JP2019219631A - Transfer film, cured film and method for forming the same, and electronic component - Google Patents

Abstract

To provide a transfer film that can give a cured film in which a resin layer containing metal oxide particles less likely induces cracks.SOLUTION: The transfer film includes a support film and a laminate disposed on the support film. The laminate includes a first resin layer disposed on the support film and a second resin layer disposed on the first resin layer, in which the first resin layer is a photosensitive resin composition layer and the second resin layer contains metal oxide particles by 75 mass% or less based on the whole mass of the second resin layer. An indentation elastic modulus of the second resin layer is 500 GPa or less measured after the laminate is subjected to the following treatment: the laminate as released from the support film is irradiated with UV rays having an exposure light quantity of 3.5×10J/mon a side of the first resin layer opposite to the second resin layer and then heated at 140°C for 30 minutes.SELECTED DRAWING: None

Description

  The present invention relates to a transfer film, a cured film, a method for forming the same, and an electronic component.

  Large electronic devices such as personal computers and televisions, small electronic devices such as car navigation systems, mobile phones, smartphones, and electronic dictionaries, display devices such as OA (Office Automation) and FA (Factory Automation) devices, etc. A liquid crystal display element and a touch panel (touch sensor) are used.

  Various types of touch panels have been adopted, and in recent years, use of a projected capacitive touch panel has been advanced. Generally, in a projected capacitive touch panel, a plurality of X electrodes and a plurality of Y electrodes orthogonal to the X electrodes have a two-layer structure in order to express two-dimensional coordinates by the X axis and the Y axis. Has formed.

  The projection-type capacitive touch panel has a problem of a so-called "bone appearance phenomenon" in which an electrode pattern is reflected on a screen in a sensing area.

  In order to suppress the bone appearance phenomenon, a first curable transparent resin layer having a low refractive index adjusted to a specific refractive index range and a second curable transparent resin having a high refractive index containing metal oxide particles. A method of forming a cured film on a touch panel using a transfer film having a resin layer adjacent thereto is disclosed (see Patent Document 1 below).

WO 2015/125853 pamphlet

  By the way, in recent years, a display that can be bent or bent has become widespread, and a touch panel provided with electrodes on a flexible base material may be used. When a cured film is formed on such a touch panel by using the above-described conventional transfer film, a crack (crack) occurs in the cured film (particularly, a resin layer containing metal oxide particles) when the cured film is laminated or when the touch panel is used. May occur. When such cracks occur, problems such as a decrease in the adhesion between the touch panel as the base material and the cured film occur, and thus it is required to suppress the occurrence of cracks.

  Therefore, the present invention provides a transfer film capable of obtaining a cured film in which cracks are less likely to occur in a resin layer containing metal oxide particles, a cured film obtained using the transfer film, a method for forming the same, and a cured film. It is intended to provide an electronic component provided with the electronic component.

One aspect of the present invention relates to a transfer film including a support film and a laminate provided on the support film. In this transfer film, the laminate includes a first resin layer provided on the support film, and a second resin layer provided on the first resin layer, wherein the first resin layer is A photosensitive resin composition layer, wherein the second resin layer contains 75% by mass or less of metal oxide particles based on the total mass of the second resin layer, The laminate is irradiated with ultraviolet light at an exposure of 3.5 × 10 ² J / m ² from the side opposite to the second resin layer of the one resin layer, and heated at 140 ° C. for 30 minutes. The indentation elastic modulus of the second resin layer is 500 GPa or less.

  According to the transfer film, a cured film in which cracks are less likely to occur in the resin layer containing metal oxide particles can be obtained.

  The second resin layer may include a binder polymer having a glass transition temperature of 70 ° C. or less.

  The second resin layer may include a polymerizable compound having an ethylenically unsaturated group and having a ratio of the molecular weight to the number of ethylenically unsaturated groups of 100 or more.

［一般式（１）中、複数のＲは、それぞれ独立に水素原子又はメチル基を示し、Ｘは、炭素数１０〜２０のｐ価の有機基を示し、ｐは２〜４の整数を示す。］ The second resin layer may include a polymerizable compound represented by the following general formula (1).

[In the general formula (1), a plurality of Rs each independently represent a hydrogen atom or a methyl group, X represents a p-valent organic group having 10 to 20 carbon atoms, and p represents an integer of 2 to 4. . ]

  The content of the polymerizable compound in the second resin layer may be not more than 60% by mass based on the total mass of the organic components in the second resin layer.

  The metal oxide particles may include at least one selected from the group consisting of zirconium oxide, titanium oxide, tin oxide, zinc oxide, indium tin oxide, indium oxide, aluminum oxide, silicon oxide, and yttrium oxide.

  The first resin layer may contain a binder polymer, a photopolymerizable compound, and a photopolymerization initiator.

  The ratio of the thickness of the second resin layer to the thickness of the first resin layer may be 0.003 or more.

  One aspect of the present invention is a step of laminating a laminate of the above-described transfer film on a substrate so that the second resin layer is in close contact with the substrate, and exposing a predetermined portion of the laminate on the substrate. The present invention relates to a method for forming a cured film, comprising: a step of removing a portion other than a predetermined exposed portion to form a patterned cured film. According to this method, a cured film in which cracks are less likely to occur in the resin layer containing the metal oxide particles can be obtained.

  One aspect of the present invention relates to a cured film formed by curing a first resin layer and a second resin layer of the laminate in the transfer film. In this cured film, cracks are less likely to occur in the resin layer containing the metal oxide particles (the cured product of the second resin layer).

  One aspect of the present invention relates to an electronic component including the cured film.

  According to the present invention, a transfer film capable of obtaining a cured film in which cracks are less likely to occur in the resin layer containing metal oxide particles, a cured film obtained using the transfer film, a method for forming the same, and the cured film Provided electronic components can be provided.

FIG. 1 is a schematic sectional view illustrating a transfer film according to an embodiment of the present invention. 1 is a schematic cross-sectional view illustrating a transparent laminate including a cured film pattern formed using a transfer film according to one embodiment of the present invention on a substrate with a transparent electrode pattern. 1 is a schematic plan view illustrating an electronic component according to an embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described in detail. However, the present invention is not limited to the following embodiments. In this specification, “(meth) acrylic acid” means acrylic acid or methacrylic acid, and “(meth) acrylate” means acrylate or methacrylate corresponding thereto. “A or B” may include one of A and B, and may include both.

  Further, in this specification, the term "step" is used not only for an independent step but also for the case where the intended action of the step is achieved even if it cannot be clearly distinguished from other steps. included. Further, a numerical range indicated by using “to” indicates a range including numerical values described before and after “to” as a minimum value and a maximum value, respectively. The upper limit and the lower limit individually described as a numerical range can be arbitrarily combined. Further, in the present specification, the content of each component in the composition, if there are a plurality of substances corresponding to each component in the composition, unless otherwise specified, the total of the plurality of substances present in the composition Means quantity. The exemplified materials may be used alone or in combination of two or more unless otherwise specified. The “structural unit derived from A and B” means “a structural unit derived from A and a structural unit derived from B”. In this specification, “thickness” means the length of each layer in the stacking direction. Further, in this specification, the exposure amount is a measured value at the i-line (wavelength 365 nm).

<Transfer film>
FIG. 1 is a schematic cross-sectional view showing a transfer film of one embodiment. The transfer film (transfer film with a protective film) 1 shown in FIG. 1 includes a support film 10, a first resin layer 20 provided on the support film 10, and a transfer film provided on the first resin layer 20. And a laminate 40 including the obtained second resin layer 30. In this transfer film 1, the first resin layer 20 is a photosensitive resin composition layer, and the second resin layer 30 is a metal resin of 75% by mass or less based on the total mass of the second resin layer 30. Including oxide particles. In addition, the transfer film 1 may include the protective film 15 provided on the second resin layer 30 on the side opposite to the first resin layer 20 as illustrated in FIG. 1, and includes the protective film 15. It is not necessary.

The second resin layer may be photo-curable. In this case, the indentation elasticity of the second resin layer after photo-curing (for example, the second resin layer after being cured to a curing reaction rate of 70% or more) is 500 GPa or less. The light-curable second resin layer is usually exposed to the light-emitting device at a dose of 3.5 × 10 ² J / m ² from the opposite side of the first resin layer from the second resin layer in a state where the support film is peeled off. By irradiating the laminated body with ultraviolet rays, the laminate can be sufficiently cured. That is, in one embodiment, the support film is peeled and removed, and the laminate is irradiated with ultraviolet light at an exposure of 3.5 × 10 ² J / m ² from the opposite side of the first resin layer from the second resin layer. Is applied, the indentation elastic modulus of the second resin layer is 500 GPa or less. Note that the photocurable second resin layer does not necessarily need to contain a photopolymerizable component such as a photopolymerizable compound and a photopolymerization initiator, and the light transferred from an adjacent resin layer (for example, the first resin layer). It may be a layer that is photocured due to a polymerization component.

  The second resin layer may be thermosetting. In this case, the indentation elasticity of the second resin layer after the thermosetting (for example, the second resin layer after being cured to a curing reaction rate of 70% or more) is 500 GPa or less. In general, the thermosetting second resin layer can be sufficiently cured by heating the laminate at 140 ° C. for 30 minutes in a state where the support film is peeled off. That is, in one embodiment, the indentation elastic modulus of the second resin layer after peeling and removing the support film and heating the laminate at 140 ° C. for 30 minutes is 500 GPa or less.

As described above, regardless of whether the second resin layer is curable (photocurable or thermosetting), the second resin layer in the first resin layer is separated from the second resin layer in a state where the support film is peeled off. Is obtained by irradiating the laminated body with ultraviolet light from the opposite side at an exposure of 3.5 × 10 ² J / m ² and heating the laminate at 140 ° C. for 30 minutes. The indentation elastic modulus of the second resin layer is 500 GPa or less. Should be fine.

  According to the transfer film of the embodiment having the above configuration, the resin layer containing the metal oxide particles (the second resin layer and the second resin layer are curable when the second resin layer is not curable). In this case, it is possible to obtain a cured film in which cracks in the cured second resin layer are less likely to occur.

  The indentation elastic modulus is preferably 450 GPa or less, more preferably 300 GPa or less, from the viewpoint of suppressing the occurrence of cracks. The indentation elastic modulus may be 100 GPa or more or 150 GPa or more from the viewpoint of maintaining the shape of the resin layer.

The indentation elastic modulus is obtained by, for example, using a Fischer scope H100CS (manufactured by FISCHER) from the side of the second resin layer opposite to the first resin layer after curing the laminate. Specifically, after the support film of the transfer film is peeled off and removed, ultraviolet rays are irradiated from the opposite side of the first resin layer from the second resin layer at an exposure amount of 3.5 × 10 ² J / m ^2. I do. After laminating this on the SiO ₂ sputtered glass so that the first resin layer is in contact with the SiO ₂ sputtered glass, it is allowed to stand still in a box dryer heated to 140 ° C. for 30 minutes. The laminate is cured as described above, and the indentation elastic modulus of the second resin layer in the obtained cured laminate is measured. The indentation elastic modulus is measured under the conditions of an indentation depth of 0.1 μm and a load of 3 mN.

  The indentation elastic modulus can be adjusted by, for example, the type and amount of the resin, metal oxide particles, and the like contained in the second resin layer.

  In the transfer film, since the second resin layer contains metal oxide particles, in the transfer film, the refractive index of the second resin layer at a wavelength of 633 nm is improved. Therefore, according to the transfer film, a cured film having better transparency can be obtained. Therefore, by using the transfer film, for example, a cured film that satisfies both functions of protecting a transparent electrode or a metal wiring in a frame area in a touch panel and suppressing visualization of a transparent electrode pattern or improving visibility of a sensing area is collectively provided. Can be formed.

  Next, the support film, the first resin layer, and the second resin layer that constitute the transfer film of the embodiment will be described in detail.

(Support film)
As the support film, for example, a polymer film can be used. Examples of the polymer film include films of polyethylene terephthalate, polycarbonate, polyethylene, polypropylene, polyether sulfone, cycloolefin polymer, and the like.

  The thickness of the support film is preferably 5 μm or more, more preferably 10 μm or more, and even more preferably 15 μm or more, from the viewpoint of excellent mechanical strength. The thickness of the support film is preferably 100 μm or less, more preferably 70 μm or less, still more preferably 40 μm or less, and particularly preferably 35 μm or less, from the viewpoint of suppressing a decrease in resolution when irradiating active light through the support film 10. preferable.

(First resin layer)
The resin composition that forms the first resin layer (hereinafter, also referred to as “first resin composition”) is a photosensitive resin composition (photosensitive resin composition). The “first resin composition” refers to a composition not containing a solvent described below. In the following description, the phrase "the first resin layer contains-" may be rephrased as "the first resin composition contains-".

  The first resin layer preferably includes a binder polymer (hereinafter, also referred to as “component (A1)”), a photopolymerizable compound (hereinafter, also referred to as “component (B1)”), and a photopolymerization initiator (hereinafter, referred to as “component (B1)”). , "(C1) component").

[(A1) component: binder polymer]
As the component (A1), a binder polymer having a carboxyl group is preferably used from the viewpoint of enabling patterning by alkali development.

  As the component (A1), a copolymer having a structural unit derived from (meth) acrylic acid and a structural unit derived from (meth) acrylic acid alkyl ester is preferable. The above-mentioned copolymer may contain in the structural unit another monomer copolymerizable with the above (meth) acrylic acid or the alkyl (meth) acrylate. Specific examples include glycidyl (meth) acrylate, benzyl (meth) acrylate, and styrene.

  The component (A1) may have an ethylenically unsaturated group. The component (A1) having an ethylenically unsaturated group is not included in the component (B1) in this specification.

  Examples of the alkyl (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, cyclohexyl (meth) acrylate, and 2-ethylhexyl (meth) acrylate; And hydroxylethyl (meth) acrylate.

  The component (A1) includes (meth) acrylic acid, glycidyl (meth) acrylate, benzyl (meth) acrylate, from the viewpoints of alkali developability (particularly alkali developability with an aqueous inorganic alkali solution), patterning properties, and transparency. Derived from at least one compound selected from the group consisting of styrene, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, cyclohexyl (meth) acrylate and 2-ethylhexyl (meth) acrylate It is preferable to include a binder polymer having the following structural unit.

  The weight average molecular weight of the component (A1) is preferably 10,000 or more, more preferably 15,000 or more, still more preferably 20,000 or more, and particularly preferably 25,000 or more, from the viewpoint of resolution. From the viewpoint of resolution, the weight average molecular weight of the component (A) is preferably 100,000 or less, more preferably 85,000 or less, still more preferably 70,000 or less, particularly preferably 55,000 or less, and particularly preferably 40,000 or less. Is very preferred. The weight average molecular weight can be measured by gel permeation chromatography with reference to the examples of the present specification.

  The acid value of the component (A1) is preferably 75 mgKOH / g or more from the viewpoint of easily forming a cured film having a desired shape by alkali development. The acid value of the component (A1) is preferably 200 mgKOH / g or less, more preferably 170 mgKOH / g or less, and 140 mgKOH / g or less, from the viewpoint of achieving both easy control of the cured film shape and rust prevention of the cured film. Is more preferred. The acid value can be measured with reference to the examples of the present specification.

  The content of the component (A1) is preferably 35 parts by mass or more based on 100 parts by mass of the total amount of the components (A1) and (B1), from the viewpoint of maintaining the pattern forming property and the rust prevention of the cured film. It is more preferably at least 40 parts by mass, further preferably at least 50 parts by mass, particularly preferably at least 55 parts by mass. The content of the component (A1) is preferably 85 parts by mass or less, and more preferably 80 parts by mass or less based on 100 parts by mass of the total of the components (A1) and (B1) from the viewpoint of excellent coatability of the resin composition. Is more preferably 70 parts by mass or less, particularly preferably 65 parts by mass or less.

[(B1) component: photopolymerizable compound]
As the component (B1), a photopolymerizable compound having an ethylenically unsaturated group can be used. Examples of the photopolymerizable compound having an ethylenically unsaturated group include a monofunctional vinyl monomer, a bifunctional vinyl monomer, and a polyfunctional vinyl monomer having at least three polymerizable ethylenically unsaturated groups.

  Examples of the monofunctional vinyl monomer include those exemplified as monomers used in the synthesis of a copolymer which is a preferred example of the component (A1).

  Examples of the bifunctional vinyl monomer include polyethylene glycol di (meth) acrylate, trimethylolpropane di (meth) acrylate, polypropylene glycol di (meth) acrylate, 2,2-bis (4- (meth) acryloxypolyethoxypolypropoxy). Phenyl) propane, bisphenol A diglycidyl ether di (meth) acrylate, tricyclodecane dimethanol di (meth) acrylate, and the like.

  As the above-mentioned polyfunctional vinyl monomer having at least three polymerizable ethylenically unsaturated groups, a conventionally known polyfunctional vinyl monomer can be used without any particular limitation. From the viewpoints of corrosion prevention and developability of the metal wiring or the transparent electrode, the polyfunctional vinyl monomer may be a (meth) acrylate compound having a skeleton derived from trimethylolpropane such as trimethylolpropane tri (meth) acrylate; tetramethylolmethane (Meth) acrylate compounds having a skeleton derived from tetramethylolmethane such as tri (meth) acrylate and tetramethylolmethanetetra (meth) acrylate; derived from pentaerythritol such as pentaerythritol tri (meth) acrylate and pentaerythritol tetra (meth) acrylate (Meth) acrylate compounds having a skeleton of; dipentaerythritol penta (meth) acrylate, bone derived from dipentaerythritol such as dipentaerythritol hexa (meth) acrylate (Meth) acrylate compounds having a skeleton derived from ditrimethylolpropane such as ditrimethylolpropanetetra (meth) acrylate; (meth) acrylate compounds having a skeleton derived from diglycerin; or derived from cyanuric acid It is preferable to use a (meth) acrylate compound having a skeleton.

［一般式（１）中、複数のＲは、それぞれ独立に水素原子又はメチル基を示し、Ｘは、炭素数１０〜２０のｐ価の有機基を示し、ｐは２〜４の整数を示す。］ The component (B1) preferably contains a compound represented by the following general formula (1).

[In the general formula (1), a plurality of Rs each independently represent a hydrogen atom or a methyl group, X represents a p-valent organic group having 10 to 20 carbon atoms, and p represents an integer of 2 to 4. . ]

  The component (B1) preferably contains a di (meth) acrylate compound having a dicyclopentanyl structure or a dicyclopentenyl structure from the viewpoint of inhibiting corrosion of the metal wiring and the transparent electrode, and preferably has a dicyclopentanyl structure. It is more preferable to include a (meth) acrylate compound. For example, a compound in which X in the general formula (1) has a dicyclopentanyl structure or a dicyclopentenyl structure and p is 2 is preferably used. Among them, a compound represented by the following general formula (1B) is more preferable as a di (meth) acrylate compound having a dicyclopentanyl structure or a dicyclopentenyl structure from the viewpoint of suppressing corrosion of a metal wiring and a transparent electrode.

［一般式（１Ｂ）中、Ｒ^１及びＲ^２は、それぞれ独立に水素原子又はメチル基を示し、Ｙは、ジシクロペンタニル構造又はジシクロペンテニル構造を有する２価の基を示し、Ｒ^３及びＲ^４は、それぞれ独立に炭素数１〜４のアルキレン基を示し、ｎ及びｍは、それぞれ独立に０〜２の整数を示し、ｑ及びｒはそれぞれ独立に０以上の整数を示し、ｑ＋ｒ＝０〜１０となるように選択される。］

[In the general formula (1B), R ¹ and R ² each independently represent a hydrogen atom or a methyl group, Y represents a divalent group having a dicyclopentanyl structure or a dicyclopentenyl structure, and R ³ And R ⁴ each independently represent an alkylene group having 1 to 4 carbon atoms, n and m each independently represent an integer of 0 to 2, q and r each independently represent an integer of 0 or more, and q + r = 0 to 10. ]

In the general formula (1B), R ³ and R ⁴ are each independently preferably an ethylene group or a propylene group, and more preferably an ethylene group. Further, the propylene group may be any of an n-isopropylene group and an isopropylene group.

In the above general formula (1B), n and m indicate how much a methylene group is added in the molecule. q and r indicate how much an alkoxy group having 1 to 4 carbon atoms is added in the molecule. When q + r is 2 or more, two or more R ³ and R ⁴ may be the same or different.

  In the compound represented by the general formula (1B), the divalent group having a dicyclopentanyl structure or a dicyclopentenyl structure contained in Y has a bulky structure, thereby realizing low moisture permeability of the film. However, it is considered that the corrosion inhibition of the metal wiring and the transparent electrode is improved.

  The dicyclopentanyl structure and the dicyclopentenyl structure can also be referred to as a tricyclodecane skeleton and a tricyclodecene skeleton, respectively. The “tricyclodecane skeleton” and “tricyclodecene skeleton” refer to the following structures, respectively (the bond is an arbitrary position).

  Examples of the compound represented by the general formula (1B) include tricyclodecane dimethanol diacrylate represented by the following formula (2). This is available as A-DCP (product name, manufactured by Shin-Nakamura Chemical Co., Ltd.).

［上記一般式（１Ｂ）において、Ｙがジシクロペンタニル構造を有する２価の基、ｍ＝ｎ＝１、ｑ＝ｒ＝０である化合物］

[In the above formula (1B), Y is a divalent group having a dicyclopentanyl structure, a compound in which m = n = 1 and q = r = 0]

  The content of the di (meth) acrylate compound having a dicyclopentanyl structure or a dicyclopentenyl structure is 50 parts by mass based on 100 parts by mass of the total amount of the component (B1) from the viewpoint of suppressing corrosion of the metal wiring and the transparent electrode. It is preferably at least 70 parts by mass, more preferably at least 70 parts by mass, even more preferably at least 80 parts by mass. The content of the di (meth) acrylate compound having a dicyclopentanyl structure or a dicyclopentenyl structure may be 100 parts by mass based on 100 parts by mass of the total amount of the component (B1).

  When a monomer having at least three polymerizable ethylenically unsaturated groups in the molecule and a monofunctional vinyl monomer or a bifunctional vinyl monomer are used in combination, the ratio of use is not particularly limited, but the photocurability and electrode corrosion are not limited. From the viewpoint of preventing the occurrence of, the proportion of the monomer having at least three polymerizable ethylenically unsaturated groups in the molecule is 30% of the total amount of 100 parts by mass of the photopolymerizable compound contained in the first resin composition. It may be at least 50 parts by mass, or at least 75 parts by mass.

[(C1) component: photopolymerization initiator]
As the component (C1), any conventionally known photopolymerization initiator can be used without any particular limitation, but a photopolymerization initiator having high transparency is preferable. From the viewpoint of forming a cured film pattern with sufficient resolution even on a base material even if the thickness is 10 μm or less, the component (C1) is at least one selected from the group consisting of an oxime ester compound and a phosphine oxide compound. And more preferably an oxime ester compound.

  Examples of the phosphine oxide compound include 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide.

  The oxime ester compound is preferably at least one selected from the group consisting of a compound represented by the following formula (3), a compound represented by the following formula (4), and a compound represented by the following formula (5). Used.

In the formula (3), R ¹¹ and R ¹² each independently represent an alkyl group having 1 to 12 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, a phenyl group or a tolyl group. An alkyl group having 1 to 8 carbon atoms, a cycloalkyl group having 4 to 6 carbon atoms, a phenyl group or a tolyl group is preferable, and an alkyl group having 1 to 4 carbon atoms, a cycloalkyl group having 4 to 6 carbon atoms, a phenyl group or a tolyl group is preferred. Groups are more preferred, and methyl, cyclopentyl, phenyl or tolyl groups are even more preferred. R ¹³ _{represents -H, -OH, -COOH, -O (} CH 2) OH, -O (CH 2) 2 OH, -COO (CH 2) OH or -COO _{(CH 2)} a 2 OH. _{-H, -O (CH 2) OH} , -O (CH 2) 2 OH, -COO (CH 2) OH, or -COO _{(CH 2)} is preferably _{2 OH, -H, -O (CH} 2) 2 OH, or -COO _{(CH 2) 2} OH it is more preferred.

In the formula (4), R ¹⁴ represents an alkyl group having 1 to 6 carbon atoms, and is preferably a propyl group. A plurality of R ¹⁴ may be the same or different. R ¹⁵ represents NO ₂ or ArCO (where Ar represents a substituted or unsubstituted aryl group), and Ar is preferably a tolyl group. When it has a substituent, examples of the substituent include an alkyl group having 1 to 6 carbon atoms. R ¹⁶ and R ¹⁷ each independently represent an alkyl group having 1 to 12 carbon atoms, a phenyl group, or a tolyl group, and a methyl group, a phenyl group, or a tolyl group is preferable.

In the formula (5), R ¹⁸ represents an alkyl group having 1 to 6 carbon atoms, and is preferably an ethyl group. R ¹⁹ is an organic group having an acetal bond, and a substituent corresponding to R ¹⁹ in a compound represented by the following formula (5-1) is preferable. R ²⁰ and R ²¹ each independently represent an alkyl group having 1 to 12 carbon atoms, a phenyl group or a tolyl group, preferably a methyl group, a phenyl group or a tolyl group, and more preferably a methyl group. R ²² represents an alkyl group having 1 to 6 carbon atoms. n shows the integer of 0-4.

  Examples of the compound represented by the above formula (3) include a compound represented by the following formula (3-1) and a compound represented by the following formula (3-2). The compound represented by the following formula (3-1) is available as IRGACURE OXE01 (product name, manufactured by BASF Japan Ltd.).

  Examples of the compound represented by the above formula (4) include a compound represented by the following formula (4-1). The compound represented by the following formula (4-1) is available as DFI-091 (manufactured by Daito Chemmix, Inc., product name).

  Examples of the compound represented by the above formula (5) include a compound represented by the following formula (5-1). The compound represented by the following formula (5-1) is available as ADEKA OPTOMER N-1919 (manufactured by ADEKA Corporation, product name).

  As other oxime ester compounds, it is preferable to use a compound represented by the following formula (6), a compound represented by the following formula (7), or the like.

  Among the above, the compound represented by the formula (3-1) is extremely preferable. In addition, whether the compound represented by the above formula (3-1) is contained in the cured film can be confirmed by pyrolysis gas chromatography / mass spectrometry of the cured film described in WO 2013/084845.

  The content of the component (C1) is preferably at least 0.1 part by mass, more preferably at least 1 part by mass, based on 100 parts by mass of the total of the components (A1) and (B1) from the viewpoint of excellent photosensitivity and resolution. More preferred. The content of the component (C1) is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, based on 100 parts by mass of the total of the components (A1) and (B1) from the viewpoint of excellent photosensitivity and resolution. Is more preferably 3 parts by mass or less, particularly preferably 2 parts by mass or less.

[Additive]
The first resin layer, from the viewpoint of further improving the rust resistance of the cured film, a triazole compound having a mercapto group, a tetrazole compound having a mercapto group, a thiadiazole compound having a mercapto group, a triazole compound having an amino group or an amino group It is preferable to further include a tetrazole compound having the following formula (hereinafter, these may be collectively referred to as “component (D1)”). Examples of the triazole compound having a mercapto group include 3-mercapto-triazole (manufactured by Wako Pure Chemical Industries, Ltd., product name: 3MT). Examples of the thiadiazole compound having a mercapto group include 2-amino-5-mercapto-1,3,4-thiadiazole (product name: ATT, manufactured by Wako Pure Chemical Industries, Ltd.).

  Examples of the triazole compound having an amino group include benzotriazole, 1H-benzotriazole-1-acetonitrile, benzotriazole-5-carboxylic acid, 1H-benzotriazole-1-methanol, carboxybenzotriazole, and the like, wherein the amino group is substituted. And 3-mercaptotriazole, 5-mercaptotriazole, and other triazole compounds containing a mercapto group and substituted with an amino group.

  Examples of the tetrazole compound having an amino group include 5-amino-1H-tetrazole, 1-methyl-5-amino-tetrazole, 1-methyl-5-mercapto-1H-tetrazole, 1-carboxymethyl-5-amino-tetrazole And the like. These tetrazole compounds may be water-soluble salts thereof. Specific examples thereof include alkali metal salts of 1-methyl-5-amino-tetrazole such as sodium, potassium and lithium.

  When the first resin composition contains the component (D1), the content is preferably based on 100 parts by mass of the total amount of the components (A1) and (B1) from the viewpoint of further improving the rust prevention of the cured film. , 0.05 parts by mass or more, preferably 0.1 parts by mass or more, more preferably 0.2 parts by mass or more, and particularly preferably 0.3 parts by mass or more. The content of the component (D1) is preferably 5.0 parts by mass or less, more preferably 2.0 parts by mass, based on 100 parts by mass of the total of the components (A1) and (B1) from the viewpoint of excellent transparency of the cured film. Or less, more preferably 1.0 part by mass or less, particularly preferably 0.8 part by mass or less.

  The first resin composition is a phosphoric acid ester having an ethylenically unsaturated group (hereinafter, also referred to as “(E1) component”) from the viewpoint of adhesion to a substrate with an ITO electrode pattern and preventing generation of a development residue. It is preferable to include The phosphoric ester having an ethylenically unsaturated group may overlap with the component (B1), but in this specification, the component (E1) is not included in the component (B1).

  (E1) The phosphoric acid ester having an ethylenically unsaturated group, which is a component, has a high level of adhesion and developability to a substrate with an ITO electrode pattern while ensuring sufficient rust prevention of the formed cured film. From the viewpoint of compatibility, the Phosmer series (Phosmer-M, Phosmer-CL, Phosmer-PE, Phosmer-MH, Phosmer-PP, etc.) manufactured by Unichemical Co., Ltd., or the KAYAMER series (PM21, PM) manufactured by Nippon Kayaku Co., Ltd. -2 etc.) are preferred.

  In the case where the first resin composition contains the component (E1), the content of the component (A1) and the component (B1) are improved from the viewpoint of improving the adhesion to the substrate with the ITO electrode pattern and preventing the generation of development residues. The amount is preferably 0.05 parts by mass or more, more preferably 0.1 parts by mass or more, and even more preferably 0.15 parts by mass or more, based on 100 parts by mass of the total amount of the components. The content of the component (E1) is determined based on the total amount of the component (A1) and the component (B1) of 100 parts by mass, from the viewpoint of improving the adhesion to the substrate with the ITO electrode pattern and preventing the generation of a development residue. It is preferably 5.0 parts by mass or less, more preferably 4.0 parts by mass or less, and still more preferably 3.0 parts by mass or less.

  In the first resin composition, as other additives, if necessary, an adhesion imparting agent such as a silane coupling agent, a rust inhibitor, a leveling agent, a plasticizer, a filler, a defoaming agent, a flame retardant , A stabilizer, an antioxidant, a fragrance, a thermal crosslinking agent, a polymerization inhibitor and the like may be contained in an amount of about 0.01 to 20 parts by mass with respect to 100 parts by mass of the components (A1) and (B1) in total. it can. These can be used alone or in combination of two or more.

  Although the first resin composition may contain metal oxide particles (hereinafter, also referred to as “component (F1)”), the content of the component (F1) in the first resin composition is usually The content is smaller than the content of metal oxide particles in the resin composition forming the second resin layer described later. The content of the component (F1) in the first resin composition may be 10% by mass or less, 5% by mass or less, or 1% by mass or less based on the total mass of the first resin composition, and may be 0% by mass. %.

  The refractive index of the cured first resin layer at a wavelength of 633 nm is usually smaller than the refractive index of the second resin layer described below at a wavelength of 633 nm. The refractive index of the cured first resin layer at a wavelength of 633 nm is, for example, 1.40 or more and 1.49 or less. The refractive index of the first resin layer at a wavelength of 633 nm may be appropriately set so that the refractive index of the cured first resin layer at a wavelength of 633 nm falls within the above range. For example, the refractive index of the first resin layer at a wavelength of 633 nm may be 1.40 to 1.49.

  The thickness of the first resin layer (the thickness after drying) is preferably 15 μm or less, and more preferably 10 μm or less, from the viewpoint of reducing the stress applied to the cured second resin layer when the cured film is bent. Is more preferable, and 8 μm or less is more preferable. The thickness (thickness after drying) of the first resin layer is preferably 2 μm or more, more preferably 3 μm or more, from the viewpoint of sufficiently exerting an effect as a protective film and sufficiently embedding the steps on the surface of the substrate with a transparent electrode pattern. Is more preferred.

(Second resin layer)
The resin composition that forms the second resin layer (hereinafter, also referred to as “second resin composition”) is, for example, a curable (for example, photocurable or thermosetting) resin composition. The “second resin composition” refers to a composition that does not contain a solvent described below. In the following description, the description "the second resin layer contains-" may be paraphrased as "the second resin composition contains-".

  The second resin layer includes, for example, an organic component and metal oxide particles (hereinafter, also referred to as “(F2) component”). The organic component includes, for example, a binder polymer (hereinafter, also referred to as “component (A2)”) and a polymerizable compound (hereinafter, also referred to as “component (B2)”).

[(A2) component: binder polymer]
As the component (A2), the compounds exemplified as the component (A1) (for example, a component having an ethylenically unsaturated group) can be used. The component (A2) having an ethylenically unsaturated group is not included in the component (B2) in this specification.

  Among the compounds exemplified as the component (A1), a binder polymer having a glass transition temperature (Tg) of 70 ° C. or lower (hereinafter, also referred to as “low Tg polymer”) is preferably used from the viewpoint of further suppressing the occurrence of cracks. . The glass transition temperature of the low Tg polymer may be 80 ° C or lower or 70 ° C or lower from the viewpoint of further suppressing the occurrence of cracks, and may be 40 ° C or higher or 50 ° C or higher from the viewpoint of maintaining the shape of the resin layer. May be.

［式（Ａ）中、Ｒ^５は、水素原子又はメチル基を示し、Ｒ^６は、炭素数１〜１２の直鎖状アルキル基を示す。Ｒ^６は、好ましくは、メチル基、エチル基又はブチル基である。］ The component (A2) (for example, a low Tg polymer) preferably has a structural unit derived from an alkyl (meth) acrylate represented by the following general formula (A), and the alkyl (meth) acrylate The content ratio of the structural unit derived from the ester is 60% by mass or more, 70% by mass or more, or 75% by mass or more based on all the structural units.

[In the formula (A), R ⁵ represents a hydrogen atom or a methyl group, and R ⁶ represents a linear alkyl group having 1 to 12 carbon atoms. R ⁶ is preferably a methyl group, an ethyl group or a butyl group. ]

  The component (A2) (for example, a low Tg polymer) preferably does not contain an alicyclic structure and a benzene ring structure. The content ratio of the structural unit having an alicyclic structure and / or a benzene ring structure in the component (A2) (for example, a low Tg polymer) is, for example, 20% by mass or less based on all the structural units constituting the component (A2). , 10% by mass or less or 5% by mass or less.

  The weight average molecular weight of the component (A2) (for example, low Tg polymer) is preferably 100,000 or less, more preferably 85,000 or less, from the viewpoint of lowering the glass transition temperature of the component (A2) and suppressing the occurrence of cracks. It is preferably 70,000 or less, more preferably 55,000 or less, and particularly preferably 40,000 or less. The weight average molecular weight of the component (A2) may be 10,000 or more, 20,000 or more, or 25,000 or more from the viewpoint of maintaining the shape of the resin layer. The weight average molecular weight of the component (A2) can be measured in the same manner as in the measurement of the weight average molecular weight of the component (A1).

  From the viewpoint of improving the alkali developability of the second resin layer, the acid value of the component (A2) is, for example, preferably 80 mgKOH / g or more, more preferably 100 mgKOH / g or more, and even more preferably 120 mgKOH / g or more. The acid value is preferably 200 mgKOH / g or less, more preferably 170 mgKOH / g or less, and even more preferably 140 mgKOH / g, from the viewpoint of achieving both easy control of the cured film shape and rust prevention of the cured film. As a method for improving the acid value of the binder polymer, a method of giving a carboxyl group to a side chain of the binder polymer may be mentioned. The acid value of the component (A2) can be measured in the same manner as the measurement of the acid value of the component (A1).

  The content of the low Tg polymer in the component (A2) is preferably 85% by mass or more, more preferably 90% by mass or more, based on the total mass of the component (A2), from the viewpoint of suppressing the occurrence of cracks more. It is more preferably at least 95% by mass. The content of the low Tg polymer in the component (A2) may be 100% by mass based on the total mass of the component (A2). That is, the component (A2) may be a low Tg polymer.

  The content of the component (A2) in the second resin layer is preferably 35% by mass or more, more preferably 40% by mass or more, and preferably 45% by mass or more, based on the total mass of the organic components in the second resin layer. Is more preferred. The content of the component (A2) in the second resin layer is preferably 80% by mass or less, and more preferably 60% by mass or less, based on the total mass of the organic components in the second resin layer. By setting the content of the component (A2) within the above range, the pattern formability and the rust prevention of the cured film can be improved.

[(B2) component: polymerizable compound]
The component (B2) may be a photopolymerizable compound or a thermopolymerizable compound. As the component (B2), the compounds having an ethylenically unsaturated group exemplified as the component (B1) can be used.

  The component (B2) has an ethylenically unsaturated group from the viewpoint that the flexibility of the second resin layer after curing can be improved and generation of cracks can be further suppressed, and the number of ethylenically unsaturated groups is It is preferable to include a polymerizable compound having a molecular weight ratio of 100 or more (polymerizable compound A). The ratio of the molecular weight to the number of ethylenically unsaturated groups in the polymerizable compound A is more preferably 110 or more, and further preferably 120 or more. The ratio of the molecular weight to the number of ethylenically unsaturated groups in the polymerizable compound A may be 200 or less, 180 or less, or 160 or less from the viewpoint of reliability after curing.

  In the component (B2), the content of the polymerizable compound A is determined based on the total mass of the component (B2) from the viewpoint that the flexibility of the second resin layer after curing can be improved and the generation of cracks can be further suppressed. May be 75% by mass or more, 85% by mass or more, or 95% by mass or more. In the component (B2), the content of the polymerizable compound A may be 100% by mass. That is, the second resin layer may contain only the polymerizable compound A as the component (B2).

  The component (B2) is a compound represented by the above general formula (1) (polymerizable compound B) from the viewpoint that the flexibility of the second resin layer after curing can be improved and the occurrence of cracks can be further suppressed. ) Is preferable. In the present embodiment, the polymerizable compound B and the polymerizable compound A may be the same. That is, the ratio of the molecular weight to the number of ethylenically unsaturated groups in the polymerizable compound B may be 100 or more.

  The component (B2) preferably contains at least one compound selected from the group consisting of a compound having a skeleton derived from ditrimethylolpropane, a compound having a dicyclopentenyl structure, and a compound having a dicyclopentenyl structure, For example, as the polymerizable compound B, X in the general formula (1) is a group having a skeleton derived from ditrimethylolpropane and p is 4, or X in the general formula (1) is It is a group having a cyclopentanyl structure (tricyclodecane skeleton) or a dicyclopentenyl structure (tricyclodecene skeleton), and preferably includes a compound in which p is 2.

  X in the general formula (1) is a group having a skeleton derived from ditrimethylolpropane, and examples of the compound in which p is 4 include ditrimethylolpropanetetraacrylate. X in the general formula (1) is a group having a dicyclopentanyl structure (tricyclodecane skeleton) or a dicyclopentenyl structure (tricyclodecene skeleton), and a compound in which p is 2 includes the compound represented by the general formula ( 1B). Preferred examples of the compound represented by the general formula (1B) are the same as those of the component (B1).

  In the component (B2), the content of the polymerizable compound B is determined based on the total mass of the component (B2), from the viewpoint that the flexibility of the second resin layer after curing can be improved and the occurrence of cracks can be further suppressed. May be 75% by mass or more, 85% by mass or more, or 95% by mass or more. In the component (B2), the content of the polymerizable compound B may be 100% by mass. That is, the second resin layer may contain only the polymerizable compound B as the component (B2).

  The content of the component (B2) in the second resin layer is such that the flexibility of the second resin layer after curing can be improved, and the generation of cracks can be further suppressed. It is preferably at most 60% by mass, more preferably at most 55% by mass, even more preferably at most 50% by mass, particularly preferably at most 47% by mass, based on the total mass of the organic component. preferable. From the viewpoint of reliability after curing, the content of the component (B2) in the second resin layer is preferably 35% by mass or more based on the total mass of the organic components in the second resin layer. It is more preferably at least 40% by mass, further preferably at least 44% by mass. In the present embodiment, the content of the polymerizable compound A may be in the above range, the content of the polymerizable compound B may be in the above range, and the content of the polymerizable compound A and the content of the polymerizable compound B May be in the above range.

[(F2) component: metal oxide particles]
As the component (F2), the refractive index at a wavelength of 633 nm is 1.50 or more from the viewpoint that the refractive index of the second resin layer at a wavelength of 633 nm is easily controlled and more excellent transparency is easily obtained. Metal oxide particles are preferred. The component (F2) may be metal oxide particles or metal oxide fine particles. As the component (F2), one kind of particles can be used alone, or two or more kinds of particles can be used in combination.

  The average particle diameter D50 of the metal oxide particles may be, for example, 5 nm or more, 10 nm or more, or 15 nm or more, and may be 70 nm or less.

  The metal oxide particles are formed of zirconium oxide, titanium oxide, tin oxide, zinc oxide, indium tin oxide, indium oxide, aluminum oxide, silicon oxide, and yttrium oxide from the viewpoint of improving the refractive index of the second resin layer. It preferably contains at least one selected from the group consisting of zirconium oxide and titanium oxide, and more preferably contains at least one selected from the group consisting of zirconium oxide and titanium oxide.

  As the zirconium oxide particles, when the material of the transparent electrode is ITO, it is preferable to use zirconium oxide nanoparticles from the viewpoint of improving the refractive index and adhesion between the ITO and the transparent substrate. The particle size distribution Dmax of the zirconium oxide nanoparticles is preferably 40 nm or less from the viewpoint of adhesion to ITO and the transparent substrate. The particle size distribution Dmax of the zirconium oxide nanoparticles may be 10 nm or more.

  Zirconium oxide nanoparticles are OZ-S30K (Nissan Chemical Industries, Ltd., product name), OZ-S40K-AC (Nissan Chemical Industries, Ltd., product name), SZR-K (Zirconium oxide methyl ethyl ketone dispersion, Sakai Chemical It is commercially available as SZR-M (Zirconium oxide methanol dispersion, product name, manufactured by Sakai Chemical Industry Co., Ltd.).

  It is also possible to use titanium oxide nanoparticles as the component (F2). The particle size distribution Dmax of the titanium oxide nanoparticles is preferably 50 nm or less, and more preferably 10 nm or more.

  As a component other than the component (F2), a sulfide containing atoms such as Mg, Al, Si, Ca, Cr, Cu, Zn, and Ba (for example, metal sulfide particles) is used in addition to the metal oxide particles. You can also.

  The content of the component (F2) is 75% by mass or less, preferably 70% by mass or less, and more preferably 60% by mass or less, based on the total mass of the second resin layer, from the viewpoint of suppressing the occurrence of cracks. It is more preferably at most 55% by mass. The content of the component (F2) is 45 mass% based on the total mass of the second resin layer, from the viewpoint that the refractive index of the second resin layer can be improved and more excellent transparency can be easily obtained. % Or more, more preferably 50% by mass or more, still more preferably 60% by mass or more, and particularly preferably 64% by mass or more. The content of the component (F) is preferably from 60 to 75% by mass, and more preferably from 64 to 70% by mass, based on the total mass of the second resin layer, from the viewpoint of suppressing the occurrence of cracks and ensuring the transparency of the cured film. % Is more preferred.

[Additive]

  The second resin layer may contain, as other additives, components (C1) to (E1) used in the first resin layer and other additives. Preferred compounds and preferred contents of these components are the same as in the first resin layer.

  The refractive index at 633 nm of the second resin layer is, for example, 1.50 or more. Therefore, it is possible to reduce the color difference due to optical reflection between the portion where the transparent electrode pattern such as ITO is formed and the portion where the transparent electrode pattern is not formed, and it is possible to suppress the bone appearance phenomenon. Further, it is possible to reduce the intensity of the reflected light on the entire screen, and it is possible to suppress a decrease in transmittance on the screen. The refractive index can be measured with reference to the examples of the present specification.

  The refractive index at 633 nm of the second resin layer may be 1.55 or more or 1.60 or more, and 1.90 or less, 1.85 or less, from the viewpoint of more sufficiently suppressing the bone appearance phenomenon. It may be 1.75 or less.

  The thickness (thickness after drying) of the second resin layer is preferably 10 nm or more, more preferably 20 nm or more, still more preferably 30 nm or more, and particularly preferably 40 nm or more. The thickness (thickness after drying) of the second resin layer 30 is preferably 1000 nm or less, more preferably 500 nm or less, further preferably 100 nm or less, still more preferably 80 nm or less, and particularly preferably 60 nm or less. When the thickness of the second resin layer after drying is 10 to 1000 nm, the above-described reflected light intensity of the entire screen can be further reduced.

  The ratio of the thickness of the second resin layer to the thickness of the first resin layer is preferably 0.003 or more, and more preferably 0.005 or more, from the viewpoint of reducing the stress applied to the cured second resin layer. More preferably, it is still more preferably 0.01 or more. The ratio of the thickness of the second resin layer to the thickness of the first resin layer may be 0.1 or less.

(Other layers)
The transfer film of the embodiment may have another layer appropriately selected as long as the effects of the present invention can be obtained. The other layers are not particularly limited and can be appropriately selected depending on the purpose. For example, a cushion layer, an oxygen shielding layer, a release layer, an adhesive layer, and the like can be given. The transfer film may have one of these layers alone, or may have two or more of these layers. Further, two or more layers of the same kind may be provided. In the transfer film, the first resin layer and the second resin layer are preferably adjacent to each other, but the other layer is present between the first resin layer and the second resin layer. You may. Further, it is preferable that the first resin layer and the support film are adjacent to each other, but the other layer may be present between the first resin layer and the support film.

(Protective film)
Examples of the protective film include polyethylene, polypropylene, polyethylene terephthalate, polycarbonate, polyethylene-vinyl acetate copolymer, polyethylene-vinyl acetate copolymer films, and laminated films of these films and polyethylene.

  The thickness of the protective film may be 5 μm or more, and may be 100 μm or less. The thickness of the protective film 15 is preferably 70 μm or less, more preferably 60 μm or less, further preferably 50 μm or less, and particularly preferably 40 μm or less, from the viewpoint of winding and storing in a roll shape.

<Method for manufacturing transfer film>
The transfer film includes, for example, a coating liquid containing a resin composition (first resin composition) that forms a first resin layer, and a resin composition (second resin composition) that forms a second resin layer. ) Is prepared, and these are applied to a support film or a protective film, respectively, dried, and bonded to each other. Further, the transfer film, after applying a coating solution containing a resin composition for forming the first resin layer on the support film, and dried, on the first resin layer, the resin for forming the second resin layer It can also be formed by applying a coating solution containing the composition, drying and applying a protective film as necessary.

  The coating liquid is obtained by uniformly dissolving or dispersing the respective components constituting the resin composition forming the first resin layer and the resin composition forming the second resin layer of the present embodiment in a solvent. be able to.

  The solvent used as the coating liquid is not particularly limited, and a known solvent can be used. Solvents used as a coating liquid include, for example, acetone, methyl ethyl ketone, methyl isobutyl ketone, toluene, methanol, ethanol, propanol, butanol, methylene glycol, ethylene glycol, propylene glycol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol Examples include ethyl methyl ether, diethylene glycol diethyl ether, propylene glycol monomethyl ether, ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, chloroform, and methylene chloride.

  Examples of the coating method include doctor blade coating, Meyer bar coating, roll coating, screen coating, spinner coating, inkjet coating, spray coating, dip coating, gravure coating, curtain coating, and die coating. And the like.

  The drying conditions are not particularly limited, but the drying temperature is preferably from 60 to 130 ° C., and the drying time is preferably from 0.5 to 30 minutes.

  The thickness of the laminate including the first resin layer and the second resin layer is preferably 30 μm or less, more preferably 20 μm or less, and still more preferably 10 μm or less, from the viewpoint of improving the followability during lamination. Further, from the viewpoint of rust prevention, the thickness is preferably 1 μm or more, more preferably 2 μm or more, and still more preferably 2 μm or more, in consideration of the possibility of occurrence of pinholes due to projections on the substrate. If it is 3 μm or more, it is possible to suppress the influence of the protrusions on the base material and keep the rust prevention.

<Transparent laminate>
FIG. 2 is a schematic sectional view showing a transparent laminate using the transfer film of one embodiment for a substrate with a transparent electrode pattern. In FIG. 2, a cured product (second cured resin layer, second cured resin layer) 32 of a second resin layer is formed on a substrate 50 with a transparent electrode pattern 50a such as ITO so as to cover the pattern 50a. Is provided thereon, and a cured product of the first resin layer (first cured resin layer, first cured resin layer) 22 is provided thereon, whereby the transparent laminate 100 is configured. That is, in the transparent laminate 100 shown in FIG. 2, a patterned cured film (cured film pattern, laminated body after curing, and cured product of the laminated body) 60 formed using the transfer film of one embodiment is formed by a transparent electrode pattern. It is provided on the substrate 50 with 50a. Although not shown in FIG. 2, metal wiring is provided on the base material, and a patterned cured film (cured film pattern, cured product of a laminate) 60 is also formed on the metal wiring. It is provided so as to cover the wiring.

  Examples of the substrate include glass, plastic, ceramic, and resin substrates used for touch panels. Examples of the resin substrate include, for example, polyester resin, polystyrene resin, olefin resin, polybutylene terephthalate resin, polycarbonate resin, and acrylic resin substrate. These substrates are preferably transparent.

  The transparent electrode forming the transparent electrode pattern 50a can be formed using a conductive metal oxide film such as ITO and IZO (Indium Zinc Oxide, indium oxide-zinc oxide). Further, the transparent electrode can also be formed using a photosensitive film having a photocurable resin layer using conductive fibers such as silver fibers and carbon nanotubes. The refractive index of a transparent electrode such as ITO is preferably 1.80 or more, more preferably 1.85 or more, further preferably 1.90 or more, from the viewpoint that the effect of suppressing the bone appearance phenomenon by the second resin layer is easily obtained. Preferably, it is preferably 2.10 or less, more preferably 2.05 or less, and even more preferably 2.00 or less.

  On the base material 50, a metal wiring may be formed. The metal wiring can be formed by using a conductive material such as Au, Ag, Cu, Al, Mo, or C by screen printing, vapor deposition, or the like. For example, a refractive index adjustment layer, an insulating layer, and the like may be provided between the base material 50 and the transparent electrode and the metal wiring.

The cured film 60 is a cured product of the laminate 40, and is cured at a curing reaction rate of, for example, 70% or more. The cured film 60 includes a first cured resin layer 22 and a second cured resin layer 32. Moisture permeability of the cured film 60, from the viewpoint of corrosion inhibition of the metal wiring and the transparent electrode is preferably less ^{350g / m 2 · 24h, 300g} / m or less, more preferably ^{2 · 24h, 250g / m 2} · 24h or less is more It is particularly preferably 200 g / m ² · 24 h or less. The moisture permeability is measured by the method described below.

First, the protective film of the transfer film was peeled off, and this was placed on a filter paper (manufactured by Advantech, No. 5C, circular φ90 mm, thickness 130 μm) at a roll temperature of 100 ° C. so that the second resin layer adhered tightly. Lamination is performed under the conditions of a feed speed of 0.6 m / min and a pressure of 0.5 MPa (cylinder pressure). Next, the above-mentioned laminate was irradiated with ultraviolet rays at an exposure amount of 0.6 J / m ² from above the surface of the support film using a parallel light exposure machine (EXM1201 manufactured by Oak Manufacturing Co., Ltd.), and then the support film was peeled off. Then, the laminated body is irradiated with ultraviolet rays from above vertically at an exposure amount of 1 × 10 ⁴ J / m ² . Thus, a moisture permeability measurement sample in which a cured film (cured film obtained by curing the laminate) is formed on the filter paper is obtained. Next, the moisture permeability is measured with reference to JIS standard (Z0208, cup method). Specifically, a hygroscopic agent (20 g of calcium chloride (anhydrous)) was placed in a measuring cup (φ60 mm, depth 15 mm, manufactured by Imoto Seisakusho), and the size of the moisture permeability measurement sample was reduced to 70 mm in diameter. The measuring cup is covered with a circular sample piece cut with scissors. Next, it is left for 24 hours in a thermo-hygrostat at 60 ° C. and 90% RH, and the moisture permeability is calculated from the change in the total mass of the measuring cup, the hygroscopic agent and the circular sample piece before and after the leaving.

  The minimum value of the transmittance of the cured film 60 at a wavelength of 400 to 700 nm is preferably 90% or more. More specifically, it is preferably at least 90.00%, more preferably at least 90.50%, even more preferably at least 90.70%. If the transmittance at a wavelength of 400 to 700 nm, which is a general visible light wavelength range, is 90% or more, the image display quality, color, and brightness in the sensing area are reduced in protecting the transparent electrode in the sensing area of the touch panel. Can be sufficiently suppressed. The maximum value of the transmittance is usually 100% or less. The visible light transmittance is measured by the method described below.

First, the protective film of the transfer film was peeled off, and a laminator (manufactured by Hitachi Chemical Co., Ltd., product name: 0.7 mm in thickness, 10 cm in length × 10 cm in width) such that the second resin layer was in close contact with the glass substrate. Using an HLM-3000 type), under the conditions of a roll temperature of 120 ° C., a base material feed speed of 1 m / min, and a pressure of 4 × 10 ⁵ Pa (cylinder pressure: 9.8 × 10 ³ N / m). Lamination is performed to produce a laminated sample in which a glass substrate, a second resin layer, a first resin layer, and a support film are laminated in this order. Next, using a parallel light exposure machine (EXM1201 manufactured by Oak Manufacturing Co., Ltd.), the exposure amount of the obtained laminated sample was 5 × 10 ² J from above the first resin layer (photosensitive resin composition layer) side. / M ² (measured value at a wavelength of 365 nm), the support film was removed after irradiating with ultraviolet rays, and placed in a box dryer (manufactured by Mitsubishi Electric Corporation, model number: NV50-CA) heated to 140 ° C. for 30 minutes. Allow to stand to obtain a sample for transmittance measurement. Next, the obtained transmittance measurement sample is measured for visible light transmittance in a measurement wavelength range of 400 to 700 nm using a haze meter (manufactured by Nippon Denshoku Industries Co., Ltd., product name: NDH 7000).

The cured film 60 can be formed by the following method. That is, the method of forming the cured film 60 includes a step of laminating the laminate 40 of the transfer film 1 on the base material 50 so that the second resin layer 30 is in close contact with the base material 50; And a step of removing a portion other than the exposed predetermined portion to form a patterned cured film 60. According to this method, a cured film 60 obtained by curing the laminate 40 of the transfer film is obtained. In this method, the laminated body 40 is irradiated with ultraviolet light at an exposure amount of 3.5 × 10 ² J / m ² from the side opposite to the second resin layer 30 in the first resin layer 20, and is irradiated at 140 ° C. for 30 minutes. By heating, the laminated body 40 can be sufficiently cured (for example, cured to a curing reaction rate of 70% or more), but if the laminated body 40 can be sufficiently cured, the curing conditions of the laminated body 40 Not limited. The details of the method of forming the cured film 60 will be described below.

