CN110343484A - Anisotropy conductiving glue and preparation method based on particle substrate application liquid metal - Google Patents
Anisotropy conductiving glue and preparation method based on particle substrate application liquid metal Download PDFInfo
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- CN110343484A CN110343484A CN201910540529.5A CN201910540529A CN110343484A CN 110343484 A CN110343484 A CN 110343484A CN 201910540529 A CN201910540529 A CN 201910540529A CN 110343484 A CN110343484 A CN 110343484A
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- particle
- adhesive
- liquid metal
- anisotropy conductiving
- conductiving glue
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
Abstract
The present invention is anisotropy conductiving glue and preparation method based on particle substrate application liquid metal, liquid metal is coated on particle stromal surface, it is formed using particle matrix as core, liquid metal coating is the core-shell structure of shell, the conductive filler that surface is coated with liquid metal is mixed into adhesive by churned mechanically method, the mixture of obtained liquid metal coating particle and adhesive removes bubble, stores for future use；The mixture of the liquid metal coating particle and adhesive that remove bubble is applied to the substrate surface with electrode, then another piece of substrate with electrode is placed on mixture, forms sandwich sandwich.Curing molding obtains anisotropy conductiving glue of the liquid metal coating particle as conductive filler.Temperature is set according to the glass transition temperature or fusing point of the glass transition temperature of conducting resinl and particle matrix, conducting resinl application external force is made to form conductive path between the electrode of upper layer and lower layer substrate, and is in state of insulation perpendicular to all directions of pressure.
Description
Technical field
The invention belongs to field of material technology, and in particular to one kind coats liquid-metal layer conduct based on particle stromal surface
The preparation method and application of the anisotropy conductiving glue of conductive filler.
Background technique
Anisotropy conductiving glue (Anisotropic Conductive Adhesives, abbreviation ACAs) has unique lead
Electrical anisotropy, i.e., the good conductive path of formation in the z-axis direction, and good insulation is then formed on x-axis and y-axis direction
Body, by accurately controlling distribution of the conductive filler in adhesive matrix, to reach this unique property of anisotropy.
After conducting resinl is heated and is pressurized, the conductive filler in adhesive matrix is between the pad of upper and lower two substrates in z-axis direction
It is upper to form good conductive path.And the region between substrate adjacent pad, adhesive matrix and remaining conductive filler conduct
Insulator prevents the formation of conductive path on other directions.Anisotropy conductiving glue provides on z-axis direction for various chip parts
High speed interconnection and conducting, including flip-chip, small spacing flip chip, flexible printed circuit cable and various thin space groups
Part.They are often used as the interconnection material in main body application aspect, such as flat-panel monitor, crystal display, intelligent label, intelligence
Card, camera model, mobile phone, thin-film solar cells, direct access sensors and semiconductor packages etc..
Anisotropy conductiving glue is filled out by host agent (main component of adhesive, leading adhesive adhesive property), conduction at present
Material and other auxiliary agents (auxiliary element of adhesive, in order to assign adhesive specific physicochemical characteristic) composition.Currently, novel
Anisotropy conductiving glue has been widely studied using low-melting-point metal as conductive filler.Conventional anisotropic-electroconductive glue is for reality
Existing conductive path, operation temperature usually carries out (fusing point depending on conductive filler) at high temperature, and the solidification of conducting resinl
The formation of forming process and conductive path must carry out that (the curing molding speed of conducting resinl needs strict control, each to guarantee simultaneously
The electric conductivity of anisotropy conducting resinl).Therefore, the novel high-performance for developing alternative low-melting-point metal anisotropy conductiving glue is each
Anisotropy conducting resinl is of great significance in Electronic Packaging industry.
Summary of the invention
Technical problem: the purpose of the present invention is to provide a kind of anisotropy based on particle substrate application liquid metal to lead
Electric glue and preparation method, another object of the present invention is to provide one kind to coat liquid-metal layer conduct based on particle stromal surface
The application of the anisotropy conductiving glue of conductive filler.
