JP6439964B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a substrate processing apparatus for processing a substrate. Examples of substrates to be processed include semiconductor wafers, liquid crystal display substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, and photomasks. Substrate, ceramic substrate, solar cell substrate and the like.

  Patent Document 1 discloses a single-wafer type substrate processing apparatus that processes substrates one by one. The substrate processing apparatus includes a spin chuck that rotates while holding the substrate horizontally, a processing liquid nozzle that discharges the processing liquid toward the upper surface of the substrate held by the spin chuck, and supplies the processing liquid to the processing liquid nozzle A processing liquid pipe to be processed, and a processing liquid valve interposed in the processing liquid pipe. When the processing liquid valve is opened, the processing liquid in the processing liquid piping is supplied to the processing liquid nozzle, and when the processing liquid nozzle is closed, the supply of the processing liquid to the processing liquid nozzle is stopped.

JP 2012-026476 A

When the processing liquid valve is opened, the valve body moves away from the valve seat. At this time, since the valve body rubs against the valve seat, particles may be generated inside the processing liquid valve. The particles are supplied to the processing liquid nozzle together with the processing liquid, and are discharged from the processing liquid nozzle. Therefore, particles generated in the processing liquid valve may adhere to the substrate.
Similarly, when the processing liquid valve is closed, particles may be generated inside the processing liquid valve. Particles generated before the processing liquid valve is completely closed may be supplied to the processing liquid nozzle together with the processing liquid. Further, there are cases where particles remain in the processing liquid valve and are supplied to the processing liquid nozzle together with the processing liquid when the processing liquid valve is opened again.

  Therefore, one of the objects of the present invention is to provide a substrate processing apparatus capable of suppressing or preventing particles generated in the opening / closing means for switching supply and stop of supply of the processing liquid to the processing liquid nozzle from being supplied to the substrate. That is.

  The invention described in claim 1 for achieving the above object includes a substrate holding means for rotating while holding the substrate horizontally, and a processing liquid discharge for discharging the processing liquid toward the substrate held by the substrate holding means. A processing liquid nozzle including an outlet, a processing liquid pipe for guiding the processing liquid to the processing liquid nozzle, an open state in which the processing liquid flowing in the processing liquid pipe toward the processing liquid nozzle is passed, and the processing liquid pipe Opening / closing means switchable to a closed state in which the supply of the processing liquid to the processing liquid nozzle is stopped, and the processing liquid piping and processing at a position downstream of the opening / closing means and upstream of the processing liquid discharge port. A suction pipe connected to at least one of the liquid nozzles; a suction means capable of generating a suction force for sucking the processing liquid between the opening / closing means and the processing liquid discharge port through the suction pipe; and the opening / closing means And said processing While the suction force for sucking the treatment liquid between the discharge port is generated in the suction means, and a control unit for switching to the open state from the closed state to the switching means, a substrate processing apparatus.

  According to this configuration, the control device switches the opening / closing means from the closed state to the open state while causing the suction means to generate a suction force for sucking the processing liquid between the opening / closing means and the processing liquid discharge port. Since the suction means generates a suction force, even if particles are generated in the opening / closing means when the opening / closing means is switched from the closed state to the open state, at least some of the particles are discharged from the processing liquid nozzle. Before being discharged from the outlet, it is sucked into the suction means together with the processing liquid that has passed through the opening / closing means. Therefore, it is possible to suppress or prevent particles generated in the opening / closing means from being discharged from the processing liquid nozzle. Thereby, the contamination of the substrate can be reduced.

  According to a second aspect of the present invention, the open state includes a first open state in which the processing liquid flowing in the processing liquid piping toward the processing liquid nozzle is passed at a first flow rate, and toward the processing liquid nozzle. And a second open state in which the processing liquid flowing in the processing liquid pipe is passed at a second flow rate greater than the first flow rate, and the flow rate of the processing liquid that can be sucked by the suction means is equal to or higher than the first flow rate, The flow rate is less than the second flow rate, and the control device switches the opening / closing means from the closed state to the first open state while generating the suction force in the suction means, and then turns the opening / closing means to the first opening state. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is switched from an open state to the second open state.

  According to this configuration, the opening / closing means is switched to three states (closed state, first open state, and second open state). The flow rate (first flow rate) of the processing liquid passing through the opening / closing means in the first open state is smaller than the flow rate (second flow rate) of the processing liquid passing through the opening / closing means in the second open state. The control device switches the opening / closing means from the closed state to the first open state, and then switches the opening / closing means from the first open state to the second open state. As a result, the flow rate of the processing liquid passing through the opening / closing means increases stepwise in the order of zero, the first flow rate, and the second flow rate.

  The control device switches the opening / closing means from the closed state to the first open state while generating a suction force in the suction means. Since the flow rate of the processing liquid that can be sucked by the suction means is equal to or higher than the first flow rate, all the processing liquid that has passed through the opening / closing means at this time is sucked by the suction means. Therefore, it is possible to prevent particles generated in the opening / closing means from being discharged from the processing liquid nozzle when switching from the closed state in which particles are easily generated to the first open state. Furthermore, since the flow rate of the processing liquid that can be sucked by the suction unit is less than the second flow rate, all the processing liquid can be sucked into the suction unit while suppressing the suction force of the suction unit.

The invention according to claim 3 is the control device according to claim 2, wherein the control device switches the opening / closing means from the first open state to the second open state while causing the suction means to generate the suction force. A substrate processing apparatus.
According to this configuration, after switching the opening / closing means from the closed state to the first open state, the control device switches the opening / closing means from the first open state to the second open state while generating a suction force in the suction means. Since the flow rate of the processing liquid that passes through the opening / closing means in the second open state (second flow rate) is larger than the flow rate of the processing liquid that can be sucked by the suction means, a part of the processing liquid that has passed through the opening / closing means Although remaining from the nozzle, the remaining processing liquid is sucked by the suction means without being discharged from the processing liquid nozzle. Therefore, at least a part of the particles generated in the opening / closing means when the opening / closing means is switched from the first open state to the second open state can be sucked by the suction means. Thereby, the contamination of the substrate can be reduced.

