CN110475438B - 焊料容器自动供应装置及方法 - Google Patents

焊料容器自动供应装置及方法 Download PDF

Info

Publication number
CN110475438B
CN110475438B CN201910349103.1A CN201910349103A CN110475438B CN 110475438 B CN110475438 B CN 110475438B CN 201910349103 A CN201910349103 A CN 201910349103A CN 110475438 B CN110475438 B CN 110475438B
Authority
CN
China
Prior art keywords
solder
solder container
mounting
container
supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201910349103.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN110475438A (zh
Inventor
金贵韩
崔智郁
沈恩爀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanwha Precision Machinery Co Ltd
Original Assignee
Hanwha Precision Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanwha Precision Machinery Co Ltd filed Critical Hanwha Precision Machinery Co Ltd
Publication of CN110475438A publication Critical patent/CN110475438A/zh
Application granted granted Critical
Publication of CN110475438B publication Critical patent/CN110475438B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
CN201910349103.1A 2018-05-10 2019-04-28 焊料容器自动供应装置及方法 Active CN110475438B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0053418 2018-05-10
KR1020180053418A KR102051499B1 (ko) 2018-05-10 2018-05-10 솔더 용기의 자동 공급 장치 및 방법

Publications (2)

Publication Number Publication Date
CN110475438A CN110475438A (zh) 2019-11-19
CN110475438B true CN110475438B (zh) 2022-07-05

Family

ID=68468146

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910349103.1A Active CN110475438B (zh) 2018-05-10 2019-04-28 焊料容器自动供应装置及方法

Country Status (3)

Country Link
KR (1) KR102051499B1 (ko)
CN (1) CN110475438B (ko)
WO (1) WO2019216516A1 (ko)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102271919A (zh) * 2009-02-09 2011-12-07 雅马哈发动机株式会社 焊料供应装置、印刷装置以及印刷方法
KR101431079B1 (ko) * 2013-02-19 2014-08-22 주식회사 두원정밀 솔더 자동공급기의 카트리지 이송장치
KR20170116447A (ko) * 2016-04-11 2017-10-19 주식회사 오토텍 자동 솔더 공급장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004306102A (ja) * 2003-04-08 2004-11-04 Sony Corp はんだ供給装置及びはんだ印刷機
JP2010036573A (ja) * 2008-07-10 2010-02-18 Arata Tsurusaki ペースト供給方法とペースト供給装置および容器
KR101196284B1 (ko) 2012-09-18 2012-11-06 이동주 솔더 페이스트 공급장치
KR101986096B1 (ko) * 2015-05-18 2019-06-05 야마하하쓰도키 가부시키가이샤 기판 작업장치 및 기판 작업장치에 있어서의 점성 유체 잔량 측정방법
KR20170011644A (ko) * 2015-07-23 2017-02-02 에스케이하이닉스 주식회사 반도체 메모리 장치 및 그것의 동작 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102271919A (zh) * 2009-02-09 2011-12-07 雅马哈发动机株式会社 焊料供应装置、印刷装置以及印刷方法
KR101431079B1 (ko) * 2013-02-19 2014-08-22 주식회사 두원정밀 솔더 자동공급기의 카트리지 이송장치
KR20170116447A (ko) * 2016-04-11 2017-10-19 주식회사 오토텍 자동 솔더 공급장치

Also Published As

Publication number Publication date
KR20190129167A (ko) 2019-11-20
CN110475438A (zh) 2019-11-19
KR102051499B1 (ko) 2019-12-03
WO2019216516A1 (ko) 2019-11-14

Similar Documents

Publication Publication Date Title
KR101920818B1 (ko) 솔더 용기의 자동 공급 장치 및 방법
US5464047A (en) Method and apparatus for dispensing paint into containers
CN108883430B (zh) 粘性流体供给装置
WO2018040630A1 (zh) 油墨颜色自动调配设备
KR20080015382A (ko) 액상물질 공급장치
CN110475438B (zh) 焊料容器自动供应装置及方法
US20140199779A1 (en) Automatic analyzer
KR20130120427A (ko) Ｂｇａ 리워크 시스템
CN114787634A (zh) 自动分析装置
JP2021139720A (ja) 自動定容装置及び自動定容方法、並びに自動定容システム
CN107029955A (zh) 一种用于汽车天窗玻璃底涂的清洁台
CN219156496U (zh) 一种单片式封口灌装机
US20020166505A1 (en) Squeegee unit and solder-paste printing machine
EP3422018A1 (en) Nozzle washing apparatus, dispensing apparatus, and method for washing nozzle
US5603446A (en) Bonding apparatus
KR101866838B1 (ko) 스마트 솔더크림 공급 장치
KR101933017B1 (ko) 스마트 솔더페이스트 공급장치
CN210235481U (zh) 多功能取米装置
CN210403670U (zh) 一种高洁净度半导体晶圆自动装载设备
CN113307210A (zh) 一种高速线全自动灌装机
CN214652011U (zh) 粉体供给系统
CN104924739A (zh) 丝网印刷机和丝网印刷方法
WO2006007331A2 (en) Automated ball mounting process and system with solder ball testing
KR101735519B1 (ko) 플럭스 디핑 장치
JPH06106114A (ja) 塗布装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant