CN110573002B - Eight chip mounter suitable for multiple substrate diaphragm - Google Patents

Eight chip mounter suitable for multiple substrate diaphragm Download PDF

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Publication number
CN110573002B
CN110573002B CN201910955127.1A CN201910955127A CN110573002B CN 110573002 B CN110573002 B CN 110573002B CN 201910955127 A CN201910955127 A CN 201910955127A CN 110573002 B CN110573002 B CN 110573002B
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China
Prior art keywords
supporting platform
screws
plate
mounting
plates
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CN201910955127.1A
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Chinese (zh)
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CN110573002A (en
Inventor
刘春伟
郝晶
雷振
李四化
汪海龙
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Shenzhen Kaiyang Automation Equipment Co ltd
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Shenzhen Kaiyang Automation Equipment Co ltd
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Priority to CN201910955127.1A priority Critical patent/CN110573002B/en
Publication of CN110573002A publication Critical patent/CN110573002A/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans

Abstract

The invention relates to the technical field of chip mounters, in particular to an eight-head chip mounter suitable for multiple base material membranes, which comprises a supporting platform, wherein a plurality of supporting bases are installed at the bottom of the supporting platform through screws, a PLC (programmable logic controller) is installed on the side surface of the supporting platform through screws, two longitudinal moving mechanisms are arranged on the upper surface of the supporting platform, a transverse moving mechanism is installed between the two longitudinal moving mechanisms through two third fixing plates, a chip mounter is installed at the bottom of the transverse moving mechanism through an electric cylinder, an object clamping mechanism is arranged at the top of the supporting platform, and a cover body is installed at four side edges of the top of the supporting platform through screws. According to the invention, the cover body, the through hole and the filtering sponge are arranged on the chip mounter, so that the circuit main board is protected while the chip mounter radiates heat, and the filtering sponge is arranged to filter dust mixed during air flowing, so that the processing quality of the circuit main board is improved.

