interface 27 may include an input interface such as a keyboard, a mouse, a touch pad, etc., and an output interface such as a display, a printer, a speaker, etc., for interaction with a user.

The communication device 28, such as a wired/wireless network interface, a serial transmission module, etc., is used to connect to an external computer and perform data transmission. For example, the communication device 28 may be connected to an external computer to obtain the detection related data or upload the classification result.

Please refer to fig. 2 to fig. 5. Fig. 5 is a schematic diagram of a control device according to an embodiment of the present invention.

In one embodiment, the control device 20 may include a quality classification control module 40, a flaw classification control module 41, a movement control module 42, a detection control module 43, and a slice taking control module 44 for implementing different functions.

The quality classification control module 40 is configured to determine a position of a good wafer area or a non-classification position of a non-classification defective wafer area based on a detection result of each wafer as a good wafer or a bad wafer.

The defect classification control module 41 is configured to determine classification positions of defective wafers of various defect types in the classified defective areas (e.g., the second wafer cassette described above). The classification position belongs to a defect area corresponding to the inferior wafer.

The defect classification control module 41 is further configured to calculate a total number of wafers of each of the defect types among the plurality of defective wafers of the non-classified defective area (e.g., the first wafer storage box), allocate a range of each defective area based on the number of the plurality of wafers of the defect types to the classified defective area (e.g., the second wafer storage box), and set a mapping relationship between a plurality of non-classified positions of the plurality of defective wafers in the non-classified defective area (e.g., the first wafer storage box) to a plurality of classified positions of the classified defective area (e.g., the second wafer storage box).

The movement control module 42 is configured to control the gripping device 22 to pick up the inferior wafer from one of the non-classified positions, determine the classified position of the inferior wafer based on the mapping relationship and the non-classified position, and control the conveying device 21 to convey the inferior wafer to the classified position determined by the classified inferior area.

The inspection control module 43 is configured to control the inspection device 25 to inspect the wafers to be inspected, so as to obtain inspection results of each wafer.

The wafer taking control module 44 is configured to control the loading device to take the wafer to be inspected to the conveying device 21.

It should be noted that the modules shown in fig. 5 are connected (may be electrical connection or information connection), and may be hardware modules (such as electronic circuit modules, integrated circuit modules, socs, etc.), software modules, or a hybrid of software and hardware modules, which are not limited.

When the module is a software module (such as firmware, an operating system or an application program), the storage device 26 may include a non-transitory computer readable recording medium, where the non-transitory computer readable recording medium stores a computer program, and the computer program records a computer executable program code, and when the control device 20 executes the program code, the control function of each module is implemented.

Please refer to fig. 2 to fig. 6. Fig. 6 is a schematic diagram illustrating operation of a wafer sorting system according to an embodiment of the invention.

In this embodiment, the operation of the wafer sorting system 2 can be divided into a loading stage 50, a detecting stage 51, and a sorting stage 52.

In the loading stage 50, a plurality of cassettes 240-245 are loaded with wafers 3 to be inspected, respectively. The loading and grabbing device may move the wafer 3 to be inspected from each cassette 240-245 to the transporting device 21 (e.g. position 33).

In the inspection stage 51, the conveyor 21 conveys the wafer 3 to be inspected to the inspection device 25 (position 34) for inspection, so as to confirm whether the wafer 3 is defective or not through visual inspection, and generate an inspection result.

The transfer device 21 then prepares the inspected wafer 3 for transfer to the wafer storage cassettes 230-237 (position 35).

In the sorting stage 52, the conveying device 21 is controlled according to the detection result to convey the detected good wafers to the good product area (position 30) through the auxiliary conveying device 210, such as to store the detected bad wafers in the wafer storage boxes 230-235, or convey the detected bad wafers to the non-classified bad product area (position 31) through the auxiliary conveying device 211, such as to store the detected bad wafers in the wafer storage box 236.

