CN110669220B - 聚砜高分子、树脂组合物及其制造方法 - Google Patents
聚砜高分子、树脂组合物及其制造方法 Download PDFInfo
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- CN110669220B CN110669220B CN201910096166.0A CN201910096166A CN110669220B CN 110669220 B CN110669220 B CN 110669220B CN 201910096166 A CN201910096166 A CN 201910096166A CN 110669220 B CN110669220 B CN 110669220B
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Abstract
Description
【技术领域】
本发明涉及一种高分子及其制造方法、含此高分子的树脂组合物及其制造方法及利用此树脂组合物的基板贴合方法,且特别是涉及一种聚砜高分子及其制造方法、含此聚砜高分子的树脂组合物及其制造方法及利用此树脂组合物的基板贴合方法。
【背景技术】
由于半导体封装制程中,为了便利生产线的操作,会藉由胶材将硅晶圆暂时贴合于载体基板后,再进行后续元件的制造流程;胶材贴合温度以220℃为使用上限,若贴合需要的温度超过220℃,则容易造成硅晶圆严重翘曲、界面破坏或溢气等问题。此外,在半导体封装制程中会有短暂的高温过程,高温可达260℃以上,若胶材耐热性不佳,将会造成材料形变甚至严重流动的现象。
现有的聚砜高分子(polysulfone)商用品,皆以高玻璃转移温度(玻璃态转变温度,Tg)、高耐热、耐酸、耐碱性为诉求,举凡BASF公司的E(Polyethersulfone;PES)、S(Polysulfon;PSU)、P(Polyphenylsulfone;PPSU)系列的聚砜高分子(polysulfone)、Solvey公司的PESU(Polyethersulfone)系列的聚砜高分子(polysulfone),或其玻璃转移温度(Tg)介于220~240℃或更高的高分子,若使用这些市售的聚砜高分子(polysulfone)系列的胶材用于半导体贴合制程时,由于胶材内的聚砜高分子(polysulfone)的玻璃转移温度(Tg)多大于220℃或材料结构较刚硬,故贴合时所需的温度同样必须大于220℃,此举将造成硅晶圆严重翘曲、界面破坏或溢气等问题。因此,这类市售的聚砜高分子(polysulfone)系列的胶材并不适合用于半导体封装制程。
有鉴于此,一种可在较低贴合温度(80~220℃)的制程条件下,提供良好贴合效率且在半导体封装的其他高温制程中不会产生溢流的胶材乃是目前业界所殷切期盼。
【发明内容】
本发明的一目的是提供一种聚砜高分子,具有以下式(I)结构通式:
R2为各自独立的取代或未经取代的芳香环;X为同时具有酯基及羟基取代的连接基;R3为碳数3以上的脂肪族连接基或含有至少2个芳香环的芳香族连接基,且此芳香族连接基中的至少两个芳香环以氧原子、硫原子、异亚丙基或六氟异亚丙基连接,使R3具有软链段的分子结构;且R’为含有环氧官能基的末端基团;n为30~200。据此,藉由同时含有磺酰基和R3为软链段分子结构的搭配,得以调整材料的软化温度,可适用于半导体封装暂时贴合制程中的较低的操作温度,其中R3若使用硬链段分子结构,例如苯环或联苯结构,则在较低的操作温度下的贴合率较差;而本发明的聚砜高分子末端具有环氧官能基,可提升材料整体耐高温性,使胶材在封装制程中,即使经历高温的环境,亦不会造成材料形变甚至严重流动的现象。