Description

Eight chip mounter suitable for multiple substrate diaphragm
Technical Field
The invention relates to the field of chip mounters, in particular to an eight-head chip mounter suitable for multiple base material diaphragms.
Background
The chip mounter is used for pasting electrical components on the circuit main board, however, current eight chip mounters can produce a large amount of heats at the in-process that uses, if carry out radiating in-process through external equipment, can produce the air flow, consequently, cause the dust adhesion in the air on the circuit main board easily at radiating in-process to influence the processingquality of circuit main board.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides an eight-head chip mounter suitable for multiple base material membranes.
In order to achieve the above purposes, the technical scheme adopted by the invention is as follows: an eight-head chip mounter suitable for multiple base material diaphragms comprises a supporting platform, wherein a plurality of supporting bases are mounted at the bottom of the supporting platform through screws, a PLC (programmable logic controller) is mounted on the side face of the supporting platform through screws, two longitudinal moving mechanisms are arranged on the upper surface of the supporting platform, a transverse moving mechanism is mounted between the two longitudinal moving mechanisms through two third fixing plates, a chip mounting mechanism is mounted at the bottom of the transverse moving mechanism through an electric cylinder, an article clamping mechanism is arranged at the top of the supporting platform, a cover body is mounted along four side edges of the top of the supporting platform through screws, a through hole is formed in the outer part of the cover body, filter sponges are matched and bonded in the through hole, the longitudinal moving mechanism, the transverse moving mechanism and the article clamping mechanism are embedded in the inner wall of the cover body, and a plurality of heat dissipation ports are formed in the top of the supporting, the top of the supporting platform is provided with a plurality of cooling fans corresponding to the plurality of cooling ports through a connecting mechanism, and the PLC is respectively connected with the longitudinal moving mechanism, the transverse moving mechanism, the cooling fans and the electric cylinder through leads; the longitudinal moving mechanism comprises a second slide rail, the second slide rail is mounted at the top of the supporting platform through screws, first mounting plates are mounted at two ends of the second slide rail through screws, a second lead screw penetrates between the two first mounting plates, a second servo motor is mounted at one end of the second lead screw through a coupler, a second support plate is mounted at the bottom of the second servo motor through screws, one end of the second support plate is welded at the side face of the first mounting plate, the second servo motor is connected with the PLC through a lead wire, a second sliding block is arranged on the second slide rail and enables the second sliding block to slide along the second slide rail, a mounting block is welded at the top of the second sliding block, a second screwed pipe penetrates through the inside of the mounting block and is mounted through screws, the second screwed pipe is sleeved outside the second lead screw, and one end of a third fixing plate is mounted at the side face of the mounting block through screws, the lateral wall of the cover body is embedded on the two first mounting plates.
Preferably, the transverse moving mechanism comprises a third screw rod and two fixing rods, two ends of the two fixing rods are welded on the side surfaces of the two third fixing plates, the two fixing rods are positioned on two sides of the third screw rod, two ends of the third screw rod are respectively arranged in the two third fixing plates in a penetrating way, one end of the third screw rod is provided with a first servo motor through a coupler, a first supporting plate is arranged at the bottom of the first servo motor through a screw, one end of the first supporting plate is welded on the side surface of the third fixing plate, a third screw tube is sleeved on the surface of the third screw rod in a threaded manner, a movable block is sleeved outside the third screw tube, the two ends of the movable block are sleeved on the surfaces of the two fixed rods, so that the movable block slides along the surfaces of the fixed rods, one end of the electric cylinder is mounted at the bottom of the movable block through a screw, and the side wall of the cover body is embedded on the first supporting plate and the first servo motor.
