CN110591582A - 一种uv后易揭离的oled模组制程用的过程膜生产方法及其产品 - Google Patents

一种uv后易揭离的oled模组制程用的过程膜生产方法及其产品 Download PDF

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CN110591582A
CN110591582A CN201910893291.4A CN201910893291A CN110591582A CN 110591582 A CN110591582 A CN 110591582A CN 201910893291 A CN201910893291 A CN 201910893291A CN 110591582 A CN110591582 A CN 110591582A
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adhesive layer
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oled module
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孙攀
王健
牛建超
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Shanghai Jingjing New Materials Co Ltd
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Abstract

本发明公开了一种UV后易揭离的OLED模组制程用的过程膜生产方法及其产品，过程膜包括：基材、压敏胶层和离型膜，所述基材厚度为25‑200μm，至少在基材的一面经过电晕处理后，使电晕面表面张力≥48dyn；所述的压敏胶层涂布在所述基材的电晕处理面，涂布厚度为3—30μm，UV前剥离力为100—5000g/25mm，UV后的剥离力为0—10g/25mm；离型膜覆盖在压敏胶层上。本发明所述OLED模组制程用的过程膜在普通UV减粘膜的基础上增加了胶层在UV照射后表面张力很小的特性，使得制程中UV前胶层贴合紧密、而UV照射后在揭离时较为省力，从而提高产品良率，目前主要应用于OLED模组的模组转移过程。

