CN110343484A - 基于粒子基质涂覆液态金属的各向异性导电胶及制备方法 - Google Patents
基于粒子基质涂覆液态金属的各向异性导电胶及制备方法 Download PDFInfo
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- CN110343484A CN110343484A CN201910540529.5A CN201910540529A CN110343484A CN 110343484 A CN110343484 A CN 110343484A CN 201910540529 A CN201910540529 A CN 201910540529A CN 110343484 A CN110343484 A CN 110343484A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
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CN201910540529.5A CN110343484B (zh) | 2019-06-21 | 2019-06-21 | 基于粒子基质涂覆液态金属的各向异性导电胶及制备方法 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110527468A (zh) * | 2019-08-15 | 2019-12-03 | 东南大学 | 一种基于一维、二维材料的力致导电胶的制备与应用 |
CN114561110A (zh) * | 2022-03-26 | 2022-05-31 | 常州大学 | 用于制备硅橡胶复合材料的硅包覆液态金属纳米填料 |
CN114933867A (zh) * | 2022-04-28 | 2022-08-23 | 北京航空航天大学 | 一种基于液态金属-多孔微球骨架的各向异性导电胶及其制备方法 |
CN115216246A (zh) * | 2021-04-21 | 2022-10-21 | 南京恩微信息科技有限公司 | 一种万向导电胶及万向超低电阻增强膜 |
CN116190337A (zh) * | 2023-04-23 | 2023-05-30 | 深圳平创半导体有限公司 | 电子器件及其制备方法 |
WO2024031510A1 (zh) * | 2022-08-11 | 2024-02-15 | 宁德时代新能源科技股份有限公司 | 连接极耳和极柱的导电胶及包含其的电池 |
Citations (3)
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CN101418210A (zh) * | 2007-10-26 | 2009-04-29 | 中国科学院理化技术研究所 | 一种具有高传热性能的混有颗粒的金属液体的制备方法 |
CN108986949A (zh) * | 2018-06-15 | 2018-12-11 | 北京梦之墨科技有限公司 | 一种导电复合材料及其制备方法 |
CN109852281A (zh) * | 2019-02-01 | 2019-06-07 | 东南大学 | 一种基于液态金属的各向异性导电胶的制备方法 |
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2019
- 2019-06-21 CN CN201910540529.5A patent/CN110343484B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101418210A (zh) * | 2007-10-26 | 2009-04-29 | 中国科学院理化技术研究所 | 一种具有高传热性能的混有颗粒的金属液体的制备方法 |
CN108986949A (zh) * | 2018-06-15 | 2018-12-11 | 北京梦之墨科技有限公司 | 一种导电复合材料及其制备方法 |
CN109852281A (zh) * | 2019-02-01 | 2019-06-07 | 东南大学 | 一种基于液态金属的各向异性导电胶的制备方法 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110527468A (zh) * | 2019-08-15 | 2019-12-03 | 东南大学 | 一种基于一维、二维材料的力致导电胶的制备与应用 |
CN115216246A (zh) * | 2021-04-21 | 2022-10-21 | 南京恩微信息科技有限公司 | 一种万向导电胶及万向超低电阻增强膜 |
CN115216246B (zh) * | 2021-04-21 | 2024-01-12 | 南京恩微信息科技有限公司 | 一种万向导电胶及万向超低电阻增强膜 |
CN114561110A (zh) * | 2022-03-26 | 2022-05-31 | 常州大学 | 用于制备硅橡胶复合材料的硅包覆液态金属纳米填料 |
CN114933867A (zh) * | 2022-04-28 | 2022-08-23 | 北京航空航天大学 | 一种基于液态金属-多孔微球骨架的各向异性导电胶及其制备方法 |
CN114933867B (zh) * | 2022-04-28 | 2023-03-10 | 北京航空航天大学 | 一种基于液态金属-多孔微球骨架的各向异性导电胶及其制备方法 |
WO2024031510A1 (zh) * | 2022-08-11 | 2024-02-15 | 宁德时代新能源科技股份有限公司 | 连接极耳和极柱的导电胶及包含其的电池 |
CN116190337A (zh) * | 2023-04-23 | 2023-05-30 | 深圳平创半导体有限公司 | 电子器件及其制备方法 |
CN116190337B (zh) * | 2023-04-23 | 2023-07-14 | 深圳平创半导体有限公司 | 电子器件及其制备方法 |
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Address after: 210000 rooms 301-302, building 10, phase I, Jingang Science Park, No.1 Kechuang Road, Yaohua street, Qixia District, Nanjing City, Jiangsu Province Patentee after: Jiangsu Fuqin Electronic Material Co.,Ltd. Address before: 210000 rooms 301-302, building 10, phase I, Jingang Science Park, No.1 Kechuang Road, Yaohua street, Qixia District, Nanjing City, Jiangsu Province Patentee before: Jiangsu Fuwei Electronic Material Technology Co., Ltd |