CN110105758A - 一种基于液态金属的电子封装材料的制备及其应用方法 - Google Patents
一种基于液态金属的电子封装材料的制备及其应用方法 Download PDFInfo
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- CN110105758A CN110105758A CN201910404632.7A CN201910404632A CN110105758A CN 110105758 A CN110105758 A CN 110105758A CN 201910404632 A CN201910404632 A CN 201910404632A CN 110105758 A CN110105758 A CN 110105758A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0837—Bismuth
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
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Priority Applications (1)
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CN201910404632.7A CN110105758A (zh) | 2019-05-15 | 2019-05-15 | 一种基于液态金属的电子封装材料的制备及其应用方法 |
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CN201910404632.7A CN110105758A (zh) | 2019-05-15 | 2019-05-15 | 一种基于液态金属的电子封装材料的制备及其应用方法 |
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CN110105758A true CN110105758A (zh) | 2019-08-09 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110923710A (zh) * | 2019-12-16 | 2020-03-27 | 上海揽禾电子有限公司 | 一种基于液态金属的柔性电子加工方法 |
CN114525002A (zh) * | 2022-01-19 | 2022-05-24 | 中国科学院合肥物质科学研究院 | 一种液态金属功能复合薄膜及其制备方法 |
CN115084780A (zh) * | 2022-07-01 | 2022-09-20 | 云南中宣液态金属科技有限公司 | 一种电池隔膜及其制备方法、含有该隔膜的锂离子电池 |
CN115678196A (zh) * | 2022-11-24 | 2023-02-03 | 江苏富勤电子材料有限公司 | 基于液态金属增韧的高分子复合材料及其制备方法 |
CN115948052A (zh) * | 2022-12-29 | 2023-04-11 | 江苏富勤电子材料有限公司 | 基于液态金属-高分子的光热复合材料、其制备方法与用途 |
Citations (7)
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TW569348B (en) * | 2001-09-05 | 2004-01-01 | Bergquist Co | Method of preparing thermally conductive compounds by liquid metal bridged particle clusters |
US20170218167A1 (en) * | 2016-02-02 | 2017-08-03 | Carnegie Mellon University, A Pennsylvania Non-Profit Corporation | Polymer Composite with Liquid Phase Metal Inclusions |
CN107501953A (zh) * | 2017-09-20 | 2017-12-22 | 天津沃尔提莫新材料技术股份有限公司 | 一种含液态金属导热填料的导热硅脂 |
CN108129841A (zh) * | 2017-12-25 | 2018-06-08 | 云南靖创液态金属热控技术研发有限公司 | 一种液态金属绝缘导热材料及其制备方法 |
CN108384327A (zh) * | 2018-04-27 | 2018-08-10 | 国家纳米科学中心 | 拉伸致导电的基于液态金属颗粒的导电油墨、其制备方法及应用 |
CN108447592A (zh) * | 2018-03-02 | 2018-08-24 | 华南理工大学 | 一种基于液态金属的可拉伸柔性功能导体及其制备方法 |
CN108912683A (zh) * | 2018-06-13 | 2018-11-30 | 中国科学院金属研究所 | 基于低熔点金属\导热粒子复合导热网络的热界面材料及其制备方法 |
-
2019
- 2019-05-15 CN CN201910404632.7A patent/CN110105758A/zh active Pending
Patent Citations (7)
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---|---|---|---|---|
TW569348B (en) * | 2001-09-05 | 2004-01-01 | Bergquist Co | Method of preparing thermally conductive compounds by liquid metal bridged particle clusters |
US20170218167A1 (en) * | 2016-02-02 | 2017-08-03 | Carnegie Mellon University, A Pennsylvania Non-Profit Corporation | Polymer Composite with Liquid Phase Metal Inclusions |
CN107501953A (zh) * | 2017-09-20 | 2017-12-22 | 天津沃尔提莫新材料技术股份有限公司 | 一种含液态金属导热填料的导热硅脂 |
CN108129841A (zh) * | 2017-12-25 | 2018-06-08 | 云南靖创液态金属热控技术研发有限公司 | 一种液态金属绝缘导热材料及其制备方法 |
CN108447592A (zh) * | 2018-03-02 | 2018-08-24 | 华南理工大学 | 一种基于液态金属的可拉伸柔性功能导体及其制备方法 |
CN108384327A (zh) * | 2018-04-27 | 2018-08-10 | 国家纳米科学中心 | 拉伸致导电的基于液态金属颗粒的导电油墨、其制备方法及应用 |
CN108912683A (zh) * | 2018-06-13 | 2018-11-30 | 中国科学院金属研究所 | 基于低熔点金属\导热粒子复合导热网络的热界面材料及其制备方法 |
Non-Patent Citations (1)
Title |
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耿旺昌: "《工程化学基础》", 30 September 2017, 西北工业大学出版社 * |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110923710A (zh) * | 2019-12-16 | 2020-03-27 | 上海揽禾电子有限公司 | 一种基于液态金属的柔性电子加工方法 |
CN114525002A (zh) * | 2022-01-19 | 2022-05-24 | 中国科学院合肥物质科学研究院 | 一种液态金属功能复合薄膜及其制备方法 |
CN114525002B (zh) * | 2022-01-19 | 2023-09-22 | 中国科学院合肥物质科学研究院 | 一种液态金属功能复合薄膜及其制备方法 |
CN115084780A (zh) * | 2022-07-01 | 2022-09-20 | 云南中宣液态金属科技有限公司 | 一种电池隔膜及其制备方法、含有该隔膜的锂离子电池 |
CN115084780B (zh) * | 2022-07-01 | 2024-02-13 | 云南中宣液态金属科技有限公司 | 一种电池隔膜及其制备方法、含有该隔膜的锂离子电池 |
CN115678196A (zh) * | 2022-11-24 | 2023-02-03 | 江苏富勤电子材料有限公司 | 基于液态金属增韧的高分子复合材料及其制备方法 |
CN115948052A (zh) * | 2022-12-29 | 2023-04-11 | 江苏富勤电子材料有限公司 | 基于液态金属-高分子的光热复合材料、其制备方法与用途 |
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Effective date of registration: 20191219 Address after: 211400, Jiangsu City, Yangzhou province Yizheng Liu Zhen Pangu industrial concentration zone Applicant after: YANGZHOU FOREWELL COMPOSITE MATERIALS CO.,LTD. Address before: 211102 No. 2, Southeast University Road, Jiangning District, Jiangsu, Nanjing Applicant before: Southeast University |
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Effective date of registration: 20200828 Address after: Room 301-302, building 10, phase I, Jingang Science Park, No.1 Kechuang Road, Yaohua street, Qixia District, Nanjing City, Jiangsu Province 210000 Applicant after: Jiangsu Fuwei Electronic Material Technology Co.,Ltd. Address before: 211400, Jiangsu City, Yangzhou province Yizheng Liu Zhen Pangu industrial concentration zone Applicant before: YANGZHOU FOREWELL COMPOSITE MATERIALS Co.,Ltd. |
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Address after: 210000 rooms 301-302, building 10, phase I, Jingang Science Park, No.1 Kechuang Road, Yaohua street, Qixia District, Nanjing City, Jiangsu Province Applicant after: Jiangsu Fuqin Electronic Material Co.,Ltd. Address before: 210000 rooms 301-302, building 10, phase I, Jingang Science Park, No.1 Kechuang Road, Yaohua street, Qixia District, Nanjing City, Jiangsu Province Applicant before: Jiangsu Fuwei Electronic Material Technology Co.,Ltd. |
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Application publication date: 20190809 |