本发明的再一目的是提供一种基板贴合方法,其步骤包括:提供一第一基板;提供前面段落所述的树脂组合物,并将该树脂组合物涂布于第一基板表面,实施加热处理,以移除树脂组合物内的有机溶剂;以及提供第二基板,使该第二基板贴合于前述的第一基板上,且前述的树脂夹于该第一基板与该第二基板之间,藉此将第二基板暂时贴合于第一基板。
【附图说明】
图1A~1D所绘示的是根据本发明的基板贴合方法的一实施例的剖面制程。
图2A~2D所绘示的是根据本发明的基板贴合方法的另一实施例的剖面制程。
【附图标记说明】
100 第一基板
200 第二基板
201 背面
202 加工面
300 树脂组合物
400 层离型材
【具体实施方式】
根据本发明的一种聚砜高分子,具有以下式(I)结构通式:
R2为各自独立的取代或未经取代的芳香环;X为一同时具有酯基及羟基取代的连接基;R3为碳数3以上的脂肪族连接基或含有至少2个芳香环的芳香族连接基,且此芳香族连接基中的至少两个芳香环以氧原子、硫原子、异亚丙基或六氟异亚丙基连接,使R3具有软链段的分子结构;且R’为含有环氧官能基的末端基团;n可为30~200,优选n为38~194。
上述式I的结构通式中,优选为具有以下式(I-a)的结构通式:
其中,R4、R5、R12、R13可各自独立地为氢、氯、溴或含芳香环结构的基团,且可为相同或不同,a、b、c、d分别为0~4;R3、R’、n如前面段落所定义。
上述R3可为C3~C10直链或支链的亚烷基、C3~C10直链或支链的亚烯基、包含C3~C20脂环族的连接基,且其中C3~C10直链或支链的亚烷基为未经取代、一个或多个亚甲基(-CH2-)被羰基(-C=O-)或亚氧基(-O-)取代且其中羰基(-C=O-)或亚氧基(-O-)取代基彼此不直接相连;或包含以下式(II)结构通式的连接基:
Y为氧原子、硫原子、异亚丙基或六氟异亚丙基;
其中R3优选为
其中,R14、R15、R16、R17、R18、R19可各自独立地为氢或甲基。
上述同时具有酯基及羟基取代的连接基系以二羧酸类化合物的酸基与含磺酰基的二环氧化物的环氧基反应而成。
上述含磺酰基的环氧化物具有以下式(V)结构通式:
其中,R6~R9可以为氢、氯、溴或含芳香环结构的基团,R10、R11可以为含有碳数1以上的碳链或含醚或芳香环结构的链状结构。
上述二羧酸为包含直链或支链烷基的二羧酸、包含脂环基结构的二羧酸或至少两个芳香环以氧原子、硫原子、异亚丙基或六氟异亚丙基连接的二羧酸,可为但不限于顺-丁烯二酸、反-丁烯二酸、草酰乙酸(oxaloacetic acid)、己二酸、己二酸衍生物、戊二酸、戊二酸衍生物、琥珀酸、丙二酸、丙二酸衍生物、庚二酸、1,8-辛二酸、壬二酸、癸二酸、酮庚二酸、4,4′-二苯醚二甲酸、顺-4-环己烯-1,2-二羧酸、反-4-环己烯-1,2-二羧酸中的至少一种或其组合;优选为包含直链亚烷基的二羧酸、包含脂环基结构的二羧酸或至少两个芳香环以氧原子、硫原子、异亚丙基或六氟异亚丙基连接的二羧酸;优选为包含脂环基结构的二羧酸或至少两个芳香环以氧原子、硫原子、异亚丙基或六氟异亚丙基连接的二羧酸,例如但不限于4,4′-二苯醚二甲酸、顺-4-环己烯-1,2-二羧酸、反-4-环己烯-1,2-二羧酸。
根据本发明的一种制造上述的聚砜高分子的方法,其步骤包括:提供二羧酸与含磺酰基的二环氧化物的反应混合物,且含磺酰基的二环氧化物与二羧酸的当量比值大于1;将反应混合物加入溶剂内,并加热使反应混合物内的二羧酸与含磺酰基的二环氧化物在催化剂存在下进行聚合反应;以及确认反应混合物中的二羧酸已完全反应完毕后,停止加热及聚合反应。在以含磺酰基的二环氧化物过量的方式进行合成,能使所反应完成的聚砜高分子的末端皆为含环氧官能基的结构。