-Lamination process-
First, after removing the protective film 15 that is present on the transfer film 1 as necessary, the laminate 40 of the transfer film 1 is placed on the surface of the base material 50 (base material with a transparent electrode pattern), and the second resin layer 30 is formed. Lamination is performed by pressure bonding from the support film 10 side so as to adhere. As the pressing means, a pressing roll may be used. The pressure roll may be provided with a heating means so as to be capable of thermocompression bonding.

  The heating temperature in the case of thermocompression bonding is such that the adhesion between the second resin layer 30 and the base material 50 and the components of the first resin layer 20 and the second resin layer 30 are not easily thermoset or thermally decomposed. In view of the above, the temperature is preferably 25 to 160 ° C, more preferably 25 to 150 ° C, and still more preferably 30 to 150 ° C.

From the viewpoint of suppressing deformation of the base material 50 while ensuring sufficient adhesion between the second resin layer 30 and the base material 50, the pressing pressure at the time of thermocompression bonding is 50 to 1 × 10 ⁵ N / linear pressure. m, more preferably 2.5 × 10 ^{2 to} 5 × 10 ⁴ N / m, and even more preferably 5 × 10 ² to 4 × 10 ⁴ N / m.

  If the transfer film 1 is thermocompression-bonded as described above, the pre-heat treatment of the base material 50 is not always necessary, but the base material 50 is pre-heated from the viewpoint of further improving the adhesion between the second resin layer and the base material. Heat treatment may be performed. The processing temperature at this time is preferably 30 to 150 ° C.

-Exposure process-
Next, predetermined portions of the second resin layer 30 and the first resin layer 20 after the transfer are irradiated with actinic rays (eg, ultraviolet rays) in a pattern through, for example, a photomask. When irradiating with the actinic ray, if the support film 10 on the first resin layer 20 is transparent, the actinic ray can be irradiated as it is. Is irradiated. A known active light source can be used as a light source for the active light. In the present specification, the pattern is not limited to the shape of fine wiring forming a circuit, but also includes a shape in which only a connection portion with another substrate is removed in a rectangular shape and a shape in which only a frame portion of the substrate is removed. It is.

The irradiation amount of the actinic ray is, for example, 1 × 10 ² to 1 × 10 ⁴ J / m ² , and the irradiation may be accompanied by heating. When the irradiation amount of the actinic ray is 1 × 10 ² J / m ² or more, the photocuring can be sufficiently advanced, and when the irradiation amount is 1 × 10 ⁴ J / m ² or less, the first resin is used. There is a tendency that discoloration of the layer and the second resin layer can be suppressed.

-Development step-
Subsequently, the unexposed portions of the first resin layer 20 and the second resin layer 30 after the irradiation of the actinic ray are removed with a developing solution to form a cured film pattern covering a part or the whole of the transparent electrode. After the irradiation with the actinic ray, if the support film 10 is laminated on the first resin layer 20, the development step is performed after removing the support film 10.

  The development step is preferably performed by a known method such as spraying, showering, rocking immersion, brushing, and scrubbing using an alkaline aqueous solution as a developing solution. Especially, it is preferable to carry out spray development using an alkaline aqueous solution from the viewpoint of environment and safety. The development temperature and time can be adjusted in a conventionally known range.

  A transparent adhesive film (OCA, Optical Clear Adhesive) or the like may be provided on the cured film 60 (the surface on the first cured resin layer 22 side) of the transparent laminate 100 described above. The refractive index of the member such as the OCA is preferably 1.45 or more, more preferably 1.47 or more, still more preferably 1.48 or more from the viewpoint that the effect of suppressing the bone appearance phenomenon by the second resin layer is easily obtained. Also, it is preferably at most 1.55, more preferably at most 1.53, even more preferably at most 1.51.

<Electronic components>
An electronic component according to one embodiment includes a cured film formed using the transfer film 1 described above. This cured film is preferably formed in a pattern. Examples of the electronic component include a touch panel, a liquid crystal display, an organic electroluminescence, a solar cell module, a printed wiring board, and an electronic paper.

  FIG. 3 is a schematic top view illustrating an example of a capacitive touch panel. The touch panel shown in FIG. 3 has a sensing area 102 for detecting touch position coordinates on one surface of a transparent base material 101, and a transparent electrode 103 and a transparent electrode 104 for detecting a change in capacitance in this area are transparent. It is provided on a substrate 101.

  The transparent electrode 103 and the transparent electrode 104 detect the X position coordinate and the Y position coordinate of the touch position, respectively.

  On the transparent substrate 101, a metal wiring 105 for transmitting a detection signal of a touch position from the transparent electrode 103 and the transparent electrode 104 to an external circuit is provided. The metal wiring 105 is connected to the transparent electrode 103 and the transparent electrode 104 by a connection electrode 106 provided on the transparent electrode 103 and the transparent electrode 104. Further, a connection terminal 107 for connecting to an external circuit is provided at an end of the metal wiring 105 opposite to a connection portion with the transparent electrode 103 and the transparent electrode 104.

  As shown in FIG. 3, by forming the cured film pattern 123, the function of the protective film of the transparent electrode 103, the transparent electrode 104, the metal wiring 105, the connection electrode 106 and the connection terminal 107 and the transparent electrode pattern are formed. At the same time, the function of suppressing the appearance of bones in the sensing area 102 (for example, the function of adjusting the refractive index) is also achieved.

  Hereinafter, the present invention will be described more specifically with reference to experimental examples. However, the present invention is not limited to the following experimental examples.

<Preparation of binder polymer solution>
A flask equipped with a stirrer, a reflux condenser, an inert gas inlet, and a thermometer was charged with 65 parts by weight of propylene glycol monomethyl ether as a solvent, and heated to 80 ° C. under a nitrogen gas atmosphere. While maintaining the reaction temperature at 80 ° C. ± 2 ° C., the compounds shown in Table 1 were uniformly added dropwise over 4 hours. After dropping, stirring was continued at 80 ° C. ± 2 ° C. for 6 hours to obtain a solution containing polymer A (binder polymer solution A, solid content: 45% by mass). A solution containing polymer B (binder polymer solution B, solid content of 45% by mass) and a solution containing polymer C (binder polymer) were prepared in the same manner as described above except that the compounds to be dropped were changed as shown in Table 1. Solution C, solid content 45% by mass).

<Method for measuring weight average molecular weight>
The weight average molecular weight (Mw) was measured by gel permeation chromatography (GPC), and was derived by conversion using a calibration curve of standard polystyrene. GPC conditions are shown below.
[GPC conditions]
Pump: L-6000 (product name, manufactured by Hitachi, Ltd.)
Column: Gelpack GL-R420, Gelpack GL-R430, Gelpack GL-R440 (these are the product names of Hitachi Chemical Co., Ltd.)
Eluent: tetrahydrofuran Measurement temperature: 40 ° C
Flow rate: 2.05 mL / min Detector: L-3300 (RI detector, manufactured by Hitachi, Ltd., product name)

<Method of measuring acid value>
The acid value was measured by a neutralization titration method based on JIS K0070 as shown below. First, the binder polymer solution was heated at 130 ° C. for 1 hour to remove volatile components, thereby obtaining a solid component. Then, 1 g of the solid binder polymer was precisely weighed, and then 30 g of acetone was added to the binder polymer, which was uniformly dissolved to obtain a resin solution. Next, an appropriate amount of phenolphthalein as an indicator was added to the resin solution, and neutralization titration was performed using a 0.1 mol / L aqueous potassium hydroxide solution. Then, the acid value was calculated by the following equation.
Acid value = 0.1 × V × f ₁ × 56.1 / (Wp × I / 100)
(Wherein, V is titer of 0.1 mol / L aqueous solution of potassium hydroxide used in titration (mL), _{f 1} is 0.1 mol / L factor of the aqueous potassium hydroxide solution (concentration conversion coefficient), Wp is measured The mass (g) of the resin solution, and I indicates the ratio (mass%) of the non-volatile content in the resin solution measured.)

<Method of measuring glass transition temperature Tg>
A measurement sample was prepared by distilling the binder polymer solution under reduced pressure using a rotary evaporator. The glass transition temperature Tg of the measurement sample was measured using a DMA measurement device (manufactured by Seiko Instruments Inc.). The temperature was raised at 2 ° C./min, and the temperature at which the peak of tan δ appeared was defined as the glass transition point (Tg).

<Preparation of coating liquid for forming first resin layer>
Each component shown in Table 2 and methylpropylene glycol (solvent) were mixed for 15 minutes with a stirrer to prepare a coating liquid 1. In Table 2, the unit of the amount of each component is parts by mass. The amount of each component is a solid content. The polymer A was mixed in the state of a binder polymer solution, and methylpropylene glycol was added in such an amount that the solid content concentration of the coating solution became 25% by mass.

The symbols of the components in Table 2 have the following meanings.
-(B1) component A-DCP: tricyclodecane dimethanol diacrylate (product name, manufactured by Shin-Nakamura Chemical Co., Ltd.)
Component (C1) OXE01: 1,2-octanedione, 1-[(4-phenylthio) phenyl-, 2- (O-benzoyloxime)] (BASF Japan Ltd., product name: IRGACURE OXE01)
-(D1) component B-6030: 5-amino-1H-tetrazole (product name, manufactured by Chiyoda Chemical Co., Ltd.)
-(E1) component PM-21: a phosphate ester having an ethylenically unsaturated group (product name, manufactured by Nippon Kayaku Co., Ltd.)

