CN110462560B - Transfer photosensitive film - Google Patents
Transfer photosensitive film Download PDFInfo
- Publication number
- CN110462560B CN110462560B CN201780089046.7A CN201780089046A CN110462560B CN 110462560 B CN110462560 B CN 110462560B CN 201780089046 A CN201780089046 A CN 201780089046A CN 110462560 B CN110462560 B CN 110462560B
- Authority
- CN
- China
- Prior art keywords
- resin layer
- transfer
- group
- photosensitive film
- cured film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000012546 transfer Methods 0.000 title claims abstract description 66
- 229920005989 resin Polymers 0.000 claims abstract description 195
- 239000011347 resin Substances 0.000 claims abstract description 195
- -1 acyl phosphine oxide Chemical compound 0.000 claims abstract description 58
- 150000001875 compounds Chemical class 0.000 claims abstract description 44
- 239000003999 initiator Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 34
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 80
- 239000000758 substrate Substances 0.000 claims description 57
- 239000000178 monomer Substances 0.000 claims description 29
- 239000002245 particle Substances 0.000 claims description 18
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 16
- 239000011230 binding agent Substances 0.000 claims description 16
- 229920000642 polymer Polymers 0.000 claims description 16
- 229910044991 metal oxide Inorganic materials 0.000 claims description 14
- 150000004706 metal oxides Chemical class 0.000 claims description 14
- 125000000217 alkyl group Chemical group 0.000 claims description 13
- 230000002378 acidificating effect Effects 0.000 claims description 11
- 125000002723 alicyclic group Chemical group 0.000 claims description 11
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 claims description 7
- 239000002998 adhesive polymer Substances 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 188
- 239000000047 product Substances 0.000 description 31
- 238000000576 coating method Methods 0.000 description 24
- 239000011248 coating agent Substances 0.000 description 23
- 230000001681 protective effect Effects 0.000 description 23
- 230000035699 permeability Effects 0.000 description 21
- 239000007788 liquid Substances 0.000 description 18
- 239000000126 substance Substances 0.000 description 17
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 12
- 125000004432 carbon atom Chemical group C* 0.000 description 12
- 239000011342 resin composition Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 125000003944 tolyl group Chemical group 0.000 description 9
- 239000003513 alkali Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000011161 development Methods 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 125000003277 amino group Chemical group 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000002105 nanoparticle Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 125000003396 thiol group Chemical group [H]S* 0.000 description 6
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 5
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 5
- 239000002585 base Substances 0.000 description 5
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- SKKHNUKNMQLBTJ-UHFFFAOYSA-N 3-bicyclo[2.2.1]heptanyl 2-methylprop-2-enoate Chemical compound C1CC2C(OC(=O)C(=C)C)CC1C2 SKKHNUKNMQLBTJ-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical group ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000006059 cover glass Substances 0.000 description 3
- 125000000753 cycloalkyl group Chemical group 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- GTKOKCQMHAGFSM-UHFFFAOYSA-N 1-methyltetrazol-5-amine Chemical compound CN1N=NN=C1N GTKOKCQMHAGFSM-UHFFFAOYSA-N 0.000 description 2
- MACMNSLOLFMQKL-UHFFFAOYSA-N 1-sulfanyltriazole Chemical compound SN1C=CN=N1 MACMNSLOLFMQKL-UHFFFAOYSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- UJTRCPVECIHPBG-UHFFFAOYSA-N 3-cyclohexylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C2CCCCC2)=C1 UJTRCPVECIHPBG-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 2
- 125000003670 adamantan-2-yl group Chemical group [H]C1([H])C(C2([H])[H])([H])C([H])([H])C3([H])C([*])([H])C1([H])C([H])([H])C2([H])C3([H])[H] 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 2
- MAWOHFOSAIXURX-UHFFFAOYSA-N cyclopentylcyclopentane Chemical group C1CCCC1C1CCCC1 MAWOHFOSAIXURX-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- CKFGINPQOCXMAZ-UHFFFAOYSA-N methanediol Chemical compound OCO CKFGINPQOCXMAZ-UHFFFAOYSA-N 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 229940049953 phenylacetate Drugs 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- CDUQMGQIHYISOP-RMKNXTFCSA-N (e)-2-cyano-3-phenylprop-2-enoic acid Chemical compound OC(=O)C(\C#N)=C\C1=CC=CC=C1 CDUQMGQIHYISOP-RMKNXTFCSA-N 0.000 description 1
- QYGBYAQGBVHMDD-XQRVVYSFSA-N (z)-2-cyano-3-thiophen-2-ylprop-2-enoic acid Chemical compound OC(=O)C(\C#N)=C/C1=CC=CS1 QYGBYAQGBVHMDD-XQRVVYSFSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- XOHZHMUQBFJTNH-UHFFFAOYSA-N 1-methyl-2h-tetrazole-5-thione Chemical compound CN1N=NN=C1S XOHZHMUQBFJTNH-UHFFFAOYSA-N 0.000 description 1
- LLCOQBODWBFTDD-UHFFFAOYSA-N 1h-triazol-1-ium-4-thiolate Chemical compound SC1=CNN=N1 LLCOQBODWBFTDD-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- ZCQDUSMMXXCYAS-UHFFFAOYSA-N 2-(5-aminotetrazol-1-yl)acetic acid Chemical compound NC1=NN=NN1CC(O)=O ZCQDUSMMXXCYAS-UHFFFAOYSA-N 0.000 description 1
- DIFOLZGBHRDEFT-UHFFFAOYSA-N 2-(benzotriazol-1-yl)acetonitrile Chemical group C1=CC=C2N(CC#N)N=NC2=C1 DIFOLZGBHRDEFT-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- IUVCFHHAEHNCFT-INIZCTEOSA-N 2-[(1s)-1-[4-amino-3-(3-fluoro-4-propan-2-yloxyphenyl)pyrazolo[3,4-d]pyrimidin-1-yl]ethyl]-6-fluoro-3-(3-fluorophenyl)chromen-4-one Chemical compound C1=C(F)C(OC(C)C)=CC=C1C(C1=C(N)N=CN=C11)=NN1[C@@H](C)C1=C(C=2C=C(F)C=CC=2)C(=O)C2=CC(F)=CC=C2O1 IUVCFHHAEHNCFT-INIZCTEOSA-N 0.000 description 1
- FIOCEWASVZHBTK-UHFFFAOYSA-N 2-[2-(2-oxo-2-phenylacetyl)oxyethoxy]ethyl 2-oxo-2-phenylacetate Chemical compound C=1C=CC=CC=1C(=O)C(=O)OCCOCCOC(=O)C(=O)C1=CC=CC=C1 FIOCEWASVZHBTK-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- KFJDQPJLANOOOB-UHFFFAOYSA-N 2h-benzotriazole-4-carboxylic acid Chemical group OC(=O)C1=CC=CC2=NNN=C12 KFJDQPJLANOOOB-UHFFFAOYSA-N 0.000 description 1
- GUOVBFFLXKJFEE-UHFFFAOYSA-N 2h-benzotriazole-5-carboxylic acid Chemical group C1=C(C(=O)O)C=CC2=NNN=C21 GUOVBFFLXKJFEE-UHFFFAOYSA-N 0.000 description 1
- ULRPISSMEBPJLN-UHFFFAOYSA-N 2h-tetrazol-5-amine Chemical compound NC1=NN=NN1 ULRPISSMEBPJLN-UHFFFAOYSA-N 0.000 description 1
- CYUZOYPRAQASLN-UHFFFAOYSA-N 3-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)CCOC(=O)C=C CYUZOYPRAQASLN-UHFFFAOYSA-N 0.000 description 1
- GDGIVSREGUOIJZ-UHFFFAOYSA-N 5-amino-3h-1,3,4-thiadiazole-2-thione Chemical compound NC1=NN=C(S)S1 GDGIVSREGUOIJZ-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BTIYWGQSYCJLEO-UHFFFAOYSA-N Cc1cc(C)c(C(=O)P(O)O)c(C)c1 Chemical compound Cc1cc(C)c(C(=O)P(O)O)c(C)c1 BTIYWGQSYCJLEO-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000007877 V-601 Substances 0.000 description 1
- SEEVRZDUPHZSOX-WPWMEQJKSA-N [(e)-1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino] acetate Chemical compound C=1C=C2N(CC)C3=CC=C(C(\C)=N\OC(C)=O)C=C3C2=CC=1C(=O)C1=CC=CC=C1C SEEVRZDUPHZSOX-WPWMEQJKSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- MXJIHEXYGRXHGP-UHFFFAOYSA-N benzotriazol-1-ylmethanol Chemical group C1=CC=C2N(CO)N=NC2=C1 MXJIHEXYGRXHGP-UHFFFAOYSA-N 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical group C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 125000003917 carbamoyl group Chemical group [H]N([H])C(*)=O 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000010227 cup method (microbiological evaluation) Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- BOTLEXFFFSMRLQ-UHFFFAOYSA-N cyclopentyloxycyclopentane Chemical group C1CCCC1OC1CCCC1 BOTLEXFFFSMRLQ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- BEFDCLMNVWHSGT-UHFFFAOYSA-N ethenylcyclopentane Chemical compound C=CC1CCCC1 BEFDCLMNVWHSGT-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 235000019256 formaldehyde Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000007760 metering rod coating Methods 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 239000002304 perfume Substances 0.000 description 1
- 229960005222 phenazone Drugs 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 235000010199 sorbic acid Nutrition 0.000 description 1
- 239000004334 sorbic acid Substances 0.000 description 1
- 229940075582 sorbic acid Drugs 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- HWCKGOZZJDHMNC-UHFFFAOYSA-M tetraethylammonium bromide Chemical compound [Br-].CC[N+](CC)(CC)CC HWCKGOZZJDHMNC-UHFFFAOYSA-M 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- OYQCBJZGELKKPM-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O-2].[Zn+2].[O-2].[In+3] OYQCBJZGELKKPM-UHFFFAOYSA-N 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a transfer type photosensitive film, a method for forming a cured film pattern, a cured film, and a touch panel, wherein the transfer type photosensitive film includes a support film, and a first resin layer provided on the support film, the first resin layer including a photopolymerizable compound having a tricyclodecane skeleton or a tricyclodecene skeleton, and an acyl phosphine oxide photopolymerization initiator.
Description
Technical Field
The invention relates to a transfer photosensitive film, a method for forming a cured film pattern, a cured film and a touch panel.
Background
A liquid crystal display element and a touch panel (touch sensor) are used for large electronic devices such as personal computers and televisions, small electronic devices such as car navigation, mobile phones, smart phones, and electronic dictionaries, and display devices such as OA (Office Automation ) and FA (Factory Automation, factory automation) devices.
Various touch panels have been put to practical use, and in recent years, the use of projection type capacitive touch panels has been advanced. In general, in a projected capacitive touch panel, a plurality of X electrodes and a plurality of Y electrodes orthogonal to the X electrodes form a 2-layer structure in order to express two-dimensional coordinates composed of the X axis and the Y axis. As a material of these electrodes, ITO (Indium-Tin-Oxide, indium Tin Oxide) is the mainstream.
However, since the frame region of the touch panel is a region where the touch position cannot be detected, narrowing the area of the frame region is an important element for improving the product value. In general, a metal wiring such as copper is formed in the frame region in order to transmit a detection signal of a touch position. In the touch panel, corrosive components such as moisture and salt may intrude into the touch panel from the sensing region when the touch panel is in contact with a fingertip. If the corrosive component intrudes into the touch panel, the metal wiring may corrode, and the resistance between the electrode and the driving circuit may increase or break.
In order to prevent corrosion of metal wiring, the following method is proposed: a photosensitive resin composition layer containing a di (meth) acrylate compound having a dicyclopentyl structure or a dicyclopentenyl structure is provided on a substrate for a touch panel, and a predetermined portion of the photosensitive resin composition layer is cured by irradiation of active light, and then a portion other than the predetermined portion is removed to form a cured film of the photosensitive resin composition covering a part or the whole of the substrate (see patent document 1 below). By this method, a cured film having sufficiently low moisture permeability can be formed on the substrate for a touch panel.
On the other hand, in the projected capacitive touch panel, there is a problem that a color difference between a portion where the transparent electrode pattern is formed and a portion where the transparent electrode pattern is not formed becomes large due to a difference in optical reflection characteristics, so-called "a visible light phenomenon" occurs in which the transparent electrode pattern is projected on a screen when the touch panel is modularized. In addition, there is a problem that the intensity of reflected light increases and the transmittance of the screen decreases between the transparent electrode pattern and the substrate or between the transparent electrode pattern and the visibility improving film (OCA: optical Clear Adhesive, optically transparent adhesive) for bonding the transparent electrode pattern to the cover glass used for modularization.
In contrast, for example, patent document 2 discloses a transparent conductive resin substrate in which a refractive index matching layer (optical adjustment layer) (hereinafter referred to as "IM layer") is provided between a base material and a transparent electrode pattern to reduce chromatic aberration between a portion where the transparent electrode pattern is formed and a portion where the transparent electrode pattern is not formed, thereby preventing a light-shadow-viewing phenomenon and a reduction in transmittance of a screen.
Further, for example, patent document 3 discloses a transfer film in which a first curable transparent resin layer having a low refractive index adjusted to a specific refractive index range and a second curable transparent resin layer having a high refractive index are adjacently present as a method for preventing the transparent electrode pattern from being visually recognized.
Prior art literature
Patent literature
Patent document 1: japanese patent application laid-open No. 2015-121929
Patent document 2: japanese patent laid-open No. 8-240800
Patent document 3: international publication No. 2014/084112 booklet
Disclosure of Invention
Problems to be solved by the invention
The present inventors studied a transfer photosensitive film using a photosensitive resin composition containing a di (meth) acrylate compound having a dicyclopentyl structure (hereinafter referred to as tricyclodecane skeleton) or a dicyclopentenyl structure (hereinafter referred to as tricyclodecenyl skeleton). In addition, in the investigation of low moisture permeability and improvement of adhesion of the cured film pattern formed of the transfer photosensitive film, it was found that, when the cured film was formed on the transparent electrode pattern, the pattern of the electrode (the occurrence pattern was visible) was more conspicuously seen even if the transparent electrode pattern was provided on the IM layer.
The inventors of the present invention have further studied the main cause of pattern visibility, and as a result, have found that depressions (also referred to as level differences) are generated on the surface of the cured film provided on the ITO electrode pattern, which can be visually recognized, that is, "pattern visibility".
The purpose of the present invention is to provide a transfer-type photosensitive film that can satisfactorily form a cured film pattern having a sufficiently low moisture permeability while suppressing level differences in an electrode pattern, and a method for forming a cured film pattern using the transfer-type photosensitive film, and a touch panel.
Means for solving the problems
In order to solve the above problems, the present inventors studied the cause of the occurrence of the level difference, and as a result, have confirmed that when a cured film is formed on an ITO electrode and an IM layer under the same conditions, the reaction rate of a photosensitive resin layer provided on the IM layer is smaller than that on the ITO electrode, and based on this, the cause of the occurrence of the dishing is presumed to be: 1) In the exposure step, the unreacted photopolymerizable compound is transferred from a portion of the photosensitive resin layer having a low reaction rate to a portion having a high reaction rate, and 2) in the annealing step of heating the exposed and developed photosensitive resin layer, the unreacted photopolymerizable compound volatilizes and a difference in thermal shrinkage occurs between the portion having a high reaction rate and the portion having a low reaction rate. The present inventors have studied the composition of a photosensitive resin layer using a step evaluation test having an exposure step and an annealing step in which the difference in exposure is set, from the viewpoint of suppressing the phenomena of 1) and 2), and as a result, have found that the use of a specific photopolymerizable compound in combination with a specific photopolymerization initiator can suppress the difference in reaction, and can reduce the difference in step, leading to completion of the present invention. When only a method of increasing the amount of the photopolymerization initiator to reduce the amount of the unreacted photopolymerizable compound is employed, development residues may be generated, and it may be difficult to form a cured film pattern satisfactorily.
The present invention provides a transfer type photosensitive film comprising a support film and a first resin layer provided on the support film, wherein the first resin layer comprises a photopolymerizable compound having a tricyclodecane skeleton or tricyclodecene skeleton, and an acylphosphine oxide photopolymerization initiator.
According to the transfer type photosensitive film of the present invention, the cured film pattern can be formed well while suppressing the level difference in the transparent electrode pattern by the above-described configuration. The cured film pattern can function as an anti-rust film for the electrode pattern.
Among these, it is considered that the use of the acylphosphine oxide photopolymerization initiator can suppress the phenomena of 1) and 2) by obtaining a sufficient polymerization reaction rate even for a photopolymerizable compound having a large molecular weight as a reason for obtaining the above-described effect.
When the blending amount of the photopolymerizable compound having a tricyclodecane skeleton or tricyclodecene skeleton is increased, the low-permeability wet-out and the adhesion of the cured film pattern are effectively improved, but the level difference generated by the cured film pattern provided on the transparent electrode pattern tends to be large. According to the present invention, by combining a photopolymerizable compound having a tricyclodecane skeleton or tricyclodecene skeleton with an acyl phosphine oxide-based photopolymerization initiator, it is possible to form a cured film pattern having a high level of low moisture permeability and high adhesion while suppressing the level of level difference.
The above-mentioned acylphosphine oxide-based photopolymerization initiator may contain 2,4, 6-trimethylbenzoyl-diphenyl-phosphine oxide. In this case, a cured film pattern having low moisture permeability and excellent color tone (particularly, yellow tone is low and color tone near neutral) can be formed.
The first resin layer may further include an oxime ester-based photopolymerization initiator. By combining the acylphosphine oxide-based photopolymerization initiator with the oxime ester-based photopolymerization initiator, the moisture permeability of the formed cured film pattern can be further reduced.
The transfer photosensitive film of the present invention may further include a second resin layer containing metal oxide particles provided on the first resin layer.
With the transfer type photosensitive film, a cured film pattern that can suppress the occurrence of a shadow-visible phenomenon while suppressing the level difference can be formed well on the electrode pattern.
The present invention also provides a 1 st formation method of a cured film pattern, comprising: the method for producing a cured film includes a step of laminating a first resin layer of a transfer photosensitive film of the present invention on a substrate having an electrode pattern so that the side of the substrate on which the electrode pattern is provided is in close contact with the first resin layer, and a step of exposing a predetermined portion of the first resin layer on the substrate, and then removing the portion other than the predetermined portion to form a cured film pattern covering a part or the whole of the electrode pattern.
The present invention also provides a 2 nd formation method of a cured film pattern, comprising: the method for producing a cured film of the present invention comprises a step of laminating a second resin layer and a first resin layer of the transfer-type photosensitive film of the present invention having a second resin layer on a substrate having an electrode pattern so that the side of the substrate on which the electrode pattern is provided is in close contact with the second resin layer, and a step of exposing predetermined portions of the second resin layer and the first resin layer on the substrate, and then removing the portions other than the predetermined portions to form a cured film pattern covering a part or the whole of the electrode pattern.
With the above-described 1 st and 2 nd formation methods of a cured film pattern according to the present invention, a cured film pattern can be formed satisfactorily while suppressing a level difference in an electrode pattern. In addition, by the 2 nd formation method of the cured film pattern of the present invention, the cured film pattern can have a function of refractive index adjustment.
The present invention also provides a cured film formed by curing the first resin layer in the transfer-type photosensitive film of the present invention.
The present invention also provides a cured film formed by curing the first resin layer alone or both of the first resin layer and the second resin layer in the above-described transfer type photosensitive film of the present invention having the second resin layer.
The present invention also provides a touch panel comprising a cured film pattern formed of a cured product of the first resin layer in the above-described transfer-type photosensitive film of the present invention, or a cured product of the second resin layer and a cured product of the first resin layer in the above-described transfer-type photosensitive film of the present invention having the second resin layer.
Effects of the invention
The present invention can provide a transfer photosensitive film capable of favorably forming a cured film pattern while suppressing a level difference in an electrode pattern, a method for forming a cured film pattern using the transfer photosensitive film, and a touch panel.
Drawings
Fig. 1 is a schematic cross-sectional view showing a transfer photosensitive film according to an embodiment of the present invention.
Fig. 2 is a schematic cross-sectional view showing a laminate including a cured film pattern formed using the transfer photosensitive film according to one embodiment of the present invention on a substrate with a transparent electrode pattern.
Fig. 3 is a schematic plan view showing a touch panel according to an embodiment of the present invention.
Fig. 4 is a schematic cross-sectional view for explaining the level difference evaluation method of the present invention.
Detailed Description
The mode for carrying out the present invention will be described in detail below with reference to the accompanying drawings as the case may be. However, the present invention is not limited to the following embodiments. In the present specification, "(meth) acrylic acid" means acrylic acid or methacrylic acid, and "(meth) acrylic acid ester" means acrylic acid ester or a methacrylic acid ester corresponding thereto. "A or B" may include either or both of A and B.
In the present specification, the term "layer" includes a structure having a shape formed on a part of the entire surface, in addition to a structure having a shape formed on the entire surface, when seen in a plan view. In the present specification, the term "process" refers not only to an independent process but also to a process that is not clearly distinguished from other processes, and is included in the term as long as the desired function of the process is achieved. The numerical range indicated by "to" is a range in which numerical values described before and after "to" are included as the minimum value and the maximum value, respectively.
In the present specification, the content of each component in the composition refers to the total amount of a plurality of substances present in the composition unless otherwise specified, in the case where a plurality of substances belonging to each component are present in the composition. The exemplified materials may be used alone or in combination of 2 or more kinds unless otherwise specified.
In the numerical ranges described in stages in the present specification, the upper limit or the lower limit of the numerical range in one stage may be replaced with the upper limit or the lower limit of the numerical range in another stage. In addition, in the numerical ranges described in the present specification, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the embodiment.
< transfer photosensitive film >
The transfer photosensitive film of the present embodiment includes a support film and a first resin layer provided on the support film. The transfer photosensitive film of the present embodiment may be a transfer photosensitive film further including a second resin layer containing metal oxide particles provided on the photosensitive resin layer. These transfer type photosensitive films may further include a protective film provided on the photosensitive resin layer or the second resin layer.