上述有机溶剂具有溶解及方便涂布的功能但以不影响高分子聚合为前提,可为但不限于包含N-甲基吡咯烷酮(N-Methyl-2-pyrrolidone)、N-乙基吡咯烷酮(N-ethyl-2-pyrrolidone)等的吡咯烷酮系溶剂、丙二醇甲醚醋酸酯(Propylene glycerol methylether acetate)、γ-丁内酯(γ-butyrolactone)等的酯系溶剂、二甲基乙酰胺(N,N-dimethylacetamide)、二甲基甲酰胺(N,N-dimethylformamide)等的酰胺系溶剂、二甲基亚砜(dimethyl sulfoxide)等的砜系溶剂、丙二醇单甲基醚(propylene glycol monomethylether)或四氢呋喃(Tetrahydrofuran)等的醚系溶剂中的至少一种或它们的混合溶剂;亦可藉由使用非质子极性溶剂,例如本申请使用的NMP作为主溶剂,搭配不同种类的溶剂调整对整体树脂溶液的溶解能力及调整涂布应用时的挥发速率,优选为包含吡咯烷酮系溶剂、酯系溶剂等的混合溶剂。
上述的主链具有磺酰基结构的高分子,为不同于式(I)或式(I-a)结构的另一高分子,可为但不限于一般市售的E(Polyethersulfone;PES)、PESU(Polyethersulfone)、S(Polysulfon;PSU)、P(Polyphenylsulfone;PPSU)系列的聚砜高分子或主链具有磺酰基结构的压克力系树脂、聚酰胺酸、聚酰亚胺、聚酰胺、聚苯噁唑等的聚合物,可用于调整胶材的耐热性、耐形变性或高温溢流的特性。
基于根据本发明的组合物为100重量百分比,根据本发明的聚砜高分子的含量可为5~55重量百分比,优选地为10~40重量百分比,更优选地为10~35重量百分比;不同于式(I)或式(I-a)结构的另一主链具有磺酰基结构的高分子的含量可为1~25重量百分比,优选地为5~15重量百分比,更优选地为5~10重量百分比;有机溶剂的含量可为30~90重量百分比,优选地为35~75重量百分比,更优选地为50~75重量百分比。
上述的树脂组合物,可依需要进一步添加流平剂、助溶剂、界面活性剂或硅烷偶合剂或其他用途的添加剂。其中,前述的硅烷偶合剂可为但不限于BYK 3620,LAPONITE-EP,BYK 302,BYK307,BYK331,BYK333,BYK342,BYK346,BYK347,BYK348,BYK349,BYK375,BYK377,BYK378,BYK3455,BYK SILCLEAN 3720;前述的流平剂可为但不限于BYK-375等硅氧烷系流平剂、BYK381等聚丙烯酸酯系流平剂、BYKETOL-WS等低分子量的表面活性聚合物流平剂;前述的界面活性剂可为但不限于BYK-3410等表面活性物质化合物;前述的助溶剂可为但不限于丙二醇甲醚醋酸酯(Propylene glycerol methyl ether acetate)、γ-丁内酯(γ-butyrolactone)等的酯系溶剂;此外,其中流平剂的含量可为0~5重量百分比,优选地为0.05~1重量百分比,更优选地为0.1~0.5重量百分比;助溶剂的含量可为1~30重量百分比,优选地为5~15重量百分比,更优选地为5~10重量百分比。
根据本发明的一种基板贴合方法,其步骤包括:提供第一基板;提供上述的树脂组合物,并将树脂组合物涂布于第一基板表面,实施加热处理,以移除其树脂组合物内的有机溶剂;以及提供第二基板,使第二基板贴合于第一基板上,且前述树脂组合物夹于第一基板与第二基板之间。
上述加热处理步骤的温度介于80℃~180℃,可以施加固定温度加热至树脂组合物中的溶剂完全移除,优选为依序梯度增加加热的温度,例如施加80℃数分钟后,将温度提高到130℃继续加热一段时间,再升温至180℃至溶剂完全移除。