<Preparation of coating liquid for forming second resin layer>
Each component shown in Table 3 and methyl propylene glycol (solvent) were mixed for 15 minutes using a stirrer to prepare coating solutions IM-1 to IM-7. In Table 3, the unit of the amount of each component is parts by mass. The amount of each component is a solid content. The polymers A to C were mixed in the state of a binder polymer solution, and methylpropylene glycol was added in such an amount that the solid content concentration of the coating solution became 1.0% by mass.

The symbols of the components in Table 3 have the following meanings.
-(B2) component A-DCP: tricyclodecane dimethanol diacrylate (product name, manufactured by Shin-Nakamura Chemical Co., Ltd.)
T-1420: Ditrimethylolpropane tetraacrylate (product name, manufactured by Nippon Kayaku Co., Ltd.)
A-TMMT: pentaerythritol tetraacrylate (Shin-Nakamura Chemical Co., Ltd. product name)
-(D2) component B-6030: 5-amino-1H-tetrazole (product name, manufactured by Chiyoda Chemical Co., Ltd.)
-(E2) component PM-21: phosphate ester having an ethylenically unsaturated group (product name, manufactured by Nippon Kayaku Co., Ltd.)
-(F2) component OZ-S30K: zirconia dispersion (manufactured by Nissan Chemical Industries, product name: Nanouse OZ-S30K, solid content: 30% by mass)

(Example 1)
<Preparation of single-layer film A including first resin layer>
The coating solution 1 is applied on a 16 μm-thick polyethylene terephthalate film (support film, product name: FB40, manufactured by Toray Industries, Inc.), and dried at 100 ° C. for 3 minutes to remove the solvent. Formed. The amount of the coating solution was adjusted and applied so that the thickness after drying was 8 μm.

<Preparation of single-layer film B including second resin layer>
The coating solution IM-1 was applied on a 30 μm-thick polypropylene film (protective film, manufactured by Oji F-Tex Corporation), and dried at 100 ° C. for 3 minutes to remove the solvent, thereby forming a second resin layer. The amount of the coating solution was adjusted so that the thickness after drying was 80 nm, and the coating was performed.

<Measurement of resin layer thickness>
The thickness of the first resin layer in the single-layer film A prepared above was measured with a digital thickness gauge (manufactured by Nikon Corporation, product name: DIGIMICROSAND MS-5C). Further, the thickness of the second resin layer in the single-layer film B produced above was measured by F20 (product name, manufactured by Filmetrics Co., Ltd.). The thickness of the first resin layer was 8 μm, and the thickness of the second resin layer was 80 nm.

<Preparation of transfer film provided with first resin layer and second resin layer>
The obtained single-layer film A having the first resin layer and the single-layer film B having the second resin layer are subjected to laminating using a laminator (HLM-3000, manufactured by Hitachi Chemical Co., Ltd.). The first resin layer, the second resin layer, and the protective film are laminated in this order on the support film by bonding at 23 ° C. so that the first resin layer and the second resin layer are in close contact with each other. Thus, a transfer film of Example 1 (a transfer film with a protective film) was obtained.

<Measurement of indentation elastic modulus>
After the support film of the transfer film was peeled off and removed, the first resin layer was irradiated with ultraviolet light at an exposure of 3.5 × 10 ² J / m ² from the side opposite to the second resin layer, and this was irradiated with SiO 2. on ₂ sputtered glass, the first resin layer was laminated in contact with the SiO ₂ sputtered glass, and allowed to stand for 30 minutes in a box-type dryer heated to 140 ° C.. The laminate was cured as described above, and the indentation elastic modulus of the second resin layer in the obtained cured laminate was measured using a Fischer scope H100CS (manufactured by FISCHER). Table 4 shows the results.

<Measurement of refractive index>
The coating solution IM-1 is uniformly coated on a glass substrate having a thickness of 0.7 mm, length 10 cm × width 10 cm by a spin coater, and dried by a hot air convection dryer at 100 ° C. for 3 minutes to remove the solvent. Then, a second resin layer was formed. Next, the second resin layer obtained above was allowed to stand in a box dryer (manufactured by Mitsubishi Electric Corporation, model number: NV50-CA) heated to 140 ° C. for 30 minutes, and the second resin layer was removed. A sample for refractive index measurement was obtained. Next, the refractive index at a wavelength of 633 nm of the sample for refractive index measurement obtained by ETA-TCM (manufactured by AudioDevGmbH Co., Ltd.) was measured. Table 4 shows the results. The thickness of the second resin layer used for the measurement was the same (80 nm) as the thickness of the second resin layer in the transfer film.

(Examples 2-3 and Comparative Examples 1-4)
In the production of the single-layer film B including the second resin layer, the same procedure as in Example 1 was carried out except that the coating solutions IM-2 to IM-7 were used instead of the coating solution IM-1. Single layer films B of Examples 2 to 3 and Comparative Examples 1 to 4 were produced. Transfer films of Examples 2 to 3 and Comparative Examples 1 to 4 were prepared in the same manner as in Example 1 except that the obtained single-layer film B was used in the preparation of the transfer film. Further, the indentation elastic modulus and the refractive index were measured in the same manner as in Example 1. Table 4 shows the results.

<Evaluation>
Using the transfer films of Examples and Comparative Examples, the crack resistance was evaluated in the following procedure. Table 4 shows the results.

[Evaluation of crack resistance]
After the protective film of the transfer film with the protective film was peeled off and removed, ultraviolet rays were irradiated from the second resin layer side at an exposure amount of 10 × 10 ² J / m ² . Then, a rod having a diameter of 1.0 mm is placed on the support film of the transfer film (on the surface opposite to the first resin layer), and the second resin layer is transferred outward along the rod. The film was bent at a bending angle of 180 degrees. After returning the transfer film to its original state, the transfer film was similarly folded nine times. Next, the bent portion was observed with a microscope from the second resin layer side of the transfer film, and the presence or absence of cracks was evaluated. After the support film of the transfer film with the protective film was peeled off and removed, the first resin layer was irradiated with ultraviolet light at an exposure of 3.5 × 10 ² J / m ² from the side opposite to the second resin layer. When the laminate cured by standing still in a box dryer heated to 140 ° C. for 30 minutes was subjected to the crack resistance evaluation by the same method as above, the same result as the above evaluation result was obtained. Was obtained.

DESCRIPTION OF SYMBOLS 1 ... Transfer film, 10 ... Support film, 15 ... Protective film, 20 ... First resin layer, 30 ... Second resin layer, 22 ... First cured resin layer, 32 ... Second cured resin layer, 40 ... Laminated body, 50 ... Substrate with transparent electrode pattern, 50a ... Transparent electrode pattern, 60 ... Cured product of cured body (cured film), 100 ... Transparent laminated body, 101 ... Transparent base material, 102 ... Sensing area, 103, 104: transparent electrode, 105: metal wiring, 106: connection electrode, 107: connection terminal, 123: cured film pattern.

Claims (11)

Support film, comprising a laminate provided on the support film,
The laminate includes a first resin layer provided on the support film, and a second resin layer provided on the first resin layer,
The first resin layer is a photosensitive resin composition layer,
The second resin layer contains 75% by mass or less of metal oxide particles based on the total mass of the second resin layer,
In a state where the support film is peeled off, the laminate is irradiated with ultraviolet light at an exposure amount of 3.5 × 10 ² J / m ² from the opposite side of the first resin layer from the second resin layer, The transfer film, wherein the indentation modulus of the second resin layer measured after heating at 140 ° C. for 30 minutes is 500 GPa or less.   The transfer film according to claim 1, wherein the second resin layer includes a binder polymer having a glass transition temperature of 70 ° C. or less.   The transfer film according to claim 1, wherein the second resin layer has a polymerizable compound having an ethylenically unsaturated group and having a ratio of a molecular weight to the number of the ethylenically unsaturated group of 100 or more. 4. . The transfer film according to claim 1, wherein the second resin layer contains a polymerizable compound represented by the following general formula (1).

[In the general formula (1), a plurality of Rs each independently represent a hydrogen atom or a methyl group, X represents a p-valent organic group having 10 to 20 carbon atoms, and p represents an integer of 2 to 4. . ]   The transfer film according to claim 3, wherein the content of the polymerizable compound in the second resin layer is 60% by mass or less based on the total mass of the organic component in the second resin layer.   The metal oxide particles comprise at least one selected from the group consisting of zirconium oxide, titanium oxide, tin oxide, zinc oxide, indium tin oxide, indium oxide, aluminum oxide, silicon oxide and yttrium oxide. 6. The transfer film according to any one of 5.   The transfer film according to claim 1, wherein the first resin layer includes a binder polymer, a photopolymerizable compound, and a photopolymerization initiator.   The transfer film according to any one of claims 1 to 7, wherein a ratio of a thickness of the second resin layer to a thickness of the first resin layer is 0.003 or more. A step of laminating the laminate of the transfer film according to any one of claims 1 to 8 on a substrate so that the second resin layer adheres to the substrate,
Exposing a predetermined portion of the laminate on the substrate,
Removing a portion other than the predetermined portion exposed to form a cured film in a pattern.   A cured film obtained by curing the first resin layer and the second resin layer of the laminate in the transfer film according to claim 1.   An electronic component comprising the cured film according to claim 10.

Images