CN210757156U

CN210757156U - Adsorption type clamping device for machining precision semiconductor components

Info

Publication number: CN210757156U
Application number: CN201921297764.6U
Authority: CN
Inventors: 佘卫平
Original assignee: Chizhou Jucheng Electronic Technology Co ltd
Current assignee: Chizhou Jucheng Electronic Technology Co ltd
Priority date: 2019-08-12
Filing date: 2019-08-12
Publication date: 2020-06-16
Anticipated expiration: 2029-08-12

Abstract

The utility model discloses an accurate semiconductor components and parts processing is with absorption formula clamping device, including connecting rod, first sucking disc and miniature air pump, the top of connecting rod is fixed with the fixed plate, and the inside intermediate position of fixed plate installs the motor, the top of motor is connected with the carousel, and has cup jointed the bearing in the junction outside of carousel and motor, the last fixed surface of carousel has linear guide rail, and linear guide rail's internal connection has first slider and second slider, the right side of first slider is provided with the second slider, and the top of first slider is fixed with first branch pipe, first sucking disc is installed in the upper right corner of first branch pipe, the top of second slider is fixed with the second branch pipe, and the upper left corner of second branch pipe installs the second sucking disc, miniature air pump is installed in the intermediate position of bellows. The clamping device can adsorb and fix the semiconductor element, and can effectively reduce the damage of the clamping device to the semiconductor element.

Description

Adsorption type clamping device for machining precision semiconductor components

Technical Field

The utility model relates to a semiconductor processing technology field specifically is an accurate semiconductor components and parts processing is with absorption formula clamping device.

Background

The semiconductor element is an electronic element made of semiconductor materials such as silicon or germanium, and commonly used semiconductor diodes, voltage stabilizing tubes, photoelectric tubes, triodes, thyristors, photoresistors, negative temperature coefficient thermistors, various integrated circuits and the like.

Clamping device size on the existing market is great, and it is fixed to be difficult to the centre gripping that is applicable to precision devices such as semiconductor components and parts, and is not convenient for adjust its centre gripping elasticity degree according to semiconductor components and parts's not unidimensional to clamping device is not convenient for cooperate the use with robotic arm, and simultaneously in the use, present clamping device easily causes the problem of damage to semiconductor components and parts, and for this reason, we provide an absorption formula clamping device for precision semiconductor components and parts processing.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an accurate semiconductor components and parts processing is with absorption formula clamping device to it is great to solve the clamping device size on the existing market that proposes in the above-mentioned background, the centre gripping that is difficult to be applicable to accurate devices such as semiconductor components and parts is fixed, and is not convenient for adjust its centre gripping elasticity degree according to semiconductor components and parts's not unidimensional, and clamping device is not convenient for cooperate the use with robotic arm, simultaneously in the use, present clamping device easily causes the problem of damage to semiconductor components and parts.

In order to achieve the above object, the utility model provides a following technical scheme: an adsorption type clamping device for machining a precise semiconductor component comprises a connecting rod, a first sucker and a miniature air pump, wherein a fixed plate is fixed above the connecting rod, a motor is installed in the middle of the inside of the fixed plate, a rotary disc is connected above the motor, a bearing is sleeved outside the joint of the rotary disc and the motor, a linear guide rail is fixed on the upper surface of the rotary disc, a first sliding block and a second sliding block are connected inside the linear guide rail, a second sliding block is arranged on the right side of the first sliding block, a first branch pipe is fixed above the first sliding block, the first sucker is installed at the upper right corner of the first branch pipe, a second branch pipe is fixed above the second sliding block, a second sucker is installed at the upper left corner of the second branch pipe, corrugated pipes are connected on the inner sides of the first branch pipe and the second branch pipe, and the miniature air pump is installed in the middle of the corrugated pipes, and the right side threads of the second sliding block and the linear guide rail are connected with a fixing bolt.

Preferably, the structure of the connecting rod is a hollow structure, and the inner wall of the connecting rod is provided with threads.

Preferably, a rotating structure is formed between the motor and the turntable, and the rotating angle between the motor and the turntable is 0-360 degrees.

Preferably, the first slider and the second slider have the same structure, and the first slider, the second slider and the linear guide rail are matched with each other to form a sliding structure.

Preferably, the first branch pipe and the second branch pipe are symmetrical left and right about a vertical center line of the corrugated pipe, and the first branch pipe and the second branch pipe are communicated with the corrugated pipe.

