CN116674104B - Slicing equipment and slicing method for producing semiconductors - Google Patents
Slicing equipment and slicing method for producing semiconductors Download PDFInfo
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- CN116674104B CN116674104B CN202310642836.0A CN202310642836A CN116674104B CN 116674104 B CN116674104 B CN 116674104B CN 202310642836 A CN202310642836 A CN 202310642836A CN 116674104 B CN116674104 B CN 116674104B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 141
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 230000000694 effects Effects 0.000 claims abstract description 18
- 230000002457 bidirectional effect Effects 0.000 claims abstract description 15
- 238000004140 cleaning Methods 0.000 claims description 41
- 230000003014 reinforcing effect Effects 0.000 claims description 18
- 239000000428 dust Substances 0.000 claims description 14
- 230000000087 stabilizing effect Effects 0.000 claims description 10
- 238000004064 recycling Methods 0.000 claims description 6
- 230000006378 damage Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 208000027418 Wounds and injury Diseases 0.000 abstract description 2
- 208000014674 injury Diseases 0.000 abstract description 2
- 206010066054 Dysmorphism Diseases 0.000 description 5
- 239000004020 conductor Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G25/00—Conveyors comprising a cyclically-moving, e.g. reciprocating, carrier or impeller which is disengaged from the load during the return part of its movement
- B65G25/02—Conveyors comprising a cyclically-moving, e.g. reciprocating, carrier or impeller which is disengaged from the load during the return part of its movement the carrier or impeller having different forward and return paths of movement, e.g. walking beam conveyors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to the technical field of semiconductor slicing equipment, and discloses slicing equipment and a slicing method thereof for producing semiconductors. According to the invention, the bidirectional stepping motor is started through the conveying assembly, the first rotating wheel is driven to rotate through the belt, then the second rotating wheel is driven to rotate through the short rod, the rotating rod and the circular block positioned at the upper end are driven to rotate through the short rod, and then the semiconductor to be conveyed is placed between the circular blocks positioned at the upper side and the lower side, so that the effect of automatic feeding is achieved to a certain extent, the problem that the manual holding for slicing can cause injury to workers is solved, and the position of the semiconductor can be limited through the circular block, so that the semiconductor is stable in moving.
Description
Technical Field
The invention relates to the technical field of semiconductor slicing equipment, in particular to slicing equipment for producing semiconductors and a slicing method thereof.
Background
A semiconductor, which is a material with conductivity between that of a conductor and an insulator at normal temperature, and which has wide application in radio, television and temperature measurement, and which is a material with controllable conductivity ranging from an insulator to a conductor;
the slicing device used in the current semiconductor production is mostly manually held by a worker to perform slicing cutting, and the slicing device has high precision but gradually descends along with the increase of working time of the worker, and when the worker is out of work, certain damage can be caused to the slicing device, so that the worker is protected, the slicing precision of the semiconductor is ensured, and the slicing device and the slicing method for producing the semiconductor are provided.
Disclosure of Invention
The present invention is directed to a dicing apparatus for producing semiconductors and a dicing method thereof, which solve the problems set forth in the background art described above.
In order to solve the technical problems, the invention is realized by the following technical scheme:
the invention relates to a slicing device for producing semiconductors, which comprises a stabilizing component, wherein the top of the stabilizing component is provided with a clamping component and a conveying component, the inner side of the conveying component is provided with a semiconductor, and the left side of the conveying component is provided with a slicing component;
The transportation assembly comprises a fixed long plate, a plurality of rotating rods are arranged on one sides, close to each other, of the fixed long plates, the rotating rods located at the upper end are in rotating connection with the fixed long plate, the rotating rods located at the lower end are in fixed connection with the fixed long plate, one end, far away from the fixed long plate, of each rotating rod is fixedly connected with a round block, one sides, close to each other, of the two fixed long plates are respectively provided with a first belt, the inner surface of each first belt is in contact with the outer surface of the rotating rod at the upper end, one end, close to the fixed long plate, of each first belt is in contact with a locating frame, one side, far away from the first belt, of each locating frame is in fixed connection with the fixed long plate, and the outer surfaces of the round blocks on the upper side and the lower side are in contact with the upper side and the lower side of a semiconductor;
the device comprises a fixed long plate, a fixed shaft, a first rotating wheel, a second rotating wheel, a belt, a short rod, a first rotating wheel, a second rotating wheel, a first belt and a second belt, wherein the lower part of the middle shaft of the fixed long plate is provided with the bidirectional stepping motor;
the two-way stepper motor bottom fixedly connected with locating plate through the locating plate, can reach the effect of carrying out fixed position to two-way stepper motor, both sides fixedly connected with dead lever around the locating plate right-hand member, two the one side axis department that the fixed long plate is close to each other is provided with clean subassembly.
Further, the cleaning component comprises a middle shaft rod, the front end and the rear end of the middle shaft rod are fixedly connected with the round block, the front end and the rear end of the middle shaft rod are rotatably connected with the round block, the middle shaft rod is internally provided with a triangular groove, the inner surface of the triangular groove is fixedly connected with an obtuse angle plate, the middle shaft in the triangular groove is fixedly connected with a triangular plate, the outer surface of the triangular plate is fixedly connected with the inner surface of the obtuse angle plate, the outer surface of the triangular plate is fixedly connected with a first spring, the top of the first spring is fixedly connected with a sliding block, the top of the sliding block is fixedly connected with a connecting block, the inner part of the connecting block is rotatably connected with a thin rod, and the front end and the rear end of the thin rod are rotatably connected with an arc block.
Further, the cleaning plate is sleeved on the outer surface of the center shaft rod, the arc-shaped block is fixedly connected with the inner surface of the cleaning plate, the left side and the right side of the sliding block are in contact with the inner wall of the obtuse angle plate, the cleaning plate is cylindrical, the diameter of the cleaning plate is the same as that of the circular block, the cleaning plate depends on the same diameter as that of the circular block, and the cleaning plate can rotationally clean the semiconductor along with the movement of the cleaning plate when the cleaning plate contacts with the semiconductor, so that the cleaning efficiency of the semiconductor is improved to a certain extent.
Further, the burst subassembly includes the riser, square groove has been seted up to the inside riser, sliding connection has square piece in the square groove, two one side fixedly connected with flat piece that square piece kept away from each other, flat piece right side fixedly connected with pointer piece, two both ends fixedly connected with connecting rod about one side that the riser kept away from each other, the one end fixedly connected with dysmorphism reinforcing strip one of riser is kept away from to the connecting rod, the flat piece is kept away from the inside vertical fixedly connected with quarter butt of one end of square piece, both sides fixedly connected with arc piece around the one end that square piece was kept away from to the quarter butt, arc piece internal surface fixedly connected with motor one, motor one top fixedly connected with rotates the wheel three, it cup joints the saw blade to rotate the three surface axis department, two the scale has been seted up to one side right-hand member that the riser kept away from each other, semicircular groove has been seted up to square groove inner wall left and right sides.