Next, a sorting process is performed to determine the position of each inferior wafer in the sorted inferior area, such as the wafer storage cassette 237, the inferior wafer is suctioned from the non-sorted inferior area (position 31) by the gripping device 22, and the inferior wafer is conveyed to the sorting position (position 32) designated in the sorted inferior area by the auxiliary conveying device 211.

Therefore, the invention can automatically finish the classified storage of the wafers and provide larger capacity of good wafers.

Referring to fig. 2 to 7, fig. 7 is a schematic diagram of a sorting result of a wafer sorting system according to an embodiment of the invention.

As shown, the bad wafers of all defect types NG1, NG2, NG3, and NG4 are stored in the wafer storage cassette 236 of the non-classified bad area in a mixed manner. Further, after sorting is completed, the bad wafers of different defect types NG1, NG2, NG3, and NG4 are sequentially arranged in the wafer storage cassette 237.

In one embodiment, the sorted inferior wafers may be stored in order of defect types, such as NG 1- > NG 2- > NG 3- > NG 4- > NG5, and the inferior wafers of the same defect type are stored continuously.

In one embodiment, the present invention can sequentially record a plurality of non-classification locations in the non-classification defective area and defect types of the defective wafers stored therein in a multi-dimensional array or serial manner.

And, by executing the sorting algorithm to the array elements or the serial nodes, the ordered array or the serial is generated, and the array elements or the serial nodes before and after the sorting are compared in position change to obtain the mapping relation.

The Sorting algorithm may be a conventional Sorting algorithm, such as a selection Sorting method (Selection Sorting), an insertion Sorting method (Insertion Sorting), a Bubble Sorting method (Bubble Sorting), a Shell Sorting method (Shell Sorting), a shaking Sorting method (Shaker Sorting), and a Quick Sorting method (Quick Sorting), but is not limited thereto.

In an embodiment, the invention can count the total number of the inferior wafers of each flaw type one by one, and sequentially move all the inferior wafers of each flaw type to the classified inferior area.

In one embodiment, the present invention can assign different flaw types to different values, such as 0-10, 0-100, -10-10, etc., perform sorting on the values, and establish a mapping relationship according to the positions before and after the sorting.

In an embodiment, the present invention can place the first inferior wafer from the non-classified inferior area to the classified inferior area, and place other inferior wafers of the same defect type to adjacent positions of the classified inferior area.

Then, a second inferior wafer (for example, a defective wafer of a different type from the first inferior wafer) is placed in the classified inferior area, and other inferior wafers of the same defective type are placed in adjacent positions of the classified inferior area.

Referring to fig. 2 to 8, fig. 8 is a schematic diagram of a sorting result of a wafer sorting system according to an embodiment of the invention.

In the present embodiment, when the sorted inferior wafer storage boxes 237 are used to store inferior wafers of different defect types, a plurality of areas (defect areas) of the wafer storage boxes 237 are used to store inferior wafers of different defect types, respectively.

Also, in order to effectively distinguish and separate the plurality of defective areas, the plurality of storage areas of the wafer cassette 237 of the sorted defective area may have a separation mark therebetween. The separation mark may be, for example, a blank layer, a foreign object (e.g., a plugged wafer model), a color, a pattern, text (e.g., a visual mark on each storage area by a decal or spray coating), and/or an electronic mark (e.g., directly recording the number of layers of each NG type in a computer), etc.

Referring to fig. 2 to 9, fig. 9 is a schematic diagram of a sorting result of a wafer sorting system according to an embodiment of the invention.

As shown, the bad wafers of all defect types NG1 and NG2 are stored in the wafer storage cassette 236 of the non-classified bad area in a mixed manner. After the sorting is completed, the defective wafer of the defect type NG1 is stored in the wafer storage box 237, and the defective wafer of the defect type NG2 is stored in the other wafer storage box 238.

In this embodiment, a set of wafer cassettes is used to store a defective wafer of a defective type.

For example, the wafer sort system 2 may first reject all bad wafers of the defect type NG1 into the wafer storage cassette 237.

The user may then replace the wafer storage cassette 237 with an empty wafer storage cassette 238. Also, the wafer sort system 2 may discharge all bad wafers of the defect type NG2 into the wafer storage cassette 238, and so on.

