CN110246776B - Chemical liquid control valve and substrate processing apparatus - Google Patents
Chemical liquid control valve and substrate processing apparatus Download PDFInfo
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- CN110246776B CN110246776B CN201910117565.0A CN201910117565A CN110246776B CN 110246776 B CN110246776 B CN 110246776B CN 201910117565 A CN201910117565 A CN 201910117565A CN 110246776 B CN110246776 B CN 110246776B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Fluid-Driven Valves (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Valve Housings (AREA)
- Lift Valve (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Multiple-Way Valves (AREA)
Abstract
The invention provides a chemical liquid control valve and a substrate processing apparatus capable of improving the replacement characteristic of chemical liquid. The flow path block (21) has a 1 st outer wall (21 a) and a 2 nd outer wall (21 b) which is a surface perpendicular to the 1 st outer wall (21 a). A flow rate adjustment valve chamber (27) in which the needle (41) is disposed is formed so that a 1 st outer wall (21 a) of the flow path block (21) is recessed. On the other hand, the opening/closing valve chamber (29) in which the diaphragm (51) is disposed is formed so that the 2 nd outer wall (21 b) is recessed. An intermediate flow path (31) connects the flow rate adjustment valve chamber (27) and the opening/closing valve chamber (29), and the intermediate flow path (31) extends at right angles to either the 1 st outer wall (21 a) or the 2 nd outer wall (21 b). With this configuration, the intermediate flow path (31) can be formed linearly. Therefore, the replacement property of the chemical liquid, which may deteriorate due to the V-shaped flow path or the like, can be improved.
Description
Technical Field
The present invention relates to a chemical liquid control valve for controlling a chemical liquid supplied to a substrate such as a semiconductor substrate, a Flat Panel Display (FPD) substrate such as a liquid crystal Display (lcd) device or an organic EL (electroluminescence) Display device, a photomask glass substrate, an optical disk substrate, a magnetic disk substrate, a ceramic substrate, or a solar cell substrate, and a substrate processing apparatus including the same.
Background
As shown in fig. 7, a conventional chemical liquid control valve 201 includes a flow rate regulating valve 202 and an ON-OFF valve (ON/OFF valve) 203 (see, for example, patent documents 1 and 2). The flow rate adjustment valve 202 adjusts the flow rate of the supplied chemical liquid. On the other hand, the on-off valve 203 supplies the chemical liquid and stops the supply of the chemical liquid. The flow rate adjustment valve 202 and the opening/closing valve 203 are connected by a V-shaped flow path 205 or an arc-shaped flow path described in patent document 2 (hereinafter referred to as "V-shaped flow path 205 or the like"). Therefore, the chemical liquid fed from the flow rate adjustment valve 202 is fed to the on-off valve 203 through the V-shaped flow path 205 or the like.
[ background Art document ]
[ patent document ]
[ patent document 1]
Japanese patent laid-open No. 2001-263507
[ patent document 2]
Japanese patent laid-open publication No. 2017-207121
Disclosure of Invention
[ problems to be solved by the invention ]
Such a conventional chemical liquid control valve 201 has the following problems. As described above, the chemical liquid fed from the flow rate adjustment valve 202 is fed to the on-off valve 203 through the V-shaped flow path 205 and the like. If the chemical liquid is passed through the V-shaped flow path 205 or the like, the substitution property of the chemical liquid from the inlet to the outlet of the chemical liquid control valve 201 may deteriorate. If the substitution property of the chemical liquid is poor, there is a possibility that dirt is generated in the liquid by the retained previous chemical liquid. Therefore, it is preferable to improve the replacement property of the chemical liquid in the chemical liquid control valve 201.
The present invention has been made in view of such circumstances, and an object thereof is to provide a chemical liquid control valve capable of improving the replacement property of a chemical liquid, and a substrate processing apparatus including the same.
[ means for solving problems ]
To achieve the above object, the present invention adopts the following configuration. That is, the chemical liquid control valve of the present invention includes: a single flow path block having a 1 st outer wall and a 2 nd outer wall which is a surface perpendicular to the 1 st outer wall; a flow rate adjustment valve chamber formed in such a manner that the 1 st outer wall is recessed; an opening/closing valve chamber formed so that the 2 nd outer wall is recessed; an intermediate flow path formed in a straight line inside the flow path block, connecting the flow rate adjustment valve chamber and the opening/closing valve chamber, and extending at right angles to either the 1 st outer wall or the 2 nd outer wall; a 1 st flow path formed inside the flow path block and connected to the flow rate adjustment valve chamber; a 2 nd flow path formed inside the flow path block and connected to the opening/closing valve chamber; a needle moving mechanism having a needle disposed in the flow rate adjustment valve chamber, closing the flow rate adjustment valve chamber, and moving the needle to adjust a flow rate of the chemical liquid; and an opening/closing valve body moving mechanism having an opening/closing valve body disposed in the opening/closing valve chamber, closing the opening/closing valve chamber, and moving the opening/closing valve body to stop the supply of the chemical liquid and the supply thereof.
According to the chemical liquid control valve of the present invention, the flow path block has the 1 st outer wall and the 2 nd outer wall which is a surface perpendicular to the 1 st outer wall. The flow rate adjusting valve chamber in which the needle is disposed is formed so that the 1 st outer wall of the flow path block is recessed. On the other hand, the opening/closing valve chamber in which the opening/closing valve body is disposed is formed so that the 2 nd outer wall is recessed. The intermediate flow path connects the flow rate adjustment valve chamber and the opening/closing valve chamber, and extends at right angles to either the 1 st outer wall or the 2 nd outer wall. With this configuration, the intermediate flow path can be formed linearly. Therefore, the replacement property of the chemical liquid, which may deteriorate due to the V-shaped flow path or the like, can be improved.
Further, the chemical liquid control valve of the present invention includes: a single flow path block having a 1 st outer wall and a 2 nd outer wall which is a surface facing the 1 st outer wall and parallel to the 1 st outer wall; a flow rate adjustment valve chamber formed in such a manner that the 1 st outer wall is recessed; an opening/closing valve chamber formed so that the 2 nd outer wall is recessed; an intermediate flow path formed in the flow path block in a straight line shape, connecting the flow rate adjusting valve chamber and the opening/closing valve chamber, and extending at right angles to the 1 st outer wall and the 2 nd outer wall; a 1 st flow path formed inside the flow path block and connected to the flow rate adjustment valve chamber; a 2 nd flow path formed inside the flow path block and connected to the opening/closing valve chamber; a needle moving mechanism having a needle disposed in the flow rate adjustment valve chamber, closing the flow rate adjustment valve chamber, and moving the needle to adjust a flow rate of the chemical liquid; and an opening/closing valve body moving mechanism having an opening/closing valve body disposed in the opening/closing valve chamber, closing the opening/closing valve chamber, and moving the opening/closing valve body to stop the supply of the chemical liquid and the supply thereof.