Technical solution: a kind of anisotropy conductiving glue based on particle substrate application liquid metal of the invention is a kind of base
In anisotropy conductiving glue of the particle stromal surface coating liquid-metal layer as conductive filler.
Wherein；
The particle matrix includes polymer particle matrix, the inorganic particulate matrix, gold that particle size is 1nm~100 μm
Belong to particle stromal surface, formed using particle matrix as core, liquid metal coating is that the core-shell structure of shell is ground using mechanical stirring
Mill, Sonication or solvent mixed method realize the formation of core-shell structure.
The conductive filler is the particle that surface is coated with liquid-metal layer, is using particle matrix as core, liquid metal applies
Layer is the core-shell structure of shell；By using the particle matrix of different-grain diameter size and the thickness of control liquid-metal layer, regulation
The partial size of conductive filler, and then regulate and control the electric conductivity of anisotropy conductiving glue.
The liquid-metal layer is for Metallic Gallium or containing the one or more of gallium, indium, zinc, bismuth, cadmium, tin, lead, dysprosium or indium
Cocrystallizing type low-melting alloy of the element as auxiliary element, fusing point are below 100 degrees Celsius.
The polymer particle matrix has stable morphosis, by selective polymerization mode and polymerized monomer, from point
Synthesis and preparation are designed in sub- level, the size and homogeneity of its easily controllable particle prepare surface physics
The polymer particle of matter and differing chemical properties.
The inorganic particulate matrix includes: that calcium carbonate nano particle, montmorillonite, Nano particles of silicon dioxide, aluminium oxide are received
Rice corpuscles, titanium dioxide nano-particle, zinc oxide nano-particle；Such inorganic particulate matrix is with good stability and uniform
Partial size 1nm~100 μm.
A kind of anisotropy conductiving glue based on particle substrate application liquid metal of the invention the preparation method comprises the following steps: preparation
Particle stromal surface coats anisotropy conductiving glue of the liquid-metal layer as conductive filler: using hot setting adhesive, thermoplastic
Property adhesive and multicomponent adhesive as adhesive, liquid metal is coated on particle stromal surface, surface is coated with liquid
Particle matrix, that is, conductive filler of metal is mixed into the adhesive by churned mechanically method, and liquid metal coating is obtained
The mixture of particle and adhesive removes bubble, stores for future use；
The mixture of the liquid metal coating particle and adhesive that remove bubble is applied to the substrate surface with electrode, then
Another piece of substrate with electrode is placed on mixture, formation sandwich sandwich, in the sandwich sandwich, on
Lower two-layer substrate needs precise alignment, it is ensured that the electrode of upper layer and lower layer substrate can precise alignment, to guarantee each to different of conducting resinl
Property；Curing molding obtains anisotropy conductiving glue of the liquid metal coating particle as conductive filler.
Wherein:
The adhesive is made of host agent and auxiliary agent, and the host agent of adhesive is epoxy resin, polyurethanes, organic silicon
Hot setting adhesive or polyacrylic, polymethylacrylic acid thermoplastic adhesive or phenolic aldehyde-epoxy type, epoxy-polyamide
The modified multicomponent adhesive of type；The auxiliary agent of adhesive be curing agent, initiator, catalyst, promotor, crosslinking agent, diluent,
Plasticizer, toughener, thickener or stabilizer.
The hot setting adhesive includes: epoxy resin tackifier, phenolic resin class adhesive, unsaturated polyester (UP) class glue
Stick, polyurethane tackifier, polyimide adhesive, allyl resin class adhesive or alkyd resin class adhesive；
Thermoplastic adhesive includes: polyethylene kind adhesive, PP type adhesive, polyvinyl chloride adhesive, propylene
Acid resin class adhesive or polycarbonate-based adhesive；
Multicomponent adhesive includes: phenolic aldehyde-epoxy type adhesive, phenolic aldehyde-polyurethane-type adhesive, phenolic aldehyde-nitrile rubber
Type adhesive, phenolic aldehyde-Pioloform, polyvinyl acetal type adhesive or epoxy-polyamide type adhesive.
A kind of application of anisotropy conductiving glue based on particle substrate application liquid metal of the invention is:
Temperature is set according to the glass transition temperature or fusing point of the glass transition temperature of conducting resinl and particle matrix, in this temperature
Under external force is applied to conducting resinl it is then cooling to restore to room temperature so that form conductive path between the electrode of upper layer and lower layer substrate,
Conducting resinl has good electric conductivity along the direction of external force at this time, and is in state of insulation perpendicular to all directions of pressure；
External force is applied to conducting resinl by control, realizes that it has good electric conductivity on the direction along external force, and protect
The all directions held perpendicular to external force are in state of insulation, and conduction resistance value is lower than 100m Ω；Select appropriate force size with
And power range carrys out the conductive extensions on proof stress direction, can achieve the formation of selective conductivity access.
Particle stromal surface coat liquid-metal layer as conductive filler anisotropy conductiving glue can elder generation curing molding,
Then apply external force under less than 120 DEG C environment and form conductive path, be different from conventional anisotropic-electroconductive adhesive curing molding
The formation of process and conductive path must carry out simultaneously, and the anisotropy conductiving glue of the preparation, which removes, is suitable for conventional anisotropic
Outside conducting resinl application range, the conductive connection between flexible circuit is applied also for, has further expanded answering for anisotropy conductiving glue
Use range.
The utility model has the advantages that compared with conventional anisotropic-electroconductive glue, the present invention has the following advantages:
(1) conductive filler declared in this patent is the particle that surface is coated with liquid-metal layer, is to be with particle matrix
Core, liquid metal coating are the core-shell structure of shell.By using the particle matrix and control liquid metal of different-grain diameter size
The thickness of layer can regulate and control the partial size of conductive filler, and then regulate and control the electric conductivity of anisotropy conductiving glue.
(2) conductive filler declared in this patent declared in this patent is the particle that surface is coated with liquid-metal layer,
Wherein liquid metal coating is Metallic Gallium and being total to as auxiliary element containing elements such as indium, zinc, bismuth, cadmium, tin, lead, dysprosium, indiums
Crystal form low-melting alloy, fusing point are below 100 degrees Celsius.
(3) conductive filler declared in this patent is the particle that surface is coated with liquid-metal layer, and wherein particle matrix is
The polymer particle matrix of different-grain diameter size, inorganic particulate matrix, metallic matrix etc..Polymer particle matrix has steady
Fixed morphosis can design synthesis and preparation from molecular level by selective polymerization mode and polymerized monomer, be easy to control
The size and homogeneity for making its particle, prepare the polymer particle of surface physical properties and differing chemical properties.This
Outside, polymer can also be handled by physical operations means (grinding, ball milling etc.), it is larger, more uniform obtains partial size
Polymer particle.Inorganic particulate matrix includes but is not limited to: calcium carbonate nano particle, montmorillonite, Nano particles of silicon dioxide,
Alumina nanoparticles, titanium dioxide nano-particle, zinc oxide nano-particle etc., such inorganic particulate matrix have good steady
Qualitative and uniform partial size is the important component as liquid metal coated carrier.
(4) external force is applied to conducting resinl by control, it may be implemented has good conduction on the direction along external force
Property, and all directions for remaining perpendicular to external force are in state of insulation, conduction resistance value is lower than 100m Ω.
(5) particle stromal surface coating liquid-metal layer can be with as the anisotropy conductiving glue of conductive filler in this patent
Then first curing molding applies external force (less than 120 DEG C) at low ambient temperatures and forms conductive path and (selecting suitable particle
Under the conditions of the liquid metal of matrix and suitable fusion points)；And conventional anisotropic-electroconductive glue operates to realize conductive path
Temperature usually carries out (fusing point depending on conductive filler) at high temperature, and the curing molding process and conductive path of conducting resinl
Formation must carry out that (the curing molding speed of conducting resinl needs strict control, to guarantee the conduction of anisotropy conductiving glue simultaneously
Performance).
