JP3529251B2 - Substrate processing equipment - Google Patents
Substrate processing equipmentInfo
- Publication number
- JP3529251B2 JP3529251B2 JP27871497A JP27871497A JP3529251B2 JP 3529251 B2 JP3529251 B2 JP 3529251B2 JP 27871497 A JP27871497 A JP 27871497A JP 27871497 A JP27871497 A JP 27871497A JP 3529251 B2 JP3529251 B2 JP 3529251B2
- Authority
- JP
- Japan
- Prior art keywords
- pure water
- flow rate
- processing
- liquid
- chemical liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、基板を１枚保持
し、純水と薬液とを混合して得られた処理液を保持した
基板に供給して処理する枚葉式の基板処理装置に係り、
特には、基板に供給する処理液を調合するための機構の
改良技術に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a single-wafer type substrate processing apparatus for holding one substrate and supplying a processing liquid obtained by mixing pure water and a chemical liquid to the substrate holding the substrate for processing. Staff,
In particular, it relates to a technique for improving a mechanism for preparing a processing liquid to be supplied to a substrate.
【０００２】[0002]
【従来の技術】従来のこの種の基板処理装置は、図６に
示すように構成されている。この装置は、基板Ｗを水平
姿勢に保持して鉛直方向の軸芯Ｊ周りで回転させるスピ
ンチャック１００と、スピンチャック１００に保持され
た基板Ｗに処理液を噴出供給するノズル１０１と、ノズ
ル１０１に供給する処理液を調合する処理液調合ユニッ
ト１０２とを備えている。2. Description of the Related Art A conventional substrate processing apparatus of this type is constructed as shown in FIG. This apparatus includes a spin chuck 100 that holds a substrate W in a horizontal posture and rotates it about a vertical axis J, a nozzle 101 that jets a processing liquid onto the substrate W held by the spin chuck 100, and a nozzle 101. And a processing liquid preparation unit 102 for preparing the processing liquid to be supplied to.
【０００３】処理液調合ユニット１０２は、１種類以上
（図では２種類）の薬液と純水とを所定の混合比率で混
合して処理液を得るためのユニットで、純水と各薬液を
個別に秤量するための秤量槽１１０や、秤量された各液
を混合して処理液を調合する調合槽１１１、調合された
処理液を貯留する貯留槽１１２などを備えている。The treatment liquid blending unit 102 is a unit for mixing one or more types (two types in the figure) of chemical liquids and pure water at a predetermined mixing ratio to obtain a treatment liquid. A weighing tank 110 for weighing, a mixing tank 111 for mixing the measured liquids to prepare a processing liquid, a storage tank 112 for storing the prepared processing liquid, and the like.
【０００４】各秤量槽１１０には、秤量対象の液（純
水、各薬液）がそれぞれ供給されるように構成され、ま
た、それぞれ上方から液吸引管１１３が垂設されてい
る。吸引管１１３の先端部１１３ａより高い位置まで純
水及び各薬液が各秤量槽１１０に供給された後、各液吸
引管１１３から各秤量槽１１０内の液を吸引すること
で、各液吸引管１１３の先端部１１３ａの高さ位置に応
じた液量の液が各秤量槽１１０に残されて純水や各薬液
の秤量が行われる。各秤量槽１１０における液吸引管１
１３の先端部１１３ａの高さ位置は混合比率に応じて調
節されている。Liquids to be weighed (pure water, chemical liquids) are supplied to the respective weighing tanks 110, and liquid suction pipes 113 are vertically provided from above. After the pure water and each chemical solution are supplied to each weighing tank 110 to a position higher than the tip portion 113a of the suction tube 113, each liquid suction tube is sucked from each liquid suction tube 113 to obtain each liquid suction tube. The amount of liquid corresponding to the height position of the tip portion 113a of 113 is left in each weighing tank 110, and pure water or each chemical liquid is weighed. Liquid suction tube 1 in each weighing tank 110
The height position of the tip portion 113a of 13 is adjusted according to the mixing ratio.
【０００５】各秤量槽１１０で秤量された純水と各薬液
は調合槽１１１に供給され、そこで混合比率に応じた液
量の純水と各薬液が混合され処理液が調合される。調合
された処理液は、密閉構造の貯留槽１１２に供給されて
そこに貯留される。貯留槽１１２には不活性ガス（Ｎ2
ガスなど）が供給されるようになって、基板Ｗにノズル
１０１から処理液を噴出供給するときは、開閉弁１１４
を閉から開にすることで、貯留槽１１２内の処理液がガ
ス圧によってノズル１０１に圧送され、基板Ｗに噴出供
給される。The pure water and each chemical solution weighed in each weighing tank 110 are supplied to a mixing tank 111, where the pure water and each chemical solution are mixed in an amount corresponding to the mixing ratio to prepare a treatment liquid. The prepared treatment liquid is supplied to and stored in a storage tank 112 having a closed structure. In the storage tank 112, an inert gas (N 2
Gas, etc., is supplied, and when the processing liquid is jetted and supplied from the nozzle 101 to the substrate W, the opening / closing valve 114
By opening from the closed state to the open state, the processing liquid in the storage tank 112 is pressure-fed to the nozzle 101 by the gas pressure and jetted and supplied to the substrate W.
【０００６】この装置では、所定枚数の基板Ｗに対する
処理を行える量の処理液をまとめて調合して貯留するよ
うにしているので、貯留槽１１２に処理液が貯留されて
いる間は、開閉弁１１４を開にするだけで、基板Ｗに処
理液を供給することができる。[0006] In this apparatus, since the processing liquids of an amount capable of processing a predetermined number of substrates W are collectively prepared and stored, the on-off valve is opened while the processing liquids are stored in the storage tank 112. The processing liquid can be supplied to the substrate W only by opening 114.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、このよ
うな構成を有する従来例の場合には、次のような問題が
ある。すなわち、基板に供給する処理液内の純水と薬液
との混合比率を変更する場合、従来装置では、貯留槽１
１２に貯留されている処理液を廃棄して、変更する混合
比率に応じて新たに処理液を調合し直さなければらず、
使用可能な処理液を廃棄することで、処理液（薬液）の
無駄な使用量が増加するという問題がある。また、新た
な混合比率で処理液を調合する場合、秤量槽１１０で秤
量する液量を変更しなければならず、各秤量槽１１０に
垂設された液吸引管１１３の先端部１１３ａの高さ位置
を調節し直さなければならないが、その調節は人手で行
うようになっているので、作業者の手間が増えるし、そ
の作業の間基板に対する処理が中断されるという問題も
ある。特に、基板に供給する処理液内の純水と薬液との
混合比率を頻繁に変更する場合などには、処理液内の純
水と薬液との混合比率を変更するごとに、液吸引管１１
３の先端部１１３ａの高さ位置を調節し直して処理液を
調合し直さなければならず、実質的に連続処理が不可能
となり、処理のスループットが著しく低下することにな
る。However, the conventional example having such a structure has the following problems. That is, when changing the mixing ratio of the pure water and the chemical liquid in the processing liquid supplied to the substrate, in the conventional device, the storage tank 1
The treatment liquid stored in 12 must be discarded, and the treatment liquid must be newly prepared according to the changed mixing ratio.
There is a problem that the useless amount of the treatment liquid (chemical liquid) is increased by discarding the usable treatment liquid. In addition, when the treatment liquid is prepared with a new mixing ratio, the amount of liquid to be weighed in the weighing tank 110 must be changed, and the height of the tip portion 113a of the liquid suction pipe 113 vertically installed in each weighing tank 110. The position has to be readjusted, but since the adjustment is done manually, there is a problem that the labor of the operator increases and the processing on the substrate is interrupted during the work. In particular, when the mixing ratio of pure water and the chemical liquid in the processing liquid supplied to the substrate is frequently changed, the liquid suction pipe 11 is changed every time the mixing ratio of the pure water and the chemical liquid in the processing liquid is changed.
It is necessary to readjust the height position of the tip end portion 113a of No. 3 and to re-prepare the treatment liquid, which makes substantially continuous treatment impossible, resulting in a significant reduction in treatment throughput.
【０００８】また、処理液を調合してからある程度の時
間が経過すると、処理液中の薬液の蒸発などが起こり、
処理液内の純水と各薬液の混合比率が変化するので処理
に用いることができなくなる。従って、処理液を調合し
てから所定時間経過してなお貯留槽１１２に残っている
処理液は廃棄しなければならず、処理液（薬液）の無駄
な使用量の増加を招くことになるし、調合した処理液の
時間管理（ライフタイムの管理）が必要になり、処理液
調合ユニット１０２の制御が複雑になる。Further, when a certain amount of time has passed since the treatment liquid was prepared, evaporation of the chemical liquid in the treatment liquid occurs,
Since the mixing ratio of pure water and each chemical liquid in the treatment liquid changes, it cannot be used for treatment. Therefore, the treatment liquid remaining in the storage tank 112 after a lapse of a predetermined time from the preparation of the treatment liquid has to be discarded, resulting in an increase in the useless amount of the treatment liquid (chemical liquid). The time management (lifetime management) of the prepared treatment liquid is required, and the control of the treatment liquid preparation unit 102 becomes complicated.
【０００９】本発明は、このような事情に鑑みてなされ
たものであって、処理液内の純水と薬液との混合比率の
頻繁な変更にも不都合なく柔軟に対応し、調合した処理
液の時間管理などが不要となる処理液の調合機構を備え
た基板処理装置を提供することを目的とする。The present invention has been made in view of such circumstances, and flexibly copes with frequent changes in the mixing ratio of pure water and chemicals in the processing liquid without any inconvenience, and the prepared processing liquid is prepared. It is an object of the present invention to provide a substrate processing apparatus equipped with a processing liquid blending mechanism that eliminates the need for time management.
【００１０】[0010]
【課題を解決するための手段】本発明は、このような目
的を達成するために、次のような構成をとる。すなわ
ち、請求項１に記載の発明は、基板を１枚保持し、純水
と薬液とを混合して得られた処理液を前記保持された基
板に供給して処理する枚葉式の基板処理装置であって、
基板を１枚保持する基板保持手段と、前記基板保持手段
に保持された基板に処理液を供給する処理液供給部と、
前記処理液供給部と純水供給源との間に接続される純水
供給路と、薬液供給源に一端が接続され、他端が前記純
水供給路の途中に接続された薬液供給路と、薬液が前記
純水供給路に導入される位置よりも上流側の前記純水供
給路に配設され、前記純水供給路内の純水流量を予め決
められた所定の流量に調節する純水流量調節手段と、前
記薬液供給路に配設され、前記薬液供給路から前記純水
供給路に供給する薬液供給流量を任意に調節し得る薬液
供給流量調節手段と、前記薬液供給路に配設され、前記
薬液供給路から前記純水供給路に供給される薬液供給流
量現在値を計測する薬液供給流量計測手段と、各基板に
供給する処理液を調合する際の純水と薬液との混合条件
を入力する混合条件入力手段と、薬液が前記純水供給路
に導入される位置よりも下流側の前記純水供給路に配設
され、前記純水供給路と前記処理液供給部とを接続する
状態と、前記純水供給路と排液ドレインとを接続する状
態とに切り換える切換え手段と、入力された混合条件と
前記薬液供給流量計測手段で計測される薬液供給流量現
在値とに基づき、フィードバック制御で前記薬液供給流
量調節手段を制御し、入力された混合条件で純水と薬液
とを混合して処理液を得るように薬液供給流量を調節す
るとともに、前記薬液供給流量調節手段に対するフィー
ドバック制御を開始した時点から所定の準備時間の間は
前記純水供給路と排液ドレインとを接続する状態を維持
し、前記準備時間が経過した時点で前記純水供給路と前
記処理液供給部とを接続する状態に切換え、以後、所定
の処理時間の間は前記純水供給路と前記処理液供給部と
を接続する状態を維持して、前記処理時間が経過した時
点で前記純水供給路と排液ドレインとを接続する状態に
切換えるように前記切換え手段を制御する制御手段と、
を備えたことを特徴とするものである。The present invention has the following constitution in order to achieve such an object. That is, the invention according to claim 1 is a single-wafer type substrate processing in which one substrate is held and a processing liquid obtained by mixing pure water and a chemical liquid is supplied to the held substrate for processing. A device,
A substrate holding means for holding one substrate, a processing liquid supply section for supplying a processing liquid to the substrate held by the substrate holding means,
A pure water supply path connected between the treatment liquid supply unit and a pure water supply source; and a chemical solution supply path having one end connected to the chemical solution supply source and the other end connected in the middle of the pure water supply path. , A pure water which is disposed in the pure water supply passage upstream of the position where the chemical solution is introduced into the pure water supply passage, and which adjusts the pure water flow rate in the pure water supply passage to a predetermined predetermined flow rate. A water flow rate adjusting means, a chemical solution supply flow rate adjusting means arranged in the chemical solution supply path and capable of arbitrarily adjusting a chemical solution supply flow rate to be supplied from the chemical solution supply path to the pure water supply path, and a chemical solution supply flow rate adjusting means arranged in the chemical solution supply path. A chemical liquid supply flow rate measuring unit that is provided to measure the current value of the chemical liquid supply flow rate supplied from the chemical liquid supply path to the pure water supply path, and pure water and the chemical solution when preparing the processing liquid to be supplied to each substrate. Mixing condition input means for inputting mixing conditions and a position where a chemical solution is introduced into the pure water supply passage It is arranged in the pure water supply path further downstream than the above, and switches between a state in which the pure water supply path and the processing liquid supply section are connected and a state in which the pure water supply path and the drainage drain are connected. Based on the switching means, the input mixing conditions and the current value of the chemical liquid supply flow rate measured by the chemical liquid supply flow rate measuring means, the chemical liquid supply flow rate adjusting means is controlled by feedback control, and pure water is supplied under the input mixing conditions. The chemical solution supply flow rate is adjusted so as to obtain a processing solution by mixing the chemical solution supply solution and the chemical solution, and the pure water supply path and the drainage solution are supplied for a predetermined preparation time from the time when feedback control to the chemical solution supply flow rate adjusting means is started. The state of connecting to the drain is maintained, and when the preparation time has elapsed, the state is switched to the state of connecting the pure water supply path and the processing liquid supply unit, and thereafter, the pure water is supplied for a predetermined processing time. Road and Control means for controlling the switching means so as to switch to a state in which the deionized water supply path and the drainage drain are connected to each other when the processing time elapses while maintaining a state of connecting to the processing liquid supply part. ,
It is characterized by having.
【００１１】請求項２に記載の発明は、上記請求項１に
記載の基板処理装置において、前記制御手段は、前記処
理時間が経過した時点で前記薬液供給路から前記純水供
給路への薬液の供給を停止するように前記薬液供給流量
調節手段を制御することを特徴とするものである。According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, the control means controls the chemical liquid from the chemical liquid supply path to the pure water supply path when the processing time elapses. It is characterized in that the chemical liquid supply flow rate adjusting means is controlled so as to stop the supply of.
【００１２】請求項３に記載の発明は、上記請求項１ま
たは２に記載の基板処理装置において、薬液が前記純水
供給路に導入される位置よりも上流側の前記純水供給路
に配設され、前記純水供給路内の純水流量現在値を計測
する純水流量計測手段と、前記計測される純水流量現在
値を監視し、薬液が前記純水供給路に導入される位置よ
りも上流側の前記純水供給路内の純水流量が予め決めら
れた所定の流量から外れたとき警報を発する監視手段
と、をさらに備えたことを特徴とするものである。According to a third aspect of the present invention, in the substrate processing apparatus according to the first or second aspect, a chemical solution is disposed in the pure water supply passage upstream of a position where the chemical is introduced into the pure water supply passage. A pure water flow rate measuring unit that is provided and measures the current pure water flow rate in the pure water supply path, and a position where the measured pure water flow rate current value is monitored and a chemical is introduced into the pure water supply path. And a monitoring means for issuing an alarm when the pure water flow rate in the pure water supply passage upstream of the predetermined flow rate deviates from a predetermined flow rate.
【００１３】[0013]
【作用】請求項１に記載の発明の作用は次のとおりであ
る。純水流量調節手段によって、薬液が純水供給路に導
入される位置よりも上流側で、純水供給路内の純水流量
が予め決められた所定の流量に調節されている。従っ
て、薬液供給流量調節手段を調節して薬液供給路から純
水供給路に供給する薬液供給流量を適宜に調節すること
で、純水供給路内において所望の混合比率で純水と薬液
を混合した処理液を調合し、処理液供給部に供給するこ
とができる。The operation of the invention described in claim 1 is as follows. The pure water flow rate adjusting means adjusts the pure water flow rate in the pure water supply path to a predetermined flow rate upstream of the position where the chemical solution is introduced into the pure water supply path. Therefore, by adjusting the chemical liquid supply flow rate adjusting means to appropriately adjust the chemical liquid supply flow rate to be supplied from the chemical liquid supply passage to the pure water supply passage, the pure water and the chemical liquid are mixed at a desired mixing ratio in the pure water supply passage. The processing liquid thus prepared can be prepared and supplied to the processing liquid supply unit.
【００１４】基板保持手段に保持された基板に供給する
処理液を調合する際の純水と薬液との混合条件は混合条
件入力手段から入力される。この混合条件は、調合する
処理液内の純水と薬液の混合比率を指定する条件であ
り、純水と薬液の混合比率を混合条件として入力しても
よいし、純水流量が既知であるからその純水流量に対す
る薬液供給流量を混合条件として入力してもよい。The mixing condition of the pure water and the chemical liquid when preparing the processing liquid to be supplied to the substrate held by the substrate holding means is inputted from the mixing condition input means. This mixing condition is a condition that specifies the mixing ratio of pure water and chemical liquid in the processing liquid to be prepared, and the mixing ratio of pure water and chemical liquid may be input as the mixing condition, or the pure water flow rate is known. Therefore, the chemical solution supply flow rate for the pure water flow rate may be input as the mixing condition.