According to the chemical liquid control valve of the present invention, the flow path block has the 1 st outer wall and the 2 nd outer wall which is a surface facing the 1 st outer wall and parallel to the 1 st outer wall. The flow rate adjustment valve chamber in which the needle is disposed is formed so that the 1 st outer wall of the flow path block is recessed. On the other hand, the opening/closing valve chamber in which the opening/closing valve body is disposed is formed such that the 2 nd outer wall is recessed. The intermediate flow passage connects the flow rate adjustment valve chamber and the opening/closing valve chamber, and extends at right angles to the 1 st outer wall and the 2 nd outer wall. With this configuration, the intermediate flow path can be formed linearly. Therefore, the replacement property of the chemical liquid, which may deteriorate due to the V-shaped flow path or the like, can be improved.
In the chemical liquid control valve, it is preferable that the 1 st channel and the 2 nd channel each have a straight shape and extend at right angles to the intermediate channel. When the material is poured into the mold to form the flow path block, the 1 st pin member inserted into the mold to form the intermediate flow path, and the 2 nd pin member and the 3 rd pin member inserted into the mold to form the 1 st flow path and the 2 nd flow path can be arranged at right angles. Therefore, the intermediate flow path, the 1 st flow path, and the 2 nd flow path can be easily formed as compared with a case where the 1 st pin member is disposed obliquely (not at right angles) to each of the 2 nd pin member and the 3 rd pin member.
In the chemical liquid control valve, it is preferable that the 1 st flow path is parallel to the 2 nd flow path, and a 1 st connection port of the 1 st flow path, which is opposite to a portion connected to the flow rate adjustment valve chamber, opens in the same direction as a 2 nd connection port of the 2 nd flow path, which is opposite to a portion connected to the opening/closing valve chamber. When a material is poured into a mold to form a flow path block, the 2 nd pin member and the 3 rd pin member inserted into the mold to form the 1 st flow path and the 2 nd flow path can be moved in the same direction. Therefore, the 1 st flow path and the 2 nd flow path can be easily formed as compared with the case where the 2 nd pin member is inserted into the mold in a direction different from the direction of the 3 rd pin member.
In addition, in the chemical liquid control valve, it is preferable that the flow path block is formed of PFA (perfluoroalkoxy alkane). If the flow path block is formed of PFA, the surface of the flow path block is covered with a surface layer which is a harder layer (film) than the inside thereof. If the chemical liquid penetrates into the inside of the flow path block, as a result, there is a concern that contaminants may be drawn out from the inside of the flow path block. However, since the surface layer prevents the penetration of the chemical liquid, it is possible to suppress the possibility of deterioration in the purity of the chemical liquid.
Further, a substrate processing apparatus according to the present invention includes: a holding and rotating unit that holds a substrate and rotates the held substrate; a nozzle configured to discharge a chemical liquid onto the substrate held by the holding/rotating unit; a chemical liquid pipe connected to the nozzle; and a chemical liquid control valve for adjusting the flow rate of the chemical liquid ejected from the nozzle, and for causing the chemical liquid to be ejected from the nozzle, and stopping the ejection of the chemical liquid; the chemical liquid control valve includes: a single flow path block having a 1 st outer wall and a 2 nd outer wall which is a surface perpendicular to the 1 st outer wall; a flow rate adjustment valve chamber formed so that the 1 st outer wall is recessed; an opening/closing valve chamber formed so that the 2 nd outer wall is recessed; an intermediate flow path formed in the flow path block in a straight line shape, connecting the flow rate adjusting valve chamber and the opening/closing valve chamber, and extending at right angles to either the 1 st outer wall or the 2 nd outer wall; a 1 st flow path formed inside the flow path block and connected to the flow rate adjustment valve chamber; a 2 nd flow path formed inside the flow path block, connected to the opening/closing valve chamber, and connected to the nozzle via the chemical liquid pipe; a needle moving mechanism having a needle disposed in the flow rate adjustment valve chamber, closing the flow rate adjustment valve chamber, and moving the needle to adjust a flow rate of the chemical liquid; and an opening/closing valve body moving mechanism having an opening/closing valve body disposed in the opening/closing valve chamber, closing the opening/closing valve chamber, and moving the opening/closing valve body to stop the supply of the chemical liquid and the supply thereof.
The substrate processing apparatus according to the present invention includes a chemical liquid control valve. In the chemical liquid control valve, the flow path block has a 1 st outer wall and a 2 nd outer wall which is a surface perpendicular to the 1 st outer wall. The flow rate adjusting valve chamber in which the needle is disposed is formed so that the 1 st outer wall of the flow path block is recessed. On the other hand, the opening/closing valve chamber in which the opening/closing valve body is disposed is formed so that the 2 nd outer wall is recessed. The intermediate flow path connects the flow rate adjustment valve chamber and the opening/closing valve chamber, and extends at right angles to either the 1 st outer wall or the 2 nd outer wall. With this configuration, the intermediate flow path can be formed linearly. Therefore, the replacement property of the chemical liquid, which may deteriorate due to the V-shaped flow path or the like, can be improved.
Further, a substrate processing apparatus according to the present invention includes: a holding and rotating unit that holds a substrate and rotates the held substrate; a nozzle configured to discharge a chemical liquid onto the substrate held by the holding/rotating unit; a chemical liquid pipe connected to the nozzle; and a chemical liquid control valve for adjusting the flow rate of the chemical liquid ejected from the nozzle, and causing the chemical liquid to be ejected from the nozzle and stopping the ejection of the chemical liquid; the chemical liquid control valve includes: a single flow path block having a 1 st outer wall and a 2 nd outer wall which is a surface facing the 1 st outer wall and parallel to the 1 st outer wall; a flow rate adjustment valve chamber formed in such a manner that the 1 st outer wall is recessed; an opening/closing valve chamber formed in such a manner that the 2 nd outer wall is recessed; an intermediate flow path formed in the flow path block in a straight line shape, connecting the flow rate adjusting valve chamber and the opening/closing valve chamber, and extending at right angles to the 1 st outer wall and the 2 nd outer wall; a 1 st flow path formed inside the flow path block and connected to the flow rate adjustment valve chamber; a 2 nd flow path formed inside the flow path block, connected to the opening/closing valve chamber, and connected to the nozzle through the chemical liquid pipe; a needle moving mechanism having a needle disposed in the flow rate adjustment valve chamber, closing the flow rate adjustment valve chamber, and moving the needle to adjust a flow rate of the chemical liquid; and an opening/closing valve body moving mechanism having an opening/closing valve body disposed in the opening/closing valve chamber, closing the opening/closing valve chamber, and moving the opening/closing valve body to stop the supply of the chemical liquid and the supply thereof.
The substrate processing apparatus according to the present invention includes a chemical liquid control valve. In the chemical liquid control valve, the flow path block has a 1 st outer wall and a 2 nd outer wall which is a surface facing the 1 st outer wall and parallel to the 1 st outer wall. The flow rate adjustment valve chamber in which the needle is disposed is formed so that the 1 st outer wall of the flow path block is recessed. On the other hand, the opening/closing valve chamber in which the opening/closing valve body is disposed is formed such that the 2 nd outer wall is recessed. The intermediate flow passage connects the flow rate adjustment valve chamber and the opening/closing valve chamber, and extends at right angles to the 1 st outer wall and the 2 nd outer wall. With this configuration, the intermediate flow path can be formed linearly. Therefore, the replacement characteristic of the chemical liquid, which may deteriorate due to the V-shaped flow path or the like, can be improved.