Invention of Claim 4 WHEREIN: The said control apparatus switches the said opening / closing means from the said open state to the said closed state, producing | generating the said suction force to the said suction means, Any one of Claims 1-3. The substrate processing apparatus according to claim 1.
According to this configuration, the control device switches the opening / closing means from the open state to the closed state while generating a suction force in the suction means. Since the suction means generates a suction force, even if particles are generated in the opening and closing means when the valve body moves toward the valve seat or when the valve body contacts the valve seat, At least a part of the particles is sucked by the suction means together with the processing liquid that has passed through the opening / closing means before being discharged from the processing liquid discharge port of the processing liquid nozzle. Thereby, the contamination of the substrate can be reduced.

  According to a fifth aspect of the present invention, the open state includes a first open state in which the processing liquid flowing in the processing liquid piping toward the processing liquid nozzle is passed at a first flow rate, and toward the processing liquid nozzle. And a second open state in which the processing liquid flowing in the processing liquid pipe is passed at a second flow rate greater than the first flow rate, and the flow rate of the processing liquid that can be sucked by the suction means is equal to or higher than the first flow rate, The flow rate is less than the second flow rate, and the control device switches the opening / closing means from the second open state to the first open state, and then causes the suction means to generate the suction force, and opens the opening / closing means. The substrate processing apparatus according to claim 4, wherein the substrate processing apparatus is switched from a first open state to the closed state.

  According to this configuration, the control device switches the opening / closing means from the second open state to the first open state. Thereafter, the control device switches the opening / closing means from the first open state to the closed state while generating a suction force in the suction means. Since the flow rate (first flow rate) of the processing liquid passing through the opening / closing means in the first open state is equal to or lower than the flow rate of the processing liquid that can be sucked by the suction means, switching from the first open state to the closed state where particles are likely to be generated is performed. At this time, all of the processing liquid that has passed through the opening / closing means is sucked into the suction means. Therefore, it is possible to prevent particles generated in the opening / closing means at this time from being discharged from the processing liquid nozzle. Further, since all the processing liquids can be sucked with a relatively small suction force, all the processing liquids can be sucked into the suction means while suppressing the suction force of the suction means.

The invention according to claim 6 is the control device according to claim 5, wherein the control device switches the opening / closing means from the second open state to the first open state while generating the suction force in the suction means. A substrate processing apparatus.
According to this configuration, the control device switches the opening / closing means from the second open state to the first open state while generating a suction force in the suction means. Since the flow rate of the processing liquid that passes through the opening / closing means in the second open state (second flow rate) is larger than the flow rate of the processing liquid that can be sucked by the suction means, a part of the processing liquid that has passed through the opening / closing means Although remaining from the nozzle, the remaining processing liquid is sucked by the suction means without being discharged from the processing liquid nozzle. Therefore, at least a part of the particles generated in the opening / closing means when the opening / closing means is switched from the second open state to the first open state can be sucked by the suction means. Thereby, the contamination of the substrate can be reduced.

  According to a seventh aspect of the present invention, the opening / closing means includes an opening / closing valve disposed on the processing liquid pipe, and the opening / closing valve forms a flow path through which the processing liquid flowing toward the processing liquid nozzle passes. And a valve body that opens and closes the flow path, and an actuator that moves the valve body, the actuator having a first open position that allows the processing liquid to pass through the flow path at the first flow rate. The valve body is positioned at any one of a second open position for allowing the processing liquid to pass through the flow path at the second flow rate and a closed position for stopping the processing liquid from passing through the flow path. The valve body is located in the first open position, the first open state, the valve body is located in the second open position, and the valve body is located in the closed position. Switching the opening / closing means to any one of the closed states; Claim 2, 3, 5, and 6 is a substrate processing apparatus according to any one of.

  According to an eighth aspect of the present invention, the opening / closing means includes a flow rate adjusting valve and an opening / closing valve connected in series on the processing liquid pipe, and the flow rate adjusting valve is in the first open state and the second open state. The open / close valve is switchable between the second open state and the closed state, and the control device is configured such that the flow rate adjustment valve is in the first open state, The first open state in which the open / close valve is in the second open state, the second open state in which the flow rate adjusting valve is in the second open state, the open / close valve is in the second open state, and the open / close valve The substrate processing apparatus according to any one of claims 2, 3, 5, and 6, wherein the opening / closing means is switched to any one of the closed state in which the closed state is the closed state.

According to a ninth aspect of the invention, the control device closes the opening / closing means while generating the suction force for sucking the processing liquid between the opening / closing means and the processing liquid discharge port. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is switched from a state to the open state, and then causes the suction unit to stop generating the suction force when the opening / closing unit is in the open state. It is.
According to a tenth aspect of the present invention, there is provided a processing liquid nozzle including a substrate holding unit that rotates while holding the substrate horizontally, and a processing liquid discharge port that discharges the processing liquid toward the substrate held by the substrate holding unit. A treatment liquid pipe for guiding the treatment liquid to the treatment liquid nozzle, an open state in which the treatment liquid flowing through the treatment liquid pipe toward the treatment liquid nozzle is allowed to pass, and from the treatment liquid pipe to the treatment liquid nozzle Opening / closing means switchable to a closed state in which the supply of the processing liquid is stopped, and at least one of the processing liquid piping and the processing liquid nozzle at a position downstream of the opening / closing means and upstream of the processing liquid discharge port. A connected suction pipe; suction means capable of generating a suction force for sucking the processing liquid between the opening / closing means and the processing liquid discharge port through the suction pipe; the opening / closing means and the processing liquid discharge port Processing between Wherein while the suction force is generated in said suction means for sucking a and a controller for switching from the open state to the closed state the switching means is a substrate processing apparatus.