Fig. 1 is a schematic cross-sectional view showing a transfer photosensitive film according to an embodiment of the present invention. The transfer type photosensitive film 1 shown in fig. 1 includes a support film 10, a first resin layer 20 provided on the support film 10, a second resin layer 30 provided on the first resin layer 20, and a protective film 40 provided on the second resin layer 30.
By using the transfer type photosensitive film, a cured film satisfying both functions of protecting a metal wiring located on a frame of a touch panel and a transparent electrode of the touch panel, and of making the transparent electrode pattern invisible and improving visibility of a touch screen can be formed in a pattern.
(support film)
As the support film 10, a polymer film may be used. Examples of the material of the polymer film include polyethylene terephthalate, polycarbonate, polyethylene, polypropylene, polyethersulfone, and cyclic olefin polymer.
The thickness of the support film 10 is preferably 5 to 100 μm, more preferably 10 to 70 μm, even more preferably 15 to 40 μm, and particularly preferably 15 to 35 μm, from the viewpoints of securing coverage and suppressing a decrease in resolution when active light is irradiated through the support film 10.
(first resin layer)
The first resin layer 20 is preferably formed of a photosensitive resin composition containing a binder polymer (hereinafter also referred to as component (a)), a photopolymerizable compound (hereinafter also referred to as component (B)), and a photopolymerization initiator (hereinafter also referred to as component (C)).
< adhesive Polymer >
As the component (a), a polymer having a carboxyl group is preferably used from the viewpoint of being capable of patterning by alkali development.
(A) The component (c) is preferably a copolymer containing structural units derived from (meth) acrylic acid and an alkyl (meth) acrylate. The copolymer may contain other monomers copolymerizable with the alkyl (meth) acrylate in the constituent unit. Specific examples of the other monomer include glycidyl (meth) acrylate, benzyl (meth) acrylate, styrene, cyclohexyl (meth) acrylate, and the like.
Examples of the alkyl (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and hydroxyethyl (meth) acrylate.
Among them, from the viewpoint of alkali developability (in particular, developability to an inorganic alkali aqueous solution), patterning property, and transparency, a binder polymer having a structural unit derived from at least one compound selected from the group consisting of (meth) acrylic acid, glycidyl (meth) acrylate, benzyl (meth) acrylate, styrene, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, cyclohexyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxy (meth) acrylate, dicyclopentyloxy (meth) acrylate, phenoxy ethyl (meth) acrylate, isobornyl (meth) acrylate, cyclohexylmaleimide, hydroxyethyl (meth) acrylate, and hydroxybutyl (meth) acrylate is preferable, and a binder polymer having a structural unit derived from at least one compound selected from the group consisting of glycidyl (meth) acrylate, benzyl (meth) acrylate, styrene, methyl (meth) acrylate, dicyclopentenyl oxy (meth) acrylate, phenoxyethyl (meth) acrylate, isobornyl (meth) acrylate, cyclohexylmaleimide, hydroxyethyl (meth) acrylate, and hydroxybutyl (meth) acrylate is more preferable, and a binder having a structural unit derived from the group of (meth) acrylate and (meth) acrylate is preferable An alkyl (meth) acrylate, glycidyl (meth) acrylate, and a structural unit of cyclohexyl (meth) acrylate. The binder polymer may be obtained by an addition reaction of an isocyanate ethyl (meth) acrylate or glycidyl (meth) acrylate with a hydroxyethyl (meth) acrylate or hydroxybutyl (meth) acrylate which is a copolymer containing at least hydroxyethyl (meth) acrylate or hydroxybutyl (meth) acrylate as the structural unit.
In this embodiment, from the viewpoint of reducing the moisture permeability of the cured film, a binder polymer containing a group having a branched structure and/or an alicyclic structure in a side chain, a group having an acidic group in a side chain, and a group having an ethylenically unsaturated group in a side chain can be used. The group having a branched structure and/or an alicyclic structure in the side chain can be introduced by a monomer containing a group having a branched structure in the side chain or a monomer containing a group having an alicyclic structure in the side chain. The group having an acidic group in a side chain can be introduced by a monomer containing a group having an acidic group in a side chain.
Specific examples of the monomer having a group having a branched structure in a side chain include isopropyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, isopentyl (meth) acrylate, tert-amyl (meth) acrylate, sec-isoamyl (meth) acrylate, 2-octyl (meth) acrylate, 3-octyl (meth) acrylate, tert-octyl (meth) acrylate, and the like. Among them, isopropyl (meth) acrylate, isobutyl (meth) acrylate, and t-butyl methacrylate are preferable, and isopropyl methacrylate and t-butyl methacrylate are more preferable.
Specific examples of the monomer having a group having an alicyclic structure in a side chain include (meth) acrylic esters having an alicyclic hydrocarbon group having 5 to 20 carbon atoms. More specific examples thereof include (meth) acrylic acid (bicyclo [2.2.1] heptyl-2) ester, (meth) acrylic acid) -1-adamantane ester, (meth) acrylic acid-2-adamantane ester, (meth) acrylic acid-3-methyl-1-adamantane ester, (meth) acrylic acid-3, 5-dimethyl-1-adamantane ester, (meth) acrylic acid-3-ethyl adamantane ester, (meth) acrylic acid-3-methyl-5-ethyl-1-adamantane ester, (meth) acrylic acid-3, 5, 8-triethyl-1-adamantane ester, (meth) acrylic acid-3, 5-dimethyl-8-ethyl-1-adamantane ester, (meth) acrylic acid 2-methyl-2-adamantane ester, (meth) acrylic acid 2-ethyl-2-adamantane ester, 3-hydroxy-1-adamantane ester, (meth) acrylic acid octahydro-4, 7-bridged inden-5-yl ester, (meth) acrylic acid octahydro-4, 7-methyl-indene-1-methyl (meth) acrylate, and (meth) acrylic acid-1-bridged-menthane ester 3-hydroxy-2, 6-trimethyl-bicyclo [3.1.1] heptyl (meth) acrylate, 3, 7-trimethyl-4-hydroxy-bicyclo [4.1.0] heptyl (meth) acrylate, norbornyl (meth) acrylate, isobornyl (meth) acrylate, fenchyl (meth) acrylate, 2, 5-trimethylcyclohexyl (meth) acrylate, cyclohexyl (meth) acrylate, and the like. Among these (meth) acrylic acid esters, cyclohexyl (meth) acrylate, norbornyl (meth) acrylate, isobornyl (meth) acrylate, 1-adamantyl (meth) acrylate, 2-adamantyl (meth) acrylate, fenchyl (meth) acrylate, 1-menthyl (meth) acrylate, dicyclopentanyl (meth) acrylate, and particularly cyclohexyl (meth) acrylate, norbornyl (meth) acrylate, isobornyl (meth) acrylate, and 2-adamantyl (meth) acrylate are preferable.
By containing the component (a) with a group having a branched structure and/or an alicyclic structure in a side chain, good adhesion to a substrate, particularly good adhesion to a substrate having an index matching layer, can be obtained. In addition, by having a group having an alicyclic structure in a side chain, the moisture permeability of the cured film can be reduced.
Specific examples of the monomer having a group having an acidic group in a side chain thereof may be appropriately selected from known monomers, and examples thereof include (meth) acrylic acid, vinyl benzoate, maleic acid, monoalkyl maleate, fumaric acid, itaconic acid, crotonic acid, cinnamic acid, sorbic acid, α -cyanocinnamic acid, acrylic acid dimer, an addition reaction product of a monomer having a hydroxyl group and a cyclic acid anhydride, ω -carboxy-polycaprolactone mono (meth) acrylate, and the like. The monomer may be appropriately produced, or commercially available ones may be used.
By incorporating a group having an acidic group in a side chain in the component (a), patterning can be performed by alkali development.
The group having an ethylenically unsaturated group in a side chain is not particularly limited, and a (meth) acryloyl group is preferable as the ethylenically unsaturated group. The linking of the ethylenically unsaturated group to the monomer is not particularly limited as long as it is a 2-valent linking group such as an ester group, an amide group, a carbamoyl group, or the like. The method of introducing an ethylenically unsaturated group into the side chain may be appropriately selected from known methods, and examples thereof include a method of adding a (meth) acrylate having an epoxy group to a group having an acidic group, a method of adding a (meth) acrylate having an isocyanate group to a group having a hydroxyl group, and a method of adding a (meth) acrylate having a hydroxyl group to a group having an isocyanate group. Among them, the method of adding a (meth) acrylate having an epoxy group to a repeating unit having an acidic group is most easily produced, and is preferable from the viewpoint of low cost.
By containing a group having an ethylenically unsaturated group in a side chain in the component (a), good adhesion to a substrate, particularly good adhesion to a substrate having an index matching layer, can be obtained. In addition, the moisture permeability of the cured film can be reduced.
The proportion of the monomer constituting the group having a branched structure and/or an alicyclic structure in the side chain is preferably 10 to 70 mol%, more preferably 15 to 65 mol%, and even more preferably 20 to 60 mol%, based on the total amount of the monomers constituting the component (a). The proportion of the monomer constituting the group having an acidic group in the side chain is preferably 5 to 70 mol%, more preferably 10 to 60 mol%, and even more preferably 20 to 50 mol%, based on the total amount of the monomers constituting the component (a). The proportion of the monomer constituting the group having an ethylenically unsaturated group in the side chain is preferably 5 to 70 mol%, more preferably 10 to 60 mol%, and even more preferably 20 to 50 mol%, based on the total amount of the monomers constituting the component (a). By satisfying the ratio of the monomers, the patterning property by alkali development, the lamination property with the substrate, and the good adhesion property with the substrate which may have the refractive index matching layer can be improved in a well-balanced manner.
From the viewpoint of resolution, the weight average molecular weight of the component (a) is preferably 10000 to 200000, more preferably 15000 to 150000, further preferably 30000 to 150000, particularly preferably 30000 to 100000, and most preferably 40000 to 100000. The weight average molecular weight can be measured by gel permeation chromatography described in examples of the present specification.
The acid value of the component (a) is preferably 75mgKOH/g or more, from the viewpoint of easily forming a cured film (cured film pattern) having a desired shape by alkali development. In order to achieve both of the ease of controlling the shape of the cured film and the rust inhibitive performance of the cured film, the acid value of the component (A) is preferably 75 to 200mgKOH/g, more preferably 75 to 150mgKOH/g, and even more preferably 75 to 120mgKOH/g. The acid value can be measured by the method described in examples of the present specification.
The first resin layer 20 may further contain a binder polymer other than the binder polymer (a) described above.
< photopolymerizable Compound >
The component (B) may be a compound having a tricyclodecane skeleton or tricyclodecene skeleton. From the viewpoint of suppressing corrosion of the metal wiring and the transparent electrode pattern, the compound having a tricyclodecane skeleton or tricyclodecene skeleton preferably contains a di (meth) acrylate compound represented by the following general formula (B-1).
[ chemical formula number 1 ]
[ in the general formula (B-1), R 1 R is R 2 Each independently represents a hydrogen atom or a methyl group, X represents a 2-valent group having a tricyclodecane skeleton or a tricyclodecene skeleton, R 3 R is R 4 Each independently represents an alkylene group having 1 to 4 carbon atoms, n and m each independently represents an integer of 0 to 2, p and q each independently represents an integer of 0 or more, and p and q are selected such that p+q=0 to 10.]