The present specification also discloses the following invention of a method for manufacturing a chemical liquid control valve.
(1) The method for manufacturing a chemical liquid control valve of the present invention is characterized by comprising the steps of: preparing a pair of molds having a 1 st inner wall and a 2 nd inner wall which is a surface perpendicular to the 1 st inner wall in an internal space, and having: a 1 st projecting portion provided on the 1 st inner wall to form a flow rate adjustment valve chamber; a 2 nd protrusion part provided on the 2 nd inner wall to form an opening/closing valve chamber; and a linear 1 st pin member which connects the 1 st projection and the 2 nd projection and is inserted in a direction extending at right angles to either the 1 st inner wall or the 2 nd inner wall; inserting a linear 2 nd pin member into the internal space so as to be connected to the 1 st projection; inserting a linear 3 rd pin member into the inner space so as to be connected to the 2 nd projection; after the 2 nd pin member and the 3 rd pin member are inserted into the internal space, causing the resin melted by heating to flow into the internal space; and removing the resin that has flowed into the internal space from the pair of molds after the resin is cooled and solidified.
According to the method for manufacturing the chemical liquid control valve of the present invention, the pair of molds has the 1 st inner wall and the 2 nd inner wall which is a surface perpendicular to the 1 st inner wall in the inner space. The pair of molds has: a 1 st protruding part provided on the 1 st inner wall to form a flow rate adjustment valve chamber; a 2 nd protrusion part provided on the 2 nd inner wall to form an opening/closing valve chamber; and a linear 1 st pin member which connects the 1 st projection and the 2 nd projection and is inserted in a direction extending at right angles to either the 1 st inner wall or the 2 nd inner wall. By forming the flow path block in such a configuration, the intermediate flow path can be formed linearly. Therefore, the replacement property of the chemical liquid, which may deteriorate due to the V-shaped flow path or the like, can be improved. In the conventional chemical liquid control valve, the V-shaped flow path is formed by cutting in two directions from the flow rate adjusting valve chamber and the opening/closing valve chamber after formation. According to the present invention, the straight intermediate flow path 31 can be formed without cutting.
[ Effect of the invention ]
According to the chemical liquid control valve and the substrate processing apparatus including the same of the present invention, the replacement characteristic of the chemical liquid can be improved.
Drawings
FIG. 1 is a schematic configuration diagram of a substrate processing apparatus according to an embodiment.
FIG. 2 is a schematic configuration diagram of a chemical liquid control valve according to an embodiment.
Fig. 3 (a) is a cross-sectional view of a pair of molds in the XY direction, and (b) is a longitudinal sectional view of the pair of molds in the XZ direction.
FIG. 4 is a schematic configuration diagram of a chemical liquid control valve according to a modification.
Fig. 5 (a) and (b) are schematic configuration diagrams of a chemical liquid control valve according to a modification.
Fig. 6 (a) and (b) are schematic configuration diagrams of a chemical liquid control valve according to a modification.
Fig. 7 is a schematic configuration diagram of a conventional chemical liquid control valve.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic configuration diagram of a substrate processing apparatus according to an embodiment. FIG. 2 is a schematic configuration diagram of a chemical liquid control valve according to an embodiment.
< construction of substrate processing apparatus 1 >
Refer to fig. 1. The substrate processing apparatus 1 includes a nozzle 2 and a holding and rotating unit 3. The nozzle 2 discharges the chemical liquid onto the substrate W held by the holding and rotating unit 3. The chemical liquid is, for example, a resist liquid, a coating liquid for antireflection film formation, a solvent such as a diluent, a rinse liquid such as deionized water (DIW), a developing solution, or an etching solution.
The holding and rotating unit 3 holds the substrate W and rotates the held substrate W. The holding and rotating unit 3 includes a spin chuck 4 and a rotation driving unit 5. The spin chuck 4 is configured to be rotatable around a rotation axis AX. The spin chuck 4 holds the substrate W in a substantially horizontal posture by, for example, vacuum-sucking the back surface of the substrate W. On the other hand, the rotation driving unit 5 drives the spin chuck 4 to rotate about the rotation axis AX. The rotation driving unit 5 includes an electric motor and the like.
The substrate processing apparatus 1 includes a chemical liquid supply source 7, chemical liquid pipes 8a and 8b, a pump P, and a chemical liquid control valve 9. The chemical liquid supply source 7 includes, for example, a tank or a bottle for storing the chemical liquid. The chemical liquid pipes 8a and 8b have one end connected to the chemical liquid supply source 7 and the other end connected to the nozzle 2.
A pump P is provided in a chemical liquid pipe 8a between the chemical liquid supply source 7 and the nozzle 2. Chemical liquid control valves 9 are provided in the chemical liquid pipes 8a and 8b between the pump P and the nozzle 2. The pump P is a mechanism for delivering the chemical liquid. The chemical liquid control valve 9 adjusts the flow rate of the chemical liquid discharged from the nozzle 2, and discharges the chemical liquid from the nozzle 2 to stop the discharge of the chemical liquid. Details of the chemical liquid control valve 9 will be described later. Further, at least one of a foreign matter removal filter and a suck-back valve for preventing liquid from dripping may be provided in the chemical liquid pipes 8a and 8b.
The substrate processing apparatus 1 includes 1 or 2 or more control units 11 and an operation unit 13. The control unit 11 includes a Central Processing Unit (CPU). The controller 11 controls the respective configurations of the substrate processing apparatus 1 and the chemical liquid control valve 9. The operation unit 13 includes an input unit, a display unit, and a storage unit. The storage unit includes a ROM (Read-only Memory), a RAM (Random Access Memory), a hard disk, and the like. The storage unit stores various conditions for substrate processing, for example.
< construction of chemical liquid control valve 9 >
Reference is made to fig. 2. The chemical liquid control valve 9 includes a single flow path block 21, a needle moving mechanism 23, and an opening/closing valve body moving mechanism 25.
The flow path block 21 is formed of a resin such as a thermoplastic fluororesin having melt fluidity, for example, PFA. The passage block 21 may be formed of a fluororesin such as PTFE (polytetrafluoroethylene).
Further, the flow path block 21 is preferably formed of PFA. If the flow path block 21 is formed of PFA by injection molding, the surface of the flow path block 21 is covered with a surface layer which is a harder layer (film) than the inside thereof. If the chemical liquid penetrates into the inside of the flow path block 21, as a result, there is a concern that dirt may be drawn out from the inside of the flow path block 21. However, since the surface layer prevents the penetration of the chemical liquid, it is possible to suppress the possibility of deterioration in the purity of the chemical liquid.
The flow path block 21 has a 1 st outer wall (surface) 21a and a 2 nd outer wall (surface) 21b. The 2 nd outer wall 21b is a surface substantially perpendicular to the 1 st outer wall 21a. A flow rate adjustment valve chamber 27 is provided in the 1 st outer wall (outer surface) 21a of the passage block 21. An opening/closing valve chamber 29 is provided in a 2 nd outer wall (outer surface) 21b of the passage block 21. The flow rate adjustment valve chamber 27 is formed so that a part of the 1 st outer wall 21a is recessed. That is, the flow rate adjustment valve chamber 27 is formed in the 1 st outer wall 21a in a concave shape. The opening/closing valve chamber 29 is formed so that a part of the 2 nd outer wall 21b is recessed. That is, the opening/closing valve chamber 29 is formed in a recessed shape on the 2 nd outer wall 21b of the flow path block 21.
