CN110576567B - 树脂成形装置及树脂成形品的制造方法 - Google Patents

树脂成形装置及树脂成形品的制造方法 Download PDF

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Publication number
CN110576567B
CN110576567B CN201910487033.6A CN201910487033A CN110576567B CN 110576567 B CN110576567 B CN 110576567B CN 201910487033 A CN201910487033 A CN 201910487033A CN 110576567 B CN110576567 B CN 110576567B
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China
Prior art keywords
molding die
projecting
molded
molding
die
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CN201910487033.6A
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English (en)
Chinese (zh)
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CN110576567A (zh
Inventor
高桥高史
尾川敬祐
金丸浩之
熊见裕树
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Towa Corp
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Towa Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/4005—Ejector constructions; Ejector operating mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14122—Positioning or centering articles in the mould using fixed mould wall projections for centering the insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
CN201910487033.6A 2018-06-08 2019-06-05 树脂成形装置及树脂成形品的制造方法 Active CN110576567B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018110281A JP7102238B2 (ja) 2018-06-08 2018-06-08 樹脂成形装置および樹脂成形品の製造方法
JP2018-110281 2018-06-08

Publications (2)

Publication Number Publication Date
CN110576567A CN110576567A (zh) 2019-12-17
CN110576567B true CN110576567B (zh) 2021-08-03

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CN201910487033.6A Active CN110576567B (zh) 2018-06-08 2019-06-05 树脂成形装置及树脂成形品的制造方法

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Country Link
JP (1) JP7102238B2 (enExample)
CN (1) CN110576567B (enExample)
MY (1) MY195116A (enExample)
PH (1) PH12019000190B1 (enExample)
TW (1) TWI730336B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110884071B (zh) * 2019-12-24 2025-07-25 上海亿泊材料应用技术有限公司 一种注塑模具
JP7360369B2 (ja) * 2020-08-28 2023-10-12 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7447050B2 (ja) * 2021-04-21 2024-03-11 Ｔｏｗａ株式会社 成形型、樹脂成形装置及び樹脂成形品の製造方法
JP7683323B2 (ja) 2021-05-24 2025-05-27 セイコーエプソン株式会社 射出成形システム、および、製造システム
JP2023048344A (ja) * 2021-09-28 2023-04-07 セイコーエプソン株式会社 射出成形システム
JP2023092241A (ja) * 2021-12-21 2023-07-03 Ｉ－Ｐｅｘ株式会社 樹脂封止装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6382717A (ja) * 1986-09-26 1988-04-13 Yazaki Corp トランスファー成形型の金型装置
US5074779A (en) * 1990-01-23 1991-12-24 Mitsubishi Denki Kabushiki Kaisha Mold for resin-sealing a semiconductor device
JPH08155960A (ja) * 1994-11-28 1996-06-18 Towa Kk 電子部品の樹脂封止成形用金型
CN104427845A (zh) * 2013-08-20 2015-03-18 东和株式会社 基板运送供给方法及基板运送供给装置
CN104517863A (zh) * 2013-09-26 2015-04-15 精工电子有限公司 半导体制造装置
CN105283289A (zh) * 2013-06-14 2016-01-27 山田尖端科技株式会社 树脂模塑用模组和树脂模塑装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0713985B2 (ja) * 1988-02-05 1995-02-15 三菱電機株式会社 半導体装置の樹脂封止成形装置
JPH03110845U (enExample) * 1990-02-27 1991-11-13
JPH06132336A (ja) * 1992-10-16 1994-05-13 Nippon Steel Corp トランスファモールド装置
JP2004253412A (ja) 2003-02-18 2004-09-09 Towa Corp 電子部品の樹脂封止成形方法及び装置
JP4503391B2 (ja) 2004-08-06 2010-07-14 株式会社ルネサステクノロジ 半導体装置の製造方法
WO2014192456A1 (ja) * 2013-05-29 2014-12-04 アピックヤマダ株式会社 樹脂モールド装置および樹脂モールド方法
JP6067832B1 (ja) * 2015-12-24 2017-01-25 エムテックスマツムラ株式会社 樹脂成形金型及び樹脂成形装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6382717A (ja) * 1986-09-26 1988-04-13 Yazaki Corp トランスファー成形型の金型装置
US5074779A (en) * 1990-01-23 1991-12-24 Mitsubishi Denki Kabushiki Kaisha Mold for resin-sealing a semiconductor device
JPH08155960A (ja) * 1994-11-28 1996-06-18 Towa Kk 電子部品の樹脂封止成形用金型
CN105283289A (zh) * 2013-06-14 2016-01-27 山田尖端科技株式会社 树脂模塑用模组和树脂模塑装置
CN104427845A (zh) * 2013-08-20 2015-03-18 东和株式会社 基板运送供给方法及基板运送供给装置
CN104517863A (zh) * 2013-09-26 2015-04-15 精工电子有限公司 半导体制造装置

Also Published As

Publication number Publication date
MY195116A (en) 2023-01-11
PH12019000190B1 (en) 2024-05-29
JP2019209665A (ja) 2019-12-12
JP7102238B2 (ja) 2022-07-19
TWI730336B (zh) 2021-06-11
PH12019000190A1 (en) 2020-01-27
CN110576567A (zh) 2019-12-17
TW202000417A (zh) 2020-01-01

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