(6) particle stromal surface coating liquid-metal layer can be with as the anisotropy conductiving glue of conductive filler in this patent
After curing molding, selects appropriate force size and power range to carry out the conductive extensions on proof stress direction, can achieve selection
The formation of property conductive path.
(7) particle stromal surface coating liquid-metal layer is not only being pressed as the anisotropy conductiving glue of conductive filler
Can be with turning circuit under power, it, can be in power under the effect of other power (including but not limited to folding force, pulling force, shearing force etc.)
Parallel direction on turning circuit.
(8) particle stromal surface coating liquid-metal layer removes as the anisotropy conductiving glue of conductive filler and is suitable for passing
Anisotropy conductiving glue application range of uniting is outer (such as circuit board cementing etc.)；The conductive connection between flexible circuit is applied also for, is opened up
The application range of anisotropy conductiving glue is opened up.
Detailed description of the invention
Fig. 1 is shear strength test sample schematic diagram.
Fig. 2 is 180 ° of peel strength test sample schematic diagrames.
Specific embodiment
The purpose of the present invention can be achieved through the following technical solutions:
Of the invention coats liquid-metal layer as the anisotropy conductiving glue of conductive filler based on particle stromal surface
Preparation method and application comprises the steps of:
Step (1) prepares anisotropy conductiving glue of the particle stromal surface coating liquid-metal layer as conductive filler: this
Hot setting adhesive, thermoplastic adhesive and multicomponent adhesive can be divided by inventing the adhesive used, and liquid metal is coated
In particle matrix, (particle matrix includes the polymer particle matrix of different-grain diameter size, inorganic particulate matrix, metallic matrix
Deng) surface, formed using particle matrix as core, liquid metal coating be shell core-shell structure (mechanical stirring can be used, grind,
The formation of core-shell structure is realized in Sonication, the methods of solvent mixing), the conductive filler that surface is coated with liquid metal is passed through
Churned mechanically method is mixed into adhesive, and the mixture of obtained liquid metal coating particle and adhesive removes bubble,
It stores for future use；
Step (2) particle stromal surface coats user of the liquid-metal layer as the anisotropy conductiving glue of conductive filler
Method: the mixture of the liquid metal coating particle and adhesive that remove bubble is applied to the substrate surface with electrode and (such as is passed
Unite circuit board, flexible circuit board etc.), then another piece of substrate with electrode be placed on mixture to (upper layer and lower layer substrate needs essence
Quasi- alignment, with guarantee upper layer and lower layer substrate electrode can precise alignment, to guarantee the anisotropy of conducting resinl), formed Sanming City
Control sandwich.Curing molding obtains anisotropy conductiving glue of the liquid metal coating particle as conductive filler.According to conduction
Temperature is arranged in the glass transition temperature of glue and the glass transition temperature or fusing point of particle matrix, applies at this temperature to conducting resinl outer
Power (including but not limited to pressure, folding force, pulling force, shearing force etc.), so that being formed between the electrode of upper layer and lower layer substrate conductive
Access, then cooling to restore to room temperature, conducting resinl has good electric conductivity along the direction of external force at this time, and perpendicular to pressure
All directions are in state of insulation.
