CN110520960B - 用于远程感测等离子体的系统和方法 - Google Patents

用于远程感测等离子体的系统和方法 Download PDF

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Publication number
CN110520960B
CN110520960B CN201880023299.9A CN201880023299A CN110520960B CN 110520960 B CN110520960 B CN 110520960B CN 201880023299 A CN201880023299 A CN 201880023299A CN 110520960 B CN110520960 B CN 110520960B
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plasma
field
frequency
antenna
plasma source
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Chinese (zh)
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CN110520960A (zh
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P·J·麦克纳利
S·凯利
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Dublin City University
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Dublin City University
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32963—End-point detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32972—Spectral analysis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/3299—Feedback systems

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
CN201880023299.9A 2017-03-31 2018-03-23 用于远程感测等离子体的系统和方法 Active CN110520960B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB1705202.8A GB201705202D0 (en) 2017-03-31 2017-03-31 System and method for remote sensing a plasma
GB1705202.8 2017-03-31
PCT/EP2018/057556 WO2018177965A1 (en) 2017-03-31 2018-03-23 System and method for remote sensing a plasma

Publications (2)

Publication Number Publication Date
CN110520960A CN110520960A (zh) 2019-11-29
CN110520960B true CN110520960B (zh) 2023-05-23

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US (2) US11476098B2 (enExample)
EP (1) EP3602602B1 (enExample)
JP (1) JP7115759B2 (enExample)
KR (1) KR102311686B1 (enExample)
CN (1) CN110520960B (enExample)
GB (1) GB201705202D0 (enExample)
WO (1) WO2018177965A1 (enExample)

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CN110351940B (zh) * 2019-06-11 2021-07-30 中国科学院合肥物质科学研究院 一种用于测量离子回旋辐射的高频磁探针诊断系统
KR20220161453A (ko) * 2020-03-31 2022-12-06 램 리써치 코포레이션 고조파 (harmonic) 측정들 및 균일도 제어를 위한 RF 자기장 센서
GB202005828D0 (en) * 2020-04-21 2020-06-03 Univ Dublin City Electromagnetic field signal acquisition system for high signal-t-noise ratios, and electrical noise immunity
GB202016105D0 (en) * 2020-10-09 2020-11-25 Univ Dublin City Non-invasive measurement of plasma systems
CN112820618B (zh) * 2020-12-14 2023-04-07 兰州空间技术物理研究所 一种微型溅射离子泵等离子体诊断装置及诊断方法
EP4020520A1 (en) * 2020-12-22 2022-06-29 Impedans Ltd Apparatus for sensing rf signals from rf plasma processing equipment
CN113128050B (zh) * 2021-04-21 2023-04-25 西安电子科技大学 基于波阻抗不变点的等离子体电子密度和碰撞频率联合诊断方法
KR20230050500A (ko) * 2021-10-07 2023-04-17 삼성전자주식회사 아킹 진단 장치와 이를 포함하는 플라즈마 공정 설비, 및 아킹 진단 방법
US20250118531A1 (en) * 2022-01-18 2025-04-10 Ucl Business Ltd Plasma Discharge Monitoring Method
KR102706432B1 (ko) * 2022-01-26 2024-10-04 김남헌 웨이퍼 식각을 위한 플라즈마 챔버 및 플라즈마 챔버를 이용한 웨이퍼 식각 방법
EP4250335A1 (en) 2022-03-25 2023-09-27 Impedans Ltd Apparatus for non-invasive sensing of radio-frequency current spectra flowing in a plasma processing chamber
KR102732381B1 (ko) * 2022-07-25 2024-11-25 한국기계연구원 박막 안테나형 플라즈마 진단장치 및 이를 포함하는 플라즈마 진단모듈
WO2024025241A1 (ko) * 2022-07-25 2024-02-01 한국기계연구원 플라즈마 진단용 박막형 초고주파 진단기 및 이를 포함하는 플라즈마 진단모듈
KR102790833B1 (ko) * 2022-08-18 2025-04-02 한국핵융합에너지연구원 플라즈마 모니터링용 뷰포트, 이를 포함하는 플라즈마 발생기 및 플라즈마 모니터링 방법
KR102743911B1 (ko) * 2022-10-21 2024-12-18 주식회사 나이스플라즈마 플라즈마 챔버 및 플라즈마 챔버를 이용한 웨이퍼 식각 방법

