CN216413042U

CN216413042U - High-power chip plastic package device

Info

Publication number: CN216413042U
Application number: CN202123106093.0U
Authority: CN
Inventors: 熊斯富
Original assignee: Jiangxi Wannianxin Microelectronics Co Ltd
Current assignee: Jiangxi Wannianxin Microelectronics Co Ltd
Priority date: 2021-12-07
Filing date: 2021-12-07
Publication date: 2022-04-29
Anticipated expiration: 2031-12-07

Abstract

The utility model relates to the technical field of chip plastic package equipment, in particular to a high-power chip plastic package device, which comprises a rack, wherein a screw rod driving structure is arranged at the top of the rack, a plastic package table is connected at the top of the screw rod driving structure, clamping assemblies are respectively arranged at the left side and the right side of the top of the plastic package table, a plastic seal plate is connected between the two clamping assemblies, an induction switch is arranged at one side, away from a motor, between a screw rod and a limiting slide rod, vertical plates are arranged at the two sides of the rack, a sliding structure is arranged above the two vertical plates and comprises an electric guide rail, a guide slide rod and an electric slide table, a first driving air cylinder is arranged at the top of the electric slide table, the bottom of the first driving air cylinder penetrates through the electric slide table and is connected with a connecting plate, a plastic package mechanism is arranged at the bottom of the connecting plate, and the arranged screw rod driving structure is matched with the induction switch, thereby improving overall automation.

Description

High-power chip plastic package device

Technical Field

The utility model relates to the technical field of chip plastic package equipment, in particular to a high-power chip plastic package device.

Background

In the field of integrated circuit technology, packaging high-power chips is one of the most basic processes, and chip packages are classified into many types, which often include plastic packages, ceramic packages, metal packages, and the like according to the nature of the raw materials of the packages, wherein the plastic packages are low-cost, simple-process, and highly reliable package structures, and are commonly used in the consumer electronics field, and have the highest market share.

At present, chip plastic packaging devices on the market generally need a large amount of manual work to operate in the plastic packaging process, the plastic packaging operation cannot be automatically performed, the overall automation degree of the plastic packaging devices is low, and the intelligent degree of the plastic packaging devices is low.

Therefore, a high power chip plastic package device is needed to solve the above problems in the background art.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a high-power chip plastic package device to solve the problems in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme:

a high-power chip plastic package device comprises a rack, wherein a lead screw driving structure is installed at the top of the rack and comprises a motor, a lead screw nut and a limiting slide rod, a plastic package table is connected at the top of the lead screw driving structure, clamping assemblies are installed on the left side and the right side of the top of the plastic package table, a plastic sealing plate is connected between the two clamping assemblies, a plurality of chip seats are arranged at the top of the plastic sealing plate at equal intervals, placing grooves for placing chips are formed in the chip seats, fixing clamping plates are connected on the left side and the right side of the plastic sealing plate, an induction switch is installed on one side, away from the motor, between the lead screw and the limiting slide rod, vertical plates are arranged on two sides of the rack, a sliding structure is installed above the two vertical plates, and comprises an electric guide rail, a guide slide rod and an electric slide table, the top of electronic slip table is installed first and is driven actuating cylinder, first bottom of driving actuating cylinder is run through electronic slip table and is connected with the connecting plate, plastic envelope mechanism is installed to the bottom of connecting plate, the dust absorption mechanism of synchronous dust absorption operation to moulding the shrouding is installed to top one side of connecting plate.

As a preferable scheme of the present invention, the bottom of the motor is fixed to the top of the frame, the output end of the motor is connected to one side of the lead screw, the lead screw is connected to the inner side of the lead screw nut through the outer side threads, the left and right sides of the lead screw nut are slidably connected to the limiting slide bar, and the motor is electrically connected to an external control device.

As a preferable scheme of the utility model, a collision block parallel to the screw rod is arranged between the screw rod and the screw rod nut at the bottom of the plastic package table, and when the plastic package table moves to a position right below the plastic package mechanism, the collision block just extrudes the inductive switch.

In a preferred embodiment of the present invention, the inductive switch is electrically connected to an external control device, and the first driving cylinder is electrically connected to the inductive switch and the external control device.

As a preferable scheme of the present invention, the clamping assembly includes a second driving cylinder, a U-shaped clamping member, a return spring, a pressing plate, and a bottom plate, a top of the return spring is mounted on a bottom side above an inside of the U-shaped clamping member, a bottom of the return spring is connected to a top of the pressing plate, and a clamping groove for accommodating the fixing clamping plate is formed between the pressing plate and the bottom plate.

As a preferable aspect of the present invention, the two sides of the electric guide rail are provided with inner sides of the vertical plates, the electric guide rail and the electric sliding table are slidably connected to each other, the left and right sides of the electric sliding table are slidably connected to the guide slide bar, and the control ends of the electric guide rail and the electric sliding table are electrically connected to an external control device.