【００１５】制御手段は、入力された混合条件と薬液供
給流量計測手段で計測される薬液供給流量現在値とに基
づき、フィードバック制御で薬液供給流量調節手段を制
御し、入力された混合条件で純水と薬液とを混合するよ
うに薬液供給流量を調節する。このとき、薬液供給流量
調節手段に対するフィードバック制御を開始した時点か
ら、入力された混合条件に応じた薬液供給流量で薬液が
純水供給路に供給されて処理液の調合が安定し、入力さ
れた混合条件に従って混合された処理液を安定的に処理
液供給部に供給できるようになるまでに所定の時間が必
要になる。そこで、制御手段は、この時間を準備時間と
して、その準備時間の間は、純水供給路と排液ドレイン
とを接続する状態を維持し、入力された混合条件に従っ
て調合されるに至っていない処理液を排液ドレインに流
すようにし、準備時間が経過し、入力された混合条件に
従って混合された処理液を安定的に処理液供給部に供給
できるようになった時点で、純水供給路と処理液供給部
とを接続する状態に切り換えて、その処理液を処理液供
給部に流すようにしている。そして、処理液を処理液供
給部に流す状態に切換えてから所定の処理時間の間、処
理液を処理液供給部に流す状態を維持して、その処理時
間の間、処理液供給部から基板に処理液を供給して処理
し、処理時間が経過した時点で純水供給路と排液ドレイ
ンとを接続する状態に切り換えて処理液を排液ドレイン
に流すようにし、基板への処理液の供給を停止させる。
なお、制御手段は、基板への処理液の供給開始のタイミ
ングよりも上記準備時間だけ早く薬液供給流量調節手段
に対するフィードバック制御を開始すれば、基板への処
理液の供給が待たされることはない。The control means controls the chemical solution supply flow rate adjusting means by feedback control based on the input mixing conditions and the current value of the chemical solution supply flow rate measured by the chemical solution supply flow rate measuring means, and the pure mixing is performed under the input mixing conditions. The chemical solution supply flow rate is adjusted so that water and the chemical solution are mixed. At this time, from the time when the feedback control to the chemical liquid supply flow rate adjusting means is started, the chemical liquid is supplied to the pure water supply passage at the chemical liquid supply flow rate according to the input mixing condition, the preparation of the treatment liquid is stabilized, and the input is performed. A predetermined time is required until the processing liquid mixed according to the mixing conditions can be stably supplied to the processing liquid supply unit. Therefore, the control means sets this time as the preparation time, and during the preparation time, maintains the state in which the pure water supply path and the drainage drain are connected to each other, and the processing which is not yet prepared according to the input mixing conditions is performed. When the preparation time has elapsed and the processing liquid mixed according to the input mixing conditions can be stably supplied to the processing liquid supply unit, the pure water supply path is connected. The processing liquid is supplied to the processing liquid supply unit by switching to the state where the processing liquid supply unit is connected. Then, the state in which the processing liquid is supplied to the processing liquid supply unit is maintained for a predetermined processing time after switching to the state where the processing liquid is supplied to the processing liquid supply unit, and the substrate is transferred from the processing liquid supply unit during the processing time. The treatment liquid is supplied to the substrate for processing, and when the treatment time has elapsed, the pure water supply path is connected to the drainage drain so that the treatment liquid flows to the drainage drain. Stop the supply.
If the control means starts the feedback control to the chemical liquid supply flow rate adjusting means earlier than the timing of starting the supply of the processing liquid to the substrate by the preparation time, the supply of the processing liquid to the substrate is not waited.
【００１６】請求項２に記載の発明によれば、制御手段
は、処理時間が経過した時点で薬液供給路から純水供給
路への薬液の供給を停止するように薬液供給流量調節手
段を制御するように構成したので、基板への処理液の供
給を停止した後、薬液を排液ドレインから廃棄し続ける
ことがなく、無駄な薬液の使用量を低減することができ
る。According to the second aspect of the present invention, the control means controls the chemical liquid supply flow rate adjusting means so as to stop the supply of the chemical liquid from the chemical liquid supply passage to the pure water supply passage when the processing time has elapsed. With this configuration, after the supply of the processing liquid to the substrate is stopped, the chemical liquid is not continuously discarded from the drain drain, and the amount of useless chemical liquid can be reduced.
【００１７】請求項３に記載の発明によれば、監視手段
は純水流量計測手段で計測される純水流量現在値を監視
し、薬液が純水供給路に導入される位置よりも上流側の
純水供給路内の純水流量が予め決められた所定の流量か
ら外れたとき警報を発する。純水流量が予め決められた
所定の流量に維持されていることを前提に薬液供給流量
を調節して処理液を調合しているので、例えば純水流量
調節手段の破損や誤動作などにより純水流量が予め決め
られた所定の流量から外れると、純水と薬液の混合比率
が入力された混合条件通りにならなくなる。この請求項
３に記載の発明によれば、そのような場合に作業者はす
ぐにその異常を知ることができる。According to the third aspect of the invention, the monitoring means monitors the pure water flow rate current value measured by the pure water flow rate measuring means, and is located upstream of the position where the chemical is introduced into the pure water supply passage. When the flow rate of pure water in the pure water supply path is deviated from a predetermined flow rate, an alarm is issued. Since the treatment liquid is prepared by adjusting the chemical liquid supply flow rate on the assumption that the pure water flow rate is maintained at a predetermined predetermined flow rate, for example, the pure water flow rate adjusting means is damaged or malfunctions, so that the pure water flow rate is adjusted. If the flow rate deviates from a predetermined flow rate, the mixing ratio of pure water and the chemical liquid will not meet the input mixing conditions. According to the invention described in claim 3, in such a case, the operator can immediately know the abnormality.
【００１８】[0018]
【発明の実施の形態】以下、図面を参照して本発明の実
施の形態を説明する。図１は本発明の一実施形態に係る
基板処理装置の概略構成を示す図である。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention.
【００１９】この装置は、基板Ｗを水平姿勢に保持して
鉛直方向の軸芯Ｊ周りで回転させる基板保持手段として
のスピンチャック１と、スピンチャック１に保持された
基板Ｗに処理液を噴出供給する処理液供給部としてのノ
ズル２とを有する基板処理部３と、ノズル２に供給する
処理液を調合する処理液調合ユニット４とを備えてい
る。In this apparatus, a processing liquid is jetted onto a spin chuck 1 as a substrate holding means for holding a substrate W in a horizontal posture and rotating it about a vertical axis J, and a substrate W held on the spin chuck 1. A substrate processing unit 3 having a nozzle 2 as a processing liquid supply unit for supplying and a processing liquid preparation unit 4 for preparing a processing liquid to be supplied to the nozzle 2 are provided.
【００２０】図では真空吸着式のスピンチャック１を示
しているが、例えば、特公平３−９６０７号公報に開示
されているような基板Ｗの外周部を３箇所以上で保持す
るメカニカル式のスピンチャックを備えた装置であって
も本発明は同様に適用することができる。Although the vacuum chuck type spin chuck 1 is shown in the drawing, for example, a mechanical type spin chuck for holding the outer peripheral portion of the substrate W at three or more places as disclosed in Japanese Patent Publication No. 3-9607. The present invention can be similarly applied to an apparatus including a chuck.
【００２１】また、図では保持された基板Ｗの上面に純
水と薬液を混合した処理液を供給する場合を示している
が、保持された基板Ｗの下面に純水と薬液を混合した処
理液を供給する場合や、保持された基板Ｗの上下両面に
純水と薬液を混合した処理液を供給する場合などにも、
本発明は同様に適用することができる。Further, although the drawing shows the case where the processing liquid in which the pure water and the chemical liquid are mixed is supplied to the upper surface of the held substrate W, the processing in which the pure water and the chemical liquid are mixed to the lower surface of the held substrate W. When supplying a liquid, or when supplying a processing liquid in which pure water and a chemical liquid are mixed onto the upper and lower surfaces of the held substrate W,
The present invention can be applied similarly.
【００２２】次に、本発明の要部である処理液調合ユニ
ット４の構成を詳述する。純水供給源１０と基板処理部
３内のノズル２との間は純水供給路１１で接続されてい
る。なお、純水供給源１０は、工場のユーテイリティで
あってもよいし、純水貯留槽からガス圧で純水を圧送す
る構成であってもよい。純水供給路１１には、純水供給
源１０側から順に、純水流量調節手段としての純水圧力
調節器１２、調合部１３、切換え弁１４が配設されてい
る。純水圧力調節器１２は、電空レギュレータ１５から
与えられた空気圧（パイロット圧）に応じて、純水圧力
調節器１２の二次側の純水圧力を調節する制御弁であ
る。Next, the structure of the treatment liquid preparation unit 4 which is the main part of the present invention will be described in detail. A pure water supply passage 11 connects the pure water supply source 10 and the nozzle 2 in the substrate processing section 3. The pure water supply source 10 may be a utility of a factory, or may be configured to pump pure water from a pure water storage tank under gas pressure. The pure water supply path 11 is provided with a pure water pressure controller 12 as a pure water flow rate adjusting means, a brewing section 13, and a switching valve 14 in order from the pure water supply source 10 side. The pure water pressure adjuster 12 is a control valve that adjusts the pure water pressure on the secondary side of the pure water pressure adjuster 12 according to the air pressure (pilot pressure) given from the electropneumatic regulator 15.
【００２３】具体的には、純水圧力調節器１２は、その
内部にダイアフラムに連動する弁体を備えている。この
ダイアフラムの一方面にパイロット圧が、他方面に二次
側の純水圧力がそれぞれ作用する。両圧力に差圧がある
とダイアフラムが変形して弁体の開度が変わる。両圧力
が平衡したところで弁体が静止する。つまり、純水圧力
調節器１２の二次側の純水圧力がパイロット圧に平衡す
るように弁体が変位する。従って、一方のパイロット圧
を与えることにより、純水圧力調節器１２の二次側の純
水圧力を一定にすることができる。その結果、純水圧力
調節器１２の二次側の純水供給路１１の流路抵抗が変化
しない限り、純水供給路１１に流れる純水の流量を一定
にすることができる。Specifically, the deionized water pressure regulator 12 has a valve body inside which is interlocked with the diaphragm. Pilot pressure acts on one side of this diaphragm, and pure water pressure on the secondary side acts on the other side. If there is a pressure difference between the two pressures, the diaphragm will deform and the opening of the valve body will change. When both pressures equilibrate, the valve body comes to rest. That is, the valve body is displaced so that the pure water pressure on the secondary side of the pure water pressure adjuster 12 is balanced with the pilot pressure. Therefore, by applying one pilot pressure, the pure water pressure on the secondary side of the pure water pressure controller 12 can be made constant. As a result, as long as the flow path resistance of the pure water supply path 11 on the secondary side of the pure water pressure controller 12 does not change, the flow rate of pure water flowing through the pure water supply path 11 can be kept constant.