Preferably, paster mechanism includes the fourth fixed plate, the expansion end welding of electronic jar has the fourth fixed plate, second mounting panel and third mounting panel have been welded respectively to the side of two symmetries on the fourth fixed plate, the upper surface of third mounting panel has the cylinder through the mounting screw, the top of second mounting panel is run through and has a plurality of paster heads through the mounting screw, the paster head is equipped with eight and equidistance and arranges, the cylinder passes through eight gas transmission hoses and is connected with eight paster heads respectively, and the PLC controller passes through the wire and is connected with the cylinder.
Preferably, the object clamping mechanism comprises two first slide rails and two second fixing plates, wherein the two first slide rails are symmetrically arranged, two stop blocks are arranged between the two first slide rails, first slide blocks are welded at the two ends of the two stop blocks, the two first slide blocks are connected to the surfaces of the two first slide rails in a sliding mode, the two second fixing plates are installed on the two symmetrical sides of the supporting platform through screws, the two second fixing plates are located between the two first slide rails, the two first screw pipes are arranged on the sides of the second fixing plates in a penetrating mode, first screw pipes are connected to the two first screw pipes through threads, one ends of the two first screw pipes are respectively in contact with the sides of the two stop blocks, holding plates are welded at the other ends of the two first screw pipes, and the side wall of the cover body is embedded in the two second fixing plates.
Preferably, openings are formed in two symmetrical side faces of the cover body, and transparent protection plates are bonded inside the openings in a matched mode.
Preferably, coupling mechanism includes two connecting plates, and two connecting plates are located the both sides of thermovent, and two connecting plates all pass through the mounting screw in supporting platform's bottom, and the welding has first fixed plate between two connecting plates, and a plurality of radiator fan run through and pass through the mounting screw at first fixed plate inner wall.
Preferably, a plurality of material storage trays are arranged at the top of the supporting platform and are symmetrically arranged.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the cover body, the through hole and the filtering sponge are arranged on the chip mounter, so that the circuit main board is protected while the chip mounter radiates heat, and the filtering sponge is arranged to filter dust mixed during air flowing, so that the processing quality of the circuit main board is improved.
Drawings
Fig. 1 is an isometric view of an eight head chip mounter adapted for multiple substrate diaphragms in accordance with the present invention;
FIG. 2 is a schematic view of the internal structure of FIG. 1;
FIG. 3 is a schematic bottom view of the structure of FIG. 1;
fig. 4 is an enlarged view of fig. 2.
In the figure: the device comprises a first fixing plate 1, a transparent protection plate 2, an opening 3, a first support plate 4, a second support plate 5, a second servo motor 6, a first servo motor 7, a cover body 8, a first mounting plate 9, a support platform 10, a second fixing plate 11, a support base 12, a PLC (programmable logic controller) 13, a holding plate 14, a first screw rod 15, a first solenoid 16, a first slide rail 17, a fixed rod 18, a third fixing plate 19, a mounting block 20, a second solenoid 21, a second slide block 22, a second screw rod 23, a second slide rail 24, a stop block 25, a first slide block 26, a movable block 27, a patch head 28, a second mounting plate 29, a heat dissipation opening 30, a fourth fixing plate 31, a third mounting plate 32, an air cylinder 33, a third solenoid 34, a connecting plate 35, a heat dissipation fan 36, a third screw rod 37, an electric cylinder 38, a material storage tray 39, a filter sponge 40 and a through hole 41.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art.
As shown in fig. 1-4, the eight-head chip mounter suitable for multiple base material membranes comprises a supporting platform 10, wherein a plurality of material storage trays 39 are arranged at the top of the supporting platform 10, the material storage trays 39 are symmetrically arranged, and the material storage trays 39 are used for placing base materials, so that the material storage trays 39 are arranged around an object clamping mechanism, and the base materials are conveniently sucked by a chip mounting mechanism.
The bottom of the supporting platform 10 is provided with a plurality of supporting bases 12 through screws, the side surface of the supporting platform 10 is provided with a PLC (programmable logic controller) 13 through screws, the upper surface of the supporting platform 10 is provided with two longitudinal moving mechanisms, each longitudinal moving mechanism comprises a second slide rail 24, each second slide rail 24 is arranged at the top of the supporting platform 10 through screws, two ends of each second slide rail 24 are respectively provided with a first mounting plate 9 through screws, a second lead screw 23 penetrates between the two first mounting plates 9, one end of each second lead screw 23 is provided with a second servo motor 6 through a coupler, the bottom of each second servo motor 6 is provided with a second supporting plate 5 through screws, one end of each second supporting plate 5 is welded at the side surface of each first mounting plate 9, each second servo motor 6 is connected with the PLC 13 through a lead wire, each second slide rail 24 is provided with a second slider 22, so that each second slider 22 slides along each second slide, the top of the second sliding block 22 is welded with an installation block 20, a second solenoid 21 penetrates through the installation block 20 and is installed through a screw, the second solenoid 21 is sleeved outside a second screw rod 23 in a threaded manner, one end of a third fixing plate 19 is installed on the side surface of the installation block 20 through a screw, the side walls of the cover body 8 are embedded on the two first installation plates 9, when the chip mounting head 28 is driven to move longitudinally, the PLC 13 controls the second servo motor 6 to work, the second servo motor 6 drives the second screw rod 23 to rotate, the second screw rod 23 drives the second screw tube 21 to rotate, since the second solenoid 21 is mounted to the mounting block 20, the mounting block 20 is restrained from rotation on the second slide rail 24 by the second slider 22, and therefore, when the second screw rod 23 rotates, the second screw rod 23 drives the mounting block 20 to move on the second slide rail 24 according to the principle of screw transmission, so as to drive the mounting head 28 to move in the longitudinal direction.
The transverse moving mechanism is arranged between the two longitudinal moving mechanisms through two third fixing plates 19 and comprises a third screw rod 37 and two fixing rods 18, two ends of the two fixing rods 18 are welded on the side surfaces of the two third fixing plates 19, the two fixing rods 18 are positioned on two sides of the third screw rod 37, two ends of the third screw rod 37 are arranged in the two third fixing plates 19 in a penetrating manner, one end of the third screw rod 37 is provided with a first servo motor 7 through a coupler, the bottom of the first servo motor 7 is provided with a first supporting plate 4 through a screw, one end of the first supporting plate 4 is welded on the side surface of the third fixing plate 19, the surface of the third screw rod 37 is sleeved with a third screwed pipe 34 in a threaded manner, a movable block 27 is sleeved outside the third screwed pipe 34, two ends of the movable block 27 are sleeved on the surfaces of the two fixing rods 18, so that the movable block 27 slides along the surfaces of, one end of the electric cylinder 38 is mounted at the bottom of the movable block 27 through a screw, the side wall of the cover body 8 is embedded on the first supporting plate 4 and the first servo motor 7, when the patch head 28 is driven to move transversely, the first servo motor 7 is controlled through the PLC 13, the first servo motor 7 drives the third screw rod 37 to rotate, the third screw rod 37 drives the movable block 27 to move on the two fixing rods 18 while rotating, and therefore the transverse movement of the patch head 28 is facilitated.
