SG11201908780RA - Substrate processing apparatus - Google Patents

Substrate processing apparatus

Info

Publication number
SG11201908780RA
SG11201908780RA SG11201908780RA SG11201908780RA SG 11201908780R A SG11201908780R A SG 11201908780RA SG 11201908780R A SG11201908780R A SG 11201908780RA SG 11201908780R A SG11201908780R A SG 11201908780RA
Authority
SG
Singapore
Prior art keywords
polishing
wafer
elastic membrane
strain
processing apparatus
Prior art date
Application number
Other languages
English (en)
Inventor
Keisuke Namiki
Makoto Fukushima
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG11201908780RA publication Critical patent/SG11201908780RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0472—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0618—Apparatus for monitoring, sorting, marking, testing or measuring using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
    • B23Q15/007—Automatic control or regulation of feed movement, cutting velocity or position of tool or work while the tool acts upon the workpiece
    • B23Q15/16—Compensation for wear of the tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Automatic Control Of Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
SG11201908780R 2017-03-31 2018-01-16 Substrate processing apparatus SG11201908780RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017071573A JP6990980B2 (ja) 2017-03-31 2017-03-31 基板処理装置
PCT/JP2018/000912 WO2018179685A1 (ja) 2017-03-31 2018-01-16 基板処理装置

Publications (1)

Publication Number Publication Date
SG11201908780RA true SG11201908780RA (en) 2019-10-30

Family

ID=63677702

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201908780R SG11201908780RA (en) 2017-03-31 2018-01-16 Substrate processing apparatus

Country Status (7)

Country Link
US (1) US11969858B2 (https=)
JP (1) JP6990980B2 (https=)
KR (1) KR102474471B1 (https=)
CN (1) CN110476226B (https=)
SG (1) SG11201908780RA (https=)
TW (1) TWI758436B (https=)
WO (1) WO2018179685A1 (https=)

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Publication number Priority date Publication date Assignee Title
KR102629679B1 (ko) * 2018-11-09 2024-01-29 주식회사 케이씨텍 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인
EP3948702A4 (en) 2019-03-29 2023-07-26 Saint-Gobain Abrasives, Inc. POWER LOOP SOLUTIONS
WO2020206382A1 (en) 2019-04-03 2020-10-08 Saint-Gobain Abrasives, Inc. Abrasive article, abrasive system and method for using and forming same
JP7523269B2 (ja) * 2020-07-13 2024-07-26 株式会社荏原製作所 基板処理装置及び音響センサ用防水装置
JP2022080370A (ja) * 2020-11-18 2022-05-30 株式会社荏原製作所 基板保持装置
KR102931498B1 (ko) * 2021-03-05 2026-02-27 어플라이드 머티어리얼스, 인코포레이티드 리테이닝 링들을 분류하기 위한 기계 학습
JP7772518B2 (ja) * 2021-07-16 2025-11-18 株式会社ディスコ ウエーハの処理方法
JP7638815B2 (ja) * 2021-07-21 2025-03-04 株式会社荏原製作所 ブレークイン処理装置、およびブレークイン処理方法
TWI789926B (zh) * 2021-09-28 2023-01-11 中國砂輪企業股份有限公司 研磨系統、研磨狀態感測系統及其資料庫與方法
US20250178149A1 (en) * 2022-02-25 2025-06-05 Ebara Corporation Substrate polishing apparatus
KR102898774B1 (ko) * 2022-03-23 2025-12-12 주식회사 히타치하이테크 진단 장치, 반도체 제조 장치 시스템, 반도체 장치 제조 시스템 및 진단 방법
JP7763140B2 (ja) * 2022-03-30 2025-10-31 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
JP7840206B2 (ja) * 2022-04-27 2026-04-03 株式会社荏原製作所 弾性膜の初期化装置、研磨装置、および弾性膜の初期化方法
CN118636053A (zh) * 2024-08-15 2024-09-13 杭州积海半导体有限公司 气膜、cmp研磨系统及实时检测气膜性能的方法