The intermediate flow path 31, the 1 st flow path 33, and the 2 nd flow path 35 are formed inside the flow path block 21. The intermediate channel 31, the 1 st channel 33, and the 2 nd channel 35 are formed in a straight line. The intermediate flow passage 31 is formed to connect the flow rate adjustment valve chamber 27 and the opening/closing valve chamber 29. The intermediate flow path 31 is formed to extend substantially at right angles to the 2 nd outer wall 21b.
One end of the 1 st flow path 33 is connected to the flow rate adjustment valve chamber 27. The other end of the 1 st channel 33 is connected to a chemical liquid pipe 8a provided with a pump P as the outside of the channel block 21. One end of the 2 nd flow passage 35 is connected to the opening/closing valve chamber 29. The other end of the 2 nd flow path 35 is connected to a chemical liquid pipe 8b provided with a nozzle 2 as the outside of the flow path block 21. That is, the 2 nd flow path 35 is connected to the nozzle 2 via the chemical liquid pipe 8b.
The 1 st channel 33 and the 2 nd channel 35 are formed to extend at right angles to the intermediate channel 31. In addition, the 1 st channel 33 is parallel to the 2 nd channel 35. The 1 st connection port 37 of the 1 st flow path 33, which is opposite to the portion connected to the flow rate adjustment valve chamber 27, opens in the same direction as the 2 nd connection port 39 of the 2 nd flow path 35, which is opposite to the portion connected to the opening/closing valve chamber 29. That is, the 1 st channel 33 and the 2 nd channel 35 are formed so that the direction of the chemical liquid passing through the 1 st channel 33 is opposite to the direction of the chemical liquid passing through the 2 nd channel 35.
The needle moving mechanism 23 is attached to the flow path block 21. The needle moving mechanism 23 has a needle 41. The needle moving mechanism 23 is configured to close the flow rate adjustment valve chamber 27 and move the needle 41 to adjust the flow rate of the chemical liquid.
In fig. 2, the flow rate adjustment valve chamber 27 has a 1 st extension flow path 40a. The 1 st extended flow path 40a is provided on, for example, an inner wall other than the bottom of the flow rate adjustment valve chamber 27. The intermediate flow path 31 is connected to the 1 st extension flow path 40a, and the intermediate flow path 31 is connected to the flow rate adjustment valve chamber 27. The opening/closing valve chamber 29 has a 2 nd extended flow path 40b. The 2 nd extended flow path 40b is provided in the bottom of the opening/closing valve chamber 29. The 2 nd flow path 35 is connected to the 2 nd extended flow path 40b, and the 2 nd flow path 35 is connected to the opening/closing valve chamber 29.
The needle moving mechanism 23 includes a cover 43, an electric motor 45, and a conversion mechanism 47 in addition to the needle 41. The needle 41 is disposed in the flow rate adjustment valve chamber 27. The needle 41 is disposed so as to face the opening 49 provided in the flow rate adjustment valve chamber 27. The opening 49 is formed in a circular shape. The opening 49 is connected to the 1 st channel 33. The tip portion 41a of the needle 41 is formed in a conical shape. The conical tip portion 41a of the needle 41 passes through the opening 49. That is, the gap between the conical tip portion 41a and the opening 49 is adjusted by moving the needle 41 in the lateral direction (X direction) (see fig. 2). Thereby, the flow rate of the chemical liquid flowing through the gap is adjusted. The cover 43 is configured to pass through the needle 41. The cover 43 closes the flow rate adjustment valve chamber 27.
The needle 41 is driven by an electric motor 45. The electric motor 45 includes, for example, a stepping motor or a servo motor. When the electric motor 45 includes a servo motor, a sensor such as a rotary encoder is provided, and therefore, the lateral movement amount or position of the needle 41 can be accurately obtained. The conversion mechanism 47 is provided between the electric motor 45 and the needle 41, and converts rotation output from the electric motor 45 into linear movement of the needle 41. The conversion mechanism 47 is configured to have a screw shaft and a guide portion, for example.
The opening/closing valve body moving mechanism 25 is attached to the flow path block 21. The opening/closing valve body moving mechanism 25 includes a diaphragm 51. The valve body moving mechanism 25 is configured to close the valve chamber 29 and move the diaphragm 51 to open and close the 2 nd flow path 35. The diaphragm 51 corresponds to the valve element for opening and closing of the present invention.
The valve body moving mechanism 25 includes a cover 53, a movable member 55, a partition wall 57, a movable partition member 59, a spring 61, an intake/exhaust port 63, and an adjustment screw 65 in addition to the diaphragm 51.
The separator 51 contains a fluororesin such as PTFE or PFA, for example. The peripheral edge of the diaphragm 51 is fixed to the inner wall of the opening/closing valve chamber 29. The diaphragm 51 separates the valve seat 75 side and the partition wall 57 side described below across the vertical movement direction of the diaphragm 51. The thick portion 51a at the center of the diaphragm 51 is fixed to the movable member 55. The cover 53 closes the opening/closing valve chamber 29.
A disc-shaped partition wall 57 is provided on the inner side wall of the cover 53. The partition wall 57 partitions the movable partition member 59 side from the diaphragm 51 side. The movable member 55 is inserted into the center of the partition wall 57. The movable member 55 can slide relative to the partition wall 57. The movable partition member 59 is fixed to the movable member 55 on the opposite side of the diaphragm 51. The movable partition member 59 is slidable with respect to the inner side wall of the cover 53. The movable partition member 59 partitions the spring 61 side and the partition wall 57 side. The contact portion between the movable member 55 and the partition wall 57 and the contact portion between the movable partition member 59 and the inner wall of the cover 53 are sealed.
The spring 61 is disposed between the top wall 53a of the cover 53 and the movable partition member 59. The spring 61 is provided so as to be pressed always downward (in the direction in which the diaphragm 51 exists). The intake/exhaust port 63 is an opening for allowing air to enter and exit a space between the movable partition member 59 and the partition wall 57 in the cover 53. The gas pipe 67 connects a gas supply source 69 such as a gas bomb or a pipe in a factory to the intake/exhaust port 63. The gas pipe 67 is provided with, for example, a three-way valve 71. The three-way valve 71 selectively switches between supplying gas from the gas supply source 69 into the cover 53 and discharging gas from the cover 53.
The adjustment screw portion 65 has a male thread 65a. The male screw 65a is configured to engage with a female screw 53b provided near a top wall 53a of the cover 53. The adjustment screw portion 65 is separated from the movable partition member 59. The upward movement of the movable partition member 59, the movable member 55, the thick portion 51a of the diaphragm 51, and the like is restricted by the position of the male screw 65a. The opening 73 is connected to the 2 nd flow channel 35. The valve seat 75 is provided around the opening 73 and receives the thick portion 51a of the diaphragm 51.
< method for manufacturing chemical liquid control valve 9 >
Next, an example of a method for manufacturing the chemical liquid control valve 9 will be described. Fig. 3 (a) is a cross-sectional view of a pair of molds in the XY directions. Fig. 3 (b) is a longitudinal sectional view of a pair of molds in the XZ direction. Fig. 3 (b) is a longitudinal sectional view of the 1 st projection 87 and the 2 nd pin member 90 in fig. 3 (a).