上述的第二基板贴合至第一基板上的步骤的温度一般可设定在220℃或更低的温度,避免温度过高造成第二基板的破坏,优选为在180℃~220℃的环境下进行。
上述的基板贴合方法,在树脂组合物涂布于第一基板表面的步骤进行前,还包括一步骤以在第一基板表面先形成一表面处理层,使得树脂组合物在第二基板贴合至第一基板后被夹于该表面处理层与第二基板之间。
上述表面处理层为一层离型材,其可包含压克力系树脂、聚酰亚胺、聚酰胺、聚酰胺酸、聚苯并噁唑中的一者或其组合,且还可包含多个无机粒子,例如但不限于碳黑。
上述发明内容旨在提供本公开内容的简化摘要,以使阅读者对本公开内容具备基本的理解。此发明内容并非本公开内容的完整概述,且其用意并非在于指出本发明实施例的重要/关键元件或界定本发明的范围。在参阅下文实施方式后,本发明所属技术领域中的技术人员应可轻易地了解本发明的基本精神以及本发明所采用的技术手段与实施状态。
为了让本发明的上述和其他目的、特征、和优点能更明显易懂,下文特举优选实施例,作详细说明如下。
合成例:高分子的混合物的制备
合成例1
混合物(P-I)的合成
将双酚S二缩水甘油基醚(Bisphenol S Diglycidyl Ether)(CAS 3878-43-1)67g、己二酸(adipic acid)(CAS 124-04-9)22.5g、1-甲基咪唑(1-Methylimidazole)(CAS616-47-7)0.18g、溶剂N-甲基-2-吡咯烷酮(N-Methyl-2-pyrrolidone)(CAS 872-50-4)179g置于玻璃釜中,通入干燥气体于液面下30分钟。接着将玻璃釜加热到100℃反应10~12小时。反应过程中以酸价滴定方式持续监测其反应率,酸价滴定确认其酸已反应完全后降温,并停止反应,获得含有具下列结构式的高分子(I)的混合物(P-I):
混合物(P-I)使用气相色谱仪(GPC)鉴定其重均分子量Mw为31000。取10g混合物(P-I)置于旋转真空浓缩瓶中,通过减压加热方式移除溶剂,测得其固体合成物重量3.25g,计算得其固体成分含量为32.5wt%。
合成例2
混合物(P-II)的合成
将双酚S二缩水甘油基醚(CAS.3878-43-1)67g、4-4-氧基二(苯甲酸)4-4-Oxybis(benzoic acid)(CAS.2215-89-6)39.8g、1-甲基咪唑(CAS 616-47-7)0.21g、溶剂N-甲基-2-吡咯烷酮(CAS 872-50-4)213g置于玻璃釜中。通入干燥气体于液面下30分钟,接着将玻璃釜加热到100℃反应10~12小时。反应过程中以酸价滴定方式持续监测其反应率,酸价滴定确认其酸已反应完全后降温,并停止反应,获得含有具下列结构式的高分子(II)的混合物(P-II):
混合物(P-II)使用气相色谱仪(GPC)鉴定其重均分子量Mw为40000。取10g混合物(P-II)置于旋转真空浓缩瓶中,通过减压加热方式移除溶剂,测得其固体合成物重量3.25g,计算得其固体成分含量为32.5wt%。
合成例3
混合物(P-III)的合成
将双酚S二缩水甘油基醚(CAS.3878-43-1)67g、1,2,3,6-四氢苯二甲酸(1,2,3,6-tetrahydrophthalic acid)(CAS 88-98-2)26.2g、1-甲基咪唑(616-47-7)0.19g、溶剂N-甲基-2-吡咯烷酮(872-50-4)186g置于玻璃釜中。通入干燥气体于液面下30分钟,接着将玻璃釜加热到100℃反应10~12小时。反应过程中以酸价滴定方式持续监测其反应率,酸价滴定确认其酸已反应完全后降温,并停止反应,获得含有具下列结构式的高分子(III)的混合物(P-III):
