CN114147613B - Silicon wafer edge polishing device - Google Patents
Silicon wafer edge polishing device Download PDFInfo
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- CN114147613B CN114147613B CN202111483007.XA CN202111483007A CN114147613B CN 114147613 B CN114147613 B CN 114147613B CN 202111483007 A CN202111483007 A CN 202111483007A CN 114147613 B CN114147613 B CN 114147613B
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- rotating shaft
- silicon wafer
- machine body
- polishing mechanism
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
- B24B29/04—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces for rotationally symmetrical workpieces, e.g. ball-, cylinder- or cone-shaped workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/007—Cleaning of grinding wheels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/095—Cooling or lubricating during dressing operation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention relates to the technical field of silicon wafer production and processing, in particular to a silicon wafer edge polishing device which comprises a machine body, wherein a placing mechanism for placing a silicon wafer is arranged on the machine body, and the placing mechanism is arranged on the machine body in a sliding manner; the polishing mechanism is used for polishing the silicon wafer and is arranged on the inner top wall of the machine body; the polishing mechanism is used for polishing the polishing mechanism, the polishing mechanism is arranged on one side, far away from the placement mechanism, of the polishing mechanism, when the polishing mechanism works, the polishing mechanism can be driven to conduct polishing operation on the polishing mechanism, and in the working process of the polishing mechanism, the polishing mechanism can automatically polish the polishing mechanism without adding an additional power source, so that the production and manufacturing cost can be reduced, the stability of the polishing mechanism is improved, and the practicability of the polishing mechanism is improved.
Description
Technical Field
The invention relates to the field of silicon wafer production and processing, in particular to a silicon wafer edge polishing device.
Background
With the continuous development of semiconductor technology, more stringent requirements are put on the geometric parameters, edges and surface roughness of silicon wafers. If the edge of the silicon wafer is rough, the phenomena of uneven and the like exist, the silicon wafer can be subjected to external force in various subsequent processing technologies, and edge damage is removed as much as possible by polishing the edge of the silicon wafer, so that a smooth silicon wafer edge is obtained.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides a silicon wafer edge polishing device. In order to achieve the above purpose, the technical scheme adopted by the invention is as follows: the silicon wafer edge polishing device comprises a machine body, wherein a placing mechanism for placing a silicon wafer is arranged on the machine body, and the placing mechanism is arranged on the machine body in a sliding manner; the polishing mechanism is used for polishing the silicon wafer and is arranged on the inner top wall of the machine body; the polishing mechanism is arranged on one side of the polishing mechanism away from the placement mechanism, and when the polishing mechanism works, the polishing mechanism can be driven to conduct polishing operation on the polishing mechanism.
The placing mechanism comprises a sliding part, the sliding part is arranged on a horizontal workbench of the machine body, the sliding part is connected with a mounting part in a sliding manner, and a suction pump and a first motor are fixedly placed in the mounting part; the device is characterized in that a transmission part is arranged on the installation part, one end of the installation part is provided with a placement part, and the placement part is connected with the suction pump through the transmission part and is used for fixing a silicon wafer to be processed.
The transmission part comprises a first rotating shaft, an air guide channel is formed in the first rotating shaft along the axis direction, one end of the air guide channel in the first rotating shaft is in sealing connection with the output end of the suction pump, the first rotating shaft is rotationally connected with the mounting part, a second rotating shaft is further arranged on the mounting part, one end of the second rotating shaft is fixedly connected with the output end of the first motor, a first gear is coaxially and fixedly sleeved on the first rotating shaft, a second gear is coaxially and fixedly sleeved on the second rotating shaft, and the first gear is in meshed connection with the second gear.
The method is characterized in that: the polishing mechanism comprises a third rotating shaft, the third rotating shaft is fixedly connected with the output end of the second motor arranged on the machine body, and a polishing wheel is arranged at the other end of the third rotating shaft.
The third rotating shaft is arranged in a telescopic way along the axis direction of the third rotating shaft.
The polishing wheel comprises an arc-shaped processing groove.
The polishing mechanism comprises a polishing part for polishing the polishing wheel, the polishing part is connected with the machine body through a connecting part, and intermittent polishing of the polishing wheel is realized through a driving part.
The polishing mechanism further comprises an air blowing component, the air blowing component is fixedly connected with the connecting component, the output end of the air blowing component is communicated with the polishing portion through a connecting air pipe, and an air blowing hole is formed in the polishing portion.
The connecting component comprises a sliding seat, the sliding seat is fixedly connected with the machine body through a connecting part, a connecting seat is arranged on one side of the sliding seat, which is away from the polishing mechanism, in an extending mode, and the connecting seat is used for connecting the air blowing component; the sliding seat is connected with a connecting block in a sliding clamping manner, the lower end of the connecting block is fixedly provided with a driving wheel, one end of the driving wheel, which is away from the connecting block, is fixedly provided with a connecting rod, and the grinding part is fixedly connected with the connecting rod; and the cam is coaxially and fixedly arranged on the third rotating shaft, and the side wall of the cam is abutted against the side wall of the driving wheel.
The connecting block is further provided with a driving rod, the extending direction of the driving rod is the same as that of the sliding seat, and one end, deviating from the connecting block, of the driving rod is fixedly connected with a piston rod of the blowing component.
The invention has the advantages that:
the round silicon wafer and the square silicon wafer can be fixed by arranging the placing mechanism, so that the adaptability of the polishing device is improved, the practicability of the polishing device is improved, the polishing mechanism can be polished, the polishing effect on the silicon wafer is improved, impurities are prevented from adhering to the polishing mechanism, the polishing effect is affected, in the working process of the polishing mechanism, the polishing mechanism can automatically polish the polishing mechanism, no additional power source is needed, the production and manufacturing cost is reduced, the stability of the polishing device is improved, and the practicability of the polishing device is improved.
Drawings
FIG. 1 is a schematic view of an isometric structure of the present invention;
FIG. 2 is a schematic view of an isometric structure of the internal structure of the body of the present invention;
FIG. 3 is an isometric partial cross-sectional view of the internal structure of the body of the present invention;
FIG. 4 is an enlarged view at A in FIG. 3;
fig. 5 is a front view of the present invention.
Detailed Description
The following detailed description of the invention provides specific embodiments with reference to the accompanying drawings.
The following detailed description of the present invention will provide clear and complete description of the technical solutions of the embodiments of the present invention, with reference to fig. 1 to 5, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1-5, the invention relates to a silicon wafer edge polishing device, which comprises a machine body 1, wherein a placing mechanism 2 for placing a silicon wafer is arranged on the machine body 1, and the placing mechanism 2 is arranged on the machine body 1 in a sliding manner; a polishing mechanism 3 for polishing a silicon wafer, the polishing mechanism 3 being arranged on the inner top wall of the machine body 1; the polishing mechanism 4 is used for polishing the polishing mechanism 3, the polishing mechanism 4 is arranged on one side, far away from the placement mechanism 2, of the polishing mechanism 3, and when the polishing mechanism 3 works, the polishing mechanism 4 can be driven to conduct polishing operation on the polishing mechanism 3.
The round silicon wafers and the square silicon wafers can be fixed through the arrangement of the placement mechanism 2, so that the adaptability of the polishing device is improved, the practicability of the polishing device is improved, meanwhile, the polishing mechanism 3 can be polished through the arrangement of the polishing mechanism 4, the polishing effect on the silicon wafers can be improved, impurities are prevented from adhering to the polishing mechanism 3 to influence the polishing effect, in the working process of the polishing mechanism 3, the polishing mechanism 4 can automatically polish the polishing mechanism 3, no additional power source is needed, the production and manufacturing cost is reduced, the stability of the polishing device is improved, and the practicability of the polishing device is improved.
