TWI758436B - 彈性膜、扣環及基板處理裝置 - Google Patents

彈性膜、扣環及基板處理裝置 Download PDF

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Publication number
TWI758436B
TWI758436B TW107108771A TW107108771A TWI758436B TW I758436 B TWI758436 B TW I758436B TW 107108771 A TW107108771 A TW 107108771A TW 107108771 A TW107108771 A TW 107108771A TW I758436 B TWI758436 B TW I758436B
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TW
Taiwan
Prior art keywords
substrate
elastic film
distortion
polishing
substrate processing
Prior art date
Application number
TW107108771A
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English (en)
Chinese (zh)
Other versions
TW201836763A (zh
Inventor
並木計介
福島誠
Original Assignee
日商荏原製作所股份有限公司
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Publication of TW201836763A publication Critical patent/TW201836763A/zh
Application granted granted Critical
Publication of TWI758436B publication Critical patent/TWI758436B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
    • B23Q15/007—Automatic control or regulation of feed movement, cutting velocity or position of tool or work while the tool acts upon the workpiece
    • B23Q15/16—Compensation for wear of the tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0472—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0618—Apparatus for monitoring, sorting, marking, testing or measuring using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Automatic Control Of Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW107108771A 2017-03-31 2018-03-15 彈性膜、扣環及基板處理裝置 TWI758436B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017071573A JP6990980B2 (ja) 2017-03-31 2017-03-31 基板処理装置
JP2017-071573 2017-03-31

Publications (2)

Publication Number Publication Date
TW201836763A TW201836763A (zh) 2018-10-16
TWI758436B true TWI758436B (zh) 2022-03-21

Family

ID=63677702

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107108771A TWI758436B (zh) 2017-03-31 2018-03-15 彈性膜、扣環及基板處理裝置

Country Status (7)

Country Link
US (1) US11969858B2 (https=)
JP (1) JP6990980B2 (https=)
KR (1) KR102474471B1 (https=)
CN (1) CN110476226B (https=)
SG (1) SG11201908780RA (https=)
TW (1) TWI758436B (https=)
WO (1) WO2018179685A1 (https=)

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KR102629679B1 (ko) * 2018-11-09 2024-01-29 주식회사 케이씨텍 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인
CN113767404A (zh) 2019-03-29 2021-12-07 圣戈班磨料磨具有限公司 高效研磨解决方案
BR112021019766A2 (pt) 2019-04-03 2021-12-07 Saint Gobain Abrasifs Sa Artigo abrasivo, sistema abrasivo e método para uso e formação dos mesmos
JP7523269B2 (ja) * 2020-07-13 2024-07-26 株式会社荏原製作所 基板処理装置及び音響センサ用防水装置
JP2022080370A (ja) * 2020-11-18 2022-05-30 株式会社荏原製作所 基板保持装置
JP7674505B2 (ja) * 2021-03-05 2025-05-09 アプライド マテリアルズ インコーポレイテッド 保持リングを分類するための機械学習
JP7772518B2 (ja) * 2021-07-16 2025-11-18 株式会社ディスコ ウエーハの処理方法
JP7638815B2 (ja) * 2021-07-21 2025-03-04 株式会社荏原製作所 ブレークイン処理装置、およびブレークイン処理方法
TWI789926B (zh) * 2021-09-28 2023-01-11 中國砂輪企業股份有限公司 研磨系統、研磨狀態感測系統及其資料庫與方法
US20250178149A1 (en) * 2022-02-25 2025-06-05 Ebara Corporation Substrate polishing apparatus
CN117121157A (zh) * 2022-03-23 2023-11-24 株式会社日立高新技术 诊断装置、半导体制造装置系统、半导体装置制造系统以及诊断方法
JP7763140B2 (ja) * 2022-03-30 2025-10-31 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
JP7840206B2 (ja) * 2022-04-27 2026-04-03 株式会社荏原製作所 弾性膜の初期化装置、研磨装置、および弾性膜の初期化方法
CN118636053A (zh) * 2024-08-15 2024-09-13 杭州积海半导体有限公司 气膜、cmp研磨系统及实时检测气膜性能的方法

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TW200610615A (en) * 2004-07-15 2006-04-01 Disco Corp Grindstone tool
TW200744787A (en) * 2006-01-25 2007-12-16 Jsr Corp Chemical mechanical polishing pad and method for manufacturing the same
TW200819243A (en) * 2006-06-28 2008-05-01 3M Innovative Properties Co Abrasive articles, CMP monitoring system and method
TW201143980A (en) * 2010-03-19 2011-12-16 Nitta Haas Inc Polishing apparatus, polishing pad, and polishing information management system
TW201404530A (zh) * 2012-07-18 2014-02-01 Applied Materials Inc Ｃｍｐ系統的承載頭中之感測器
TW201422367A (zh) * 2012-11-16 2014-06-16 Applied Materials Inc 藉由承載頭的感測器記錄量測値
US9073170B2 (en) * 2010-09-08 2015-07-07 Ebara Corporation Polishing apparatus having thermal energy measuring means
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TW201608657A (zh) * 2014-05-28 2016-03-01 台灣積體電路製造股份有限公司 邊緣裂縫偵測方法及系統

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Publication number Priority date Publication date Assignee Title
US20020037681A1 (en) * 2000-09-25 2002-03-28 Norm Gitis Method and apparatus for controlled polishing
TW200610615A (en) * 2004-07-15 2006-04-01 Disco Corp Grindstone tool
TW200744787A (en) * 2006-01-25 2007-12-16 Jsr Corp Chemical mechanical polishing pad and method for manufacturing the same
TW200819243A (en) * 2006-06-28 2008-05-01 3M Innovative Properties Co Abrasive articles, CMP monitoring system and method
TW201143980A (en) * 2010-03-19 2011-12-16 Nitta Haas Inc Polishing apparatus, polishing pad, and polishing information management system
US9073170B2 (en) * 2010-09-08 2015-07-07 Ebara Corporation Polishing apparatus having thermal energy measuring means
TW201404530A (zh) * 2012-07-18 2014-02-01 Applied Materials Inc Ｃｍｐ系統的承載頭中之感測器
TW201422367A (zh) * 2012-11-16 2014-06-16 Applied Materials Inc 藉由承載頭的感測器記錄量測値
TW201608657A (zh) * 2014-05-28 2016-03-01 台灣積體電路製造股份有限公司 邊緣裂縫偵測方法及系統
TW201600235A (zh) * 2014-06-16 2016-01-01 應用材料股份有限公司 具有整合式偵測器的化學機械硏磨保持環

Also Published As

Publication number Publication date
KR102474471B1 (ko) 2022-12-06
TW201836763A (zh) 2018-10-16
JP2018174230A (ja) 2018-11-08
US20200023487A1 (en) 2020-01-23
JP6990980B2 (ja) 2022-01-12
WO2018179685A1 (ja) 2018-10-04
US11969858B2 (en) 2024-04-30
KR20190134665A (ko) 2019-12-04
CN110476226A (zh) 2019-11-19
SG11201908780RA (en) 2019-10-30
CN110476226B (zh) 2023-08-18

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