CN101367255A - Driven wheel structure of numerical control cutting machine for cutting silicon wafer - Google Patents
Driven wheel structure of numerical control cutting machine for cutting silicon wafer Download PDFInfo
- Publication number
- CN101367255A CN101367255A CNA2008101957202A CN200810195720A CN101367255A CN 101367255 A CN101367255 A CN 101367255A CN A2008101957202 A CNA2008101957202 A CN A2008101957202A CN 200810195720 A CN200810195720 A CN 200810195720A CN 101367255 A CN101367255 A CN 101367255A
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- Prior art keywords
- driven wheel
- wheel structure
- numerical control
- silicon wafer
- cutting machine
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Abstract
The invention provides a driven wheel structure of a numerical control cutting machine for cutting silicon wafers. The driven wheel structure can monitor the cutting force to workpieces in cutting processes in real time, thereby ensuring high qualification ratio of products. The driven wheel structure comprises a frame, wherein a slide rail is arranged on the frame; a guide body is arranged on the slide rail; the guide body is sleeved on a transmission shaft; the transmission shaft is provided with a roller; and a diamond band saw blade is sleeved outside the roller and a driving wheel. The driven wheel structure is characterized in that the lower part of the guide body is provided with a sensor; the lower end of the sensor is in contact with a cushion block; the cushion block is pressed on a screw; and the screw is connected with the frame through a thread.
Description
(1) technical field
The present invention relates to the parts of numerical control cutting machine for cutting silicon wafer, be specially the driven wheel structure of numerical control cutting machine for cutting silicon wafer.
(2) background technology
Silicon wafer is as the vitals in the solar module, and it costs an arm and a leg, on the one hand because it is raw-material rare, and on the other hand because its quality is crisp, scrappage height during processing.In the traditional silicon wafer cutting grinding, because of to inequality firmly in the silicon wafer processing, sometimes even firmly excessive, cause wafer breakage.
(3) summary of the invention
At the problems referred to above, the invention provides the driven wheel structure of numerical control cutting machine for cutting silicon wafer, it can be monitored in the cutting in real time to the cutting force of workpiece, and the qualification rate of product is higher.
Its technical scheme is such: it comprises frame, on the described frame slide rail is set, guide way is installed on slide rail, described guide way is set in power transmission shaft, and described driving sleeve is equipped with roller, and the band-saw diamond bar is set in the outside of described roller and driving wheel, it is characterized in that: the bottom of described guide way is equipped with sensor, the lower end of described sensor contact cushion block, described cushion block press-fits in screw rod, and described screw rod and described frame are with being threaded.
It is further characterized in that: the junction of described power transmission shaft and described roller is provided with bearing, and described bearing has two; The outer end of described two bearings is pressed with capping respectively, and described capping is connected with screw respectively with described roller.
In the said structure of the present invention, sensor the expanding force that can monitor the band-saw diamond bar in real time is set, can guarantee cutting force like this to wafer, guarantee the qualification rate of product.
(4) description of drawings
Fig. 1 is the main structural representation of looking of the present invention;
Fig. 2 be among Fig. 1 A-A of the present invention to cutaway view.
(5) specific embodiment
See Fig. 1, Fig. 2, the present invention includes frame 2, slide rail 8 is set on the frame 2, guide way 7 is installed on slide rail 8, and guide way 7 is set in power transmission shaft 6, and the output of power transmission shaft 6 is set with roller 10, power transmission shaft 6 is provided with bearing 13 with the junction of roller 10, bearing 13 has two, and the outer end of bearing 13 is pressed with capping 11 respectively, and capping 11 is connected with screw 14 respectively with roller 10.Band-saw diamond bar 12 is set in the outside (not expressing driving wheel among the figure) of roller 10 and driving wheel, the bottom of guide way 7 is equipped with sensor 4, the lower end contact cushion block 3 of sensor 4, and cushion block 3 press-fits in screw rod 1, screw rod 1 is threaded with frame 2 usefulness, and 5 is that packing ring, 9 is screw.Describe the course of work of the present invention below in conjunction with accompanying drawing: saw blade 12 is at driving wheel, the drive turning down of roller 10 realizes the cutting to wafer, promote guide way 7 by push structure and move the feeding that realizes saw blade 12 cuttings along slide rail 8, when guide way 7 amount of movements excessive, sensor 4 just and the pressure between the cushion block 3 strengthen, when force value surpasses setting value, sensor 4 control push structure actions, the expanding force that makes guide way 7 drive power transmission shafts 6 and driven pulley 10 return until saw blade reaches desirable requirement, among the present invention, push structure can adopt hydraulic drive or motor transmission, and concrete structure belongs to prior art.
Claims (4)
1. the driven wheel structure of numerical control cutting machine for cutting silicon wafer, it comprises frame, on the described frame slide rail is set, guide way is installed on slide rail, and described guide way is set in power transmission shaft, described driving sleeve is equipped with driven pulley, the band-saw diamond bar is set in the outside of described driven pulley and driving wheel, it is characterized in that: the bottom of described guide way is equipped with sensor, the lower end contact cushion block of described sensor, described cushion block press-fits in screw rod, and described screw rod and described frame are with being threaded.
2. according to the driven wheel structure of the described numerical control cutting machine for cutting silicon wafer of claim 1, it is characterized in that: the junction of described power transmission shaft and described driven pulley is provided with bearing.
3. according to the driven wheel structure of the described numerical control cutting machine for cutting silicon wafer of claim 2, it is characterized in that: described bearing has two.
4. according to the driven wheel structure of the described numerical control cutting machine for cutting silicon wafer of claim 3, it is characterized in that: the outer end of described two bearings is pressed with capping respectively, and described capping is connected with screw respectively with described driven pulley.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101957202A CN101367255A (en) | 2008-08-28 | 2008-08-28 | Driven wheel structure of numerical control cutting machine for cutting silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101957202A CN101367255A (en) | 2008-08-28 | 2008-08-28 | Driven wheel structure of numerical control cutting machine for cutting silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101367255A true CN101367255A (en) | 2009-02-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008101957202A Pending CN101367255A (en) | 2008-08-28 | 2008-08-28 | Driven wheel structure of numerical control cutting machine for cutting silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101367255A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110733140A (en) * | 2019-10-25 | 2020-01-31 | 江苏晶杰光电科技有限公司 | sapphire wafer cutting equipment and process |
-
2008
- 2008-08-28 CN CNA2008101957202A patent/CN101367255A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110733140A (en) * | 2019-10-25 | 2020-01-31 | 江苏晶杰光电科技有限公司 | sapphire wafer cutting equipment and process |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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Application publication date: 20090218 |