The bottom of the transverse moving mechanism is provided with a chip mounting mechanism through an electric cylinder 38, the chip mounting mechanism comprises a fourth fixing plate 31, the movable end of the electric cylinder 38 is welded with the fourth fixing plate 31, two symmetrical side surfaces on the fourth fixing plate 31 are respectively welded with a second mounting plate 29 and a third mounting plate 32, the upper surface of the third mounting plate 32 is provided with an air cylinder 33 through screws, the top of the second mounting plate 29 penetrates through and is provided with a plurality of chip mounting heads 28 through screws, the chip mounting heads 28 are eight and are arranged at equal intervals, the air cylinder 33 is respectively connected with the eight chip mounting heads 28 through eight air conveying hoses, the PLC 13 is connected with the air cylinder 33 through a lead, the air cylinder 33 is controlled to work through the PLC 13 in the process of sucking the base material, the air cylinder 33 is used for generating flowing air when working, after the chip mounting heads 28 are contacted with the base material, the air cylinder 33 stops working when being installed, for separating the substrate from the placement head 28 and thereby attaching the substrate to the circuit board.
The top of the supporting platform 10 is provided with an object clamping mechanism, the object clamping mechanism comprises two first slide rails 17 and two second fixing plates 11, the two first slide rails 17 are symmetrically arranged, two stop blocks 25 are arranged between the two first slide rails 17, first slide blocks 26 are welded at two ends of the two stop blocks 25, the two first slide blocks 26 are both slidably connected to the surfaces of the two first slide rails 17, the two second fixing plates 11 are mounted on two symmetrical side surfaces of the supporting platform 10 through screws, the two second fixing plates 11 are located between the two first slide rails 17, first screw pipes 16 are respectively arranged on the side surfaces of the two second fixing plates 11 in a penetrating manner, first screw rods 15 are respectively connected to the inner parts of the two first screw pipes 16 in a threaded manner, one ends of the two first screw rods 15 are respectively contacted with the side surfaces of the two stop blocks 25, holding plates 14 are respectively welded at the other ends of the two first screw rods 15, the side walls of the cover body 8 are embedded on, when the position to the circuit board is clamped fixedly, the holding plate 14 is rotated firstly, the holding plate 14 drives the first screw rod 15 to rotate in the first screw tube 16, when the screw thread rotates, the first screw rod 15 moves in the first screw tube 16, the stop dog 25 is pushed along with the movement of the first screw rod 15, the stop dog 25 slides on the two first slide rails 17 through the first slide block 26, and after the two stop dogs 25 are respectively contacted with two symmetrical side surfaces of the circuit board, the circuit board can be clamped and fixed, so that the circuit board is installed.
There is the cover body 8 along four side departments at supporting platform 10 top through the screw installation, and opening 3 has all been seted up to two symmetrical sides of the cover body 8, and opening 3's inside matching bonds and has transparent guard plate 2, and transparent guard plate 2 chooses for use transparent glass or transparent plastic panel, and it still plays the effect of protection when the staff of being convenient for looks over.
Through-hole 41 has been seted up to the outside of the cover body 8, and the inside matching of through-hole 41 bonds and has strained sponge 40, and through-hole 41 is used for the gas flow, strains sponge 40 and is used for filtering the impurity in the gas body in the cover body 8 that flows into to protect the circuit board.
The longitudinal moving mechanism, the transverse moving mechanism and the object clamping mechanism are all embedded in the inner wall of the cover body 8, the top of the supporting platform 10 is provided with a plurality of heat dissipation ports 30, the top of the supporting platform 10 is provided with a plurality of heat dissipation fans 36 corresponding to the plurality of heat dissipation ports 30 through a connecting mechanism, the PLC 13 is respectively connected with the longitudinal moving mechanism, the transverse moving mechanism, the heat dissipation fans 36 and the electric cylinder 38 through wires, the PLC 13 adopts an industrial-grade single chip microcomputer, the connecting mechanism comprises two connecting plates 35, the two connecting plates 35 are positioned at two sides of the heat dissipation ports 30, the two connecting plates 35 are both installed at the bottom of the supporting platform 10 through screws, a first fixing plate 1 is welded between the two connecting plates 35, the plurality of heat dissipation fans 36 penetrate through and are installed on the inner wall of the first fixing plate 1 through screws, and the two connecting plates 35 and the first fixing plate 1 are used for fixing the positions, thereby improving the stability of the position where the heat dissipation fan 36 is located.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (7)

