CN110497547A - A kind of cutting semiconductor materials devices and methods therefor - Google Patents
A kind of cutting semiconductor materials devices and methods therefor Download PDFInfo
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- CN110497547A CN110497547A CN201910801890.9A CN201910801890A CN110497547A CN 110497547 A CN110497547 A CN 110497547A CN 201910801890 A CN201910801890 A CN 201910801890A CN 110497547 A CN110497547 A CN 110497547A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 85
- 239000000463 material Substances 0.000 title claims abstract description 37
- 238000005520 cutting process Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 12
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 17
- 230000005540 biological transmission Effects 0.000 claims description 10
- 230000006835 compression Effects 0.000 claims description 10
- 238000007906 compression Methods 0.000 claims description 10
- 230000000694 effects Effects 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 230000033001 locomotion Effects 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention belongs to semiconductor fields, especially a kind of cutting semiconductor materials devices and methods therefor, for existing semi-conductor thermoelectric material cutter device, it is lower that there are the degree of automation, cannot as needed convenient and fast adjustment equipment so as to be cut into different length semi-conductor thermoelectric material and using inconvenient victory problem, now propose following scheme, it includes pedestal, U-shaped frame is fixedly installed at the top of the pedestal, the side of the U-shaped frame offers connector, cylinder is fixedly installed in the top inner wall of the connector, and connect cover is slidably connected on the side inner wall of connector, the present invention carries out longitudinally reciprocating motion by starting cylinder, semiconductor can be driven to be moved and cut respectively with this, the rotation that can use idler wheel simultaneously can be convenient the length intercepted required for control semiconductor, and use automatic operation , therefore when in use, operation can be more convenient.
Description
Technical field
The present invention relates to technical field of semiconductors more particularly to a kind of cutting semiconductor materials devices and methods therefors.
Background technique
Semi-conductor thermoelectric material refers to the semiconductor material with larger pyroelectric effect, also known as thermoelectric material.It can be direct
Electric energy is converted thermal energy into, or directly by electric energy production refrigeration when using semi-conductor thermoelectric material plate, is needed according to need
The size wanted cuts semi-conductor thermoelectric material plate using cutter device.
Current semi-conductor thermoelectric material cutter device, it is lower that there are the degree of automation, cannot easily adjust as needed
Section equipment is to be cut into the semi-conductor thermoelectric material of different length and using the problem of inconvenient victory, so it is proposed that one
Kind of cutting semiconductor materials devices and methods therefor, for solving the problems, such as above-mentioned proposition.
Summary of the invention
Based on background technique there are current semi-conductor thermoelectric material cutter device, it is lower that there are the degree of automation, cannot
Convenient and fast adjustment equipment is to be cut into the semi-conductor thermoelectric material of different length and using the skill of inconvenient victory as needed
Art problem, the invention proposes a kind of cutting semiconductor materials devices and methods therefors.
A kind of cutting semiconductor materials device proposed by the present invention, including pedestal are fixedly installed with U at the top of the pedestal
Type frame, the side of the U-shaped frame offer connector, cylinder are fixedly installed in the top inner wall of the connector, and connect
Mouthful side inner wall on slidably connect connect cover, symmetrically rotation connection is there are two connecting rod in the connect cover, and two connecting rods
Bottom end be rotatably connected to link block, slidably connect the same mounting rack on two link blocks, on the mounting rack and bottom
Idler wheel is rotatably connected on seat, the side of the connect cover is fixedly installed with the first rack gear, and rotates on the inner wall of connector
It is connected with rotate gear, the second rack gear is slidably connected on the inner wall of the connector, a Slideslip of second rack gear connects
It is connected to cutter.
Preferably, the side of the connect cover is rotatably connected to rotating bar, slidably connects movable plate on the U-shaped frame,
One end of the rotating bar and movable plate are rotatablely connected, and are fixedly installed with driving motor, the driving at the top of the movable plate
Rotate gear is fixedly installed on the output shaft of motor, the side of the cutter is fixedly installed with connection rack gear, the tooth connection
Item is engaged with rotate gear activity, cutter can be driven to be moved downwards using driving motor.
Preferably, the side of second rack gear offers link slot, and the link slot internal screw thread is connected with connecting plate, institute
State connecting plate bottom side extend to U-shaped frame outside and be fixedly connected at the top of cutter, connecting plate can be slided
Dynamic limit.
