CN110199292A - 光学通路调制器及制造方法、图像识别传感器和电子设备 - Google Patents
光学通路调制器及制造方法、图像识别传感器和电子设备 Download PDFInfo
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- CN110199292A CN110199292A CN201780002187.0A CN201780002187A CN110199292A CN 110199292 A CN110199292 A CN 110199292A CN 201780002187 A CN201780002187 A CN 201780002187A CN 110199292 A CN110199292 A CN 110199292A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 357
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 179
- 238000001514 detection method Methods 0.000 claims description 60
- 238000000034 method Methods 0.000 claims description 44
- 238000005530 etching Methods 0.000 claims description 30
- 230000000694 effects Effects 0.000 claims description 24
- 239000003292 glue Substances 0.000 claims description 23
- 238000001914 filtration Methods 0.000 claims description 17
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 16
- 239000010936 titanium Substances 0.000 claims description 16
- 229910052719 titanium Inorganic materials 0.000 claims description 16
- 238000012545 processing Methods 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 230000008054 signal transmission Effects 0.000 claims description 11
- 235000005824 Zea mays ssp. parviglumis Nutrition 0.000 claims description 9
- 235000002017 Zea mays subsp mays Nutrition 0.000 claims description 9
- 235000005822 corn Nutrition 0.000 claims description 9
- 229910052711 selenium Inorganic materials 0.000 claims description 9
- 239000011669 selenium Substances 0.000 claims description 9
- 238000004528 spin coating Methods 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 3
- 230000009467 reduction Effects 0.000 claims description 3
- 241000209149 Zea Species 0.000 claims 2
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 10
- 238000003384 imaging method Methods 0.000 abstract description 9
- 239000010410 layer Substances 0.000 description 155
- 230000004888 barrier function Effects 0.000 description 28
- 239000004065 semiconductor Substances 0.000 description 24
- 238000002360 preparation method Methods 0.000 description 16
- 230000008569 process Effects 0.000 description 14
- 238000003491 array Methods 0.000 description 12
- 230000006698 induction Effects 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 9
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 9
- 229910010271 silicon carbide Inorganic materials 0.000 description 9
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 8
- 240000008042 Zea mays Species 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 5
- 238000005240 physical vapour deposition Methods 0.000 description 5
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 4
- 229910000673 Indium arsenide Inorganic materials 0.000 description 4
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- VTGARNNDLOTBET-UHFFFAOYSA-N gallium antimonide Chemical compound [Sb]#[Ga] VTGARNNDLOTBET-UHFFFAOYSA-N 0.000 description 4
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 4
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 210000001951 dura mater Anatomy 0.000 description 3
- 238000012634 optical imaging Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 238000011946 reduction process Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
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Abstract
一种光学通路调制器(41)及制作方法、图像识别传感器(130)和电子设备(100)，光学通路调制器(41)包括：形成有光采集通路(11)的基材(1)和非透光层(2)；非透光层(2)覆盖于基材(1)上除光采集通路(11)以外的表面上。非透光层(2)能够有效阻挡光信号进入光学通路调制器(41)的基材(1)，从而在各光采集通路(11)之间形成有效的光阻隔，避免各光采集通路(11)中的光信号产生干扰，保证成像的对比度，从而有效提高光学成像的质量。
Description
PCT国内申请，说明书已公开。
Claims (19)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/117049 WO2019119245A1 (zh) | 2017-12-18 | 2017-12-18 | 光学通路调制器及制造方法、图像识别传感器和电子设备 |
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| Publication Number | Publication Date |
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| CN110199292A true CN110199292A (zh) | 2019-09-03 |
| CN110199292B CN110199292B (zh) | 2023-10-27 |
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| CN (1) | CN110199292B (zh) |
| WO (1) | WO2019119245A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112466896A (zh) * | 2019-09-09 | 2021-03-09 | 格科微电子（上海）有限公司 | 光学指纹器件的制造方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016112864A1 (zh) * | 2015-01-16 | 2016-07-21 | 宁波舜宇光电信息有限公司 | 利用小孔成像原理建立的光学成像装置及其制造方法和应用 |
| CN106684052A (zh) * | 2017-02-16 | 2017-05-17 | 苏州晶方半导体科技股份有限公司 | 指纹识别芯片封装结构以及封装方法 |
| CN107423728A (zh) * | 2017-09-07 | 2017-12-01 | 京东方科技集团股份有限公司 | 光学结构及其制作方法、显示基板及显示装置 |
| CN206931093U (zh) * | 2017-05-24 | 2018-01-26 | 深圳市汇顶科技股份有限公司 | 光学图像识别芯片及终端设备 |
| CN206975658U (zh) * | 2017-04-06 | 2018-02-06 | 深圳市汇顶科技股份有限公司 | 指纹识别装置及电子终端 |
| CN208298199U (zh) * | 2017-12-18 | 2018-12-28 | 深圳市为通博科技有限责任公司 | 光学通路调制器、图像识别传感器和电子设备 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62198987A (ja) * | 1986-02-27 | 1987-09-02 | Komatsu Ltd | 画像読み取り装置 |
| CN104036230A (zh) * | 2014-03-21 | 2014-09-10 | 中山微盾信息科技有限公司 | 一种超薄手指静脉识别系统 |
| CN106709455B (zh) * | 2016-12-23 | 2020-06-30 | 张一帆 | 一种支持全屏光学指纹传感器的显示屏及其制作方法 |
| CN107193412B (zh) * | 2017-04-27 | 2020-04-14 | Oppo广东移动通信有限公司 | 显示屏、显示装置及移动终端 |
-
2017
- 2017-12-18 WO PCT/CN2017/117049 patent/WO2019119245A1/zh active Application Filing
- 2017-12-18 CN CN201780002187.0A patent/CN110199292B/zh active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016112864A1 (zh) * | 2015-01-16 | 2016-07-21 | 宁波舜宇光电信息有限公司 | 利用小孔成像原理建立的光学成像装置及其制造方法和应用 |
| CN106684052A (zh) * | 2017-02-16 | 2017-05-17 | 苏州晶方半导体科技股份有限公司 | 指纹识别芯片封装结构以及封装方法 |
| CN206975658U (zh) * | 2017-04-06 | 2018-02-06 | 深圳市汇顶科技股份有限公司 | 指纹识别装置及电子终端 |
| CN206931093U (zh) * | 2017-05-24 | 2018-01-26 | 深圳市汇顶科技股份有限公司 | 光学图像识别芯片及终端设备 |
| CN107423728A (zh) * | 2017-09-07 | 2017-12-01 | 京东方科技集团股份有限公司 | 光学结构及其制作方法、显示基板及显示装置 |
| CN208298199U (zh) * | 2017-12-18 | 2018-12-28 | 深圳市为通博科技有限责任公司 | 光学通路调制器、图像识别传感器和电子设备 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112466896A (zh) * | 2019-09-09 | 2021-03-09 | 格科微电子（上海）有限公司 | 光学指纹器件的制造方法 |
| CN112466896B (zh) * | 2019-09-09 | 2024-04-16 | 格科微电子（上海）有限公司 | 光学指纹器件的制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110199292B (zh) | 2023-10-27 |
| WO2019119245A1 (zh) | 2019-06-27 |
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