As conductive filler, (wherein liquid metal coating is simple substance to particle using surface coated with low melting point liquid metal layer
Gallium or one or more mischmetals containing gallium, indium, zinc, bismuth, cadmium, tin, lead, dysprosium, indium etc. are low as the cocrystallizing type of auxiliary element
Melting alloy, fusing point are below 100 degrees Celsius；Particle matrix is the polymer particle matrix of different-grain diameter size, inorganic grain
Subbase matter, metallic matrix etc.) (adhesive can be divided into hot setting adhesive, thermoplastic adhesive and multicomponent with adhesive
Adhesive) it combines, anisotropy conductiving glue obtained is easily processed into type, and has good electric anisotropy and excellent
Cementability.By control preparation process in pressure size and range, can the conducting situation to circuit be effectively controlled,
The anisotropy conductiving glue can be used for traditional circuit-board and flexible circuit board.Adhesive is by host agent (main component of adhesive, master
Lead adhesive adhesive property) and auxiliary agent (auxiliary element of adhesive, in order to assign adhesive specific physicochemical characteristic).Glue
The host agent of stick is the including but not limited to hot setting adhesives such as epoxy resin, polyurethanes, organic silicon；Polyacrylic acid
The thermoplastic adhesives such as class, polymethylacrylic acid；There are also the modified multicomponent gluings such as phenolic aldehyde-epoxy type, epoxy-polyamide type
Agent.The multicomponent adhesive of hot setting adhesive, thermoplastic adhesive and the modification declared below be for commercial product in the market
It is unified, as long as core adhesive composition is identical, i.e., in this patent statement range.Hot setting adhesive includes but is not limited to: ring
Oxygen resinae adhesive, phenolic resin class adhesive, unsaturated polyester (UP) class adhesive, polyurethane tackifier, polyimide
Adhesive, allyl resin class adhesive, alkyd resin class adhesive etc..Thermoplastic adhesive includes but is not limited to: polyethylene
Class adhesive, PP type adhesive, polyvinyl chloride adhesive, crylic acid resin adhesive, polycarbonate-based adhesive
Deng.Modified multicomponent adhesive includes but is not limited to: phenolic aldehyde-epoxy type adhesive, phenolic aldehyde-polyurethane-type adhesive, phenolic aldehyde-
Nitrile rubber type adhesive, phenolic aldehyde-Pioloform, polyvinyl acetal type adhesive, epoxy-polyamide type adhesive etc..The auxiliary agent of adhesive
For include but is not limited to curing agent, initiator, catalyst, promotor, crosslinking agent, diluent, plasticizer, toughener, thickener,
Stabilizer etc..
In order to better illustrate the present invention, it is further elaborated below with reference to example, but the contents of the present invention are not only
It is confined to following example.
Embodiment (for using titanium dioxide nano-particle as the matrix of conductive filler)
Step (1) prepares titanium dioxide nano-particle the leading as anisotropy conductiving glue of surface coating liquid-metal layer
Electric filler
A certain amount of liquid metal and titanium dioxide nano-particle powder are put into mortar, by the method for grinding, made
Liquid metal is completely encapsulated in titanium dioxide nano-particle surface, and (liquid metal of aneroid drop-wise, shows to have mixed in mixture
Entirely), it obtains using titanium dioxide nano-particle as core, liquid metal coating is the core-shell structure of shell, as anisotropy conductiving glue
Conductive filler, room temperature storage is spare.
Step (2) prepares the titanium dioxide nano-particle of surface coating liquid-metal layer and the mixture of adhesive
The titanium dioxide nano-particle that a certain amount of surface is coated with liquid-metal layer is added in adhesive, mixture exists
5min is stirred under 1000rpm, then at room temperature, vacuumizes the bubble removed in mixture, room temperature storage is spare.
Step (3) surface coats anisotropic conductive of the titanium dioxide nano-particle layer of liquid metal as conductive filler
The application method of glue
The liquid metal coated titanium dioxide nanoparticle for removing bubble and adhesive mixture are applied to electrode
Substrate surface, then another piece of substrate with electrode be placed on mixture to (upper layer and lower layer substrate needs precise alignment, it is ensured that up and down
The electrode of two-layer substrate can precise alignment, to guarantee the anisotropy of conducting resinl), formed sandwich sandwich.Through excessively high
Warm curing molding is cooled to room temperature spare.Temperature is arranged according to the glass transition temperature of conducting resinl material, and (temperature is generally greater than glass
Change 30 DEG C of temperature), the pressure perpendicular to sample direction is applied to sample under this temperature environment, it is cold in the case where keeping pressure
But restore to room temperature, obtain anisotropy conductiving glue.Conducting resinl has good electric conductivity on the direction along external force at this time, and
The all directions for remaining perpendicular to external force are in state of insulation (conduction resistance value is lower than 100m Ω).