In the above general formula (B-1), R 3 R is R 4 Ethylene or propylene are preferred, and ethylene is more preferred. The propylene group may be either n-isopropylene group or isopropylene group.
According to the compound represented by the general formula (B-1), the 2-valent group having the tricyclodecane skeleton or tricyclodecene skeleton contained in X has a bulky structure, whereby low moisture permeability of the cured film can be achieved and corrosion inhibition of the metal wiring and the transparent electrode can be improved. Here, the "tricyclodecane skeleton" and the "tricyclodecene skeleton" in the present specification refer to the following structures (bonding positions are arbitrary positions, respectively).
[ chemical formula number 2 ]
As the compound having a tricyclodecane skeleton or tricyclodecene skeleton, a compound having a tricyclodecane skeleton such as tricyclodecane dimethanol di (meth) acrylate is preferable from the viewpoint of low moisture permeability of the obtained cured film pattern. They are available as DCP and A-DCP (both available from Xinzhongcun chemical industries Co., ltd.).
The proportion of the compound having a tricyclodecane skeleton or tricyclodecene skeleton in the component (B) is preferably 50 parts by mass or more, more preferably 70 parts by mass or more, and even more preferably 80 parts by mass or more, based on 100 parts by mass of the total amount of the photopolymerizable compounds contained in the photosensitive resin composition, from the viewpoint of reducing the moisture permeability and the level difference.
As the photopolymerizable compound as the component (B), a photopolymerizable compound having an ethylenically unsaturated group, which is different from the compound having a tricyclodecane skeleton or tricyclodecene skeleton, can be used. Examples of the photopolymerizable compound having an ethylenically unsaturated group include a monofunctional vinyl monomer having one polymerizable ethylenically unsaturated group in the molecule, a difunctional vinyl monomer having two polymerizable ethylenically unsaturated groups in the molecule, or a multifunctional vinyl monomer having at least three polymerizable ethylenically unsaturated groups in the molecule.
The content of the component (a) and the component (B) is preferably 35 to 85 parts by mass, more preferably 40 to 80 parts by mass, still more preferably 50 to 70 parts by mass, and particularly preferably 55 to 65 parts by mass, relative to 100 parts by mass of the total amount of the component (a) and the component (B).
From the viewpoint of low moisture permeability and improved adhesion of the cured film pattern, the compound having a tricyclodecane skeleton or tricyclodecenyl skeleton is preferably 5 parts by mass or more, more preferably 10 parts by mass or more, still more preferably 20 parts by mass or more, and particularly preferably 25 parts by mass or more, relative to 100 parts by mass of the total amount of the component (a) and the component (B). In this embodiment, by combining an acyl phosphine oxide photopolymerization initiator described later as a photopolymerization initiator with a compound having a tricyclodecane skeleton or tricyclodecene skeleton blended in the above-described ratio, a cured film pattern having a low moisture permeability and high adhesion at a high level while suppressing the level of level difference can be formed.
< photopolymerization initiator >
As the component (C), an acylphosphine oxide-based photopolymerization initiator is used. (C) The component (c) may be used in combination with a conventionally known photopolymerization initiator other than the acylphosphine oxide-based photopolymerization initiator.
Examples of the acylphosphine oxide-based photopolymerization initiator include 2,4, 6-trimethylbenzoyl-diphenyl-phosphine oxide, bis (2, 4, 6-trimethylbenzoyl) -phenylphosphine oxide, and 2,4, 6-trimethylbenzoyl-phosphonite. The acylphosphine oxide photopolymerization initiator can be obtained as IRGACURE TPO, IRGACURE 819, IRGACURE TPO-L (product name, manufactured by BASF Co., ltd.). By using the acylphosphine oxide-based photopolymerization initiator, a sufficient polymerization reaction rate can be obtained in the photosensitive resin layer, and pattern visibility can be suppressed.
Examples of photopolymerization initiators other than the acylphosphine oxide-based photopolymerization initiator include oxime ester-based photopolymerization initiators. By combining the acylphosphine oxide-based photopolymerization initiator with the oxime ester-based photopolymerization initiator, the moisture permeability of the formed cured film pattern can be further reduced.
The oxime ester photopolymerization initiator is preferably a compound represented by the following general formula (1), a compound represented by the following general formula (2), or a compound represented by the following general formula (3).
[ chemical formula number 3 ]
In the formula (1), R 11 R is R 12 Each independently represents an alkyl group having 1 to 12 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, a phenyl group or a tolyl group, preferably an alkyl group having 1 to 8 carbon atoms, a cycloalkyl group having 4 to 6 carbon atoms, a phenyl group or a tolyl group, more preferably an alkyl group having 1 to 4 carbon atoms, a cycloalkyl group having 4 to 6 carbon atoms, a phenyl group or a tolyl group, and still more preferably a methyl group, a cyclopentyl group, a phenyl group or a tolyl group. R is R 13 represents-H, -OH, -COOH, -O (CH) 2 )OH、-O(CH 2 ) 2 OH、-COO(CH 2 ) OH or-COO (CH) 2 ) 2 OH, preferably-H, -O (CH) 2 )OH、-O(CH 2 ) 2 OH、-COO(CH 2 ) OH or-COO (CH) 2 ) 2 OH, more preferably-H, -O (CH) 2 ) 2 OH or-COO (CH) 2 ) 2 OH。
[ chemical formula number 4 ]
In the formula (2), 2R 14 Each independently represents an alkyl group having 1 to 6 carbon atoms, preferably a propyl group. R is R 15 Represents NO 2 Or ArCO (wherein Ar represents an aryl group), and as Ar, tolyl is preferable. R is R 16 R is R 17 Each independently represents an alkyl group having 1 to 12 carbon atoms, a phenyl group or a tolyl group, and preferably a methyl group, a phenyl group or a tolyl group.
[ chemical formula number 5 ]
In the formula (3), R 18 An alkyl group having 1 to 6 carbon atoms is preferably ethyl. R is R 19 The organic group having an acetal bond is preferably R which is contained in a compound represented by the following formula (3-1) 19 Corresponding substituents. R is R 20 R is R 21 Each independently represents an alkyl group having 1 to 12 carbon atoms, a phenyl group or a tolyl group, preferably a methyl group, a phenyl group or a tolyl group, and more preferably a methyl group. R is R 22 Represents a hydrogen atom or an alkyl group.
The compound represented by the above general formula (1) can be obtained as IRGACURE OXE 01 (product name, manufactured by BASF Co., ltd.).
The compound represented by the above general formula (2) can be obtained as DFI-091 (product name, manufactured by DAITO CHEMIX Co., ltd.).
The compound represented by the above general formula (3) can be obtained as Adeka Optomer N-1919 (manufactured by ADEKA, product name).
The content of the component (C) is preferably 0.1 to 10 parts by mass, more preferably 1 to 5 parts by mass, even more preferably 1 to 3 parts by mass, and particularly preferably 1 to 2 parts by mass, relative to 100 parts by mass of the total of the component (a) and the component (B) in view of excellent photosensitivity and resolution.
From the viewpoint of exposure sensitivity, the proportion of the acylphosphine oxide-based photopolymerization initiator in the component (C) is preferably 1 part by mass or more, more preferably 3 parts by mass or more, and still more preferably 5 parts by mass or more, based on 100 parts by mass of the total amount of the photopolymerization initiator contained in the photosensitive resin composition.
In the case where the acylphosphine oxide-based photopolymerization initiator is used in combination with the oxime ester compound, the mass ratio of the acylphosphine oxide-based photopolymerization initiator to the oxime ester compound is preferably 8 from the viewpoints of pattern visibility, reliability, color tone, and curability: 1 to 0.5:1, more preferably 4: 1-2: 1.
from the viewpoint of further improving the rust inhibitive performance of the cured film, the photosensitive resin composition of the present embodiment preferably further contains at least one compound (hereinafter also referred to as component (D)) selected from the group consisting of a triazole compound having a mercapto group, a tetrazole compound having a mercapto group, a thiadiazole compound having a mercapto group, a triazole compound having an amino group, and a tetrazole compound having an amino group. Examples of the triazole compound having a mercapto group include 3-mercapto-triazole (manufactured by Wako pure chemical industries, ltd., product name: 3 MT). Examples of the thiadiazole compound having a mercapto group include 2-amino-5-mercapto-1, 3, 4-thiadiazole (manufactured by Wako pure chemical industries, ltd., product name: ATT).
Examples of the triazole compound having an amino group include compounds substituted with an amino group such as benzotriazole, 1H-benzotriazole-1-acetonitrile, benzotriazole-5-carboxylic acid, 1H-benzotriazole-1-methanol, and carboxybenzotriazole, and compounds substituted with an amino group on a triazole compound having a mercapto group such as 3-mercaptotriazole and 5-mercaptotriazole.
Examples of the tetrazole compound having an amino group include 5-amino-1H-tetrazole, 1-methyl-5-amino-tetrazole, 1-methyl-5-mercapto-1H-tetrazole, and 1-carboxymethyl-5-amino-tetrazole. These tetrazole compounds may also be water soluble salts thereof. Specific examples thereof include alkali metal salts such as sodium, potassium and lithium of 1-methyl-5-amino-tetrazole.
When the photosensitive resin composition contains the component (D), the content thereof is preferably 0.05 to 5.0 parts by mass, more preferably 0.1 to 2.0 parts by mass, still more preferably 0.2 to 1.0 parts by mass, and particularly preferably 0.3 to 0.8 parts by mass, relative to 100 parts by mass of the total amount of the component (a) and the component (B).
The photosensitive resin composition forming the first resin layer of the present embodiment may contain, as other additives, about 0.01 to 20 parts by mass of an adhesion imparting agent such as a phosphate having an ethylenically unsaturated group, a silane coupling agent, an anticorrosive agent, a leveling agent, a plasticizer, a filler, an antifoaming agent, a flame retardant, a stabilizer, an antioxidant, a perfume, a thermal crosslinking agent, a polymerization inhibitor, and the like, based on 100 parts by mass of the total amount of the component (a) and the component (B), as required. They may be used singly or in combination of 2 or more.
The thickness of the first resin layer may be 1 to 15. Mu.m, preferably 2 to 10. Mu.m, more preferably 3 to 8. Mu.m, still more preferably 4 to 6. Mu.m, particularly preferably 5 to 6. Mu.m. By setting the thickness to 1 to 15 μm, a film having few defects at the time of coating and excellent transparency can be formed. In addition, the thickness of the first resin layer after curing (i.e., the thickness of the cured film pattern) is also preferably within the above-described range.
(second resin layer)
The second resin layer 30 is a layer containing metal oxide particles. The second resin layer 30 can have a relatively higher refractive index than the first resin layer 20 by containing metal oxide particles. The refractive index of the second resin layer 30 at 633nm is preferably in the range of 1.40 to 1.90, more preferably 1.50 to 1.90, still more preferably 1.53 to 1.85, and particularly preferably 1.55 to 1.75. In the case where the second resin layer contains a curable component, the refractive index of the cured second resin layer at 633nm is also preferably within the above range.
If the refractive index of the second resin layer 30 is within the above range at 633nm, when the cured film pattern is provided on the transparent electrode pattern such as ITO, it is possible to achieve an intermediate value of the refractive index of various members used on the cured film pattern (for example, OCA used in modularization to bond the protective glass to the transparent electrode pattern), it is possible to reduce chromatic aberration due to optical reflection between a portion where the transparent electrode pattern such as ITO is formed and a portion where the transparent electrode pattern such as ITO is not formed, and it is possible to prevent a visible light phenomenon. In addition, the reflected light intensity of the entire screen can be reduced, and the transmittance on the screen can be suppressed from being reduced.
The refractive index of the transparent electrode such as ITO is preferably 1.80 to 2.10, more preferably 1.85 to 2.05, and even more preferably 1.90 to 2.00. The refractive index of the component such as OCA is preferably 1.45 to 1.55, more preferably 1.47 to 1.53, and still more preferably 1.48 to 1.51.
The minimum light transmittance of the second resin layer 30 in the wavelength region of 450 to 650nm is preferably 80% or more, more preferably 85% or more, and still more preferably 90% or more. In the case where the second resin layer contains a curable component, the minimum light transmittance of the cured second resin layer in the wavelength region of 450 to 650nm is also preferably within the above range.
The second resin layer 30 may contain the above-described component (a), component (B) and component (C), and may further contain the above-described component (D) as needed. The second resin layer 30 does not necessarily contain a photopolymerization component such as component (B) and component (C), and the second resin layer may be cured by photopolymerization transferred from a resin layer adjacent to the layer.
The second resin layer 30 contains metal oxide particles (hereinafter also referred to as component (E)). The metal oxide particles preferably contain metal oxide particles having a refractive index of 1.50 or more at a wavelength of 633 nm. Thus, when the transfer type photosensitive film is produced, the transparency of the second resin layer and the refractive index at a wavelength of 633nm can be improved. In addition, the developability can be improved while the adsorption to the substrate is suppressed.
Examples of the metal oxide particles include particles made of metal oxides such as zirconium oxide, titanium oxide, tin oxide, zinc oxide, indium tin oxide, indium oxide, aluminum oxide, and yttrium oxide. Among them, particles of zirconia or titania are preferable from the viewpoint of suppressing the visible light phenomenon.
When the material of the transparent electrode is ITO, zirconia nanoparticles are preferably used in terms of improving the refractive index and adhesion to ITO and the transparent substrate. In the zirconia nanoparticles, the particle size distribution Dmax is preferably 40nm or less.
The zirconia nanoparticles can be obtained commercially as OZ-S30K (manufactured by daily chemical industry, product name), OZ-S40K-AC (manufactured by daily chemical industry, product name), SZR-K (zirconia methyl ethyl ketone dispersion, manufactured by sakeh chemical industry, product name), SZR-M (zirconia methanol dispersion, manufactured by sakeh chemical industry, product name).
The second resin layer 30 may contain titanium oxide nanoparticles as the component (E). In the titanium oxide nanoparticle, the particle size distribution Dmax is preferably 50nm or less, more preferably 10 to 50nm.
As the component (E), oxide particles or sulfide particles containing an atom such as Mg, al, si, ca, cr, cu, zn, ba may be used in addition to the metal oxide particles. They may be used alone or in combination of two or more.
In addition to the metal oxide particles, organic compounds such as a compound having a triazine ring, a compound having an isocyanuric acid skeleton, and a compound having a fluorene skeleton can be used. This can increase the refractive index at a wavelength of 633 nm.
The thickness of the second resin layer 30 may be 0.01 to 1. Mu.m, preferably 0.03 to 0.5. Mu.m, more preferably 0.04 to 0.3. Mu.m, still more preferably 0.07 to 0.25. Mu.m, and particularly preferably 0.05 to 0.2. Mu.m. By setting the thickness to 0.01 to 1 μm, the intensity of reflected light on the entire screen can be further reduced. In addition, the thickness of the cured second resin layer is also preferably within the above range.
When the second resin layer 30 has a single layer and a uniform film thickness in the film thickness direction, the refractive index of the second resin layer can be obtained as follows using ETA-TCM (manufactured by audiodev gmbh corporation, product name). The following measurement was performed at 25 ℃.
(1) The coating liquid for forming the second resin layer was uniformly coated on a glass substrate having a thickness of 0.7mm and a longitudinal dimension of 10cm and a transverse dimension of 10cm by a spin coater, and dried by a hot air retention dryer at 100℃for 3 minutes, and the solvent was removed to form the second resin layer.
(2) Next, the mixture was allowed to stand in a box-type dryer (model: NV50-CA, manufactured by Mitsubishi electric Co., ltd.) heated to 140℃for 30 minutes to obtain a sample for refractive index measurement having a second resin layer.
(3) Next, the refractive index at 633nm was measured using ETA-TCM (manufactured by Audio Dev GmbH Co., ltd., product name) for the obtained refractive index measurement sample.
The refractive index of the single-layer first resin layer can also be measured by the same method. In the transfer type photosensitive film, since it is difficult to measure the refractive index of the second resin layer monolayer, the value of the outermost layer on the protective film side of the second resin layer is used.
(other layers)
The transfer type photosensitive film of the present invention may be provided with other layers appropriately selected within a range where the effects of the present invention can be obtained. The other layer is not particularly limited and may be appropriately selected according to the purpose, and examples thereof include a buffer layer, an oxygen barrier layer, a release layer, and an adhesive layer. The transfer photosensitive film may have 1 kind of these layers alone or 2 or more kinds. In addition, the semiconductor device may have 2 or more layers of the same species.
(protective film)
Examples of the protective film 40 include polyethylene, polypropylene, polyethylene terephthalate, polycarbonate, polyethylene-vinyl acetate copolymer, and polyethylene-vinyl acetate copolymer films, and laminated films of these films and polyethylene.
The thickness of the protective film 40 is preferably 5 to 100 μm, and is preferably 70 μm or less, more preferably 60 μm or less, still more preferably 50 μm or less, and particularly preferably 40 μm or less, from the viewpoint of winding the transfer photosensitive film 1 into a roll and storing it.
The minimum value of the total light transmittance (Tt) of the cured film portion (excluding the support film 10 and the protective film 40) obtained by curing the first resin layer 20 and the second resin layer 30 in the transfer photosensitive film 1 in the visible light region having a wavelength of 400 to 700nm is preferably 90.00% or more, more preferably 90.50% or more, and still more preferably 90.70% or more. If the total light transmittance in the normal visible light wavelength region, i.e., 400 to 700nm, is 90.00% or more, the degradation of the image display quality, color tone, and luminance in the sensing region can be sufficiently suppressed in the case of protecting the transparent electrode in the sensing region of the touch panel (touch sensor).
The first resin layer 20 and the second resin layer 30 of the transfer photosensitive film 1 can be formed, for example, by preparing a first resin layer forming coating liquid and a second resin layer forming coating liquid, respectively coating the support film 10 and the protective film 40, and drying the same. The transfer photosensitive film 1 can be formed by bonding the support film 10 on which the first resin layer 20 is formed and the protective film 40 on which the second resin layer 30 is formed, with the first resin layer 20 and the second resin layer 30 facing each other. The transfer type photosensitive film 1 may be formed by applying a coating liquid containing a coating liquid for forming a first resin layer on the support film 10, drying the coating liquid, then applying a coating liquid for forming a second resin layer on the first resin layer 20, drying the coating liquid, and attaching the protective film 40.
The coating liquid can be obtained by uniformly dissolving or dispersing the components constituting the photosensitive resin composition and the second resin layer of the present embodiment in a solvent.
The solvent used for the coating liquid is not particularly limited, and a known solvent can be used. Specific examples thereof include acetone, methyl ethyl ketone, methyl isobutyl ketone, toluene, methanol, ethanol, propanol, butanol, methylene glycol, ethylene glycol, propylene glycol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether, propylene glycol monomethyl ether, ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, chloroform, and methylene chloride.
Examples of the coating method include doctor blade coating, meyer bar coating, roll coating, screen coating, spin coating, inkjet coating, spray coating, dip coating, gravure coating, curtain coating, and die coating.
The drying conditions are not particularly limited, and the drying temperature is preferably 60 to 130℃and the drying time is preferably 0.5 to 30 minutes.
[ method of Forming cured film Pattern ]
Fig. 2 is a schematic cross-sectional view showing a laminate including a cured film formed using a transfer photosensitive film according to an embodiment of the present invention on a substrate with a transparent electrode pattern. The laminate 100 shown in fig. 2 includes a transparent electrode pattern-provided base material 50 having a transparent electrode pattern 50a, and a cured film 60 provided on the transparent electrode pattern 50a of the transparent electrode pattern-provided base material 50. The cured film 60 is a cured film composed of the cured first resin layer 22 and the cured second resin layer 32, and is formed using the transfer photosensitive film 1 of the present embodiment. The cured film 60 satisfies both the function of protecting the transparent electrode pattern 50a and the function of invisible of the transparent electrode pattern 50a or improving the visibility of the touch screen. An embodiment of a method for producing a laminate in which a cured film is formed on a substrate having a transparent electrode pattern will be described below.
Lamination procedure-
First, after removing the protective film 40 of the transfer photosensitive film 1, the second resin layer 30, the first resin layer 20, and the support film 10 are pressed against the surface of the transparent electrode pattern-attached substrate 50 from the side of the second resin layer 30, whereby lamination (transfer) is performed. The pressure bonding mechanism includes a pressure bonding roller. The pressure roller may be provided with a heating mechanism to enable thermocompression bonding.
The heating temperature at the time of the thermocompression bonding is preferably 10 to 160 ℃, more preferably 20 to 150 ℃, and even more preferably 30 to 150 ℃, from the viewpoint of the adhesion of the second resin layer 30 to the transparent electrode pattern-carrying substrate 50 and the viewpoint of the difficulty in thermosetting or thermal decomposition of the constituent components of the first resin layer 20 or the second resin layer 30.
In addition, from the viewpoint of sufficiently securing adhesion between the second resin layer 30 and the transparent electrode pattern-attached substrate 50 and suppressing deformation of the transparent electrode pattern-attached substrate 50, the pressure of the pressure bonding at the time of thermocompression bonding is preferably 50 to 1×10 in terms of line pressure 5 N/m, more preferably 2.5X10 2 ～5×10 4 N/m, more preferably 5X 10 2 ～4×10 4 N/m。
When the transfer photosensitive film 1 is heat-pressed as described above, the preheating treatment of the transparent electrode pattern-attached substrate 50 is not necessarily required, but the preheating treatment of the transparent electrode pattern-attached substrate 50 may be performed from the viewpoint of further improving the adhesion between the second resin layer 30 and the transparent electrode pattern-attached substrate 50. The treatment temperature in this case is preferably 30 to 150 ℃.
(substrate)
Examples of the substrate constituting the substrate 50 with a transparent electrode pattern include substrates such as a glass plate, a plastic plate, and a ceramic plate for a touch panel (touch sensor).
(transparent electrode and Metal Wiring)
The transparent electrode can be formed using a conductive metal oxide film such as ITO or IZO (Indium Zinc Oxide, indium oxide-zinc oxide). The transparent electrode may be formed using a photosensitive film having a photocurable resin layer using conductive fibers such as silver fibers and carbon nanotubes. The metal wiring may be formed by a method such as screen printing or vapor deposition using a conductive material such as Au, ag, cu, al, mo, C. Further, an insulating layer or an index matching layer may be provided between the substrate and the electrode on the substrate. The index matching layer may have the same composition as the second resin layer 30 described above.