Description

一种UV后易揭离的OLED模组制程用的过程膜生产方法及其 产品
技术领域
本发明涉及胶带领域，具体是涉及一种UV后易揭离的OLED模组制程用的过程膜。
背景技术
OLED模组制程用的过程膜，需要具有超高的粘力，以保证OLED模组在加工处理过程中保持稳定、不脱落、不飞边，并保护未加工部分。而在加工完毕后只要照射足够的UV光线，即可大幅度减低其粘力和胶层表面张力，使得制程中膜转移时，可以轻易撕开该过程膜和转移膜的贴合，使得OLED模组可以在下一道生产工序正常使用。
申请号：201810106104.9涉及保护膜技术领域，尤其是涉及一种UV减粘组合物、UV减粘膜及其制备方法。所述UV减粘组合物主要由按重量百分比计的如下原料制成：丙烯酸酯压敏胶树脂20％-50％、多官能度低聚物和/或多官能度单体1％-30％、交联剂0.3％-2％、抗静电剂0.1％-5％、分散剂0-2％、流平剂0.2％-2％、光引发剂0.5％-5％和溶剂25％-60％。所述UV减粘膜包括依次贴合的基材层、UV减粘层和离型膜层，所述UV减粘层是由所述UV减粘组合物涂布于基材层表面，烘干熟化得到的。所述UV减粘组合物，具有优异的粘合力，UV照射前具有高粘合力，剥离力高，UV照射后具有低粘合力，UV剥离力低，抗静电效果好。
实用新型专利号：ZL201420369939.0涉及保护膜领域，尤其涉及一种UV减粘保护膜。该UV减粘保护膜包括PET基材层、设于PET基材层上方的UV减粘粘胶剂层以及设于UV减粘粘胶剂层上方的PET离型膜层。该UV减粘保护膜具有UV光照射前超高粘性，UV光照射后超低粘性的优良性能，降低产品的成本，并且具有较高的制程良率，在半导体晶圆切割、打磨表面保护、触控屏OGS二次强化耐酸膜等产品方面得到广泛应用。
申请号：201810105862.9涉及保护膜技术领域，尤其是涉及一种UV减粘组合物、UV减粘膜及其制备方法。所述UV减粘组合物主要由按重量百分比计的如下原料制成：丙烯酸酯压敏胶树脂20％-50％、多官能度低聚物和/或多官能度单体1％-30％、交联剂0.3％-2％、热引发剂0.1％-5％、光引发剂0.5％-5％和溶剂25％-60％。所述UV减粘膜包括依次贴合的基材层、UV减粘层和离型膜层，其中，所述UV减粘层是由所述UV减粘组合物涂布于基材层表面，烘干熟化得到的。所述UV减粘组合物，具有优异的粘合力，UV照射前具有高粘合力，剥离力高，UV照射后具有低粘合力，UV剥离力低，并且长时间储存后不留残胶。
申请号：201710242271.1提供了一种耐热型UV减粘膜，依次包括基材层、UV光敏胶黏剂层和离型膜层。还提供了一种所述UV光敏胶黏剂层的制备方法，按重量百分比计包括组分：30-50％溶剂型耐高温聚丙烯酸酯压敏胶粘剂、1-25％低分子混合添加剂、0.1-3％双官能团或多官能团特殊添加剂、0.1-1.5％光引发剂、0.5-2％硬化剂、35-60％溶剂。还提供了一种所述耐热型UV减粘膜的制备方法。本发明不仅提高了UV光敏胶黏剂对电晕PET基材的密着性和耐高温性能，且减少了底涂层处理技术，优化了产品结构。
然而传统的支撑体保护膜均未考虑UV后胶层表面张力的问题，在膜转移过程中，当UV后的膜与转移用膜进行模组转移时，很难将两者撕离，从而造成转移不彻底或对OLED模组产生不良影响，进而影响成品率。减小UV后胶层表面张力会有效的杜绝这种情况产生，提高生产效率。
发明内容
针对现有技术的不足，本发明提供了一种UV后易揭离的OLED模组制程用的过程膜的生产方法，以有效的解决OLED模组在膜转移过程中出现的撕离困难等问题。
本发明的再一目的在于：提供一种上述方法制备的产品。
本发明目的通过下述方案实现：一种UV后易揭离的OLED模组制程用过程膜的生产方法，过程膜包括：基材、压敏胶层和离型膜，其中，
所述基材为PET、PO、PVC或PP等光学薄膜，厚度为25-200μm，至少在基材的一面经过电晕处理后，使电晕面表面张力≥48dyn；
所述的压敏胶层涂布在所述基材的电晕处理面，涂布厚度为3—30μm，UV前剥离力为100—5000g/25mm，UV后的剥离力为0—10g/25mm；
所述的离型膜覆盖在所述压敏胶层上，使压敏胶层与离型膜的离型面进行覆合。
本发明中所述基材为PET、PO、PVC或PP等光学薄膜，可以根据基材柔软度、挺度、光学性能的不同有效满足不同工艺环境下不同尺寸、不同外形OLED模组的保护需求。
所述压敏胶层可针对不同工艺环境、不同尺寸和贴覆材料的模组选择不同的剥离力范围，保证制程及模组转移过程的稳定性。
进一步的，本发明所述的UV后易揭离的OLED模组制程用过程膜的生产方法，包括以下步骤：
（a）将基材进行单面电晕处理，将电晕好的膜材放置一段时间；
（b）；在基材的电晕面涂布压敏胶层并复合离型，制得料膜；
（c）将生产完成的料膜进行熟化处理。
其中，在步骤（a）中，所述放置时间不少于3天（d），放置环境为室温或40-60℃高温，目的使电晕产生的臭氧充分分解，防止对后段生产造成影响。
在步骤（c）中，所述熟化时间为3—10天，放置环境为室温或40-60℃高温，待其剥离力稳定，即熟化完成。
在上述方案基础上，所述压敏胶层中含有光引发剂，该光引发剂满足吸收波长在100—400nm，添加比例为所述压敏胶层质量的0.1—5%；含有低表面张力改性的纳米玻璃纤维，添加比例为所述压敏胶层质量的0.1—10%。压敏胶层中添加低表面张力改性纳米玻璃纤维对UV光较为敏感，UV前在压敏胶中分散性好，UV后易聚集于压敏胶表层，从而降低与被贴物的粘力。
所述压敏胶层中含有光引发剂，根据客户使用波长及能量的不同，选择不同种类及添加量的光引发剂；所述压敏胶层中含有低表面张力改性纳米玻璃纤维，根据客户方被贴物的类型及模组转移过程选用UV膜的不同来选择合适的添加量。
所述离型膜（3）为具有离型性能的PET，厚度为25—150um，以达到保护压敏胶层的作用。
本发明还提供一种UV后易揭离的OLED模组制程用的过程膜，根据上述的生产方法制备得到的。
本发明优越性在于：本发明所述OLED模组制程用的过程膜在普通UV减粘膜的基础上增加了胶层在UV照射后表面张力很小的特性，使得制程中UV前胶层贴合紧密、而UV照射后在揭离时较为省力，从而提高产品良率，主要应用于OLED模组的模组转移过程。
附图说明
图1本发明UV后易揭离的OLED模组制程用的过程膜的结构示意图；
图2是一种UV后易揭离的OLED模组制程用的过程膜的制备流程图；
图中标号说明：
1——基材；
2——压敏胶层；
3——离型膜。
具体实施方式
以下结合附图对本发明作进一步详细描述，本发明上述特征和优点将会变得更加清楚和容易理解。
一种UV后易揭离的OLED模组制程用过程膜如图1所示，包括：基材1、压敏胶层2和离型膜3。UV后易揭离的OLED模组制程用过程膜的生产方法如图2所示：
（a）所述基材1选自PET、PO、PVC或PP光学薄膜，厚度为25-200μm，将基材的单面进行电晕处理，使电晕面表面张力≥48dyn；
（b）将电晕好的基材1在室温或40-60℃放置不少于3d；
（c）在基材1的电晕面涂布厚度为3—30μm压敏胶，UV前剥离力为100—5000g/25mm，UV后的剥离力为0—10g/25mm，涂布后形成的压敏胶层2与离型膜3的离型面进行覆合，得到料膜；
（d）将生产完成的料膜进行熟化处理，在室温或40-60℃高温熟化3—10天。
本发明的压敏胶层2中含有光引发剂，该光引发剂满足吸收波长在200—400nm，添加比例为所述压敏胶层2质量的0.1—5%；含有低表面张力改性的纳米玻璃纤维，添加比例为所述压敏胶层2质量的0.1—10%。
所述离型膜3为具有离型性能的PET，厚度为25—150um。
本发明所提供的UV后易揭离的OLED模组制程用的过程膜可保证OLED模组在加工处理过程中保持稳定、不脱落、不飞边，并保护未加工部分。而在加工完毕后只要照射足够的UV光线，即可大幅度减低其粘力和胶层表面张力，使得制程中膜转移时，可以轻易撕开UV前及UV后两张膜的贴合，并且不会对模组本身造成污染，可有效杜绝模组转移过程两膜撕离困难问题。