Although general explanation and specific example above has done detailed description to the present invention, in the present invention
On the basis of the present invention can be realized to bound, the section value of cited raw material and response parameter, just do not do here
Additionally repeat.
Performance test:
Tensile property test: it is carried out by CB/T 1040.3-2006, using SANS E42.503 type microcomputer controlled electronic ten thousand
Energy testing machine is tested in room temperature, and rate of extension 5mm/min, every kind of sample need to test 5 battens, as a result average.It stretches
Toughness can be by carrying out integral acquisition to tensile stress-strain curve.
Compression performance test: it is carried out by CB/T 1040.3-2006, using SANS E42.503 type microcomputer controlled electronic ten thousand
Energy testing machine is tested in room temperature, and compression speed 1mm/min, every kind of sample need to test 5 battens, as a result average.
Shear strength test: CB/T 1040.3-2006 is carried out, omnipotent using SANS E42.503 type microcomputer controlled electronic
Testing machine is tested in room temperature, and rate of extension 10mm/min, every kind of sample need to test 5 battens, as a result average.Shearing is strong
Test sample is spent, as shown in Figure 1:
180 ° of peel strength tests: CB/T 1040.3-2006 is carried out, using SANS E42.503 type microcomputer controlled electronic
Universal testing machine is tested in room temperature, and rate of extension 10mm/min, every kind of sample need to test 5 battens, as a result average.
180 ° of peel strength test samples, as shown in Figure 2:
Impact strength: being tested with shock machine, is carried out according to GB/T 1843-2008, and simply supported beam mode, test are selected
Temperature is room temperature.
Hardness performance analysis: it is tested with Shore durometer, test temperature is room temperature.
Differential scanning calorimeter: it is tested using DSC25TA differential scanning calorimeter.Sample is surveyed in nitrogen protection
Examination, heating rate are 5 DEG C/min, and temperature scanning range is -50-250 DEG C.
Dynamic thermo-mechanical property test: being tested using Q800 type dynamic thermo-mechanical analsis instrument, and test pattern is double outstanding
Arm, for sample having a size of 80mm × 10mm × 4mm, heating rate is 3 DEG C/min, frequency 1Hz, Range of measuring temp 0-200
℃。
Thermogravimetric analysis: being tested using TG 209F1 type thermogravimetric analyzer, and sample is tested in nitrogen protection, heating
Rate is 10 DEG C/min, and temperature scanning range is 25-800 DEG C.
Scanning electron microscope characterization: sample extension test plane of disruption surface topography can pass through FEI Nova Nano SEM
450 scanning electron microscope are tested.
Electric conductivity test: Keysight 34461A uses bifilar mode monitored resistance to change over time at room temperature.Power supply
Line periodicity (NPLC) and measurement range are 0.02 and automatic mode, and measuring option is resistance 2W.Electric wire is by rectangle sample
Two sides are connected to Keysight 34461A.In the above process, all conducting wires are all firmly fixed by insulating tape.
Claims (10)
1. a kind of anisotropy conductiving glue based on particle substrate application liquid metal, it is characterised in that the anisotropy conductiving glue
It is a kind of anisotropy conductiving glue based on particle stromal surface coating liquid-metal layer as conductive filler.
2. the anisotropy conductiving glue according to claim 1 based on particle substrate application liquid metal, it is characterised in that
The particle matrix includes polymer particle matrix, the inorganic particulate matrix, clipped wire subbase that particle size is 1nm~100 μm
Matter surface is formed using particle matrix as core, and liquid metal coating is the core-shell structure of shell, uses mechanical stirring, grinding, sound wave drop
Solution or solvent mixed method realize the formation of core-shell structure.