Preferably, it is rotatably connected to ball-screw on the inner wall of the link slot, is embedded with ball wire on the connecting plate
Thick stick nut, the ball-screw are threadedly coupled through ball-screw nut and with ball-screw nut, solid on the ball-screw
Surely it is arranged with fixed ring, and fixed ring is located at the top of connecting plate, torque spring, and torsion bullet is arranged on the ball-screw
Spring is located at the top of fixed ring, the top and bottom end of the torque spring top with the top inner wall of link slot and fixed ring respectively
Portion is fixedly connected, and be can be convenient using torque spring and is carried out elastic spacing to connecting plate.
Preferably, it is rotatably connected to shaft on the mounting rack, and the idler wheel fixation being located above is set in shaft, institute
One end of shaft is stated through U-shaped frame and extends to the side of U-shaped frame, the top side of the pedestal is fixedly installed with rotation electricity
Machine, the output shaft of the rotary electric machine and one end of shaft are fixedly installed with transmission gear, and two transmission gear activities are nibbled
It closes, idler wheel can be driven to be rotated using rotary electric machine, so that semiconductor is moved.
Preferably, it is folded with the same semiconductor between two idler wheels, and symmetrically there are two limits for rotation connection on U-shaped frame
Wheel, two position-limited wheels, which are located above and below semiconductor and with semiconductor, to be in contact, can be with using two position-limited wheels
Sliding limit is carried out to semiconductor.
Preferably, the side of the cutter is fixedly installed with connection ring, and backing plate is fixedly installed at the top of the pedestal, pad
Plate is located at the side of U-shaped frame, and compression bar is slidably connected in connection ring, and the bottom end of the compression bar is fixedly installed with pressing plate, described
Compressed spring is arranged on compression bar, and compressed spring is located at the lower section of connection ring, the top of the compressed spring and bottom end difference
It is fixedly connected at the top of the bottom of connection ring and pressing plate, pressure can be applied to mounting rack using compressed spring, so that two rollings
Wheel is closely clamped with semiconductor.
Preferably, push plate is slidably connected on the side inner wall of the connector, the top of the connect cover and push plate
Bottom is fixedly connected, and is fixedly connected at the top of the piston rod of cylinder and push plate, can be slided to connect cover using push plate
Limit.
Preferably, rotation hole is offered on the two sides inner wall of the connect cover, and is rotatably connected to limit in rotation hole
Gear slidably connects the two-sided rack on the inner wall of the connect cover, and the two-sided rack is meshed with two position limited gears respectively,
One end of two connecting rods is fixedly connected with two position limited gears respectively, and the top of the two-sided rack is fixedly installed with limit bullet
Spring, and the top of limit spring is fixedly connected with the bottom of push plate, when two connecting rods are rotated, can drive position limited gear
It is rotated, the two-sided rack can be driven to be moved with this, so that limit spring is in stress.
The invention also provides a kind of application methods of cutting semiconductor materials device, comprising the following steps:
S1: it drives connect cover to be moved downwards using starting cylinder, when connect cover is moved downwards, installation can be driven
Frame is moved downwards, and two idler wheels are contacted with semiconductor at this time, so that pair of rollers semiconductor is compressed；
S2: starting rotary electric machine can drive shaft to be rotated, and semiconductor can be driven to be moved with this；
S3: starting cylinder is moved backward, and push plate can be driven to be moved upwards at this time, in the first rack gear, rotate gear
Under the action of the second rack gear, cutter can be driven to be moved downwards, and when push plate is moved upwards, can pushed
Driving motor is moved, and cutter can drive connection rack gear to be moved downwards in downward moved, until rotation
Gear is meshed with rack gear is connect；
S4: starting driving motor can drive cutter to cut semiconductor.
The beneficial effects of the present invention are:
1, it drives connect cover to be moved downwards using starting cylinder, when connect cover is moved downwards, installation can be driven
Frame is moved downwards, and two idler wheels are contacted with semiconductor at this time, so that pair of rollers semiconductor is compressed, while
When mounting rack is moved downwards, shaft can be driven to be moved downwards, two transmission gears can be made to be meshed with this,
At this moment starting rotary electric machine can drive shaft to be rotated, and semiconductor can be driven to be moved with this；
2, it can star cylinder at this time after the completion of movement to be moved backward, push plate can be driven to be moved upwards at this time,
Under the action of the first rack gear, rotate gear and the second rack gear, cutter can be driven to be moved downwards, and upward in push plate
When being moved, connect cover can be driven to be moved upwards, at this moment can be pushed under the action of rotating bar driving motor into
Row movement, and cutter downwards moved when, can drive connection rack gear moved downwards, until rotate gear with connect
Rack gear is meshed, and at this time by starting driving motor, cutter can be driven to cut semiconductor；
The present invention carries out longitudinally reciprocating motion by starting cylinder, semiconductor can be driven respectively to be moved and cut with this,
The rotation that can use idler wheel simultaneously can be convenient the length intercepted required for control semiconductor, and use automatic operation, because
It is more convenient to operate meeting when in use for this.