Referring to fig. 2 to 10, fig. 10 is a schematic diagram illustrating a portion of a wafer sorting system according to an embodiment of the invention.

In one embodiment, the wafer sorting system 2 may include a lift mechanism that may be used to adjust the height of any one of the wafer cassettes 236-237, the conveyor 21 (including the auxiliary conveyors 210-211) to bring the wafers on the conveyor 21 or the auxiliary conveyors 210-211 to a specified storage height in the wafer cassettes, i.e., the height of the sort or no sort location.

For example, when the lifting device is disposed on the conveying device 21, besides the height (position 36) of the conveyed inferior wafer, the picking height of the picking device 22 can be indirectly adjusted, and the inferior wafer (position 31) of each height of the wafer storage box 236 without the classified inferior area can be picked.

In another example, when the lifting device 60 is disposed in the wafer storage cassette 236 of the non-classified defective area, the height of the position 31 can be adjusted to match the height of the picking device 22, so as to pick up defective wafers.

In another example, when the lifting device 61 is disposed on the wafer storage cassette 237 of the sorted inferior product region, the inferior product wafer may be received by adjusting the height of the position 32 to match the height of the conveying device 21.

Referring to fig. 2 to 11, fig. 11 is a partial flowchart of a wafer sorting method according to an embodiment of the invention.

The wafer sorting method according to the embodiments of the present invention may be implemented by the wafer sorting system according to any of the embodiments.

The wafer sorting method of the present embodiment may include steps S10 to S13.

In step S10, the control device 20 controls the conveying device 21 to convey each of the plurality of wafers to the good product area or the non-classified bad product area through the quality classification control module 40.

In step S11, the control device 20 performs classification processing on the inferior wafers without classification of inferior wafers based on the defect types by the defect classification control module 41 to determine the defect areas corresponding to the inferior wafers among the defect areas.

In one embodiment, a plurality of defective areas of the classified defective areas may be set in the same wafer storage cassette. The control device 20 may determine the sorting position (e.g., layer number or position code) of each inferior wafer in the wafer cassette. The classification position belongs to a defect area corresponding to the inferior wafer.

In step S12, the control device 20 controls the gripping device 22 and the conveying device 21 to take each defective wafer from the non-classified defective area through the movement control module 42, and conveys the defective wafer to the determined defective area.

Referring to fig. 2 to 12, fig. 12 is a partial flowchart of a wafer sorting method according to an embodiment of the invention.

Step S10 of the wafer sorting method of the present embodiment may include steps S20 to S25.

In step S20, the control device 20 obtains the inspection result of each wafer through the quality classification control module 40.

In step S21, the control device 20 determines whether the currently processed wafer is good or not based on the obtained detection result by the quality classification control module 40.

If the wafer is good, step S22 is performed. In step S22, the control device 20 controls the conveying device 21 to store the good wafers in the good area through the quality classification control module 40.

Step S23 is then performed. In step S23, the control device 20 determines whether the next wafer needs to be sorted and stored by the quality sorting control module 40, i.e. determines whether all the wafer inspection is completed.

And if the next wafer does not need to be stored, ending. Otherwise, the control device 20 executes step S20 again.

If it is determined in step S21 that the wafer is a defective wafer, step S24 is performed. In step S24, the control device 20 records the defect type of the inferior wafer through the quality classification control module 40.

In one embodiment, the control device 20 can record the non-sort location of the inferior wafer in the non-sort inferior area and the defect type thereof.

In one embodiment, when the entire wafer cassette is set to the no-sort defective area, the control device 20 may record the defect types of defective wafers stored in each layer of the wafer cassette, such as in an array or a sequence.

In step S25, the control device 20 controls the conveying device 21 to store the inferior wafers to the non-classified inferior area through the quality classification control module 40.

Therefore, the invention can effectively store various wafers and record the quality of the wafers.

Referring to fig. 2 to 13, fig. 13 is a partial flowchart of a wafer sorting method according to an embodiment of the invention.

