PH12019000190B1 - Resin molding apparatus and method for manufacturing resin molded product - Google Patents

Resin molding apparatus and method for manufacturing resin molded product

Info

Publication number
PH12019000190B1
PH12019000190B1 PH1/2019/000190A PH12019000190A PH12019000190B1 PH 12019000190 B1 PH12019000190 B1 PH 12019000190B1 PH 12019000190 A PH12019000190 A PH 12019000190A PH 12019000190 B1 PH12019000190 B1 PH 12019000190B1
Authority
PH
Philippines
Prior art keywords
mold chase
molding apparatus
resin molding
lower mold
molded product
Prior art date
Application number
PH1/2019/000190A
Other languages
English (en)
Other versions
PH12019000190A1 (en
Inventor
Hiroyuki Kanamaru
Hiroki Kumami
Keisuke Ogawa
Takafumi Takahashi
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of PH12019000190A1 publication Critical patent/PH12019000190A1/en
Publication of PH12019000190B1 publication Critical patent/PH12019000190B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/4005—Ejector constructions; Ejector operating mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14122—Positioning or centering articles in the mould using fixed mould wall projections for centering the insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
PH1/2019/000190A 2018-06-08 2019-05-16 Resin molding apparatus and method for manufacturing resin molded product PH12019000190B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018110281A JP7102238B2 (ja) 2018-06-08 2018-06-08 樹脂成形装置および樹脂成形品の製造方法

Publications (2)

Publication Number Publication Date
PH12019000190A1 PH12019000190A1 (en) 2020-01-27
PH12019000190B1 true PH12019000190B1 (en) 2024-05-29

Family

ID=68810791

Family Applications (1)

Application Number Title Priority Date Filing Date
PH1/2019/000190A PH12019000190B1 (en) 2018-06-08 2019-05-16 Resin molding apparatus and method for manufacturing resin molded product

Country Status (5)

Country Link
JP (1) JP7102238B2 (enExample)
CN (1) CN110576567B (enExample)
MY (1) MY195116A (enExample)
PH (1) PH12019000190B1 (enExample)
TW (1) TWI730336B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110884071B (zh) * 2019-12-24 2025-07-25 上海亿泊材料应用技术有限公司 一种注塑模具
JP7360369B2 (ja) * 2020-08-28 2023-10-12 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7447050B2 (ja) * 2021-04-21 2024-03-11 Ｔｏｗａ株式会社 成形型、樹脂成形装置及び樹脂成形品の製造方法
JP7683323B2 (ja) 2021-05-24 2025-05-27 セイコーエプソン株式会社 射出成形システム、および、製造システム
JP2023048344A (ja) * 2021-09-28 2023-04-07 セイコーエプソン株式会社 射出成形システム
JP2023092241A (ja) * 2021-12-21 2023-07-03 Ｉ－Ｐｅｘ株式会社 樹脂封止装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6382717A (ja) * 1986-09-26 1988-04-13 Yazaki Corp トランスファー成形型の金型装置
JPH0713985B2 (ja) * 1988-02-05 1995-02-15 三菱電機株式会社 半導体装置の樹脂封止成形装置
JP2635193B2 (ja) * 1990-01-23 1997-07-30 三菱電機株式会社 半導体装置の樹脂封止装置、樹脂封止方法及び樹脂封止型半導体装置
JPH03110845U (enExample) * 1990-02-27 1991-11-13
JPH06132336A (ja) * 1992-10-16 1994-05-13 Nippon Steel Corp トランスファモールド装置
JP3611612B2 (ja) * 1994-11-28 2005-01-19 Ｔｏｗａ株式会社 電子部品の樹脂封止成形用金型
JP2004253412A (ja) 2003-02-18 2004-09-09 Towa Corp 電子部品の樹脂封止成形方法及び装置
JP4503391B2 (ja) 2004-08-06 2010-07-14 株式会社ルネサステクノロジ 半導体装置の製造方法
WO2014192456A1 (ja) * 2013-05-29 2014-12-04 アピックヤマダ株式会社 樹脂モールド装置および樹脂モールド方法
JP6062810B2 (ja) * 2013-06-14 2017-01-18 アピックヤマダ株式会社 樹脂モールド金型及び樹脂モールド装置
JP5934156B2 (ja) * 2013-08-20 2016-06-15 Ｔｏｗａ株式会社 基板の搬送供給方法及び基板の搬送供給装置
JP6321482B2 (ja) * 2013-09-26 2018-05-09 エイブリック株式会社 半導体製造装置
JP6067832B1 (ja) * 2015-12-24 2017-01-25 エムテックスマツムラ株式会社 樹脂成形金型及び樹脂成形装置

Also Published As

Publication number Publication date
MY195116A (en) 2023-01-11
JP2019209665A (ja) 2019-12-12
JP7102238B2 (ja) 2022-07-19
TWI730336B (zh) 2021-06-11
PH12019000190A1 (en) 2020-01-27
CN110576567A (zh) 2019-12-17
TW202000417A (zh) 2020-01-01
CN110576567B (zh) 2021-08-03

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