Detailed description of the invention
Fig. 1 is a kind of structural side view of cutting semiconductor materials device proposed by the present invention；
Fig. 2 is a kind of second rack structure side view of cutting semiconductor materials device proposed by the present invention；
Fig. 3 is a kind of structural front view of cutting semiconductor materials device proposed by the present invention；
Fig. 4 is a kind of connect cover structural front view of cutting semiconductor materials device proposed by the present invention；
Fig. 5 is a kind of A schematic enlarged-scale view of cutting semiconductor materials device proposed by the present invention；
Fig. 6 is a kind of B structure enlarged drawing of cutting semiconductor materials device proposed by the present invention.
In figure: 1 pedestal, 2 U-shaped framves, 3 connectors, 4 cylinders, 5 push plates, 6 connect covers, 7 mounting racks, 8 idler wheels, 9 semiconductors,
10 first rack gears, 11 rotate gears, 12 second rack gears, 13 connecting plates, 14 cutters, 15 compression bars, 16 compressed springs, 17 position-limited wheels,
18 fixed rings, 19 connection rack gears, 20 link slots, 21 ball-screws, 22 ball-screw nuts, 23 torque springs, 24 rotating bars, 25
Movable plate, 26 driving motors, 27 rotate gears, 28 shafts, 29 rotary electric machines, 30 transmission gears, 31 connecting rods, 32 position limited gears,
33 the two-sided racks, 34 limit springs.
Specific embodiment
Combined with specific embodiments below the present invention is made further to explain.
Embodiment one
With reference to Fig. 1-5, a kind of cutting semiconductor materials device, including pedestal 1 are proposed in the present embodiment, the top of pedestal 1 is solid
Dingan County is equipped with U-shaped frame 2, and the side of U-shaped frame 2 offers connector 3, cylinder 4 is fixedly installed in the top inner wall of connector 3,
And connect cover 6 is slidably connected on the side inner wall of connector 3, and symmetrically rotation connection is there are two connecting rod 31 in connect cover 6, and two
The bottom end of a connecting rod 31 is rotatably connected to link block, and the same mounting rack 7, mounting rack 7 are slidably connected on two link blocks
It is rotatably connected to idler wheel 8 on upper and pedestal 1, the side of connect cover 6 is fixedly installed with the first rack gear 10, and connector 3 is interior
It is rotatably connected to rotate gear 12 on wall, the second rack gear 12, the side of the second rack gear 12 are slidably connected on the inner wall of connector 3
Cutter 14 is slidably connected, drives connect cover 6 to be moved downwards using starting cylinder 4, is moved downwards in connect cover 6
When, mounting rack 7 can be driven to be moved downwards, two idler wheels 8 are contacted with semiconductor 9 at this time, so that idler wheel 8 is to half
Conductor 9 is compressed, while when mounting rack 7 is moved downwards, shaft 28 can be driven to be moved downwards, can be with this
So that two transmission gears 30 are meshed, at this moment starting rotary electric machine 29 can drive shaft 28 to be rotated, can be with this
It drives semiconductor 9 to be moved, can star cylinder 4 at this time after the completion of movement and moved backward, can drive push away at this time
Plate 5 is moved upwards, under the action of the first rack gear 10, rotate gear 11 and the second rack gear 12, can drive cutter 14 to
Under moved, and when push plate 5 is moved upwards, connect cover 6 can be driven to be moved upwards, at this moment in rotating bar
Driving motor 26 can be pushed to be moved under the action of 24, and cutter 14 can drive tooth connection in downward moved
Item 19 is moved downwards, until rotate gear 27 is meshed with rack gear 19 connect, passes through start driving motor 26 at this time, can be with
Cutter 14 is driven to cut semiconductor 9, the present invention carries out longitudinally reciprocating motion by starting cylinder 4, can distinguish with this
The rotation for driving semiconductor 9 to be moved and cut, while can use idler wheel 8 can be convenient to cut required for control semiconductor 9
The length taken, and automatic operation is used, therefore when in use, operation can be more convenient.
Embodiment two
In the present embodiment, the side of connect cover 6 is rotatably connected to rotating bar 24, slidably connects movable plate 25 on U-shaped frame 2, turns
One end of lever 24 and movable plate 25 are rotatablely connected, and the top of movable plate 25 is fixedly installed with driving motor 26, driving motor 26
Output shaft on be fixedly installed with rotate gear 27, the side of cutter 14 is fixedly installed with connection rack gear 19, connection rack gear 19 with
27 activity engagement of rotate gear, can drive cutter 14 to be moved downwards using driving motor 26.
In the present embodiment, the side of the second rack gear 12 offers link slot 20, and 20 internal screw thread of link slot is connected with connecting plate
13, the bottom side of connecting plate 13 extends to the outside of U-shaped frame 2 and is fixedly connected with the top of cutter 14, can be to connecting plate
13 carry out sliding limit.
In the present embodiment, it is rotatably connected to ball-screw 21 on the inner wall of link slot 20, is embedded with ball on connecting plate 13
Feed screw nut 22, ball-screw 21 is through ball-screw nut 22 and is threadedly coupled with ball-screw nut 22, ball-screw 21
Upper fixing sleeve is equipped with fixed ring 18, and fixed ring 18 is located at the top of connecting plate 13, is arranged with torque spring on ball-screw 21
23, and torque spring 23 is located at the top of fixed ring 18, the top and bottom end of torque spring 23 top with link slot 20 respectively
Inner wall is fixedly connected with the top of fixed ring 18, be can be convenient using torque spring 23 and is carried out elastic spacing to connecting plate 13.
In the present embodiment, shaft 28 is rotatably connected on mounting rack 7, and the fixation of idler wheel 8 being located above is set in shaft
On 28, one end of shaft 28 runs through U-shaped frame 2 and extends to the side of U-shaped frame 2, and the top side of pedestal 1 is fixedly installed with rotation
Motor 29, the output shaft of rotary electric machine 29 and one end of shaft 28 are fixedly installed with transmission gear 30, and two transmission gears
30 activity engagements, can drive idler wheel 8 to be rotated, so that semiconductor 9 is moved using rotary electric machine 29.
In the present embodiment, the same semiconductor 9 is folded between two idler wheels 8, and be symmetrically rotatably connected on U-shaped frame 2
Two position-limited wheels 17, two position-limited wheels 17 are located above and below semiconductor 9 and with semiconductor 9 and are in contact, and utilize
Two position-limited wheels 17 can carry out sliding limit to semiconductor 9.
In the present embodiment, the side of cutter 14 is fixedly installed with connection ring, and the top of pedestal 1 is fixedly installed with backing plate, pad
Plate is located at the side of U-shaped frame 2, and compression bar 15 is slidably connected in connection ring, and the bottom end of compression bar 15 is fixedly installed with pressing plate, compression bar
Compressed spring 16 is arranged on 15, and compressed spring 16 is located at the lower section of connection ring, the top of compressed spring 16 and bottom end difference
It is fixedly connected at the top of the bottom of connection ring and pressing plate, pressure can be applied to mounting rack 7 using compressed spring 16, so that two
Idler wheel 8 is closely clamped with semiconductor 9.
In the present embodiment, push plate 5, top and the push plate 5 of connect cover 6 are slidably connected on the side inner wall of connector 3
Bottom is fixedly connected, and the piston rod of cylinder 4 is fixedly connected with the top of push plate 5, can be carried out to connect cover 6 using push plate 5
Sliding limit.
In the present embodiment, rotation hole is offered on the two sides inner wall of connect cover 6, and limit is rotatably connected in rotation hole
Gear 32, slidably connects the two-sided rack 33 on the inner wall of connect cover 6, and the two-sided rack 33 respectively with two 32 phases of position limited gear
Engagement, one end of two connecting rods 31 are fixedly connected with two position limited gears 32 respectively, and the top of the two-sided rack 33 is fixedly installed with
Limit spring 34, and the top of limit spring 34 is fixedly connected with the bottom of push plate 5, it, can when two connecting rods 31 are rotated
To drive position limited gear 32 to be rotated, the two-sided rack 33 can be driven to be moved with this so that limit spring 34 be in by
Power state.