混合物(P-III)使用气相色谱仪(GPC)鉴定其重均分子量Mw为34000。取10g混合物(P-III)置于旋转真空浓缩瓶中,通过减压加热方式移除溶剂,测得其固体合成物重量3.25g,计算得其固体成分含量为32.5wt%。
合成例4
混合物(P-IV)的合成
将双酚A二缩水甘油基醚(Bisphenol A Diglycidyl Ether)(CAS.1675-54-3)62.8g、己二酸(CAS 64-19-9)22.5g、1-甲基咪唑(CAS 616-47-7)0.21g、溶剂N-甲基-2-吡咯烷酮(CAS 872-50-4)175g置于玻璃釜中。通入干燥气体于液面下30分钟,接着将玻璃釜加热到100℃反应10~12小时。反应过程中以酸价滴定方式持续监测其反应率,酸价滴定确认其酸已反应完全后降温,并停止反应,获得含有具下列结构式的高分子(IV)的混合物(P-IV):
混合物(P-IV)使用气相色谱仪(GPC)鉴定其重均分子量Mw为42000。取10g混合物(P-IV)置于旋转真空浓缩瓶中,通过减压加热方式移除溶剂,测得其固体合成物重量3.25g,计算得其固体成分含量为32.5wt%。
合成例5
混合物(P-V)的合成
将双酚S二缩水甘油基醚(CAS.3878-43-1)62.8g、4-4-氧基二(苯甲酸)(CAS.2215-89-6)39.8g、醋酸(CAS 64-19-7)3.7g、1-甲基咪唑(CAS616-47-7)0.21g、溶剂N-甲基-2-吡咯烷酮(CAS 872-50-4)205g置于玻璃釜中。通入干燥气体于液面下30分钟,接着将玻璃釜加热到100℃反应10~12小时。反应过程中以酸价滴定方式持续监测其反应率,酸价滴定确认其酸已反应完全后降温,并停止反应,获得含有具下列结构式的高分子(V)的混合物(P-V):
混合物(P-V)使用气相色谱仪(GPC)鉴定其重均分子量Mw为39500。取10g混合物(P-V)置于旋转真空浓缩瓶中,通过减压加热方式移除溶剂,测得其固体合成物重量3.25g,计算得其固体成分含量为32.5wt%。
树脂组合物配方的制备:
实施例1
取合成例1所获得的混合物(P-I)80g,加入N-甲基-2-吡咯烷酮(CAS872-50-4)12g、丙二醇甲醚醋酸酯(CAS 108-65-6)7g、聚醚砜4100p(购自住友化学公司)8g、BYK375(购自BYK公司)0.2g于瓶中,混和搅拌至粘度均匀,为树脂组合物配方1。
实施例2
取合成例2所获得的混合物(P-II)80g,加入N-甲基-2-吡咯烷酮(CAS872-50-4)12g、丙二醇甲醚醋酸酯(CAS 108-65-6)7g、聚醚砜4100p(购自住友化学公司)8g、BYK375(购自BYK公司)0.2g于瓶中,混和搅拌至粘度均匀,为树脂组合物配方2。
实施例3
取合成例2所获得的混合物(P-II)80g,加入N-甲基-2-吡咯烷酮(CAS872-50-4)12g、丙二醇甲醚醋酸酯(CAS 108-65-6)7g、聚醚砜4100p(购自住友化学公司)8g于瓶中,混和搅拌至粘度均匀,为树脂组合物配方3。
实施例4
取合成例3所获得的混合物(P-III)80g,加入N-甲基-2-吡咯烷酮(872-50-4)12g、丙二醇甲醚醋酸酯(CAS 108-65-6)7g、聚醚砜4100p(购自住友化学公司)8g、BYK375(购自BYK公司)0.2g于瓶中,混和搅拌至粘度均匀为树脂组合物配方4。
实施例5
取合成例2所获得的混合物(P-II)70g,加入N-甲基-2-吡咯烷酮(CAS872-50-4)18g、丙二醇甲醚醋酸酯(CAS 108-65-6)7g、聚醚砜4100p(购自住友化学公司)12g、BYK375(购自BYK公司)0.2g于瓶中,混和搅拌至粘度均匀,为树脂组合物配方5。
实施例6
取合成例2所获得的混合物(P-II)85g,加入N-甲基-2-吡咯烷酮(CAS872-50-4)9g、丙二醇甲醚醋酸酯(CAS 108-65-6)7g、聚醚砜4100p(购自住友化学公司)6g、BYK375(购自BYK公司)0.2g于瓶中,混和搅拌至粘度均匀,为树脂组合物配方6。
实施例7
取合成例1所获得的混合物(P-I)80g,加入N-甲基-2-吡咯烷酮(CAS872-50-4)12g、丙二醇甲醚醋酸酯(CAS 108-65-6)7g、PSU(购自Solvay)8g、BYK375(购自BYK公司)0.2g于瓶中,混和搅拌至粘度均匀,为树脂组合物配方7。
比较例1
取合成例4所获得的混合物(P-IV)80g,加入N-甲基-2-吡咯烷酮(CAS872-50-4)12g、丙二醇甲醚醋酸酯(CAS 108-65-6)7g、聚醚砜4100p(购自住友化学公司)8g、BYK375(购自BYK公司)0.2g于瓶中,混和搅拌至粘度均匀,为树脂组合物配方8。
比较例2
取聚醚砜4100p(购自住友化学公司)34g、BYK375(购自BYK公司)0.2g置于瓶中,加入N-甲基-2-吡咯烷酮(CAS 872-50-4)66g,混和搅拌至粘度均匀,为树脂组合物配方9。其中,聚醚砜4100p作为高分子。
比较例3
取合成例5所获得的混合物(P-V)80g,加入N-甲基-2-吡咯烷酮(CAS872-50-4)12g、丙二醇甲醚醋酸酯(CAS 108-65-6)7g、聚醚砜4100p(购自住友化学公司)8g、BYK375(购自BYK公司)0.2g于瓶中,混和搅拌至粘度均匀,为树脂组合物配方10。
实施例1~7所公开的树脂组合物配方1~7及比较例1~3所公开的树脂组合物配方8~10的内容物整理如表一所示。
表一
配方1~10乃以下面所述的220℃贴合率测量、高温溢流测量进行相关特性测试,其测量结果乃记录如表二所示。
220℃贴合率测量:
在2cm*2cm的玻璃基板上分别涂布圆形直径7mm,厚度50μm的液态胶材,此液态胶材可为实施例1~4及比较例1~3所公开的树脂组合物的其中之一。其次,依序加热80℃10分钟、130℃10分钟、180℃10分钟,将胶材的溶剂烤干。接着,在胶材表面放上1cm2玻璃基板,并放置2kg的砝码于玻璃基板上,此贴合压力为2Kg/cm2。将此贴合装置设置于220℃环境如热板或烘箱。10分钟后移除砝码及热源,观察胶材贴合上下玻璃的面积。若贴合面积大于90%则判为◎;若贴合面积达80~90%则判为○;若50~80%判为△;未达50%判为X。
高温溢流测量:
在2cm*2cm的玻璃基板上涂布圆形直径7mm,厚度50μm的液态胶材,此液态胶材可为实施例1~4及比较例1~3所公开的树脂组合物的其中之一。其次,依序加热80℃10分钟、130℃10分钟、180℃10分钟,将胶材的溶剂烤干。接着,在胶材表面放上1.1cm*1.1cm玻璃基板,加热至220℃,并接续放上770g的砝码于玻璃基板上10分钟,此圆形面的贴合压力为2Kg/cm2。贴合后移除砝码及热源,观察胶材贴合上下玻璃区域的直径作为原始直径。上述试片制作完成后,将此试片置于260℃下120秒,移除热源后待试片回到室温测量其直径。若胶材直径与原始直径比值为95~105%则判为◎;若胶材微量溢流;直径与原始直径比值为105~115%判为○;若胶材溢流明显直径与原始直径比值为115~150%判为△;若胶材直径与原始直径比值大于150%判为X。
表二