Further, the inside axis department of square piece rotates and is connected with the gear, square piece inside upper and lower both sides contact has the flat rack, just flat rack and gear intermeshing, square piece inside left and right sides sliding connection has the movable plate, the one end fixedly connected with semicircular inserting block that the gear was kept away from to the movable plate, two one side that the movable plate is close to each other is provided with the fixed plate, is located the lower extreme flat rack left end and movable plate fixed connection, is located the upper end flat rack right side and movable plate fixed connection, is located the left side the fixed plate top and square piece inner wall top fixed connection, is located the right side fixed plate bottom and square piece inner wall bottom fixed connection, one side fixed mounting that movable plate and fixed plate are close to each other has the spring two, semicircular inserting block surface and semicircular groove internal surface contact each other, is located the lower extreme flat rack right-hand member fixed connection has the square plate, is located the upper end flat rack left end and square plate fixed connection, one side that square plate and fixed plate are close to each other has the spring two.
Further, the clamping assembly comprises a fixed long rod, a sliding groove is formed in the fixed long rod, a sliding clamping plate is contacted with the right side of the inner wall of the sliding groove, openings are formed in the front side and the rear side of the fixed long rod, the openings are communicated with the sliding groove, a guide plate is fixedly connected to the left side of the inner wall of the opening, a round hole is formed in the guide plate, a push rod is slidably connected to the round hole, the right end of the push rod is fixedly connected with the left side of the sliding clamping plate, a square is fixedly connected to the left outer surface of the push rod, short blocks are fixedly connected to the left side and the right side of the square, a fixing assembly is arranged on the left side and the right side of the semiconductor, the front side and the rear side of the square are mutually contacted with the inner wall of the sliding groove, a spring III is sleeved on the outer surface of the push rod, and one end of the spring is fixedly connected with the left side of the sliding clamping plate, and the other end of the spring is fixedly connected with the left side of the guide plate.
Further, both sides and fixed stock fixed connection about the riser, the one end that the locating plate was kept away from to the dead lever is with the fixed stock fixed connection that is located the lower extreme, both ends and the fixed stock fixed connection that is located the lower extreme around the locating plate, connecting rod and fixed stock pass through a dysmorphism reinforcing bar fixed connection, and a dysmorphism reinforcing bar can increase the fixity of being connected between connecting rod and the fixed stock, and then make the device whole can be more firm.
Further, fixed subassembly includes the grip block, grip block top fixedly connected with dysmorphism reinforcing bar two, grip block top fixedly connected with right angle connecting rod, the one end that the grip block was kept away from to the right angle connecting rod respectively with square and short piece top fixed connection, the recess is seted up to the grip block bottom, sliding connection has obtuse angle push pedal in the recess, both sides are provided with the air tank around the grip block is inside, the air tank is connected with the recess through the gas pocket, the inside sliding connection of air tank has the slide, slide bottom fixedly connected with vertical pole, vertical pole bottom fixedly connected with sucking disc, the one end that vertical pole was kept away from to the sucking disc is contacted with semiconductor each other, the one end that dysmorphism reinforcing bar two was kept away from to the obtuse angle push pedal is contacted with semiconductor each other, obtuse angle push pedal top surface and recess internal surface are contacted each other, slide top fixedly connected with spring four, and spring four tops and air tank inner wall top fixed connection.
Further, the stabilizing assembly comprises bottom strips, the top of each bottom strip is fixedly connected with an inclined plate, the inner surface of each inclined plate is transversely and fixedly connected with a reinforcing plate, and the left end of one side, close to each other, of each bottom strip is provided with a collecting box;
The collecting box bottom contact has the connecting strip, is located the connecting strip top fixedly connected with semicircular piece of axis department, semicircular piece inside transversely rotates and is connected with the cylinder pole, cylinder pole surface left and right sides fixedly connected with stopper, two one side that the stopper is close to each other contacts each other with the collecting box front and back both sides, stopper left and right sides fixedly connected with cardboard, collecting box left and right sides contacts each other with the cardboard side, both sides and bottom strip fixed connection around the connecting strip, the one end that the bottom strip was kept away from to the hang plate and the fixed stock fixed connection who is located the lower extreme.
A dicing method for producing a semiconductor, comprising the steps of:
step one: before the semiconductor slicing work is carried out, a worker starts the bidirectional stepping motor, the first rotating wheel rotates with the second rotating wheel through a belt, then the second rotating wheel rotates with the rotating rod and the round block positioned at the upper end through a short rod, the second rotating rod positioned at the upper end rotates with the belt, then the semiconductors to be transported are placed between the round blocks positioned at the upper side and the lower side, and the semiconductors can be transported;
Step two: when the semiconductor moves to the middle shaft of the fixed long rod, the outer surface of the cleaning plate is contacted with the upper side and the lower side of the semiconductor, and the first spring positioned in the middle shaft can support and fix the inside of the cleaning plate by virtue of elasticity, so that dust attached to the semiconductor can be removed better;
step three: when the semiconductor moves to a certain position, the obtuse-angle push plate is contacted with the semiconductor and is influenced by the reaction force, the obtuse-angle push plate slides into the groove and pushes air in the groove into the air groove through the air hole, the sliding plate moves downwards with the hanging rod and the sucker under the influence of air pressure, and the sucker can suck the semiconductor;
step four: the semiconductor moves leftwards, the clamping block moves along with the semiconductor and moves along with the square block and the short block through the right-angle connecting rod, the square block and the short block slide in the chute, the ejector rod moves along with the square block, the sliding clamping plate moves leftwards in the chute under the influence of the ejector rod and simultaneously extrudes the spring III, at the moment, the spring III is in a compressed state, when the semiconductor is completely sliced and is pumped away by a worker, the sucking disc is separated from the semiconductor, the clamping block loses the pushing force and returns to the original position under the pushing force of the spring III, and then the next semiconductor is clamped, so that the fixed assembly can achieve the function of recycling;
Step five: the method comprises the steps that a worker starts a motor I, a rotating wheel III rotates together with a saw blade, the transported semiconductors are cut and sliced, the worker can adjust the thickness of the sliced according to different requirements, the worker holds a flat block by hand and can forcefully move upwards or downwards, when the semicircular insert is in contact with the inner wall of a square groove, the semicircular insert moves towards the inside of the square block along with a moving plate and a flat rack, a gear rotates under the influence of the flat rack, the square plate extrudes a spring II, when the position of the semicircular insert corresponds to the semicircular groove, the semicircular insert is inserted into the semicircular groove under the pushing of the spring II, the effect of fixing the position is achieved, the saw blade can be kept at the same height, and the scale on a vertical plate can enable the worker to clearly distinguish the moving distance of the saw blade;
step six: dust generated by slicing the saw blade can drop into the collecting box downwards, a worker can break off the limiting block outwards, and the collecting box loses the limiting block and the limiting plate in position at the moment, so that the dust can be taken down from the connecting strip.
The invention has the following beneficial effects:
According to the invention, the bidirectional stepping motor is started through the conveying assembly, the first rotating wheel is driven to rotate through the belt, then the second rotating wheel is driven to rotate through the short rod, the rotating rod and the circular block positioned at the upper end are driven to rotate through the short rod, and then the semiconductor to be conveyed is placed between the circular blocks positioned at the upper side and the lower side, so that the effect of automatic feeding can be achieved to a certain extent, the problem that the manual holding is used for slicing, and damage to workers can occur is solved, and the position of the semiconductor can be limited through the circular block, so that the semiconductor is stable in moving.
2. According to the invention, through the cleaning assembly, when the semiconductor moves to the middle shaft of the fixed long rod, the outer surface of the cleaning plate can be contacted with the upper side and the lower side of the semiconductor, and the spring positioned in the middle shaft can support and fix the inside of the cleaning plate by virtue of the elastic force, so that dust attached to the semiconductor can be better removed, and the effect of cleaning the semiconductor is achieved.
3. According to the invention, through the fixing component, after the semiconductor moves to a certain position, the obtuse-angle push plate is contacted with the semiconductor and can be influenced by the reaction force, the obtuse-angle push plate can slide into the groove and push air in the groove into the air groove through the air hole, the slide plate can move downwards with the hanging rod and the sucker under the influence of air pressure, at the moment, the sucker can suck the semiconductor, the effect of fixing the semiconductor is achieved, the semiconductor cannot shift or shake in position when the semiconductor is subjected to slicing, and the slicing working efficiency is increased.
4. According to the invention, the semiconductor moves leftwards through the clamping assembly, the clamping block moves along with the semiconductor and moves along with the square block and the short block through the right-angle connecting rod, the square block and the short block slide in the sliding groove, the ejector rod moves along with the square block, the sliding clamping plate moves leftwards in the sliding groove under the influence of the ejector rod, the spring III is extruded at the same time, at the moment, the spring III is in a compressed state, when the semiconductor is completely sliced and is pumped away by a worker, the sucking disc is separated from the semiconductor, the clamping block loses the pushing force and returns to the original position under the pushing force of the spring III, and then the next semiconductor is clamped, so that the fixing assembly can achieve the function of recycling.
5. According to the invention, through the parting assembly, when the semicircular insert is contacted with the inner wall of the square groove, the semicircular insert carries the moving plate and the flat rack to move towards the inside of the square block, the gear can rotate under the influence of the flat rack, the square plate can extrude the second spring, when the position of the semicircular insert corresponds to the semicircular groove, the semicircular insert can be inserted into the semicircular groove under the pushing of the second spring, the effect of fixing the position is achieved, at the moment, the saw blade can be kept at the same height, the scales on the vertical plate can clearly distinguish the moving distance of the saw blade by a worker, adjustment can be made according to different requirements, and the integral practicability of the device is improved.
Of course, it is not necessary for any one product to practice the invention to achieve all of the advantages set forth above at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of the overall structure of the transport assembly of the present invention;
FIG. 3 is a schematic view of the overall structure of the dicing assembly of the present invention;
FIG. 4 is an enlarged partial schematic view of the FIG. 3A;
FIG. 5 is a schematic view of the overall structure of the cleaning assembly of the present invention;
FIG. 6 is a schematic view of the overall structure of the clamping assembly of the present invention;
FIG. 7 is a schematic view of the overall structure of the fixing assembly of the present invention;
FIG. 8 is a schematic view of the overall structure of the stabilizing assembly of the present invention;
fig. 9 is a schematic view showing the overall structure of the collecting tank of the present invention.
In the drawings, the list of components represented by the various numbers is as follows:
in the figure: 1. a stabilizing assembly; 11. a bottom strip; 12. an inclined plate; 13. a reinforcing plate; 14. a collection box; 141. a connecting strip; 142. a semicircular block; 143. a cylindrical rod; 144. a limiting block; 145. a clamping plate; 2. a clamping assembly; 21. fixing the long rod; 22. a guide plate; 23. a push rod; 24. a sliding clamping plate; 25. a square block; 26. short blocks; 27. a fixing assembly; 271. a clamping block; 272. a second special-shaped reinforcing strip; 273. a right angle connecting rod; 275. an obtuse angle push plate; 274. a hanging rod; 276. a suction cup; 277. a slide plate; 3. a transport assembly; 31. a rotating lever; 32. a circular block; 33. a first belt; 34. fixing the long plate; 35. a bidirectional stepper motor; 36. rotating a first wheel; 37. rotating a second wheel; 38. a second belt; 39. a positioning plate; 40. a fixed rod; 41. a cleaning assembly; 411. a middle shaft lever; 412. a blunt angle plate; 413. a triangle; 414. a sliding block; 415. a connecting block; 416. a thin rod; 417. an arc-shaped block; 418. a cleaning plate; 42. a positioning frame; 4. a semiconductor; 5. a slicing assembly; 51. a riser; 52. square blocks; 521. a gear; 522. a flat rack; 523. a moving plate; 524. a semicircular insert; 525. a square plate; 526. a fixing plate; 53. a flat block; 54. a pointer block; 55. a connecting rod; 56. a special-shaped reinforcing strip I; 57. a right angle lever; 58. an arc-shaped sheet; 59. a first motor; 60. rotating a third wheel; 61. saw blade.
Description of the embodiments
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-9, the present invention is a dicing apparatus for producing semiconductors, comprising a stabilizing member 1,
the top of the stabilizing component 1 is provided with a clamping component 2 and a conveying component 3, the inner side of the conveying component 3 is provided with a semiconductor 4, and the left side of the conveying component 3 is provided with a slicing component 5;
the transportation assembly 3 comprises a fixed long plate 34, a plurality of rotating rods 31 are arranged on one side of the two fixed long plates 34, which is close to each other, the rotating rods 31 positioned at the upper end are connected with the fixed long plates 34 in a rotating way, the rotating rods 31 positioned at the lower end are fixedly connected with the fixed long plates 34, one end of the rotating rods 31, which is far away from the fixed long plates 34, is fixedly connected with a round block 32, one side of the two fixed long plates 34, which is close to each other, is provided with a first belt 33, the inner surface of the first belt 33 is contacted with the outer surface of the rotating rods 31 at the upper end, one end of the first belt 33, which is close to the fixed long plates 34, is contacted with a positioning frame 42, one side of the positioning frame 42, which is far away from the first belt 33, is fixedly connected with the fixed long plates 34, the outer surface of the round block 32 at the upper side and the lower side is contacted with the upper side and the lower side of the semiconductor 4, a bidirectional stepping motor 35 is arranged below the middle shaft of the fixed long plates 34, the output end of the bidirectional stepping motor 35 is fixedly connected with a first rotating wheel 36, the upper part of the first rotating wheel 36 is provided with the second rotating wheel 37, the outer surfaces of the first rotating wheel 36 and the second rotating wheel 37 are sleeved with the second belt 38, the inside of the second rotating wheel 37 is fixedly connected with a short rod, the short rod is fixedly connected with the rotating rod 31 positioned at the upper end of the middle shaft, the bidirectional stepping motor 35 is started through the transportation assembly 3, the first rotating wheel 36 carries the second rotating wheel 37 to rotate through the second belt 38, then the second rotating wheel 37 carries the rotating rod 31 and the round block 32 positioned at the upper end to rotate through the short rod, the rotation of the rotating rod 31 positioned at the upper end carries the first belt 33, then the semiconductor 4 to be transported is placed between the round blocks 32 positioned at the upper side and the lower side, the effect of automatic feeding can be achieved to a certain extent, the problem that manual hand-holding is used for slicing and injury can be caused to workers is solved, the position of the semiconductor 4 can be limited by the circular block 32, so that the semiconductor is more stable in movement;
The bottom of the bidirectional stepping motor 35 is fixedly connected with a positioning plate 39, the front side and the rear side of the right end of the positioning plate 39 are fixedly connected with a fixing rod 40, and a cleaning assembly 41 is arranged at the middle shaft of one side of the two fixing long plates 34, which are close to each other.
The cleaning component 41 comprises a middle shaft rod 411, the front end and the rear end of the middle shaft rod 411 at the upper end are fixedly connected with the round block 32, the front end and the rear end of the middle shaft rod 411 at the lower end are rotatably connected with the round block 32, a triangular groove is formed in the middle shaft rod 411, an obtuse angle plate 412 is fixedly connected to the inner surface of the triangular groove, a triangular plate 413 is fixedly connected to the middle shaft in the triangular groove, the outer surface of the triangular plate 413 is fixedly connected with the inner surface of the obtuse angle plate 412, a first spring is fixedly connected to the outer surface of the triangular plate 413, a sliding block 414 is fixedly connected to the top of the first spring, a connecting block 415 is fixedly connected to the top of the sliding block 414, a thin rod 416 is rotatably connected to the inner portion of the connecting block 415, the front end and the rear end of the thin rod 416 are rotatably connected with an arc-shaped block 417, through the cleaning component 41, when the semiconductor 4 moves to the middle shaft of the fixed long rod 21, the outer surface of the cleaning plate 418 contacts with the upper side and the lower side of the semiconductor 4, and the first spring in the middle shaft rod 411 can enable the connecting block 415 and the thin rod 416 to support and fix the inner part of the cleaning plate 418 by means of elasticity, so that dust attached to the semiconductor 4 can be better removed, and the cleaning effect is achieved.
The cleaning plate 418 is sleeved on the outer surface of the middle shaft rod 411, the arc-shaped block 417 is fixedly connected with the inner surface of the cleaning plate 418, the left side and the right side of the sliding block 414 are in contact with the inner wall of the obtuse angle plate 412, the cleaning plate 418 is cylindrical, and the diameter of the cleaning plate 418 is the same as that of the circular block 32.
The slicing component 5 comprises a vertical plate 51, a square groove is formed in the vertical plate 51, a square block 52 is connected in the square groove in a sliding way, one side, away from each other, of the two square blocks 52 is fixedly connected with a flat block 53, the right side of the flat block 53 is fixedly connected with a pointer block 54, the upper end and the lower end of one side, away from each other, of the two vertical plates 51 are fixedly connected with a connecting rod 55, one end, away from the vertical plate 51, of the connecting rod 55 is fixedly connected with a special-shaped reinforcing strip I56, one end, away from the square block 52, of the flat block 53 is internally and vertically fixedly connected with a right-angle rod 57, two sides, away from one end, of the flat block 53, of the right-angle rod 57 are fixedly connected with arc-shaped sheets 58, the inner surface of the arc-shaped sheets 58 is fixedly connected with a motor I59, the top of the motor I59 is fixedly connected with a rotating wheel III 60, a saw blade 61 is sleeved at the center shaft of the outer surface of the rotating wheel III, scales are formed at the right end of one side, away from each other vertical plates 51, semicircular grooves are formed in the left side and the right side of the inner wall of the square groove, through the slicing component 5, when the semicircular inserting blocks 524 are in contact with the inner wall of the square groove, the semicircular inserting blocks 524 carry the moving plate 523 and the flat racks 522 to move towards the inside of the square blocks 52, the gears 521 can rotate under the influence of the flat racks 522, the square plates 525 can squeeze the springs II, when the positions of the semicircular inserting blocks 524 correspond to the semicircular grooves, the semicircular inserting blocks 524 can be inserted into the semicircular grooves under the pushing of the springs II, the effect of fixing the positions is achieved, at the moment, the saw blades 61 can be kept at the same height, scales on the vertical plates 51 can enable staff to clearly distinguish the moving distance of the saw blades 61, adjustment can be made according to different requirements, and the overall practicability of the device is improved.
The middle shaft in the square block 52 is rotationally connected with a gear 521, the upper side and the lower side in the square block 52 are contacted with a flat rack 522, the flat rack 522 is meshed with the gear 521, the left side and the right side in the square block 52 are slidably connected with a movable plate 523, one end of the movable plate 523 far away from the gear 521 is fixedly connected with a semicircular inserting block 524, one side of the movable plate 523 close to each other is provided with a fixed plate 526, the left end of the flat rack 522 positioned at the lower end is fixedly connected with the movable plate 523, and the right side of the flat rack 522 positioned at the upper end is fixedly connected with the movable plate 523;
the top of the fixing plate 526 positioned on the left side is fixedly connected with the top of the inner wall of the square block 52, the bottom of the fixing plate 526 positioned on the right side is fixedly connected with the bottom of the inner wall of the square block 52, a second spring is fixedly arranged on one side, close to each other, of the moving plate 523 and the fixing plate 526, the outer surface of the semicircular inserting block 524 is in contact with the inner surface of the semicircular groove, the right end of the flat rack 522 positioned on the lower end is fixedly connected with the square plate 525, the left end of the flat rack 522 positioned on the upper end is fixedly connected with the square plate 525, and a second spring is fixedly arranged on one side, close to each other, of the square plate 525 and the fixing plate 526.