In the present embodiment, drives connect cover 6 to be moved downwards using starting cylinder 4, moved downwards in connect cover 6
When, mounting rack 7 can be driven to be moved downwards, two idler wheels 8 are contacted with semiconductor 9 at this time, later in connect cover 6
When continuing to be moved downwards, two connecting rods 31 can be made to be rotated, so position limited gear 32 will be made to be rotated,
The two-sided rack 33 can be driven to be moved downwards with this, at this moment limit spring 34 would be at stress, while limit bullet
Spring 34 can also provide opposite power, so that idler wheel 8 compresses semiconductor 9, while when mounting rack 7 is moved downwards,
Shaft 28 can be driven to be moved downwards, two transmission gears 30 can be made to be meshed with this, at this moment start rotary electric machine
29 can drive shaft 28 to be rotated, and semiconductor 9 can be driven to be moved with this, can opened at this time after the completion of movement
Cylinder 4 of taking offence is moved backward, and push plate 5 can be driven to be moved upwards at this time, in the first rack gear 10, rotate gear 11 and
Under the action of two rack gears 12, cutter 14 can be driven to be moved downwards, and when push plate 5 is moved upwards, it can band
Dynamic connect cover 6 is moved upwards, at this moment driving motor 26 can be pushed to be moved under the action of rotating bar 24, and cutter
14 downwards moved when, can drive connection rack gear 19 moved downwards, up to rotate gear 27 with connect rack gear 19
It is meshed, at this time by starting driving motor 26, cutter 14 can be driven to cut semiconductor 9, it can band respectively with this
The rotation that dynamic semiconductor 9 is moved and cut, while can use idler wheel 8 can be convenient interception required for control semiconductor 9
Length, and use automatic operation, therefore when in use, operation can be more convenient.
The invention also provides a kind of application methods of cutting semiconductor materials device, comprising the following steps:
S1: it drives connect cover 6 to be moved downwards using starting cylinder 4, when connect cover 6 is moved downwards, can drive
Mounting rack 7 is moved downwards, and two idler wheels 8 are contacted with semiconductor 9 at this time, so that idler wheel 8 presses semiconductor 9
Tightly；
S2: starting rotary electric machine 29 can drive shaft 28 to be rotated, and semiconductor 9 can be driven to be moved with this；
S3: starting cylinder 4 is moved backward, and push plate 5 can be driven to be moved upwards at this time, in the first rack gear 10, rotation
Under the action of gear 11 and the second rack gear 12, cutter 14 can be driven to be moved downwards, and be moved upwards in push plate 5
When, driving motor 26 can be pushed to be moved, and cutter 14 can drive connection rack gear 19 downward in downward moved
It is moved, until rotate gear 27 is meshed with rack gear 19 is connect；
S4: starting driving motor 26 can drive cutter 14 to cut semiconductor 9.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (10)
1. a kind of cutting semiconductor materials device, including pedestal, which is characterized in that be fixedly installed at the top of the pedestal U-shaped
Frame, the side of the U-shaped frame offer connector, and cylinder, and connector are fixedly installed in the top inner wall of the connector
Side inner wall on slidably connect connect cover, symmetrically rotation connection is there are two connecting rod in the connect cover, and two connecting rods
Bottom end is rotatably connected to link block, slidably connects the same mounting rack on two link blocks, on the mounting rack and pedestal
On be rotatably connected to idler wheel, the side of the connect cover is fixedly installed with the first rack gear, and on the inner wall of connector rotate connect
It is connected to rotate gear, the second rack gear is slidably connected on the inner wall of the connector, the side of second rack gear is slidably connected
There is cutter.
2. a kind of cutting semiconductor materials device according to claim 1, which is characterized in that the side of the connect cover turns
It is dynamic to be connected with rotating bar, movable plate is slidably connected on the U-shaped frame, one end of the rotating bar and movable plate are rotatablely connected,
It is fixedly installed with driving motor at the top of the movable plate, is fixedly installed with rotate gear on the output shaft of the driving motor,
The side of the cutter is fixedly installed with connection rack gear, and the connection rack gear is engaged with rotate gear activity.
3. a kind of cutting semiconductor materials device according to claim 1, which is characterized in that the side of second rack gear
Link slot is offered, the link slot internal screw thread is connected with connecting plate, and the bottom side of the connecting plate extends to the outer of U-shaped frame
Side and be fixedly connected at the top of cutter.
4. a kind of cutting semiconductor materials device according to claim 3, which is characterized in that on the inner wall of the link slot
It is rotatably connected to ball-screw, ball-screw nut is embedded on the connecting plate, the ball-screw runs through ball-screw spiral shell
Mother is simultaneously threadedly coupled with ball-screw nut, and fixing sleeve is equipped with fixed ring on the ball-screw, and fixed ring is located at connecting plate
Top, be arranged with torque spring on the ball-screw, and torque spring is located at the top of fixed ring, the torque spring
Top and bottom end are fixedly connected at the top of the top inner wall of link slot and fixed ring respectively.