Citations (3)

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TW200731441A (en) * 2005-09-30 2007-08-16 Onwafer Technologies Inc Methods of and apparatuses for measuring electrical parameters of a plasma process
TW201338034A (zh) * 2012-03-01 2013-09-16 Hitachi High Tech Corp 乾蝕刻裝置及乾蝕刻方法
CN105188249A (zh) * 2014-06-16 2015-12-23 朗姆研究公司 确定反应室的介质表面上导电膜的存在

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US6566272B2 (en) * 1999-07-23 2003-05-20 Applied Materials Inc. Method for providing pulsed plasma during a portion of a semiconductor wafer process
JP2005531931A (ja) * 2002-07-03 2005-10-20 東京エレクトロン株式会社 半導体プロセスパラメータの非侵入性の測定と解析のための方法と装置
JP4364498B2 (ja) * 2002-10-30 2009-11-18 原田産業株式会社 異常放電検出装置及び方法
JP5404984B2 (ja) * 2003-04-24 2014-02-05 東京エレクトロン株式会社 プラズマモニタリング方法、プラズマモニタリング装置及びプラズマ処理装置
US20050188922A1 (en) * 2004-02-26 2005-09-01 Tokyo Electron Limited. Plasma processing unit
JP4601439B2 (ja) 2005-02-01 2010-12-22 株式会社日立ハイテクノロジーズ プラズマ処理装置
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US7655110B2 (en) * 2006-03-29 2010-02-02 Tokyo Electron Limited Plasma processing apparatus
US7993487B2 (en) * 2006-03-29 2011-08-09 Tokyo Electron Limited Plasma processing apparatus and method of measuring amount of radio-frequency current in plasma
KR101089951B1 (ko) * 2008-03-07 2011-12-05 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치
US20110217925A1 (en) * 2010-03-08 2011-09-08 Mark Rhodes Noise reducing near-field receiver antenna and system
KR20160120382A (ko) * 2015-04-07 2016-10-18 삼성전자주식회사 광학 분광 분석 장치 및 플라즈마 처리 장치
KR102417178B1 (ko) * 2015-09-03 2022-07-05 삼성전자주식회사 마이크로파 탐침, 그 탐침을 구비한 플라즈마 모니터링 시스템, 및 그 시스템을 이용한 반도체 소자 제조방법

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
TW200731441A (en) * 2005-09-30 2007-08-16 Onwafer Technologies Inc Methods of and apparatuses for measuring electrical parameters of a plasma process
TW201338034A (zh) * 2012-03-01 2013-09-16 Hitachi High Tech Corp 乾蝕刻裝置及乾蝕刻方法
CN105188249A (zh) * 2014-06-16 2015-12-23 朗姆研究公司 确定反应室的介质表面上导电膜的存在

Also Published As

Publication number Publication date
EP3602602B1 (en) 2021-01-13
KR20200021914A (ko) 2020-03-02
US20210104387A1 (en) 2021-04-08
GB201705202D0 (en) 2017-05-17
WO2018177965A1 (en) 2018-10-04
CN110520960A (zh) 2019-11-29
US11476098B2 (en) 2022-10-18
US20230230821A1 (en) 2023-07-20
EP3602602A1 (en) 2020-02-05
JP2020516024A (ja) 2020-05-28
US12278095B2 (en) 2025-04-15
KR102311686B1 (ko) 2021-10-13
JP7115759B2 (ja) 2022-08-09

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