JP6990980B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

Info

Publication number
JP6990980B2
JP6990980B2 JP2017071573A JP2017071573A JP6990980B2 JP 6990980 B2 JP6990980 B2 JP 6990980B2 JP 2017071573 A JP2017071573 A JP 2017071573A JP 2017071573 A JP2017071573 A JP 2017071573A JP 6990980 B2 JP6990980 B2 JP 6990980B2
Authority
JP
Japan
Prior art keywords
substrate
polishing
strain
control device
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017071573A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018174230A (ja
JP2018174230A5 (https=
Inventor
計介 並木
誠 福島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2017071573A priority Critical patent/JP6990980B2/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to KR1020197030937A priority patent/KR102474471B1/ko
Priority to SG11201908780R priority patent/SG11201908780RA/en
Priority to PCT/JP2018/000912 priority patent/WO2018179685A1/ja
Priority to US16/499,576 priority patent/US11969858B2/en
Priority to CN201880022273.2A priority patent/CN110476226B/zh
Priority to TW107108771A priority patent/TWI758436B/zh
Publication of JP2018174230A publication Critical patent/JP2018174230A/ja
Publication of JP2018174230A5 publication Critical patent/JP2018174230A5/ja
Application granted granted Critical
Publication of JP6990980B2 publication Critical patent/JP6990980B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
    • B23Q15/007—Automatic control or regulation of feed movement, cutting velocity or position of tool or work while the tool acts upon the workpiece
    • B23Q15/16—Compensation for wear of the tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0472—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0618—Apparatus for monitoring, sorting, marking, testing or measuring using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Automatic Control Of Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2017071573A 2017-03-31 2017-03-31 基板処理装置 Active JP6990980B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2017071573A JP6990980B2 (ja) 2017-03-31 2017-03-31 基板処理装置
SG11201908780R SG11201908780RA (en) 2017-03-31 2018-01-16 Substrate processing apparatus
PCT/JP2018/000912 WO2018179685A1 (ja) 2017-03-31 2018-01-16 基板処理装置
US16/499,576 US11969858B2 (en) 2017-03-31 2018-01-16 Substrate processing apparatus
KR1020197030937A KR102474471B1 (ko) 2017-03-31 2018-01-16 기판 처리 장치
CN201880022273.2A CN110476226B (zh) 2017-03-31 2018-01-16 基板处理装置
TW107108771A TWI758436B (zh) 2017-03-31 2018-03-15 彈性膜、扣環及基板處理裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017071573A JP6990980B2 (ja) 2017-03-31 2017-03-31 基板処理装置

Publications (3)

Publication Number Publication Date
JP2018174230A JP2018174230A (ja) 2018-11-08
JP2018174230A5 JP2018174230A5 (https=) 2020-05-07
JP6990980B2 true JP6990980B2 (ja) 2022-01-12

Family

ID=63677702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017071573A Active JP6990980B2 (ja) 2017-03-31 2017-03-31 基板処理装置

Country Status (7)