According to the preferable scheme of the utility model, the dust collection mechanism is internally provided with a dust collection fan and a dust collection box body, one side of the dust collection mechanism is connected with a dust collection pipe with an elastic structure, one side of the dust collection pipe, which is far away from the dust collection mechanism, is connected with a dust collection head, and the dust collection head is funnel-shaped.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the plastic packaging machine, the plastic packaging table can be driven to move through the screw rod driving structure, when the plastic packaging table moves to the position under the plastic packaging mechanism, the touch block just pushes the induction switch, the motor stops working at the moment, the first driving cylinder is controlled to drive the bottom plastic packaging mechanism to descend to a certain position, and finally the plastic packaging operation is performed on a chip through the plastic packaging mechanism, so that the overall automation is improved, and the use efficiency of the equipment is higher.

2. According to the plastic packaging table, the clamping assembly is arranged, so that the two ends of the plastic packaging table can be clamped and limited, the device can be suitable for plastic packaging tables of different sizes to use under the driving action of the second driving air cylinder, the application range is wide, and the device is more convenient to use.

3. According to the utility model, through the arrangement of the electric guide rail, the electric sliding table and the guide sliding rod, the transverse position of the plastic packaging mechanism can be adjusted, so that the plastic packaging mechanism can perform plastic packaging operation on a chip on the plastic packaging table, and the flexibility is higher.

4. According to the utility model, through the arranged dust collection mechanism, dust around the plastic package table and the chip can be synchronously adsorbed during plastic package, so that the dust is prevented from being adhered to the chip during plastic package to influence the use effect of the subsequent chip.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic structural view of the present invention without a plastic sealing plate;

FIG. 3 is a schematic view of the sliding structure of the present invention;

FIG. 4 is a schematic view of a screw driving structure according to the present invention;

FIG. 5 is a schematic view of a clamping assembly of the present invention;

FIG. 6 is a schematic structural view of a plastic sealing plate according to the present invention;

in the figure: 1. a frame; 101. a screw rod driving structure; 1011. a motor; 1012. a screw rod; 1013. a feed screw nut; 1014. a limiting slide bar; 102. a plastic packaging table; 1021. a contact block; 103. a clamping assembly; 1031. a second driving cylinder; 1032. a U-shaped clamping member; 1033. a return spring; 1034. pressing a plate; 1035. a base plate; 104. a plastic sealing plate; 1041. a chip holder; 1042. a placement groove; 1043. fixing the clamping plate; 105. an inductive switch; 106. a vertical plate; 107. a sliding structure; 1071. an electric rail; 1072. a guide slide bar; 1073. an electric sliding table; 108. a first driving cylinder; 1081. a connecting plate; 1082. a plastic packaging mechanism; 109. a dust suction mechanism; 1091. a dust collection pipe; 1092. a dust suction head.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without any creative work based on the embodiments of the present invention belong to the protection scope of the present invention.

Referring to fig. 1-6, the present invention provides a technical solution:

a high-power chip plastic package device comprises a frame 1, a screw rod driving structure 101 is installed at the top of the frame 1, the screw rod driving structure 101 comprises a motor 1011, a screw rod 1012, a screw rod nut 1013 and a limit slide bar 1014, the top of the screw rod driving structure 101 is connected with a plastic package platform 102, clamping components 103 are installed on the left side and the right side of the top of the plastic package platform 102, a plastic seal plate 104 is connected between the two clamping components 103, a plurality of chip seats 1041 are equidistantly arranged on the top of the plastic seal plate 104, a placing groove 1042 for placing chips is arranged in the chip seats 1041, a fixing clamp plate 1043 is connected on the left side and the right side of the plastic seal plate 104, an induction switch 105 is installed on one side, far away from the motor 1011, between the screw rod 1012 and the limit slide bar 1014, vertical plates 106 are arranged on the two sides of the frame 1, a sliding structure 107 is installed above the two vertical plates 106, the sliding structure 107 comprises an electric guide rail 1071, a guide slide bar 1072 and an electric slide table 1073, the top of the electric sliding table 1073 is provided with a first driving cylinder 108, the bottom of the first driving cylinder 108 penetrates through the electric sliding table 1073 to be connected with a connecting plate 1081, the bottom of the connecting plate 1081 is provided with a plastic packaging mechanism 1082, one side of the top of the connecting plate 1081 is provided with a dust suction mechanism 109 which synchronously performs dust suction operation on the plastic sealing plate 104, the screw rod driving structure 101 is matched with the inductive switch 105, thereby improving the overall automation, and through the arrangement of the electric guide rail 1071, the electric sliding table 1073 and the guide sliding rod 1072, thereby the transverse position of the plastic packaging mechanism 1082 can be adjusted, the plastic packaging operation can be carried out on the chip on the plastic packaging table 102, the flexibility is higher, the dust collection mechanism 109 can synchronously adsorb dust around the plastic package table 102 and the chip during plastic package, so that the dust is prevented from adhering to the chip during plastic package to affect the use effect of the subsequent chip.