Step S01 step of preparing a pair of molds 81 and 82
A pair of molds 81 and 82 is prepared. If the pair of molds 81, 82 are disposed to face each other, an internal space 83 is formed in the pair of molds 81, 82. In fig. 3 (a) and 3 (b), hatching with a bold space and a right underline is the internal space 83. The internal space 83 is a space filled with resin. The pair of molds 81 and 82 has a 1 st inner wall (surface) 85 and a 2 nd inner wall (surface) 86 in the internal space 83. The 2 nd inner wall 86 is a surface substantially perpendicular to the 1 st inner wall 85.
The pair of dies 81 and 82 includes a 1 st projection 87 for forming the flow rate adjustment valve chamber 27, a 2 nd projection 88 for forming the opening/closing valve chamber 29, and a 1 st straight pin member 89 for forming the intermediate flow path 31. The 1 st protruding portion 87 is provided on the 1 st inner wall 85 of the inner space 83 in the pair of molds 81, 82. The 1 st protrusion 87 is provided with a 1 st connecting protrusion 87a corresponding to the 1 st extended channel 40a. The 2 nd projection 88 is provided on the 2 nd inner wall 86. The 2 nd protrusion 88 is provided with a 2 nd connecting protrusion 88a corresponding to the 2 nd extended flow path 40b.
The 1 st pin member 89 is inserted in a direction extending substantially at right angles to the 2 nd inner wall 86 so as to connect the 1 st protruding portion 87 and the 2 nd protruding portion 88. The 1 st projection 87 is movable in the lateral direction (X direction). The 1 st projection 87 is inserted into the inner space 83 of the pair of molds 81, 82. As shown in fig. 3 (a), the 2 nd protrusion 88 is formed integrally with the 1 st pin member 89. The integrated 2 nd projecting portion 88 and 1 st pin member 89 are movable in the longitudinal direction (Y direction) and inserted into the internal space 83 of the pair of molds 81 and 82. The front end portion 89a of the 1 st pin member 89 contacts the 1 st connecting protrusion 87a of the 1 st protrusion 87.
The 2 nd projecting portion 88 and the 1 st pin member 89 may not be integrally formed but may be configured to move independently.
Step S02 step of inserting the 2 nd pin member 90
A linear 2 nd pin member 90 is inserted into the internal space 83 so as to be connected to the 1 st projection 87. The 2 nd pin member 90 is movable in the lateral direction (X direction). The tip 90a of the 2 nd pin member 90 contacts the 1 st projection 87. The 2 nd pin member 90 is used to form the 1 st flow path 33.
Step S03 step of inserting the 3 rd pin member 91
A linear 3 rd pin member 91 is inserted into the internal space 83 so as to be connected to the 2 nd projection 88. The 3 rd pin member 91 is movable in the lateral direction (X direction). The tip 91a of the 3 rd pin member 91 contacts the 2 nd connecting projection 88a of the 2 nd projecting portion 88. The 3 rd pin member 91 is used to form the 2 nd flow path 35.
Step S04 step of flowing resin
After the 1 st protruding portion 87, the 2 nd protruding portion 88, the 1 st pin member 89, the 2 nd pin member 90, and the 3 rd pin member 91 are inserted into the internal space 83 (i.e., after steps S01 to S03), a resin (e.g., PFA) melted by heating is caused to flow into the internal space 83. The resin in the heating cylinder of the injection molding machine, not shown, is melted by heating. That is, the resin flowing into the pair of molds 81 and 82 is fluidized by heating. Then, the heated air is flowed into the internal space 83 of the pair of dies 81 and 82.
Step S05 for detaching flow path block (molded article)
After the resin flowing into the internal space 83 is cooled and solidified, the 1 st projection 87, the 2 nd projection 88, the 1 st pin member 89, the 2 nd pin member 90, and the 3 rd pin member 91 are extracted from the pair of molds 81 and 82. Thereafter, the resin is discharged from the pair of dies 81 and 82 as a single passage block 21. This removal is performed by relatively moving the pair of dies 81 and 82 in the vertical direction (the Z direction in fig. 3 (b)). The resin that has flowed into the internal space 83 forms a skin layer at the portions that come into contact with the inner walls ( reference numerals 85 and 86, etc.) of the pair of molds 81 and 82, the 1 st projection 87, the 2 nd projection 88, the 1 st pin member 89, the 2 nd pin member 90, and the 3 rd pin member 91.
[ step S06] step of mounting needle moving mechanism and valve body moving mechanism for opening and closing
The passage block 21 removed from the pair of dies 81 and 82 is subjected to a process for polishing the surfaces of the opening 49 and the valve seat 75 shown in fig. 2. Then, the components such as the needle moving mechanism 23 and the opening/closing valve body moving mechanism 25 are mounted on the flow path block 21.
Further, according to the structure of the passage block 21 such as the following modification, the pair of molds 81 and 82, the 1 st projecting portion 87, the 2 nd projecting portion 88, and the like may be configured as follows. For example, the 1 st protruding portion 87 may be fixed to the 1 st inner wall 85 of the mold 81 without moving relative to the mold 81. Similarly, the 2 nd protrusion 88 may be fixed to the 2 nd inner wall 86 of the mold 82 without moving relative to the mold 82. In addition, the 2 nd inner wall 86 may be a surface facing the 1 st inner wall 85, corresponding to the configuration of fig. 4 described below.
In the conventional chemical liquid control valve 9, the V-shaped flow path 205 shown in fig. 7 is formed by cutting in two directions from the flow rate adjustment valve chamber and the opening/closing valve chamber after the formation. That is, the V-shaped flow path 205 shown in fig. 7 cannot be formed linearly due to the restriction of the mold. Further, for example, when the flow path block 21 is made of PFA, the surface layer of PFA may be scraped off at the V-shaped flow path 205 portion, and thus the chemical solution may penetrate into the flow path block 21 (PFA). According to the method of manufacturing the chemical liquid control valve 9 of the present embodiment, the straight intermediate flow path 31 can be formed without cutting.
< operation of substrate processing apparatus and chemical liquid control valve >
Next, the operations of the substrate processing apparatus 1 and the chemical liquid control valve 9 will be described.
Refer to fig. 1. A conveyance mechanism, not shown, conveys the substrate W onto the holding and rotating unit 3. The holding and rotating unit 3 holds the substrate W by attracting the back surface of the substrate W. Thereafter, the holding and rotating unit 3 rotates the held substrate W. The nozzle 2 is moved above the substrate W by a moving mechanism not shown. The controller 11 operates the chemical liquid control valve 9 to discharge the chemical liquid from the nozzle 2 onto the substrate W.
In the chemical liquid control valve 9 shown in fig. 2, first, the operation of the opening/closing valve body moving mechanism 25 will be described. The thick portion 51a of the diaphragm 51 is pressed against a valve seat 75 (see the thick portion 51a indicated by a broken line in fig. 2) provided around the opening 73 of the opening/closing valve chamber 29 by the elastic force (restoring force) of the spring 61. This state is a closed state in which the chemical liquid is not allowed to flow from the opening/closing valve chamber 29 to the 2 nd flow path 35. When the chemical liquid is in the closed state, the chemical liquid is not discharged from the nozzle 2.
