SG10201808877SA - Polishing apparatus and polishing method - Google Patents
Polishing apparatus and polishing methodInfo
- Publication number
- SG10201808877SA SG10201808877SA SG10201808877SA SG10201808877SA SG10201808877SA SG 10201808877S A SG10201808877S A SG 10201808877SA SG 10201808877S A SG10201808877S A SG 10201808877SA SG 10201808877S A SG10201808877S A SG 10201808877SA SG 10201808877S A SG10201808877S A SG 10201808877SA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing
- semiconductor wafer
- swing arm
- top ring
- holds
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 10
- 238000000034 method Methods 0.000 title abstract 2
- 230000003287 optical effect Effects 0.000 abstract 5
- 239000004065 semiconductor Substances 0.000 abstract 3
- 238000001514 detection method Methods 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
POLISHING APPARATUS AND POLISHING METHOD A polishing table holds a polishing pad. A top ring holds a semiconductor wafer. A swing arm holds the top ring. The swing arm swings around a swing center on the swing arm during polishing. An optical sensor is disposed on the polishing table and measures an optical characteristic changeable in accordance with a variation in film thickness of the semiconductor wafer. A fluid supply control apparatus determines a distance from an axis of rotation to the optical sensor when the semiconductor wafer is rotated by the top ring. An endpoint detection section detects a polishing end point indicating an end of polishing based on the optical characteristic measured by the optical sensor and the determined distance. Representative drawing: Fig. 2
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017202620A JP7141204B2 (en) | 2017-10-19 | 2017-10-19 | Polishing device and polishing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201808877SA true SG10201808877SA (en) | 2019-05-30 |
Family
ID=66170423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201808877SA SG10201808877SA (en) | 2017-10-19 | 2018-10-09 | Polishing apparatus and polishing method |
Country Status (3)
Country | Link |
---|---|
US (1) | US11667007B2 (en) |
JP (1) | JP7141204B2 (en) |
SG (1) | SG10201808877SA (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6357260B2 (en) * | 2016-09-30 | 2018-07-11 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6399501B2 (en) * | 1999-12-13 | 2002-06-04 | Applied Materials, Inc. | Method and apparatus for detecting polishing endpoint with optical monitoring |
US7101257B2 (en) * | 2003-05-21 | 2006-09-05 | Ebara Corporation | Substrate polishing apparatus |
US7822500B2 (en) * | 2004-06-21 | 2010-10-26 | Ebara Corporation | Polishing apparatus and polishing method |
CN102490112B (en) * | 2006-10-06 | 2015-03-25 | 株式会社荏原制作所 | Processing end point detecting method, polishing method and polishing apparatus |
JP5415735B2 (en) * | 2008-09-26 | 2014-02-12 | 株式会社荏原製作所 | Dressing method, dressing condition determining method, dressing condition determining program, and polishing apparatus |
JP5340795B2 (en) * | 2009-04-27 | 2013-11-13 | 株式会社荏原製作所 | Polishing method and polishing apparatus |
JP5730747B2 (en) | 2010-12-10 | 2015-06-10 | 株式会社荏原製作所 | Eddy current sensor and polishing method and apparatus |
-
2017
- 2017-10-19 JP JP2017202620A patent/JP7141204B2/en active Active
-
2018
- 2018-10-09 SG SG10201808877SA patent/SG10201808877SA/en unknown
- 2018-10-17 US US16/162,914 patent/US11667007B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US11667007B2 (en) | 2023-06-06 |
US20190118332A1 (en) | 2019-04-25 |
JP2019075520A (en) | 2019-05-16 |
JP7141204B2 (en) | 2022-09-22 |
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