3. the anisotropy conductiving glue according to claim 1 based on particle substrate application liquid metal, it is characterised in that
The conductive filler is the particle that surface is coated with liquid-metal layer, is using particle matrix as core, liquid metal coating is shell
Core-shell structure；By using the particle matrix of different-grain diameter size and the thickness of control liquid-metal layer, regulate and control conductive filler
Partial size, and then regulate and control anisotropy conductiving glue electric conductivity.
4. the anisotropy conductiving glue according to claim 1 based on particle substrate application liquid metal, it is characterised in that
The liquid-metal layer is Metallic Gallium or one or more element conducts containing gallium, indium, zinc, bismuth, cadmium, tin, lead, dysprosium or indium
The cocrystallizing type low-melting alloy of auxiliary element, fusing point are below 100 degrees Celsius.
5. the anisotropy conductiving glue according to claim 2 based on particle substrate application liquid metal, it is characterised in that
The polymer particle matrix has stable morphosis, through selective polymerization mode and polymerized monomer, from molecular level
Synthesis and preparation are designed, the size and homogeneity of its easily controllable particle prepare surface physical properties and chemistry
Distinct polymer particle.
6. the anisotropy conductiving glue according to claim 2 based on particle substrate application liquid metal, it is characterised in that
The inorganic particulate matrix includes: calcium carbonate nano particle, montmorillonite, Nano particles of silicon dioxide, alumina nanoparticles, two
Titanium oxide nanoparticles, zinc oxide nano-particle；Such inorganic particulate matrix partial size 1nm with good stability and uniform
~100 μm.
7. a kind of preparation side of the anisotropy conductiving glue as described in claim 1 based on particle substrate application liquid metal
Method, it is characterised in that should be the preparation method comprises the following steps: preparing particle stromal surface coating liquid-metal layer as each to different of conductive filler
Property conducting resinl: hot setting adhesive, thermoplastic adhesive and multicomponent adhesive is used to coat liquid metal as adhesive
In particle stromal surface, the particle matrix i.e. conductive filler that surface is coated with liquid metal is mixed into institute by churned mechanically method
In the adhesive stated, the mixture of liquid metal coating particle and adhesive is obtained, bubble is removed, stores for future use；
The mixture of the liquid metal coating particle and adhesive that remove bubble is applied to the substrate surface with electrode, then will be another
One piece of substrate with electrode is placed on mixture, formation sandwich sandwich, in the sandwich sandwich, upper and lower two
Laminar substrate needs precise alignment, it is ensured that the electrode of upper layer and lower layer substrate can precise alignment, to guarantee the anisotropy of conducting resinl；Gu
Chemical conversion type obtains anisotropy conductiving glue of the liquid metal coating particle as conductive filler.
8. the preparation method of the anisotropy conductiving glue according to claim 7 based on particle substrate application liquid metal,
It is characterized in that the adhesive is made of host agent and auxiliary agent, the host agent of adhesive is epoxy resin, polyurethanes, organosilicon
Class hot setting adhesive or polyacrylic, polymethylacrylic acid thermoplastic adhesive or phenolic aldehyde-epoxy type, epoxy-polyamides
The modified multicomponent adhesive of amine type；The auxiliary agent of adhesive is curing agent, initiator, catalyst, promotor, crosslinking agent, dilution
Agent, plasticizer, toughener, thickener or stabilizer.
9. the preparation method of the anisotropy conductiving glue according to claim 7 based on particle substrate application liquid metal,
It is characterized in that the hot setting adhesive includes: epoxy resin tackifier, phenolic resin class adhesive, unsaturated polyester (UP) class
Adhesive, polyurethane tackifier, polyimide adhesive, allyl resin class adhesive or alkyd resin class adhesive；
Thermoplastic adhesive includes: polyethylene kind adhesive, PP type adhesive, polyvinyl chloride adhesive, acrylic acid tree
Lipid adhesive or polycarbonate-based adhesive；
Multicomponent adhesive includes: phenolic aldehyde-epoxy type adhesive, phenolic aldehyde-polyurethane-type adhesive, phenolic aldehyde-nitrile rubber type glue
Stick, phenolic aldehyde-Pioloform, polyvinyl acetal type adhesive or epoxy-polyamide type adhesive.