如表二的测量结果所示,实施例1~7中所含的高分子(I)~(III)均为具有环氧官能基封端且为具有磺酰基的聚砜高分子,故在220℃贴合率测量及高温溢流测量中均显示其在半导体基板贴合时可赋予优异的贴合效果,且在高温制程时也不会有明显的溢流现象,此结果显示根据本发明所公开的具有环氧官能基封端且为具有磺酰基的聚砜高分子适合作为半导体制程中基板贴合胶材的成份。此外,如表一所示,实施例2、3内的内容物大致相同,唯一差异仅在于实施例2还包含有0.2g的作为流平剂的BYK375,惟如表二的测量结果所示,实施例2、3在220℃贴合率测量及高温溢流测量并无明显差异,显示根据本发明所公开的树脂组合物,流平剂存在与否并不实质影响其低温可贴合性及改善高温溢流的效果。
如表二所示,比较例1虽包含具有环氧官能基封端的高分子(IV),使其在220℃贴合率测量时具有优异的贴合效果,惟此具有环氧官能基封端的高分子(IV)并不具有磺酰基,导致比较例1在半导体基板贴合后的高温处理时产生严重的溢流现象。
如表二所示,比较例2内所含的高分子是一种市售的聚醚砜4100p高分子(购自住友化学公司),其结构与本发明式(I)高分子的差异在于不具有-X-R3-X-的结构,而是直接以氧原子连接,其玻璃态转变点Tg为230℃,故比较例2在220℃贴合率测量无法提供良好的贴合效率。
如表二所示,比较例3内所含的高分子(V)虽为具有磺酰基的聚砜高分子,使其在220℃贴合率测量时提供良好的贴合效率,惟此高分子(V)的两末端并不具有环氧官能基封端,故在高温溢流测量时产生明显的溢流现象。
如上所述,根据本发明所公开的同时含有磺酰基、-X-R3-X-及环氧官能基封端的聚砜高分子的树脂组合物,在220℃贴合率测量及高温溢流测量均显示其在半导体基板贴合时可赋予优异的贴合效果,故极适合用于半导体封装制程中的贴合步骤。如图1A~1D所绘示的根据本发明的基板贴合方法的一实施例的剖面制程,此基板贴合方法的步骤包括:提供如图1A所示的第一基板100;提供根据本发明的树脂组合物配方300,并如图1B所示般先将此树脂组合物配方300涂布于第一基板100的上表面(未标示),然后在温度介于80℃~180℃的条件下再实施加热处理,以移除树脂组合物配方300内的有机溶剂;以及提供如图1C所示的第二基板200,并在温度介于180℃~220℃的条件下使第二基板200的背面201如图1D所示般贴合于第一基板100的上表面(未标示),且前述树脂组合物配方300夹于第一基板100与第二基板200之间。
上述的第一基板100是作为载体基板,可使用但不限于硅材料、玻璃材料或其他耐高温材料,其尺寸通常大于第二基板200,使其在生产作业线上便于作为各种形状、尺寸的第二基板200的乘载功能。上述的第二基板200在半导体封装制程中可为但不限于晶圆,在第二基板200的背面201形成线路或电路重分配结构作为晶片电子讯号出入的通道的结构;并使用本发明的树脂组合物300作为贴合材料,将树脂组合物300施加于第一基板100的上表面(未标示),使第二基板200藉此固定于第一基板100上。另外,因第二基板200的背面201有时因线路或电路重分配结构形成不平整的表面,故此树脂组合物300所构成的贴合材料亦可使封装制程中在第二基板200的加工面202进行加工、修饰(例如制作金属线路、在表面挖洞等),甚至后续晶片接着(粘合)、模组材料接着时易于操作,同时亦可作为保护第二基板200的背面201的结构或线路的功能,避免其在高温过程中受到破坏;完成封装加工后,可藉由热、外力或激光等方式破坏树脂组合物300以剥离第一基板100和第二基板200。