Exposure process-
Next, the photomask is separated from predetermined portions of the transferred first resin layer and second resin layer, and the active light is irradiated in a pattern. When the active light is irradiated, the active light may be directly irradiated when the support film 10 on the first resin layer and the second resin layer is transparent, or the active light may be irradiated after the support film is removed when the support film is opaque. As the light source of the active light, a known active light source can be used. In this specification, the pattern is not limited to the shape of the fine wiring forming the circuit, but includes a shape in which only the connection portion with another base material is removed to have a rectangular shape, a shape in which only the frame portion of the base material is removed, and the like.
The irradiation amount of the active light was 1×10 2 ～1×10 4 J/m 2 The irradiation may be accompanied by heating. If the irradiation amount of the active light is 1×10 2 J/m 2 The above can sufficiently proceed the photo-curing of the first resin layer and the second resin layer, and if it is 1×10 4 J/m 2 Hereinafter, discoloration of the first resin layer and the second resin layer tends to be suppressed.
Subsequently, the unexposed portions of the first resin layer and the second resin layer irradiated with the active light are removed with a developer, and a cured film (refractive index adjustment pattern) 60 is formed so as to cover a part or the whole of the transparent electrode. When the support film 10 is laminated on the first resin layer and the second resin layer after irradiation of the active light, the support film is removed and then subjected to a developing process.
The developing step may be performed by a known method such as spraying, sprinkling, oscillating dipping, brushing, or polishing using a known developer such as an aqueous alkali solution, an aqueous developer, or an organic solvent. Among them, the aqueous alkali solution is preferably used for spray development from the viewpoint of environment and safety. The development temperature and time can be adjusted within a conventionally known range.
In the present embodiment, the cured film pattern is formed using the transfer type photosensitive film, and in the case of using the transfer type photosensitive film having no second resin layer, the cured film pattern may be formed in the same manner.
(cured film)
The cured film of the present invention may be a cured film obtained by curing the first resin layer and the second resin layer of the transfer photosensitive film of the present embodiment. In this case, for example, in the case where most of the second resin layer is covered with the first resin layer and is not exposed, the second resin layer does not necessarily need to be cured. The cured film of the present invention also includes a case where such a first resin layer is cured and a second resin layer is not cured. The cured film of the present invention is preferably formed in a pattern.
In the case where the transfer type photosensitive film of the present invention does not have the second resin layer, the cured film of the present invention may be a cured film obtained by curing the first resin layer.
The transfer photosensitive film of the present embodiment can be applied to the formation of protective films in various electronic components. The electronic component of the present embodiment includes a cured film pattern formed using a transfer photosensitive film. Examples of the electronic component include a touch sensor, a touch panel, a liquid crystal display, an organic electroluminescent element, a solar cell module, a printed wiring board, and electronic paper.
For example, the touch sensor may include the laminate 100 shown in fig. 2. When the touch sensor is a module such as a touch panel, OCA for bonding the cover glass to the laminate 100 may be used.
Fig. 3 is a schematic plan view showing a touch panel according to an embodiment of the present invention. Fig. 3 shows an example of a capacitive touch panel. The touch panel shown in fig. 3 has a touch screen 102 for detecting touch position coordinates on one surface of a transparent substrate 101, and a transparent electrode 103 and a transparent electrode 104 for detecting a change in electrostatic capacitance in the region are provided on the transparent substrate 101.
The transparent electrode 103 and the transparent electrode 104 detect the X position coordinates and the Y position coordinates of the touch position, respectively.
The transparent substrate 101 is provided with a lead wiring 105 for transmitting a detection signal of a touch position from the transparent electrode 103 and the transparent electrode 104 to an external circuit. The lead wiring 105, the transparent electrode 103, and the transparent electrode 104 are connected to each other through a connection electrode 106 provided on the transparent electrode 103 and the transparent electrode 104. A connection terminal 107 connected to an external circuit is provided at an end of the lead wiring 105 opposite to the connection portion between the transparent electrode 103 and the transparent electrode 104.
As shown in fig. 3, in the touch panel of the present embodiment, a cured film pattern 123 is formed using the transfer type photosensitive film of the present embodiment, across a portion where the transparent electrode pattern is formed and a portion where the transparent electrode pattern is not formed. The cured film pattern 123 is composed of a cured first resin layer and a cured second resin layer. In the case of using a transfer type photosensitive film having no second resin layer, the cured film pattern 123 is composed of a cured first resin layer. The cured film pattern 123 can protect the transparent electrode 103, the transparent electrode 104, the lead-out wiring 105, the connection electrode 106, and the connection terminal 107, and can prevent the light-shadow-viewing phenomenon of the sensing region (touch screen) 102 formed by the transparent electrode pattern. In addition, by using the transfer type photosensitive film of the present embodiment, the level difference of the surface of the cured film pattern 123 can be sufficiently small.
Examples
The present invention will be described in more detail with reference to examples and comparative examples, but the present invention is not limited to the examples.
[ preparation of adhesive Polymer solution ]
Synthesis example A1
85.7 parts by mass of 1-methoxy-2-propanol (manufactured by Daicel chemical industry Co., ltd.) was previously charged into the reaction vessel, and the temperature was raised to 80 ℃. On the other hand, 46 parts by mass of cyclohexyl methacrylate, 2 parts by mass of methyl methacrylate, 52 parts by mass of methacrylic acid and 10 parts by mass of an azo-based polymerization initiator (manufactured by Wako pure chemical industries, ltd., V-601) were mixed to obtain a mixed solution. The mixed solution was added dropwise to the above-mentioned reaction vessel at 80℃under a nitrogen atmosphere for 2 hours. After the dropping, the mixture was allowed to react for 4 hours to obtain an acrylic resin solution.
Subsequently, 2.5 parts by mass of hydroquinone monomethyl ether and 8.4 parts by mass of tetraethylammonium bromide were added to the acrylic resin solution, and then 32 parts by mass of glycidyl methacrylate was added dropwise over 2 hours. After the dropping, the mixture was reacted at 80℃for 4 hours while blowing air, and propylene glycol monomethyl ether acetate was added as a solvent to make the solid content 45 mass%, thereby obtaining a binder polymer solution A1. Wherein, the addition amount is adjusted to lead the cyclohexyl methacrylate, the methyl methacrylate, the methacrylic acid and the glycidyl methacrylate to reach x: l: y: z=46 mol%:2mol%:20mol%:32mol%.
Synthesis example A2
62 parts by mass of propylene glycol monomethyl ether and 62 parts by mass of toluene were placed in a flask equipped with a stirrer, a reflux condenser, an inert gas inlet, and a thermometer, the temperature was raised to 80℃under a nitrogen atmosphere, the reaction temperature was maintained at 80.+ -. 2 ℃, and 1.5 parts by mass of the compound shown in Table 1 and 2,2' -azobis (isobutyronitrile) were uniformly added dropwise over 4 hours. After the dropping, stirring was continued at 80.+ -. 2 ℃ for 6 hours to obtain a binder polymer solution A2 (solid content: 45 mass%) having a weight-average molecular weight of 30000 and an acid value of 156.6 mgKOH/g.
[ Table 1 ]
(examples 1 to 13 and comparative examples 1 to 11)
[ preparation of coating liquid for Forming first resin layer ]
The components shown in tables 2 and 3 were mixed in the amounts (unit: parts by mass) shown in the tables, and mixed for 15 minutes using a stirrer to prepare a first resin layer-forming coating liquid. In tables 2 and 3, the blending amount of the component (A) represents the blending amount of the solid component. Wherein the coating liquid is prepared by using methyl ethyl ketone as a solvent and adjusting the solid content to 20-30 mass%.
[ production of coating liquid for Forming second resin layer ]
The components shown in Table 3 were blended in the blending amounts (unit: parts by mass) shown in the table, and mixed for 15 minutes using a stirrer to prepare a second resin layer-forming coating liquid. In Table 3, the blending amount of the component (A) represents the blending amount of the solid component.
The symbols of the components in tables 2 to 5 indicate the following meanings.
[ (A) component ]
A1: adhesive polymer solution prepared by the above method
A2: adhesive polymer solution prepared by the above method
[ (B) component ]
a-DCP: tricyclodecane dimethanol diacrylate (product name manufactured by Xinzhongcun chemical Co., ltd.)
DPHA: dipentaerythritol hexaacrylate (New Zhongcun chemical Co., ltd., product name "A-DPH")
[ (C) component ]
TPO:2,4, 6-Trimethylbenzoyl-diphenyl-phosphine oxide (product name "IRGACURE TPO" manufactured by BASF corporation)
819: bis (2, 4, 6-trimethylbenzoyl) -phenylphosphine oxide (product name "IRGACURE 819", manufactured by BASF corporation)
OXE 01:1- [4- (phenylsulfanyl) phenyl-1, 2-octanedione 2- (O-benzoyloxime) (product name "IRGACURE OXE 01", manufactured by BASF corporation)
OXE 02:1- [ 9-Ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl ] -ethanone 1- (O-acetyl oxime) (product name "IRGACURE OXE 02" manufactured by BASF corporation)
184: 1-hydroxy-cyclohexyl-phenyl-one (product name "IRGACURE184" manufactured by BASF corporation)
651:2, 2-dimethoxy-1, 2-diphenylethane-1-one (product name "IRGACURE 651", manufactured by BASF corporation)
754: mixtures of 2- (2-oxo-2-phenylacetyloxyethoxy) ethyl oxy-phenylacetate and 2- (2-hydroxyethoxy) ethyl oxy-phenylacetate (product name "IRGACURE754", manufactured by BASF corporation)
[ (E) component ]
E1: zirconium oxide nanoparticle Dispersion (product name "OZ-S30K", manufactured by Nissan chemical industry Co., ltd.)
[ production of transfer photosensitive film ]
(with the second resin layer)
As the protective film, a polypropylene film (product name: ES-201, manufactured by Ware F-Tex Co., ltd.) having a thickness of 30 μm was used, the coating liquid for forming the second resin layer prepared as described above was uniformly applied to the protective film by using a die coater, and dried by a hot air retention dryer at 110℃for 3 minutes, and the solvent was removed to form a second resin layer having a thickness of 60nm and a refractive index of 1.4.
As a support film, a polyethylene terephthalate film (product name: FB40, manufactured by Toray Co., ltd.) having a thickness of 16 μm was used, the coating liquid for forming the first resin layer prepared as described above was uniformly coated on the support film using a comma coater, and the support film was dried with a hot air convection dryer at 110℃for 3 minutes, and the solvent was removed to form a first resin layer having a thickness of 8. Mu.m.
Next, a protective film having a second resin layer and a support film having a first resin layer were bonded to each other at 23 ℃ using a laminator (product name: HLM-3000 manufactured by hitachi chemical Co., ltd.), to prepare a transfer photosensitive film in which the protective film, the second resin layer, the first resin layer and the support film were laminated in this order.
