CN110476226B - 基板处理装置 - Google Patents

基板处理装置 Download PDF

Info

Publication number
CN110476226B
CN110476226B CN201880022273.2A CN201880022273A CN110476226B CN 110476226 B CN110476226 B CN 110476226B CN 201880022273 A CN201880022273 A CN 201880022273A CN 110476226 B CN110476226 B CN 110476226B
Authority
CN
China
Prior art keywords
substrate
deformation
polishing
processing apparatus
substrate processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201880022273.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN110476226A (zh
Inventor
并木计介
福岛诚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN110476226A publication Critical patent/CN110476226A/zh
Application granted granted Critical
Publication of CN110476226B publication Critical patent/CN110476226B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0472—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0618—Apparatus for monitoring, sorting, marking, testing or measuring using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
    • B23Q15/007—Automatic control or regulation of feed movement, cutting velocity or position of tool or work while the tool acts upon the workpiece
    • B23Q15/16—Compensation for wear of the tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Automatic Control Of Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
CN201880022273.2A 2017-03-31 2018-01-16 基板处理装置 Active CN110476226B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017071573A JP6990980B2 (ja) 2017-03-31 2017-03-31 基板処理装置
JP2017-071573 2017-03-31
PCT/JP2018/000912 WO2018179685A1 (ja) 2017-03-31 2018-01-16 基板処理装置

Publications (2)

Publication Number Publication Date
CN110476226A CN110476226A (zh) 2019-11-19
CN110476226B true CN110476226B (zh) 2023-08-18

Family

ID=63677702

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880022273.2A Active CN110476226B (zh) 2017-03-31 2018-01-16 基板处理装置

Country Status (7)

Country Link
US (1) US11969858B2 (https=)
JP (1) JP6990980B2 (https=)
KR (1) KR102474471B1 (https=)
CN (1) CN110476226B (https=)
SG (1) SG11201908780RA (https=)
TW (1) TWI758436B (https=)
WO (1) WO2018179685A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102629679B1 (ko) * 2018-11-09 2024-01-29 주식회사 케이씨텍 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인
CN113767404A (zh) 2019-03-29 2021-12-07 圣戈班磨料磨具有限公司 高效研磨解决方案
BR112021019766A2 (pt) 2019-04-03 2021-12-07 Saint Gobain Abrasifs Sa Artigo abrasivo, sistema abrasivo e método para uso e formação dos mesmos
JP7523269B2 (ja) * 2020-07-13 2024-07-26 株式会社荏原製作所 基板処理装置及び音響センサ用防水装置
JP2022080370A (ja) * 2020-11-18 2022-05-30 株式会社荏原製作所 基板保持装置
JP7674505B2 (ja) * 2021-03-05 2025-05-09 アプライド マテリアルズ インコーポレイテッド 保持リングを分類するための機械学習
JP7772518B2 (ja) * 2021-07-16 2025-11-18 株式会社ディスコ ウエーハの処理方法
JP7638815B2 (ja) * 2021-07-21 2025-03-04 株式会社荏原製作所 ブレークイン処理装置、およびブレークイン処理方法
TWI789926B (zh) * 2021-09-28 2023-01-11 中國砂輪企業股份有限公司 研磨系統、研磨狀態感測系統及其資料庫與方法
US20250178149A1 (en) * 2022-02-25 2025-06-05 Ebara Corporation Substrate polishing apparatus
CN117121157A (zh) * 2022-03-23 2023-11-24 株式会社日立高新技术 诊断装置、半导体制造装置系统、半导体装置制造系统以及诊断方法
JP7763140B2 (ja) * 2022-03-30 2025-10-31 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
JP7840206B2 (ja) * 2022-04-27 2026-04-03 株式会社荏原製作所 弾性膜の初期化装置、研磨装置、および弾性膜の初期化方法
CN118636053A (zh) * 2024-08-15 2024-09-13 杭州积海半导体有限公司 气膜、cmp研磨系统及实时检测气膜性能的方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008310404A (ja) * 2007-06-12 2008-12-25 Nikon Corp 研磨装置
CN102802871A (zh) * 2010-03-19 2012-11-28 霓达哈斯股份有限公司 研磨装置、研磨垫及研磨信息管理系统