5. a kind of cutting semiconductor materials device according to claim 1, which is characterized in that the company of rotation on the mounting rack
It is connected to shaft, and the idler wheel fixation being located above is set in shaft, one end of the shaft through U-shaped frame and extends to U-shaped
The side of frame, the top side of the pedestal are fixedly installed with rotary electric machine, and the one of the output shaft of the rotary electric machine and shaft
End is fixedly installed with transmission gear, and two transmission gear activity engagements.
6. a kind of cutting semiconductor materials device according to claim 1, which is characterized in that be folded between two idler wheels
The same semiconductor, and symmetrically there are two position-limited wheels, two position-limited wheels to be located at the top of semiconductor for rotation connection on U-shaped frame
With lower section and it is in contact with semiconductor.
7. a kind of cutting semiconductor materials device according to claim 1, which is characterized in that the side of the cutter is fixed
Connection ring is installed, backing plate is fixedly installed at the top of the pedestal, backing plate is located at the side of U-shaped frame, and slides in connection ring
It is connected with compression bar, the bottom end of the compression bar is fixedly installed with pressing plate, and compressed spring, and compressed spring position are arranged on the compression bar
In the lower section of connection ring, the top of the compressed spring is separately connected at the top of the bottom and pressing plate of ring with bottom end and is fixedly connected.
8. a kind of cutting semiconductor materials device according to claim 1, which is characterized in that in the side of the connector
Push plate is slidably connected on wall, the top of the connect cover is fixedly connected with the bottom of push plate, and the piston rod of cylinder and push plate
Top be fixedly connected.
9. a kind of cutting semiconductor materials device according to claim 1, which is characterized in that in the two sides of the connect cover
Rotation hole is offered on wall, and is rotatably connected to position limited gear in rotation hole, is slidably connected on the inner wall of the connect cover
The two-sided rack, and the two-sided rack is meshed with two position limited gears respectively, one end of two connecting rods respectively with two position limited gears
It is fixedly connected, the top of the two-sided rack is fixedly installed with limit spring, and the top of limit spring and the bottom of push plate are solid
Fixed connection.
10. a kind of application method of cutting semiconductor materials device, the following steps are included:
S1: it drives connect cover to be moved downwards using starting cylinder, when connect cover is moved downwards, installation can be driven
Frame is moved downwards, and two idler wheels are contacted with semiconductor at this time, so that pair of rollers semiconductor is compressed；
S2: starting rotary electric machine can drive shaft to be rotated, and semiconductor can be driven to be moved with this；
S3: starting cylinder is moved backward, and push plate can be driven to be moved upwards at this time, in the first rack gear, rotate gear
Under the action of the second rack gear, cutter can be driven to be moved downwards, and when push plate is moved upwards, can pushed
Driving motor is moved, and cutter can drive connection rack gear to be moved downwards in downward moved, until rotation
Gear is meshed with rack gear is connect；
S4: starting driving motor can drive cutter to cut semiconductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910801890.9A CN110497547A (en) | 2019-08-28 | 2019-08-28 | A kind of cutting semiconductor materials devices and methods therefor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910801890.9A CN110497547A (en) | 2019-08-28 | 2019-08-28 | A kind of cutting semiconductor materials devices and methods therefor |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111151046A (en) * | 2020-01-10 | 2020-05-15 | 厉风英 | Rain sewage purification device |
| CN111702250A (en) * | 2020-07-06 | 2020-09-25 | 常德永盛液压机械有限公司 | Hydraulic power oil tank processing is with cutting device who has deformation protective structure |
| CN112191909A (en) * | 2020-10-14 | 2021-01-08 | 重庆力东机电有限公司 | Automatic cutting device for metal plates |
| CN116674104A (en) * | 2023-06-01 | 2023-09-01 | 浙江精瓷半导体有限责任公司 | Slicing equipment and slicing method for producing semiconductors |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111151046A (en) * | 2020-01-10 | 2020-05-15 | 厉风英 | Rain sewage purification device |
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| CN116674104A (en) * | 2023-06-01 | 2023-09-01 | 浙江精瓷半导体有限责任公司 | Slicing equipment and slicing method for producing semiconductors |
| CN116674104B (en) * | 2023-06-01 | 2024-02-06 | 浙江精瓷半导体有限责任公司 | Slicing equipment and slicing method for producing semiconductors |
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Application publication date: 20191126 |