Family Cites Families (25)

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Publication number Priority date Publication date Assignee Title
WO2000045993A1 (en) 1999-02-02 2000-08-10 Ebara Corporation Wafer holder and polishing device
JP4101403B2 (ja) 1999-06-22 2008-06-18 株式会社荏原製作所 ウェーハ研磨装置及びウェーハ製造方法
TW436382B (en) 1999-03-12 2001-05-28 Mitsubishi Materials Corp Wafer holding head, wafer polishing apparatus, and method for making wafers
US6494765B2 (en) 2000-09-25 2002-12-17 Center For Tribology, Inc. Method and apparatus for controlled polishing
JP2002219645A (ja) 2000-11-21 2002-08-06 Nikon Corp 研磨装置、この研磨装置を用いた半導体デバイス製造方法並びにこの製造方法によって製造された半導体デバイス
JP2005123485A (ja) 2003-10-17 2005-05-12 Ebara Corp 研磨装置
EP1758711B1 (en) * 2004-06-21 2013-08-07 Ebara Corporation Polishing apparatus and polishing method
US20060014475A1 (en) 2004-07-15 2006-01-19 Disco Corporation Grindstone tool
US20090053983A1 (en) 2006-01-25 2009-02-26 Jsr Corporation Chemical mechanical polishing pad and method for manufacturing same
US7840305B2 (en) 2006-06-28 2010-11-23 3M Innovative Properties Company Abrasive articles, CMP monitoring system and method
DE102007011880A1 (de) 2007-03-13 2008-09-18 Peter Wolters Gmbh Bearbeitungsmaschine mit Mitteln zur Erfassung von Bearbeitungsparametern
JP5093652B2 (ja) 2007-06-12 2012-12-12 株式会社ニコン 研磨装置
JP5551479B2 (ja) * 2010-03-19 2014-07-16 ニッタ・ハース株式会社 研磨装置、研磨パッドおよび研磨情報管理システム
JP5552401B2 (ja) 2010-09-08 2014-07-16 株式会社荏原製作所 研磨装置および方法
JP5677004B2 (ja) 2010-09-30 2015-02-25 株式会社荏原製作所 研磨装置および方法
JP5868081B2 (ja) 2011-09-05 2016-02-24 株式会社ディスコ 加工装置
JP5891127B2 (ja) 2012-07-03 2016-03-22 株式会社荏原製作所 研磨装置および研磨方法
US9105516B2 (en) 2012-07-03 2015-08-11 Ebara Corporation Polishing apparatus and polishing method
US20140020829A1 (en) 2012-07-18 2014-01-23 Applied Materials, Inc. Sensors in Carrier Head of a CMP System
KR20150085000A (ko) 2012-11-16 2015-07-22 어플라이드 머티어리얼스, 인코포레이티드 캐리어 헤드용 센서들에 의한 기록 측정들
JP2014223684A (ja) 2013-05-15 2014-12-04 株式会社東芝 研磨装置および研磨方法
US9454684B2 (en) 2014-05-28 2016-09-27 Taiwan Semiconductor Manufacturing Company Limited Edge crack detection system
US9878421B2 (en) 2014-06-16 2018-01-30 Applied Materials, Inc. Chemical mechanical polishing retaining ring with integrated sensor
KR101913701B1 (ko) * 2015-03-13 2018-11-02 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드
JP6557049B2 (ja) 2015-04-23 2019-08-07 株式会社ディスコ 加工装置

Also Published As

Publication number Publication date
TW201836763A (zh) 2018-10-16
US11969858B2 (en) 2024-04-30
KR102474471B1 (ko) 2022-12-06
TWI758436B (zh) 2022-03-21
CN110476226B (zh) 2023-08-18
JP2018174230A (ja) 2018-11-08
WO2018179685A1 (ja) 2018-10-04
JP6990980B2 (ja) 2022-01-12
US20200023487A1 (en) 2020-01-23
KR20190134665A (ko) 2019-12-04
CN110476226A (zh) 2019-11-19

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