According to this configuration, the control device switches the opening / closing means from the open state to the closed state while generating a suction force in the suction means. Since the suction means generates a suction force, even if particles are generated in the opening and closing means when the valve body moves toward the valve seat or when the valve body contacts the valve seat, At least a part of the particles is sucked by the suction means together with the processing liquid that has passed through the opening / closing means before being discharged from the processing liquid discharge port of the processing liquid nozzle. Thereby, the contamination of the substrate can be reduced.
According to an eleventh aspect of the present invention, the control device generates the suction force that sucks the processing liquid between the opening / closing means and the processing liquid discharge port when the opening / closing means is in the open state. The substrate processing apparatus according to claim 10, wherein the opening / closing means is switched from the open state to the closed state while stopping the suction means and then generating the suction force in the suction means.

It is the schematic diagram which looked at the inside of the processing unit with which the substrate processing apparatus concerning one embodiment of the present invention was equipped horizontally. It is typical sectional drawing which shows the internal structure of the chemical | medical solution valve | bulb with which the substrate processing apparatus was equipped. It is a schematic diagram which shows the flow of the chemical | medical solution in each state during standby, before the start of discharge, and during discharge. FIG. 3A shows the flow of the chemical during standby, FIG. 3B shows the flow of the chemical before the start of discharge, and FIG. 3C shows the flow of the chemical during the discharge. It is a time chart which shows the state of a chemical | medical solution valve | bulb and a suction device when the discharge of a chemical | medical solution is started and when the discharge of a chemical | medical solution is stopped. It is a time chart which shows the state of a chemical | medical solution valve | bulb and a suction device when discharge of a chemical | medical solution is started which concerns on other embodiment of this invention. 10 is a time chart according to still another embodiment of the present invention showing the state of the chemical liquid valve and the suction device when the discharge of the chemical liquid is stopped. It is a schematic diagram which shows the structure of the chemical | medical solution valve | bulb which concerns on other embodiment of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a schematic view of the inside of a processing unit 2 provided in a substrate processing apparatus 1 according to an embodiment of the present invention viewed horizontally.
The substrate processing apparatus 1 is a single-wafer type apparatus that processes a disk-shaped substrate W such as a semiconductor wafer one by one. The substrate processing apparatus 1 includes a processing unit 2 that processes a substrate W using a processing liquid, a transport robot (not shown) that transports the substrate W to the processing unit 2, and a control device 3 that controls the substrate processing apparatus 1. including.

The processing unit 2 is held by a spin chuck 4 (substrate holding means) that rotates the substrate W around a vertical rotation axis A1 that passes through the center of the substrate W while holding the substrate W horizontally, and the spin chuck 4. And a plurality of processing liquid nozzles that discharge the processing liquid toward the substrate W.
The spin chuck 4 includes a disc-shaped spin base 5 held in a horizontal posture, a plurality of chuck pins 6 that hold the substrate W in a horizontal posture above the spin base 5, and a central portion of the spin base 5. A spin shaft 7 extending downward, and a spin motor 8 that rotates the substrate W and the spin base 5 around the rotation axis A1 by rotating the spin shaft 7 are included. The spin chuck 4 is not limited to a clamping chuck in which a plurality of chuck pins 6 are brought into contact with the peripheral end surface of the substrate W, and the back surface (lower surface) of the substrate W which is a non-device forming surface is adsorbed to the upper surface of the spin base 5. Thus, a vacuum chuck that holds the substrate W horizontally may be used.

  The processing unit 2 includes a rinse liquid nozzle 9 that discharges a rinse liquid downward toward the upper surface of the substrate W held by the spin chuck 4, and a rinse liquid that guides the rinse liquid from the rinse liquid supply source to the rinse liquid nozzle 9. A pipe 10 and a rinse liquid valve 11 for opening and closing the inside of the rinse liquid pipe 10 are included. The rinse liquid is, for example, pure water (deionized water). The rinse liquid is not limited to pure water, but may be any of carbonated water, electrolytic ion water, hydrogen water, ozone water, and hydrochloric acid water having a diluted concentration (for example, about 10 to 100 ppm).

  The processing unit 2 includes a chemical solution nozzle 12 including a chemical solution discharge port 12a that discharges the chemical solution downward toward the upper surface of the substrate W held by the spin chuck 4, and a chemical solution that guides the chemical solution from the chemical solution supply source to the chemical solution nozzle 12. The piping 13 and the chemical | medical solution valve | bulb 14 (opening-closing means) which open and close the inside of the chemical | medical solution piping 13 are included. When the chemical valve 14 is opened, the chemical solution in the chemical solution pipe 13 is supplied to the chemical solution nozzle 12 and discharged from the chemical solution nozzle 12. The chemical liquid discharged from the chemical nozzle 12 is, for example, sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, aqueous ammonia, hydrogen peroxide, organic acid (for example, citric acid, oxalic acid, etc.), organic alkali (for example, TMAH: tetra A liquid containing at least one of a surfactant and a corrosion inhibitor, and an organic solvent (for example, IPA: isopropyl alcohol).

  The processing unit 2 includes a suction pipe 15 connected to the chemical liquid pipe 13 at a position downstream of the chemical liquid valve 14 and a suction force for sucking the processing liquid in the chemical liquid pipe 13 that has passed through the chemical liquid valve 14 through the suction pipe 15. A suction device 16 (suction means). The upstream end of the suction pipe 15 is connected to the chemical liquid pipe 13, and the downstream end of the suction pipe 15 is connected to the suction device 16. The suction device 16 is connected to the inside of the chemical liquid pipe 13 via the suction pipe 15. When the suction device 16 is driven, the suction force of the suction device 16 is transmitted to the inside of the chemical liquid pipe 13 via the suction pipe 15, and the fluid in the chemical liquid pipe 13 is transferred to the suction device 16 via the suction pipe 15. Sucked. The suction device 16 includes, for example, an ejector that generates a suction force and a gas valve that switches supply and stop of gas supply to the ejector. The suction device 16 may be a suction pump.