In the embodiment, referring to fig. 1 and 4, the bottom of the motor 1011 is fixed on the top of the frame 1, the output end of the motor 1011 is connected to one side of the screw rod 1012, the screw rod 1012 is connected to the inner side of the screw nut 1013 through the outer thread, the left and right sides of the screw nut 1013 are slidably connected to the limit slide bar 1014, the motor 1011 is electrically connected to the external control device, the bottom of the plastic package stage 102 is located between the screw rod 1012 and the screw nut 1013, a collision block 1021 parallel to the screw rod 1012 is arranged, when the plastic package stage 102 moves right below the plastic package mechanism 1082, the collision block 1021 pushes the inductive switch 105, the inductive switch 105 is electrically connected to the external control device, the first driving cylinder 108 is electrically connected to the inductive switch 105 and the external control device, the screw rod is driven to rotate by the motor 1011 during actual use, the screw rod 1012 drives the plastic package stage 102 to move, and then drive and mould shrouding 104 and remove, take it to the bottom of plastic packaging mechanism 1082, when plastic packaging platform 102 moved under the plastic packaging mechanism 1082, conflict piece 1021 just in time extrudeed inductive switch 105, motor 1011 stop work this moment, the first actuating cylinder 108 that drives of simultaneous control drove bottom plastic packaging mechanism 1082 and descends to a definite position, carry out the plastic packaging operation through plastic packaging mechanism 1082 to the chip at last, thereby whole automation has been improved, make more high-efficient when the equipment uses.

In an embodiment, referring to fig. 1, 4, 5 and 6, the clamping assembly 103 includes a second driving cylinder 1031, a U-shaped clamping member 1032, a return spring 1033, a pressure plate 1034 and a bottom plate 1035, wherein a top portion of the return spring 1033 is mounted on a bottom side above an inner portion of the U-shaped clamping member 1032, a bottom portion of the return spring 1033 is connected to a top portion of the pressure plate 1034, a clamping slot for receiving the fixing plate 1043 is formed between the pressure plate 1034 and the bottom plate 1035, and by providing the clamping assembly 103, in practical use, the pressure plate 1034 is driven by the elastic action of the return spring 1033 to clamp the fixing clip plate 1043, so that the clamping assembly 103 can not only clamp and limit two ends of the plastic package table 102, the device can be applied to plastic package tables 102 of different sizes by the driving action of the second driving cylinder 1031, so that the application range is wide, and the device is more convenient to use.

Embodiment, please refer to fig. 1 and 3, the inboard of riser 106 is installed to electronic guide rail 1071's both sides, sliding connection between electronic guide rail 1071 and the electronic slip table 1073, and the left and right sides sliding connection of electronic slip table 1073 is in direction slide bar 1072, the control end electric connection of electronic guide rail 1071 and electronic slip table 1073 is in outside controlling means, through the electronic guide rail 1071 who sets up, electronic slip table 1073 and direction slide bar 1072, it drives plastic packaging mechanism 1082 and carries out synchronous motion to remove through controlling electronic slip table 1073, thereby can adjust plastic packaging mechanism 1082's lateral position, make it carry out the plastic packaging operation to the chip on the plastic packaging platform 102, the flexibility is higher.

In an embodiment, referring to fig. 1 and fig. 2, a dust suction fan and a dust suction box are arranged inside the dust suction mechanism 109, one side of the dust suction mechanism 109 is connected with a dust suction pipe 1091 with an elastic structure, one side of the dust suction pipe 1091, which is far away from the dust suction mechanism 109, is connected with a dust suction head 1092, the dust suction head 1092 is funnel-shaped, and by the arranged dust suction mechanism 109, dust around the plastic package table 102 and the chip can be synchronously adsorbed by the dust suction mechanism 109 during plastic package, so that the dust is prevented from being adhered to the chip during plastic package, and the use effect of the subsequent chip is prevented from being affected.