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6435956B1 (en) * 1999-02-02 2002-08-20 Ebara Corporation Wafer holder and polishing device
JP4101403B2 (ja) * 1999-06-22 2008-06-18 株式会社荏原製作所 ウェーハ研磨装置及びウェーハ製造方法
TW436382B (en) 1999-03-12 2001-05-28 Mitsubishi Materials Corp Wafer holding head, wafer polishing apparatus, and method for making wafers
US6494765B2 (en) 2000-09-25 2002-12-17 Center For Tribology, Inc. Method and apparatus for controlled polishing
JP2002219645A (ja) 2000-11-21 2002-08-06 Nikon Corp 研磨装置、この研磨装置を用いた半導体デバイス製造方法並びにこの製造方法によって製造された半導体デバイス
JP2005123485A (ja) 2003-10-17 2005-05-12 Ebara Corp 研磨装置
CN1972780B (zh) * 2004-06-21 2010-09-08 株式会社荏原制作所 抛光设备和抛光方法
US20060014475A1 (en) 2004-07-15 2006-01-19 Disco Corporation Grindstone tool
EP1975985A4 (en) 2006-01-25 2011-08-10 Jsr Corp CHEMICAL-MECHANICAL POLISHING ELEMENT AND METHOD OF MANUFACTURING THEREOF
US7840305B2 (en) 2006-06-28 2010-11-23 3M Innovative Properties Company Abrasive articles, CMP monitoring system and method
DE102007011880A1 (de) 2007-03-13 2008-09-18 Peter Wolters Gmbh Bearbeitungsmaschine mit Mitteln zur Erfassung von Bearbeitungsparametern
JP5552401B2 (ja) 2010-09-08 2014-07-16 株式会社荏原製作所 研磨装置および方法
JP5677004B2 (ja) * 2010-09-30 2015-02-25 株式会社荏原製作所 研磨装置および方法
JP5868081B2 (ja) * 2011-09-05 2016-02-24 株式会社ディスコ 加工装置
JP5891127B2 (ja) * 2012-07-03 2016-03-22 株式会社荏原製作所 研磨装置および研磨方法
US9105516B2 (en) 2012-07-03 2015-08-11 Ebara Corporation Polishing apparatus and polishing method
US20140020829A1 (en) 2012-07-18 2014-01-23 Applied Materials, Inc. Sensors in Carrier Head of a CMP System
KR20150085000A (ko) 2012-11-16 2015-07-22 어플라이드 머티어리얼스, 인코포레이티드 캐리어 헤드용 센서들에 의한 기록 측정들
JP2014223684A (ja) * 2013-05-15 2014-12-04 株式会社東芝 研磨装置および研磨方法
US9454684B2 (en) 2014-05-28 2016-09-27 Taiwan Semiconductor Manufacturing Company Limited Edge crack detection system
US9878421B2 (en) 2014-06-16 2018-01-30 Applied Materials, Inc. Chemical mechanical polishing retaining ring with integrated sensor
KR101913701B1 (ko) * 2015-03-13 2018-11-02 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드
JP6557049B2 (ja) * 2015-04-23 2019-08-07 株式会社ディスコ 加工装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008310404A (ja) * 2007-06-12 2008-12-25 Nikon Corp 研磨装置
CN102802871A (zh) * 2010-03-19 2012-11-28 霓达哈斯股份有限公司 研磨装置、研磨垫及研磨信息管理系统

Also Published As

Publication number Publication date
KR102474471B1 (ko) 2022-12-06
TW201836763A (zh) 2018-10-16
JP2018174230A (ja) 2018-11-08
US20200023487A1 (en) 2020-01-23
JP6990980B2 (ja) 2022-01-12
WO2018179685A1 (ja) 2018-10-04
US11969858B2 (en) 2024-04-30
KR20190134665A (ko) 2019-12-04
CN110476226A (zh) 2019-11-19
SG11201908780RA (en) 2019-10-30
TWI758436B (zh) 2022-03-21

Similar Documents

Publication Publication Date Title
CN110476226B (zh) 基板处理装置
TWI784711B (zh) 用於研磨設備的承載頭的壓力控制組件及方法
US11683923B2 (en) Maintenance management device
CN105428275A (zh) 处理模块、处理装置及处理方法
KR101998453B1 (ko) 연마 방법 및 연마 장치
TWI763013B (zh) 經由定向的晶圓裝載作不對稱性校正
CN109807739A (zh) 化学机械研磨设备
KR20200003959A (ko) 기판 연마 시스템
TWI821480B (zh) 基板處理裝置及基板處理裝置中應部分研磨區域之限定方法
JP7104254B2 (ja) 保守管理装置
JP7779778B2 (ja) 基板研磨装置および基板研磨方法
WO2023223959A1 (ja) 基板研磨方法、プログラム、および、基板研磨装置
JP2017188500A (ja) 検査方法、検査装置及び検査システム
JP7348018B2 (ja) 加工装置
TW201324600A (zh) 化學機械研磨製程及化學機械研磨系統
JP7790897B2 (ja) 基板処理装置
JP2025032561A (ja) 情報処理装置、基板処理装置、及び、情報処理方法
KR20050065842A (ko) 폴리싱패드상의 웨이퍼 위치 검출장치

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant