CN110573840B - 传感器封装 - Google Patents

传感器封装 Download PDF

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Publication number
CN110573840B
CN110573840B CN201880028109.2A CN201880028109A CN110573840B CN 110573840 B CN110573840 B CN 110573840B CN 201880028109 A CN201880028109 A CN 201880028109A CN 110573840 B CN110573840 B CN 110573840B
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China
Prior art keywords
sensor
sensor chip
sensor package
contact pad
height
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CN201880028109.2A
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English (en)
Chinese (zh)
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CN110573840A (zh
Inventor
W·亨齐克
D·普斯坦
M·伯勒
S·布劳恩
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Sensirion AG
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Sensirion AG
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Publication of CN110573840A publication Critical patent/CN110573840A/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/0004—Gaseous mixtures, e.g. polluted air
    • G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
    • G01N33/0027—General constructional details of gas analysers, e.g. portable test equipment concerning the detector
    • G01N33/0036—General constructional details of gas analysers, e.g. portable test equipment concerning the detector specially adapted to detect a particular component

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Food Science & Technology (AREA)
  • Combustion & Propulsion (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Pressure Sensors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN201880028109.2A 2017-04-28 2018-04-24 传感器封装 Active CN110573840B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP17168692.6 2017-04-28
EP17168692.6A EP3396329A1 (fr) 2017-04-28 2017-04-28 Emballage de capteur
PCT/EP2018/060467 WO2018197484A1 (fr) 2017-04-28 2018-04-24 Boîtier de capteur

Publications (2)

Publication Number Publication Date
CN110573840A CN110573840A (zh) 2019-12-13
CN110573840B true CN110573840B (zh) 2021-08-20

Family

ID=58668749

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880028109.2A Active CN110573840B (zh) 2017-04-28 2018-04-24 传感器封装

Country Status (4)

Country Link
US (1) US10989571B2 (fr)
EP (2) EP3396329A1 (fr)
CN (1) CN110573840B (fr)
WO (1) WO2018197484A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11387155B2 (en) * 2019-12-12 2022-07-12 Texas Instruments Incorporated IC having a metal ring thereon for stress reduction
US20220270960A1 (en) * 2021-02-23 2022-08-25 Texas Instruments Incorporated Open-Cavity Package for Chip Sensor

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CN101038909A (zh) * 2006-03-18 2007-09-19 Atmel德国有限公司 电子部件,电子组件以及用于制造电子组件的方法
US20080009102A1 (en) * 2006-07-07 2008-01-10 Advanced Semiconductor Engineering Inc. Method for Encasulating Sensor Chips
CN101110401A (zh) * 2006-07-19 2008-01-23 台湾积体电路制造股份有限公司 半导体装置及半导体封装结构
US20080246133A1 (en) * 2007-04-05 2008-10-09 Micron Technology, Inc. Flip-chip image sensor packages and methods of fabricating the same
CN101339927A (zh) * 2007-07-02 2009-01-07 英飞凌科技股份有限公司 半导体器件
US20100164082A1 (en) * 2008-12-26 2010-07-01 Renesas Technology Corp. Manufacturing method for semiconductor devices and semiconductor device
CN103579258A (zh) * 2012-07-18 2014-02-12 宏翔光电股份有限公司 基板内嵌式模块结构
CN103843133A (zh) * 2011-07-03 2014-06-04 联达科技控股有限公司 具有热熔接封装部件的引线载体
CN105158299A (zh) * 2014-06-06 2015-12-16 盛思锐股份公司 用于制造气体传感器封装的方法
CN105277594A (zh) * 2014-06-06 2016-01-27 盛思锐股份公司 气体传感器封装件

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JPH04258176A (ja) * 1991-02-12 1992-09-14 Mitsubishi Electric Corp 半導体圧力センサ
US6266197B1 (en) * 1999-12-08 2001-07-24 Amkor Technology, Inc. Molded window array for image sensor packages
US6492699B1 (en) * 2000-05-22 2002-12-10 Amkor Technology, Inc. Image sensor package having sealed cavity over active area
US6629633B1 (en) * 2000-11-13 2003-10-07 Amkor Technology, Inc. Chip size image sensor bumped package fabrication method
US6624921B1 (en) * 2001-03-12 2003-09-23 Amkor Technology, Inc. Micromirror device package fabrication method
US6667543B1 (en) * 2002-10-29 2003-12-23 Motorola, Inc. Optical sensor package
US6995462B2 (en) * 2003-09-17 2006-02-07 Micron Technology, Inc. Image sensor packages
DE102004003413A1 (de) * 2004-01-23 2005-08-11 Robert Bosch Gmbh Verfahren zum Verpacken von Halbleiterchips und entsprechende Halbleiterchipanordnung
TWI303094B (en) * 2005-03-16 2008-11-11 Yamaha Corp Semiconductor device, method for manufacturing semiconductor device, and cover frame
TWI327769B (en) * 2006-12-29 2010-07-21 Ind Tech Res Inst A packaging structure of pressure sensor and a method therefor
US20080191333A1 (en) * 2007-02-08 2008-08-14 Advanced Chip Engineering Technology Inc. Image sensor package with die receiving opening and method of the same
CN104736984B (zh) * 2012-11-30 2017-09-08 富士电机株式会社 压力传感器装置及压力传感器装置的制造方法
US20150090030A1 (en) * 2013-09-27 2015-04-02 Infineon Technologies Ag Transducer arrangement comprising a transducer die and method of covering a transducer die
CN206136291U (zh) * 2015-06-30 2017-04-26 意法半导体股份有限公司 微机电麦克风和电子系统

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101038909A (zh) * 2006-03-18 2007-09-19 Atmel德国有限公司 电子部件,电子组件以及用于制造电子组件的方法
US20080009102A1 (en) * 2006-07-07 2008-01-10 Advanced Semiconductor Engineering Inc. Method for Encasulating Sensor Chips
CN101110401A (zh) * 2006-07-19 2008-01-23 台湾积体电路制造股份有限公司 半导体装置及半导体封装结构
US20080246133A1 (en) * 2007-04-05 2008-10-09 Micron Technology, Inc. Flip-chip image sensor packages and methods of fabricating the same
CN101339927A (zh) * 2007-07-02 2009-01-07 英飞凌科技股份有限公司 半导体器件
US20100164082A1 (en) * 2008-12-26 2010-07-01 Renesas Technology Corp. Manufacturing method for semiconductor devices and semiconductor device
CN103843133A (zh) * 2011-07-03 2014-06-04 联达科技控股有限公司 具有热熔接封装部件的引线载体
CN103579258A (zh) * 2012-07-18 2014-02-12 宏翔光电股份有限公司 基板内嵌式模块结构
CN105158299A (zh) * 2014-06-06 2015-12-16 盛思锐股份公司 用于制造气体传感器封装的方法
CN105277594A (zh) * 2014-06-06 2016-01-27 盛思锐股份公司 气体传感器封装件

Also Published As

Publication number Publication date
EP3601957B1 (fr) 2020-04-15
EP3601957A1 (fr) 2020-02-05
WO2018197484A1 (fr) 2018-11-01
US20200182661A1 (en) 2020-06-11
CN110573840A (zh) 2019-12-13
US10989571B2 (en) 2021-04-27
EP3396329A1 (fr) 2018-10-31

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