In one embodiment of the present invention, the placement mechanism 2 includes a sliding component 21, the sliding component 21 is disposed on a horizontal workbench of the machine body 1, a mounting portion 22 is slidably connected to the sliding component 21, and a suction pump and a first motor are fixedly placed inside the mounting portion 22; the mounting part 22 is provided with a transmission part 23, the transmission part 23 is used for fixing a silicon wafer to be processed, one end of the mounting part 22 is provided with a placing part 24, and the placing part 24 is connected with the suction pump through the transmission part 23.
The sliding component 21 comprises an X-axis linear slide rail 211 and a Y-axis linear slide rail 212, so that the mounting part 22 can move along the X-axis direction and the Y-axis direction, and the central positions of the placing part 24 and the polishing mechanism 3 can be adjusted, and polishing operations on silicon wafers with different sizes can be realized;
further, the sliding member 21 is electrically connected to an external programmable controller, and when the square silicon wafer is processed, the edge of the square silicon wafer is polished by the movement of the mounting portion 22 on the sliding member 21.
Meanwhile, a suction pump is arranged to form vacuum between the placing part 24 and the silicon wafer, so that the silicon wafer is adsorbed on the placing part 24, and the problem that the silicon wafer is difficult to clamp when the edge of the silicon wafer is polished is solved.
In one embodiment of the present invention, the transmission member 23 includes a first rotating shaft 231, an air guide channel is provided on the first rotating shaft 231 along an axial direction, one end of the air guide channel on the first rotating shaft 231 is connected with an output end of the getter pump in a sealing manner, the first rotating shaft 231 is connected with the mounting portion 22 in a rotating manner, a second rotating shaft 232 is further provided on the mounting portion 22, one end of the second rotating shaft 232 is fixedly connected with an output end of the first motor, a first gear 233 is coaxially and fixedly sleeved on the first rotating shaft 231, a second gear 234 is coaxially and fixedly sleeved on the second rotating shaft 232, and the first gear 233 is meshed with the second gear 234.
When polishing the round silicon wafer, the first motor is started to drive the second rotating shaft 232 to rotate, the second rotating shaft 232 drives the first rotating shaft 231 to rotate through the second gear 234 and the first gear 233, so that the placing part 24 is driven to rotate, and the silicon wafer is driven to rotate, so that the edge of the silicon wafer can be polished, and the adaptability of the polishing device is improved.
In one embodiment of the present invention, the polishing mechanism 3 includes a third rotating shaft 31, the third rotating shaft 31 is fixedly connected to an output end of the second motor provided on the machine body 1, and a polishing wheel 32 is provided at the other end of the third rotating shaft 31.
In the working process, the second motor drives the third rotating shaft 31 to rotate, so that the polishing wheel 32 is driven to rotate, and the silicon wafer is polished.
In one embodiment of the present invention, the third rotating shaft 31 is telescopically arranged along an axial direction thereof. By providing the third rotation shaft 31 to be telescopic, silicon wafers of different thicknesses can be polished, and the adaptability of the present invention can be further improved.
In one embodiment of the invention, the polishing wheel 32 includes an arcuate shaped processing groove. The arc-shaped processing groove is arranged on the polishing wheel 32, so that the edge of the silicon wafer can be polished more smoothly in the polishing process, sharp edges cannot be generated, and the staff is prevented from being scratched in the subsequent taking process.
In one embodiment of the present invention, the dressing mechanism 4 includes a dressing portion 43 for dressing the polishing wheel 32, the dressing portion 43 is connected to the machine body 1 by a connecting member, and intermittent dressing of the polishing wheel 32 is achieved by a driving member.
The polishing wheel 32 is polished by arranging the polishing part 43, so that impurities are not attached to the polishing wheel 32, the polishing effect is improved, and further, the intermittent polishing of the polishing wheel 32 is realized by the driving part, so that the polishing wheel 32 is prevented from being worn too fast due to excessive polishing, and the practicability of the polishing wheel is improved.
In one embodiment of the present invention, the polishing mechanism 4 further includes an air blowing component 46, the air blowing component 46 is fixedly connected with the connecting component, an output end of the air blowing component 46 is communicated with the polishing portion 43 through a connecting air pipe 48, and an air blowing hole 431 is formed in the polishing portion 43.
