TWI732220B - Automatic polishing system - Google Patents
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- TWI732220B TWI732220B TW108117786A TW108117786A TWI732220B TW I732220 B TWI732220 B TW I732220B TW 108117786 A TW108117786 A TW 108117786A TW 108117786 A TW108117786 A TW 108117786A TW I732220 B TWI732220 B TW I732220B
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Description
本發明是有關於一種拋光系統,特別是有關於一種可以機械手臂夾取拋光對象至第一拋光單元及第二拋光單元之間進行拋光之自動拋光系統。 The present invention relates to a polishing system, in particular to an automatic polishing system that can grip a polishing object with a mechanical arm to perform polishing between a first polishing unit and a second polishing unit.
一般來說,金屬拋光作業除了為專用機械設計的需要,而對金屬母材專用固定制具之拋光步驟外,其他多為人工拋光。 Generally speaking, in addition to the needs of special machinery design, metal polishing operations are mostly manual polishing, except for the polishing steps of the metal base metal special fixed fixture.
因此,針對金屬拋光領域的產業來說,如何達到自動拋光,將是亟需探討並克服的一大課題。 Therefore, for the metal polishing industry, how to achieve automatic polishing will be a major issue that needs to be discussed and overcome urgently.
有鑑於上述習知之問題,本發明的目的在於提供一種自動拋光系統,用以解決習知技術中所面臨之問題。 In view of the above-mentioned conventional problems, the purpose of the present invention is to provide an automatic polishing system to solve the problems faced by the conventional technology.
基於上述目的,本發明係提供一種自動拋光系統,係包含基座、拋光裝置、機械手臂及控制模組。拋光裝置設置於基座之一端,拋光裝置包含裝置基座、第一拋光單元及第二拋光單元,裝置基座直立地設於基座上,第一拋光單元及第二拋光單元相互對應地設於裝置基座對應機械手臂之一面上。機械手臂設置於基座之另一端,且夾取拋光對象,並依據控制訊號移動拋光對象至第一拋光單元及第二拋光單元之間,第一拋光單元及第二拋光單元依據控制訊號拋光拋光對象。控制模組連結拋光裝置及機械手臂,且傳送控制訊號至拋光裝置及機械手臂。 Based on the above objective, the present invention provides an automatic polishing system, which includes a base, a polishing device, a mechanical arm, and a control module. The polishing device is arranged at one end of the base. The polishing device includes a device base, a first polishing unit and a second polishing unit. The device base is set upright on the base, and the first polishing unit and the second polishing unit are arranged corresponding to each other. On the surface of the device base corresponding to the robot arm. The mechanical arm is set at the other end of the base, and clamps the polishing object, and moves the polishing object between the first polishing unit and the second polishing unit according to the control signal. The first polishing unit and the second polishing unit polish and polish according to the control signal Object. The control module connects the polishing device and the robot arm, and transmits control signals to the polishing device and the robot arm.
較佳地,拋光裝置可包含偵測單元,其偵測第一拋光單元、第二拋光單元或其組合與拋光對象之間的間隙,並產生間隙資訊且傳送至控制模組,控制模組依據間隙資訊產生控制訊號。 Preferably, the polishing device may include a detection unit that detects the gap between the first polishing unit, the second polishing unit, or a combination thereof and the polishing object, and generates gap information and transmits it to the control module, which is based on The gap information generates a control signal.
較佳地,偵測單元可為光學偵測單元,其偵測拋光對象之表面,並產生間隙資訊。 Preferably, the detection unit may be an optical detection unit, which detects the surface of the polishing object and generates gap information.
較佳地,光學偵測單元可偵測拋光對象之表面而產生拋光資訊。 Preferably, the optical detection unit can detect the surface of the polishing object to generate polishing information.
較佳地,拋光裝置可包含計數單元,其偵測拋光對象之拋光次數,並產生計數訊號且傳送至控制模組,控制模組依據計數訊號產生控制訊號。 Preferably, the polishing device may include a counting unit, which detects the number of polishing times of the polishing object, and generates a counting signal and transmits it to the control module. The control module generates a control signal according to the counting signal.
較佳地,拋光裝置可包含開闔模組,其連結控制模組、第一拋光單元及第二拋光單元,並接收控制訊號且依據控制訊號調整第一拋光單元、第二拋光單元或其組合與拋光對象之間之間隙。 Preferably, the polishing device may include an opening and closing module, which connects the control module, the first polishing unit and the second polishing unit, and receives the control signal and adjusts the first polishing unit, the second polishing unit or a combination thereof according to the control signal The gap with the polishing object.
較佳地,自動拋光系統更可包含助拋劑供應模組,其設置於基座上並對第一拋光單元、第二拋光單元、拋光對象或其組合提供助拋劑。 Preferably, the automatic polishing system may further include a polishing aid supply module, which is arranged on the base and provides a polishing aid for the first polishing unit, the second polishing unit, the polishing object, or a combination thereof.
較佳地,自動拋光系統更可包含上料盤,其設置於基座上,且放置待拋光之拋光對象,機械手臂由上料盤夾取拋光對象。 Preferably, the automatic polishing system may further include a loading tray, which is arranged on the base and placing the polishing object to be polished, and the mechanical arm grips the polishing object from the loading tray.
較佳地,自動拋光系統更可包含下料盤,其設置於基座上,且機械手臂放置拋光後之拋光對象至下料盤上。 Preferably, the automatic polishing system may further include a discharge tray, which is arranged on the base, and the robotic arm places the polished object on the discharge tray.
承上所述,本發明之自動拋光系統藉由機械手臂夾取拋光對象,並移至第一拋光單元及第二拋光單元之間進行拋光,以達到自動拋光之功效。 Based on the above, the automatic polishing system of the present invention grips the polishing object by the mechanical arm, and moves it between the first polishing unit and the second polishing unit for polishing, so as to achieve the effect of automatic polishing.
100:自動拋光系統 100: Automatic polishing system
110:基座 110: Pedestal
120:拋光裝置 120: Polishing device
121:裝置基座 121: Device base
122:第一拋光單元 122: The first polishing unit
123:第二拋光單元 123: The second polishing unit
124:偵測單元 124: Detection unit
125:計數單元 125: counting unit
126:開闔模組 126: Open and Close Module
130:機械手臂 130: mechanical arm
140:控制模組 140: control module
150:助拋劑供應模組 150: Propellant supply module
第1圖係為本發明之自動拋光系統之第一示意圖。 Figure 1 is the first schematic diagram of the automatic polishing system of the present invention.
第2圖係為本發明之自動拋光系統之第二示意圖。 Figure 2 is the second schematic diagram of the automatic polishing system of the present invention.
第3圖係為本發明之自動拋光系統之第三示意圖。 Figure 3 is the third schematic diagram of the automatic polishing system of the present invention.
第4圖係為本發明之自動拋光系統之第一方塊圖。 Figure 4 is the first block diagram of the automatic polishing system of the present invention.
第5圖係為本發明之自動拋光系統之第二方塊圖。 Figure 5 is the second block diagram of the automatic polishing system of the present invention.
第6圖係為本發明之自動拋光系統之第三方塊圖。 Figure 6 is a third-party block diagram of the automatic polishing system of the present invention.
為利瞭解本發明之特徵、內容與優點及其所能達成之功效,茲將本發明配合圖式,並以實施例之表達形式詳細說明如下,而其中所使用之圖式,其主旨僅為示意及輔助說明書之用,未必為本發明實施後之真實比例與精準配置,故不應就所附之圖式的比例與配置關係解讀、侷限本發明於實際實施上的權利範圍。 In order to understand the features, content and advantages of the present invention and its achievable effects, the present invention is combined with the figures and described in detail in the form of an embodiment as follows. The figures used therein are only intended to The schematic and auxiliary instructions are not necessarily the true proportions and precise configurations after the implementation of the present invention. Therefore, the proportions and configuration relationships of the attached drawings should not be interpreted as to limit the scope of rights of the present invention in actual implementation.
本發明之優點、特徵以及達到之技術方法將參照例示性實施例及所附圖式進行更詳細地描述而更容易理解,且本發明或可以不同形式來實現,故不應被理解僅限於此處所陳述的實施例,相反地,對所屬技術領域具有通常知識者而言,所提供的實施例將使本揭露更加透徹與全面且完整地傳達本發明的範疇,且本發明將僅為所附加的申請專利範圍所定義。 The advantages, features, and technical methods of the present invention will be described in more detail with reference to exemplary embodiments and the accompanying drawings to make it easier to understand, and the present invention may be implemented in different forms, so it should not be understood to be limited to these The described embodiments, on the contrary, for those with ordinary knowledge in the technical field, the provided embodiments will make this disclosure more thorough, comprehensive and complete to convey the scope of the present invention, and the present invention will only be appended As defined by the scope of patent applications.