(case without the second resin layer)
As a support film, a polyethylene terephthalate film (product name: FB40, manufactured by Toray Co., ltd.) having a thickness of 16 μm was used, the coating liquid for forming the first resin layer prepared as described above was uniformly coated on the support film using a comma coater, and the support film was dried with a hot air convection dryer at 110℃for 3 minutes, and the solvent was removed to form a first resin layer having a thickness of 8. Mu.m.
Then, the support film having the first resin layer and a 30 μm thick polypropylene film (product name: ES-201, manufactured by Ware F-Tex Co., ltd.) as a protective film were bonded at 23℃to prepare a transfer type photosensitive film in which the protective film, the first resin layer and the support film were laminated in this order.
[ evaluation test of level difference ]
First, a test for evaluating the dishing (height difference) of the cured film surface formed of the transfer type photosensitive film will be described with reference to fig. 4. Fig. 4 shows a case of evaluating a transfer type photosensitive film having no second resin layer, and in a case of evaluating a transfer type photosensitive film having a second resin layer, the same is true except that the first resin layer 20 has a laminated structure of the first resin layer and the second resin layer.
A substrate 52 (ITO substrate) for evaluation was prepared. The protective films of the transfer type photosensitive films obtained in examples and comparative examples were peeled off, and the first resin layer 20 or, in the case where the transfer type photosensitive film had the second resin layer, the second resin layer 30 was laminated with the substrate at 100℃under 0.6m/min under 0.4 MPa.
After lamination, the substrate was cooled, and when the temperature of the substrate reached 23 ℃, an exposure machine (trade name: EXM-1201 manufactured by ORC Co., ltd.) having a high-pressure mercury lamp was used from the support film 10 side at 50mJ/cm 2 Is irradiated with light through a mask 70 having a predetermined pattern (see fig. 4 (a)).
Next, the mask 70 was removed at 10mJ/cm 2 The exposure amount L2 of (a) is irradiated with light (see fig. 4 (b)).
Next, the support film 10 was removed at 375mJ/cm 2 The exposure amount L3 of (a) is irradiated with light (see fig. 4 (c)).
Next, annealing was performed at 140℃for 30 minutes, and then the total exposure was measured to 435mJ/cm 2 The total of the surface S1 of the high-reactivity portion and the exposure amount was 385mJ/cm 2 The difference in height G (nm) between the surfaces S2 of the low-reactivity portions of (a) is shown (see fig. 4 (d)). The difference in height G (nm) was measured by a laser microscope (manufactured by Lasertec).
If the difference in height is 120nm or less, the pattern visibility can be sufficiently suppressed. In addition, when the laminate 100 shown in fig. 2 is formed, the following effect can be exhibited if the difference in the height of the recess of the cured film surface is 120nm or less. When a module such as a touch panel is formed using the laminate 100, OCA is used to bond the cover glass to the laminate 100. However, the OCA requires adhesion reliability under high temperature and high humidity in the cured film, but when there is a fine level difference on the surface of the cured film, there is a case where the OCA floats (peels off) due to the level difference. If the difference in height of the cured film surface is 120nm or less, the occurrence of the above-mentioned problems can be suppressed, and the adhesion reliability of the OCA under high temperature and high humidity can be improved.
[ evaluation of visible Pattern ]
The annealed samples obtained in the step evaluation test were fixed to a black plate, and were visually observed by irradiation with light from an oblique direction, and evaluated according to the following criteria.
O: no or no pattern is visible.
X: the pattern can be seen.
[ moisture permeability of cured film ]
5 transfer photosensitive films were prepared. First, the protective film of the 1 st transfer type photosensitive film was peeled off, and laminated on filter paper (manufactured by Advantec, no.5C, round shape of Φ90mm, thickness 130 μm) under conditions of a roll temperature of 100 ℃, a substrate transport speed of 0.6 m/min, and a pressure contact pressure (roll pressure) of 0.5 MPa. Then, the support film was peeled off, and the protective film of the 2 nd transfer type photosensitive film was peeled off and laminated on the first resin layer laminated on the filter paper. By repeating this operation, a laminate was produced in which a first resin layer (i.e., 5 layers of the first resin layer) and a support film were laminated on a filter paper to a thickness of 40 μm.
In the case where the transfer type photosensitive film has the second resin layer, a laminate of 5 layers of the first resin layer and the second resin layer having a thickness of about 40 μm and the support film was produced by the same procedure as described above.
Using a parallel ray exposure machine (EXM 1201 manufactured by ORC Co., ltd.) from the top of the support film surface at 0.6J/m 2 The laminate is irradiated with ultraviolet rays.
Then, the support film of the laminate irradiated with the ultraviolet rays was peeled off and removed, and the thickness of the support film was 1×10 from the vertical upper side of the laminate 4 J/m 2 Is irradiated with ultraviolet rays. Thus, a sample for moisture permeability measurement in which a cured film was formed on a filter paper was obtained.
Then, the moisture permeability was measured with reference to JIS standard (Z0208, cup method). First, a hygroscopic material (20 g of calcium chloride (anhydrous)) was added to a measuring cup (60 mm. Phi., 15mm deep, manufactured by well corporation). Next, the above-mentioned sample for measuring the moisture permeability is usedThe scissors were cut into round test pieces of 70mm diameter and covered on the measuring cup. The mixture was left to stand at 40℃and 90% RH for 24 hours in a constant temperature and humidity tank. The moisture permeability was calculated from the change in total mass of the measuring cup, the moisture absorbent and the circular sample piece before and after the placement. If the moisture permeability is 200g/m 2 And (3) the rust resistance is good when the time is 24 hours or less.
Symbol description
1. Transfer photosensitive film
10. Support film
20. A first resin layer
22. A cured first resin layer
30. Second resin layer
32. A cured second resin layer
40. Protective film
50. Substrate with transparent electrode pattern
50a transparent electrode pattern
60. Cured film
100. Laminate body
101. Transparent substrate
102. Sensing area
103. 104 transparent electrode
105. Lead-out wiring
106. Connection electrode
107. Connection terminal
123. Cured film pattern
Claims (21)
1. A transfer-type photosensitive film is provided with:
a support film, and
a first resin layer disposed on the support film;
the first resin layer contains a photopolymerizable compound having a tricyclodecane skeleton or tricyclodecene skeleton, and an acyl phosphine oxide photopolymerization initiator,
the first resin layer contains a binder polymer containing a group having a branched structure and/or an alicyclic structure in a side chain, a group having an acidic group in a side chain, and a group having an ethylenically unsaturated group in a side chain,
the adhesive polymer contains, as monomers constituting the adhesive polymer, a monomer constituting a group having a branched structure and/or an alicyclic structure in a side chain, a monomer constituting a group having an acidic group in a side chain, and a monomer constituting a group having an ethylenically unsaturated group in a side chain,
The proportion of the monomer constituting the group having a branched structure and/or an alicyclic structure in the side chain is 20 to 60 mol%, the proportion of the monomer constituting the group having an acidic group in the side chain is 20 to 50 mol%, the proportion of the monomer constituting the group having an ethylenically unsaturated group in the side chain is 20 to 50 mol%,
the first resin layer contains 5 parts by mass or more of the photopolymerizable compound having a tricyclodecane skeleton or tricyclodecene skeleton with respect to 100 parts by mass of the total amount of the binder polymer and the photopolymerizable compound contained in the first resin layer.
2. The transfer-type photosensitive film according to claim 1, wherein,
the acylphosphine oxide-based photopolymerization initiator comprises 2,4, 6-trimethylbenzoyl-diphenyl-phosphine oxide.
3. The transfer-type photosensitive film according to claim 1 or 2, wherein,
the first resin layer further includes an oxime ester-based photopolymerization initiator.
4. The transfer-type photosensitive film according to claim 1, wherein,
the weight average molecular weight of the binder polymer is 10000-200000.
5. The transfer-type photosensitive film according to claim 1 or 2, wherein,
The acid value of the binder polymer is 75-200 mgKOH/g.
6. The transfer-type photosensitive film according to claim 1 or 2, wherein,
the thickness of the first resin layer is 1-15 mu m.
7. The transfer photosensitive film according to claim 1 or 2, further comprising:
and a second resin layer containing metal oxide particles disposed on the first resin layer.
8. The transfer-type photosensitive film according to claim 7, wherein,
the second resin layer contains a photopolymerizable compound having a tricyclodecane skeleton or a tricyclodecene skeleton.
9. The transfer-type photosensitive film according to claim 7, wherein,
the second resin layer has a higher refractive index than the first resin layer,
the refractive index of the second resin layer at 633nm is 1.40-1.90.
10. The transfer-type photosensitive film according to claim 7, wherein,
the refractive index of the metal oxide particles is 1.50 or more at a wavelength of 633 nm.
11. The transfer-type photosensitive film according to claim 7, wherein,
the second resin layer contains an acylphosphine oxide-based photopolymerization initiator.
12. The transfer-type photosensitive film according to claim 7, wherein,
The second resin layer contains a binder polymer,
the binder polymer is a copolymer containing structural units derived from (meth) acrylic acid and alkyl (meth) acrylate.
13. The transfer-type photosensitive film according to claim 7, wherein,
the thickness of the second resin layer is 0.01-1 mu m.
14. The transfer-type photosensitive film according to claim 1 or 2, which is used for forming a cured film on a substrate having an ITO electrode pattern and an index matching layer.
15. A method for forming a cured film pattern, comprising:
a step of laminating the first resin layer of the transfer photosensitive film according to any one of claims 1 to 6 on a substrate having an electrode pattern so that the side of the substrate on which the electrode pattern is provided is in close contact with the first resin layer, and
and a step of exposing a predetermined portion of the first resin layer on the substrate, and removing a portion other than the predetermined portion to form a cured film pattern covering a part or the whole of the electrode pattern.
16. A method for forming a cured film pattern, comprising:
a step of laminating the second resin layer and the first resin layer of the transfer photosensitive film according to any one of claims 7 to 13 on a substrate having an electrode pattern so that the side of the substrate on which the electrode pattern is provided is in close contact with the second resin layer, and
And a step of exposing predetermined portions of the second resin layer and the first resin layer on the substrate, and removing portions other than the predetermined portions to form a cured film pattern covering a part or the whole of the electrode pattern.
17. A cured film formed by curing the first resin layer in the transfer-type photosensitive film according to any one of claims 1 to 6.
18. A cured film formed by curing the first resin layer alone or both of the first resin layer and the second resin layer in the transfer photosensitive film according to any one of claims 7 to 13.
19. A laminate, comprising: a substrate having an electrode pattern and the cured film of claim 17 or 18 disposed on the electrode pattern, wherein,
the cured film has a height difference on the side opposite to the electrode pattern,
the height difference is below 120 nm.
20. A touch panel having a cured film pattern formed of the cured film of the first resin layer in the transfer-type photosensitive film according to any one of claims 1 to 6, or the cured film of the second resin layer and the cured film of the first resin layer in the transfer-type photosensitive film according to any one of claims 7 to 13.