  When the substrate W is processed, the control device 3 controls the spin chuck 4 to rotate the substrate W. Thereafter, the control device 3 causes the chemical liquid nozzle 12 to discharge the chemical liquid toward the upper surface of the rotating substrate W. Thereby, the chemical solution is supplied to the entire upper surface of the substrate W (chemical solution supply step). The control device 3 stops the discharge of the chemical liquid from the chemical liquid nozzle 12 and then discharges pure water, which is an example of the rinse liquid, to the rinse liquid nozzle 9 toward the rotating substrate W. Thereby, pure water is supplied to the entire upper surface of the substrate W, and the chemical solution adhering to the substrate W is washed away (rinse solution supplying step). The control device 3 stops the discharge of pure water from the rinsing liquid nozzle 9 and then causes the spin chuck 4 to rotate the substrate W at a high rotational speed. Thereby, the pure water adhering to the substrate W is spun off around the substrate W by centrifugal force. Therefore, pure water is removed from the substrate W, and the substrate W is dried (drying process).

FIG. 2 is a schematic cross-sectional view showing the internal structure of the chemical liquid valve 14 provided in the substrate processing apparatus 1. In FIG. 2, the valve element 21 in the second open state (fully opened state) is indicated by a solid line, the valve element 21 in the first open state is indicated by a one-dot chain line, and the valve element 21 in the closed state is indicated by a two-dot chain line. Below, with reference to FIG. 2, the internal structure of the chemical | medical solution valve | bulb 14 is demonstrated.
The chemical liquid valve 14 is, for example, a diaphragm valve. The chemical valve 14 includes a valve body in which a flow path 18 is formed. The valve body includes an inlet 17 into which liquid flows, an outlet 19 that discharges the liquid that flows into the inlet 17, a flow path 18 that connects the inlet 17 and the outlet 19, and an annular shape that surrounds the flow path 18. The valve seat 20 and a valve body 21 disposed in the flow path 18 are included. The valve body 21 is a diaphragm formed of an elastic material such as rubber or resin. The chemical liquid pipe 13 includes an upstream pipe 13 a that guides the chemical liquid from the chemical liquid supply source to the inlet 17 and a downstream pipe 13 b that guides the chemical liquid from the outlet 19 to the chemical nozzle 12.

  The chemical valve 14 includes a valve actuator that opens and closes the valve body. The valve actuator includes a rod 22 that moves integrally with the valve body 21, an electric motor 24 that generates power for moving the rod 22 in the axial direction, and a motion conversion that converts rotation of the electric motor 24 into linear motion of the rod 22. Mechanism 23. When the electric motor 24 rotates, the rod 22 moves in the axial direction of the rod 22 by a movement amount corresponding to the rotation angle of the electric motor 24. The rod 22 is in the axial direction of the rod 22 between a second open position (the position shown in FIG. 2) where the valve body 21 is separated from the valve seat 20 and a closed position where the valve body 21 is pressed against the valve seat 20. Can be moved to.

  When the rod 22 moves to the closed position side while the valve body 21 is away from the valve seat 20, a part of the valve body 21 approaches the valve seat 20. When the rod 22 reaches the closed position, the valve body 21 contacts the valve seat 20 and the flow path 18 is closed. On the other hand, if the rod 22 moves to the second open position side while the valve body 21 is pressed against the valve seat 20, the valve body 21 is separated from the valve seat 20, and the flow path 18 is opened.

  The control device 3 is a microcomputer. The control device 3 stops the rod 22 at any of the three positions by controlling the rotation angle of the electric motor 24. The three positions are the above-described second open position and closed position, and the first open position between the second open position and the closed position. When the rod 22 is disposed at any one of the closed position, the first open position, and the second open position, the chemical valve 14 is in a closed state (indicated by a two-dot chain line) and a first open state (indicated by a one-dot chain line). State) and a second open state (state indicated by a solid line). The closed state, the first open state, and the second open state of the chemical liquid valve 14 correspond to the closed position, the first open position, and the second open position of the rod 22, respectively.

  When the chemical valve 14 is closed, the valve body 21 is pressed against the valve seat 20. When the chemical valve 14 is in the first open state and the second open state, the valve body 21 is separated from the valve seat 20. The liquid flow rate (first flow rate) discharged from the outlet 19 in the first open state is smaller than the liquid flow rate (second flow rate) discharged from the outlet 19 in the second open state. The flow rate that can be sucked by the suction device 16 is equal to or higher than the first flow rate and lower than the second flow rate. Therefore, when the chemical liquid valve 14 is in the first open state and the suction device 16 is driven, all the chemical liquid that has passed through the chemical liquid valve 14 is sucked into the suction device 16 through the suction pipe 15.

FIG. 3A shows the flow of the chemical during standby, FIG. 3B shows the flow of the chemical before the start of discharge, and FIG. 3C shows the flow of the chemical during the discharge. FIG. 4 is a time chart showing states of the chemical liquid valve 14 and the suction device 16 when the chemical liquid discharge is started and when the chemical liquid discharge is stopped. In the following, reference is made to FIG. Reference is made to FIG. 3 as appropriate.
When the chemical valve 14 is switched from the closed state to the second open state, the control device 3 starts driving the suction device 16 (time T1 shown in FIG. 4). Then, the control apparatus 3 switches the chemical | medical solution valve | bulb 14 from a closed state to a 1st open state (time T2 shown in FIG. 4). Then, the control apparatus 3 switches the chemical | medical solution valve | bulb 14 from a 1st open state to a 2nd open state (time T3 shown in FIG. 4). Thereafter, the control device 3 stops driving the suction device 16 (time T4 shown in FIG. 4).