The working principle is as follows: when the device is used, a chip is placed in the placing groove 1042 through a manipulator, the pressure plate 1034 is driven by the elastic action of the reset spring 1033 to clamp the fixed clamping plate 1043, so that the two ends of the plastic package table 102 can be clamped and limited by the clamping component 103, the device can be suitable for the plastic package tables 102 with different sizes to use through the driving action of the second driving air cylinder 1031, the screw 1012 is driven to rotate through the work of the motor 1011, the plastic package table 102 is driven to move through the screw 1012, the plastic sealing plate 104 is driven to move to bring the plastic sealing plate to the bottom of the plastic package mechanism 1082, when the plastic package table 102 moves to the position under the plastic package mechanism 1082, the touch block 1021 just extrudes the induction switch 105, at the moment, the motor 1011 stops working, the first driving air cylinder 108 is controlled to drive the bottom plastic package mechanism 1082 to descend to a certain position, and finally, the plastic package operation is carried out on the chip through the plastic package mechanism 1082, thereby the whole automation has been improved, move through control electric sliding table 1073 and drive plastic packaging mechanism 1082 and carry out synchronous motion, thereby can adjust plastic packaging mechanism 1082's horizontal position, make it can carry out the plastic packaging operation to the chip on the plastic packaging platform 102, the flexibility is higher, in the time of the plastic packaging, can carry out synchronous absorption to the dust around plastic packaging platform 102 and the chip in the plastic packaging through dust absorption mechanism 109, prevent that the dust from on the chip in the plastic packaging, influence the result of use of follow-up chip, there is certain spreading value.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high-power chip plastic envelope device, includes frame (1), its characterized in that: the lead screw driving structure (101) is installed at the top of the rack (1), the lead screw driving structure (101) comprises a motor (1011), a lead screw (1012), a lead screw nut (1013) and a limiting slide rod (1014), the lead screw drives the top of the lead screw driving structure (101) to be connected with a plastic package platform (102), clamping components (103) are installed on the left side and the right side of the top of the plastic package platform (102), a plastic sealing plate (104) is connected between the two clamping components (103), a plurality of chip seats (1041) are arranged at the top of the plastic sealing plate (104) at equal intervals, a placing groove (1042) for placing chips is arranged in the chip seats (1041), a fixing clamping plate (1043) is connected on the left side and the right side of the plastic sealing plate (104), an induction switch (105) is installed on one side, away from the motor (1011), between the lead screw (1012) and the limiting slide rod (1014), the both sides of frame (1) are provided with riser (106), two sliding structure (107) are installed to top between riser (106), sliding structure (107) include electric guide rail (1071), direction slide bar (1072) and electric sliding table (1073), first actuating cylinder (108) that drives is installed at the top of electric sliding table (1073), the bottom that first actuating cylinder (108) that drives runs through electric sliding table (1073) is connected with connecting plate (1081), plastic envelope mechanism (1082) are installed to the bottom of connecting plate (1081), top one side of connecting plate (1081) is installed and is carried out dust absorption mechanism (109) of dust absorption operation to moulding shrouding (104) in step.

2. The high-power chip plastic package device according to claim 1, wherein: the bottom of motor (1011) is fixed in the top of frame (1), the output of motor (1011) is connected in one side of lead screw (1012), lead screw (1012) pass through outside threaded connection in the inboard of screw-nut (1013), the left and right sides sliding connection in spacing slide bar (1014) of screw-nut (1013), motor (1011) electric connection is in outside controlling means.

3. The high-power chip plastic package device according to claim 1, wherein: and a contact block (1021) parallel to the screw rod (1012) is arranged between the screw rod (1012) and the screw rod nut (1013) at the bottom of the plastic package table (102), and when the plastic package table (102) moves to a position right below the plastic package mechanism (1082), the contact block (1021) just extrudes the inductive switch (105).

4. The high-power chip plastic package device according to claim 1, wherein: the inductive switch (105) is electrically connected with an external control device, and the first driving cylinder (108) is electrically connected with the inductive switch (105) and the external control device.

5. The high-power chip plastic package device according to claim 1, wherein: the clamping assembly (103) comprises a second driving cylinder (1031), a U-shaped clamping piece (1032), a return spring (1033), a pressure plate (1034) and a bottom plate (1035), wherein the top of the return spring (1033) is installed on the bottom side above the inner portion of the U-shaped clamping piece (1032), the bottom of the return spring (1033) is connected to the top of the pressure plate (1034), and a clamping groove for accommodating the fixing clamping plate (1043) is formed between the pressure plate (1034) and the bottom plate (1035).

6. The high-power chip plastic package device according to claim 1, wherein: the inboard of riser (106) is installed to the both sides of electronic guide rail (1071), sliding connection between electronic guide rail (1071) and electronic slip table (1073), and the left and right sides sliding connection of electronic slip table (1073) in direction slide bar (1072), the control end electric connection of electronic guide rail (1071) and electronic slip table (1073) is in outside controlling means.

7. The high-power chip plastic package device according to claim 1, wherein: the inside of dust absorption mechanism (109) is dust absorption fan and dust absorption box, one side of dust absorption mechanism (109) is connected with the dust absorption pipe (1091) of elastic construction, one side that dust absorption pipe (1091) kept away from dust absorption mechanism (109) is connected with dust absorption head (1092), dust absorption head (1092) are hourglass hopper-shaped.