1. The eight-head chip mounter suitable for multiple base material membranes comprises a supporting platform (10), wherein a plurality of supporting bases (12) are installed at the bottom of the supporting platform (10) through screws, and a PLC (programmable logic controller) (13) is installed on the side face of the supporting platform (10) through screws, and is characterized in that two longitudinal moving mechanisms are arranged on the upper surface of the supporting platform (10), a transverse moving mechanism is installed between the two longitudinal moving mechanisms through two third fixing plates (19), a chip mounting mechanism is installed at the bottom of the transverse moving mechanism through an electric cylinder (38), an object clamping mechanism is arranged at the top of the supporting platform (10), a cover body (8) is installed at four side edges of the top of the supporting platform (10) through screws, a through hole (41) is formed in the outer portion of the cover body (8), and a filter sponge (40) is bonded in the through hole (41) in a matching manner, the longitudinal moving mechanism, the transverse moving mechanism and the object clamping mechanism are all embedded in the inner wall of the cover body (8), a plurality of radiating holes (30) are formed in the top of the supporting platform (10), a plurality of radiating fans (36) corresponding to the radiating holes (30) are mounted on the top of the supporting platform (10) through connecting mechanisms, and the PLC (13) is connected with the longitudinal moving mechanism, the transverse moving mechanism, the radiating fans (36) and the electric cylinder (38) through conducting wires; the longitudinal moving mechanism comprises a second sliding rail (24), the second sliding rail (24) is installed at the top of the supporting platform (10) through screws, first mounting plates (9) are installed at the two ends of the second sliding rail (24) through screws, a second lead screw (23) penetrates between the two first mounting plates (9), a second servo motor (6) is installed at one end of the second lead screw (23) through a coupler, a second supporting plate (5) is installed at the bottom of the second servo motor (6) through screws, one end of the second supporting plate (5) is welded on the side face of the first mounting plate (9), the second servo motor (6) is connected with the PLC (13) through a wire, a second sliding block (22) is arranged on the second sliding rail (24) to enable the second sliding block (22) to slide along the second sliding rail (24), and a mounting block (20) is welded at the top of the second sliding block (22), the inside of installation piece (20) is run through and is installed second screwed pipe (21) through the screw, second screwed pipe (21) screw thread cup joints the outside at second lead screw (23), the side at installation piece (20) is passed through to the one end of third fixed plate (19), the lateral wall of the cover body (8) inlays and establishes on two first mounting panels (9).
2. The eight-head chip mounter applicable to multiple substrate membranes according to claim 1, wherein the lateral movement mechanism comprises a third lead screw (37) and two fixing rods (18), two ends of the two fixing rods (18) are welded on the sides of the two third fixing plates (19), the two fixing rods (18) are located on two sides of the third lead screw (37), two ends of the third lead screw (37) are installed in the two third fixing plates (19) in a penetrating manner, one end of the third lead screw (37) is provided with a first servo motor (7) through a coupling, the bottom of the first servo motor (7) is provided with a first supporting plate (4) through a screw, one end of the first supporting plate (4) is welded on the side of the third fixing plate (19), and a third solenoid (34) is sleeved on the surface of the third lead screw (37) in a threaded manner, the outside cover of third screwed pipe (34) is equipped with movable block (27), the surface at two dead levers (18) is all established at the both ends of movable block (27) for movable block (27) are along the surface slip of dead lever (18), the bottom at movable block (27) is passed through in the one end of electronic jar (38), the lateral wall of the cover body (8) inlays and establishes on first backup pad (4) and first servo motor (7).
3. The eight-head chip mounter suitable for multiple substrate membranes as claimed in claim 1, wherein said chip mounter includes a fourth fixing plate (31), said electric cylinder (38) has a fourth fixing plate (31) at its active end, said fourth fixing plate (31) has a second mounting plate (29) and a third mounting plate (32) at its two symmetrical sides, said third mounting plate (32) has a cylinder (33) at its upper surface through mounting screws, said second mounting plate (29) has a plurality of chip mounting heads (28) at its top through mounting screws, said chip mounting heads (28) are equipped with eight and equidistant arrangements, said cylinder (33) is connected with eight chip mounting heads (28) through eight gas hoses, and said PLC controller (13) is connected with said cylinder (33) through wires.
4. The eight-head chip mounter applicable to multiple substrate membranes according to claim 1, wherein the object clamping mechanism comprises two first slide rails (17) and two second fixing plates (11), the two first slide rails (17) are symmetrically arranged, two stoppers (25) are arranged between the two first slide rails (17), first sliding blocks (26) are welded at two ends of each stopper (25), the two first sliding blocks (26) are both slidably connected to the surfaces of the two first slide rails (17), the two second fixing plates (11) are mounted on two symmetrical side surfaces of the supporting platform (10) through screws, the two second fixing plates (11) are located between the two first slide rails (17), first screw pipes (16) are both arranged on the side surfaces of the two second fixing plates (11) in a penetrating manner, and first screw rods (15) are both in threaded connection with the insides of the two first screw pipes (16), one end of each of the two first screw rods (15) is in contact with the side face of each of the two check blocks (25), the holding plate (14) is welded at the other end of each of the two first screw rods (15), and the side wall of the cover body (8) is embedded on the two second fixing plates (11).
5. The eight-head chip mounter applicable to multiple base material membranes according to claim 1, wherein openings (3) are formed in two symmetrical side surfaces of the cover body (8), and transparent protection plates (2) are bonded inside the openings (3) in a matching mode.
6. The eight-head chip mounter for multiple base material membranes according to claim 1, wherein the connecting mechanism comprises two connecting plates (35), the two connecting plates (35) are located on two sides of the heat dissipation opening (30), the two connecting plates (35) are both mounted at the bottom of the supporting platform (10) through screws, the first fixing plate (1) is welded between the two connecting plates (35), and the plurality of cooling fans (36) penetrate through and are mounted on the inner wall of the first fixing plate (1) through screws.
7. The eight-head chip mounter for multiple base material membranes according to claim 1, wherein a plurality of material storage trays (39) are arranged on the top of said supporting platform (10), and said material storage trays (39) are symmetrically arranged.
CN201910955127.1A 2019-10-09 2019-10-09 Eight chip mounter suitable for multiple substrate diaphragm Active CN110573002B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910955127.1A CN110573002B (en) 2019-10-09 2019-10-09 Eight chip mounter suitable for multiple substrate diaphragm

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Application Number Priority Date Filing Date Title
CN201910955127.1A CN110573002B (en) 2019-10-09 2019-10-09 Eight chip mounter suitable for multiple substrate diaphragm

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CN110573002B true CN110573002B (en) 2021-01-15

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CN110181981A (en) * 2019-04-26 2019-08-30 吴善旺 A kind of engraving machine

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