  On the other hand, when the chemical liquid valve 14 is switched from the second open state to the closed state, the control device 3 starts driving the suction device 16 (time T5 shown in FIG. 4). Then, the control apparatus 3 switches the chemical | medical solution valve | bulb 14 from a 2nd open state to a 1st open state (time T6 shown in FIG. 4). Then, the control apparatus 3 switches the chemical | medical solution valve | bulb 14 from a 1st open state to a closed state (time T7 shown in FIG. 4). Thereafter, the control device 3 stops driving the suction device 16 (time T8 shown in FIG. 4).

  During the period from time T2 to time T3, the chemical valve 14 is set to the first open state. The flow rate at which the suction device 16 can suck the fluid in the chemical solution pipe 13 is equal to or higher than the flow rate (first flow rate) of the chemical solution that passes through the chemical solution valve 14 when the chemical solution valve 14 is in the first open state. Accordingly, during this period, all the chemical liquid that has passed through the chemical liquid valve 14 is sucked into the suction device 16. Therefore, during this period, as shown by the thick line in FIG.

  Moreover, the chemical | medical solution valve | bulb 14 is set to the 2nd open state during the period of time T3-time T4. The flow rate at which the suction device 16 can suck the fluid in the chemical solution pipe 13 is less than the flow rate (second flow rate) of the chemical solution that passes through the chemical solution valve 14 when the chemical solution valve 14 is in the second open state. Therefore, during this period, a part of the chemical liquid that has passed through the chemical liquid valve 14 is sucked into the suction device 16 and the remaining chemical liquid is discharged from the chemical liquid nozzle 12. During the period from time T4 to time T5, since the driving of the suction device 16 is stopped, all the chemical liquids that have passed through the chemical liquid valve 14 are discharged from the chemical liquid nozzle 12 as shown by the thick lines in FIG. .

  Further, during the period from time T5 to time T6, since the chemical liquid valve 14 is in the second open state and the suction device 16 generates a suction force, a part of the chemical liquid that has passed through the chemical liquid valve 14 is sucked into the suction device 16. The remaining chemical solution is discharged from the chemical solution nozzle 12. Therefore, during this period, the chemical liquid is discharged from the chemical liquid nozzle 12 at a flow rate smaller than the second flow rate. During the period from time T6 to time T7, since the chemical liquid valve 14 is in the first open state and the suction device 16 generates a suction force, all the chemical liquid that has passed through the chemical liquid valve 14 is sucked into the suction device 16. The Therefore, the chemical liquid is not discharged from the chemical nozzle 12 during this period. During the period after time T7, since the chemical valve 14 is closed, the chemical liquid flowing in the chemical liquid pipe 13 toward the chemical nozzle 12 is blocked by the chemical valve 14 as shown by a thick line in FIG. It is done.

  Particles are likely to be generated inside the chemical liquid valve 14 when the valve body 21 and the valve seat 20 rub against each other. Therefore, particles are likely to be generated inside the chemical liquid valve 14 when the valve body 21 moves away from the valve seat 20 or when the valve body 21 contacts the valve seat 20. In addition, when the chemical valve 14 is opened and closed, minute vibration may occur in the state where the valve seat 20 and the valve body 21 are close to each other, and in this case, particles are likely to be generated. Further, the valve element 21 may be rubbed against a portion other than the valve seat 20 to generate particles inside the chemical liquid valve 14. In the diaphragm valve, particles may fall off the valve body 21 due to elastic deformation of the valve body 21 (diaphragm).

  Since the control device 3 switches the chemical valve 14 from the closed state to the first open state when the suction device 16 is sucking the inside of the chemical solution pipe 13 through the suction pipe 15, it remains in the chemical valve 14. Particles that have been generated or particles that are generated when the chemical solution valve 14 is switched are sucked together with the chemical solution by the suction device 16 and are not supplied to the chemical solution nozzle 12. Therefore, it is possible to suppress or prevent the chemical liquid containing particles from being supplied to the substrate W when the chemical liquid valve 14 is switched from the closed state to the first open state.

  Further, when the suction device 16 is sucking the inside of the chemical liquid pipe 13 through the suction pipe 15, the control device 3 switches the chemical liquid valve 14 from the first open state to the second open state. At least a part of the particles generated by the switching is sucked into the suction device 16 together with the chemical solution. Therefore, it is possible to prevent particles generated when the chemical valve 14 is switched from the first open state to the second open state from being discharged from the chemical nozzle 12 together with the chemical solution.

  Further, when the suction device 16 is sucking the inside of the chemical liquid pipe 13 through the suction pipe 15, the control device 3 switches the chemical liquid valve 14 from the second open state to the first open state. Similarly, when the suction device 16 is sucking the inside of the chemical liquid pipe 13 through the suction pipe 15, the control device 3 switches the chemical liquid valve 14 from the first open state to the closed state. Therefore, it is possible to prevent all the particles generated by the switching from being supplied to the substrate W. Thereby, the contamination of the substrate W can be reduced.

  As described above, in the present embodiment, the chemical valve 14 is switched to three states (closed state, first open state, and second open state). The flow rate (first flow rate) of the chemical solution that passes through the chemical solution valve 14 in the first open state is smaller than the flow rate (second flow rate) of the chemical solution that passes through the chemical solution valve 14 in the second open state. The control device 3 switches the chemical liquid valve 14 from the closed state to the first open state, and then switches the chemical liquid valve 14 from the first open state to the second open state. As a result, the flow rate of the chemical solution passing through the chemical solution valve 14 increases stepwise in the order of zero, the first flow rate, and the second flow rate.