請參閱第1至4圖;第1圖係為本發明之自動拋光系統之第一示意圖;第2圖係為本發明之自動拋光系統之第二示意圖;第3圖係為本發明之自動拋光系統之第三示意圖;第4圖係為本發明之自動拋光系統之第一方塊圖。如圖所示,本發明之自動拋光系統100包含了基座110、拋光裝置120、機械手臂130及控制模組140。
Please refer to Figures 1 to 4; Figure 1 is the first schematic diagram of the automatic polishing system of the present invention; Figure 2 is the second schematic diagram of the automatic polishing system of the present invention; Figure 3 is the automatic polishing system of the present invention The third schematic diagram of the system; Figure 4 is the first block diagram of the automatic polishing system of the present invention. As shown in the figure, the
續言之,拋光裝置120設置於基座110之一端,拋光裝置120包含裝置基座121、第一拋光單元122及第二拋光單元123。其中,裝置基座121直立
地設於基座110上,第一拋光單元122及第二拋光單元123相互對應地設於裝置基座121對應機械手臂130之一面上。其中,拋光流程可大致分為先粗拋,再細拋,最後亮拋。第一拋光單元122及第二拋光單元123可為布輪或砂布帶。
In addition, the
而,機械手臂130設置於基座110之另一端,且夾取拋光對象,並依據控制訊號移動拋光對象至第一拋光單元122及第二拋光單元123之間,第一拋光單元122及第二拋光單元123依據控制訊號拋光拋光對象。控制模組140連結拋光裝置120及機械手臂130,且傳送控制訊號至拋光裝置120及機械手臂130。其中,機械手臂130可為6軸式機械手臂。
However, the
請參閱第5圖,其為本發明之自動拋光系統之第二方塊圖。如圖所示,拋光裝置120可包含偵測單元124,其偵測第一拋光單元122、第二拋光單元123或其組合與拋光對象之間的間隙,並產生間隙資訊且傳送至控制模組140,控制模組140依據間隙資訊產生控制訊號。藉以達到偵測間隙大小,並據以調整之目的。
Please refer to Figure 5, which is the second block diagram of the automatic polishing system of the present invention. As shown in the figure, the
另一方面,偵測單元124可為光學偵測單元,其偵測拋光對象之表面,並產生間隙資訊。藉以達到依據拋光程度推算間隙大小,並據以調整之目的。 On the other hand, the detecting unit 124 may be an optical detecting unit, which detects the surface of the polishing object and generates gap information. In order to achieve the purpose of calculating the gap size according to the degree of polishing and adjusting accordingly.
續言之,光學偵測單元可偵測拋光對象之表面而產生拋光資訊。拋光資訊將傳送至控制模組140,控制模組140可據以判斷拋光對象之拋光作業之進度,而適時的停止拋光作業。 In addition, the optical detection unit can detect the surface of the polishing object to generate polishing information. The polishing information is transmitted to the control module 140, and the control module 140 can judge the progress of the polishing operation of the polishing object according to it, and stop the polishing operation in a timely manner.
此外,拋光裝置120可包含計數單元125,其偵測拋光對象之拋光次數,並產生計數訊號且傳送至控制模組140,控制模組140依據計數訊號產生控制訊號。藉以達到依據拋光次數推算間隙大小,並據以調整之目的。
In addition, the
另一方面,拋光裝置120可包含開闔模組126,其連結控制模組140、第一拋光單元122及第二拋光單元123,並接收控制訊號且依據控制訊號調整第一拋光單元122、第二拋光單元123或其組合與拋光對象之間之間隙。
On the other hand, the
請參閱第6圖,其為本發明之自動拋光系統之第三方塊圖。如圖所示,自動拋光系統100更可包含助拋劑供應模組150,其連結控制模組140且設置於基座110上並依據控制訊號對第一拋光單元122、第二拋光單元123、拋光對象或其組合提供助拋劑。其中,助拋劑供應模組150可定時自動提供助拋劑。
Please refer to Figure 6, which is a third-party block diagram of the automatic polishing system of the present invention. As shown in the figure, the
而,自動拋光系統100包含上料盤,其設置於基座110上,且放置待拋光之拋光對象,機械手臂130由上料盤夾取拋光對象;另一方面,自動拋光系統100包含下料盤,其設置於基座110上,且機械手臂130放置拋光後之拋光對象至下料盤上。
However, the
承上所述,本發明之自動拋光系統藉由機械手臂夾取拋光對象,並移至第一拋光單元及第二拋光單元之間進行拋光,以達到自動拋光之功效。 Based on the above, the automatic polishing system of the present invention grips the polishing object by the mechanical arm, and moves it between the first polishing unit and the second polishing unit for polishing, so as to achieve the effect of automatic polishing.
以上所述之實施例僅係為說明本發明之技術思想及特點,其目的在使熟習此項技藝之人士能夠瞭解本發明之內容並據以實施,當不能以之限定本發明之專利範圍,即大凡依本發明所揭示之精神所作之均等變化或修飾,仍應涵蓋在本發明之專利範圍內。 The above-mentioned embodiments are only to illustrate the technical ideas and features of the present invention, and their purpose is to enable those who are familiar with the art to understand the content of the present invention and implement them accordingly. When they cannot be used to limit the patent scope of the present invention, That is, all equal changes or modifications made in accordance with the spirit of the present invention should still be covered by the patent scope of the present invention.
100:自動拋光系統 100: Automatic polishing system
110:基座 110: Pedestal
120:拋光裝置 120: Polishing device
121:裝置基座 121: Device base
122:第一拋光單元 122: The first polishing unit
123:第二拋光單元 123: The second polishing unit
130:機械手臂 130: mechanical arm
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11179655A (en) * | 1997-12-17 | 1999-07-06 | Kawasaki Heavy Ind Ltd | Grinding position measuring device |
TWM576940U (en) * | 2018-12-11 | 2019-04-21 | 許富菘 | Multi-purpose grinding equipment and system |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11179655A (en) * | 1997-12-17 | 1999-07-06 | Kawasaki Heavy Ind Ltd | Grinding position measuring device |
TWM576940U (en) * | 2018-12-11 | 2019-04-21 | 許富菘 | Multi-purpose grinding equipment and system |
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