【００２４】電空レギュレータ１５は、供給された加圧
空気（圧空）を、後述するコントローラ５から与えられ
る操作電圧（Ｖｐ）に応じた空気圧（パイロット圧）に
変換して出力する。本実施形態では、純水供給路１１に
流れる純水の流量を常時、予め決められた所定の流量に
維持するために、コントローラ５は、常時一定の操作電
圧（Ｖｐ）を電空レギュレータ１５に出力するようにし
ている。The electropneumatic regulator 15 converts the supplied pressurized air (compressed air) into an air pressure (pilot pressure) corresponding to an operation voltage (Vp) given from the controller 5 described later and outputs it. In the present embodiment, in order to always maintain the flow rate of pure water flowing in the pure water supply passage 11 at a predetermined flow rate, the controller 5 constantly supplies a constant operating voltage (Vp) to the electropneumatic regulator 15. I am trying to output.
【００２５】調合部１３には、純水供給路１１の純水中
に異なる種類の薬液（図では、２種類の薬液１、２：薬
液１、２は例えば、アンモニアと過酸化水素水）を、供
給流量を任意に調節可能に個別に供給する薬液流量調節
弁１６が配設されている。薬液流量調節弁１６の入口側
には薬液供給源１７に接続された薬液供給路１８が接続
されている。なお、薬液供給源１７は、工場のユーテイ
リティであってもよいし、薬液貯留槽からガス圧で薬液
を圧送する構成であってもよい。In the mixing section 13, different types of chemicals (two types of chemicals 1 and 2 in the figure: chemicals 1 and 2 are, for example, ammonia and hydrogen peroxide solution) are added to the pure water of the pure water supply passage 11. A chemical liquid flow rate control valve 16 that individually supplies the supply flow rate so that the supply flow rate can be arbitrarily adjusted is provided. A chemical liquid supply passage 18 connected to a chemical liquid supply source 17 is connected to an inlet side of the chemical liquid flow rate control valve 16. The chemical liquid supply source 17 may be a utility of a factory, or may be configured to pressure-feed the chemical liquid from a chemical liquid storage tank.
【００２６】図２を参照して薬液流量調節弁１６の一例
の構造を説明する。薬液流量調節弁１６は、純水供給路
１１の途中に介在する弁連結管３０に連結されている。
薬液流量調節弁１６の底面部と、弁連結管３０に穿たれ
た有底孔とが相まって弁室３１が形成されている。弁室
３１は接続孔３２を介して薬液供給路１８に連通接続さ
れている。また、弁室３１は薬液導入口３３を介して、
弁連結管３０の純水流路３０ａに連通接続されている。
弁室３１には、薬液導入口３３の開閉を行うとともに、
開口度を調節する絞り弁３４が設けられている。絞り弁
３４の基端は、弁本体３５内を摺動変位する支持体３６
に連結支持されている。この支持体３６は、バネ３７に
よって下方向に押し付けられている。パイロットエア供
給口３８にエアを供給しない状態では、バネ３７のバネ
力によって支持体３６および絞り弁３４は下方向に押し
付けられており、このとき薬液導入口３３は閉じられて
いる。一方、パイロットエア供給口３８に適宜の空気圧
（パイロット圧）のエアが供給されると、支持体３６と
一体に絞り弁３４がバネ３７のバネ力に抗して上昇し、
パイロット圧とバネ力とがバランスした位置で絞り弁３
４が停止し、その停止位置に応じた開度で薬液導入口３
３が開かれる。すなわち、この薬液流量調節弁１６は、
電空レギュレータ１９から与えられたパイロット圧に応
じて、その弁の開度が操作されることにより、薬液供給
管１８から純水供給路１１に供給する薬液供給流量を任
意に調節できるようになっている。The structure of an example of the chemical liquid flow rate control valve 16 will be described with reference to FIG. The chemical liquid flow rate control valve 16 is connected to a valve connecting pipe 30 which is interposed in the pure water supply passage 11.
A valve chamber 31 is formed by a bottom surface portion of the chemical liquid flow rate control valve 16 and a bottomed hole formed in the valve connecting pipe 30. The valve chamber 31 is communicatively connected to the chemical liquid supply path 18 via a connection hole 32. In addition, the valve chamber 31 is
It is connected to the pure water flow path 30a of the valve connecting pipe 30.
In addition to opening and closing the chemical liquid inlet 33 in the valve chamber 31,
A throttle valve 34 for adjusting the degree of opening is provided. The base end of the throttle valve 34 has a support 36 that is slidably displaced in the valve body 35.
It is connected to and supported by. The support 36 is pressed downward by a spring 37. When air is not supplied to the pilot air supply port 38, the support body 36 and the throttle valve 34 are pressed downward by the spring force of the spring 37, and at this time, the chemical liquid inlet 33 is closed. On the other hand, when air having an appropriate air pressure (pilot pressure) is supplied to the pilot air supply port 38, the throttle valve 34 rises integrally with the support 36 against the spring force of the spring 37,
The throttle valve 3 at the position where the pilot pressure and the spring force are balanced.
4 is stopped, and the chemical liquid inlet 3 is opened at an opening according to the stop position.
3 is opened. That is, the chemical liquid flow rate control valve 16 is
By operating the opening degree of the valve according to the pilot pressure given from the electropneumatic regulator 19, the chemical liquid supply flow rate to be supplied from the chemical liquid supply pipe 18 to the pure water supply passage 11 can be arbitrarily adjusted. ing.
【００２７】図１に戻って、電空レギュレータ１９は、
供給された加圧空気（圧空）を、後述するコントローラ
５から与えられる操作電圧（Ｖｍ１、Ｖｍ２）に応じた
空気圧（パイロット圧）に変換し、薬液流量調節弁１６
のパイロットエア供給口３８に供給するように構成され
ている。Returning to FIG. 1, the electropneumatic regulator 19 is
The supplied pressurized air (compressed air) is converted into an air pressure (pilot pressure) according to an operation voltage (Vm1, Vm2) given from a controller 5 described later, and the chemical liquid flow control valve 16
Of the pilot air supply port 38.
【００２８】なお、管路内に孔あきねじり板を固定し、
純水と各薬液とを均一に混合するように構成されたスタ
ティックミキサーを弁連結管３０と切換え弁１４との間
の純水供給路１１に配設することが好ましい。A perforated torsion plate is fixed in the pipe,
It is preferable to dispose a static mixer configured to uniformly mix pure water and each chemical in the pure water supply passage 11 between the valve connecting pipe 30 and the switching valve 14.
【００２９】各薬液供給路１８には、各々の薬液供給路
１８に流れる薬液の流量を計測する薬液流量センサ２０
が配設されている。これら薬液流量センサ２０からの計
測信号（薬液供給流量現在値Ｓｍ１、Ｓｍ２）は後述す
るコントローラ５に与えられている。A chemical liquid flow rate sensor 20 for measuring the flow rate of the chemical liquid flowing in each chemical liquid supply passage 18 is provided in each chemical liquid supply passage 18.
Is provided. The measurement signals (current chemical supply flow rate values Sm1, Sm2) from these chemical flow rate sensors 20 are given to the controller 5 described later.
【００３０】調合部１３の下流側に配設された切換え弁
１４は、純水供給路１１とノズル２とを接続する状態
と、純水供給路１１と排液ドレイン２１とを接続する状
態とに切り換えるための弁である。The switching valve 14 arranged on the downstream side of the brewing section 13 has a state in which the pure water supply passage 11 and the nozzle 2 are connected and a state in which the pure water supply passage 11 and the drainage drain 21 are connected. This is a valve for switching to.
【００３１】この切換え弁１４は、図３に示すように２
個の開閉弁１４ａ、１４ｂを組み合わせて構成されてい
る。ノーマル状態では、図３（ａ）に示すように純水供
給路１１と排液ドレイン２１とを接続する状態、すなわ
ち、調合部１３からの液が排液ドレイン２１に流される
状態になっていて、後述するコントローラ５から切換え
信号（ＣＳ）が与えられると、その間、図３（ｂ）に示
すように純水供給路１１とノズル２とを接続する状態、
すなわち、調合部１３で混合された処理液がノズル２に
流される状態に切り換えられるようになっている。な
お、切換え弁１４としては電磁式の三方弁などで構成し
てもよい。As shown in FIG. 3, this switching valve 14 has two
It is configured by combining individual on-off valves 14a and 14b. In the normal state, as shown in FIG. 3A, the pure water supply path 11 and the drainage drain 21 are connected to each other, that is, the liquid from the blending section 13 is allowed to flow into the drainage drain 21. When a switching signal (CS) is given from the controller 5 to be described later, a state in which the pure water supply path 11 and the nozzle 2 are connected during that period, as shown in FIG.
That is, the processing liquid mixed in the blending unit 13 can be switched to a state in which the processing liquid is flowed to the nozzle 2. The switching valve 14 may be an electromagnetic three-way valve or the like.
【００３２】コントローラ５には、各基板Ｗに供給する
処理液を調合する際の純水と各薬液との混合条件を含む
各基板Ｗに対する処理条件が、処理条件入力部６から入
力されるように構成され、この処理条件に従って、コン
トローラ５は、装置全体、すなわち、基板処理部３およ
び処理液調合ユニット４に対する制御を行う。処理条件
の入力は、例えば、作業者により行われる。To the controller 5, the processing conditions for the respective substrates W, including the mixing conditions of pure water and the respective chemical liquids when preparing the processing liquids to be supplied to the respective substrates W, are input from the processing condition input unit 6. In accordance with this processing condition, the controller 5 controls the entire apparatus, that is, the substrate processing unit 3 and the processing liquid preparation unit 4. The operator inputs the processing conditions, for example.
【００３３】処理液調合ユニット４に対する制御には、
薬液流量調節弁１６の開閉および弁の開度の調節制御、
切換え弁１４の切換え制御を含んでいる。For the control of the processing liquid preparation unit 4,
Opening and closing of the chemical liquid flow rate control valve 16 and adjustment control of the opening degree of the valve,
The switching control of the switching valve 14 is included.
【００３４】混合条件は、調合する処理液内の純水と各
薬液の混合比率を指定する条件であり、純水と各薬液の
混合比率を混合条件として入力してもよいし、純水流量
が予め決められた流量に維持されていて既知であるから
その純水流量に対する薬液供給流量を混合条件として入
力してもよい。The mixing condition is a condition for designating the mixing ratio of pure water and each chemical liquid in the processing liquid to be prepared, and the mixing ratio of pure water and each chemical liquid may be inputted as the mixing condition, or the pure water flow rate. Is maintained at a predetermined flow rate and is known, the chemical solution supply flow rate with respect to the pure water flow rate may be input as the mixing condition.
【００３５】混合比率で入力される場合、純水流量が既
知であるから、入力された混合比率で処理液を調合する
ための薬液供給流量を特定することができる。例えば、
純水流量をＦｐ、入力された混合比率が（純水：薬液
１：薬液２＝ｈｐ：ｈｍ１：ｈｍ２、例えば、１０：
１：２）であれば、薬液１の純水供給路１１への薬液供
給流量は〔Ｆｐ×（ｈｍ１／ｈｐ）〕、薬液２の純水供
給路１１への薬液供給流量は〔Ｆｐ×（ｈｍ２／ｈ
ｐ）〕となる。When the mixing ratio is input, the pure water flow rate is known, so that the chemical liquid supply flow rate for preparing the processing liquid can be specified at the input mixing ratio. For example,
The pure water flow rate is Fp, and the input mixing ratio is (pure water: chemical solution 1: chemical solution 2 = hp: hm1: hm2, for example, 10:
1: 2), the chemical solution supply flow rate of the chemical solution 1 to the pure water supply path 11 is [Fp × (hm1 / hp)], and the chemical solution supply flow rate of the chemical solution 2 to the pure water supply path 11 is [Fp × ( hm2 / h
p)].
【００３６】コントローラ５は、入力された混合条件か
ら各薬液の目標とする薬液供給流量（Ｔｍ１、Ｔｍ２）
を決めると、その目標の薬液供給流量（Ｔｍ１、Ｔｍ
２）と、各薬液流量センサ２０からの各薬液供給量現在
値（Ｓｍ１、Ｓｍ２）とに基づき、フィードバック制御
で各薬液流量調節弁１６の弁の開度を調節する。すなわ
ち、コントローラ５は、各薬液供給量現在値（Ｓｍ１、
Ｓｍ２）を監視しながら、各薬液供給量現在値（Ｓｍ
１、Ｓｍ２）と目標の薬液供給流量（Ｔｍ１、Ｔｍ２）
との偏差を無くすように、操作電圧（Ｖｍ１、Ｖｍ２）
を各電空レギュレータ１９に与えていき、各薬液供給量
現在値（Ｓｍ１、Ｓｍ２）と目標の薬液供給流量（Ｔｍ
１、Ｔｍ２）との偏差が無くなった状態の操作電圧（Ｖ
ｍ１、Ｖｍ２）を維持する。The controller 5 sets the target chemical liquid supply flow rate (Tm1, Tm2) of each chemical liquid based on the input mixing conditions.
The target chemical liquid supply flow rate (Tm1, Tm
2) and the current value (Sm1, Sm2) of each chemical liquid supply amount from each chemical liquid flow rate sensor 20, the valve opening of each chemical liquid flow rate control valve 16 is adjusted by feedback control. That is, the controller 5 causes the current value of each chemical liquid supply (Sm1,
While monitoring Sm2), the current value of each chemical liquid supply (Sm2)
1, Sm2) and target chemical liquid supply flow rate (Tm1, Tm2)
Operating voltage (Vm1, Vm2) so as to eliminate the deviation from
To the respective electropneumatic regulators 19, and the respective chemical liquid supply current values (Sm1, Sm2) and the target chemical liquid supply flow rate (Tm
1, Tm2), the operating voltage (V
m1, Vm2) is maintained.
【００３７】次に、本装置による１枚の基板Ｗに対する
処理動作を説明する。処理対象の基板Ｗが基板処理部３
に搬入されると、コントローラ５はその基板Ｗをスピン
チャック１に保持させる。この基板Ｗに対する処理条件
は処理条件入力部６から入力され、コントローラ５に与
えられる。コントローラ５は、その処理条件に従って、
純水と薬液とを混合した処理液を基板Ｗに供給して行う
処理を含む所定の処理を行わせる。このとき、コントロ
ーラ５は、純水と薬液とを混合した処理液を基板Ｗに供
給する開始タイミング（処理液供給開始タイミングｔ
ｓ）を処理条件によって特定する。Next, the processing operation for one substrate W by this apparatus will be described. The substrate W to be processed is the substrate processing unit 3
Then, the controller 5 causes the spin chuck 1 to hold the substrate W. The processing condition for the substrate W is input from the processing condition input unit 6 and given to the controller 5. The controller 5, according to the processing conditions,
Predetermined processing including processing performed by supplying a processing liquid in which pure water and a chemical liquid are mixed to the substrate W is performed. At this time, the controller 5 starts the supply of the processing liquid obtained by mixing pure water and the chemical liquid to the substrate W (processing liquid supply start timing t
s) is specified by the processing conditions.
【００３８】図４は、純水と各薬液とを混合して得られ
た処理液を基板Ｗに供給して行う処理前後における切換
え弁１４の切換え状態を示している。図に示すように、
切換え弁１４は、処理液供給開始タイミングｔｓから処
理時間ＰＴ（１０秒程度）の間だけ、ノズル２に処理液
を流す状態にされ、それ以外は排液ドレイン２１に処理
液を流す状態にされる。これにより、処理液供給開始タ
イミングｔｓから処理時間ＰＴの間だけ純水と各薬液と
を入力された混合条件で混合した処理液がノズル２から
基板Ｗに噴出供給される。このとき、基板Ｗはスピンチ
ャック１とともに軸芯Ｊ周りに回転されている。処理時
間ＰＴは、一義的に決めておいてもよいし、処理条件で
指定するようにしてもよい。FIG. 4 shows the switching state of the switching valve 14 before and after the processing in which the processing liquid obtained by mixing pure water and each chemical liquid is supplied to the substrate W. As shown in the figure,
The switching valve 14 is in a state in which the processing liquid is allowed to flow through the nozzle 2 only during the processing time PT (about 10 seconds) from the processing liquid supply start timing ts, and is in a state in which the processing liquid is allowed to flow through the drain drain 21 otherwise. It As a result, the processing liquid obtained by mixing pure water and each chemical liquid under the input mixing conditions is jetted and supplied from the nozzle 2 to the substrate W only during the processing time PT from the processing liquid supply start timing ts. At this time, the substrate W is rotated around the axis J together with the spin chuck 1. The processing time PT may be uniquely determined or may be specified by the processing condition.
【００３９】図４中のｔｃは、上述したフィードバック
制御による各薬液流量調節弁１６の弁の開度の調節を開
始するタイミング（処理液調合開始タイミング）であ
る。すなわち、コントローラ５は、処理液供給開始タイ
ミングｔｓよりも準備時間ＡＴ（数秒程度）だけ早いタ
イミング（ｔｃ）でフィードバック制御による各薬液流
量調節弁１６の弁の開度の調節を開始する。この処理液
調合開始タイミングｔｃの時点では切換え弁１４は処理
液を排液ドレイン２１に流す状態となっており、コント
ローラ５は、処理液調合開始タイミングｔｃから準備時
間ＡＴの間は処理液を排液ドレイン２１に流す状態を維
持し、準備時間ＡＴが経過した時点で処理液をノズル２
に流す状態に切換え、以後、処理時間ＰＴの間、処理液
をノズル２に流す状態を維持して、処理時間ＰＴが経過
した時点で処理液を排液ドレイン２１に流す状態に切換
えるように制御する。In FIG. 4, tc is a timing at which the adjustment of the opening degree of each chemical liquid flow rate control valve 16 by the above-described feedback control is started (treatment liquid preparation start timing). That is, the controller 5 starts adjusting the opening degree of each chemical liquid flow rate control valve 16 by feedback control at a timing (tc) earlier than the processing liquid supply start timing ts by the preparation time AT (about several seconds). At the time of this processing liquid preparation start timing tc, the switching valve 14 is in a state of flowing the processing liquid to the drain 21, and the controller 5 discharges the processing liquid from the processing liquid preparation start timing tc to the preparation time AT. The treatment liquid is kept flowing to the liquid drain 21, and the treatment liquid is discharged from the nozzle 2 when the preparation time AT has elapsed.
Control to switch to a state of flowing the treatment liquid to the nozzle 2 during the treatment time PT, and to switch the treatment liquid to the drain drain 21 when the treatment time PT elapses. To do.
【００４０】フィードバック制御による各薬液流量調節
弁１６の弁の開度の調節を開始してから、入力された混
合条件に応じた目標の各薬液供給流量で各薬液が純水供
給路１１に供給されるように各薬液流量調節弁１６の弁
の開度が調節されるまでにある程度の時間を要する。ま
た、調合部１３において入力された混合条件で純水と各
薬液とが混合されて所望の処理液が調合され始めてから
その処理液が切換え弁１４の入口側に到達するまでにも
ある程度の時間を要する。従って、フィードバック制御
による各薬液流量調節弁１６の弁の開度の調節を開始し
てから、入力された混合条件で純水と各薬液とが混合さ
れた処理液が切換え弁１４の入口側に安定的に流れてく
るようになるまでに要する時間を準備時間ＡＴとして設
定し、処理液調合開始タイミングｔｃから準備時間ＡＴ
の間は処理液を排液ドレイン２１に流す状態を維持し、
準備時間ＡＴが経過した時点で処理液をノズル２に流す
状態に切換えるように制御することにより、入力された
混合条件で純水と各薬液とが混合されるに至っていない
処理液を基板Ｗに供給するような不都合を防止すること
ができる。また、処理条件から決まる処理液供給開始タ
イミングｔｓで、フィードバック制御による各薬液流量
調節弁１６の弁の開度の調節を開始すると、基板Ｗに処
理液を供給できるまでに待ち時間が発生するが、処理条
件から決まる処理液供給開始タイミングｔｓより準備時
間ＡＴだけ早くフィードバック制御による各薬液流量調
節弁１６の弁の開度の調節を開始（準備時間ＡＴの間
は、基板処理部３で他の処理を行ってもよい）すること
で、待ち時間なく予定通りに基板Ｗへの処理液の供給を
開始できる。After starting the adjustment of the valve opening degree of each chemical liquid flow control valve 16 by the feedback control, each chemical liquid is supplied to the pure water supply passage 11 at the target chemical liquid supply flow rate corresponding to the input mixing condition. As described above, it takes a certain amount of time for the opening degree of each chemical liquid flow rate control valve 16 to be adjusted. In addition, a certain amount of time is required from when the pure water and each chemical liquid are mixed under the mixing conditions input in the mixing unit 13 to start preparation of a desired processing liquid until the processing liquid reaches the inlet side of the switching valve 14. Requires. Therefore, after starting the adjustment of the opening degree of the valve of each chemical liquid flow rate control valve 16 by the feedback control, the treatment liquid in which pure water and each chemical liquid are mixed under the input mixing condition is supplied to the inlet side of the switching valve 14. The time required for stable flow is set as the preparation time AT, and the preparation time AT is set from the processing liquid preparation start timing tc.
During this period, the processing liquid is kept flowing to the drain 21.
When the preparation time AT has elapsed, the processing liquid is controlled to flow into the nozzle 2 so that the processing liquid which has not been mixed with the pure water and the chemical liquids under the input mixing conditions is applied to the substrate W. It is possible to prevent inconvenience such as supply. Further, when the opening degree of the valve of each chemical liquid flow rate control valve 16 is started by the feedback control at the processing liquid supply start timing ts determined by the processing condition, a waiting time occurs before the processing liquid can be supplied to the substrate W. , The adjustment of the opening degree of the valve of each chemical liquid flow rate control valve 16 by the feedback control is started earlier than the processing liquid supply start timing ts determined by the processing condition by the preparation time AT (during the preparation time AT, the substrate processing unit 3 does not By performing the processing), the supply of the processing liquid to the substrate W can be started as scheduled without waiting time.
【００４１】なお、準備時間ＡＴは一義的に決めておい
てもよいし、薬液の調合を行うごとに、混合条件に応じ
て準備時間ＡＴを個別に決めるようにしてもよい。混合
条件が異なると、各薬液流量調節弁１６の弁の開度の調
節に要する時間に差が出ることが考えられるが、その調
節時間の変動が大きい場合には、後者のように準備時間
ＡＴを決めることで、薬液の調合を行うごとに最適な準
備時間ＡＴが設定できる。準備時間ＡＴの間に純水供給
路１１に供給される薬液は廃棄されるので、準備時間Ａ
Ｔが不必要に長いと、無駄に廃棄する薬液量が増える
が、薬液の調合を行うごとに最適な準備時間ＡＴを設定
することで、無駄に廃棄する薬液量を最小に抑えること
ができる。The preparation time AT may be uniquely determined, or the preparation time AT may be individually determined according to the mixing conditions each time a chemical solution is prepared. When the mixing conditions are different, the time required for adjusting the opening degree of the valve of each chemical liquid flow rate control valve 16 may be different, but when the fluctuation of the adjustment time is large, the preparation time AT By determining, the optimum preparation time AT can be set every time the chemical solution is prepared. Since the chemical liquid supplied to the pure water supply path 11 during the preparation time AT is discarded, the preparation time A
If T is unnecessarily long, the amount of the waste chemical liquid to be wasted increases, but by setting the optimum preparation time AT each time the chemical liquid is prepared, the amount of waste chemical liquid to be wasted can be minimized.
【００４２】ところで、処理時間ＰＴが経過してから次
の基板Ｗに対する処理液供給開始タイミングｔｓまでの
間は、切換え弁１４は処理液を排液ドレイン２１に流す
状態になっている。従って、各電空レギュレータ１９へ
の操作電圧を処理時間ＰＴのときのまま維持している
と、不必要な薬液の廃棄量が増えることになり、無駄な
薬液の使用量が増加することになる。そこで、コントロ
ーラ５は、処理時間ＰＴが経過した時点で、各薬液流量
調節弁１６にエアを供給しない（弁を閉じる）ようにす
る操作電圧を電空レギュレータ１９に与えて、薬液供給
路１８から純水供給路１１への薬液の供給を停止させる
ように制御する。これにより、薬液の廃棄は、準備時間
ＡＴの間だけにとなり、無駄な薬液の使用量を大幅に低
減することができる。By the way, from the time when the processing time PT elapses until the next processing liquid supply start timing ts to the substrate W, the switching valve 14 is in a state of flowing the processing liquid to the drain 21. Therefore, if the operating voltage to each electropneumatic regulator 19 is maintained at the processing time PT, the amount of unnecessary chemical liquid discarded increases, and the amount of useless chemical liquid used increases. . Therefore, the controller 5 applies an operation voltage to the electropneumatic regulator 19 so as not to supply air to each chemical liquid flow rate control valve 16 (closes the valve) at the time when the processing time PT elapses, so that the chemical liquid supply path 18 is operated. Control is performed so that the supply of the chemical liquid to the pure water supply passage 11 is stopped. As a result, the chemical liquid is discarded only during the preparation time AT, and the useless amount of the chemical liquid can be significantly reduced.
【００４３】本装置は、各基板Ｗごとに上記のように装
置を制御して各基板Ｗを処理する。すなわち、本装置で
は、基板Ｗに供給する処理液を、作り置きしておくので
はなく、必要な時に、必要な量だけ、指定された混合条
件に従って調合するので、混合比率を頻繁に変更して処
理するような場合でも、作り置きの処理液を廃棄した
り、処理が中断されたり、連続処理が妨げられたりする
などの不都合を招かずに、柔軟に対応することができ、
また、処理液のライフタイム管理なども不要となる。さ
らに、本装置によれば、入力された混合条件に従って処
理液が自動的に調合されるので、作業者は混合条件を入
力するだけで、その他の調節作業などを行う必要がな
く、作業者の負担を軽減することもできる。The present apparatus controls the apparatus as described above for each substrate W to process each substrate W. That is, in the present apparatus, the processing liquid to be supplied to the substrate W is not prepared in advance, but when necessary, in the required amount and according to the specified mixing conditions, the mixing ratio is frequently changed. Even in the case of processing by treating it, it is possible to flexibly cope with it without inconvenience such as discarding the stock processing liquid, interrupting the processing, or interrupting the continuous processing.
Further, it is not necessary to manage the lifetime of the processing liquid. Further, according to the present apparatus, the treatment liquid is automatically prepared according to the input mixing conditions, so that the operator does not need to perform other adjustment work simply by inputting the mixing conditions, The burden can also be reduced.
【００４４】なお、１枚の基板Ｗに対して処理液を基板
Ｗに供給する処理を２回以上行う場合には、各処理で使
用する処理液の調合を上記と同様に行えばよい。When the treatment liquid is supplied to the substrate W more than once for one substrate W, the treatment liquids used in the respective treatments may be prepared in the same manner as described above.
【００４５】ところで、上記の実施形態では、純水供給
路１１に流れる純水の流量が一定に維持されていること
を前提にしているが、例えば、純水供給路１１の流路抵
抗が変動すれば、純水圧力を一定に維持していても純水
供給路１１に流れる純水の流量が変動する。この場合、
処理液内の純水と各薬液との混合比率が変動するので、
入力された混合条件通りに調合された処理液を得ること
ができなくなる。そこで、図５に示すように、純水供給
路１１に、これに流れる純水の流量を計測する純水流量
センサ４０を配設し、この純水流量センサ４０からの計
測信号（純水流量現在値Ｓｐ）をコントローラ５で監視
し、純水供給路１１内の純水流量が予め決められた所定
の流量から外れたときブザーなどの警報機器４１から警
報を発して、純水流量の変動を作用者に知らせるように
構成してもよい。さらに、純水供給路１１内の純水流量
が予め決められた所定の流量から外れたとき処理を中断
するように基板処理部３を制御してもよい。By the way, in the above embodiment, it is premised that the flow rate of the pure water flowing through the pure water supply passage 11 is kept constant, but, for example, the flow resistance of the pure water supply passage 11 varies. Then, the flow rate of pure water flowing in the pure water supply passage 11 varies even if the pure water pressure is maintained constant. in this case,
Since the mixing ratio of pure water in the processing liquid and each chemical liquid varies,
It is no longer possible to obtain a treatment liquid prepared according to the input mixing conditions. Therefore, as shown in FIG. 5, a pure water flow rate sensor 40 for measuring the flow rate of pure water flowing through the pure water supply path 11 is provided, and a measurement signal (pure water flow rate) from the pure water flow rate sensor 40 is provided. The present value Sp) is monitored by the controller 5, and when the pure water flow rate in the pure water supply path 11 deviates from a predetermined flow rate, an alarm is issued from an alarm device 41 such as a buzzer to change the pure water flow rate. May be configured to be notified to the operator. Further, the substrate processing unit 3 may be controlled so that the processing is interrupted when the pure water flow rate in the pure water supply passage 11 deviates from a predetermined flow rate.
【００４６】また、純水流量センサ４０からの純水流量
現在値Ｓｐをコントローラ５で監視し、純水供給路１１
内の純水流量が予め決められた所定の流量から外れたと
き、純水供給路１１内の純水流量を予め決められた所定
の流量に戻し、維持するように、フィードバック制御で
純水圧力調節器１２および電空レギュレータ１５を制御
してもよい。すなわち、純水流量現在値Ｓｐと予め決め
られた所定の流量との偏差を無くすように、電空レギュ
レータ１５に与える操作電圧Ｖｐを調節し、純水流量現
在値Ｓｐと予め決められた所定の流量との偏差が無くな
った状態の操作電圧Ｖｐを維持する。Further, the controller 5 monitors the pure water flow rate current value Sp from the pure water flow rate sensor 40, and the pure water supply path 11
When the pure water flow rate in the inside deviates from a predetermined predetermined flow rate, the pure water pressure in the pure water supply path 11 is returned to and maintained at the predetermined predetermined flow rate by the feedback control. The regulator 12 and the electropneumatic regulator 15 may be controlled. That is, the operation voltage Vp applied to the electropneumatic regulator 15 is adjusted so as to eliminate the deviation between the pure water flow rate current value Sp and the predetermined predetermined flow rate, and the pure water flow rate current value Sp and the predetermined predetermined flow rate are adjusted. The operating voltage Vp is maintained in a state where there is no deviation from the flow rate.
【００４７】また、上記実施形態では、純水供給路１１
に流れる純水流量の調節を純水圧力で調節するように構
成したが、例えば、薬液流量調節弁１６と同様の構成の
流量調節弁を調合部１３より上流側の純水供給路１１に
配設して、この流量調節弁で純水供給路１１に流れる純
水流量を調節するように構成してもよい。この場合に
も、純水の流量調節弁の破損や誤動作などを考量して、
上記図５のように純水流量センサ４０を設けて、純水流
量を監視し、純水流量が予め設定された所定の流量から
外れたとき警報機器４１から警報を発するように構成し
てもよい。Further, in the above embodiment, the pure water supply passage 11 is provided.
The pure water flow rate is adjusted by pure water pressure. For example, a flow rate control valve having the same configuration as the chemical liquid flow rate control valve 16 is arranged in the pure water supply passage 11 upstream of the blending section 13. Alternatively, the flow rate control valve may be used to control the flow rate of pure water flowing through the pure water supply passage 11. Also in this case, consider the damage and malfunction of the pure water flow control valve,
As shown in FIG. 5, the pure water flow rate sensor 40 may be provided to monitor the pure water flow rate and to issue an alarm from the alarm device 41 when the pure water flow rate deviates from a preset predetermined flow rate. Good.
【００４８】上記実施形態では、純水に２種類の薬液を
混合することができる装置を示しているが、純水と１種
類の薬液とを混合する場合には、薬液供給源１７から薬
液流量調節弁１６までの薬液供給系を１系統だけ備えれ
ばよいし、純水と３種類以上の薬液とを混合する場合に
は、前記薬液供給系を３系統以上備えればよい。In the above embodiment, an apparatus capable of mixing two kinds of chemical liquids with pure water is shown. However, when mixing pure water and one kind of chemical liquid, the chemical liquid flow rate from the chemical liquid supply source 17 is used. It is sufficient to provide only one system of chemical liquid supply system up to the control valve 16, and when mixing pure water and three or more types of chemical liquids, three or more system of chemical liquid supply systems may be provided.
【００４９】[0049]
【発明の効果】以上の説明から明らかなように、請求項
１に記載の発明によれば、所定の流量で純水が流されて
いる純水供給路に薬液を直接供給して純水供給路内で純
水と薬液とを混合して処理液を調合しその処理液を処理
液供給部から基板に供給するとともに、純水供給路に供
給する薬液供給流量を適宜に調節可能に構成しているの
で、処理液の調合を常時自動で行うことができ、作業者
の手間を省くことができるとともに、混合条件が頻繁に
変更されても、その変更を速やかに行え、処理を中断し
たり、連続処理が妨げられることがない。また、純水供
給路に供給する薬液供給流量を実測値を監視しながらフ
ィードバック制御で薬液供給流量を調節するように構成
しているので、所望の混合条件で純水と薬液とを混合し
た処理液の調合を正確に行うことができる。さらに、薬
液供給流量調節手段に対するフィードバック制御を開始
した時点から所定の準備時間の間は純水供給路と排液ド
レインとを接続した状態を維持し、準備時間が経過した
時点で純水供給路と処理液供給部とを接続した状態に切
換えるようにしているので、混合条件で純水と薬液とが
混合されるに至っていない処理液を基板に供給するよう
な不都合を防止することができる。As is apparent from the above description, according to the first aspect of the invention, the pure water is supplied by directly supplying the chemical solution to the pure water supply passage in which the pure water is flowed at a predetermined flow rate. Pure water and a chemical solution are mixed in the passage to prepare a treatment liquid, the treatment liquid is supplied from the treatment liquid supply unit to the substrate, and the chemical liquid supply flow rate to be supplied to the pure water supply passage is appropriately adjustable. Since the processing liquid can be constantly and automatically prepared, the labor of the operator can be saved, and even if the mixing conditions are frequently changed, the changes can be promptly made and the processing can be interrupted. , Continuous processing is not hindered. Further, since the chemical liquid supply flow rate to be supplied to the pure water supply path is configured to be adjusted by feedback control while monitoring the actual measurement value, a process in which pure water and chemical liquid are mixed under desired mixing conditions The liquid can be accurately prepared. Further, the state in which the pure water supply passage and the drainage drain are connected is maintained for a predetermined preparation time from the time when the feedback control for the chemical liquid supply flow rate adjusting means is started, and the pure water supply passage is provided when the preparation time elapses. Since the processing liquid supply unit and the processing liquid supply unit are switched to the connected state, it is possible to prevent the disadvantage that the processing liquid, which has not been mixed with the pure water and the chemical liquid under the mixing condition, is supplied to the substrate.
【００５０】請求項２に記載の発明によれば、処理時間
が経過した時点で薬液供給路から純水供給路への薬液の
供給を停止するように薬液供給流量調節手段を制御する
ように構成したので、基板への処理液の供給を停止した
後、薬液を排液ドレインから廃棄し続けることがなく、
無駄な薬液の使用量を低減することができる。According to the second aspect of the invention, the chemical liquid supply flow rate adjusting means is controlled so that the supply of the chemical liquid from the chemical liquid supply passage to the pure water supply passage is stopped when the processing time has elapsed. Therefore, after stopping the supply of the processing liquid to the substrate, it is not necessary to continuously discard the chemical liquid from the drain drain,
It is possible to reduce the amount of useless chemical liquid used.
【００５１】請求項３に記載の発明によれば、純水流量
計測手段で計測される純水流量現在値を監視し、薬液が
純水供給路に導入される位置よりも上流側の純水供給路
内の純水流量が予め設定された所定の流量から外れたと
き警報を発するように構成しているので、純水流量調節
手段の破損や誤動作などにより調合する処理液の混合条
件が、入力された混合条件通りにならなくなったら、す
ぐに作業者はその異常を知ることができる。According to the third aspect of the invention, the pure water flow rate present value measured by the pure water flow rate measuring means is monitored, and the pure water on the upstream side of the position where the chemical is introduced into the pure water supply passage. Since the alarm is issued when the pure water flow rate in the supply path deviates from a preset predetermined flow rate, the mixing conditions of the processing liquid to be prepared due to damage or malfunction of the pure water flow rate adjusting means, When the inputted mixing conditions are not met, the operator can immediately know the abnormality.
【図１】本発明の一実施形態に係る基板処理装置の概略
構成を示す図である。FIG. 1 is a diagram showing a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention.
【図２】薬液流量調節弁の一例の構造を示す断面図であ
る。FIG. 2 is a cross-sectional view showing the structure of an example of a chemical liquid flow rate control valve.
【図３】切換え弁の一例の構成を示す図である。FIG. 3 is a diagram showing a configuration of an example of a switching valve.
【図４】切換え弁の切換え制御を説明するためのタイム
チャートである。FIG. 4 is a time chart for explaining switching control of a switching valve.
【図５】本発明の別の実施形態に係る基板処理装置の概
略構成を示す図である。FIG. 5 is a diagram showing a schematic configuration of a substrate processing apparatus according to another embodiment of the present invention.
【図６】従来装置の構成を示す図である。FIG. 6 is a diagram showing a configuration of a conventional device.
１：スピンチャック ２：ノズル ５：コントローラ ６：処理条件入力部 １０：純水供給源 １１：純水供給路 １２：純水圧力調節器 １４：切換え弁 １５、１９：電空レギュレータ １６：薬液流量調節弁 １７：薬液供給源 １８：薬液供給路 ２０：薬液流量センサ ２１：排液ドレイン ４０：純水流量センサ ４１：警報機器 Ｗ：基板 1: Spin chuck 2: Nozzle 5: Controller 6: Processing condition input section 10: Pure water supply source 11: Pure water supply path 12: Pure water pressure controller 14: Switching valve 15, 19: Electropneumatic regulator 16: Chemical liquid flow control valve 17: Chemical liquid supply source 18: Chemical supply path 20: Chemical flow rate sensor 21: drainage drain 40: Pure water flow rate sensor 41: Alarm device W: Substrate
───────────────────────────────────────────────────── フロントページの続き (72)発明者 上野 賢治 京都府京都市伏見区羽束師古川町322 大日本スクリーン製造株式会社 洛西事 業所内 (56)参考文献 特開 平３−161078（ＪＰ，Ａ) 特開 平３−114565（ＪＰ，Ａ) 実開 平４−99269（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) B05C 11/08 B05C 11/10 G03F 7/30 H01L 21/027 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Kenji Ueno Kenji Ueno 322 Hazushishi Furukawa-cho, Fushimi-ku, Kyoto, Kyoto Prefecture Dainippon Screen Mfg. Co., Ltd. Rakusai Works (56) Reference Japanese Patent Laid-Open No. 3-161078 (JP, A) ) Japanese Patent Laid-Open No. 3-114565 (JP, A) Fudokai 4-99269 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) B05C 11/08 B05C 11/10 G03F 7 / 30 H01L 21/027
Claims (3)
して得られた処理液を前記保持された基板に供給して処
理する枚葉式の基板処理装置であって、 基板を１枚保持する基板保持手段と、 前記基板保持手段に保持された基板に処理液を供給する
処理液供給部と、 前記処理液供給部と純水供給源との間に接続される純水
供給路と、 薬液供給源に一端が接続され、他端が前記純水供給路の
途中に接続された薬液供給路と、 薬液が前記純水供給路に導入される位置よりも上流側の
前記純水供給路に配設され、前記純水供給路内の純水流
量を予め決められた所定の流量に調節する純水流量調節
手段と、 前記薬液供給路に配設され、前記薬液供給路から前記純
水供給路に供給する薬液供給流量を任意に調節し得る薬
液供給流量調節手段と、 前記薬液供給路に配設され、前記薬液供給路から前記純
水供給路に供給される薬液供給流量現在値を計測する薬
液供給流量計測手段と、 各基板に供給する処理液を調合する際の純水と薬液との
混合条件を入力する混合条件入力手段と、 薬液が前記純水供給路に導入される位置よりも下流側の
前記純水供給路に配設され、前記純水供給路と前記処理
液供給部とを接続する状態と、前記純水供給路と排液ド
レインとを接続する状態とに切り換える切換え手段と、 入力された混合条件と前記薬液供給流量計測手段で計測
される薬液供給流量現在値とに基づき、フィードバック
制御で前記薬液供給流量調節手段を制御し、入力された
混合条件で純水と薬液とを混合して処理液を得るように
薬液供給流量を調節するとともに、前記薬液供給流量調
節手段に対するフィードバック制御を開始した時点から
所定の準備時間の間は前記純水供給路と排液ドレインと
を接続する状態を維持し、前記準備時間が経過した時点
で前記純水供給路と前記処理液供給部とを接続する状態
に切換え、以後、所定の処理時間の間は前記純水供給路
と前記処理液供給部とを接続する状態を維持して、前記
処理時間が経過した時点で前記純水供給路と排液ドレイ
ンとを接続する状態に切換えるように前記切換え手段を
制御する制御手段と、 を備えたことを特徴とする基板処理装置。1. A single-wafer type substrate processing apparatus for holding one substrate and supplying a processing liquid obtained by mixing pure water and a chemical liquid to the held substrate for processing. A substrate holding means for holding one substrate, a processing liquid supply unit for supplying a processing liquid to the substrate held by the substrate holding unit, and pure water connected between the processing liquid supply unit and a pure water supply source A supply path and a chemical solution supply path, one end of which is connected to the chemical solution supply source and the other end of which is connected in the middle of the pure water supply path, and the upstream side of a position where the chemical solution is introduced into the pure water supply path. A pure water flow rate adjusting means provided in the pure water supply path and adjusting the pure water flow rate in the pure water supply path to a predetermined flow rate; and the chemical solution supply path provided in the chemical solution supply path. A chemical liquid supply flow rate adjusting means capable of arbitrarily adjusting the chemical liquid supply flow rate to be supplied to the pure water supply passage from the above; A chemical liquid supply flow rate measuring means arranged in the supply path for measuring the current value of the chemical liquid supply flow rate supplied from the chemical liquid supply path to the pure water supply path, and pure water for preparing a processing liquid to be supplied to each substrate. Mixing condition input means for inputting a mixing condition between the pure water and the chemical liquid; and the pure water supply passage and the treatment, which are arranged on the pure water supply passage downstream of the position where the chemical liquid is introduced into the pure water supply passage. Switching means for switching between a state in which the liquid supply unit is connected and a state in which the pure water supply path and the drainage drain are connected, input mixing conditions, and the chemical liquid supply flow rate measured by the chemical liquid supply flow rate measuring means. Based on the current value, the chemical solution supply flow rate adjusting means is controlled by feedback control, and the chemical solution supply flow rate is adjusted so as to obtain a processing solution by mixing pure water and the chemical solution under the input mixing conditions. For supply flow control means The state in which the pure water supply path and the drainage drain are connected is maintained for a predetermined preparation time from the time when the feedback control is started, and the pure water supply path and the processing liquid are maintained when the preparation time elapses. After switching to a state in which the pure water supply path and the processing liquid supply section are connected for a predetermined processing time, the pure water is maintained when the processing time elapses. A substrate processing apparatus comprising: a control unit that controls the switching unit to switch to a state in which the water supply path and the drainage drain are connected.
て、 前記制御手段は、前記処理時間が経過した時点で前記薬
液供給路から前記純水供給路への薬液の供給を停止する
ように前記薬液供給流量調節手段を制御することを特徴
とする基板処理装置。2. The substrate processing apparatus according to claim 1, wherein the control means stops the supply of the chemical liquid from the chemical liquid supply passage to the pure water supply passage when the processing time elapses. A substrate processing apparatus characterized by controlling a chemical liquid supply flow rate adjusting means.
において、 薬液が前記純水供給路に導入される位置よりも上流側の
前記純水供給路に配設され、前記純水供給路内の純水流
量現在値を計測する純水流量計測手段と、 前記計測される純水流量現在値を監視し、薬液が前記純
水供給路に導入される位置よりも上流側の前記純水供給
路内の純水流量が予め決められた所定の流量から外れた
とき警報を発する監視手段と、 をさらに備えたことを特徴とする基板処理装置。3. The substrate processing apparatus according to claim 1, wherein the pure water supply passage is provided in the pure water supply passage upstream of a position where a chemical solution is introduced into the pure water supply passage. A pure water flow rate measuring means for measuring a current pure water flow rate value, and the pure water flow rate upstream of a position where a chemical solution is introduced into the pure water supply path by monitoring the measured pure water flow rate current value. The substrate processing apparatus further comprising: a monitoring unit that issues an alarm when the pure water flow rate in the supply path deviates from a predetermined flow rate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27871497A JP3529251B2 (en) | 1997-10-13 | 1997-10-13 | Substrate processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27871497A JP3529251B2 (en) | 1997-10-13 | 1997-10-13 | Substrate processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11114474A JPH11114474A (en) | 1999-04-27 |
| JP3529251B2 true JP3529251B2 (en) | 2004-05-24 |
Family
ID=17601176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27871497A Expired - Lifetime JP3529251B2 (en) | 1997-10-13 | 1997-10-13 | Substrate processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3529251B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4891589B2 (en) * | 2005-10-11 | 2012-03-07 | 東京エレクトロン株式会社 | Liquid processing apparatus, processing liquid supply method, and processing liquid supply program |
| JP2011176125A (en) * | 2010-02-24 | 2011-09-08 | Tokyo Electron Ltd | Liquid treatment apparatus, liquid treatment method, program, and program recording medium |
| JP2012074601A (en) * | 2010-09-29 | 2012-04-12 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus and substrate processing method |
| JP6212253B2 (en) * | 2012-11-15 | 2017-10-11 | 株式会社荏原製作所 | Substrate cleaning apparatus and substrate cleaning method |
| KR102149485B1 (en) * | 2013-01-04 | 2020-08-31 | 세메스 주식회사 | Unit for supplying chemical, Appratus and Method for treating substrate with the unit |
| JP2014171978A (en) * | 2013-03-08 | 2014-09-22 | Toshiba Corp | Coating liquid coating apparatus and coating liquid coating method |
| JP6439964B2 (en) * | 2014-09-17 | 2018-12-19 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing equipment |
-
1997
- 1997-10-13 JP JP27871497A patent/JP3529251B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11114474A (en) | 1999-04-27 |
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