  The control device 3 switches the chemical valve 14 from the closed state to the first open state while causing the suction device 16 to generate a suction force. Since the flow rate of the chemical liquid that can be sucked by the suction device 16 is equal to or higher than the first flow rate, all the chemical liquid that has passed through the chemical liquid valve 14 at this time is sucked into the suction device 16. Therefore, it is possible to prevent particles generated in the chemical liquid valve 14 from being discharged from the chemical liquid nozzle 12 when switching from the closed state in which particles are easily generated to the first open state. Thereby, the contamination of the substrate W can be reduced. Furthermore, since the flow rate of the chemical solution that can be sucked by the suction device 16 is less than the second flow rate, all the chemical solution can be sucked into the suction device 16 while suppressing the suction force of the suction device 16.

  Further, in the present embodiment, the control device 3 switches the chemical liquid valve 14 from the closed state to the first open state, and then causes the suction device 16 to generate a suction force while opening the chemical liquid valve 14 from the first open state to the second open state. Switch to state. Since the flow rate (second flow rate) of the chemical solution that passes through the chemical solution valve 14 in the second open state is larger than the flow rate of the chemical solution that can be sucked by the suction device 16, a part of the chemical solution that has passed through the chemical solution valve 14 The remaining chemical liquid is discharged from the liquid 12 but is sucked into the suction device 16 without being discharged from the chemical liquid nozzle 12. Accordingly, at least a part of particles generated in the chemical liquid valve 14 when the chemical liquid valve 14 is switched from the first open state to the second open state can be sucked into the suction device 16. Thereby, the contamination of the substrate W can be reduced.

  Moreover, in this embodiment, the control apparatus 3 switches the chemical | medical solution valve | bulb 14 from a 2nd open state to a 1st open state. Thereafter, the control device 3 switches the chemical liquid valve 14 from the first open state to the closed state while causing the suction device 16 to generate a suction force. Since the flow rate (first flow rate) of the chemical solution that passes through the chemical solution valve 14 in the first open state is equal to or less than the flow rate of the chemical solution that can be sucked by the suction device 16, the switching from the first open state to the closed state where particles are likely to be generated is performed. At this time, all the chemical liquid that has passed through the chemical liquid valve 14 is sucked into the suction device 16. Therefore, it is possible to prevent particles generated in the chemical liquid valve 14 from being discharged from the chemical liquid nozzle 12. Furthermore, since all the chemicals can be sucked with a relatively small suction force, all the chemicals can be sucked into the suction device 16 while suppressing the suction force of the suction device 16.

  In the present embodiment, the control device 3 switches the chemical valve 14 from the second open state to the first open state while causing the suction device 16 to generate a suction force. Since the flow rate (second flow rate) of the chemical solution that passes through the chemical solution valve 14 in the second open state is larger than the flow rate of the chemical solution that can be sucked by the suction device 16, a part of the chemical solution that has passed through the chemical solution valve 14 The remaining chemical liquid is discharged from the liquid 12 but is sucked into the suction device 16 without being discharged from the chemical liquid nozzle 12. Therefore, at least a part of particles generated in the chemical liquid valve 14 when the chemical liquid valve 14 is switched from the second open state to the first open state can be sucked into the suction device 16. Thereby, the contamination of the substrate W can be reduced.

Although the description of the embodiment of the present invention has been described above, the present invention is not limited to the contents of the above-described embodiment, and various modifications can be made within the scope of the present invention.
For example, in the above-described embodiment, as illustrated in Example 1A of FIG. 5, the case where the driving of the suction device 16 is stopped after the chemical valve 14 is switched from the first open state to the second open state has been described. However, since the time when particles are likely to be generated inside the chemical liquid valve 14 is when the chemical liquid valve 14 is switched from the closed state to another state, as shown in Example 2A of FIG. After starting the driving, the chemical liquid valve 14 may be switched from the closed state to the first open state, and after the driving of the suction device 16 is stopped, the chemical liquid valve 14 may be switched from the first open state to the second open state. Further, as illustrated in Example 3A of FIG. 5, the control device 3 may switch the chemical valve 14 from the closed state to the second open state while causing the suction device 16 to generate a suction force.

In any of Example 1A, Example 2A, and Example 3A shown in FIG. 5, the valve element 21 is separated from the valve seat 20 while the suction device 16 is generating suction force. Particles can be efficiently discharged to the suction device 16.
In particular, in Example 1A and Example 2A, the flow rate of the chemical solution that passes through the chemical solution valve 14 is increased in multiple stages. Therefore, compared to Example 3A, the valve body 21 passes through the chemical solution valve 14 immediately after it leaves the valve seat 20. Small chemical flow rate. If the flow of the chemical liquid that has passed through the chemical liquid valve 14 is fast, particles may pass through the suction pipe 15 and reach the chemical liquid nozzle 12. Therefore, in Example 1A and Example 2A, particles can be discharged from the chemical liquid pipe 13 more reliably.

  In Examples 1A and 3A, the suction device 16 generates a suction force in any period during which the valve body 21 is moving away from the valve seat 20. On the other hand, in Example 2A, the driving of the suction device 16 is stopped when the chemical valve 14 is switched from the first open state to the second open state. Therefore, as compared with Example 2A, in Example 1A and Example 3A, particles generated with the switching of the chemical liquid valve 14 can be reliably sucked into the suction device 16.

  Further, in the above-described embodiment, as illustrated in Example 1B of FIG. 6, the case where the chemical valve 14 is switched from the second open state to the first open state after driving of the suction device 16 has been described. However, as illustrated in Example 2B of FIG. 6, the control device 3 switches the chemical liquid valve 14 from the second open state to the first open state before starting the drive of the suction device 16 to drive the suction device 16. After the start, the chemical valve 14 may be switched from the first open state to the closed state. Further, as illustrated in Example 3B of FIG. 6, the control device 3 may switch the chemical valve 14 from the second open state to the closed state after starting the driving of the suction device 16.