By operating the three-way valve 71, gas is supplied from the gas supply source 69 to the space between the movable partition member 59 and the partition wall 57 in the cover 53 through the gas pipe 67 and the intake/exhaust port 63. Thereby, the movable partition member 59 moves upward while repelling the elastic force of the spring 61, and the movable member 55 and the thick portion 51a of the diaphragm 51 move upward (see the thick portion 51a indicated by the solid line in fig. 2). This state is an open state in which the chemical liquid is circulated. When the chemical liquid is in the open state, the chemical liquid is discharged from the nozzle 2.
Here, the flow of the chemical liquid in the opened state will be specifically described. The pump P shown in fig. 1 delivers the chemical liquid from the chemical liquid supply source 7 to the 1 st flow path 33 of the chemical liquid control valve 9 through the chemical liquid pipe 8a. The chemical liquid supplied to the 1 st flow path 33 shown in fig. 2 is supplied to the flow rate adjustment valve chamber 27 through a gap between the distal end portion 41a of the needle 41 and the opening portion 49. Thereafter, the chemical liquid is sent from the flow rate adjustment valve chamber 27 to the opening/closing valve chamber 29 through the intermediate flow path 31. Further, since the intermediate flow path 31 is formed linearly, the chemical liquid can be more smoothly transferred than the V-shaped flow path 205 shown in fig. 7 or the like.
Then, the chemical liquid is supplied from the opening/closing valve chamber 29 to the chemical liquid pipe 8b through the opening 73 of the valve seat 75 and the 2 nd flow path 35. The chemical liquid supplied to the chemical liquid pipe 8b is supplied to the nozzle 2 and discharged from the nozzle 2.
The operation of the needle moving mechanism 23 will be described. The needle moving mechanism 23 adjusts the gap between the tip portion 41a of the needle 41 and the opening 49, thereby adjusting the flow rate of the chemical liquid in the flow path block 21 such as the 1 st flow path 33. The needle 41 is moved by the rotational drive of the electric motor 45. The conversion mechanism 47 converts the rotation of the electric motor 45 into the linear movement of the needle 41. The needle 41 moves in the lateral direction (X direction).
After the chemical liquid is discharged, the controller 11 stops the supply of the gas from the gas supply source 69 by operating the three-way valve 71, and discharges the gas in the cover 53 shown in fig. 2 through the intake/exhaust port 63 and the like. Thereby, the thick portion 51a of the diaphragm 51 is pressed down by the elastic force of the spring 61, and the thick portion 51a is pressed against the valve seat 75 (closed state). When the chemical liquid is in the closed state, the chemical liquid is not discharged from the nozzle 2.
After the chemical liquid is discharged from the nozzle 2, the nozzle 2 is retracted from above the substrate W to the outside of the substrate. The holding and rotating unit 3 stops the rotation of the held substrate W, and thereafter releases the holding of the substrate W. The conveyance mechanism, not shown, moves the substrate W on the holding and rotating unit 3 to another device, a mounting unit, a carrier, or the like.
According to the present embodiment, the flow path block 21 has the 1 st outer wall 21a and the 2 nd outer wall 21b which is a surface perpendicular to the 1 st outer wall 21a. The flow rate adjustment valve chamber 27 in which the needle 41 is disposed is formed so that the 1 st outer wall 21a of the passage block 21 is recessed. On the other hand, the opening/closing valve chamber 29 in which the diaphragm 51 is disposed is formed so that the 2 nd outer wall 21b is recessed. The intermediate flow path 31 connects the flow rate adjustment valve chamber 27 and the opening/closing valve chamber 29, and the intermediate flow path 31 extends at a right angle to the 2 nd outer wall 21b. With this configuration, the intermediate flow path 31 can be formed linearly. Therefore, the replacement property of the chemical liquid, which may deteriorate due to the V-shaped flow path or the like, can be improved. The replacement characteristic is a characteristic expressed by a time when the new chemical liquid flows into the 1 st connection port 37 and the original chemical liquid is pushed out to reach the 2 nd connection port 39.
The 1 st channel 33 and the 2 nd channel 35 are linear and extend at right angles to the intermediate channel 31. When the resin is poured into the pair of molds 81 and 82 to form the flow path block 21, the 1 st pin member 89 inserted into the pair of molds 81 and 82 to form the intermediate flow path 31 and the 2 nd pin members 90 and 3 rd pin members 91 inserted into the pair of molds 81 and 82 to form the 1 st flow path 33 and the 2 nd flow path 35 can be arranged at right angles. Therefore, the intermediate flow path 31, the 1 st flow path 33, and the 2 nd flow path 35 can be easily formed, compared to a case where the 1 st pin member 89 is disposed obliquely (not at right angles) to each of the 2 nd pin member 90 and the 3 rd pin member 91.
In addition, the 1 st channel 33 is parallel to the 2 nd channel 35. The 1 st connection port 37 of the 1 st flow path 33, which is opposite to the portion connected to the flow rate adjustment valve chamber 27, opens in the same direction as the 2 nd connection port 39 of the 2 nd flow path 35, which is opposite to the portion connected to the opening/closing valve chamber 29. When the resin is poured into the pair of molds 81 and 82 to form the passage block 21, the 2 nd pin member 90 and the 3 rd pin member 91 inserted into the pair of molds 81 and 82 to form the 1 st passage 33 and the 2 nd passage 35 can be moved in the same direction. Therefore, the 1 st flow path 33 and the 2 nd flow path 35 can be formed more easily than when the 2 nd pin member 90 is inserted into the mold in a direction different from the direction of the 3 rd pin member 91.
The present invention is not limited to the above embodiment, and can be modified as follows.
(1) In the above embodiment, the 2 nd outer wall 21b provided with the opening/closing valve chamber 29 is a surface perpendicular to the 1 st outer wall 21a provided with the flow rate adjusting valve chamber 27. In this regard, the 2 nd outer wall 21b may be a surface facing the 1 st outer wall 21a and substantially parallel to the 1 st outer wall 21a as shown in fig. 4. That is, the 2 nd outer wall (surface) 21b is provided on the opposite side of the 1 st outer wall (surface) 21a across the flow path block 21. The 2 nd outer wall 21b is substantially parallel to the 1 st outer wall 21a.
The flow rate adjustment valve chamber 27 is formed so that a part of the 1 st outer wall 21a of the flow path block 21 is recessed. The opening/closing valve chamber 29 is formed so that a part of the 2 nd outer wall 21b of the passage block 21 is recessed. As shown in fig. 4, the flow rate adjustment valve chamber 27 is disposed so as to face the opening/closing valve chamber 29.
The straight intermediate flow passage 31 is formed to connect the opening/closing valve chamber 29 and the flow rate adjustment valve chamber 27. The intermediate flow path 31 extends at right angles to the 1 st outer wall 21a and the 2 nd outer wall 21b. The 1 st channel 33 and the 2 nd channel 35 extend at right angles to the intermediate channel 31. The 1 st flow path 33 is connected to the flow rate adjusting valve chamber 27. On the other hand, the 2 nd flow path 35 is connected to the opening/closing valve chamber 29.