By providing the air blowing member 46, in the polishing process of the polishing wheel 32 by the polishing portion 43, air can be blown to the polishing wheel 32, dust generated during polishing can be blown away, the dust is prevented from adhering to the polishing wheel 32 again, and meanwhile, the polishing wheel 32 can be cooled, so that the polishing effect on a silicon wafer is further improved, and the practicability of the polishing device is improved.
In one embodiment of the present invention, the connecting component includes a sliding seat 41, the sliding seat 41 is fixedly connected with the machine body 1 through a connecting portion 412, a connecting seat 411 is arranged on one side of the sliding seat 41 away from the polishing mechanism in an extending manner, and the connecting seat 411 is used for connecting the air blowing component 46; a connecting block 45 is connected to the sliding seat 41 in a sliding and clamping manner, a driving wheel 44 is fixedly arranged at the lower end of the connecting block 45, a connecting rod 42 is fixedly arranged at one end, away from the connecting block 45, of the driving wheel 44, and the grinding part 43 is fixedly connected with the connecting rod 42; the cam 33, the cam 33 is coaxially and fixedly disposed on the third rotating shaft 31, the side wall of the cam 33 abuts against the side wall of the driving wheel 44, and a connecting spring (not shown) is fixedly disposed between the connecting block 45 and the slide 41.
By providing the cam 33 and the driving wheel 44, when the third rotating shaft 31 rotates, the cam 33 can be driven to rotate, so that the driving wheel 44 is pushed back and forth, so that the connecting block 45 can reciprocate, and the grinding part 43 is driven to intermittently contact with the polishing wheel 32, so that intermittent grinding work is realized.
Further, the connecting block 45 is further provided with a driving rod 47, the extending direction of the driving rod 47 is the same as that of the sliding seat 41, one end of the driving rod 47 away from the connecting block 45 is fixedly connected with a piston rod of the air blowing component 46, and when the connecting block 45 reciprocates, the driving rod 47 can be driven to reciprocate, so that the air blowing component 46 can continuously blow air, and the polishing wheel 32 can be continuously blown and cooled, so that the polishing effect on silicon wafers is improved, and the practicability of the polishing device is improved.
The embodiments of the present invention are disclosed as preferred embodiments, but not limited thereto, and those skilled in the art will readily appreciate from the foregoing description that various extensions and modifications can be made without departing from the spirit of the present invention.
Claims (6)
1. The utility model provides a silicon chip edge burnishing device, includes organism, its characterized in that: the machine body is provided with a placing mechanism for placing the silicon wafers, and the placing mechanism is arranged on the machine body in a sliding manner; the polishing mechanism is used for polishing the silicon wafer and is arranged on the inner top wall of the machine body, and comprises a third rotating shaft; the polishing mechanism is arranged on one side of the polishing mechanism far away from the placement mechanism, and can be driven to perform polishing operation on the polishing mechanism when the polishing mechanism works;
the polishing mechanism comprises a polishing part for polishing the polishing wheel, the polishing part is connected with the machine body through a connecting part, and intermittent polishing of the polishing wheel is realized through a driving part; the polishing mechanism further comprises an air blowing component, the air blowing component is fixedly connected with the connecting component, the output end of the air blowing component is communicated with the polishing part through a connecting air pipe, and an air blowing hole is formed in the polishing part;
the connecting component comprises a sliding seat, the sliding seat is fixedly connected with the machine body through a connecting part, a connecting seat is arranged on one side of the sliding seat, which is away from the polishing mechanism, in an extending mode, and the connecting seat is used for connecting the air blowing component; the sliding seat is connected with a connecting block in a sliding clamping manner, the lower end of the connecting block is fixedly provided with a driving wheel, one end of the driving wheel, which is away from the connecting block, is fixedly provided with a connecting rod, and the grinding part is fixedly connected with the connecting rod; the cam is coaxially and fixedly arranged on the third rotating shaft, and the side wall of the cam is abutted against the side wall of the driving wheel;
the connecting block is further provided with a driving rod, the extending direction of the driving rod is the same as that of the sliding seat, and one end, deviating from the connecting block, of the driving rod is fixedly connected with a piston rod of the blowing component.