In any of Example 1B, Example 2B, and Example 3B shown in FIG. 6, the valve element 21 contacts the valve seat 20 while the suction device 16 is sucking the inside of the chemical liquid pipe 13, so that the chemical liquid valve 14 is switched. Particles generated along with this can be efficiently discharged to the suction device 16.
In particular, in Example 1B and Example 2B, the flow rate of the chemical liquid passing through the chemical liquid valve 14 is reduced in multiple stages. Therefore, compared with Example 3B, the valve body 21 is moved to the valve seat 20 in a state where the flow rate of the chemical liquid is reliably reduced. Contact. If the flow of the chemical liquid that has passed through the chemical liquid valve 14 is fast, particles may pass through the suction pipe 15 and reach the chemical liquid nozzle 12. Therefore, in Example 1B and Example 2B, particles can be discharged from the chemical liquid pipe 13 more reliably.

  Further, in Example 1B, the chemical valve 14 is switched from the second open state to the first open state while the suction device 16 generates a suction force, so that particles generated at this time can be discharged to the suction device 16. On the other hand, in Example 2B, when the chemical liquid valve 14 is switched from the second open state to the first open state, since the suction device 16 is not driven, particles generated at this time are not discharged to the suction device 16, The discharge of the chemical solution from the chemical solution nozzle 12 can be stopped almost simultaneously with the start of the driving of the suction device 16.

  Further, in Example 1B and Example 3B, the suction device 16 generates a suction force in any period during which the valve body 21 moves in a direction approaching the valve seat 20. On the other hand, in Example 2B, when the chemical valve 14 is switched from the second open state to the first open state, the driving of the suction device 16 is stopped. Therefore, compared to Example 2B, in Example 1B and Example 3B, particles generated with the switching of the chemical liquid valve 14 can be reliably sucked into the suction device 16.

  In the above-described embodiment, the case where the form of the valve body 21 (diaphragm) is changed by the electric motor 24 has been described, but the form of the valve body 21 may be changed by an actuator other than the electric motor 24 such as an air cylinder. Further, the chemical liquid valve 14 may be another type of valve such as a needle valve. Further, as shown in FIG. 7, a chemical liquid valve 214 including a flow rate adjustment valve 225 and an on-off valve 226 connected in series on the chemical liquid pipe 13 may be provided instead of the chemical liquid valve 14.

  Although not shown, each of the flow rate adjustment valve 225 and the opening / closing valve 226 includes a valve seat in which a flow path through which a chemical solution passes, a valve body that opens and closes the flow path, and an actuator that moves the valve body. . The flow rate adjustment valve 225 can be switched between a first open state and a second open state. The on-off valve 226 can be switched between a second open state and a closed state. The control device 3 includes a first open state in which the flow rate adjustment valve 225 is in the first open state and the open / close valve 226 is in the second open state, a flow rate adjustment valve 225 in the second open state, and the open / close valve 226 in the second open state. The chemical solution valve 214 is switched to either the second open state, which is a state, or the closed state, in which the open / close valve 226 is closed.

  When the flow rate adjustment valve 225 is in the first open state and the on-off valve 226 is in the second open state, the chemical liquid at the first flow rate passes through the flow rate adjustment valve 225 and the on-off valve 226 and is supplied to the chemical liquid nozzle 12. When the flow rate adjustment valve 225 is in the second open state and the open / close valve 226 is in the second open state, the chemical liquid at the second flow rate passes through the flow rate adjustment valve 225 and the open / close valve 226 and is supplied to the chemical liquid nozzle 12. When the on-off valve 226 is in the closed state, the chemical liquid flowing in the chemical liquid pipe 13 toward the chemical liquid nozzle 12 is opened and closed regardless of whether the flow rate adjustment valve 225 is in the first open state or the second open state. Therefore, the supply of the chemical solution to the chemical nozzle 12 is stopped. The control device 3 controls the flow rate adjustment valve 225 and the opening / closing valve 226 to cause the substrate processing apparatus 1 to perform the above-described operation.

  In the above-described embodiment, the case where the control device 3 drives the suction device 16 both when the chemical liquid valve 14 is switched to the closed state and when the chemical liquid valve 14 is switched from the closed state to another state has been described. However, the control device 3 may drive the suction device 16 only when the chemical liquid valve 14 is switched to the closed state or only when the chemical liquid valve 14 is switched from the closed state to another state.

In the above-described embodiment, the case where the opening / closing means is the chemical liquid valve 14 has been described. However, the processing liquid that passes through the opening / closing means may be a liquid other than the chemical liquid.
In the above-described embodiment, the case where the suction pipe 15 is connected to the chemical liquid pipe 13 at a position downstream of the chemical liquid valve 14 has been described. However, the suction pipe 15 may be connected to the chemical liquid nozzle 12, You may connect to both the chemical | medical solution nozzle 12 and the chemical | medical solution piping 13. FIG.

In the above-described embodiment, the case where the chemical liquid nozzle 12 ejects the chemical liquid toward the upper surface of the substrate W has been described, but the chemical liquid nozzle 12 may eject the chemical liquid toward the lower surface of the substrate W.
In the above-described embodiment, the case where the substrate processing apparatus 1 is an apparatus that processes a disk-shaped substrate W has been described. However, the substrate processing apparatus 1 may be an apparatus that processes a polygonal substrate W. .
Two or more of all the embodiments described above may be combined.