The diaphragm 51 shown in fig. 4 moves in the longitudinal direction (Y direction). Further, the needle 41 of the present modification also moves in the longitudinal direction. The tip portion 41a of the needle 41 passes through the opening 49 at the connection portion between the flow rate adjustment valve chamber 27 and the intermediate flow passage 31.
According to the present modification, the flow path block 21 has the 1 st outer wall 21a and the 2 nd outer wall 21b which is a surface opposed to the 1 st outer wall 21a and parallel to the 1 st outer wall 21a. The flow rate adjustment valve chamber 27 in which the needle 41 is disposed is formed so that the 1 st outer wall 21a of the passage block 21 is recessed. On the other hand, the opening/closing valve chamber 29 in which the diaphragm 51 is disposed is formed so that the 2 nd outer wall 21b is recessed. The intermediate flow passage 31 connects the flow rate adjustment valve chamber 27 and the opening/closing valve chamber 29, and the intermediate flow passage 31 extends at right angles to the 1 st outer wall 21a and the 2 nd outer wall 21b. With this configuration, the intermediate flow path 31 can be formed linearly. Therefore, the replacement property of the chemical liquid, which may deteriorate due to the V-shaped flow path or the like, can be improved.
(2) In the above embodiment, for example, as shown in fig. 2, the intermediate flow path 31 is formed to extend substantially at right angles to the 2 nd outer wall 21b provided with the opening/closing valve chamber 29. In this regard, as shown in fig. 5 (a), the intermediate flow path 31 may be formed to extend substantially at right angles to the 1 st outer wall 21a provided with the flow rate adjustment valve chamber 27.
(3) In the above-described embodiment and modification (1), as shown in fig. 2 and 4, the opening 73 at the bottom of the opening/closing valve chamber 29 is connected to the 2 nd flow path 35. In this regard, the opening 73 at the bottom of the opening/closing valve chamber 29 may be connected to the intermediate flow path 31 as shown in fig. 5 (b).
(4) In the above-described embodiment and the respective modifications, as shown in fig. 2 and 4, the intermediate flow path 31 or the 1 st flow path 33 extending in the moving direction of the needle 41 is connected to the opening 49 at the bottom of the flow rate adjustment valve chamber 27. In this regard, as shown in fig. 5 (b), the intermediate flow path 31 (or the 1 st flow path 33) extending in the direction orthogonal to the moving direction of the needle 41 may be connected to the opening 49 at the bottom of the flow rate adjustment valve chamber 27 via the 3 rd extended flow path 40 c. The 3 rd extended channel 40c extends from the opening 49 in the moving direction of the needle 41 and is connected to the intermediate channel 31.
In fig. 5 (a) and 5 (b) and fig. 6 (a) and 6 (b) described below, the needle moving mechanism 23 and the opening/closing valve body moving mechanism 25 are simplified.
(5) In the above-described embodiment and the modifications, the needle moving mechanism 23 includes the electric motor 45 and the conversion mechanism 47, and is configured to convert the rotation output from the electric motor 45 into the linear movement of the needle 41 by the conversion mechanism 47. However, it is not limited thereto. Instead of the electric motor 45, a handle or a knob that is manually rotated by the operator may be provided, and the rotation of the handle or the knob may be converted into the linear movement of the needle 41.
(6) In the above-described embodiment and modifications, for example, as shown in fig. 2 and 4, the 1 st connection port 37 at one end of the 1 st channel 33 is directed in the same direction as the 2 nd connection port 39 at one end of the 2 nd channel 35. That is, the 1 st connection port 37 and the 2 nd connection port 39 are opened rightward in fig. 2 and 4. In this regard, the 1 st connection port 37 may be opened in a direction opposite to the 2 nd connection port 39 as shown in fig. 6 (a) and 6 (b). That is, in fig. 6 (a) and 6 (b), the 1 st connection port 37 opens leftward, and the 2 nd connection port 39 opens rightward.
In fig. 6 (a) and 6 (b), the 1 st connection port 37 opens in the opposite direction to the 2 nd connection port 39, that is, 180 degrees opposite to the 2 nd connection port 39 around the intermediate channel 31. In this regard, the 1 st connection port 37 may be opened in a direction of, for example, 90 ° around the intermediate flow path 31 (i.e., a direction other than 0 degree and 180 degrees) with respect to the 2 nd connection port 39.
(7) In the above-described embodiment and the modifications, the opening/closing valve body moving mechanism 25 drives the diaphragm 51 by gas. In this regard, the valve body moving mechanism 25 for opening and closing may drive the diaphragm 51 by an electric motor in the same manner as the needle moving mechanism 23. The rotation by the electric motor is converted into linear movement by a conversion mechanism. Thereby, the thick portion 51a of the diaphragm 51 is pressed against the valve seat 75, or the thick portion 51a is separated from the valve seat 75.
[ description of symbols ]
1. Substrate processing apparatus
2. Nozzle with a nozzle body
3. Holding and rotating part
8a, 8b chemical liquid piping
9. Chemical liquid control valve
11. Control unit
21. Single flow path block
21b No. 2 outer wall
23. Needle moving mechanism
25. Valve body moving mechanism for opening and closing
27. Valve chamber for flow rate adjustment
29. Valve chamber for opening and closing
31. Intermediate flow path
33. 1 st flow path
35. 2 nd flow path
37. The 1 st connection port
39. The 2 nd connecting port
41. Needle
51. Diaphragm
Claims (7)
1. A chemical liquid control valve is characterized by comprising:
a single flow path block having a 1 st outer wall and a 2 nd outer wall which is a surface perpendicular to the 1 st outer wall;
a flow rate adjustment valve chamber formed so that the 1 st outer wall is recessed;
an opening/closing valve chamber formed so that the 2 nd outer wall is recessed;
an intermediate flow path formed in the flow path block in a straight line shape, connecting the flow rate adjusting valve chamber and the opening/closing valve chamber, and extending at right angles to either the 1 st outer wall or the 2 nd outer wall;
a 1 st flow path formed inside the flow path block and connected to the flow rate adjustment valve chamber;
a 2 nd flow path formed inside the flow path block and connected to the opening/closing valve chamber;
a needle moving mechanism having a needle disposed in the flow rate adjustment valve chamber, closing the flow rate adjustment valve chamber, and moving the needle to adjust a flow rate of the chemical liquid; and
and an opening/closing valve body moving mechanism which has an opening/closing valve body disposed in the opening/closing valve chamber, closes the opening/closing valve chamber, and moves the opening/closing valve body to stop the supply of the chemical liquid and the supply thereof.
2. A chemical liquid control valve is characterized by comprising:
a single flow path block having a 1 st outer wall and a 2 nd outer wall which is a surface facing the 1 st outer wall and parallel to the 1 st outer wall;
a flow rate adjustment valve chamber formed in such a manner that the 1 st outer wall is recessed;
an opening/closing valve chamber formed so that the 2 nd outer wall is recessed;
an intermediate flow path formed in a straight line inside the flow path block, connecting the flow rate adjustment valve chamber and the opening/closing valve chamber, and extending at right angles to the 1 st outer wall and the 2 nd outer wall;
a 1 st flow path formed inside the flow path block and connected to the flow rate adjustment valve chamber;
a 2 nd flow path formed inside the flow path block and connected to the opening/closing valve chamber;
a needle moving mechanism having a needle disposed in the flow rate adjustment valve chamber, closing the flow rate adjustment valve chamber, and moving the needle to adjust a flow rate of the chemical liquid; and
and an opening/closing valve body moving mechanism having an opening/closing valve body disposed in the opening/closing valve chamber, closing the opening/closing valve chamber, and moving the opening/closing valve body to stop the supply of the chemical liquid and the supply thereof.