The clamping component 2 comprises a fixed long rod 21, a chute is arranged in the fixed long rod 21, a sliding clamping plate 24 is contacted with the right side of the inner wall of the chute, openings are arranged on the front side and the rear side of the fixed long rod 21, the openings are communicated with the chute, a guide plate 22 is fixedly connected on the left side of the inner wall of the openings, a round hole is arranged in the guide plate 22, a push rod 23 is connected in a sliding manner in the round hole, the right end of the push rod 23 is fixedly connected with the left side of the sliding clamping plate 24, a square block 25 is fixedly connected with the left outer surface of the push rod 23, short blocks 26 are fixedly connected on the left side and the right side of the square block 25, a fixing component 27 is arranged on the upper side and the lower side of the semiconductor 4 positioned on the left side, the front side and the rear side of the square block 25 are mutually contacted with the inner wall of the chute, a spring III is sleeved on the outer surface of the push rod 23, and the left end of the spring is fixedly connected with the left side of the sliding clamping plate 24, and the other end of the spring III is fixedly connected with the left side of the guide plate 22, through the clamping component 2, the semiconductor 4 moves leftwards, the clamping block 271 moves along with the semiconductor 4 and moves along with the block 25 and the short block 26 through the right-angle connecting rod 273, the block 25 and the short block 26 slide in the sliding groove, the ejector rod 23 moves along with the block 25, the sliding clamping plate 24 is influenced by the ejector rod 23 to move leftwards in the sliding groove, the spring III is extruded simultaneously, at the moment, the spring III is in a compressed state, when the semiconductor 4 is completely sliced and is pumped by a worker, the sucking disc 276 is separated from the semiconductor 4, the clamping block 271 loses the pushing force, returns to the original position under the pushing force of the spring III, and then the next semiconductor 4 is clamped, so that the fixing component 27 can achieve the recycling effect.
The upper side and the lower side of the vertical plate 51 are fixedly connected with the fixed long rod 21, one end of the fixed rod 40, which is far away from the positioning plate 39, is fixedly connected with the fixed long rod 21 positioned at the lower end, the front end and the rear end of the positioning plate 39 are fixedly connected with the fixed long rod 21 positioned at the lower end, and the connecting rod 55 is fixedly connected with the fixed long rod 21 through a special-shaped reinforcing strip I56.
The fixed subassembly 27 includes the grip block 271, grip block 271 top fixedly connected with special-shaped reinforcing strip two 272, grip block 271 top fixedly connected with right angle connecting rod 273, the one end that grip block 271 was kept away from to right angle connecting rod 273 is respectively with square 25 and short piece 26 top fixedly connected with, the recess is seted up to grip block 271 bottom, sliding connection has obtuse angle push pedal 275 in the recess, both sides are provided with the air tank around grip block 271 inside, the air tank is connected with the recess through the gas pocket, the inside sliding connection of air tank has slide 277, slide 277 bottom fixedly connected with drop rod 274, drop rod 274 bottom fixedly connected with sucking disc 276, the one end that drop rod 274 was kept away from to sucking disc 276 contacts with semiconductor 4 each other, obtuse angle push pedal 275 is kept away from one end and semiconductor 4 each other contact of special-shaped reinforcing strip two 272, obtuse angle push pedal 275 top surface and recess internal surface contact each other, slide 277 top fixedly connected with spring four, and spring four tops and air tank inner wall top fixedly connected with each other, through the fixed subassembly 27, after semiconductor 4 moves to the position, obtuse angle push pedal 275 can contact with semiconductor 4, simultaneously can receive the reaction force, obtuse angle push pedal 275 can slide inwards the recess to the recess, and will slide down, and will not promote the recess to the semiconductor position in the semiconductor position through the drop rod 274, the pressure can not shake the semiconductor position in the semiconductor position, the effect piece 276, the effect can be reached, the suction plate 276 can be moved in the position and the semiconductor position and the vibration can not take place.
The stable subassembly 1 includes sill bar 11, sill bar 11 top fixedly connected with inclined plate 12, inclined plate 12 internal surface transversely fixedly connected with gusset plate 13, the one side left end that two sill bars 11 are close to each other is provided with collecting box 14, collecting box 14 bottom contact has connecting strip 141, be located the connecting strip 141 top fixedly connected with semicircular piece 142 of axis department, semicircular piece 142 inside transversely rotates and is connected with cylinder pole 143, cylinder pole 143 surface left and right sides fixedly connected with stopper 144, one side that two stoppers 144 are close to each other contacts with collecting box 14 front and back both sides each other, stopper 144 left and right sides fixedly connected with cardboard 145, collecting box 14 left and right sides and cardboard 145 side each other contact, both sides and sill bar 11 fixed connection around the connecting strip 141, the one end that inclined plate 12 kept away from sill bar 11 and the fixed length pole 21 fixed connection that is located the lower extreme, the produced by saw blade 61 burst can drop to collecting box 14 downwards, through collecting box 14 this moment, the effect to collect the dust thing has been reached, the problem that the dust thing that needs to take place on the ground directly falls on the ground has been reduced, the staff can be with stopper 144 and the side limit position is broken off from the cardboard that the stopper is broken off to the side of collecting box 145, and then the cardboard is removed from the position to the outside position of stopper 144, and the position is broken off the stopper is removed from the side 144.
A dicing method for producing a semiconductor, comprising the steps of:
step one: before the slicing of the semiconductor 4, a worker starts the bidirectional stepping motor 35, the first rotating wheel 36 rotates with the second rotating wheel 37 through the second belt 38, then the second rotating wheel 37 rotates with the rotating rod 31 and the circular block 32 positioned at the upper end through the short rod, the rotating rod 31 positioned at the upper end rotates with the first belt 33, and then the semiconductor 4 to be transported is placed between the circular blocks 32 positioned at the upper side and the lower side, so that the semiconductor 4 can be transported;
step two: when the semiconductor 4 moves to the middle shaft of the fixed long rod 21, the outer surface of the cleaning plate 418 contacts with the upper side and the lower side of the semiconductor 4, and the first spring positioned in the middle shaft 411 can support and fix the inside of the cleaning plate 418 by virtue of the elastic force through the connecting block 415 and the thin rod 416, so that dust attached to the semiconductor 4 can be removed better;
step three: when the semiconductor 4 moves to a certain position, the obtuse-angle pushing plate 275 contacts with the semiconductor 4 and is influenced by the reaction force, the obtuse-angle pushing plate 275 slides into the groove and pushes air in the groove into the air groove through the air hole, the sliding plate 277 moves downwards with the hanging rod 274 and the sucker 276 under the influence of air pressure, and the sucker 276 sucks the semiconductor 4;
Step four: the semiconductor 4 moves leftwards, the clamping block 271 moves along with the semiconductor 4 and moves along with the block 25 and the short block 26 through the right-angle connecting rod 273, the block 25 and the short block 26 slide in the chute, the ejector rod 23 moves along with the block 25, the sliding clamping plate 24 moves leftwards in the chute under the influence of the ejector rod 23 and simultaneously extrudes the spring III, at the moment, the spring III is in a compressed state, when the semiconductor 4 is completely sliced and is pulled away by a worker, the sucker 276 is separated from the semiconductor 4, the clamping block 271 loses the pushing force and returns to the original position under the pushing force of the spring III, and then the next semiconductor 4 is clamped, so that the fixing assembly 27 can achieve the recycling function;
step five: the first motor 59 is started by a worker, the third rotating wheel 60 rotates together with the saw blade 61 to cut and divide the transported semiconductor 4, the worker can adjust the thickness of the divided pieces according to different requirements, the worker holds the flat block 53 by hand and can forcefully move upwards or downwards, when the semicircular insert 524 contacts with the inner wall of the square groove, the semicircular insert 524 moves towards the inside of the square block 52 with the moving plate 523 and the flat rack 522, the gear 521 rotates under the influence of the flat rack 522, the square plate 525 extrudes the second spring, when the position of the semicircular insert 524 corresponds to the semicircular groove, the semicircular insert 524 is inserted into the semicircular groove under the pushing of the second spring, the effect of fixing the position is achieved, the saw blade 61 is kept at the same height, and the graduation on the vertical plate 51 can enable the worker to clearly distinguish the moving distance of the saw blade 61;
Step six: dust generated by slicing the saw blade 61 falls down into the collecting box 14, and the worker can break the limiting block 144 outward, so that the collecting box 14 loses the limiting block 144 and the clamping plate 145, and can be taken down from the connecting strip 141.