Country Link
US (1) US11969858B2 (https=)
JP (1) JP6990980B2 (https=)
KR (1) KR102474471B1 (https=)
CN (1) CN110476226B (https=)
SG (1) SG11201908780RA (https=)
TW (1) TWI758436B (https=)
WO (1) WO2018179685A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102629679B1 (ko) * 2018-11-09 2024-01-29 주식회사 케이씨텍 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인
CN113767404A (zh) 2019-03-29 2021-12-07 圣戈班磨料磨具有限公司 高效研磨解决方案
BR112021019766A2 (pt) 2019-04-03 2021-12-07 Saint Gobain Abrasifs Sa Artigo abrasivo, sistema abrasivo e método para uso e formação dos mesmos
JP7523269B2 (ja) * 2020-07-13 2024-07-26 株式会社荏原製作所 基板処理装置及び音響センサ用防水装置
JP2022080370A (ja) * 2020-11-18 2022-05-30 株式会社荏原製作所 基板保持装置
JP7674505B2 (ja) * 2021-03-05 2025-05-09 アプライド マテリアルズ インコーポレイテッド 保持リングを分類するための機械学習
JP7772518B2 (ja) * 2021-07-16 2025-11-18 株式会社ディスコ ウエーハの処理方法
JP7638815B2 (ja) * 2021-07-21 2025-03-04 株式会社荏原製作所 ブレークイン処理装置、およびブレークイン処理方法
TWI789926B (zh) * 2021-09-28 2023-01-11 中國砂輪企業股份有限公司 研磨系統、研磨狀態感測系統及其資料庫與方法
US20250178149A1 (en) * 2022-02-25 2025-06-05 Ebara Corporation Substrate polishing apparatus
CN117121157A (zh) * 2022-03-23 2023-11-24 株式会社日立高新技术 诊断装置、半导体制造装置系统、半导体装置制造系统以及诊断方法
JP7763140B2 (ja) * 2022-03-30 2025-10-31 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
JP7840206B2 (ja) * 2022-04-27 2026-04-03 株式会社荏原製作所 弾性膜の初期化装置、研磨装置、および弾性膜の初期化方法
CN118636053A (zh) * 2024-08-15 2024-09-13 杭州积海半导体有限公司 气膜、cmp研磨系统及实时检测气膜性能的方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000045993A1 (en) 1999-02-02 2000-08-10 Ebara Corporation Wafer holder and polishing device
JP2001009712A (ja) 1999-06-22 2001-01-16 Mitsubishi Materials Corp ウェーハ研磨装置及びウェーハ製造方法
JP2008310404A (ja) 2007-06-12 2008-12-25 Nikon Corp 研磨装置
JP2009542449A (ja) 2006-06-28 2009-12-03 スリーエム イノベイティブ プロパティズ カンパニー 研磨物品、ｃｍｐモニタリングシステム及び方法
JP2011194509A (ja) 2010-03-19 2011-10-06 Nitta Haas Inc 研磨装置、研磨パッドおよび研磨情報管理システム
JP2013052483A (ja) 2011-09-05 2013-03-21 Disco Corp 加工装置
JP2014011432A (ja) 2012-07-03 2014-01-20 Ebara Corp 研磨装置および研磨方法
JP2014223684A (ja) 2013-05-15 2014-12-04 株式会社東芝 研磨装置および研磨方法
JP2015051501A (ja) 2010-09-30 2015-03-19 株式会社荏原製作所 研磨装置および方法
JP2016207862A (ja) 2015-04-23 2016-12-08 株式会社ディスコ 加工装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW436382B (en) 1999-03-12 2001-05-28 Mitsubishi Materials Corp Wafer holding head, wafer polishing apparatus, and method for making wafers
US6494765B2 (en) 2000-09-25 2002-12-17 Center For Tribology, Inc. Method and apparatus for controlled polishing
JP2002219645A (ja) 2000-11-21 2002-08-06 Nikon Corp 研磨装置、この研磨装置を用いた半導体デバイス製造方法並びにこの製造方法によって製造された半導体デバイス
JP2005123485A (ja) 2003-10-17 2005-05-12 Ebara Corp 研磨装置
CN1972780B (zh) * 2004-06-21 2010-09-08 株式会社荏原制作所 抛光设备和抛光方法
US20060014475A1 (en) 2004-07-15 2006-01-19 Disco Corporation Grindstone tool
EP1975985A4 (en) 2006-01-25 2011-08-10 Jsr Corp CHEMICAL-MECHANICAL POLISHING ELEMENT AND METHOD OF MANUFACTURING THEREOF
DE102007011880A1 (de) 2007-03-13 2008-09-18 Peter Wolters Gmbh Bearbeitungsmaschine mit Mitteln zur Erfassung von Bearbeitungsparametern
JP5552401B2 (ja) 2010-09-08 2014-07-16 株式会社荏原製作所 研磨装置および方法
US9105516B2 (en) 2012-07-03 2015-08-11 Ebara Corporation Polishing apparatus and polishing method
US20140020829A1 (en) 2012-07-18 2014-01-23 Applied Materials, Inc. Sensors in Carrier Head of a CMP System
KR20150085000A (ko) 2012-11-16 2015-07-22 어플라이드 머티어리얼스, 인코포레이티드 캐리어 헤드용 센서들에 의한 기록 측정들
US9454684B2 (en) 2014-05-28 2016-09-27 Taiwan Semiconductor Manufacturing Company Limited Edge crack detection system
US9878421B2 (en) 2014-06-16 2018-01-30 Applied Materials, Inc. Chemical mechanical polishing retaining ring with integrated sensor
KR101913701B1 (ko) * 2015-03-13 2018-11-02 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000045993A1 (en) 1999-02-02 2000-08-10 Ebara Corporation Wafer holder and polishing device
JP2001009712A (ja) 1999-06-22 2001-01-16 Mitsubishi Materials Corp ウェーハ研磨装置及びウェーハ製造方法
JP2009542449A (ja) 2006-06-28 2009-12-03 スリーエム イノベイティブ プロパティズ カンパニー 研磨物品、ｃｍｐモニタリングシステム及び方法
JP2008310404A (ja) 2007-06-12 2008-12-25 Nikon Corp 研磨装置
JP2011194509A (ja) 2010-03-19 2011-10-06 Nitta Haas Inc 研磨装置、研磨パッドおよび研磨情報管理システム
JP2015051501A (ja) 2010-09-30 2015-03-19 株式会社荏原製作所 研磨装置および方法
JP2013052483A (ja) 2011-09-05 2013-03-21 Disco Corp 加工装置
JP2014011432A (ja) 2012-07-03 2014-01-20 Ebara Corp 研磨装置および研磨方法
JP2014223684A (ja) 2013-05-15 2014-12-04 株式会社東芝 研磨装置および研磨方法
JP2016207862A (ja) 2015-04-23 2016-12-08 株式会社ディスコ 加工装置

Also Published As

Publication number Publication date
KR102474471B1 (ko) 2022-12-06
TW201836763A (zh) 2018-10-16
JP2018174230A (ja) 2018-11-08
US20200023487A1 (en) 2020-01-23
WO2018179685A1 (ja) 2018-10-04
US11969858B2 (en) 2024-04-30
KR20190134665A (ko) 2019-12-04
CN110476226A (zh) 2019-11-19
SG11201908780RA (en) 2019-10-30
TWI758436B (zh) 2022-03-21
CN110476226B (zh) 2023-08-18

Similar Documents

Publication Publication Date Title
JP6990980B2 (ja) 基板処理装置
US9403256B2 (en) Recording measurements by sensors for a carrier head
EP3765238B1 (en) Consumable part monitoring in chemical mechanical polisher
JP6757696B2 (ja) 漏れ検査方法、およびこの漏れ検査方法を実行するためのプログラムを記録したコンピュータ読み取り可能な記録媒体
US7914363B2 (en) Smart conditioner rinse station
JP6917966B2 (ja) 弾性膜のストレッチ動作プログラム、弾性膜のストレッチ動作方法、および研磨装置
JP6906425B2 (ja) 基板処理装置
TWI821480B (zh) 基板處理裝置及基板處理裝置中應部分研磨區域之限定方法
JP7840206B2 (ja) 弾性膜の初期化装置、研磨装置、および弾性膜の初期化方法
CN101422867B (zh) 智能调整器冲洗站

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200325

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200325

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210629

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210817

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20211109

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20211207

R150 Certificate of patent or registration of utility model

Ref document number: 6990980

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250