Step S11 of the wafer sorting method of the present embodiment may include steps S30-S32.

In step S30, the control device 20 calculates the total wafer amount of each of the defect types from among the plurality of defective wafers in the non-classified defective area by the defect classification control module 41 to obtain a plurality of wafer amounts of the defect types.

In step S31, the control device 20 allocates the range of each defective area to the wafer cassette of the classified defective area based on the number of the wafers of the defect types by the defect classification control module 41, such as the number of layers required for planning each defective area.

In step S32, the control device 20 sets a mapping relationship between the non-classification positions of the non-classification defective areas and the classification positions of the classified defective areas of the defective wafers through the defect classification control module 41.

The mapping relationship may be stored in the storage device 26, and the control device 20 may know the sorting position of each inferior wafer after sorting.

Therefore, the invention can effectively plan the classification position and ensure the correct classification result.

Referring to fig. 2 to 14, fig. 14 is a partial flowchart of a wafer sorting method according to an embodiment of the invention.

In step S40, the control device 20 controls the gripping device 22 to pick up the inferior wafer from one of the non-sorting positions through the movement control module 42, and place the inferior wafer on the conveying device 21.

In step S41, the control device 20 determines the classified position of the inferior wafer based on the mapping relationship and the non-classified position of the current inferior wafer through the movement control module 42.

In step S42, the control device 20 controls the conveying device 21 to convey the inferior wafer to the sorting position determined by the sorted inferior area through the movement control module 42.

In step S43, the control device 20 determines whether all the inferior wafers are inspected by the movement control module 42 to be sorted and stored.

And if the next wafer does not need to be stored, ending. Otherwise, the control device 20 executes step S40 again.

The invention can be classified into good products and bad products according to quality in two stages, and can be subdivided into different flaw groups according to flaw types after detection is completed, thereby avoiding slow detection speed or reducing storage capacity of good products due to classification of bad products, achieving careful and accurate classification, and not needing human assistance.

The above description is only a preferred embodiment of the present invention and is not intended to limit the scope of the present invention, so that all equivalent modifications that are made in the present invention are included in the scope of the present invention.

Claims

1. A wafer sorting system, comprising:

a conveying device for conveying a plurality of wafers;

a gripping device for gripping the wafer;

the wafer storage boxes are at least divided into a good product area, a non-classified inferior product area and a classified inferior product area, wherein the classified inferior product area comprises a plurality of flaw areas respectively corresponding to a plurality of flaw types; a kind of electronic device with high-pressure air-conditioning system

The control device is electrically connected with the conveying device and the grabbing device and is set to control the conveying device to convey the good wafer to the good area when the wafer is a good wafer, record the defect type of the bad wafer when the wafer is a bad wafer and control the conveying device to convey the bad wafer to the non-classification bad area;

the control device is configured to perform a classification process on the plurality of inferior wafers in the non-classified inferior zone based on the plurality of defect types to determine the defect zone corresponding to each inferior wafer, control the gripping device and the conveying device to take the inferior wafer from the non-classified inferior zone, and convey the inferior wafer to the defect zone of the classified inferior zone.

2. The wafer sort system of claim 1, further comprising:

the detection device is electrically connected with the control device and is used for detecting the plurality of wafers to generate a detection result of each wafer, wherein the detection result is used for indicating that the wafer is the good wafer or the bad wafer and comprises the defect type when the bad wafer is indicated; and

the feeding device comprises a plurality of feeding grabbing devices and a plurality of to-be-detected boxes, wherein the to-be-detected boxes are used for storing the plurality of wafers, and the feeding grabbing devices are used for grabbing the plurality of wafers from the to-be-detected boxes to the conveying device so as to enable the plurality of wafers to be conveyed to the detecting device.

3. The wafer sorting system of claim 1, wherein the plurality of wafer cassettes comprises a first wafer cassette and a second wafer cassette, the first wafer cassette is configured as the no-sort-reject zone, the second wafer cassette is configured as the sorted-reject zone, and the first and second wafer cassettes are disposed on different sides of the conveyor.

4. The wafer sort system of claim 3, further comprising:

an auxiliary conveying device, whose conveying direction is different from that of the conveying device, for conveying the inferior wafer from the first wafer storage box to the second wafer storage box; and

and the lifting device is used for adjusting the height of at least one of the first wafer storage box, the second wafer storage box and the auxiliary conveying device so as to enable the wafers to reach a storage height.

5. The wafer sort system as set forth in claim 3, wherein the second wafer cassette is configured with the plurality of defect areas and includes at least one zone mark for separating the plurality of defect areas;

the control device comprises a flaw classification control module which is set to determine a classification position of each inferior wafer in the second wafer storage box, wherein the classification position belongs to the flaw area corresponding to the inferior wafer;

the defect classification control module is further configured to calculate a plurality of wafer numbers of the defect types in the plurality of inferior wafers of the first wafer storage box, allocate a range of each defect area in the second wafer storage box based on the plurality of wafer numbers of the defect types, and set a mapping relationship between a plurality of non-classification positions of the plurality of inferior wafers in the first wafer storage box to the plurality of classification positions of the second wafer storage box.

6. The wafer sorting system of claim 5, wherein the control device comprises a movement control module configured to control the gripping device to pick up the inferior wafer from one of the non-sorting locations, determine the sorting location based on the mapping relationship and the non-sorting location, and control the transporting device to transport the inferior wafer to the sorting location of the sorted inferior zone.

7. A wafer sorting method comprising:

a) Controlling a conveying device to convey each of the plurality of wafers to a good product area or a non-classified bad product area by a control device;

b) When the wafer is a good wafer, storing the good wafer in the good area;

c) When the wafer is a defective wafer, recording the defect type of the defective wafer, and storing the defective wafer into the non-classified defective area;

d) Performing a classification process on the inferior wafers of the non-classified inferior zone based on the defect types to determine the defect zone corresponding to each inferior wafer among the defect zones of the classified inferior zone; a kind of electronic device with high-pressure air-conditioning system

e) And controlling a grabbing device and the conveying device to pick up each inferior wafer from the non-classified inferior product region and conveying the inferior wafer to the determined defective region.

8. The wafer sorting method according to claim 7, wherein step c) includes recording a non-sort location of the inferior wafer in the non-sort inferior zone and the defect type.

9. The wafer sort method according to claim 7, wherein at least one wafer storage cassette is set as the no-sort-bad-section;

wherein step c) includes recording the defect type of the inferior wafer stored in each layer of the wafer storage cassette.

10. The wafer sorting method according to claim 7, wherein the plurality of defect areas of the sorted inferior product area are set in a wafer storage cassette;

the step d) includes determining a classification position of each inferior wafer in the wafer storage box, wherein the classification position belongs to the defect area corresponding to the inferior wafer.

11. The wafer sort method according to claim 10, wherein the no-sort-bad-product region is set in another wafer storage cassette;

wherein step d) comprises:

d1 Calculating a plurality of wafer numbers of the plurality of flaw types in the plurality of inferior wafers of the non-classified inferior product region;

d2 Distributing the range of each defective area based on the number of the wafers of the defect types in the wafer storage box of the non-classified inferior product area; a kind of electronic device with high-pressure air-conditioning system

d3 Setting a mapping relationship between a plurality of non-classification positions of the non-classification defective product region to a plurality of classification positions of the classified defective product region.

12. The wafer sort method according to claim 11, wherein step e) includes:

e1 Controlling the gripping device to draw the inferior wafer from one of the plurality of non-sort locations;

e2 Determining the classified position based on the mapping relation and the unclassified position in the control device; a kind of electronic device with high-pressure air-conditioning system

e3 Controlling the conveying device to convey the inferior wafer to the sorting position of the sorted inferior area.

13. The method of claim 10, wherein step d) further comprises setting at least one partition mark in the wafer cassette, wherein the at least one partition mark is used to separate the plurality of defect areas.