When the semiconductor 4 slicing machine is used, before a worker starts the bidirectional stepping motor 35 to slice the semiconductor 4, the first rotating wheel 36 rotates with the second rotating wheel 37 through the second belt 38, then the second rotating wheel 37 rotates with the rotating rod 31 and the circular block 32 positioned at the upper end through the short rod, the first belt 33 rotates due to the rotation of the rotating rod 31 positioned at the upper end, and then the semiconductor 4 to be transported is placed between the circular blocks 32 positioned at the upper side and the lower side, so that the semiconductor 4 can be transported;
when the semiconductor 4 moves to the middle shaft of the fixed long rod 21, the outer surface of the cleaning plate 418 contacts with the upper side and the lower side of the semiconductor 4, and the first spring positioned in the middle shaft 411 can support and fix the inside of the cleaning plate 418 by virtue of the elastic force through the connecting block 415 and the thin rod 416, so that dust attached to the semiconductor 4 can be removed better;
when the semiconductor 4 moves to a certain position, the obtuse-angle pushing plate 275 contacts with the semiconductor 4 and is influenced by the reaction force, the obtuse-angle pushing plate 275 slides into the groove and pushes air in the groove into the air groove through the air hole, the sliding plate 277 moves downwards with the hanging rod 274 and the sucker 276 under the influence of air pressure, and the sucker 276 sucks the semiconductor 4;
The semiconductor 4 moves leftwards, the clamping block 271 moves along with the semiconductor 4 and moves along with the block 25 and the short block 26 through the right-angle connecting rod 273, the block 25 and the short block 26 slide in the chute, the ejector rod 23 moves along with the block 25, the sliding clamping plate 24 moves leftwards in the chute under the influence of the ejector rod 23 and simultaneously extrudes the spring III, at the moment, the spring III is in a compressed state, when the semiconductor 4 is completely sliced and is pulled away by a worker, the sucker 276 is separated from the semiconductor 4, the clamping block 271 loses the pushing force and returns to the original position under the pushing force of the spring III, and then the next semiconductor 4 is clamped, so that the fixing assembly 27 can achieve the recycling function;
the first motor 59 is started by a worker, the third rotating wheel 60 rotates together with the saw blade 61 to cut and divide the transported semiconductor 4, the worker can adjust the thickness of the divided pieces according to different requirements, the worker holds the flat block 53 by hand and can forcefully move upwards or downwards, when the semicircular insert 524 contacts with the inner wall of the square groove, the semicircular insert 524 moves towards the inside of the square block 52 with the moving plate 523 and the flat rack 522, the gear 521 rotates under the influence of the flat rack 522, the square plate 525 extrudes the second spring, when the position of the semicircular insert 524 corresponds to the semicircular groove, the semicircular insert 524 is inserted into the semicircular groove under the pushing of the second spring, the effect of fixing the position is achieved, the saw blade 61 is kept at the same height, and the graduation on the vertical plate 51 can enable the worker to clearly distinguish the moving distance of the saw blade 61;
Dust generated by slicing the saw blade 61 falls down into the collecting box 14, and the worker can break the limiting block 144 outward, so that the collecting box 14 loses the limiting block 144 and the clamping plate 145, and can be taken down from the connecting strip 141.
The preferred embodiments of the invention disclosed above are intended only to assist in the explanation of the invention. The preferred embodiments are not exhaustive or to limit the invention to the precise form disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best understand and utilize the invention. The invention is limited only by the claims and the full scope and equivalents thereof.
Claims (6)
1. A dicing apparatus for producing semiconductors, comprising a stabilizing assembly (1), characterized in that:
the top of the stabilizing component (1) is provided with a clamping component (2) and a conveying component (3), a semiconductor (4) is arranged on the inner side of the conveying component (3), and a slicing component (5) is arranged on the left side of the conveying component (3);
The transportation assembly (3) comprises a fixed long plate (34), a plurality of rotating rods (31) are arranged on one sides, close to each other, of the fixed long plates (34), the rotating rods (31) located at the upper end are rotationally connected with the fixed long plates (34), the rotating rods (31) located at the lower end are fixedly connected with the fixed long plates (34), one ends, far away from the fixed long plates (34), of the rotating rods (31) are fixedly connected with round blocks (32), one sides, close to each other, of the two fixed long plates (34) are respectively provided with a first belt (33), the inner surfaces of the first belts (33) are in contact with the outer surfaces of the rotating rods (31) at the upper end, one ends, close to the fixed long plates (34), of the first belts (33) are in contact with positioning frames (42), one sides, far away from the first belts (33), of the positioning frames (42) are fixedly connected with the fixed long plates (34), and the outer surfaces of the round blocks (32) on the upper side and the lower side are in contact with the upper side and the lower side of the semiconductor (4);
a bidirectional stepping motor (35) is arranged below the middle shaft of the fixed long plate (34), the output end of the bidirectional stepping motor (35) is fixedly connected with a first rotating wheel (36), a second rotating wheel (37) is arranged above the first rotating wheel (36), the outer surfaces of the first rotating wheel (36) and the second rotating wheel (37) are sleeved with a second belt (38), a short rod is fixedly connected inside the second rotating wheel (37), and the short rod is fixedly connected with a rotating rod (31) positioned at the upper end of the middle shaft;
The bottom of the bidirectional stepping motor (35) is fixedly connected with a positioning plate (39), the front side and the rear side of the right end of the positioning plate (39) are fixedly connected with a fixed rod (40), and a cleaning assembly (41) is arranged at the middle shaft of one side of the two fixed long plates (34) which are close to each other;
the slicing assembly (5) comprises vertical plates (51), square grooves are formed in the vertical plates (51), square blocks (52) are connected in the square grooves in a sliding mode, one sides, away from each other, of the square blocks (52) are fixedly connected with flat blocks (53), pointer blocks (54) are fixedly connected to the right sides of the flat blocks (53), connecting rods (55) are fixedly connected to the upper ends and the lower ends of one sides, away from each other, of the two vertical plates (51), one end, away from the vertical plates (51), of each connecting rod (55) is fixedly connected with a special-shaped reinforcing strip (56), one end, away from the square blocks (52), of each flat block (53) is fixedly connected with a right-angle rod (57), two sides, away from the front sides and the rear sides, of one end of each flat block (53) are fixedly connected with arc-shaped plates (58), a first motor (59) is fixedly connected to the inner surface of each arc-shaped plate (58), a third rotating wheel (60) is fixedly connected to the top of each motor, and a third rotating shaft (60) is sleeved with a saw blade (61) on the outer surface of each third rotating shaft;
Scales are arranged at the right end of one side, away from each other, of the two vertical plates (51), and semicircular grooves are formed in the left side and the right side of the inner wall of the square groove;
the clamping assembly (2) comprises a fixed long rod (21), a sliding groove is formed in the fixed long rod (21), sliding clamping plates (24) are contacted with the right side of the inner wall of the sliding groove, openings are formed in the front side and the rear side of the fixed long rod (21), the openings are communicated with the sliding groove, a guide plate (22) is fixedly connected to the left side of the inner wall of the openings, a round hole is formed in the guide plate (22), a push rod (23) is connected to the inside of the round hole in a sliding mode, the right end of the push rod (23) is fixedly connected with the left side of the sliding clamping plates (24), a square block (25) is fixedly connected to the outer surface of the left side of the push rod (23), short blocks (26) are fixedly connected to the left side and the upper side and the lower side of the semiconductor (4) on the left side of the square block (25);
the front side and the rear side of the square block (25) are in contact with the inner wall of the chute, a spring III is sleeved on the outer surface of the ejector rod (23), one end of the spring III is fixedly connected with the left side of the sliding clamping plate (24), and the other end of the spring III is fixedly connected with the left side of the guide plate (22);
The upper side and the lower side of the vertical plate (51) are fixedly connected with the fixed long rod (21), one end, far away from the positioning plate (39), of the fixed rod (40) is fixedly connected with the fixed long rod (21) positioned at the lower end, the front end and the rear end of the positioning plate (39) are fixedly connected with the fixed long rod (21) positioned at the lower end, and the connecting rod (55) is fixedly connected with the fixed long rod (21) through a special-shaped reinforcing strip I (56);
the fixing assembly (27) comprises a clamping block (271), the top of the clamping block (271) is fixedly connected with a special-shaped reinforcing strip II (272), the top of the clamping block (271) is fixedly connected with a right-angle connecting rod (273), one end, far away from the clamping block (271), of the right-angle connecting rod (273) is fixedly connected with the tops of a square block (25) and a short block (26) respectively, a groove is formed in the bottom of the clamping block (271), an obtuse angle push plate (275) is slidably connected in the groove, air grooves are formed in the front side and the rear side of the inner portion of the clamping block (271), the air grooves are connected with the grooves through air holes, a sliding plate (277) is slidably connected in the air grooves, a hanging rod (274) is fixedly connected to the bottom of the sliding plate (277), and a sucker (276) is fixedly connected to the bottom of the hanging rod (274).
One end of the sucker (276) far away from the hanging rod (274) is in contact with the semiconductor (4), one end of the obtuse angle push plate (275) far away from the special-shaped reinforcing strip II (272) is in contact with the semiconductor (4), the outer surface of the top of the obtuse angle push plate (275) is in contact with the inner surface of the groove, the top of the sliding plate (277) is fixedly connected with a spring IV, and the top of the spring IV is fixedly connected with the top of the inner wall of the air groove.
2. A dicing apparatus for producing semiconductors as recited in claim 1, wherein: the cleaning assembly (41) comprises a middle shaft rod (411), wherein the front end and the rear end of the middle shaft rod (411) are located at the upper end and fixedly connected with a round block (32), the front end and the rear end of the middle shaft rod (411) are located at the lower end and are rotationally connected with the round block (32), triangular grooves are formed in the middle shaft rod (411), obtuse angle plates (412) are fixedly connected to the inner surfaces of the triangular grooves, triangular plates (413) are fixedly connected to the middle shaft positions in the triangular grooves, the outer surfaces of the triangular plates (413) are fixedly connected with the inner surfaces of the obtuse angle plates (412), springs I are fixedly connected to the outer surfaces of the triangular plates (413), a sliding block (414) is fixedly connected to a connecting block (415) at the top of the spring, a thin rod (416) is rotationally connected to the inner ends of the connecting block (415), and arc-shaped blocks (417) are rotationally connected to the front end and the rear end of the thin rod (416).
3. A dicing apparatus for producing semiconductors as recited in claim 2, wherein: the cleaning plate (418) is sleeved on the outer surface of the middle shaft rod (411), the arc-shaped blocks (417) are fixedly connected with the inner surface of the cleaning plate (418), the left side and the right side of the sliding block (414) are in contact with the inner wall of the obtuse angle plate (412), the cleaning plate (418) is cylindrical, and the diameter of the cleaning plate (418) is the same as that of the circular block (32).
4. A dicing apparatus for producing semiconductors according to claim 3, wherein: the gear (521) is rotationally connected to the middle shaft in the square block (52), flat racks (522) are contacted with the upper side and the lower side in the square block (52), the Ping Chitiao (522) is meshed with the gear (521), a movable plate (523) is slidably connected to the left side and the right side in the square block (52), one end, far away from the gear (521), of the movable plate (523) is fixedly connected with a semicircular inserting block (524), one side, close to each other, of the two movable plates (523) is provided with a fixed plate (526), the left end, located at the lower end, of the Ping Chitiao (522) is fixedly connected with the movable plate (523), and the right side, located at the upper end, of the Ping Chitiao (522) is fixedly connected with the movable plate (523);
The top of the fixing plate (526) positioned at the left side is fixedly connected with the top of the inner wall of the square block (52), the bottom of the fixing plate (526) positioned at the right side is fixedly connected with the bottom of the inner wall of the square block (52), and the outer surface of the semicircular inserting block (524) is in contact with the inner surface of the semicircular groove;
the right end of Ping Chitiao (522) that is located the lower extreme is fixedly connected with square board (525), is located the upper end Ping Chitiao (522) left end and square board (525) fixed connection, one side that square board (525) and fixed plate (526) are close to each other fixed mounting has the spring two.