Preferably, the inner walls of the first sucker and the second sucker are both connected with non-slip mats, and the first sucker and the second sucker are both made of elastic silica gel.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the adsorption type clamping device for processing the precise semiconductor component is provided with the threads arranged in the connecting rod, so that the connecting rod is conveniently connected with the mechanical arm, the use convenience of the clamping device can be effectively enhanced due to the mutual matching use, and the motor is arranged to drive the rotary table to rotate, so that the position angle of a clamped workpiece can be changed according to the actual use condition, and convenience is provided for a user to process and operate;

2. the distance between the first sucker and the second sucker can be changed, so that the whole device can meet the requirement of clamping semiconductor components with different sizes, the practicability is higher, the surfaces, which are in contact with the semiconductor elements, of the first sucker and the second sucker are subjected to anti-skidding treatment, the stability of connection between the first sucker and the semiconductor elements can be effectively enhanced, and the semiconductor elements are effectively prevented from slipping in the processing process;

3. set up miniature air pump and can discharge first sucking disc and the inside air of second sucking disc through first branch pipe and second branch pipe and bellows to adsorb fixedly to semiconductor element, adsorb fixedly and can effectively alleviate clamping device's injury to semiconductor element, be favorable to protecting semiconductor element and avoid it by the scratch, set up first sucking disc and second sucking disc and make for soft silica gel, further alleviate the damage of first sucking disc and second sucking disc to semiconductor element.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic top view of the present invention;

fig. 3 is the schematic view of the cross-sectional structure of the joint of the second slider, the linear guide rail and the fixing bolt.

In the figure: 1. a connecting rod; 2. a fixing plate; 3. a motor; 4. a turntable; 5. a bearing; 6. a linear guide rail; 7. a first slider; 8. a second slider; 9. a first branch pipe; 10. a first suction cup; 11. a second branch pipe; 12. a second suction cup; 13. a bellows; 14. a micro air pump; 15. and (5) fixing the bolt.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: an adsorption type clamping device for processing a precise semiconductor component comprises a connecting rod 1, a fixing plate 2, a motor 3, a turntable 4, a bearing 5, a linear guide rail 6, a first slider 7, a second slider 8, a first branch pipe 9, a first suction disc 10, a second branch pipe 11, a second suction disc 12, a corrugated pipe 13, a miniature air pump 14 and a fixing bolt 15, wherein the fixing plate 2 is fixed above the connecting rod 1, the motor 3 is arranged at the middle position inside the fixing plate 2, the connecting rod 1 is of a hollow structure, the inner wall of the connecting rod 1 is provided with threads, the threads arranged inside the connecting rod 1 are arranged, the connecting rod 1 is convenient to be connected with a mechanical arm provided with matched threads, the clamping device is matched with the mechanical arm for use, the convenience in use can be effectively enhanced, the thread structure is simple, the mounting and the dismounting are convenient, the turntable 4 is connected above the motor 3, the bearing 5 is sleeved on the outer side of the joint of the rotary table 4 and the motor 3, a rotating structure is formed between the motor 3 and the rotary table 4, the rotating angle between the motor 3 and the rotary table 4 is 0-360 degrees, the motor 3 is arranged to drive the rotary table 4 to rotate, so that the clamping and fixing part of the clamping device is driven to horizontally rotate, the position angle of a clamped workpiece is changed according to the actual use condition, and convenience is provided for a user to process and operate;

the upper surface of the rotary table 4 is fixed with a linear guide rail 6, the interior of the linear guide rail 6 is connected with a first slide block 7 and a second slide block 8, the right side of the first slide block 7 is provided with the second slide block 8, a first branch pipe 9 is fixed above the first slide block 7, a first suction cup 10 is installed at the upper right corner of the first branch pipe 9, a second branch pipe 11 is fixed above the second slide block 8, a second suction cup 12 is installed at the upper left corner of the second branch pipe 11, the first slide block 7 and the second slide block 8 have the same structure, the first slide block 7, the second slide block 8 and the linear guide rail 6 are mutually matched to form a sliding structure, the first slide block 7, the second slide block 8 and the linear guide rail 6 can slide, so that the distance between the first suction cup 10 and the second suction cup 12 is changed, the whole device can meet the requirements of clamping semiconductor components with different sizes, and has stronger practicability, the sliding adjustment mode has a simple structure, the use is convenient, the inner walls of the first sucking disc 10 and the second sucking disc 12 are both connected with anti-slip pads, the first sucking disc 10 and the second sucking disc 12 are both made of elastic silica gel, the first sucking disc 10 and the second sucking disc 12 are made of soft silica gel, the damage of the first sucking disc 10 and the second sucking disc 12 to the semiconductor element is further reduced, meanwhile, the anti-slip treatment is carried out on the surfaces, contacted with the semiconductor element, of the first sucking disc 10 and the second sucking disc 12, the stability of connection between the semiconductor element and the semiconductor element can be effectively enhanced, and the semiconductor element is effectively prevented from slipping in the processing process;

the inner sides of the first branch pipe 9 and the second branch pipe 11 are connected with a corrugated pipe 13, a micro air pump 14 is arranged in the middle of the corrugated pipe 13, the first branch pipe 9 and the second branch pipe 11 are symmetrical left and right about the vertical center line of the corrugated pipe 13, the first branch pipe 9, the second branch pipe 11 and the corrugated pipe 13 are communicated, the first branch pipe 9, the second branch pipe 11 and the corrugated pipe 13 are both arranged in a hollow state, so that the micro air pump 14 can discharge the air inside the first suction cup 10 and the second suction cup 12 through the first branch pipe 9, the second branch pipe 11 and the bellows 13, so that the first suction cup 10 and the second suction cup 12 can be adsorbed on the surface of the semiconductor element, therefore, the semiconductor element is adsorbed and fixed, the damage of the clamping device to the semiconductor element can be effectively reduced by adsorption and fixation, the semiconductor element is protected from being scratched, and the right side of the second sliding block 8 and the linear guide rail 6 are in threaded connection with the fixing bolt 15.