3. The chemical liquid control valve according to claim 1 or 2, characterized in that:
the 1 st flow path and the 2 nd flow path are each linear and extend at right angles to the intermediate flow path.
4. The chemical liquid control valve according to claim 1 or 2, characterized in that:
the 1 st flow path is parallel to the 2 nd flow path,
the 1 st connection port of the 1 st flow path, which is opposite to the portion connected to the flow rate adjustment valve chamber, opens in the same direction as the 2 nd connection port of the 2 nd flow path, which is opposite to the portion connected to the opening/closing valve chamber.
5. The chemical liquid control valve according to claim 1 or 2, characterized in that:
the flow path block is formed of PFA.
6. A substrate processing apparatus is characterized by comprising:
a holding and rotating unit that holds a substrate and rotates the held substrate;
a nozzle configured to discharge a chemical liquid onto the substrate held by the holding/rotating unit;
a chemical liquid pipe connected to the nozzle; and
a chemical liquid control valve that adjusts a flow rate of the chemical liquid ejected from the nozzle, and causes the chemical liquid to be ejected from the nozzle, thereby stopping the ejection of the chemical liquid;
the chemical liquid control valve includes: a single flow path block having a 1 st outer wall and a 2 nd outer wall which is a surface perpendicular to the 1 st outer wall;
a flow rate adjustment valve chamber formed in such a manner that the 1 st outer wall is recessed;
an opening/closing valve chamber formed in such a manner that the 2 nd outer wall is recessed;
an intermediate flow path formed in the flow path block in a straight line shape, connecting the flow rate adjusting valve chamber and the opening/closing valve chamber, and extending at right angles to either the 1 st outer wall or the 2 nd outer wall;
a 1 st flow path formed inside the flow path block and connected to the flow rate adjustment valve chamber;
a 2 nd flow path formed inside the flow path block, connected to the opening/closing valve chamber, and connected to the nozzle through the chemical liquid pipe;
a needle moving mechanism having a needle disposed in the flow rate adjustment valve chamber, closing the flow rate adjustment valve chamber, and moving the needle to adjust a flow rate of the chemical liquid; and
and an opening/closing valve body moving mechanism having an opening/closing valve body disposed in the opening/closing valve chamber, closing the opening/closing valve chamber, and moving the opening/closing valve body to stop the supply of the chemical liquid and the supply thereof.
7. A substrate processing apparatus is characterized by comprising:
a holding and rotating unit that holds a substrate and rotates the held substrate;
a nozzle configured to discharge a chemical liquid onto the substrate held by the holding/rotating unit;
a chemical liquid pipe connected to the nozzle; and
a chemical liquid control valve that adjusts a flow rate of the chemical liquid ejected from the nozzle, and causes the chemical liquid to be ejected from the nozzle, thereby stopping the ejection of the chemical liquid;
the chemical liquid control valve includes: a single flow path block having a 1 st outer wall and a 2 nd outer wall which is a surface facing the 1 st outer wall and parallel to the 1 st outer wall;
a flow rate adjustment valve chamber formed so that the 1 st outer wall is recessed;
an opening/closing valve chamber formed so that the 2 nd outer wall is recessed;
an intermediate flow path formed in the flow path block in a straight line shape, connecting the flow rate adjusting valve chamber and the opening/closing valve chamber, and extending at right angles to the 1 st outer wall and the 2 nd outer wall;
a 1 st flow path formed inside the flow path block and connected to the flow rate adjustment valve chamber;
a 2 nd flow path formed inside the flow path block, connected to the opening/closing valve chamber, and connected to the nozzle via the chemical liquid pipe;
a needle moving mechanism having a needle disposed in the flow rate adjustment valve chamber, closing the flow rate adjustment valve chamber, and moving the needle to adjust a flow rate of the chemical liquid; and
and an opening/closing valve body moving mechanism which has an opening/closing valve body disposed in the opening/closing valve chamber, closes the opening/closing valve chamber, and moves the opening/closing valve body to stop the supply of the chemical liquid and the supply thereof.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018040760A JP7029314B2 (en) | 2018-03-07 | 2018-03-07 | Chemical control valve and substrate processing equipment |
| JP2018-040760 | 2018-03-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110246776A CN110246776A (en) | 2019-09-17 |
| CN110246776B true CN110246776B (en) | 2023-02-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910117565.0A Active CN110246776B (en) | 2018-03-07 | 2019-02-15 | Chemical liquid control valve and substrate processing apparatus |
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| Country | Link |
|---|---|
| JP (1) | JP7029314B2 (en) |
| KR (1) | KR102225758B1 (en) |
| CN (1) | CN110246776B (en) |
| TW (1) | TWI732178B (en) |
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| KR102326247B1 (en) * | 2020-02-21 | 2021-11-12 | 한국기술교육대학교 산학협력단 | Exhaust control apparatus |
| KR102355356B1 (en) | 2020-03-25 | 2022-01-25 | 무진전자 주식회사 | Chemical providing management system of semiconductor process |
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| JP6238798B2 (en) * | 2014-03-10 | 2017-11-29 | 旭有機材株式会社 | Flow regulating valve and fluid control apparatus including the same |
| KR101821863B1 (en) * | 2015-11-19 | 2018-01-25 | 서문원 | Hydraulic pressure buffer solenoid valve and method for operating the solenoid valve |
| JP6588819B2 (en) * | 2015-12-24 | 2019-10-09 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing apparatus and substrate processing method |
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2018
- 2018-03-07 JP JP2018040760A patent/JP7029314B2/en active Active
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2019
- 2019-02-13 TW TW108104752A patent/TWI732178B/en active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016134390A (en) * | 2015-01-15 | 2016-07-25 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing apparatus |
| KR20170116155A (en) * | 2015-03-27 | 2017-10-18 | 가부시키가이샤 스크린 홀딩스 | Process liquid supply device and control method of process liquid supply device |
| JP2017092241A (en) * | 2015-11-10 | 2017-05-25 | 株式会社Ｓｃｒｅｅｎホールディングス | Process liquid supply device and control method for process liquid supply device |
| JP2017207121A (en) * | 2016-05-18 | 2017-11-24 | Ckd株式会社 | Flow passage block, fluid control device, and method for producing flow passage block |
Also Published As
| Publication number | Publication date |
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| CN110246776A (en) | 2019-09-17 |
| KR20190106707A (en) | 2019-09-18 |
| TWI732178B (en) | 2021-07-01 |
| JP7029314B2 (en) | 2022-03-03 |
| TW201938933A (en) | 2019-10-01 |
| JP2019157888A (en) | 2019-09-19 |
| KR102225758B1 (en) | 2021-03-09 |
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