Claims (7)

1.一种UV后易揭离的OLED模组制程用过程膜的生产方法，过程膜包括：基材（1）、压敏胶层（2）和离型膜（3），其特征在于，
所述基材（1）为PET、PO、PVC或PP光学薄膜，厚度为25-200μm，至少在基材（1）的一面经过电晕处理后，使电晕面表面张力≥48dyn；
所述的压敏胶层涂布在所述基材（1）的电晕处理面，涂布厚度为3—30μm，UV前剥离力为100—5000g/25mm，UV后的剥离力为0—10g/25mm；
离型膜（3）覆盖在所述压敏胶层（2）上，使压敏胶层（2）与离型膜（3）的离型面进行覆合。
2.根据权利要求1所述的UV后易揭离的OLED模组制程用过程膜的生产方法，其特征在于：包括以下步骤：
（a）将基材（1）进行单面电晕处理，将电晕好的膜材放置一段时间；
（b）；在基材（1）的电晕面涂布压敏胶层（2）并复合离型（3），制得料膜；
（c）将料膜进行熟化处理。
3.如权利要求2所述的UV后易揭离的OLED模组制程用的过程膜的生产方法，其特征在于：在步骤（a）中，所述放置时间不少于3d，放置环境为室温或40-60℃高温。
4.如权利要求2所述的UV后易揭离的OLED模组制程用的过程膜的生产方法，其特征在于：在步骤（c）中，所述熟化时间为3—10天，放置环境为室温或40-60℃高温。
5.如权利要求1或2所述的UV后易揭离的OLED模组制程用的过程膜的生产方法，其特征在于：所述压敏胶层（2）中含有光引发剂，该光引发剂满足吸收波长在200—400nm，添加比例为所述压敏胶层（2）质量的0.1—5%；含有低表面张力改性的纳米玻璃纤维，添加比例为所述压敏胶层（2）质量的0.1—10%。
6.如权利要求1或2所述的UV后易揭离的OLED模组制程用的过程膜的生产方法，其特征在于：所述离型膜（3）为具有离型性能的PET，厚度为25—150um。
7.一种UV后易揭离的OLED模组制程用的过程膜，如权利要求1至6任一项所述的生产方法制备得到的。
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