2. The silicon wafer edge polishing apparatus as set forth in claim 1, wherein: the placing mechanism comprises a sliding part, the sliding part is arranged on a horizontal workbench of the machine body, the sliding part is connected with a mounting part in a sliding manner, and a suction pump and a first motor are fixedly placed in the mounting part; the device is characterized in that a transmission part is arranged on the installation part, one end of the installation part is provided with a placement part, and the placement part is connected with the suction pump through the transmission part and is used for fixing a silicon wafer to be processed.
3. A silicon wafer edge polishing apparatus as set forth in claim 2 wherein: the transmission part comprises a first rotating shaft, an air guide channel is formed in the first rotating shaft along the axis direction, one end of the air guide channel in the first rotating shaft is in sealing connection with the output end of the suction pump, the first rotating shaft is rotationally connected with the mounting part, a second rotating shaft is further arranged on the mounting part, one end of the second rotating shaft is fixedly connected with the output end of the first motor, a first gear is coaxially and fixedly sleeved on the first rotating shaft, a second gear is coaxially and fixedly sleeved on the second rotating shaft, and the first gear is in meshed connection with the second gear.
4. A silicon wafer edge polishing apparatus according to claim 1, 2 or 3, wherein: the third rotating shaft is fixedly connected with the output end of the second motor arranged on the machine body, and the other end of the third rotating shaft is provided with a polishing wheel.
5. The wafer edge polishing apparatus as set forth in claim 4, wherein: the third rotating shaft is arranged in a telescopic way along the axis direction of the third rotating shaft.
6. The wafer edge polishing apparatus as set forth in claim 4, wherein: the polishing wheel comprises an arc-shaped processing groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111483007.XA CN114147613B (en) | 2021-12-07 | 2021-12-07 | Silicon wafer edge polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111483007.XA CN114147613B (en) | 2021-12-07 | 2021-12-07 | Silicon wafer edge polishing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114147613A CN114147613A (en) | 2022-03-08 |
| CN114147613B true CN114147613B (en) | 2023-06-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111483007.XA Active CN114147613B (en) | 2021-12-07 | 2021-12-07 | Silicon wafer edge polishing device |
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Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5236515B2 (en) * | 2009-01-28 | 2013-07-17 | 株式会社荏原製作所 | Dressing apparatus, chemical mechanical polishing apparatus and method |
| CN201446460U (en) * | 2009-08-06 | 2010-05-05 | 吴根 | Intermittent automatic knife grinder |
| CN203918783U (en) * | 2014-06-24 | 2014-11-05 | 浙江司贝宁精工科技有限公司 | The automatic dressing polishing wheel mechanism that a kind of digital control polishing machine tool is used |
| CN203973393U (en) * | 2014-07-09 | 2014-12-03 | 袁泽 | The cooling wheel dressing mechanism of centreless grinding line |
| CN105773165B (en) * | 2016-03-25 | 2018-09-04 | 大连理工大学 | A kind of lightweight cross core dot matrix foam battenboard drilled hole polishing method being suitable for integrating shock resistance and noise reduction |
| CN207757465U (en) * | 2017-12-18 | 2018-08-24 | 东旭集团有限公司 | Wheel dress device |
| CN209190478U (en) * | 2018-11-01 | 2019-08-02 | 惠州市兴源自动化设备有限公司 | Five axis, four station polissoir for the polishing of mobile phone shell side |
| CN109571185A (en) * | 2019-01-05 | 2019-04-05 | 中山容大光学科技有限公司 | Optical lens piece grinds machine |
| CN212527061U (en) * | 2020-06-13 | 2021-02-12 | 常州聚仁精密工具有限公司 | Automatic grinding device for ultrahigh-hardness drill bit water gap |
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| CN114147613A (en) | 2022-03-08 |
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