图2A~2D所绘示的是根据本发明的基板贴合方法的另一实施例的剖面制程,其中,第一基板100与树脂组合物300之间乃先做表面处理,例如,施加如图2A所示的层离型材400于第一基板100的上表面(未标示),以利后续制程将第一基板100和第二基板200剥离。前述的离型材可为但不限于聚酰亚胺、聚酰胺、聚酰胺酸、聚苯并噁唑等材料,亦可视情况添加无机粒子,例如碳黑。然后,提供根据本发明的树脂组合物300,并如图2B所示般先将此树脂组合物300涂布于层离型材400上,然后在温度介于80℃~180℃的条件下实施加热处理,以移除树脂组合物300内的有机溶剂。接着,提供如图2C所示的第二基板200,并在温度介于180℃~220℃的条件下使第二基板200的背面201如第2D图所示般贴合于第一基板100的上表面(未标示),使前述树脂组合物300夹于第一基板100上的层离型材400与第二基板200之间。
综上所述,根据本发明所公开的同时含有磺酰基、-X-R3-X-及环氧官能基封端的聚砜高分子的树脂组合物,在半导体基板低温贴合时可赋予优异的贴合效果,且在高温制程时也不会有明显的溢流现象,有效解决现有胶材的缺点,适合作为半导体基板贴合时的胶材。
虽然本发明已以优选实施例揭露如上,然其并非用以限定本发明,任何所属技术领域中的技术人员在不脱离本发明的精神和范围内,应可更改与组合上述各种实施例。
Claims (15)
3.如权利要求1或2所述的聚砜高分子,其中式(I-a)结构中同时具有酯基及羟基取代的连接基是以二羧酸类化合物的酸基与含磺酰基的二环氧化物的环氧基反应而成。
5.如权利要求3所述的聚砜高分子,该二羧酸选自顺-丁烯二酸、反-丁烯二酸、草酰乙酸、己二酸、己二酸衍生物、戊二酸、戊二酸衍生物、琥珀酸、丙二酸、丙二酸衍生物、庚二酸、1,8-辛二酸、壬二酸、癸二酸、酮庚二酸、4,4'-二苯醚二甲酸、顺-4-环己烯-1,2-二羧酸、反-4-环己烯-1,2-二羧酸。
6.一种制造如权利要求3所述的聚砜高分子的方法,其步骤包括:
提供包含二羧酸与含磺酰基的二环氧化物的反应混合物,且该含磺酰基的二环氧化物与该二羧酸的当量比值大于1;
将该反应混合物加入溶剂内,并加热使该反应混合物内的该二羧酸与该含磺酰基的二环氧化物在催化剂存在下进行聚合反应;以及
确认该反应混合物中的该二羧酸已完全反应完毕后,停止加热及聚合反应。
8.如权利要求7所述的树脂组合物,该有机溶剂包含N-甲基吡咯烷酮、N-乙基吡咯烷酮、丙二醇甲醚醋酸酯、二甲基乙酰胺、二甲基甲酰胺、二甲基亚砜、丙二醇单甲基醚、四氢呋喃、γ-丁内酯中至少一种或其组合。
9.如权利要求7至8中任一项所述的树脂组合物,其进一步包含流平剂、助溶剂、界面活性剂、硅烷偶合剂中的至少一种。
10.一种基板贴合方法,其步骤包括:
提供第一基板;
提供如权利要求7至9中任一项所述的树脂组合物,并将该树脂组合物涂布于该第一基板表面;
实施加热处理,以移除该树脂组合物内的有机溶剂;以及
提供第二基板,使该第二基板贴合于该第一基板上,且该树脂夹于该第一基板与该第二基板之间。
11.如权利要求10所述的基板贴合方法,该加热处理步骤的温度为80℃~180℃。
12.如权利要求10所述的基板贴合方法,该第二基板贴合至该第一基板上的步骤在温度180℃~220℃的环境下进行。
13.如权利要求10所述的基板贴合方法,在该树脂组合物涂布于该第一基板表面的步骤进行前,还包括在该第一基板表面上形成表面处理层的步骤。
14.如权利要求13所述的基板贴合方法,该表面处理层为层离型材,该层离型材包含压克力系树脂、聚酰亚胺、聚酰胺、聚酰胺酸、聚苯并噁唑中的一者或其组合。
15.如权利要求14所述的基板贴合方法,该层离型材还包含多个无机粒子。
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US20190382534A1 (en) | 2019-12-19 |
TW202000743A (zh) | 2020-01-01 |
JP6909822B2 (ja) | 2021-07-28 |
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