5. A dicing apparatus for producing semiconductors as recited in claim 4, wherein: the stabilizing assembly (1) comprises bottom strips (11), wherein the top of each bottom strip (11) is fixedly connected with an inclined plate (12), the inner surface of each inclined plate (12) is transversely and fixedly connected with a reinforcing plate (13), and the left end of one side, close to each other, of each bottom strip (11) is provided with a collecting box (14);
the bottom of the collecting box (14) is contacted with a connecting strip (141), the top of the connecting strip (141) positioned at the center shaft is fixedly connected with a semicircular block (142), a cylindrical rod (143) is transversely and rotationally connected inside the semicircular block (142), limiting blocks (144) are fixedly connected to the left side and the right side of the outer surface of the cylindrical rod (143), one side, close to each other, of each limiting block (144) is contacted with the front side and the rear side of the collecting box (14), clamping plates (145) are fixedly connected to the left side and the right side of each limiting block (144), and the left side and the right side of the collecting box (14) are contacted with the side surfaces of the clamping plates (145);
The front side and the rear side of the connecting strip (141) are fixedly connected with the bottom strip (11), and one end of the inclined plate (12) far away from the bottom strip (11) is fixedly connected with a fixed long rod (21) positioned at the lower end.
6. A dicing method for producing a semiconductor, using the dicing apparatus of claim 5, characterized by comprising the steps of:
step one: before the semiconductor (4) is sliced, a worker starts a bidirectional stepping motor (35), a first rotating wheel (36) rotates by a second belt (38) and drives a second rotating wheel (37), then the second rotating wheel (37) rotates by a short rod and drives a rotating rod (31) and a round block (32) positioned at the upper end, the rotating rod (31) positioned at the upper end rotates by a first belt (33), and then the semiconductor (4) to be transported is placed between the round blocks (32) positioned at the upper side and the lower side, so that the semiconductor (4) can be transported;
step two: when the semiconductor (4) moves to the middle shaft of the fixed long rod (21), the outer surface of the cleaning plate (418) is contacted with the upper side and the lower side of the semiconductor (4), and the first spring positioned in the middle shaft rod (411) can support and fix the inside of the cleaning plate (418) by virtue of the elastic force through the connecting block (415) and the thin rod (416), so that dust attached to the semiconductor (4) can be removed better;
Step three: when the semiconductor (4) moves to a certain position, the obtuse-angle pushing plate (275) is contacted with the semiconductor (4) and is influenced by the reaction force, the obtuse-angle pushing plate (275) slides into the groove and pushes air in the groove into the air groove through the air hole, the sliding plate (277) moves downwards with the hanging rod (274) and the sucker (276) under the influence of air pressure, and the sucker (276) sucks the semiconductor (4);
step four: the semiconductor (4) moves leftwards, the clamping block (271) moves along with the semiconductor (4) and moves together with the square block (25) and the short block (26) through the right-angle connecting rod (273), the square block (25) and the short block (26) slide in the sliding groove, the ejector rod (23) moves together with the square block (25), the sliding clamping plate (24) moves leftwards in the sliding groove under the influence of the ejector rod (23) and presses the spring III, at the moment, when the spring III is in a compressed state, when the semiconductor (4) is completely sliced and is pumped away by a worker, the sucking disc (276) is separated from the semiconductor (4), the clamping block (271) loses the pushing force, returns to the original position under the pushing force of the spring III, and then clamps the next semiconductor (4), so that the fixing assembly (27) can achieve the recycling effect;
Step five: the motor I (59) is started by a worker, the rotating wheel III (60) rotates together with the saw blade (61) while rotating, the transported semiconductor (4) is cut and sliced, the worker can adjust the thickness of the sliced semiconductor according to different requirements, the worker holds the flat block (53) by hand and then can forcefully move upwards or downwards, when the semicircular insert block (524) contacts with the inner wall of the square groove, the semicircular insert block (524) moves towards the inside of the square block (52) with the moving plate (523) and the flat rack (522), the gear (521) rotates under the influence of the flat rack (522), the square plate (525) extrudes the spring II, when the position of the semicircular insert block (524) corresponds to the semicircular groove, the semicircular insert block (524) is inserted into the semicircular groove under the pushing of the spring II, the effect of fixing the position is achieved, and the saw blade (61) is kept at the same height, and scales on the vertical plate (51) can clearly distinguish the moving distance of the saw blade (61) of the worker;
step six: dust generated by slicing the saw blade (61) can drop downwards into the collecting box (14), a worker can break off the limiting block (144) outwards, and at the moment, the collecting box (14) loses the limiting block (144) and the limiting plate (145) to limit the positions, so that the dust can be taken down from the connecting strip (141).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN202310642836.0A CN116674104B (en) | 2023-06-01 | 2023-06-01 | Slicing equipment and slicing method for producing semiconductors |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110497547A (en) * | 2019-08-28 | 2019-11-26 | 大同新成新材料股份有限公司 | A kind of cutting semiconductor materials devices and methods therefor |
| CN112692879A (en) * | 2020-12-10 | 2021-04-23 | 罗静峰 | Initiative towed glass fiber board automatic cutout equipment |
| CN213052974U (en) * | 2020-08-21 | 2021-04-27 | 上海雯盈机电设备有限公司 | Board cutting device for machining convenient to adjust |
| CN213618588U (en) * | 2020-09-29 | 2021-07-06 | 太仓海普森包装有限公司 | Paperboard cutting device for heavy carton |
| CN215880087U (en) * | 2021-09-26 | 2022-02-22 | 天津莱欧智能科技有限公司 | Cutting device is used in processing of zinc steel guardrail |
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- 2023-06-01 CN CN202310642836.0A patent/CN116674104B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110497547A (en) * | 2019-08-28 | 2019-11-26 | 大同新成新材料股份有限公司 | A kind of cutting semiconductor materials devices and methods therefor |
| CN213052974U (en) * | 2020-08-21 | 2021-04-27 | 上海雯盈机电设备有限公司 | Board cutting device for machining convenient to adjust |
| CN213618588U (en) * | 2020-09-29 | 2021-07-06 | 太仓海普森包装有限公司 | Paperboard cutting device for heavy carton |
| CN112692879A (en) * | 2020-12-10 | 2021-04-23 | 罗静峰 | Initiative towed glass fiber board automatic cutout equipment |
| CN215880087U (en) * | 2021-09-26 | 2022-02-22 | 天津莱欧智能科技有限公司 | Cutting device is used in processing of zinc steel guardrail |
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| CN116674104A (en) | 2023-09-01 |
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