10. a kind of application of the anisotropy conductiving glue as described in claim 1 based on particle substrate application liquid metal,
It is characterized in that:
According to the glass transition temperature or fusing point of the glass transition temperature of conducting resinl and particle matrix, temperature is set, it is right at this temperature
Conducting resinl applies external force, so that conductive path is formed between the electrode of upper layer and lower layer substrate, then cooling recovery to room temperature, and at this time
Conducting resinl has good electric conductivity along the direction of external force, and is in state of insulation perpendicular to all directions of pressure；
External force is applied to conducting resinl by control, realizes that it has good electric conductivity on the direction along external force, and keep hanging down
It directly is in state of insulation in all directions of external force, conduction resistance value is lower than 100m Ω；Select appropriate force size and power
Range carrys out the conductive extensions on proof stress direction, can achieve the formation of selective conductivity access.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110527468A (en) * | 2019-08-15 | 2019-12-03 | 东南大学 | A kind of preparation and application causing conducting resinl based on one-dimensional, two-dimensional material power |
| CN114561110A (en) * | 2022-03-26 | 2022-05-31 | 常州大学 | Silicon-coated liquid metal nanofiller for preparing silicone rubber composite |
| CN114933867A (en) * | 2022-04-28 | 2022-08-23 | 北京航空航天大学 | Anisotropic conductive adhesive based on liquid metal-porous microsphere skeleton and preparation method thereof |
| CN115216246A (en) * | 2021-04-21 | 2022-10-21 | 南京恩微信息科技有限公司 | Universal conductive adhesive and universal ultralow-resistance reinforced film |
| CN116190337A (en) * | 2023-04-23 | 2023-05-30 | 深圳平创半导体有限公司 | Electronic device and method for manufacturing the same |
| WO2024031510A1 (en) * | 2022-08-11 | 2024-02-15 | 宁德时代新能源科技股份有限公司 | Conductive adhesive connecting tab and pole, and battery containing same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110527468A (en) * | 2019-08-15 | 2019-12-03 | 东南大学 | A kind of preparation and application causing conducting resinl based on one-dimensional, two-dimensional material power |
| CN115216246A (en) * | 2021-04-21 | 2022-10-21 | 南京恩微信息科技有限公司 | Universal conductive adhesive and universal ultralow-resistance reinforced film |
| CN115216246B (en) * | 2021-04-21 | 2024-01-12 | 南京恩微信息科技有限公司 | Universal conductive adhesive and universal ultralow-resistance reinforcing film |
| CN114561110A (en) * | 2022-03-26 | 2022-05-31 | 常州大学 | Silicon-coated liquid metal nanofiller for preparing silicone rubber composite |
| CN114933867A (en) * | 2022-04-28 | 2022-08-23 | 北京航空航天大学 | Anisotropic conductive adhesive based on liquid metal-porous microsphere skeleton and preparation method thereof |
| CN114933867B (en) * | 2022-04-28 | 2023-03-10 | 北京航空航天大学 | Anisotropic conductive adhesive based on liquid metal-porous microsphere skeleton and preparation method thereof |
| WO2024031510A1 (en) * | 2022-08-11 | 2024-02-15 | 宁德时代新能源科技股份有限公司 | Conductive adhesive connecting tab and pole, and battery containing same |
| CN116190337A (en) * | 2023-04-23 | 2023-05-30 | 深圳平创半导体有限公司 | Electronic device and method for manufacturing the same |
| CN116190337B (en) * | 2023-04-23 | 2023-07-14 | 深圳平创半导体有限公司 | Electronic device and method for manufacturing the same |
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