1: substrate processing device 2: processing unit 3: control device 4: spin chuck (substrate holding means)
5: Spin base 6: Chuck pin 7: Spin shaft 8: Spin motor 9: Rinse liquid nozzle 10: Rinse liquid pipe 11: Rinse liquid valve 12: Chemical liquid nozzle 12a: Chemical liquid outlet 13: Chemical liquid pipe 13a: Upstream pipe 13b: Downstream piping 14: Chemical valve (open / close means, open / close valve)
15: Suction piping 16: Suction device (suction means)
17: Inlet 18: Channel 19: Outlet 20: Valve seat 21: Valve body 22: Rod 23: Motion conversion mechanism 24: Electric motor 214: Chemical valve (opening / closing means)
225: Flow rate adjusting valve 226: Open / close valve A1: Rotation axis W: Substrate

Claims (11)

Substrate holding means for rotating while holding the substrate horizontally;
A processing liquid nozzle including a processing liquid discharge port for discharging the processing liquid toward the substrate held by the substrate holding means;
A treatment liquid pipe for guiding the treatment liquid to the treatment liquid nozzle;
Open / close switchable between an open state in which the processing liquid flowing in the processing liquid pipe is passed toward the processing liquid nozzle and a closed state in which the supply of the processing liquid from the processing liquid pipe to the processing liquid nozzle is stopped Means,
A suction pipe connected to at least one of the processing liquid pipe and the processing liquid nozzle at a position downstream of the opening / closing means and upstream of the processing liquid discharge port;
A suction means capable of generating a suction force for sucking the processing liquid between the opening / closing means and the processing liquid discharge port through the suction pipe;
And a control device that switches the open / close means from the closed state to the open state while generating the suction force for sucking the processing liquid between the open / close means and the processing liquid discharge port. Processing equipment. The open state includes a first open state in which the processing liquid flowing through the processing liquid pipe toward the processing liquid nozzle passes at a first flow rate, and a processing liquid flowing through the processing liquid pipe toward the processing liquid nozzle. And a second open state that allows a second flow rate greater than the first flow rate to pass through,
The flow rate of the processing liquid that can be sucked by the suction means is not less than the first flow rate and less than the second flow rate.
The control device switches the open / close means from the closed state to the first open state while generating the suction force in the suction means, and then changes the open / close means from the first open state to the second open state. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is switched to.   The substrate processing apparatus according to claim 2, wherein the controller switches the opening / closing means from the first open state to the second open state while generating the suction force in the suction means.   The substrate processing apparatus according to claim 1, wherein the control device switches the opening / closing means from the open state to the closed state while causing the suction means to generate the suction force. The open state includes a first open state in which the processing liquid flowing through the processing liquid pipe toward the processing liquid nozzle passes at a first flow rate, and a processing liquid flowing through the processing liquid pipe toward the processing liquid nozzle. And a second open state that allows a second flow rate greater than the first flow rate to pass through,
The flow rate of the processing liquid that can be sucked by the suction means is not less than the first flow rate and less than the second flow rate.
The control device switches the opening / closing means from the second open state to the first open state, and then generates the suction force to the suction means, while opening and closing the opening / closing means from the first open state to the closed state. The substrate processing apparatus according to claim 4, wherein the substrate processing apparatus is switched to.   The substrate processing apparatus according to claim 5, wherein the controller switches the opening / closing means from the second open state to the first open state while generating the suction force in the suction means. The opening / closing means includes an opening / closing valve disposed on the processing liquid pipe,
The open / close valve includes a valve seat in which a flow path through which the processing liquid flowing toward the processing liquid nozzle passes, a valve body that opens and closes the flow path, and an actuator that moves the valve body,
The actuator includes a first open position for allowing the processing liquid to pass through the flow path at the first flow rate, a second open position for allowing the processing liquid to pass through the flow path at the second flow rate, and a processing liquid for the flow path. The valve body is positioned at any one of the closed position for stopping the passage of
The control device includes the first open state in which the valve body is located in the first open position, the second open state in which the valve body is located in the second open position, and the valve body in the closed position. The substrate processing apparatus according to any one of claims 2, 3, 5, and 6, wherein the opening / closing means is switched to any one of the closed state positioned at a position. The opening / closing means includes a flow rate adjusting valve and an opening / closing valve connected in series on the processing liquid pipe,
The flow rate adjustment valve can be switched between the first open state and the second open state,
The on-off valve can be switched between the second open state and the closed state,
The control device includes the first open state in which the flow rate adjustment valve is in the first open state and the open / close valve is in the second open state, and the open / close valve in the second open state. The switch according to claim 2, 3, 5, and 6, wherein the opening / closing means is switched to either the second open state, which is the second open state, or the closed state, where the open / close valve is the closed state. The substrate processing apparatus as described in any one of Claims.   The control device switches the opening / closing means from the closed state to the open state while causing the suction means to generate the suction force for sucking the processing liquid between the opening / closing means and the processing liquid discharge port. The substrate processing apparatus according to claim 1, wherein when the opening / closing means is in the open state, the suction means stops generating the suction force. Substrate holding means for rotating while holding the substrate horizontally;
A processing liquid nozzle including a processing liquid discharge port for discharging the processing liquid toward the substrate held by the substrate holding means;
A treatment liquid pipe for guiding the treatment liquid to the treatment liquid nozzle;
Open / close switchable between an open state in which the processing liquid flowing in the processing liquid pipe is passed toward the processing liquid nozzle and a closed state in which the supply of the processing liquid from the processing liquid pipe to the processing liquid nozzle is stopped Means,
A suction pipe connected to at least one of the processing liquid pipe and the processing liquid nozzle at a position downstream of the opening / closing means and upstream of the processing liquid discharge port;
A suction means capable of generating a suction force for sucking the processing liquid between the opening / closing means and the processing liquid discharge port through the suction pipe;
And a control device that switches the opening / closing means from the open state to the closed state while causing the suction means to suck the processing liquid between the opening / closing means and the processing liquid discharge port. Processing equipment.   The control device causes the suction means to stop generating the suction force for sucking the processing liquid between the opening / closing means and the processing liquid discharge port when the opening / closing means is in the open state, The substrate processing apparatus according to claim 10, wherein the opening / closing means is switched from the open state to the closed state while generating a suction force in the suction means.

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