The working principle is as follows: for the adsorption type clamping device for processing the precision semiconductor components, firstly, the whole clamping device is arranged on a matched mechanical arm, a connecting rod 1 is rotated, the connecting rod 1 can generate a thread effect with the mechanical arm, so that the whole clamping device is arranged and fixed, then, the distance between a first suction disc 10 and a second suction disc 12 is adjusted according to the size of the semiconductor component to be clamped, as the first sliding block 7, the second sliding block 8 and a linear guide rail 6 are connected and fixed in the same way, the first sliding block 7 and the linear guide rail 6 are also fixed by fixing bolts 15, the two fixing bolts 15 are firstly respectively unscrewed, so that the first sliding block 7, the second sliding block 8 and the linear guide rail 6 can slide, the first sliding block 7 and the second sliding block 8 slide, and the first sliding block 7 and the second sliding block 8 slide along the linear guide rail 6, driving the first branch pipe 9 and the second branch pipe 11 to move, changing the distance between the first suction cup 10 and the second suction cup 12 to make the distance smaller than the size of a semiconductor element to be clamped, and then screwing two fixing bolts 15 for fixing;

the semiconductor element to be clamped is arranged between the first suction cup 10 and the second suction cup 12, the inner walls of the first suction cup 10 and the second suction cup 12 are attached to the semiconductor element, then the micro air pump 14 is started, the micro air pump 14 forms strong suction force, air in the first suction cup 10 is sucked through the corrugated pipe 13 and the first branch pipe 9, so that the first suction cup 10 is tightly attached to the semiconductor element, meanwhile, air in the second suction cup 12 is sucked away through the corrugated pipe 13 and the second branch pipe 11, so that the second suction cup 12 is tightly attached to the semiconductor element, thereby press from both sides tight semiconductor component, when the position angle that needs to change semiconductor component, start the motor 3 of fixing in fixed plate 2, motor 3 drives carousel 4 and rotates, and bearing 5 supports carousel 4, and carousel 4 rotates and drives the semiconductor component monolithic rotation that first sucking disc 10 and second sucking disc 12 were pressed from both sides, just so accomplishes the use of whole accurate semiconductor component processing with absorption formula clamping device.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a precision semiconductor components and parts processing is with absorption formula clamping device, includes connecting rod (1), first sucking disc (10) and miniature air pump (14), its characterized in that: a fixed plate (2) is fixed above the connecting rod (1), a motor (3) is installed at the inner middle position of the fixed plate (2), a turntable (4) is connected above the motor (3), a bearing (5) is sleeved outside the joint of the turntable (4) and the motor (3), a linear guide rail (6) is fixed on the upper surface of the turntable (4), a first slider (7) and a second slider (8) are connected inside the linear guide rail (6), a second slider (8) is arranged on the right side of the first slider (7), a first branch pipe (9) is fixed above the first slider (7), a first sucker (10) is installed at the upper right corner of the first branch pipe (9), a second branch pipe (11) is fixed above the second slider (8), and a second sucker (12) is installed at the upper left corner of the second branch pipe (11), the inner sides of the first branch pipe (9) and the second branch pipe (11) are connected with a corrugated pipe (13), the miniature air pump (14) is installed in the middle of the corrugated pipe (13), and the right sides of the second sliding block (8) and the linear guide rail (6) are in threaded connection with a fixing bolt (15).

2. The adsorption type clamping device for the precision semiconductor component machining according to claim 1, wherein the adsorption type clamping device comprises: the structure of the connecting rod (1) is a hollow structure, and the inner wall of the connecting rod (1) is provided with threads.

3. The adsorption type clamping device for the precision semiconductor component machining according to claim 1, wherein the adsorption type clamping device comprises: a rotating structure is formed between the motor (3) and the rotating disc (4), and the rotating angle between the motor (3) and the rotating disc (4) is 0-360 degrees.

4. The adsorption type clamping device for the precision semiconductor component machining according to claim 1, wherein the adsorption type clamping device comprises: the first sliding block (7) and the second sliding block (8) are identical in structure, and the first sliding block (7), the second sliding block (8) and the linear guide rail (6) are matched with each other to form a sliding structure.

5. The adsorption type clamping device for the precision semiconductor component machining according to claim 1, wherein the adsorption type clamping device comprises: the first branch pipe (9) and the second branch pipe (11) are symmetrical left and right relative to the vertical center line of the corrugated pipe (13), and the first branch pipe (9) and the second branch pipe (11) are communicated with the corrugated pipe (13).

6. The adsorption type clamping device for the precision semiconductor component machining according to claim 1, wherein the adsorption type clamping device comprises: the inner walls of the first sucking disc (10) and the second sucking disc (12) are both connected with anti-slip pads, and the first sucking disc (10) and the second sucking disc (12) are both made of elastic silica gel.