21. The touch panel according to claim 20, wherein,
the touch panel includes a transparent substrate provided with a transparent electrode pattern,
the cured film pattern is formed across a portion on the transparent substrate where the transparent electrode pattern is formed and a portion where the transparent electrode pattern is not formed.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2017/012679 WO2018179095A1 (en) | 2017-03-28 | 2017-03-28 | Transfer-type photosensitive film, method for forming cured film pattern, cured film and touch panel |
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| Publication Number | Publication Date |
|---|---|
| CN110462560A CN110462560A (en) | 2019-11-15 |
| CN110462560B true CN110462560B (en) | 2023-07-28 |
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| CN201780089046.7A Active CN110462560B (en) | 2017-03-28 | 2017-03-28 | Transfer photosensitive film |
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| JP (3) | JP7210091B2 (en) |
| CN (1) | CN110462560B (en) |
| TW (1) | TWI776873B (en) |
| WO (1) | WO2018179095A1 (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1580953A (en) * | 2003-08-15 | 2005-02-16 | 富士胶片株式会社 | Light-sensitive transfer sheet, light-sensitive layers, picture pattern forming method and layout pattern forming method |
| CN1641481A (en) * | 2004-01-14 | 2005-07-20 | 富士胶片株式会社 | Light-sensitive transfer sheet, light-sensitive layers, method for forming image pattern and method for distribution pattern |
| JP2008274003A (en) * | 2007-04-25 | 2008-11-13 | Hitachi Chem Co Ltd | Phosphorus-containing compound, resin composition containing the same, photosensitive film by using resin composition, method for forming resist pattern and printed wiring board |
| JP2009175730A (en) * | 2007-12-28 | 2009-08-06 | Fujifilm Corp | Photosensitive resin composition, photo spacer, forming method for it, protective film, coloring pattern, substrate for display device and display device |
| JP2010139993A (en) * | 2008-12-15 | 2010-06-24 | Hitachi Chem Co Ltd | Photosensitive resin composition and photosensitive element |
| CN102272887A (en) * | 2009-01-08 | 2011-12-07 | 株式会社普利司通 | Photocurable transfer sheet, and method for forming uneven pattern using same |
| CN102341753A (en) * | 2009-03-13 | 2012-02-01 | 日立化成工业株式会社 | Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same |
| CN102687067A (en) * | 2009-09-29 | 2012-09-19 | 富士胶片株式会社 | Photosensitive resin composition for photospacer, photosensitive resin transfer material, photospacer and process for production thereof, substrate for liquid crystal display device, and liquid crystal display device |
| JP2013064973A (en) * | 2011-08-26 | 2013-04-11 | Toppan Printing Co Ltd | Photosensitive resin composition, material for touch panel, touch panel protective film, touch panel insulating film, and touch panel |
| JP5304973B1 (en) * | 2011-12-05 | 2013-10-02 | 日立化成株式会社 | Method for forming protective film of electrode for touch panel, photosensitive resin composition and photosensitive element, and method for manufacturing touch panel |
| WO2015030151A1 (en) * | 2013-08-30 | 2015-03-05 | Canon Kabushiki Kaisha | Curable composition for photoimprint and method of producing film, optical component, circuit board, or electronic component using the composition |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08240800A (en) * | 1995-03-03 | 1996-09-17 | Asahi Glass Co Ltd | Resin substrate for liqud crystal display |
| TWI251124B (en) * | 2000-12-05 | 2006-03-11 | Nippon Catalytic Chem Ind | Photosensitive resin composition, its use, lactone-ring-containing polymer, and production process thereof |
| JP4078077B2 (en) * | 2002-01-08 | 2008-04-23 | キヤノン株式会社 | Recording element unit and recording apparatus |
| TWI344976B (en) * | 2003-10-27 | 2011-07-11 | Sumitomo Chemical Co | Stained sensitization resin |
| JP4389582B2 (en) * | 2003-12-26 | 2009-12-24 | 住友化学株式会社 | Photosensitive resin composition |
| JP4994136B2 (en) * | 2006-07-26 | 2012-08-08 | 富士フイルム株式会社 | Photosensitive composition, photosensitive resin transfer film, photospacer production method, liquid crystal display substrate, and liquid crystal display device |
| JP5447939B2 (en) * | 2009-07-29 | 2014-03-19 | 日立化成株式会社 | Photosensitive resin composition and photosensitive film |
| JP5641293B2 (en) * | 2010-05-28 | 2014-12-17 | 日立化成株式会社 | Photosensitive resin composition, photosensitive film, permanent resist |
| JP2012078528A (en) * | 2010-09-30 | 2012-04-19 | Fujifilm Corp | Photosensitive composition, photosensitive resin transfer film, resin pattern and production method of resin pattern, substrate for liquid crystal display device, and liquid crystal display device |
| TW201228831A (en) * | 2010-12-22 | 2012-07-16 | Nippon Synthetic Chem Ind | Transfer-printing laminated material |
| JP2012255925A (en) * | 2011-06-09 | 2012-12-27 | Hitachi Chem Co Ltd | Photosensitive resin composition, and photosensitive element and permanent resist using the same |
| JP5821481B2 (en) * | 2011-09-30 | 2015-11-24 | 東レ株式会社 | Negative photosensitive resin composition and protective film and touch panel member using the same |
| WO2013084283A1 (en) * | 2011-12-05 | 2013-06-13 | 日立化成株式会社 | Method for forming protective film for touch panel electrodes, photosensitive resin composition, and photosensitive element |
| JP2013200577A (en) * | 2011-12-05 | 2013-10-03 | Hitachi Chemical Co Ltd | Formation method of cured resin film pattern, photosensitive resin composition, photosensitive element, manufacturing method of touch panel and cured resin film |
| WO2013084282A1 (en) * | 2011-12-05 | 2013-06-13 | 日立化成株式会社 | Method for forming resin cured film pattern, photosensitive resin composition, and photosensitive element |
| KR20130120394A (en) * | 2012-04-25 | 2013-11-04 | 스미또모 가가꾸 가부시키가이샤 | Photosensitive resin composition |
| JP5534282B2 (en) * | 2012-04-27 | 2014-06-25 | 日産化学工業株式会社 | Imprint material |
| JP5922008B2 (en) * | 2012-11-30 | 2016-05-24 | 富士フイルム株式会社 | TRANSFER FILM AND TRANSPARENT LAMINATE, ITS MANUFACTURING METHOD, CAPACITANCE TYPE INPUT DEVICE, AND IMAGE DISPLAY DEVICE |
| JP6400289B2 (en) * | 2013-12-24 | 2018-10-03 | 日立化成株式会社 | Base material for touch panel with cured film and method for producing the same, photosensitive element and touch panel |
| JP5729495B2 (en) * | 2014-01-24 | 2015-06-03 | 日立化成株式会社 | Photosensitive element, solder resist and printed wiring board using photosensitive resin composition |
| CN105934478B (en) * | 2014-01-29 | 2020-01-14 | 日立化成株式会社 | Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element |
| JP6233143B2 (en) * | 2014-03-31 | 2017-11-22 | 東洋インキＳｃホールディングス株式会社 | Active energy ray curable ink and printed matter |
| JP6284913B2 (en) * | 2014-08-29 | 2018-02-28 | 富士フイルム株式会社 | Composition for forming touch panel electrode protective film, transfer film, laminate, protective film for touch panel electrode and method for forming the same, capacitive input device, and image display device |
| JP6415217B2 (en) * | 2014-09-26 | 2018-10-31 | 東京応化工業株式会社 | Structure with planarization layer |
| KR101685520B1 (en) * | 2014-12-10 | 2016-12-12 | 고오 가가쿠고교 가부시키가이샤 | Liquid solder resist composition and covered-printed wiring board |
| JP6767090B2 (en) * | 2015-01-28 | 2020-10-14 | 互応化学工業株式会社 | Photosensitive resin composition, printed wiring board, dry film with support, and multilayer printed wiring board |
| KR102493938B1 (en) * | 2015-01-28 | 2023-01-30 | 고오 가가쿠고교 가부시키가이샤 | Method for producing carboxyl group-containing resin, photosensitive resin composition, dry film, printed wiring board, and carboxyl group-containing resin |
| WO2016181422A1 (en) * | 2015-05-11 | 2016-11-17 | 日立化成株式会社 | Transfer-type photosensitive refractive index adjustment film, method for forming refractive index adjustment pattern, and electronic component |
-
2017
- 2017-03-28 WO PCT/JP2017/012679 patent/WO2018179095A1/en active Application Filing
- 2017-03-28 JP JP2019508390A patent/JP7210091B2/en active Active
- 2017-03-28 CN CN201780089046.7A patent/CN110462560B/en active Active
-
2018
- 2018-03-28 TW TW107110631A patent/TWI776873B/en active
-
2022
- 2022-06-01 JP JP2022089813A patent/JP2022121441A/en active Pending
-
2024
- 2024-07-01 JP JP2024106406A patent/JP2024133548A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1580953A (en) * | 2003-08-15 | 2005-02-16 | 富士胶片株式会社 | Light-sensitive transfer sheet, light-sensitive layers, picture pattern forming method and layout pattern forming method |
| CN1641481A (en) * | 2004-01-14 | 2005-07-20 | 富士胶片株式会社 | Light-sensitive transfer sheet, light-sensitive layers, method for forming image pattern and method for distribution pattern |
| JP2008274003A (en) * | 2007-04-25 | 2008-11-13 | Hitachi Chem Co Ltd | Phosphorus-containing compound, resin composition containing the same, photosensitive film by using resin composition, method for forming resist pattern and printed wiring board |
| JP2009175730A (en) * | 2007-12-28 | 2009-08-06 | Fujifilm Corp | Photosensitive resin composition, photo spacer, forming method for it, protective film, coloring pattern, substrate for display device and display device |
| JP2010139993A (en) * | 2008-12-15 | 2010-06-24 | Hitachi Chem Co Ltd | Photosensitive resin composition and photosensitive element |
| CN102272887A (en) * | 2009-01-08 | 2011-12-07 | 株式会社普利司通 | Photocurable transfer sheet, and method for forming uneven pattern using same |
| CN102341753A (en) * | 2009-03-13 | 2012-02-01 | 日立化成工业株式会社 | Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same |
| CN102687067A (en) * | 2009-09-29 | 2012-09-19 | 富士胶片株式会社 | Photosensitive resin composition for photospacer, photosensitive resin transfer material, photospacer and process for production thereof, substrate for liquid crystal display device, and liquid crystal display device |
| JP2013064973A (en) * | 2011-08-26 | 2013-04-11 | Toppan Printing Co Ltd | Photosensitive resin composition, material for touch panel, touch panel protective film, touch panel insulating film, and touch panel |
| JP5304973B1 (en) * | 2011-12-05 | 2013-10-02 | 日立化成株式会社 | Method for forming protective film of electrode for touch panel, photosensitive resin composition and photosensitive element, and method for manufacturing touch panel |
| WO2015030151A1 (en) * | 2013-08-30 | 2015-03-05 | Canon Kabushiki Kaisha | Curable composition for photoimprint and method of producing film, optical component, circuit board, or electronic component using the composition |
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| JP2022121441A (en) | 2022-08-19 |
| CN110462560A (en) | 2019-11-15 |
| TWI776873B (en) | 2022-09-11 |
| WO2018179095A1 (en) | 2018-10-04 |
| JPWO2018179095A1 (en) | 2020-01-30 |
| JP2024133548A (en) | 2024-10-02 |
| JP7210091B2 (en) | 2023-01-23 |
| TW201902955A (en) | 2019-01-16 |
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