WO2016112864A1 - 利用小孔成像原理建立的光学成像装置及其制造方法和应用 - Google Patents

利用小孔成像原理建立的光学成像装置及其制造方法和应用 Download PDF

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Publication number
WO2016112864A1
WO2016112864A1 PCT/CN2016/071005 CN2016071005W WO2016112864A1 WO 2016112864 A1 WO2016112864 A1 WO 2016112864A1 CN 2016071005 W CN2016071005 W CN 2016071005W WO 2016112864 A1 WO2016112864 A1 WO 2016112864A1
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WIPO (PCT)
Prior art keywords
optical imaging
image sensor
image
light
imaging device
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PCT/CN2016/071005
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English (en)
French (fr)
Inventor
张宝忠
王明珠
袁业辉
汪凯伦
Original Assignee
宁波舜宇光电信息有限公司
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Priority claimed from CN201510284029.1A external-priority patent/CN106203412A/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Publication of WO2016112864A1 publication Critical patent/WO2016112864A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/10—Image acquisition

Definitions

  • the present invention relates to an imaging apparatus, and more particularly to an optical imaging apparatus established by the principle of aperture imaging and a method of fabricating the same, and an optical imaging apparatus of the prior art, in which an optical imaging apparatus collects an object In the case of an image, it is not necessary to dispose an optical element such as a lens or a prism, so that the height of the optical imaging device is remarkably lowered, and further, the optical imaging device can be applied to an electronic device that is thin and thin, and is miniaturized. Medical equipment and other fields.
  • a more popular user identification method is to input a combination number or letter as a password on an electronic device, and compare it with a password pre-stored in the electronic device, that is, to identify the user's identity legality;
  • the more popular user identification method is based on biometrics.
  • a typical implementation method is to collect the fingerprint image of the user and compare it with the fingerprint image pre-stored in the electronic device, that is, the identity legality of the user can be identified.
  • the practice process proves that the first type of identification is less secure because anyone can enter the correct password into the electronic device.
  • the electronic device considers the password input to be a legitimate user. It directly leads to the control of the electronic device being obtained by the input.
  • the second way to identify the user's biometrics is to improve the security of the user.
  • the fingerprint collector made by the prior art semiconductor chip technology has poor antistatic and anticorrosive ability, which leads to insufficient stability of the fingerprint collector during use, especially when the input finger has sweat secretion.
  • the fingerprint collector is unable to capture the fingerprint image.
  • a typical example is that the inputer who is prone to sweat is less fluent when using the fingerprint collector, which seriously affects the user experience of the fingerprint collector.
  • the principle of the fingerprint collector made by the prior art optical imaging technology is the full emission of light.
  • the necessary components of the fingerprint collector include an image sensor, a prism, a lens, a light source, etc., the prism and the lens are disposed on the photosensitive path of the image sensor, and an image acquisition area is provided at an upper portion of the prism and the lens.
  • the inputter places the finger end in the image collection area, and the light generated by the light is irradiated to the finger end of the input image in the image collection area, and the light is Finger-end reflection, because the fingerprint of the fingertip of the input person causes the amount of light reflected at different positions of the finger end to be different, so that the light reflected by the finger end of the input person is received by the image sensor after passing through the prism and the lens. To complete the acquisition of the fingerprint pattern of the finger of the input person.
  • the fingerprint collector made by the optical imaging technology has the height and width of the fingerprint collector due to the presence of optical lenses such as prisms and lenses. Larger, which in turn leads to the inability of optical imaging technology to be applied to electronic devices that are thin and light.
  • optical imaging techniques used by endoscopes are similar to optical imaging techniques of electronic devices.
  • the endoscope cannot be continuously reduced in size because it is provided with an optical lens such as a lens.
  • endoscopes cannot be applied due to size limitations during the diagnosis and treatment of some diseases. Therefore, how to reduce the size of the endoscope has become an urgent problem to be solved.
  • An object of the present invention is to provide an optical imaging apparatus, a manufacturing method thereof and an application thereof, which use a small aperture imaging optical system as an imaging apparatus, which has a simple structure and can reduce the size of a miniature imaging system such as an entire fingerprint recognition and an endoscope. Placed in a small volume of equipment.
  • An object of the present invention is to provide an optical imaging apparatus, a manufacturing method thereof and an application thereof, which can ensure the object distance, the image distance and the aperture size of the aperture optical imaging system after determining the total height of the entire system apparatus. It has better resolution and meets the accuracy requirements of fingerprint recognition.
  • An object of the present invention is to provide an optical imaging apparatus and a manufacturing method and application thereof, which use an aperture imaging optical system as an imaging apparatus, which can reduce volume and cost while using a conventional lens as an optical system. .
  • An object of the present invention is to provide an optical imaging device, a manufacturing method and application thereof, and a conventional method of using a prism as a fingerprint sensing region.
  • the present invention can select an inorganic or organic material having a high transparency as a fingerprint sensing region. And can be as thin as possible, so the cost is lower, choose from It also makes the entire fingerprint identification system smaller and lighter.
  • the through hole can be engraved on a thin plate made of an organic or inorganic material having a transmittance close to zero, and is simple to manufacture.
  • An object of the present invention is to provide an optical imaging apparatus, a manufacturing method thereof and an application thereof, which use an aperture imaging optical system to project an image of an object recognition area after being irradiated with a light source that reflects a certain brightness onto an image sensor, and then project the image onto the image sensor. For terminal equipment to determine.
  • An object of the present invention is to provide an optical imaging apparatus, a manufacturing method thereof and an application thereof, which utilize the principle of small-hole imaging, have good resolution, high practicability, no complicated manufacturing process, and simple operation.
  • An object of the present invention is to provide an optical imaging device, a manufacturing method and application thereof, and finally satisfy the identifiable requirements of the fingerprint identification system by stepwise definition and calculation, which is simple, practical, and operability, and defines optical imaging according to actual conditions.
  • the size of the system enables the optical imaging system to be installed as a fingerprint image acquisition device in a small fingerprint recognition device.
  • An object of the present invention is to provide an optical imaging apparatus and a manufacturing method and application thereof. Compared with the optical imaging system of the prior art, the optical imaging apparatus does not need to be configured with a lens or a prism when acquiring an image of an object.
  • the optical element is such that the height of the optical imaging device is significantly lowered, and further, the optical imaging device can be applied to fields of electronic devices, medical devices, and the like that are thin and thin, miniaturized.
  • An object of the present invention is to provide an optical imaging apparatus and a manufacturing method and application thereof, wherein the volume of the optical imaging apparatus can be further reduced to ensure the resolution of the optical imaging apparatus Can be placed in smaller devices for use.
  • An object of the present invention is to provide an optical imaging apparatus and a manufacturing method and application thereof, wherein the image sensor is placed in a dark cavity, and the dark cavity communicates with an external environment of the dark cavity through a light passing hole. Thereby, the light reflected by the object enters the dark cavity only through the light passing hole to be described. The photosensitive surface of the image sensor is received, which in turn generates an image associated with the object from which the image was acquired.
  • An object of the present invention is to provide an optical imaging apparatus and a method and apparatus for manufacturing the same, wherein when the height of the optical imaging apparatus is determined, the object distance, the image distance, and the pass of the optical imaging apparatus can be changed
  • the aperture of the apertures adjusts the resolution of the optical imaging device such that the optical imaging device satisfies the requirements for the accuracy of the user's identification.
  • the optical imaging apparatus further includes a carrier platform that forms an image acquisition area, wherein the carrier platform is not comprised of a prism and It is made of an optical element such as a lens, but is made of any inorganic or organic material having good penetration, thereby remarkably reducing the overall height of the optical imaging apparatus.
  • An object of the present invention is to provide an optical imaging apparatus and a method of fabricating the same, and an application thereof, wherein a part of the structure of the electronic apparatus can form the optical imaging apparatus after the optical imaging apparatus is disposed in the electronic apparatus The image capturing area, so that the optical imaging device conforms to the development trend of thinning and miniaturization of the electronic device.
  • An object of the present invention is to provide an optical imaging apparatus and a method of fabricating the same, and an application thereof, wherein a part of the structure of the electronic apparatus can form the optical imaging apparatus after the optical imaging apparatus is disposed in the electronic apparatus
  • the light source that is, the optical imaging device of the present invention may not require a light source to be configured to further reduce the volume of the optical imaging device.
  • the present invention provides an optical imaging system, an optical imaging method, and a method of developing an optical imaging system using the aperture imaging principle.
  • an optical imaging system comprising:
  • An identification carrier having a transparent object recognition area
  • the darkroom casing forms a darkroom and has a through hole, the through hole being in communication with the darkroom;
  • An image sensing device comprising an image sensor mounted in the darkroom;
  • a light source wherein the light source is mounted outside the darkroom housing, wherein when an object of interest is placed in the object recognition area, the emitted light emitted by the light source is directed toward the object recognition area and further The surface of the recognition object is reflected and then projected through the through hole to the image sensor, whereby the recognition object is imaged by the optical imaging system by the principle of aperture imaging.
  • the image sensing device further comprises a circuit board, wherein the circuit board is connected to the image sensor.
  • the object recognition region is made using an inorganic or organic material having a high transmittance.
  • the inorganic or organic material from which the darkroom housing is made blocks light from passing through to form the darkroom.
  • the light source is mounted at one or more locations inside the chamber.
  • the light source emits ultraviolet, infrared or visible light alone or simultaneously
  • the image sensor is adapted to sense ultraviolet, infrared or visible light.
  • the circuit board is connected to a bottom wall of the darkroom housing or as a bottom wall of the darkroom housing to form the darkroom.
  • the optical imaging system is assembled to a fingerprinting device.
  • the optical imaging system is integrated in an intelligent electronic device, and the identification object is a fingerprint, thereby providing a fingerprint recognition function for the intelligent electronic device.
  • the optical imaging system is assembled to an endoscope.
  • the invention also provides an optical imaging method comprising the steps of:
  • a transparent object recognition area receives the emitted light of the light source, and the identification object placed in the object recognition area reflects the light;
  • the light emitted by the light source outside the through hole is blocked by the darkroom housing, so that the light emitted by the light source can only be reflected and passed through the through The hole reaches the image sensor.
  • the image sensor is installed in a darkroom of the darkroom housing, the light source is mounted on the outside of the darkroom, and the object recognition area and the through hole are arranged in parallel and maintain a spacing.
  • the aperture of the through hole, the distance from the through hole to the object recognition area and the image sensor, and the size of the image sensor are determined according to the principle of aperture imaging.
  • the object recognition region is made using an inorganic or organic material having a high transmittance.
  • the light source emits ultraviolet, infrared or visible light alone or simultaneously
  • the image sensor can Sensitive to ultraviolet, infrared or visible light.
  • the present invention also provides a method of developing an optical imaging system using the principle of aperture imaging, the method comprising the steps of:
  • the method further comprises: step (F) checking whether the obtained identification object reaches the terminal system determinable requirement, and if the determination request is met, completing, if the determination request is not met, returning to step (C) analyzing the failure reason until the qualified condition is met.
  • step (F) is after said step (E).
  • the sensing surface is located in the object recognition area, wherein the sensing area U is an area of the identification object induced by the object recognition area.
  • the optical imaging system is defined according to a distance W of the through hole to the sensing surface and a distance X from the through hole to the image sensor, and the through hole is disposed on a through hole wall, wherein The object recognition area and the image sensor are mounted on opposite sides of the through hole wall at a distance of W and X.
  • the senor is mounted in a darkroom, and a darkroom housing forming the darkroom is such that light from the light source directed toward the darkroom housing is blocked or absorbed by the darkroom housing.
  • an image sensor having a size, a pixel value, and a pixel point size is selected as an image sensor of the optical imaging system.
  • a light source of suitable illumination wavelength and intensity is selected to meet the brightness and resolution requirements of the optical imaging system.
  • the present invention also provides a fingerprint identification system for applying a fingerprint, which includes:
  • An identification carrier having a transparent object recognition area
  • the darkroom casing forms a darkroom and has a through hole, the through hole being in communication with the darkroom;
  • An image sensing device comprising an image sensor, the image sensor being mounted in the dark room;
  • the light source is mounted outside the darkroom housing
  • a fingerprint recognition terminal coupled to the image sensing device, wherein when a finger or a finger is placed in the object recognition area, the emitted light emitted by the light source is directed to the object recognition area and further Reaching the surface of the finger or toe is reflected and then projected through the through hole to the image sensor, thereby imaging the identification object through the optical imaging system by the principle of aperture imaging, the fingerprint recognition The terminal determines and identifies the imaging of the fingerprint.
  • the darkroom housing is made of an opaque material.
  • the through hole is disposed in parallel with the image sensor.
  • the image sensor is coupled to a circuit board, wherein the circuit board is coupled to a bottom wall of the darkroom housing for forming the darkroom.
  • the image sensing device shares a circuit board with the fingerprint recognition terminal.
  • the fingerprint identification system is adapted to make a separate fingerprint identification device or integrated in an intelligent electronic device.
  • the present invention also provides an optical imaging device, wherein the optical imaging device includes an image sensor and a light source, the optical imaging device having an image acquisition area, a dark cavity, and a light passing hole;
  • the light passing hole communicates with the dark cavity and an external environment of the dark cavity, the image sensor is located in the dark cavity, and the light passing hole corresponds to a photosensitive surface of the image sensor, the light source Located in an external environment of the dark cavity, the image acquisition area is located in a photosensitive path of the image sensor;
  • the light passing hole corresponds to a center position of a photosensitive surface of the image sensor.
  • the optical imaging apparatus further includes a casing, wherein the casing has the dark cavity and the light passing hole, the image sensor is housed in the casing, and the light source is disposed adjacent to The housing.
  • the optical imaging device further includes a casing and a substrate, wherein the casing is disposed on the substrate to form the dark cavity between the casing and the substrate, the light source is adjacent to Provided in the housing.
  • the optical imaging apparatus further includes a circuit board, wherein the image sensor is mounted on the circuit board, and the circuit board is mounted on the substrate.
  • the optical imaging apparatus further includes a circuit board, wherein the image sensor is mounted on the circuit board, the substrate has a receiving cavity, and the circuit board is housed in the receiving cavity.
  • the optical imaging device further includes a circuit board, wherein the image sensor and the circuit board are respectively mounted on different sides of the substrate, and the image sensor is electrically connected to the circuit board.
  • the housing includes an upper casing portion and at least one side casing portion, each of the side casing portions extending curvedly from an edge of the upper casing portion to the substrate, thereby being in the upper casing portion,
  • the dark cavity is formed between each of the side shell portions and the substrate.
  • the optical imaging device further includes a casing and a circuit board, the casing being disposed on the circuit board to form the dark cavity between the casing and the circuit board, An image sensor is attached to the circuit board.
  • the housing includes an upper casing portion and at least one side casing portion, each of the side casing portions respectively curvedly extending from an edge of the upper casing portion to the wiring board, thereby being in the upper casing portion
  • the dark cavity is formed between each of the side shell portions and the circuit board.
  • the optical imaging device further includes a housing, a substrate and a supporting component, wherein the supporting component is disposed on the substrate, and the periphery of the housing extends to the supporting component respectively, thereby
  • the dark cavity is formed between the substrate, the support member, and the housing, the housing having the light through hole to communicate with the external environment of the dark cavity and the dark cavity.
  • the optical imaging apparatus further includes a circuit board, wherein the image sensor is mounted on the circuit board, and the circuit board is mounted on the substrate.
  • the optical imaging apparatus further includes a circuit board, wherein the image sensor is mounted on the circuit board, the substrate has a receiving cavity, and the circuit board is housed in the receiving cavity.
  • the optical imaging device further includes a circuit board, wherein the image sensor and the circuit board are respectively mounted on different sides of the substrate, and the image sensor is electrically connected to the circuit board.
  • the optical imaging device further includes a housing, a circuit board and a supporting component, wherein the supporting component is disposed on the circuit board, and the periphery of the housing extends to the supporting component respectively, thereby Forming the dark cavity between the support member, the circuit board and the housing, the image sensor is mounted on the circuit board, and the housing has the light passing hole to communicate with the dark The cavity and the external environment of the dark cavity.
  • the optical imaging device further includes a carrier member, wherein the carrier member is spaced apart from the housing, and a side of the carrier member forms the image acquisition region.
  • the plane of the photosensitive surface of the image sensor is parallel to the plane in which the carrier element is located.
  • the present invention also provides an electronic device comprising an optical imaging device, wherein the optical imaging device comprises an image sensor and a light source, the optical imaging device having an image acquisition area, a dark cavity and a light aperture;
  • the light passing hole communicates with an outer environment of the dark cavity and the dark cavity, the image sensor is located in the dark cavity, and the light passing hole corresponds to a photosensitive surface of the image sensor, and the light source is located An external environment of the dark cavity, the image acquisition area being located in a photosensitive path of the image sensor.
  • the optical imaging device is configured to collect biometric features of a user; wherein when the position of the captured image of the user is placed in the image acquisition area, light generated by the light source is radiated to the captured image After the position is reflected by the position of the captured image, the light reflected by the position of the captured image passes through the clear hole into the dark cavity and is further received by the photosensitive surface of the image sensor. Thereby the optical imaging device collects biometric features of the user.
  • the type of the biometric is selected from the group consisting of a fingerprint, a palm print and a foot print.
  • the electronic device is a biometric collection device, and the electronic device further includes a connection device, the optical imaging device is communicably connected to the connection device, and the connection device is adapted to be communicably connected Yu Yi Electric.
  • the electronic device is a mobile electronic device, and the electronic device further includes a device body, the optical imaging device is communicably connected to the device body; wherein the user of the optical imaging device collects The biometrics are transmitted to the device body for comparison with biometric features pre-stored on the device body. If the matching is successful, the device body considers that the user identity of the biometric feature is legal, if If the matching fails, the device body considers that the identity of the user who collected the biometric is illegal.
  • the apparatus body includes a button
  • the optical imaging device is disposed on the device body
  • the button forms the image collection area
  • the device body includes a display screen
  • the optical imaging device is disposed on the device body
  • the display screen forms the image collection area
  • the type of the electronic device is selected from the group consisting of a mobile phone, a tablet computer, a notebook computer, an electronic paper book, and a personal digital assistant.
  • the electronic device is an access control system or a safe security lock; wherein the electronic device comprises a device body, the optical imaging device is communicably connected to the device body; wherein the optical imaging device collects The biometric feature of the user is transmitted to the device body for comparison with a biometric pre-stored on the device body. If the matching is successful, the device body considers the user identity of the biometric to be collected. If the match fails, the device body considers that the identity of the user who collected the biometric is illegal.
  • the device body includes a processor and a lock body
  • the optical imaging device is communicably coupled to the processor
  • the processor is operatively coupled to the lock body
  • the processor It is possible to control the state of the lock body.
  • the electronic device is a payment terminal for payment by billing.
  • the electronic device is a courier terminal for signing the courier.
  • the electronic device is an endoscope; wherein the electronic device includes a device body, the optical imaging device is communicably coupled to the device body, and the optical imaging device is disposed on the device body So that the device body forms the image collection area.
  • the invention also provides a design method of an optical imaging device, wherein the design method comprises the following steps:
  • the method further comprises the steps of:
  • Step (j.1) is configured to satisfy the requirements of the optical imaging device according to the image height of the optical imaging device An image sensor;
  • Step (j.2) Selects the image sensor having an appropriate number of pixels and pixel size required to satisfy the optical imaging device in accordance with the resolution of the optical imaging device.
  • the design method further comprises the steps of:
  • step (j) Detecting whether the imaging quality of the optical imaging device satisfies the need for use, and if satisfied, the design of the optical imaging device is completed, and if not, the step (j) is repeatedly performed.
  • the imaging object range parameter of the optical imaging device is set to F
  • the aperture parameter of the optical imaging device is set to ⁇
  • the image distance parameter of the optical imaging device is set to X
  • setting a height parameter of the optical imaging device to U setting an image height parameter of the optical imaging device to V; wherein an image height of the optical imaging device and the optical imaging
  • V [UX+ ⁇ (W+X)]/W.
  • the present invention also provides a method of fabricating an optical imaging apparatus, wherein the manufacturing method comprises the following steps:
  • the method comprises the steps of:
  • the light passing hole is made to correspond to a center position of a photosensitive surface of the image sensor.
  • the method further comprises the steps of:
  • a housing having a light through aperture is provided to form the dark cavity between the housing and the substrate.
  • the method further comprises the steps of:
  • a housing having a light through hole is provided to form the dark cavity between the housing and the wiring board.
  • the method further comprises the steps of:
  • a carrier element is disposed at intervals in the housing, wherein the carrier element forms the image acquisition area.
  • the housing is made of an inorganic or organic material having a penetration close to zero.
  • a layer of light absorbing or reflective material is applied or attached to the inner and/or outer surface of the housing.
  • the light source of the light source is selected from the group consisting of ultraviolet light, infrared light and visible light.
  • the imaging object range parameter of the optical imaging device is set to F
  • the aperture parameter of the optical imaging device is set to ⁇
  • the image distance parameter of the optical imaging device is set to X
  • setting a height parameter of the optical imaging device to U setting an image height parameter of the optical imaging device to V; wherein an image height of the optical imaging device and the optical imaging
  • V [UX+ ⁇ (W+X)]/W.
  • the present invention also provides an imaging method by an optical imaging device, wherein the method comprises the following steps:
  • the light generated by the light source is reflected by a surface of an object placed in the image acquisition area, thereby generating reflected light
  • the reflected light is received by an image sensor after entering the dark cavity, thereby generating an image related to the object.
  • the light source generates a type of light selected from the group consisting of ultraviolet light, infrared light, and visible light.
  • the present invention also provides an optical imaging apparatus, wherein the optical imaging apparatus includes an image sensor having an image acquisition area, a dark cavity, and a light passing hole; wherein the image sensor is disposed in the dark a cavity, the light-passing hole is communicated with the dark cavity and an external environment of the dark cavity, and the light-passing hole corresponds to a photosensitive surface of the image sensor, and the image capturing area is located in the image Photosensitive path like a sensor;
  • the image forming object range parameter of the optical imaging device is set to F
  • the aperture parameter of the light passing hole of the optical imaging device is set to ⁇
  • the image distance parameter of the optical imaging device is set to X
  • the optical imaging device further includes a light source, the light source being located in an external environment of the dark cavity, wherein when an object is placed in the image capturing area, light generated by the light source is radiated to the The object is then reflected by the surface of the object, and the light reflected by the surface of the object passes through the clear hole into the dark cavity and is further received by the photosensitive surface of the image sensor, so that the optical imaging device collects An image of the object.
  • a light source being located in an external environment of the dark cavity, wherein when an object is placed in the image capturing area, light generated by the light source is radiated to the The object is then reflected by the surface of the object, and the light reflected by the surface of the object passes through the clear hole into the dark cavity and is further received by the photosensitive surface of the image sensor, so that the optical imaging device collects An image of the object.
  • the light passing hole corresponds to a center position of a photosensitive surface of the image sensor.
  • Figure 1 is a block diagram showing the construction of an optical imaging system in accordance with a preferred embodiment of the present invention.
  • FIG 3 is a schematic view showing the optical path structure of aperture optical imaging of an optical imaging system in accordance with a preferred embodiment of the present invention.
  • FIG. 4 is a flow chart of an optical imaging method in accordance with a preferred embodiment of the present invention.
  • FIG. 5 is a flow chart of a method for developing an optical imaging system using the aperture imaging principle in accordance with a preferred embodiment of the present invention.
  • FIG. 6 is a flow chart of an imaging method applied to a fingerprint recognition device of an optical imaging system in accordance with a preferred embodiment of the present invention.
  • FIG. 7 is a flow chart of an imaging method applied to an endoscope by an optical imaging system in accordance with a preferred embodiment of the present invention.
  • Figure 8 is a schematic cross-sectional view of an optical imaging device in accordance with another preferred embodiment of the present invention.
  • Figure 9 is a schematic cross-sectional view of an optical imaging apparatus in accordance with still another preferred embodiment of the present invention.
  • Figure 10 is a schematic cross-sectional view showing a modified embodiment of the above preferred embodiment of the present invention.
  • Figure 11 is a schematic cross-sectional view of an optical imaging apparatus in accordance with still another preferred embodiment of the present invention.
  • Figure 12 is a schematic cross-sectional view showing a modified embodiment of the above preferred embodiment of the present invention.
  • Figure 13 is a schematic view showing the optical path of an optical imaging apparatus according to the present invention.
  • Figure 14 is a schematic flow chart showing the design of an optical imaging apparatus according to the present invention.
  • 15 through 23 are schematic views of an electronic device including the optical imaging device, respectively, in accordance with various embodiments of the present invention.
  • Fig. 24 is a block diagram schematically showing an imaging method by an optical imaging device.
  • fingerprint recognition equipment In modern society, many industries and fields use fingerprint recognition equipment to collect human fingerprints for identification. In the fingerprint collection comparison process, fingerprint image reading (or fingerprint image collection) is very important, which is due to fingerprint identification equipment. The accuracy of the fingerprint is high, so the accuracy of the fingerprint image is very important.
  • the optical imaging system provided by the present invention mainly relates to a micro optical imaging system such as an ultra-thin fingerprint recognition and an endoscope established by the principle of small hole imaging, comprising an optical system and a sensing system, wherein the optical system comprises an optical
  • the imaging system and an illumination system combine the above systems according to the principle of small hole imaging to obtain an image that can be determined by a processing terminal, which can be used as a fingerprint image acquisition device and installed in a small instrument device to form a fingerprint identification device.
  • the fingerprint identification device terminal is provided with an accurate fingerprint image for identification and determination; it can also be installed as an imaging device in other medical instruments such as an endoscope for clinical use, or can be installed in other microelectronic devices.
  • an optical imaging system 10 includes an imaging device 11, an identification carrier 12, a light source 13, and an image sensing device 14, wherein the imaging device 11 is located on the identification carrier 12
  • the image sensing device 14 includes an image sensor 141, wherein the image sensor 141 is located inside a dark room 110 of the imaging device 11, and the image sensor 141 and the through hole 1111
  • the light source 13 is mounted to the dark room 110 while maintaining an appropriate spacing external.
  • the darkroom 110 is formed by a darkroom housing 111, wherein the darkroom housing 111 has a through hole 1111 through which the darkroom 110 communicates with the chamber 120, the identification carrier 12 has an object recognition area 121, which is disposed spaced apart from the darkroom housing 111, and the light source 13 emits light toward the object recognition area 121, the object recognition area 121 reflects light, according to the principle of aperture imaging, the light propagates along a straight line, and the identification object of the object recognition area 121 is projected through the through hole 1111 to the image sensor 141, and then connected to the image sensor 141 A terminal device makes a decision.
  • the darkroom housing 111 may be integrally formed, or may be formed by connecting several side walls to form the darkroom 110.
  • the object recognition area 121 and the image sensor 141 are respectively mounted on opposite sides of the small hole 111 and are spaced apart from the small hole 111, and the small hole 111 is Correspondingly, it constitutes a small aperture imaging system, all of which constitute the illumination system, providing a light source to the object recognition area 121.
  • the object recognition area 121 and the image sensor 141 are located on opposite sides of the through hole 1111, and are spaced apart from the through hole 1111, wherein the pitch is greater than zero, respectively, as the object distance and the image distance.
  • the side wall 122 of the identification carrier 12 and the darkroom housing 111 have a spacing to form the chamber 120, that is, the chamber 120 includes the object identification area 121, the side wall 122 and All areas between the darkroom housings 111.
  • the image sensing device 14 further includes a circuit board 142, wherein the circuit board 142 is electrically connected to the sensor 141.
  • the circuit board 142 is connected to the bottom wall of the darkroom housing 111.
  • the circuit board 142 can also serve as the bottom wall of the darkroom housing 111.
  • the manufacturing material of the darkroom housing 111 is an opaque material capable of blocking or absorbing light, preventing light emitted from the light source 13 outside the darkroom housing 111 from entering the darkroom 110.
  • the dark chamber housing 111 may be made of any material, except that when it is used, a opaque tissue paper or an opaque or light absorbing material is applied to the outside thereof. It absorbs or blocks light. This has the advantage that the image sensor 141 located in the darkroom 110 receives only the light reflected by the object recognition area 121 to ensure the accuracy of the captured image.
  • the side wall 122 and the bottom wall 123 of the identification carrier 12 may also be sealed by corresponding plates, and the light source 13 may be mounted to one or more of the side walls 122 and/or the bottom wall 123.
  • the light source 13 may also be mounted outside the darkroom housing 111 to emit light to the object recognition area 121.
  • the light source 13 is mounted to the side wall 122 and the bottom wall 123. In short, the light emitted by the light source 13 can be directed to the object recognition area 121 without entering the dark room 110 directly through the through hole 111.
  • the light emitted by the light source 13 cannot enter the darkroom 110, even if the light emitted by the light source 13 is directed toward the wall around the darkroom 110, that is, the darkroom housing 111, the darkroom needs to be The housing 111 is blocked or absorbed. It is worth noting that when the light source 13 is mounted, care should be taken to prevent its light from entering the through hole 1111, so that the through hole 1111 can only receive the object recognition area. 121 reflected light.
  • the circuit board 142 can select an FPC board (flexible circuit board).
  • the side wall forming the darkroom housing 111 can be freely moved to adjust the through-hole wall of the darkroom housing 111 (ie, provided)
  • the distance between the wall of the through hole 1111 and the image sensor 141 the user can change the distance between the through hole 1111 and the image sensor 141 according to the actual use environment and imaging requirements, that is, equivalent
  • the image distance can be changed so that the image distance can be freely adjusted, increasing the range of application of the imaging device.
  • the size of the object recognition area 121 is determined according to the actual use, that is, according to the size of the object to be identified, and it should be made of a transparent material.
  • it can be determined by the area of the fingerprint recognition required by the human body fingerprint.
  • fingerprint recognition is performed, a finger is placed thereon to collect the fingerprint, so the production of the object recognition area 121 is required.
  • the material should have a high transmittance, so it can be made of transparent inorganic or organic materials, which can be as thin as possible, but it is required to have a certain strength in a thinner state, so that it Ability to withstand the force applied by finger presses during fingerprint recognition.
  • the dark chamber housing 111 may be a thin plate made of an inorganic or organic material having a transmittance close to zero, that is, light cannot pass through the dark chamber housing 111.
  • the through hole 1111 is located. The thickness of the inner wall of the through hole wall should not exceed one-half the aperture of the through hole 1111.
  • the light source 13 is capable of emitting ultraviolet, infrared, visible light and the like in a wavelength band simultaneously or separately, and the light-emitting characteristics are determined by the resolution required by the system and the type of the image sensor 141; the image sensing The device 141 is a sensor capable of sensing light in the ultraviolet, infrared, visible light, etc., and the size type is determined by the fingerprint sensing area and the size of the small hole imaging system.
  • the darkroom housing 111 and the image sensing device 14 form an aperture module, which can be applied to a small aperture optical imaging system, wherein the darkroom housing 111 is opaque
  • the material is formed to block the light emitted by the light source 13 from directly hitting the image sensor 141, thereby preventing the light reflected by the object recognition area 121 from being emitted to the image sensor 141 through a place other than the through hole 1111. Then, the light enters the image sensor 141 only through the through hole 1111.
  • a small hole imaging module can be formed to be imaged.
  • the light source 13 is disposed outside the aperture imaging module such that the light emitted by the light source 13 is directed toward an object side.
  • the object side is the object recognition area. 121, the object side reflects light, and through the aperture imaging principle, the reflected light directly enters the dark room 110, and then is projected to the image sensor 141, and the object image is obtained by connecting the terminal device, for example, The fingerprint image in the preferred embodiment.
  • the light source 13 can be electrically connected to the circuit board 142, and then powered by the circuit board 142. Further, when the optical imaging system provided by the present invention is applied to an electronic product or the like, The light source 13 may use a light source that is provided by the device, or the light source 13 may be connected to a power supply system in the device.
  • the optical imaging system 10A includes an imaging device 11A, an identification carrier 12A, a light source 13A, and an image sensing device. 14A, wherein the imaging device 11A has a through hole 1111A, and a wall of the through hole 111A is formed as a through hole wall, wherein the image sensing device 14A includes an image sensor 141A and a circuit board 142A mounted on the imaging device 11A has a dark room 110A, wherein the dark room 110 is formed by a darkroom casing 111A, wherein the side wall 122A forming the identification carrier 12A can serve as both side walls of the darkroom casing 111A, that is, the image forming
  • the device 11A and the identification carrier 12A share a side wall, and the imaging device 12A has a chamber 120A located in a region between the object recognition area 12A included in the imaging device 12A and the through hole wall.
  • the light source 13A is mounted on the through hole wall of the darkroom housing 111A, so that the light emitted by the light source 13A is directed toward the object recognition area 121A, and the object recognition area 121A reflects light and wears
  • the through hole 1111A enters the dark room 110A, and the image of the object recognition area 121A is projected onto the image sensor 141A, and then transmitted to a terminal device for determination.
  • FIG. 3 is a schematic diagram of an optical path structure 20 for aperture optical imaging of an optical imaging system provided in accordance with the present invention, in which an identification object is placed in the object recognition area 121, wherein the object recognition area 121 reflects The light, wherein the reflected light propagates through the through hole 1111 in a straight line, propagates to the image sensor 141, projects the identification object onto the image sensor 141, and is then determined by the instrument terminal.
  • the object recognition area 121 is used as the object side 201, and when the image determination is performed, the object recognition area 121 is used as a sensing surface to form a recognition object.
  • the identification object located on the sensing surface is taken as the object height U
  • the image sensor 141 is used as the image side 205, wherein the image height is V
  • the through hole 1111 is disposed on the through hole wall of the darkroom housing 111.
  • Located between the object side 201 and the image side 205, and the aperture of the small hole is ⁇ .
  • the distance from the object recognition area 121 to the through hole wall is the distance 202 from the object side 201 (or the sensing surface) to the through hole 1111, which is called the object distance W, and the image sensor 141 is The distance of the through-hole wall is the distance 204 from the image side 205 to the through-hole 1111, which is called the image distance X.
  • the emitted light 206 emitted by the light source 13 is directed toward the object recognition area 121, and the object recognition area 121 is formed with an identification object to reflect light due to the dark chamber housing 111.
  • the opaque light is reflected, so that the reflected light 207 reflected by the object recognition area 121 can only be transmitted to the image sensor 141 through the through hole 1111, and the other reflected light is located by the through hole 1111.
  • the darkroom housing 111 absorbs or blocks, that is, the image sensor 141 can only receive the reflected light 207 reflected by the object 201 through the through hole 1111, and cannot receive the light.
  • the light of the hole 1111 that is, the light directly emitted by the light source 13 and the reflected light 207 that is directed outside the through hole 1111, in other words, the reflected light directly passing through the through hole 1111 207 can be propagated outside the image sensor 141, and other light rays cannot propagate to the image sensor 141, that is, the light that the light source 203 emits toward the imaging device 11, and the direction of the emission by the object side 201 Place Reflected light rays are outside of the through hole 1111 of the housing 111 darkroom absorbed or blocked.
  • the imaging method of the fingerprint recognition optical imaging system is that a light beam 206 is emitted from the light source 13 and the emitted light 206 is directed toward the object.
  • a square identification area 121 the object recognition area 121 is reflected to obtain a reflected light ray 207, and the reflected light ray 207 is propagated to the image sensor 141 through the through hole 1111, and the image sensor 141 senses the reflected light 207
  • the fingerprint image of the object recognition area 121 is projected To the image sensor 141.
  • the optical imaging system provided by the present invention is only an image capturing system in the fingerprint recognition device, so the image sensor 141 can transmit the obtained fingerprint image to the fingerprint identification device terminal for corresponding determination.
  • the invention utilizes the principle of small hole imaging to establish an optical imaging system such as fingerprint recognition and endoscope, and has a simple structure, and can reduce the size of the whole optical imaging system such as fingerprint recognition and endoscope under the premise of ensuring good resolution, and is convenient for It is placed in smaller equipment.
  • the total height of the entire optical imaging system is determined, and the total height of the optical imaging system can be determined according to actual use conditions, that is, according to the device to be embedded in the optical imaging system.
  • the size of the imaging system is used to determine the total height of the optical imaging system required. For example, different sizes of fingerprint recognition devices such as computers, mobile phones, and access control have different requirements for optical imaging systems, and an optical imaging system suitable for different devices can be developed.
  • the optical imaging system is disposed in a mobile phone or an access control.
  • a finger is placed on the object recognition area 121, and the object recognition area 121 reflects light, wherein the reflected light enters
  • the dark room 110 projects the fingerprint image to the image sensor 141 for determination by the mobile phone terminal or the access control terminal.
  • the backlight system of the mobile phone can be used as a light source, or the circuit board can be shared with the mobile phone, and the light source and the device can be given by other fingerprint recognition devices such as a mobile phone.
  • the image sensor is powered, and at the same time, the imaging device 11 is installed at a certain distance from the screen of the mobile phone. In other words, a transparent area needs to be set as the object recognition area 121 on the screen of the mobile phone or the button, and then A certain distance is reserved between the through hole 1111 of the imaging device 11 and the object recognition area, and no reflected light capable of blocking the object recognition area 121 is placed in the space.
  • One through hole 1111 is disposed on the 111, wherein the through hole 111 is located in the image sensor 141 and the object recognition area 121, according to the mobile phone
  • the aperture of the through hole 1111, the distance between the object recognition area 121 and the through hole 1111, and the distance between the image sensor 141 and the through hole 1111 may be set, and thus, In this application, the side walls 122 and the bottom wall 123 of the identification carrier 12 are no longer needed, i.e., other components of the handset may be used as the side walls 122 and the bottom wall 123 of the identification carrier 12.
  • the optical system of the present invention can also be installed in a fingerprint setting device, for example, a mobile phone, a computer,
  • a fingerprint setting device for example, a mobile phone, a computer,
  • the television, the access control, and the like, which are described in FIG. 1 or FIG. 2, are included in the fingerprint recognition device as a whole, including the imaging device 11, the identification carrier 12, the light source 13, and the image sensing device.
  • the optical imaging system provided by the present invention when the optical imaging system provided by the present invention is mounted on a medical instrument such as an endoscope, an imaging plane is used as the object recognition area 121, and an image that can be recognized is projected by the imaging device 11 of the present invention.
  • the image sensor 14 is further transmitted to the endoscope terminal for identification.
  • the sensing area required for the fingerprint recognition optical imaging system is further defined, that is, the object height U is determined, wherein the size of the object height U is determined by the area of the human body fingerprint required to be inductively recognized, that is, the sensing area U
  • the area of the fingerprint recognition area image can be defined according to the requirements of the embedded different devices.
  • the total height of the optical system includes the distance from the object side identification area 121 to the bottom wall 123 of the identification carrier 12 and the thickness of themselves, as shown in FIG.
  • the F ⁇ (W/ X+1) calculating the aperture ⁇ and determining the tolerance of the aperture ⁇ , that is, the size of the through hole 1111 is obtained, where F represents the range of the imaged object corresponding to the point on the screen, and the decision is small.
  • the aperture optical imaging system the aperture can be calculated according to the required resolution F, that is, F is the actual required resolution, as a known number.
  • the sensor After determining the object height U, the object distance W, the image distance X, the aperture ⁇ , the image height V, and the size of the sensor, the sensor with the appropriate pixel value and pixel size is selected, and finally the size, the pixel value, and the pixel size are selected.
  • a suitable sensor is used as the image sensor 141 of the optical imaging system.
  • the light source 13 with suitable illumination wavelength and light intensity is selected and installed inside the system, so that the light source 13 meets the required resolution of the system while satisfying the required brightness of the system, and conforms to the selected image sensor.
  • Type of 141 the light source 13 with suitable illumination wavelength and light intensity is selected and installed inside the system, so that the light source 13 meets the required resolution of the system while satisfying the required brightness of the system, and conforms to the selected image sensor.
  • the image obtained by the optical imaging system is input into the terminal of the fingerprint identification system for determination analysis. If the terminal can analyze and determine the fingerprint, the optical imaging system is qualified. If the terminal cannot analyze the determination, the image is continuously re-imaged through the aperture imaging principle. Define the object distance W, image distance X and aperture ⁇ , and then reselect the sensor and light source until the imaging meets the requirements.
  • the method for formulating the optical imaging system provided by the present invention by using the aperture imaging principle includes the following steps:
  • the size of the small hole (or aperture) ⁇ , the distance W from the small hole to the sensing surface, and the distance X from the small hole to the sensor and the corresponding tolerance are defined by the principle of small hole imaging;
  • step (8) is performed, and if the determination request is not reached, the reason for the failure is analyzed in step (4), and the calculation is recalculated. Step (8) is continued until qualified;
  • optical imaging apparatus 8 is an optical imaging apparatus provided in accordance with another preferred embodiment of the present invention, wherein the optical imaging apparatus acquires an image of an object using a small aperture imaging principle.
  • the optical imaging device includes an image sensor 30B, a housing 40B, and a carrier member 50B.
  • the housing 40B has a light-passing hole 41B and a dark cavity 42B.
  • the light-passing hole 41B communicates with the device.
  • the external environment of the dark cavity 42B and the casing 40B that is, the light of the external environment of the casing 40B can only enter the inside of the dark cavity 42B through the light passing hole 41B.
  • the image sensor 30B is housed in the dark cavity 42B, and the light passing hole 41B corresponds to the photosensitive surface of the image sensor 30B.
  • the light passing hole 41B corresponds to a center position of the photosensitive surface of the image sensor 30B.
  • the photosensitive surface of the image sensor 30B and the inner surface of the housing 40B are not in contact, thereby forming an image distance of the optical imaging device between the housing 40B and the photosensitive surface of the image sensor 30B.
  • the carrier member 50B is spaced apart from the housing 40B such that the carrier member 50B and the housing 40B are not in contact to form between the carrier member 50B and the housing 40B.
  • the object distance of the optical imaging system The side of the carrier element 50B forms an image acquisition area 51B, the image acquisition area 51B and the housing 40B are located on different sides of the carrier element 50B, and the image acquisition area 51B is located in the image sensor 30B
  • the photosensitive path when an image of an object is acquired using the optical imaging device, an object of the acquired image needs to be placed in the image acquisition region 51B.
  • the dark cavity 42B is a dark cavity, and the dark cavity 42B communicates with the external environment of the casing 40B only through the light passing hole 41B. That is, the light of the external environment of the casing 40B enters the dark cavity 42B only through the light passing hole 41B to be received by the photosensitive surface of the image sensor 30B, thereby allowing the light to pass through The light entering the dark cavity 42B of the hole 41B is not disturbed, thereby ensuring the image quality of the optical imaging apparatus.
  • the optical imaging device may further include a light source 13B disposed adjacent to the housing 40B, and the light source 13B and the housing 40B are located on the same side of the carrier member 50B.
  • the light generated by the light source 13B can be directly radiated through the carrier member 50B to the surface of the object placed on the image acquisition region 51B, and then the surface of the object Light reflected, thereby being reflected by the object, enters the dark cavity 42B after passing through the light carrying hole 41B of the carrier member 50B and the housing 40B, and is further exposed by the photosensitive surface of the image sensor 30B. receive.
  • the light generated by the light source 13B does not directly pass through the housing 40B and The light-passing hole 41B enters the dark cavity 42B. In this way, it can be ensured that the light reflected by the object does not interfere when entering the dark cavity 42B through the light-passing hole 41B, thereby It is ensured that the reliability of the optical imaging device when acquiring an image of an object is utilized.
  • the housing 40B may be made of an inorganic or organic material having a penetration close to zero.
  • the housing 40B may be made of any material and then coated or attached with a layer of reflective material or light absorbing on the outer and/or inner surface of the housing 40B. material. In the above manner, the housing 40B can block light generated by the light source 13B from penetrating the housing 40B and interfering with light in the dark chamber 42B.
  • the position of the light source 13B is lower than the plane of the side of the casing 40B where the light-passing hole 41B is provided, by way of The light generated by the light source 13B does not directly enter the dark cavity 42B through the light passing hole 41B.
  • the light source 13B may also have good optical directivity, so that the light generated by the light source 13B can be concentrated to the image collection area 51B in a concentrated manner without Diffusion occurs such that light generated by the light source 13B does not directly enter the dark cavity 42B through the light passing hole 41B.
  • the light that can enter the dark cavity 42B through the light passing hole 41B is light reflected by the object, thereby improving the image quality of the optical imaging apparatus.
  • the light source 13B may include at least one light emitting element, so that in a preferred embodiment of the present invention, each of the light emitting elements of the light source 13B may be spaced along the outer surface of the housing 40B. In another preferred embodiment of the present invention, each of the light-emitting elements of the light source 13B may be circumferentially disposed along an outer surface of the housing 40B, thereby enabling light generated by the light source 13B to be generated. Radiation is more uniformly radiated to the image acquisition area 51B.
  • each of the light-emitting elements of the light source 13B may generate ultraviolet light, infrared light, visible light or the like separately or simultaneously.
  • the light-emitting characteristics of each of the light-emitting elements of the light source 13B are determined by the resolution required by the optical imaging device and the type of the image sensor 30B.
  • the image sensor 30B can sense ultraviolet light, infrared light, visible light. Wait for the light.
  • the size of the image sensor 30B is determined by the size of the image capturing area 51B and the aperture of the light passing hole 41B.
  • the size of the image capturing area 51B is made according to the actual state of the optical imaging device It is determined by the situation that the size of the image acquisition area 51B can be determined according to the size of the object of the image to be acquired, and after the size of the image acquisition area 51B is determined, the size of the carrier element 50B is also determined. It will be understood by those skilled in the art that the size of the carrier element 50B is greater than or equal to the size of the image acquisition area 51B, and the carrier element 50B is made of a transparent material. For example, when the optical imaging device is implemented as a biometric collection device and is used to acquire an image of a fingerprint, the size of the image acquisition region 51B of the optical imaging device is determined by the size of the finger end.
  • the carrier member 50B may be made of an inorganic or organic material having a high transmittance, and the carrier member 50B may be made thin on the basis of strength, so that the carrier member 50B can be The force of the object subjected to the acquired image applied to the carrier element 50B.
  • the optical imaging device may further include a circuit board 60B electrically connected to the circuit board 60B for converting the photosensitive surface of the image sensor 30B with the collected object.
  • the image-related electrical signals of the image are transmitted out, thereby forming an image of the object of the acquired image.
  • the image sensor 30B is mounted on the circuit board 60B
  • the circuit board 60B is mounted on the housing 40B.
  • the image sensor 30B and the circuit board 60B are respectively mounted on different sides of the housing 40B, so that the heat generated by the image sensor 30B during operation does not occur.
  • the wiring board 60B is deformed to ensure the flatness of the image sensor 30B.
  • the type of the wiring board 60B may be not limited, for example, the wiring board 60B may be an FPC wiring board (flexible printed wiring board) such that the wiring board is made The thickness of 60B is thinner to significantly reduce the thickness of the optical imaging device.
  • an optical imaging device in accordance with another preferred embodiment of the present invention.
  • the optical imaging device includes an image sensor 30C, a housing 40C, a carrier member 50C, and a substrate 70C.
  • the housing 40C has a light passing hole 41C.
  • the housing 40C is disposed on the substrate 70C to form a dark cavity 42C between the housing 40C and the substrate 70C, and the light passing hole 41C communicates with the dark cavity 42C and the housing
  • the external environment of 40C that is, the light of the external environment of the casing 40C can only enter the inside of the dark cavity 42C through the light passing hole 41C.
  • the image sensor 30C is housed in the dark cavity 42C, and the light passing hole 41C corresponds to the photosensitive surface of the image sensor 30C.
  • the light passing hole 41C corresponds to a center position of the photosensitive surface of the image sensor 30C.
  • the photosensitive surface of the image sensor 30C is not in contact with the inner surface of the housing 40C, thereby forming the surface between the housing 40C and the photosensitive surface of the image sensor 30C.
  • the image distance of the optical imaging device is not in contact with the inner surface of the housing 40C, thereby forming the surface between the housing 40C and the photosensitive surface of the image sensor 30C.
  • the carrier member 50C is spaced apart from the housing 40C such that the carrier member 50C and the housing 40C are not in contact, thereby forming the optical between the carrier member 50C and the housing 40C.
  • the side of the carrier element 50C forms an image acquisition area 51C, the image acquisition area 51C and the housing 40C are located on different sides of the carrier element 50C, and the image acquisition area 51C is located in the image sensor 30C On the photosensitive path.
  • the housing 40C further includes an upper casing portion 43C and at least one side casing portion. 44C, wherein each of the side shell portions 44C extends curvedly from an edge of the upper shell portion 43C to the substrate 70C, respectively, such that the upper shell portion 43C, each of the side shell portions 44C, and the substrate 70C
  • the dark cavity 42C is formed between, and the light passing hole 41C is provided in the upper case portion 43C.
  • the plane in which the photosensitive surface of the image sensor 30C is located, the plane in which the upper casing portion 43C is located, and the plane in which the carrier member 50C is located are parallel to each other, by collecting objects using the optical imaging device in this manner.
  • the image enables uniform imaging of the various positions of the object.
  • the upper case portion 43C and each of the side case portions 44C may be integrally formed of one sheet material, or a plurality of sheets may be formed by splicing, and the present invention is not limited in this respect.
  • the optical imaging apparatus may further include a light source 13C disposed adjacent to the housing 40C, and the light source 13C and the housing 40C are located on the same side of the carrier member 50C.
  • the light generated by the light source 13C can be directly radiated through the carrier member 50C to the surface of the object placed on the image capturing region 51C, and then the surface of the object Light that is reflected, thereby being reflected by the object, enters the dark cavity 42C after passing through the light carrying hole 50C of the carrier member 50C and the casing 40C, and is further exposed by the photosensitive surface of the image sensor 30C. Photoelectric conversion is received and performed to generate an electrical signal associated with the object from which the image was acquired.
  • the light source 13C may be disposed on the substrate 70C.
  • the position of the light source 13C may be lower than the plane of the upper casing portion 43C of the casing 40C, thereby The light generated by the light source 13C does not directly enter the dark cavity 42C through the light passing hole 41C provided in the upper casing portion 43C to ensure the reliability of the optical imaging apparatus when it is used.
  • the optical imaging device may further include a circuit board 60C electrically connected to the circuit board 60C for rotating the photosensitive surface of the image sensor 30C.
  • the electrical signal associated with the object from which the image was acquired is transmitted, thereby forming an image of the object of the acquired image.
  • the image sensor 30C is mounted on the circuit board 60C, and the circuit board 60C is mounted on the substrate 70C.
  • the image sensor 30C is mounted on the circuit board 60C, the substrate 70C has a receiving cavity 71C, and the circuit board 60C is disposed in the receiving cavity 71C. In this way, the height of the optical imaging device can be significantly reduced, thereby making the optical imaging device thinner.
  • the circuit board 60C and the image sensor 30C may also be respectively mounted on different sides of the substrate 70C, such that the image sensor 30C is generated during operation.
  • the heat does not cause the wiring board 60C to be deformed so as not to affect the flatness of the image sensor 30C.
  • the substrate 70C can be made of a material having better heat conduction and heat dissipation properties, such as a stainless steel material, so that the substrate 70C can not only ensure the flatness of the image sensor 30C, but also It is also possible to quickly dissipate the optical imaging device to ensure stability of the optical imaging device during operation.
  • the optical imaging apparatus may further include a supporting member 80C, wherein the supporting member 80C is disposed on the substrate 70C, and the carrying member 50C is disposed on the supporting member 80C to enable the carrying member 50C to Supported by the carrier element 80C.
  • the support member 80C is made of a material having a low transmittance to prevent light outside the optical imaging device from interfering with light generated by the light source 13C, thereby ensuring that the light imaging device collects an object. The accuracy of the image.
  • the height of the support member 80C can also be adjusted, that is, the carrier member 50C and the housing 40C can be modified by adjusting the support member 80C.
  • the optical imaging apparatus includes an image sensor 30D, a casing 40D, a carrier member 50D, and a wiring board 60D, and the housing 40D has a light passing hole 41D.
  • the image sensor 30D and the housing 40D are respectively mounted on the circuit board 60D to form a dark cavity 42D between the housing 40D and the circuit board 60D, and the light passing hole 41D is connected to The dark cavity 42D
  • the external environment of the housing 40D that is, the light of the external environment of the housing 40D, can only enter the interior of the dark chamber 42D through the light passing hole 41D.
  • the image sensor 30D is housed in the dark cavity 42D, and the light passing hole 41D corresponds to the photosensitive surface of the image sensor 30D.
  • the light passing hole 41D corresponds to a center position of a photosensitive surface of the image sensor 30D.
  • the photosensitive surface of the image sensor 30D and the inner surface of the housing 40D are not in contact, thereby forming an image distance of the optical imaging device between the housing 40D and the photosensitive surface of the image sensor 30D.
  • the carrier member 50D is spaced apart from the housing 40D such that the carrier member 50D and the housing 40D are not in contact, thereby forming the optical between the carrier member 50D and the housing 40D
  • the object distance of the imaging device The side of the carrier element 50D forms an image acquisition area 51D, the image acquisition area 51D and the housing 40D are located on different sides of the carrier element 50D, and the image acquisition area 51D is located at the image sensor 30D. On the photosensitive path.
  • the housing 40D further includes an upper housing portion 43D and at least one side housing portion 44D, wherein each of the side housing portions 44D extends curvedly from an edge of the upper housing portion 43D to the wiring board 60D, thereby
  • the dark portion 42D is formed between the upper case portion 43D, each of the side case portions 44D, and the wiring board 60D, and the light passing hole 41D is provided in the upper case portion 43D.
  • the plane in which the upper casing portion 43D is located is parallel to the plane in which the carrier member 50D is located, in such a manner that when the image of the object is captured by the optical imaging device, the positions of the object can be uniformly Imaging.
  • the optical imaging device may further include a light source 13D disposed adjacent to the housing 40D, and the light source 13D and the housing 40D are located on the same side of the carrier member 50D.
  • the light generated by the light source 13D can be directly radiated through the carrier member 50D to the surface of the object placed on the image acquisition region 51D, and then the surface of the object Light reflected, thereby being reflected by the object, enters the dark cavity 42D after passing through the light carrying hole 41D of the carrier member 50D and the housing 40D, and is further exposed by the photosensitive surface of the image sensor 30D Photoelectric conversion is received and performed to generate an electrical signal associated with the object from which the image was acquired.
  • the light source 13D may be disposed on the circuit board 60D, in such a manner that the position of the light source 13D may be lower than the plane of the upper casing portion 43D of the casing 40D, thereby The light generated by the light source 13D does not directly enter the dark cavity 42D through the light passing hole 41D provided in the upper casing portion 43D to ensure the reliability of the optical imaging device when it is used.
  • the light source 13D and the image sensor 30D may also share the circuit of the circuit board 60D. Thereby the consistency of the optical imaging device is better.
  • the circuit board 60D is a PCB circuit board such that the circuit board 60D has a certain hardness, and the circuit board 60D does not deform at a higher temperature, thereby ensuring that it is mounted on the circuit board 60D.
  • the optical imaging device may further include a support member 80D, wherein the support member 80D is disposed on the circuit board 60D, and the carrier member 50D is disposed on the support member 80D such that the carrier member 50D Supported by the support member 80D.
  • the support member 80D is made of a material having a low transmittance to prevent light outside the optical imaging device from interfering with light generated by the light source 13D, thereby ensuring that the light imaging device collects an object. The accuracy of the image.
  • the optical imaging device includes an image sensor 30E, a housing 40E, a carrier member 50E, a substrate 70E, and a support member 80E.
  • the housing 40E has a light passing hole 41E.
  • the image sensor 30E and the supporting member 80E are respectively disposed on the substrate 70E.
  • the housing 40E includes an upper casing portion 43E, and the upper casing portion 43E is surrounded by Extending to the support member 80E, respectively, a dark cavity 42E is formed between the upper casing portion 43E of the casing 40E and the substrate 70E, and the light-passing hole 41E is provided in the upper casing portion 43E.
  • the light-passing hole 41E communicates with the external environment of the dark cavity 42E and the casing 40E, that is, the light of the external environment of the casing 40E can only enter through the light-passing hole 41E.
  • the image sensor 30E is housed in the dark cavity 42E, and the light passing hole 41E corresponds to the photosensitive surface of the image sensor 30E.
  • the light passing hole 41E corresponds to a center position of the photosensitive surface of the image sensor 30E.
  • the photosensitive surface of the image sensor 30E is not in contact with the upper casing portion 43E of the casing 40E, thereby forming between the upper casing portion 43E of the casing 40E and the photosensitive surface of the image sensor 30E.
  • the image distance of the optical imaging device is not in contact with the upper casing portion 43E of the casing 40E, thereby forming between the upper casing portion 43E of the casing 40E and the photosensitive surface of the image sensor 30E.
  • the housing 40E and the supporting member 80E may be integrally formed to form the optical imaging device on both sides of the housing 40E. Image distance and object distance.
  • the carrier element 50E is supported by the support element 80E, and the carrier element 50E and the upper casing portion 43E of the housing 40E are not in contact, such that the carrier element 50E and the housing 40E are
  • the object distance of the optical imaging device is formed between the shell portions 43E.
  • the side of the carrier member 50E forms an image acquisition area 51E, and the image collection area 51E and the housing 40E are located at The different sides of the carrier element 50E are described, and the image acquisition area 51E is located on the photosensitive path of the image sensor 30E.
  • the plane in which the photosensitive surface of the image sensor 30E is located, the plane in which the upper casing portion 43E is located, and the plane in which the carrier member 50E is located are parallel to each other, by collecting objects using the optical imaging device in this manner.
  • the image enables uniform imaging of the various positions of the object.
  • the optical imaging device may further include a light source 13E disposed on the upper casing portion 43E of the casing 40E.
  • the light generated by the light source 13E can be directly radiated through the carrier member 50E to the surface of the object placed on the image acquisition region 51E, and then the surface of the object The light reflected, thereby being reflected by the object, enters the dark cavity 42E after passing through the light carrying hole 41E of the carrier member 50E and the housing 40, and is further received by the photosensitive surface of the image sensor 30E and Photoelectric conversion is performed to generate an electrical signal associated with the object from which the image was acquired.
  • the optical imaging device may further include a circuit board 60E electrically connected to the circuit board 60E for converting the photosensitive surface of the image sensor 30E with the captured image.
  • the object-related electrical signals are transmitted out, thereby forming an image of the object of the acquired image.
  • the image sensor 30E is mounted on the circuit board 60E, and the circuit board 60E is mounted on the substrate 70E.
  • the image sensor 30E is mounted on the circuit board 60E.
  • the substrate 70E has a receiving cavity 71E.
  • the circuit board 60E is disposed in the receiving cavity 71E. In this way, the height of the optical imaging device can be significantly reduced, thereby making the optical imaging device thinner.
  • the circuit board 60E and the image sensor 30E may also be respectively mounted on different sides of the substrate 70E, such that the image sensor 30E is generated during operation. The heat does not cause the wiring board 60E to be deformed so as not to affect the flatness of the image sensor 30E.
  • the substrate 70E can be made of a material having better heat conduction and heat dissipation properties, such as a stainless steel material, so that the substrate 70E can not only ensure the flatness of the image sensor 30E, but also It is also possible to quickly dissipate the optical imaging device to ensure stability of the optical imaging device during operation.
  • Figure 12 is a light provided in accordance with a variant embodiment of the above described preferred embodiment of the present invention.
  • the optical imaging apparatus includes an image sensor 30F, a housing 40F, a carrier member 50F, a wiring board 60F, and a support member 80F.
  • the housing 40F has a light passing hole 41F, and the image sensor 30F and the supporting member 80F are respectively disposed on the circuit board 60F.
  • the housing 40F includes an upper casing portion 43F, and the upper casing portion 43F Each of the four sides extends to the support member 80F, so that a dark cavity 42F is formed between the upper casing portion 43F of the casing 40F and the circuit board 60F, and the light-passing hole 41F is disposed in the upper casing.
  • the light-passing hole 41F communicates with the external environment of the dark cavity 42F and the casing 40F, that is, the light of the external environment of the casing 40F can pass only through the light-passing hole 41F It enters the inside of the dark chamber 42F.
  • the image sensor 30F is housed in the dark cavity 42F, and the light passing hole 41F corresponds to the photosensitive surface of the image sensor 30F.
  • the light control 41F corresponds to a central position of the photosensitive surface of the image sensor 30F.
  • the photosensitive surface of the image sensor 30F and the upper casing portion 43F of the casing 40F are not in contact with each other to form between the upper casing portion 43F of the casing 40F and the photosensitive surface of the image sensor 30F.
  • the image distance of the optical imaging device is not in contact with each other to form between the upper casing portion 43F of the casing 40F and the photosensitive surface of the image sensor 30F.
  • the carrier member 50F is supported by the support member 80F, and the carrier member 50F and the upper casing portion 43F of the housing 40F are not in contact, so that the carrier member 50F and the housing 40F are The object distance of the optical imaging device is formed between the shell portions 43F.
  • the side of the carrier member 50F forms an image acquisition area 51F, and the image acquisition area 51F is located on the photosensitive path of the image sensor 30F.
  • the plane in which the photosensitive surface of the image sensor 30F is located, the plane in which the upper casing portion 43F is located, and the plane in which the carrier member 50F is located are parallel to each other, by collecting objects using the optical imaging device in this manner.
  • the image enables uniform imaging of the various positions of the object.
  • the optical imaging apparatus may further include a light source 13F disposed on the upper casing portion 43F of the casing 40F.
  • the light generated by the light source 13F can be directly radiated through the carrier member 50F to the surface of the object placed on the image capturing region 51F, and then the surface of the object Light that is reflected, thereby being reflected by the object, enters the dark cavity 42F after passing through the light carrying hole 41F of the carrier member 50F and the housing 40F, and is further exposed by the photosensitive surface of the image sensor 30F. Photoelectric conversion is received and performed to generate an electrical signal associated with the object from which the image was acquired.
  • an object of the acquired image needs to be placed in the image acquisition area 51F, and light emitted by the light source 13F passes through the bearing component. 50F and irradiated to the surface of the object, at this time, the surface of the object reflects the light, and the light passes through the bearing member 50F and the light passing hole 41F again to enter the dark cavity 42F, thereby being set
  • the photosensitive surface of the image sensor 30F in the dark chamber 42F receives and performs subsequent photoelectric conversion, and then the electrical signal associated with the object is further transmitted through the wiring board 60F.
  • the light generated by the light source 13F does not directly enter the dark cavity 42F through the casing 40F, thereby being reflected by the surface of the object and entering the through the light-passing hole 41F. Light within the dark cavity 42F is not disturbed, thereby ensuring the quality of the image captured by the optical imaging device.
  • the present invention also provides a method of designing the optical imaging apparatus. In determining the actual application environment of the optical imaging device, the value of the range parameter F of the imaged object of the optical imaging device is determined accordingly.
  • setting the object height parameter of the optical imaging device to U, and the object height U of the optical imaging device is less than or equal to the height of the image capturing region 51C; setting the optical imaging The image height parameter of the device is V, and the image height V of the optical imaging device is less than or equal to the height of the image sensor 30C; the diameter of the light passing hole 41C is an aperture, and the aperture of the optical imaging device is set.
  • the parameter is ⁇ ; the distance between the upper casing portion 43C of the casing 40C and the photosensitive surface of the image sensor 30C is an image distance, and the image distance parameter of the optical imaging device is set to X; The distance between the upper casing portion 43C of the casing 40C and the carrier member 50C is an object distance, and the object distance parameter of the optical imaging device is set to W.
  • Figure 14 shows a design process 1400 of the optical imaging device of the present invention.
  • Stage 1410 determining the height of the optical imaging device based on the particular use environment of the optical imaging device. It is worth mentioning that the height of the optical imaging device includes the distance between the upper casing portion 43C of the casing 40C and the photosensitive surface of the image sensor 30C, and the upper casing of the casing 40C. The distance between the portion 43C and the carrier member 50C and the thickness and tolerance of the elements themselves, that is, the height of the optical imaging device includes at least the image distance X and the object distance Y of the optical imaging device.
  • Stage 1420 After the height of the optical imaging device is determined, the object height U of the optical imaging device is defined such that the size of the image acquisition region 51C is also determined, that is, the size of the image acquisition region 51C. Greater than or equal to the object height U of the optical imaging device. For example, when the optical imaging device is implemented as the biometrics collection device for acquiring fingerprints, the area of the image acquisition region 51C matches the area of the fingertips.
  • the value of the aperture ⁇ of the optical imaging device can be calculated.
  • the aperture of the light-passing aperture 41C is greater than or equal to twice the thickness of the upper housing portion 43C according to the principle of linear propagation of light rays and ensuring the imaging quality of the optical imaging device.
  • Stage 1440 After determining the object height, image height, object distance, image distance and aperture of the optical imaging device, and the size of the image sensor 30C, the image sensor 30C having appropriate pixel values and pixel size is selected. To match the optical imaging device, thereby improving the imaging quality of the optical imaging device.
  • Stage 1450 Selecting an illuminant having a suitable light wave length and light intensity as the light source 13C of the optical imaging apparatus of the present invention. It is worth mentioning that while the light source 13C satisfies the required brightness of the optical imaging device, the light-emitting characteristics of the light source 13C also meet the resolution requirement of the optical imaging device, and the light-emitting characteristics of the light source 13C. Matches the type of the image sensor 30C.
  • the present invention also provides a design method of an optical imaging device, wherein the design method comprises the following steps:
  • the method further comprises the steps of:
  • Step (j.1) configuring an image sensor 30C required to satisfy the optical imaging device according to an image height of the optical imaging device
  • Step (j.2) Selects the image sensor 30C having an appropriate number of pixels and pixel size required to satisfy the optical imaging device in accordance with the resolution of the optical imaging device.
  • the method further comprises the steps of:
  • step (j) Detecting whether the imaging quality of the optical imaging device satisfies the need for use, and if satisfied, the design of the optical imaging device is completed, and if not, the step (j) is repeatedly performed.
  • the imaging object range parameter of the optical imaging device is set to F
  • the aperture parameter of the optical imaging device is set to ⁇
  • the image distance parameter of the optical imaging device is set to X
  • setting a height parameter of the optical imaging device to U setting an image height parameter of the optical imaging device to V; wherein an image height of the optical imaging device and the optical imaging
  • V [UX+ ⁇ (W+X)]/W.
  • the present invention also provides a method of forming an optical imaging apparatus, wherein the forming method comprises the following steps:
  • an image sensor 30C is placed in a dark cavity 42C, wherein the dark cavity 42C communicates with the external environment of the dark cavity 42C through a light passing hole 41C, and the light passing hole 41C corresponds to the image a photosensitive surface of the sensor 30C;
  • the light passing hole 41C corresponds to a center position of the photosensitive surface of the image sensor 30C.
  • step (i) further comprises the steps of:
  • step (ii) further comprises the steps of:
  • a carrier member 50C is disposed at an upper portion of the housing 40C, and the carrier member 50C forms the image pickup region 51C.
  • the present invention also provides an electronic device 90, wherein the electronic device 90 comprises an optical imaging device, which in the different embodiments of the invention can assist the electronic device in achieving different The function.
  • the electronic device 90J can be a biometric acquisition device, such as a fingerprint collector or the like.
  • the electronic device 90J is used to assist in collecting biometric features of the user such as fingerprints, palm prints or foot prints.
  • the electronic device 90J may include a connection device 91J and the optical imaging device 100J, the optical imaging device 100J being communicably connected to the connection device 91J, the connection device 91J being adapted to be communicably Connected to an electrical appliance, such as a computer.
  • an electrical appliance such as a computer.
  • the user can place the position of the fingertip and the like that needs to be acquired in the image capturing area 51 of the optical imaging device 100J.
  • the light generated by the light source 13 is radiated to the surface of the finger end,
  • the surface of the end reflects the light, and the light reflected by the surface of the finger end enters the dark cavity 42 after passing through the light passing hole 41 to be
  • the photosensitive surface of the image sensor 30 receives and performs photoelectric conversion to generate an electrical signal associated with the finger end, and the electrical signal is transmitted to the electrical device by the connecting device 91J, so that an image related to the finger end can be generated.
  • the connecting device 91J can be implemented as a USB connector, and when the electronic device 90J is used, the connecting device of the electrical device can be inserted through the connecting device 91J. In a manner, the electronic device 90J is coupled to the appliance such that the electronic device 90 can transmit the collected biometrics of the user to the appliance.
  • the connecting device 90J can also be implemented as a communication module, such as a Bluetooth module, a Wi-Fi module, etc., when the electronic device is used, through the connection.
  • the device 91J is wirelessly coupled to the communication module of the appliance such that the electronic device 90J can transmit the collected biometrics of the user to the appliance.
  • the electronic device 90K can be a mobile electronic device such as a mobile phone, a tablet computer, a notebook computer, or an electronic paper book. Or a portable digital electronic device such as a personal digital assistant that can be used for mobile use.
  • the optical imaging device 100K can collect biometric features of the user, such as fingerprint features, to assist the electronic device 90K in achieving identification of the user.
  • the electronic device 90K includes a device body 92K and the optical imaging device 100K, wherein the optical imaging device 100K is communicably coupled to the device body 92K.
  • the optical imaging device 100K may collect biometric features of the user, such as fingerprint features, and transmit them to the device body 92K, and subsequently, the device body 92K will acquire images and The image pre-stored in the device body 92K is compared. If the matching is successful, the device body 92K considers the user to be a legitimate user. If the matching fails, the device body 92K considers the user to be an illegal user. .
  • the optical imaging apparatus 100K of the present invention does not require optical elements such as prisms, lenses, etc., as compared with prior art optical imaging systems, thereby making the optical imaging apparatus 100K The thickness is thinner, and the optical imaging apparatus 100K can be applied to the electronic device 90K that is thin and thin.
  • optical imaging device 100K can be disposed at different locations of the device body 92K such that the electronic device 90K is used in a different manner.
  • the device body 92K includes a button 921K, for example
  • the button 921K may be a main button (for example, a Home button) or a switch button of the electronic device 90K, and the optical imaging device 100K is correspondingly disposed on the button 921K, and the button 921K may form the button
  • the carrier member 50 of the optical imaging device 100K thereby forming the image acquisition region 51 at an upper portion of the button 921K, whereby the optical imaging device is operated when the user operates the electronic device 90K through the button 921K
  • the 100K will synchronously collect the fingerprint features of the user for subsequent identification of the user.
  • the device body 92K includes a display screen 922K, and the optical imaging device 100K is correspondingly disposed on the display screen 922K, at which time the display screen 922K forms the The carrier element 50K of the optical imaging device 100K, thereby forming the image acquisition area 51 on the display screen 922K; correspondingly, the display screen 922K also forms the light source 13 of the optical imaging apparatus 100K,
  • the optical imaging device 100K collects fingerprint features of the user for subsequent identification.
  • the 18 to 20 are an electronic device 90L according to a third preferred embodiment of the present invention, wherein the electronic device 90L can be applied to an access control system or a safe security lock.
  • the optical imaging device 100L can collect biometric characters such as fingerprint features of the user to assist the electronic device 90L in identifying the user.
  • the electronic device 90L includes a device body 92L and the optical imaging device 100L.
  • the device body 92L further includes a processor 923L and a lock body 924L.
  • the optical imaging device 100L is communicably connected to
  • the processor 923L is operatively coupled to the lock body 924L for controlling a gate to which the access control system is installed or a cabinet door to which the safe lock is installed status.
  • the optical imaging device 100L collects biometric features of the user, such as fingerprint features, and transmits them to the processor 923L for comparison. If the matching is successful, the processor The lock body 924L is opened by the 923L operation, and if the match fails, the processor 923L generates an instruction to keep the lock body 924L in a locked state.
  • the 21 is an electronic device 90M provided in accordance with a fourth preferred embodiment of the present invention, wherein the electronic device 90M may be a payment terminal such as a POINT machine (Point Of Sales) or the like.
  • the electronic device 90M includes a device body 92M and an optical imaging device 100M that can collect biometric features of the user, such as fingerprint features, for completing payment of the statement.
  • the optical imaging device 100M can collect biometric features of the user, such as fingerprint features. At this time, the electronic device 90M can pre-store the captured image. The image of the electronic device 90M is compared. If the matching is successful, the electronic device 90M considers the identity of the user to be legal, thereby completing the payment of the statement. If the match is yes, the electronic device 90M considers the user's The identity is illegal and the payment for the bill fails.
  • the electronic device 90N may be a courier terminal, the electronic device 90N including a device body 92N and an optical imaging device 100N.
  • the optical imaging device 100N can collect biometric features of the user, such as fingerprint features, for completing the signing of the courier.
  • an electronic device 90S according to a sixth preferred embodiment of the present invention, wherein the electronic device 90S is a medical device such as an endoscope or the like.
  • the image acquired by the optical imaging device 100S is not used to identify the identity of the user, but is applied to medical diagnosis and treatment.
  • the electronic device 90S includes a device body 92S and the optical imaging device 100S, wherein the optical imaging device 100S is disposed in the device body 92S, and the housing of the device body 92S forms the The carrier member 50 of the optical imaging device 100S, thereby forming the image acquisition region 51S of the optical imaging device 100S outside the housing of the device body 92S.
  • the 90S communication connected appliance displays an image.
  • the height of the optical imaging device 100S of the electronic device 90S is significantly reduced as compared with the prior art endoscope, so that the volume of the electronic device 90S can be simultaneously reduced, thereby facilitating the expansion of the electronic device.
  • the present invention also provides an imaging method by an optical imaging device, characterized in that the method comprises the following steps:

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Abstract

一种利用小孔成像原理建立的光学成像装置(100J,100K,100L,100S)及其制造方法和应用，其中所述光学成像装置包括一识别载体(12,12A)，其具有一透明的物方识别区域(121,121A)；一暗室壳体(111,111A)，其中所述暗室壳体(111,111A)形成一暗室(110,110A)，并具有一通孔(1111,1111A)，所述通孔(1111,1111A)与所述暗室(110,110A)相连通；一图像感应装置(14,14A)，其包括一图像传感器(141,141A)，所述图像传感器(141,141A)安装于所述暗室(110,110A)中；和一光源(13,13A)，其中所述光源(13,13A)安装于所述暗室壳体(111,111A)外部，其中当一识对对象放置于所述物方识别区域(121,121A)时，所述光源(13,13A)发出的发射光线射向所述物方识别区域(121,121A)并进一步地到达所述识别对象表面被反射，然后穿过所述通孔(1111,1111A)投射到所述图像传感器(141,141A)，从而藉由小孔成像原理使所述识别对象通过所述光学成像系统(10,10A)进行成像。

Description

利用小孔成像原理建立的光学成像装置及其制造方法和应用 技术领域
本发明涉及一种成像装置，特别涉及一种利用小孔成像原理建立的光学成像装置及其制造方法和应用，相对于现有技术的光学成像系统来说，所述光学成像装置在采集物体的图像时，不需要被配置透镜、棱镜等光学元件，从而，使得所述光学成像装置的高度显著地降低，进而，使得所述光学成像装置能够被应用于追求轻薄化、微型化的电子设备、医疗器械等领域。
背景技术
用户的身份识别技术对于电子设备来说屡见不鲜见。例如，一种比较普及的用户身份识别方式是在电子设备上输入组合数字或字母作为密码，并与预存于电子设备的密码进行比对，即可以对用户的身份合法性进行识别；另一种比较普及的用户身份识别方式是基于生物特征实现的，典型的实施方式是采集用户的指纹图像，并与预存于电子设备的指纹图像进行比对，即可以完成对用户的身份合法性进行识别。
实践的过程证明第一种身份识别方式的安全性较低，其原因在于，任何人都可以将正确的密码输入到电子设备，此时，电子设备会认为密码的输入者为合法的用户，这就直接导致了电子设备的控制权被该输入者取得。相对来说，第二种通过采集用户的生物特征的方式来进行用户的身份识别在安全性方面有很大的提升。
现有技术的采集用户的生物特征(如指纹图像)的技术有半导体芯片技术和光学成像技术，这两种技术各有优缺点。
现有技术的半导体芯片技术制成的指纹采集器的抗静电和抗腐蚀能力较差，这导致指纹采集器在使用的过程中的稳定性不足，尤其是当该输入者的指端有汗液分泌时，指纹采集器就无法采集到指纹图像。一个典型的示例是容易出手汗的该输入者在使用指纹采集器时的流畅性较差，严重地影响了指纹采集器的用户体验。
现有技术的光学成像技术制成的指纹采集器的原理是光线的全发射。指纹采集器必要的构件包括图像传感器、棱镜、透镜和光源等，棱镜和透镜设置于图像传感器的感光路径上，并且在棱镜和透镜的上部设有图像采集区。在指纹采集器被用于采集该输入者的指纹图像时，该输入者将指端放置于图像采集区，光线产生的光线会照射到该输入者的位于图像采集区的指端，并且光线被指端反射，因为该输入者的指端的指纹的存在，使得指端的不同位置反射的光量不同，从而，被该输入者的指端反射的光线在透过棱镜和透镜之后，被图像传感器接收，以完成对该输入者的指端的指纹图形的采集。
尽管现有技术的光学成像技术的稳定性和精确性优于半导体芯片技术，但是利用光学成像技术制成的指纹采集器因为棱镜、透镜等光学镜片的存在，使得指纹采集器的高度和宽度都比较大，进而导致光学成像技术无法被应用于追求轻薄化的电子设备中。
另外，在医学方面，内窥镜使用的光学成像技术与电子设备的光学成像技术类似。具体地说，内窥镜因为设有透镜等光学镜片使得其体积无法被继续缩小。目前，在一些疾病的诊断和治疗过程中，内窥镜因为尺寸的限制而无法被应用。因此，如何缩小内窥镜的尺寸也成为了亟需解决的问题。
发明内容
本发明的一个目的在于提供一种光学成像装置及其制造方法和应用，使用小孔成像光学系统作为成像装置，结构简单，能够减小整个指纹识别及内窥镜等微型成像系统的尺寸，可以放置于小体积的仪器设备中。
本发明的一个目的在于提供一种光学成像装置及其制造方法和应用，在确定整个系统装置的总高后，能够通过改变小孔光学成像系统的物距、像距及孔径的大小来保证其具有较好的解像力，满足指纹识别的精度要求。
本发明的一个目的在于提供一种光学成像装置及其制造方法和应用，使用小孔成像光学系统作为成像装置，和传统的使用透镜作为光学系统相比，不但可以减小体积，还可以降低成本。
本发明的一个目的在于提供一种光学成像装置及其制造方法和应用，摒弃了传统的采用棱镜作为指纹感应区域的做法，本发明可以选择任意透明度较高的无机或有机材料作为指纹感应区域，且可以做到尽量薄，因此，成本较低，选择自 由，也使得整个指纹识别系统的体积更小，重量更轻。
本发明的一个目的在于提供一种光学成像装置及其制造方法和应用，通孔可以刻在大多数穿透率接近于零的有机或无机材料所制的较薄的平板上，制造简单。
本发明的一个目的在于提供一种光学成像装置及其制造方法和应用，其利用小孔成像光学系统将物方识别区域在反射一定亮度的光源照射后形成指纹的像投影到图像传感器上，再供终端设备判定。
本发明的一个目的在于提供一种光学成像装置及其制造方法和应用，其包括的成像装置可以作为模组得以应用于任何电子设备的光学成像系统，应用范围广泛。
本发明的一个目的在于提供一种光学成像装置及其制造方法和应用，利用小孔成像的原理，解像力好，实用性强，没有复杂的制造工艺，且操作简单。
本发明的一个目的在于提供一种光学成像装置及其制造方法和应用，可以根据所应用的设备来选择性地进行设置，得以使其能够合理地、低成本地应用于相应设备中。
本发明的一个目的在于提供一种光学成像装置及其制造方法和应用，通过逐步定义和计算，最终满足指纹识别系统的可判定要求，简单实用、可操作性强，根据实际情况定义出光学成像系统的大小，得以将光学成像系统作为指纹图像采集装置安装于小型指纹识别设备中。
本发明的一个目的在于提供一种光学成像装置及其制造方法和应用，相对于现有技术的光学成像系统来说，所述光学成像装置在采集物体的图像时，不需要被配置透镜、棱镜等光学元件，从而，使得所述光学成像装置的高度显著地降低，进而，使得所述光学成像装置能够被应用于追求轻薄化、微型化的电子设备、医疗器械等领域。
本发明的一个目的在于提供一种光学成像装置及其制造方法和应用，其中在保证所述光学成像装置的解像力的前提下，所述光学成像装置的体积可以进一步地被减小，以便于其能够被置放到更小的设备中使用。
本发明的一个目的在于提供一种光学成像装置及其制造方法和应用，其中所述图像传感器被置入一暗腔，并且所述暗腔通过一通光孔连通于所述暗腔的外部环境，从而，被物体反射的光线仅会通过所述通光孔进入到所述暗腔内以被所述 图像传感器的感光面接收，进而在后续生成与被采集图像的物体相关的图像。
本发明的一个目的在于提供一种光学成像装置及其制造方法和应用，其中当所述光学成像装置的高度被确定之后，可以通过改变所述光学成像装置的物距、像距以及所述通光孔的孔径来调整所述光学成像装置的解像力，从而，使所述光学成像装置满足对于用户的身份识别的精度的要求。
本发明的一个目的在于提供一种光学成像装置及其制造方法和应用，其中所述光学成像装置还包括一承载平台，所述承载平台形成一图像采集区域，其中所述承载平台不是由棱镜和透镜等光学元件制成，而是由任何穿透性较好的无机或有机材料制成，从而显著地降低了所述光学成像装置的整体高度。
本发明的一个目的在于提供一种光学成像装置及其制造方法和应用，其中当所述光学成像装置被配置于所述电子设备之后，所述电子设备的部分结构可以形成所述光学成像装置的所述图像采集区域，从而所述光学成像装置符合所述电子设备轻薄化、微型化的发展趋势。
本发明的一个目的在于提供一种光学成像装置及其制造方法和应用，其中当所述光学成像装置被配置于所述电子设备之后，所述电子设备的部分结构可以形成所述光学成像装置的光源，也就是说，本发明的所述光学成像装置可以不需要被配置光源，以进一步减少所述光学成像装置的体积。
为满足本发明的以上优势以及本发明的其他优势及目的，本发明提供一种光学成像系统、一种光学成像方法以及一种利用小孔成像原理制定光学成像系统的方法。
相应地，本发明提供一种光学成像系统，其包括：
一识别载体，其具有一透明的物方识别区域；
一暗室壳体，其中所述暗室壳体形成一暗室，并具有一通孔，所述通孔与所述暗室相连通；
一图像感应装置，其包括一图像传感器，所述图像传感器安装于所述暗室中；和
一光源，其中所述光源安装于所述暗室壳体外部，其中当一识对对象放置于所述物方识别区域时，所述光源发出的发射光线射向所述物方识别区域并进一步地到达所述识别对象表面被反射，然后穿过所述通孔投射到所述图像传感器，从而藉由小孔成像原理使所述识别对象通过所述光学成像系统进行成像。
优选地，所述图像感应装置进一步包括一电路板，其中所述电路板连接于所述图像传感器。
优选地，所述物方识别区域使用具有高透过率的无机或有机材料制作。
优选地，制作所述暗室壳体的无机或有机材料阻挡光线通过而形成所述暗室。
优选地，其中在所述暗室壳体外部形成一容纳腔室，所述光源安装于所述腔室内部的一个或多个位置。
优选地，所述光源单独或同时发射紫外、红外或可见光，所述图像传感器适合于感应紫外、红外或可见光。
优选地，所述电路板连接于所述暗室壳体的底壁或作为所述暗室壳体的底壁，以形成所述暗室。
优选地，所述光学成像系统组装于一指纹设别设备。
优选地，所述光学成像系统集成于一智能电子设备，所述识别对象为指纹，从而为所述智能电子设备提供指纹识别功能。
优选地，所述光学成像系统组装于一内窥镜。
本发明还提供一种光学成像方法，其包括以下步骤：
(a)一光源发射光线；
(b)一透明的物方识别区域接收所述光源的发射光线，并被放置于所述物方识别区域的识别对象将光线反射；
(c)所述反射光线通过一通孔投射到一图像传感器，从而藉由小孔成像原理使所述识别对象进行成像。
优选地，在所述步骤(c)中，所述光源射向所述通孔之外的光线被所述暗室壳体所阻挡，从而所述光源发出的光线只能被反射后通过所述通孔到达所述图像传感器。
优选地，所述图像传感器安装于所述暗室壳体的一暗室中，所述光源安装于所述暗室外部，所述物方识别区域和所述通孔平行设置，并保持一间距。
优选地，所述通孔的孔径、所述通孔到所述物方识别区域和所述图像传感器的距离以及所述图像传感器的尺寸根据小孔成像原理来确定。
优选地，所述物方识别区域使用具有高透过率的无机或有机材料制作。
优选地，所述光源单独或同时发射紫外、红外或可见光，所述图像传感器能 够感应紫外、红外或可见光。
本发明还提供一种利用小孔成像原理制定光学成像系统的方法，所述方法包括以下步骤：
(A)制定整个光学成像系统的总高；
(B)定义物方识别区域所需的感应面积U；
(C)定义出一通孔的孔径Φ、所述通孔到一感应面的距离W以及所述通孔到一图像传感器的距离X及相应公差；
(D)选择合适的图像传感器；和
(E)选择满足系统所需的至少一光源。
优选地，进一步包括一步骤(F)检验所得识别对象是否达到终端系统可判定要求，如果达到判定要求，则完成，如果达不到判定要求，则返回步骤(C)分析失败原因，直至合格为止，其中所述步骤(F)位于所述步骤(E)之后。
优选地，在所述步骤(C)中，根据公式F＝Φ(W/X+1)，计算出孔径Φ及其公差，其中F表示屏幕上的点所对应的被成像物的范围。
优选地，在所述步骤(C)中，根据公式F＝Φ(W/X+1)，计算出孔径Φ及其公差，其中F表示屏幕上的点所对应的被成像物的范围。
优选地，由公式V＝[UX+Φ(W+X)]/W，计算出像高V及其公差，其中所述图像传感器的尺寸根据像高V来选择。
优选地，由公式V＝[UX+Φ(W+X)]/W，计算出像高V及其公差，其中所述图像传感器的尺寸根据像高V来选择。
优选地，所述感应面位于所述物方识别区域，其中所述感应面积U为所述物方识别区域感应的识别对象的面积。
优选地，根据所述通孔到所述感应面的距离W以及所述通孔到所述图像传感器的距离X制定所述光学成像系统，将所述通孔设于一通孔壁上，其中所述物方识别区域和所述图像传感器按照W和X的距离安装于所述通孔壁的相对的两侧。
优选地，所述传感器安装于一暗室中，形成所述暗室的一暗室壳体得以使所述光源发出的射向所述暗室壳体的光线被所述暗室壳体阻挡或吸收。
优选地，在所述步骤(D)中，选择出规格大小、像素值及像素点大小均合适的图像传感器作为所述光学成像系统的图像传感器。
优选地，在所述步骤(E)中，选择合适发光波长及光强的光源，以满足所述光学成像系统的亮度和解像力要求。
本发明还提供一种指纹识别系统，以应用于识别一指纹，其包括：
一识别载体，其具有一透明的物方识别区域；
一暗室壳体，其中所述暗室壳体形成一暗室，并具有一通孔，所述通孔与所述暗室相连通；
一图像感应装置，其包括一图像传感器，所述图像传感器安装于所述暗室中；
一光源，其中所述光源安装于所述暗室壳体外部；和
一指纹识别终端，其耦接于所述图像感应装置，其中当有手指或脚指置于所述物方识别区域时，所述光源发出的发射光线射向所述物方识别区域并进一步地到达所述手指或脚指表面被反射，然后穿过所述通孔投射到所述图像传感器，从而藉由小孔成像原理使所述识别对象通过所述光学成像系统进行成像，所述指纹识别终端对所述指纹的成像进行判定和识别。
优选地，所述暗室壳体采用不透光材料制作。
优选地，所述通孔与所述图像传感器平行设置。
优选地，所述图像传感器连接于一电路板，其中所述电路板连接于所述暗室壳体的底壁，从而用于形成所述暗室。
优选地，所述图像感应装置与所述指纹识别终端共用一电路板。
优选地，所述指纹识别系统适合于制作独立的指纹识别装置，或集成于一智能电子设备中。
本发明还提供一种光学成像装置，其中所述光学成像装置包括一图像传感器和一光源，所述光学成像装置具有一图像采集区域、一暗腔以及一通光孔；
其中所述通光孔连通于所述暗腔与所述暗腔的外部环境，所述图像传感器位于所述暗腔，并且所述通光孔对应于所述图像传感器的感光面，所述光源位于所述暗腔的外部环境，所述图像采集区域位于所述图像传感器的感光路径；
其中当一物体置放于所述图像采集区域时，所述光源产生的光线在辐射至所述物体后被所述物体的表面反射，被所述物体的表面反射的光线穿过所述通光孔进入所述暗腔并进一步被所述图像传感器的感光面接收，从而所述光学成像装置采集物体的图像。
优选地，所述通光孔对应于所述图像传感器的感光面的中心位置。
优选地，所述光学成像装置还包括一壳体，其中所述壳体具有所述暗腔和所述通光孔，所述图像传感器被容纳于所述壳体，所述光源邻近地设置于所述壳体。
优选地，所述光学成像装置还包括一壳体和一基板，其中所述壳体设置于所述基板，以在所述壳体和所述基板之间形成所述暗腔，所述光源邻近地设置于所述壳体。
优选地，所述光学成像装置还包括一线路板，其中所述图像传感器贴装于所述线路板，所述线路板贴装于所述基板。
优选地，所述光学成像装置还包括一线路板，其中所述图像传感器贴装于所述线路板，所述基板具有一接受腔，所述线路板被容纳于所述接受腔。
优选地，所述光学成像装置还包括一线路板，其中所述图像传感器和所述线路板分别贴装于所述基板的不同侧，并且所述图像传感器电连接于所述线路板。
优选地，所述壳体包括一上壳部和至少一侧壳部，每所述侧壳部分别弯曲地从所述上壳部的边缘延伸至所述基板，从而在所述上壳部、每所述侧壳部和所述基板之间形成所述暗腔。
优选地，所述光学成像装置还包括一壳体和一线路板，所述壳体设置于所述线路板，以在所述壳体和所述线路板之间形成所述暗腔，所述图像传感器贴装于所述线路板。
优选地，所述壳体包括一上壳部和至少一侧壳部，每所述侧壳部分别弯曲地从所述上壳部的边缘延伸至所述线路板，从而在所述上壳部、每所述侧壳部和所述线路板之间形成所述暗腔。
优选地，所述光学成像装置还包括一壳体、一基板和一支撑元件，其中所述支撑元件设置于所述基板，所述壳体的四周分别延伸至所述支撑元件，从而在所述基板、所述支撑元件和所述壳体之间形成所述暗腔，所述壳体具有所述通光孔以连通于所述暗腔与所述暗腔的外部环境。
优选地，所述光学成像装置还包括一线路板，其中所述图像传感器贴装于所述线路板，所述线路板贴装于所述基板。
优选地，所述光学成像装置还包括一线路板，其中所述图像传感器贴装于所述线路板，所述基板具有一接受腔，所述线路板被容纳于所述接受腔。
优选地，所述光学成像装置还包括一线路板，其中所述图像传感器和所述线路板分别贴装于所述基板的不同侧，并且所述图像传感器电连接于所述线路板。
优选地，所述光学成像装置还包括一壳体、一线路板和一支撑元件，其中所述支撑元件设置于所述线路板，所述壳体的四周分别延伸至所述支撑元件，从而在所述支撑元件、所述线路板和所述壳体之间形成所述暗腔，所述图像传感器贴装于所述线路板，所述壳体具有所述通光孔以连通于所述暗腔与所述暗腔的外部环境。
优选地，所述光学成像装置还包括一承载元件，其中所述承载元件间隔地设置于所述壳体，并且所述承载元件的侧部形成所述图像采集区域。
优选地，所述图像传感器的感光面所在的平面与所述承载元件所在的平面平行。
本发明还提供一种电子设备，其包括一光学成像装置，其中所述光学成像装置包括一图像传感器和一光源，所述光学成像装置具有一图像采集区域、一暗腔以及一通光孔；其中所述通光孔连通于所述暗腔和所述暗腔的外部环境，所述图像传感器位于所述暗腔，并且所述通光孔对应于所述图像传感器的感光面，所述光源位于所述暗腔的外部环境，所述图像采集区域位于所述图像传感器的感光路径。
优选地，所述光学成像装置供采集使用者的生物特征；其中当使用者的被采集图像的位置置放于所述图像采集区域时，所述光源产生的光线在辐射至所述被采集图像的位置后、被所述被采集图像的位置反射，被所述被采集图像的位置反射后的光线穿过所述通光孔进入所述暗腔并进一步被所述图像传感器的感光面接收，从而所述光学成像装置采集使用者的生物特征。
优选地，所述生物特征的类型选自指纹、掌纹和脚纹组成的类型组。
优选地，所述电子设备是一生物特征采集装置，并且所述电子设备还包括一连接装置，所述光学成像装置可通信地连接于所述连接装置，所述连接装置适于可通信地连接于一电器。
优选地，所述电子设备是一移动电子设备，并且所述电子设备还包括一设备本体，所述光学成像装置可通信地连接于所述设备本体；其中所述光学成像装置采集的使用者的所述生物特征被传输至所述设备本体，以与预存于所述设备本体的生物特征进行比对，若匹配成功，则所述设备本体认为被采集所述生物特征的使用者身份合法，若匹配失败，则所述设备本体认为被采集所述生物特征的使用者身份非法。
优选地，所述设备本体包括一按钮，所述光学成像装置设置于所述设备本体，并且所述按钮形成所述图像采集区域。
优选地，所述设备本体包括一显示屏幕，所述光学成像装置设置于所述设备本体，并且所述显示屏幕形成所述图像采集区域。
优选地，所述电子设备的类型选自手机、平板电脑、笔记本电脑、电纸书和个人数字助理组成的类型组。
优选地，所述电子设备是一门禁系统或者保险柜安全锁；其中所述电子设备包括一设备本体，所述光学成像装置可通信地连接于所述设备本体；其中所述光学成像装置采集的使用者的所述生物特征被传输至所述设备本体，以与预存于所述设备本体的生物特征进行比对，若匹配成功，则所述设备本体认为被采集所述生物特征的使用者身份合法，若匹配失败，则所述设备本体认为被采集所述生物特征的使用者身份非法。
优选地，所述设备本体包括一处理器和一锁体，所述光学成像装置可通信地连接于所述处理器，所述处理器可操作地连接于所述锁体，并且所述处理器得以控制所述锁体的状态。
优选地，所述电子设备是一支付终端，以供对账单进行支付。
优选地，所述电子设备是一快递终端，以供对快递件进行签收。
优选地，所述电子设备是一内窥镜；其中所述电子设备包括一设备本体，所述光学成像装置可通信地连接于所述设备本体，并且所述光学成像装置设置于所述设备本体，以使所述设备本体形成所述图像采集区域。
本发明还提供一种光学成像装置的设计方法，其中所述设计方法包括如下步骤：
(h)根据所述光学成像装置的使用环境，分别确定所述光学成像装置的高度和成像物范围；
(i)定义所述光学成像装置的物高；
(j)根据所述光学成像装置的高度、成像物范围和物高，计算所述光学成像装置的物距、像距、孔径以及像高；以及
(k)配置满足所述光学成像装置所需的一光源。
优选地，在所述步骤(j)中，进一步包括步骤：
步骤(j.1)根据所述光学成像装置的像高，配置满足所述光学成像装置所需 的一图像传感器；和
步骤(j.2)根据所述光学成像装置的解像力，选择满足所述光学成像装置所需的具有合适的像素数量和像素尺寸的所述图像传感器。
优选地，所述设计方法还包括步骤：
(l)检测所述光学成像装置的成像品质是否满足使用需要，若满足则所述光学成像装置的设计完成，若不满足则重复执行所述步骤(j)。
优选地，在上述方法中，设定所述光学成像装置的成像物范围参数为F，设定所述光学成像装置的孔径参数为Φ，设定所述光学成像装置的像距参数为X，设定所述光学成像装置的物距参数为W；其中所述光学成像装置的成像物范围与所述光学成像装置的孔径、物距和像距的关系满足函数表达式：F＝Φ(W/X+1)。
优选地，在上述方法中，设定所述光学成像装置的物高参数为U，设定所述光学成像装置的像高参数为V；其中所述光学成像装置的像高与所述光学成像装置的物高、孔径、物距和像距的关系满足函数表达式：V＝[UX+Φ(W+X)]/W。
本发明还提供一种光学成像装置的制造方法，其中所述制造方法包括如下步骤：
(i)将一图像传感器置入一暗腔，其中所述暗腔通过一通光孔连通于所述暗腔的外部环境，并且所述通光孔对应于所述图像传感器的感光面；
(ii)形成一图像采集区域于所述图像传感器的感光路径，其中所述图像采集区域位于所述通光孔的上方，并且所述图像采集区域供放置被采集图像的物体；以及
(iii)设置一光源于所述暗腔的外部环境，其中所述光源产生的光线在辐射至所述图像采集区域之后，被放置于所述图像采集区域的物体反射，被反射的光线穿过所述通光孔进入到所述暗腔，以被所述图像传感器的感光面接收。
优选地，在所述步骤(i)中，包括步骤：
使所述通光孔对应于所述图像传感器的感光面的中心位置。
优选地，在所述步骤(i)中，还包括步骤：
将所述图像传感器设置于一基板；和
提供具有通光孔的一壳体，以在所述壳体和所述基板之间形成所述暗腔。
优选地，在所述步骤(i)中，还包括步骤：
将所述图像传感器贴装于一线路板；和
提供具有通光孔的一壳体，以在所述壳体和所述线路板之间形成所述暗腔。
优选地，在所述步骤(ii)中，还包括步骤：
间隔地设置一承载元件于所述壳体，其中所述承载元件形成所述图像采集区域。
优选地，所述壳体由穿透率接近于零的无机或有机材料制成。
优选地，在上述方法中，在所述壳体的内表面和/或外表面涂覆或贴附一层吸光或反光材料。
优选地，所述光源的光线类型选自紫外光、红外光和可见光组成的类型组。
优选地，在上述方法中，设定所述光学成像装置的成像物范围参数为F，设定所述光学成像装置的孔径参数为Φ，设定所述光学成像装置的像距参数为X，设定所述光学成像装置的物距参数为W；其中所述光学成像装置的成像物范围与所述光学成像装置的孔径、物距和像距的关系满足函数表达式：F＝Φ(W/X+1)。
优选地，在上述方法中，设定所述光学成像装置的物高参数为U，设定所述光学成像装置的像高参数为V；其中所述光学成像装置的像高与所述光学成像装置的物高、孔径、物距和像距的关系满足函数表达式：V＝[UX+Φ(W+X)]/W。
本发明还提供一种通过一光学成像装置的成像方法，其中所述方法包括如下步骤：
(1)通过一光源产生光线；
(2)所述光源产生的光线辐射至一图像采集区域；
(3)所述光源产生的光线被置放于所述图像采集区域的一物体的表面反射，从而产生被反射光线；
(4)所述被反射光线穿过一通光孔进入一暗腔；以及
(5)所述被反射光线在进入所述暗腔后被一图像传感器接收，从而生成与所述物体相关的图像。
优选地，所述光源产生的光线类型选自紫外光、红外光和可见光组成的类型组。
本发明还提供一种光学成像装置，其中所述光学成像装置包括一图像传感器，所述光学成像装置具有一图像采集区域、一暗腔以及一通光孔；其中所述图像传感器设置于所述暗腔，所述通光孔连通于所述暗腔与所述暗腔的外部环境，并且所述通光孔对应于所述图像传感器的感光面，所述图像采集区域位于所述图 像传感器的感光路径；
其中设定所述光学成像装置的成像物范围参数为F，设定所述光学成像装置的所述通光孔的孔径参数为Φ，设定所述光学成像装置的像距参数为X，设定所述光学成像装置的物距参数为W；其中所述光学成像装置的成像物范围与所述光学成像装置的孔径、物距和像距的关系满足函数表达式：F＝Φ(W/X+1)。
优选地，设定所述光学成像装置的物高参数为U，设定所述光学成像装置的像高参数为V；其中所述光学成像装置的像高与所述光学成像装置的物高、孔径、物距和像距的关系满足函数表达式：V＝[UX+Φ(W+X)]/W。
优选地，所述光学成像装置还包括一光源，所述光源位于所述暗腔的外部环境，其中当一物体置放于所述图像采集区域时，所述光源产生的光线在辐射至所述物体后被所述物体的表面反射，被所述物体的表面反射的光线穿过所述通光孔进入所述暗腔并进一步被所述图像传感器的感光面接收，从而所述光学成像装置采集物体的图像。
优选地，所述通光孔对应于所述图像传感器的感光面的中心位置。
附图说明
图1是本发明的一个优选实施例的一种光学成像系统的结构示意图。
图2是本发明的上述优选实施例的一种光学成像系统的结构的一种变形实施。
图3是本发明的一个优选实施例的一种光学成像系统的小孔光学成像的光路结构示意图。
图4是本发明的一个优选实施例的一种光学成像方法的流程图。
图5是本发明的一个优选实施例一种利用小孔成像原理制定光学成像系统的方法流程图。
图6是本发明的一个优选实施例的一种光学成像系统应用于指纹识别设备的成像方法流程图。
图7是本发明的一个优选实施例的一种光学成像系统应用于内窥镜的成像方法流程图。
图8是根据本发明的另一个优选实施例的光学成像装置的剖示示意图。
图9是根据本发明的再一个优选实施例的光学成像装置的剖示示意图。
图10是根据本发明的上述优选实施例的一个变形实施方式的剖示示意图。
图11是根据本发明的又一个优选实施例的光学成像装置的剖示示意图。
图12是根据本发明的上述优选实施例的一个变形实施方式的剖示示意图。
图13是根据本发明的光学成像装置的光路结构示意图。
图14是根据本发明的光学成像装置的设计流程示意图。
图15至图23分别是根据本发明的不同实施例的电子设备的示意图，其中所述电子设备包括所述光学成像装置。
图24是根据通过光学成像装置的成像方法的框图示意图。
具体实施方式
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例，本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。
在现代社会中，很多行业和领域都采用指纹识别设备采集人的指纹进行识别，在指纹采集比对过程中，指纹图像的读取(或指纹图像的采集)非常重要，这是由于指纹识别设备对指纹的清晰度等要求较高，所以指纹取像的准确性非常重要。
本发明提供的光学成像系统，主要是涉及利用小孔成像原理建立的超薄指纹识别及内窥镜等微型光学成像系统，包括一光学系统和一传感系统，其中所述光学系统包括一光学成像系统和一照明系统，将以上系统按照小孔成像原理进行组合后得到可供一处理终端判定的像即可，其可以作为指纹图像采集装置，安装于小型仪器设备中制作成指纹识别设备，给指纹识别设备终端提供准确的指纹图像，供其识别判定；也可以作为一种成像装置安装于内窥镜等其他医疗仪器设备中供临床使用，也可以安装于其他微型电子设备中。
如图1和图4所示，一种光学成像系统10，包括一成像装置11、一识别载体12、一光源13和一图像感应装置14，其中所述成像装置11位于所述识别载体12具有的一腔室120中，所述图像感应装置14包括一图像传感器141，其中所述图像传感器141位于所述成像装置11具有的一暗室110内部，且所述图像传感器141与所述通孔1111保持一适当间距，所述光源13安装于所述暗室110 外部。
进一步地，所述暗室110通过一暗室壳体111形成，其中所述暗室壳体111具有一通孔1111，所述暗室110通过所述通孔1111与所述腔室120相连通，所述识别载体12具有一物方识别区域121，所述物方识别区域121与所述暗室壳体111相间隔地设置，所述光源13发射光线射向所述物方识别区域121，所述物方识别区域121反射光线，根据小孔成像原理，光沿直线传播，所述物方识别区域121的识别对象得以通过所述通孔1111投影到所述图像传感器141，然后通过连接于所述图像传感器141的一终端设备进行判定。
优选地，所述暗室壳体111可以一体地形成，也可以通过几个侧壁相连接后形成所述暗室110。
值得一提的是，所述物方识别区域121和所述图像传感器141分别安装于所述小孔111的相对的两侧并和所述小孔111保持一间距，且与所述小孔111相对应，其组成了小孔成像系统，所有所述光源13构成所述照明系统，提供光源给所述物方识别区域121。
所述物方识别区域121和所述图像传感器141位于所述通孔1111相对的两侧，均与所述通孔1111保持一间距，其中所述间距大于零，分别作为物距和像距。
所述识别载体12的侧壁122与所述暗室壳体111之间具有间距，以形成所述腔室120，即所述腔室120包括所述物方识别区域121、所述侧壁122与所述暗室壳体111之间的所有区域。
所述图像感应装置14进一步包括一电路板142，其中所述电路板142电连接于所述传感器141，优选地，所述电路板142连接于所述暗室壳体111的底壁，另外，所述电路板142也可以作为所述暗室壳体111的底壁。
值得一提的是，所述暗室壳体111的制造材料为不透光材料，能够得以阻挡或者吸收光线，防止位于所述暗室壳体111外部的所述光源13发出的光线进入所述暗室110。此外，可以选用任意材料来制造所述暗室壳体111，只是在使用的时候，在其外部贴一层不透光的薄纸或者涂覆一层不透光的或能够吸光的材料，使其得以吸收或者阻挡光线。这样做的好处是，使得位于所述暗室110中的所述图像传感器141只接收通过所述物方识别区域121反射的光线，以保证采集图像的准确性。
进一步地，所述识别载体12的侧壁122和底壁123也可以通过相应的板材来密封，所述光源13则得以安装于所述侧壁122和/或所述底壁123的一个或多个位置，所述光源13也可以安装于所述暗室壳体111外部，以发射光线射向所述物方识别区域121。例如，在本优选实施例中，所述光源13安装于所述侧壁122和所述底壁123上。总之，所述光源13发出的光线只要能射向所述物方识别区域121，同时不会直接通过所述通孔111进入所述暗室110即可。
换句话说，所述光源13发射的光线不能进入所述暗室110，即使所述光源13发射的光线射向所述暗室110周围的壁，即所述暗室壳体111，也需要被所述暗室壳体111所阻挡或吸收，值得注意的是，安装所述光源13的时候，要注意避免其光线射入所述通孔1111，得以使所述通孔1111只能接收所述物方识别区域121反射的光线。
在本实施例中，所述电路板142可以选择FPC板(柔性电路板)。
进一步地，当所述暗室壳体111通过相应的板材来连接形成时，形成所述暗室壳体111的侧壁可以自由移动，得以调节所述暗室壳体111的通孔壁(即为设有所述通孔1111的壁)与所述图像传感器141之间的距离，使用者可以根据实际使用环境及成像要求来改变所述通孔1111与所述图像传感器141之间的距离，即相当于可以改变像距，使得像距可以自由调节，增加了所述成像装置的应用范围。
值得一提的是，所述物方识别区域121的面积大小根据实际使用情况来决定，即根据识别对象的大小来决定，且其应采用透明材料来制作。例如，当将其应用于指纹识别设备中时，可以由人体指纹所需感应识别的面积决定，进行指纹识别时，在其上放置指头以采集指纹，所以要求所述物方识别区域121的制作材料要有较高的透过率，因此可以选用透明的各类无机或有机材料来制作，其可以做到尽量薄，但要求其在厚度较薄的状态下仍然有一定的强度，以使其能够承受指纹识别时手指按压所施加的力。
所述暗室壳体111可以选用穿透率接近于零的无机或有机材料所制作的较薄的平板，即光线无法从所述暗室壳体111穿过，优选地，所述通孔1111所处的通孔壁的内壁的厚度不应超过所述通孔1111的孔径的二分之一。
所述光源13为可同时或单独发射紫外、红外、可见光等波段的光，其发光特性由系统所需达到的解像力和所述图像传感器141的类型决定；所述图像传感 器141为可感应紫外、红外、可见光等波段光的传感器，其尺寸类型由指纹感应面积及小孔成像系统的尺寸决定。
换句话说，所述暗室壳体111和所述图像感应装置14组成一小孔模组，所述小孔模组可以应用于小孔光学成像系统，其中所述暗室壳体111采用不透光材料制作，得以阻挡所述光源13发射的光线直接射向所述图像传感器141，进而得以阻止所述物方识别区域121反射的光线通过所述通孔1111以外的地方射向所述图像传感器141，进而使光线只通过所述通孔1111进入所述图像传感器141。
进一步地，当将所述光源13与所述小孔模组进行适当组合，则可形成一小孔成像模组，得以成像。具体地，将所述光源13设于所述小孔成像模组之外，使得其所发射的光线射向一物方，在本优选实施例中，所述物方为所述物方识别区域121，所述物方反射光线，通过小孔成像原理，反射光线则直接进入所述暗室110，进而投影到所述图像传感器141，通过连接终端设备，得以获得所述物方的像，例如本优选实施例中的指纹图像。
值得一提的是，所述光源13可以电连接于所述电路板142，进而通过所述电路板142来供电，此外，当本发明提供的光学成像系统应用于电子产品等设备中时，所述光源13可以使用设备自带的光源，也可以将所述光源13连接于设备中的供电系统。
图2为对图1所述的光学成像系统的一种变形实施，在本变形实施例中，所述光学成像系统10A包括一成像装置11A，一识别载体12A、一光源13A和一图像感应装置14A，其中所述成像装置11A具有一通孔1111A，设置所述通孔111A的壁成为通孔壁，其中所述图像感应装置14A包括一图像传感器141A和一电路板142A，安装于所述成像装置11A具有的一暗室110A中，其中所述暗室110通过一暗室壳体111A来形成，其中形成所述识别载体12A的侧壁122A可以作为所述暗室壳体111A的两侧壁，即所述成像装置11A和所述识别载体12A共用侧壁，所述成像装置12A具有的一腔室120A则位于所述成像装置12A包括的一物方识别区域12A与所述通孔壁之间的区域。
所述光源13A安装于所述暗室壳体111A具有的所述通孔壁上，得以使所述光源13A发射光线射向所述物方识别区域121A，所述物方识别区域121A反射光线，穿过所述通孔1111A，进入到所述暗室110A，将所述物方识别区域121A的图像投影到所述图像传感器141A，进而传递给一终端设备进行判定。
图3所示为根据本发明提供的光学成像系统的小孔光学成像的光路结构20的示意图，使用时，将识别对象放置于所述物方识别区域121，其中所述物方识别区域121反射光线，其中反射光线沿直线传播穿过所述通孔1111，传播到所述图像传感器141，将识别对象投影到所述图像传感器141上，再供仪器终端进行判定。
具体地说，如图3所示，根据上述的光学成像系统可知，所述物方识别区域121作为物方201，进行图像判定时，所述物方识别区域121作为感应面，以形成识别对象，将位于所述感应面的识别对象作为物高U，所述图像传感器141作为像方205，其中像高为V，所述通孔1111设于所述暗室壳体111的通孔壁上，位于所述物方201和所述像方205之间，且所述小孔的孔径为Φ。所述物方识别区域121到所述通孔壁的距离即为所述物方201(或感应面)到所述通孔1111的距离202，称为物距W，所述图像传感器141到所述通孔壁的距离即为所述像方205到所述通孔1111的距离204，称为像距X。
在工作过程中，由所述光源13发出的发射光线206射向所述物方识别区域121，所述物方识别区域121形成有识别对象，对光线进行反射，由于所述暗室壳体111的不透光性，所以经所述物方识别区域121反射的反射光线207只能通过所述通孔1111才能传播到所述图像传感器141，其它的反射光线则被所述通孔1111所处的所述暗室壳体111吸收或阻挡，也就是说，所述图像传感器141只能接收由所述物方201反射的穿过所述通孔1111的反射光线207，不能接收没有射向所述通孔1111的光线，即不能接收所述光源13直接发射的光线以及射向所述通孔1111之外的所述反射光线207，换句话说，除了直接通过所述通孔1111的所述反射光线207可以传播到所述图像传感器141外，其它的光线则不能传播到所述图像传感器141，即所述光源203射向所述成像装置11的光线，以及由所述物方201发射的射向所述通孔1111之外的反射光线均被所述暗室壳体111所吸收或遮挡。
如图5所示，根据本发明提供的光学成像系统，可以得出指纹识别光学成像系统的成像方法为：由所述光源13发射一束发射光线206，所述发射光线206射向所述物方识别区域121，所述物方识别区域121进行反射得到反射光线207，所述反射光线207通过所述通孔1111传播到所述图像传感器141，所述图像传感器141感应到所述反射光线207，所述物方识别区域121的指纹图像得以投影 到所述图像传感器141。本发明提供的光学成像系统仅为指纹识别设备中的取像系统，所以所述图像传感器141得以将得到的指纹图像传送给指纹识别设备终端进行相应的判定。
本发明利用小孔成像原理建立指纹识别及内窥镜等光学成像系统，结构简单，可以在保证较好解像力的前提下，减小整个指纹识别及内窥镜等光学成像系统的尺寸，便于将其置放于体积更小的仪器设备中。
在制定本发明提供的光学成像系统时，首先制定整个光学成像系统的总高，可以根据实际使用情况来制定光学成像系统的总高，也就是说，根据将光学成像系统所要嵌入的设备对于光学成像系统的大小来制定所需要的光学成像系统的总高，例如，对于电脑、手机、门禁等不同大小的指纹识别设备对于光学成像系统的需求不同，可以制定出适合不同设备的光学成像系统。
在其应用过程中，将光学成像系统设于手机或门禁中，使用的时候，将手指放置于所述物方识别区域121，所述物方识别区域121反射光线，其中所述反射光线进入到所述暗室110，将所述指纹图像投影到所述图像传感器141，供手机终端或门禁终端进行判定。
值得一提的是，当所述光学成像系统应用于手机等系统中时，可以将手机的背光系统作为光源，也可以与手机共用电路板，通过手机等其他指纹识别设备给所述光源和所述图像传感器供电，同时，只要将所述成像装置11按照距离手机屏一定的间距进行安装，换句话说，需要在手机屏或者按键位置设置一透明区域作为所述物方识别区域121，进而在所述成像装置11的所述通孔1111和所述物方识别区域之间预留出一定的间距，并且在该间距内不要放置任何能够阻挡所述物方识别区域121的反射光线进入所述通孔的部件，在本应用中，只需要将所述图像传感器141放置于手机中，且在所述图像传感器141周围设置一个所述暗室110，在形成所述暗室110的所述暗室壳体111上设置一个所述通孔1111，其中所述通孔111位于所述图像传感器141和所述物方识别区域121，根据手机大小等情况来设置所述通孔1111的孔径、所述物方识别区域121与所述通孔1111之间的距离、所述图像传感器141与所述通孔1111之间的距离即可，因此，在本应用中，不再需要所述识别载体12的侧壁122和底壁123，即可以将手机的其他部件作为所述识别载体12的侧壁122和底壁123。
此外，本发明的光学系统也可以均安装于指纹设别设备，例如，手机、电脑、 电视及门禁等，即将图1或图2中所述的包括成像装置11、识别载体12、光源13及图像感应装置作为一个整体安装于指纹识别设备来应用。
如图7所示，当将本发明提供的光学成像系统安装于内窥镜等医学器材时，将摄像平面作为物方识别区域121，将其可以识别到的图像通过本发明的成像装置11投影到所述图像传感器14，进而得以传递到内窥镜终端进行识别。通过将本发明提供的光学成像系统应用于内窥镜等医疗仪器中时，可以保证检验的准确性，同时可以缩小医疗设备的体积，增加其应用范围，也更加方便将镜头放入体内进行相应部位的检查。
本领域的技术人员可以根据本发明提供的小孔成像装置想到其他的实施和应用，均不脱离本发明。
其次，再定义出指纹识别光学成像系统所需要的感应面积，即确定出所述物高U，其中所述物高U的大小由人体指纹所需感应识别的面积决定，即所述感应面积U为所述指纹识别区域图像的面积，可以根据嵌入的不同设备的需求来定义。
值得一提的是，所述光学系统的总高包括图1所示的从所述物方识别区域121到所述识别载体12的底壁123的距离以及它们本身的厚度，这其中也包括图3所示的所述物距W和所述像距X，因此，可以根据小孔成像原理在所述光学成像系统的总高范围内定义出合适的所述物距W和所述像距X及相应公差。
在所述光学成像系统的总高确定后，并定义出合适的所述物距W和所述像距X，在保证光学成像系统有较好解像力的前提下，可以由F＝Φ(W/X+1)计算出所述孔径Φ，并确定所述孔径Φ的公差，即得出了所述通孔1111的大小，其中F表示屏幕上的点所对应的被成像物的范围，决定小孔光学成像系统的解像力，计算之前，可以根据需要的解像力F来计算孔径，即F是实际需要的解像力，作为已知数。
由公式F＝Φ(W/X+1)可以看出，在光学成像系统总高确定的情况下，可以调整物距W、像距X和孔径Φ来保证光学成像系统有较好的解像力，满足设备对解像力的需求。
当整个光学成像系统的总高、物高U、物距W、像距X和孔径Φ均确定后，由公式V＝[UX+Φ(W+X)]/W，可以计算出像高V，由于需要在所述图像传感器141上成像，所以，所述图像传感器141的尺寸大小可以根据成像高度V来选择， 即像高V决定了所述图像传感器141的尺寸大小。
在确定物高U、物距W、像距X、孔径Φ、像高V和传感器的尺寸后，选择合适像素值及像素点大小的传感器，最终选择出规格大小、像素值及像素点大小均合适的传感器作为光学成像系统的所述图像传感器141。
然后再选择合适发光波长及光强的光源13，安装于系统内部，使得光源13在满足系统所需亮度的同时，其发光特性也要达到系统所需的解像力要求，并符合所选择的图像传感器141的类型。
最后将该光学成像系统所得到的像输入到指纹识别系统终端中作判定分析，如果终端可以分析判定此指纹，则该光学成像系统合格，如果终端无法分析判定，则继续通过小孔成像原理重新定义物距W、像距X及孔径Φ，然后重新选择传感器和光源，直至成像符合要求为止。
综上，如图4所示，利用小孔成像原理制定本发明提供的所述光学成像系统的方法包括以下步骤：
(1)开始；
(2)制定整个光学成像系统的总高；
(3)定义指纹识别系统所需感应面积；
(4)由小孔成像原理定义出小孔的大小(或孔径)Φ、小孔到感应面的距离W以及小孔到传感器的距离X及相应公差；
(5)选择合适的传感器；
(6)选择满足系统所需的光源；
(7)检验所得指纹成像是否达到指纹识别系统可判定要求，如果达到判定要求，则执行第(8)步，如果达不到判定要求，则返回第(4)步分析失败原因，重新计算，直到合格再执行第(8)步；
(8)完成。
如图8所示是根据本发明的另一个优选实施例提供的光学成像装置，其中所述光学成像装置采用小孔成像原理采集物体的图像。
具体地说，所述光学成像装置包括一图像传感器30B、一壳体40B以及一承载元件50B，所述壳体40B具有一通光孔41B和一暗腔42B，所述通光孔41B连通于所述暗腔42B和所述壳体40B的外部环境，也就是说，所述壳体40B的外部环境的光线仅可以通过所述通光孔41B进入到所述暗腔42B的内部。所述 图像传感器30B被容纳于所述暗腔42B，并且所述通光孔41B对应于所述图像传感器30B的感光面。优选地，所述通光孔41B对应于所述图像传感器30B的感光面的中心位置。所述图像传感器30B的感光面和所述壳体40B的内表面没有接触，从而在所述壳体40B和所述图像传感器30B的感光面之间形成所述光学成像装置的像距。
相应地，所述承载元件50B间隔地设置于所述壳体40B，以使所述承载元件50B和所述壳体40B没有接触，从而在所述承载元件50B和所述壳体40B之间形成所述光学成像系统的物距。所述承载元件50B的侧部形成一图像采集区域51B，所述图像采集区域51B和所述壳体40B位于所述承载元件50B的不同侧，并且所述图像采集区域51B位于所述图像传感器30B的感光路径上，在使用所述光学成像装置采集物体的图像时，被采集图像的物体需要被放置于所述图像采集区域51B。
在使用所述光学成像装置采集被放置于所述图像采集区域51B的物体的图像时，被物体反射的光线会依次穿过所述承载元件50B和所述壳体40B的所述通光孔41B，并进入到所述暗腔42B内，在后续被物体反射的光线会被所述图像传感器30B的感光面接收并进行光电转化，从而生成与被采集图像的物体相关的电信号。
本领域的技术人员可以理解，所述暗腔42B是一个黑暗的腔体，并且所述暗腔42B仅通过所述通光孔41B与所述壳体40B的外部环境相连通。也就是说，所述壳体40B的外部环境的光线仅通过所述通光孔41B进入所述暗腔42B内，以被所述图像传感器30B的感光面接收，从而，使得通过所述通光孔41B进入所述暗腔42B的光线不会被干扰，从而，保证所述光学成像装置的成像品质。
进一步地，所述光学成像装置还可以包括一光源13B，所述光源13B邻近地设置于所述壳体40B，并且所述光源13B和所述壳体40B位于所述承载元件50B的同侧。在利用所述光学成像装置采集物体的图像时，所述光源13B产生的光线能够透过所述承载元件50B直接辐射至被放置于所述图像采集区域51B的物体的表面，然后被物体的表面反射，从而被物体反射的光线在穿过所述承载元件50B和所述壳体40B的所述通光孔41B之后进入到所述暗腔42B内，并进一步被所述图像传感器30B的感光面接收。
值得一提的是，所述光源13B产生的光线不会直接穿过所述壳体40B以及 所述通光孔41B进入到所述暗腔42B内，通过这样的方式，可以保证被物体反射的光线在经过所述通光孔41B进入到所述暗腔42B内时不会被干扰，从而保证利用所述光学成像装置在采集物体的图像时的可靠性。
优选地，在本发明的一个较佳实施方式中，所述壳体40B可以由穿透率接近于零的无机或者有机材料制成。在本发明的另一个较佳实施方式中，所述壳体40B可以由任何材料制成，然后在所述壳体40B的外表面和/或内表面涂覆或贴附一层反光材料或吸光材料。通过上述的方式，所述壳体40B能够阻止所述光源13B产生的光线穿透所述壳体40B而干扰所述暗腔42B内的光线。
另外，在本发明的一个较佳的实施方式中，所述光源13B的位置低于所述壳体40B的设有所述通光孔41B的一侧所在的平面，通过这样的方式，所述光源13B产生的光线不会直接通过所述通光孔41B而进入到所述暗腔42B。在本发明的另一个较佳的实施方式中，所述光源13B也可以具有良好的光向性，从而所述光源13B产生的光线能够较为集中地辐射至所述图像采集区域51B，而不会发生扩散，从而所述光源13B产生的光线不会直接通过所述通光孔41B进入到所述暗腔42B。
换言之，在本发明的所述光学成像装置中，能够通过所述通光孔41B进入到所述暗腔42B内的光线是被物体反射的光线，从而提高所述光学成像装置的成像品质。
进一步地，所述光源13B可以包括至少一发光元件，从而在本发明的一个较佳的实施方式中，所述光源13B的每所述发光元件可以沿着所述壳体40B的外表面间隔地设置；在本发明的另一个较佳的实施方式中，所述光源13B的每所述发光元件可以沿着所述壳体40B的外表面环绕地设置，从而使所述光源13B产生的光线能够更加均匀地辐射至所述图像采集区域51B。
更进一步地，所述光源13B的每所述发光元件可以单独地或者同时产生紫外光、红外光、可见光等光线。所述光源13B的每所述发光元件的发光特征由所述光学成像装置所需要达到的解像力和所述图像传感器30B的类型决定，例如所述图像传感器30B可以感应到紫外光、红外光、可见光等光线。另外，所述图像传感器30B的尺寸由所述图像采集区域51B的尺寸和所述通光孔41B的孔径决定。
进一步地，所述图像采集区域51B的尺寸根据所述光学成像装置的实际使 用情况来决定，即所述图像采集区域51B的尺寸可以根据被采集图像的物体的尺寸决定，并且在所述图像采集区域51B的尺寸确定之后，所述承载元件50B的尺寸也随之确定。本领域的技术人员应当理解，所述承载元件50B的尺寸大于或者等于所述图像采集区域51B的尺寸，并且所述承载元件50B由透明材料制成。例如，当所述光学成像装置被实施为一生物特征采集装置，并且用于采集指纹的图像时，所述光学成像装置的所述图像采集区域51B的尺寸由指端的尺寸决定。所述承载元件50B可以选择透过率较高的无机或有机材料制成，并且所述承载元件50B在保证强度的基础上，其厚度可以被做的很薄，以使得所述承载元件50B能够承受被采集图像的物体施加于所述承载元件50B的力。
另外，所述光学成像装置还可以包括一线路板60B，所述图像传感器30B电连接于所述线路板60B，所述线路板60B供将所述图像传感器30B的感光面转化的与被采集物体图像的物体相关的电信号传输出去，从而在后续形成被采集图像的物体的图像。优选地，在本发明的一个较佳的实施方式中，所述图像传感器30B贴装于所述线路板60B，所述线路板60B贴装于所述壳体40B。在本发明的另一个较佳实施例中，所述图像传感器30B和所述线路板60B分别贴装于所述壳体40B的不同侧，从而所述图像传感器30B在工作时产生的热量不会导致所述线路板60B变形，以确保所述图像传感器30B的平整性。在本发明的所述光学成像装置中，所述线路板60B的类型可以不受限制，例如所述线路板60B可以是FPC线路板(可挠性印刷线路板)，这样，使得所述线路板60B的厚度更薄，以显著地降低所述光学成像装置的厚度。
如图9所示是根据本发明的另一优选实施例提供的光学成像装置。具体地说，所述光学成像装置包括一图像传感器30C、一壳体40C、一承载元件50C以及一基板70C，所述壳体40C具有一通光孔41C。所述壳体40C设置于所述基板70C，以在所述壳体40C和所述基板70C之间形成一暗腔42C，所述通光孔41C连通于所述暗腔42C和所述壳体40C的外部环境，也就是说，所述壳体40C的外部环境的光线仅可以通过所述通光孔41C进入到所述暗腔42C的内部。所述图像传感器30C被容纳于所述暗腔42C，并且所述通光孔41C对应于所述图像传感器30C的感光面。优选地，所述通光孔41C对应于所述图像传感器30C的感光面的中心位置。所述图像传感器30C的感光面和所述壳体40C的内表面没有接触，从而在所述壳体40C和所述图像传感器30C的感光面之间形成所述 光学成像装置的像距。
所述承载元件50C间隔地设置于所述壳体40C，以使所述承载元件50C和所述壳体40C没有接触，从而在所述承载元件50C和所述壳体40C之间形成所述光学成像装置的物距。所述承载元件50C的侧部形成一图像采集区域51C，所述图像采集区域51C和所述壳体40C位于所述承载元件50C的不同侧，并且所述图像采集区域51C位于所述图像传感器30C的感光路径上。
与上述优选实施例提供的所述光学成像装置不同，在本发明的这个优选的实施例提供的所述光学成像装置中，所述壳体40C进一步包括一上壳部43C和至少一侧壳部44C，其中每所述侧壳部44C分别弯曲地从所述上壳部43C的边缘延伸至所述基板70C，从而在所述上壳部43C、每所述侧壳部44C和所述基板70C之间形成所述暗腔42C，所述通光孔41C设于所述上壳部43C。优选地，所述图像传感器30C的感光面所在的平面、所述上壳部43C所在的平面和所述承载元件50C所在的平面相互平行，通过这样的方式，在利用所述光学成像装置采集物体的图像时，使得物体的各个位置都能够均匀地成像。
值得一提的是，所述上壳部43C和每所述侧壳部44C可以一个板材一体地形成，也可以将多个板材拼接形成，本发明在这方面不受限制。
进一步地，所述光学成像装置还可以包括一光源13C，所述光源13C邻近地设置于所述壳体40C，并且所述光源13C和所述壳体40C位于所述承载元件50C的同侧。在利用所述光学成像装置采集物体的图像时，所述光源13C产生的光线能够透过所述承载元件50C直接辐射至被放置于所述图像采集区域51C的物体的表面，然后被物体的表面反射，从而被物体反射的光线在穿过所述承载元件50C和所述壳体40C的所述通光孔41C之后进入到所述暗腔42C内，并进一步被所述图像传感器30C的感光面接收并进行光电转化，以生成与被采集图像的物体相关的电信号。
优选地，所述光源13C可以被设置于所述基板70C上，通过这样的方式，所述光源13C的位置会低于所述壳体40C的所述上壳部43C所在的平面，从而使得所述光源13C产生的光线不会通过设于所述上壳部43C的所述通光孔41C直接进入所述暗腔42C内，以确保所述光学成像装置在被使用时的可靠性。
另外，所述光学成像装置还可以包括一线路板60C，所述图像传感器30C电连接于所述线路板60C，所述线路板60C供将所述图像传感器30C的感光面转 化的与被采集图像的物体相关的电信号传输出去，从而在后续形成被采集图像的物体的图像。
优选地，在本发明的一个较佳的实施方式中，所述图像传感器30C贴装于所述线路板60C，所述线路板60C贴装于所述基板70C。
在本发明的另一个较佳的实施方式中，所述图像传感器30C贴装于所述线路板60C，所述基板70C具有一接受腔71C，所述线路板60C设置于所述接受腔71C内，通过这样的方式，可以显著地减少所述光学成像装置的高度，从而使得所述光学成像装置的更薄。
在本发明的再一个较佳的实施方式中，所述线路板60C和所述图像传感器30C还可以分别贴装于所述基板70C的不同侧，这样，所述图像传感器30C在工作时产生的热量不会使所述线路板60C产生形变，从而不会影响所述图像传感器30C的平整度。
本领域的技术人员可以理解的是，所述基板70C可以由导热和散热性能较好的材料制成，例如不锈钢材料，这样，所述基板70C不仅能够保证所述图像传感器30C的平整度，而且还能够使所述光学成像装置快速地散热，从而确保所述光学成像装置在工作时的稳定性。
进一步地，所述光学成像装置还可以包括一支撑元件80C，其中所述支撑元件80C设置于所述基板70C，所述承载元件50C设置于所述支撑元件80C，以使所述承载元件50C能够被所述承载元件80C支撑。优选地，所述支撑元件80C由透过率低的材料制成，以避免所述光学成像装置外部的光线对所述光源13C产生的光线产生干扰，从而确保所述光线成像装置在采集物体的图像时的精度。
在本发明的另一个较佳的实施方式中，所述支撑元件80C的高度还可以被调节，也就是说，通过调整所述支撑元件80C，可以改变所述承载元件50C和所述壳体40C的上壳部43C之间的距离，从而改变所述光学成像装置的物距，以此，来使所述光学成像装置满足不同的使用需求。
如图10所示是根据本发明的上述优选实施例的一个变形实施方式提供的光学成像装置。具体地说，所述光学成像装置包括一图像传感器30D、一壳体40D、一承载元件50D以及一线路板60D，所述壳体40D具有一通光孔41D。所述图像传感器30D和所述壳体40D分别贴装于所述线路板60D，以在所述壳体40D和所述线路板60D之间形成一暗腔42D，所述通光孔41D连通于所述暗腔42D 与所述壳体40D的外部环境，也就是说，所述壳体40D的外部环境的光线仅可以通过所述通光孔41D进入到所述暗腔42D的内部。所述图像传感器30D被容纳于所述暗腔42D，并且所述通光孔41D对应于所述图像传感器30D的感光面。优选地，所述通光孔41D对应于所述图像传感器30D的感光面的中心位置。所述图像传感器30D的感光面和所述壳体40D的内表面没有接触，从而在所述壳体40D和所述图像传感器30D的感光面之间形成所述光学成像装置的像距。
所述承载元件50D间隔地设置于所述壳体40D，以使所述承载元件50D和所述壳体40D没有接触，从而在所述承载元件50D和所述壳体40D之间形成所述光学成像装置的物距。所述承载元件50D的侧部形成一图像采集区域51D，所述图像采集区域51D和所述壳体40D位于所述承载元件50D的不同侧，所述图像采集区域51D位于所述图像传感器30D的感光路径上。
所述壳体40D进一步包括一上壳部43D和至少一侧壳部44D，其中每所述侧壳部44D分别弯曲地从所述上壳部43D的边缘延伸至所述线路板60D，从而在所述上壳部43D、每所述侧壳部44D和所述线路板60D之间形成所述暗腔42D，所述通光孔41D设于所述上壳部43D。优选地，所述上壳部43D所在的平面平行于所述承载元件50D所在的平面，通过这样的方式，在利用所述光学成像装置采集物体的图像时，使得物体的各个位置都能够均匀地成像。
进一步地，所述光学成像装置还可以包括一光源13D，所述光源13D邻近地设置于所述壳体40D，并且所述光源13D和所述壳体40D位于所述承载元件50D的同侧。在利用所述光学成像装置采集物体的图像时，所述光源13D产生的光线能够透过所述承载元件50D直接辐射至被放置于所述图像采集区域51D的物体的表面，然后被物体的表面反射，从而被物体反射的光线在穿过所述承载元件50D和所述壳体40D的所述通光孔41D之后进入到所述暗腔42D内，并进一步被所述图像传感器30D的感光面接收并进行光电转化，以生成与被采集图像的物体相关的电信号。
优选地，所述光源13D可以被设置于所述线路板60D上，通过这样的方式，所述光源13D的位置会低于所述壳体40D的所述上壳部43D所在的平面，从而使得所述光源13D产生的光线不会通过设于所述上壳部43D的所述通光孔41D直接进入所述暗腔42D内，以确保所述光学成像装置在被使用时的可靠性。另外，所述光源13D和所述图像传感器30D还可以共用所述线路板60D的电路， 从而使得所述光学成像装置的一致性更好。
更优选地，所述线路板60D是PCB线路板，以使所述线路板60D具有一定的硬度，并且所述线路板60D在较高的温度下不会产生形变，从而能够保证被贴装于所述线路板60D的所述图像传感器30D的平整性。
进一步地，所述光学成像装置还可以包括一支撑元件80D，其中所述支撑元件80D设置于所述线路板60D，所述承载元件50D设置于所述支撑元件80D，以使得所述承载元件50D被所述支撑元件80D支撑。优选地，所述支撑元件80D由透过率低的材料制成，以避免所述光学成像装置外部的光线对所述光源13D产生的光线产生干扰，从而确保所述光线成像装置在采集物体的图像时的精度。
如图11所示是根据本发明的再一优选实施例提供的光学成像装置。具体地说，所述光学成像装置包括一图像传感器30E、一壳体40E、一承载元件50E、一基板70E和一支撑元件80E。所述壳体40E具有一通光孔41E，所述图像传感器30E和所述支撑元件80E分别设置于所述基板70E，所述壳体40E包括一上壳部43E，所述上壳部43E的四周分别延伸至所述支撑元件80E，从而在所述壳体40E的所述上壳部43E与所述基板70E之间形成一暗腔42E，所述通光孔41E设于所述上壳部43E，并且所述通光孔41E连通于所述暗腔42E与所述壳体40E的外部环境，也就是说，所述壳体40E的外部环境的光线仅可以通过所述通光孔41E进入到所述暗腔42E的内部。所述图像传感器30E被容纳于所述暗腔42E内，并且所述通光孔41E对应于所述图像传感器30E的感光面。优选地，所述通光孔41E对应于所述图像传感器30E的感光面的中心位置。所述图像传感器30E的感光面和所述壳体40E的所述上壳部43E没有接触，从而在所述壳体40E的所述上壳部43E和所述图像传感器30E的感光面之间形成所述光学成像装置的像距。
值得一提的是，在本发明的一个较佳的实施方式中，所述壳体40E和支撑元件80E还可以一体地形成，从而在所述壳体40E的两侧分别形成所述光学成像装置的像距和物距。
所述承载元件50E被所述支撑元件80E支撑，并且所述承载元件50E和所述壳体40E的所述上壳部43E没有接触，从而在所述承载元件50E和所述壳体40E的所述上壳部43E之间形成所述光学成像装置的物距。所述承载元件50E的侧部形成一图像采集区域51E，所述图像采集区域51E和所述壳体40E位于所 述承载元件50E的不同侧，并且所述图像采集区域51E位于所述图像传感器30E的感光路径上。
优选地，所述图像传感器30E的感光面所在的平面、所述上壳部43E所在的平面和所述承载元件50E所在的平面相互平行，通过这样的方式，在利用所述光学成像装置采集物体的图像时，使得物体的各个位置都能够均匀地成像。
进一步地，所述光学成像装置还可以包括一光源13E，所述光源13E设置于所述壳体40E的所述上壳部43E。在利用所述光学成像装置采集物体的图像时，所述光源13E产生的光线能够透过所述承载元件50E直接辐射至被放置于所述图像采集区域51E的物体的表面，然后被物体的表面反射，从而被物体反射的光线在穿过所述承载元件50E和所述壳体40的通光孔41E之后进入到所述暗腔42E内，并进一步被所述图像传感器30E的感光面接收并进行光电转化，以生成与被采集图像的物体相关的电信号。
另外，所述光学成像装置还可以包括一线路板60E，所述图像传感器30E电连接于所述线路板60E，所述线路板60E供将所述图像传感器30E的感光面转化的与被采集图像的物体相关的电信号传输出去，从而在后续形成被采集图像的物体的图像。优选地，在本发明的一个较佳的实施方式中，所述图像传感器30E贴装于所述线路板60E，所述线路板60E贴装于所述基板70E。在本发明的另一个较佳的实施方式中，所述图像传感器30E贴装于所述线路板60E，所述基板70E具有一接受腔71E，所述线路板60E设置于所述接受腔71E内，通过这样的方式，可以显著地减少所述光学成像装置的高度，从而使得所述光学成像装置的更薄。
在本发明的再一个较佳的实施方式中，所述线路板60E和所述图像传感器30E还可以分别贴装于所述基板70E的不同侧，这样，所述图像传感器30E在工作时产生的热量不会使所述线路板60E产生形变，从而不会影响所述图像传感器30E的平整度。
本领域的技术人员可以理解的是，所述基板70E可以由导热和散热性能较好的材料制成，例如不锈钢材料，这样，所述基板70E不仅能够保证所述图像传感器30E的平整度，而且还能够使所述光学成像装置快速地散热，从而确保所述光学成像装置在工作时的稳定性。
如图12所示是根据本发明的上述优选实施例的一个变形实施方式提供的光 学成像装置。具体地说，所述光学成像装置包括一图像传感器30F、一壳体40F、一承载元件50F、一线路板60F和一支撑元件80F。所述壳体40F具有一通光孔41F，所述图像传感器30F和所述支撑元件80F分别设置于所述线路板60F，所述壳体40F包括一上壳部43F，所述上壳部43F的四周分别延伸至所述支撑元件80F，从而在所述壳体40F的所述上壳部43F与所述线路板60F之间形成一暗腔42F，所述通光孔41F设于所述上壳部43F，并且所述通光孔41F连通于所述暗腔42F与所述壳体40F的外部环境，也就是说，所述壳体40F的外部环境的光线仅可以通过所述通光孔41F进入到所述暗腔42F的内部。所述图像传感器30F被容纳于所述暗腔42F内，并且所述通光孔41F对应于所述图像传感器30F的感光面。优选地，所述通光控41F对应于所述图像传感器30F的感光面的中心位置。所述图像传感器30F的感光面和所述壳体40F的所述上壳部43F没有接触，从而在所述壳体40F的所述上壳部43F和所述图像传感器30F的感光面之间形成所述光学成像装置的像距。
所述承载元件50F被所述支撑元件80F支撑，并且所述承载元件50F和所述壳体40F的所述上壳部43F没有接触，从而在所述承载元件50F和所述壳体40F的所述上壳部43F之间形成所述光学成像装置的物距。所述承载元件50F的侧部形成一图像采集区域51F，所述图像采集区域51F位于所述图像传感器30F的感光路径上。
优选地，所述图像传感器30F的感光面所在的平面、所述上壳部43F所在的平面和所述承载元件50F所在的平面相互平行，通过这样的方式，在利用所述光学成像装置采集物体的图像时，使得物体的各个位置都能够均匀地成像。
进一步地，所述光学成像装置还可以包括一光源13F，所述光源13F设置于所述壳体40F的所述上壳部43F。在利用所述光学成像装置采集物体的图像时，所述光源13F产生的光线能够透过所述承载元件50F直接辐射至被放置于所述图像采集区域51F的物体的表面，然后被物体的表面反射，从而被物体反射的光线在穿过所述承载元件50F和所述壳体40F的所述通光孔41F之后进入到所述暗腔42F内，并进一步被所述图像传感器30F的感光面接收并进行光电转化，以生成与被采集图像的物体相关的电信号。
在利用所述光学成像装置采集物体图像的过程中，需要将被采集图像的物体置放于所述图像采集区域51F，所述光源13F发出的光线会穿过所述承载元件 50F并照射至物体的表面，此时，物体的表面会反射光线，并使光线再次穿过所述承载元件50F和所述通光孔41F，以进入到所述暗腔42F内，从而被设置于所述暗腔42F内的所述图像传感器30F的感光面接收并进行后续的光电转化，然后与物体相关的电信号进一步藉由所述线路板60F传输出去。
在这个过程中，所述光源13F产生的光线不会穿过所述壳体40F而直接进入到所述暗腔42F内，从而被物体的表面反射并通过所述通光孔41F进入到所述暗腔42F内的光线不会被干扰，从而确保所述光学成像装置采集的图像的品质。
如图13和图14所示，本发明还提供了所述光学成像装置的设计方法。在确定所述光学成像装置的实际应用环境时，所述光学成像装置的被成像物的范围参数F的值随之确定。
另外，在本发明中，设定所述光学成像装置的物高参数为U，并且所述光学成像装置的物高U小于或者等于所述图像采集区域51C的高度；；设定所述光学成像装置的像高参数为V，并且所述光学成像装置的像高V小于或者等于所述图像传感器30C的高度；所述通光孔41C的直径为孔径，并设定所述光学成像装置的孔径参数为Φ；所述壳体40C的所述上壳部43C与所述图像传感器30C的感光面之间的距离为像距，并设定所述光学成像装置的像距参数为X；所述壳体40C的所述上壳部43C与所述承载元件50C之间的距离为物距，并设定所述光学成像装置的物距参数为W。
图14示出了本发明的所述光学成像装置的设计过程1400。阶段1410：根据所述光学成像装置的具体使用环境，确定所述光学成像装置的高度。值得一提的是，所述光学成像装置的高度包括所述壳体40C的所述上壳部43C与所述图像传感器30C的感光面之间的距离、所述壳体40C的所述上壳部43C与所述承载元件50C之间的距离以及这些元件的本身的厚度和公差，也就是说，所述光学成像装置的高度至少包括所述光学成像装置的像距X和物距Y。
阶段1420：在所述光学成像装置的高度被确定之后，定义所述光学成像装置的物高U，这样，所述图像采集区域51C的尺寸也随着确定，即所述图像采集区域51C的尺寸大于或者等于所述光学成像装置的物高U。例如，当所述光学成像装置被实施为用于采集指纹的所述生物特征采集装置时，所述图像采集区域51C的面积与指端的面积匹配。
阶段1430：根据所述光学成像装置的高度确定所述光学成像装置的像距X 和物距W，其中所述光学成像装置的成像物范围F与所述光学成像装置的孔径Φ、像距X和物距W的关系满足函数表达式：F＝Φ(W/X+1)，在保证所述光学成像装置的解像力的基础上，可以计算出所述光学成像装置的孔径Φ的值。优选地，根据光线的直线传播原理，并且保证所述光学成像装置的成像品质，所述通光孔41C的孔径大于或者等于两倍的所述上壳部43C的厚度。
本领域的技术人员应当理解，根据函数表达式F＝Φ(W/X+1)，在所述光学成像装置的高度确定的情况下，可以通过调整所述光学成像装置的像距、物距和孔径，来保证所述光学成像装置的成像物范围，并进一步确保所述光学成像装置具有较好的解像力。例如，在所述光学成像装置的孔径确定的情况下，所述光学成像装置的像距越大，则所述光学成像装置的成像物范围越小，反之则所述光学成像装置的成像物范围越大；在所述光学成像装置的物距和像距确定的情况下，所述光学成像装置的孔径越大，则所述光学成像装置的成像物范围越大，反之则所述光学成像物的范围越小。
进一步地，所述光学成像装置的像高V与所述光学成像装置的物高U、像距X、物距W和孔径Φ的关系满足函数表达式：V＝[UX+Φ(W+X)]/W，从而，通过计算可以得到所述光学成像装置的像高V的值。也就是说，在所述光学成像装置的物高、物距、像距和孔径确定之后，可以计算出所述光学成像装置的像高，通过这样的方式，所述图像传感器30C的尺寸可以根据计算得到的所述光学成像装置的像高V的值来选择，从而，所述光学成像装置的像高V决定了所述图像传感器30C的尺寸。
阶段1440：在确定了所述光学成像装置的物高、像高、物距、像距和孔径以及所述图像传感器30C的尺寸之后，选择具有合适像素值以及像素点尺寸的所述图像传感器30C，来匹配所述光学成像装置，从而提高所述光学成像装置的成像品质。
阶段1450：选择具有合适光波长度以及光强的发光体作为本发明的所述光学成像装置的所述光源13C。值得一提的是，所述光源13C在满足所述光学成像装置所需亮度的同时，所述光源13C的发光特性也要达到所述光学成像装置的解像力要求，并且所述光源13C的发光特性与所述图像传感器30C的类型匹配。
阶段1460：对设计完成的所述光学成像装置进行测试，以判断所述光学成像装置的成像效果是否满足成像需要，若所述光学成像装置的成像效果满足成像 需要，则表明所述光学成像装置的设计完成，若所述光学成像装置的成像效果不能够满足成像需要，则根据函数表达式V＝[UX+Φ(W+X)]/W重新调整所述光学成像装置的相关参数，直至所述光学成像装置的成像效果满足成像需要为止。
进一步地，本发明还提供一种光学成像装置的设计方法，其中所述设计方法包括如下步骤：
(h)根据所述光学成像装置的使用环境，分别确定所述光学成像装置的高度和成像物范围；
(i)定义所述光学成像装置的物高；
(j)根据所述光学成像装置的高度、成像物范围和物高，计算所述光学成像装置的物距、像距、孔径以及像高；以及
(k)配置满足所述光学成像装置所需的一光源13C。
优选地，在所述步骤(j)中，进一步包括步骤：
步骤(j.1)根据所述光学成像装置的像高，配置满足所述光学成像装置所需的一图像传感器30C；和
步骤(j.2)根据所述光学成像装置的解像力，选择满足所述光学成像装置所需的具有合适的像素数量和像素尺寸的所述图像传感器30C。
优选地，在所述步骤(k)之后，还包括步骤：
(l)检测所述光学成像装置的成像品质是否满足使用需要，若满足则所述光学成像装置的设计完成，若不满足则重复执行所述步骤(j)。
优选地，在上述方法中，设定所述光学成像装置的成像物范围参数为F，设定所述光学成像装置的孔径参数为Φ，设定所述光学成像装置的像距参数为X，设定所述光学成像装置的物距参数为W；其中所述光学成像装置的成像物范围与所述光学成像装置的孔径、物距和像距的关系满足函数表达式：F＝Φ(W/X+1)。
优选地，在上述方法中，设定所述光学成像装置的物高参数为U，设定所述光学成像装置的像高参数为V；其中所述光学成像装置的像高与所述光学成像装置的物高、孔径、物距和像距的关系满足函数表达式：V＝[UX+Φ(W+X)]/W。
本发明还提供一种光学成像装置的形成方法，其中所述形成方法包括如下步骤：
(i)将一图像传感器30C置入一暗腔42C，其中所述暗腔42C通过一通光孔41C连通于所述暗腔42C的外部环境，并且所述通光孔41C对应于所述图像 传感器30C的感光面；
(ii)形成一图像采集区域51C于所述图像传感器30C的感光路径，其中所述图像采集区域51C位于所述通光孔41C的上方，并且所述图像采集区域供放置被采集图像的物体；以及
(iii)设置一光源13C于所述暗腔42C的外部环境，其中所述光源13C产生的光线在辐射至所述图像采集区域51C之后，被放置于所述图像采集区域51C的物体反射，被反射的光线穿过所述通光孔51C进入到所述暗腔52C，以被所述图像传感器30C的感光面接收。
优选地，在上述方法中，所述通光孔41C对应于所述图像传感器30C的感光面的中心位置。
优选地，在所述步骤(i)中还包括步骤：
(i.1)将所述图像传感器30C设置于一基板70C；以及
(i.2)提供具有所述通光孔41C的一壳体40C，以在所述壳体40C和所述基板70C之间形成所述暗腔42C，并使所述图像传感器30C位于所述暗腔42C内。
优选地，在所述步骤(ii)中还包括步骤：
在所述壳体40C的上部设置一承载元件50C，所述承载元件50C形成所述图像采集区域51C。
值得一提的是，本发明还提供一种电子设备90，其中所述电子设备90包括光学成像装置，在本发明的不同的实施例中，所述光学成像装置可以辅助所述电子设备实现不同的功能。
如图15所示是根据本发明的第一个优选实施例提供的电子设备90J，其中所述电子设备90J可以是一生物特征采集装置，例如指纹采集器等。所述电子设备90J用于辅助采集使用者的诸如指纹、掌纹或者脚纹等在内的生物特征。
具体地说，所述电子设备90J可以包括一连接装置91J和所述光学成像装置100J，所述光学成像装置100J可通信地连接于所述连接装置91J，所述连接装置91J适于可通讯地连接于一电器，例如电脑等。在使用时，使用者可以将指端等需要被采集图像的位置放置在所述光学成像装置100J的所述图像采集区域51，此时，所述光源13产生的光线辐射至指端的表面，指端的表面将光线反射，被指端的表面反射的光线在穿过所述通光孔41之后进入到所述暗腔42内，以被所 述图像传感器30的感光面接收并进行光电转化，以生成与指端相关的电信号，电信号藉由所述连接装置91J传输至所述电器，从而可以生成与指端相关的图像。
在本发明的一个较佳的实施方式中，所述连接装置91J可以被实施为一个USB连接件，在使用所述电子设备90J时，可以通过所述连接装置91J插入所述电器的连接口的方式，将所述电子设备90J连接至所述电器，从而所述电子设备90可以将采集的使用者的生物特征传输至所述电器。
在本发明的另一个较佳的实施方式中，所述连接装置90J还可以被实施为一个通讯模块，例如蓝牙模块、Wi-Fi模块等，在使用所述电子设备时，可以通过所述连接装置91J与所述电器的通讯模块无线地连接，从而所述电子设备90J可以将采集的使用者的生物特征传输至所述电器。
如图16和图17所示是根据本发明的第二个优选实施例提供的电子设备90K，其中所述电子设备90K可以是一移动电子设备，例如手机、平板电脑、笔记本电脑、电纸书或者个人数字助理等可以被移动使用的便携式移动电子设备。所述光学成像装置100K可以采集使用者的生物特征例如指纹特征，以辅助所述电子设备90K实现对使用者的身份识别。
具体地说，所述电子设备90K包括一设备本体92K和所述光学成像装置100K，其中所述光学成像装置100K可通讯地连接于所述设备本体92K。在使用所述电子设备90K之前，所述光学成像装置100K可以采集使用者的生物特征例如指纹特征，并将其传输至所述设备本体92K，后续，所述设备本体92K将被采集的图像与预存于所述设备本体92K的图像进行比对，若匹配成功，则所述设备本体92K认为该使用者为合法使用者，若匹配失败，则所述设备本体92K认为该使用者为非法使用者。
本领域的技术人员可以理解的是，相对于现有技术的光学成像系统来说，本发明的所述光学成像装置100K因为不需要棱镜、透镜等光学元件，从而使得所述光学成像装置100K的厚度更薄，进而使得所述光学成像装置100K能够适用于追求轻薄化、小型化的所述电子设备90K。
本领域的技术人员可以理解的是，所述光学成像装置100K可以被配置于所述设备本体92K的不同位置，以使所述电子设备90K的使用方式不同。
在如图16所示的这个示例中，所述设备本体92K包括一按钮921K，例如 所述按钮921K可以是所述电子设备90K的主按钮(例如Home按钮)或者开关机按钮，所述光学成像装置100K被对应地设置于所述按钮921K，此时所述按钮921K会形成所述光学成像装置100K的所述承载元件50，从而在所述按钮921K的上部形成所述图像采集区域51，从而，当使用者通过所述按钮921K操作所述电子设备90K时，所述光学成像装置100K会同步地采集使用者的指纹特征，以用于后续对使用者的身份识别。
在如图17所示的这个示例中，所述设备本体92K包括一显示屏幕922K，所述光学成像装置100K被对应地设置于所述显示屏幕922K，此时所述显示屏幕922K会形成所述光学成像装置100K的所述承载元件50K，从而在所述显示屏幕922K上形成所述图像采集区域51；相应地，所述显示屏幕922K还会形成所述光学成像装置100K的所述光源13，从而，当所述显示屏幕922K产生光线，且使用者将指端放置在所述图像采集区域51时，所述光学成像装置100K会采集使用者的指纹特征，以用于后续的身份识别。
如图18至图20所示是根据本发明的第三个优选实施例提供的电子设备90L，其中所述电子设备90L可以被应用于一门禁系统或者保险柜安全锁。所述光学成像装置100L可以采集使用者的生物特字例如指纹特征，以辅助所述电子设备90L对使用者的身份识别。
具体地说，所述电子设备90L包括一设备本体92L和所述光学成像装置100L，所述设备本体92L进一步包括一处理器923L和一锁体924L，所述光学成像装置100L可通讯地连接于所述处理器923L，所述处理器923L可操作地连接于所述锁体924L，所述锁体924L用于控制安装有所述门禁系统的大门或者安装有所述保险柜安全锁的柜门状态。
在所述电子设备90L的使用过程中，所述光学成像装置100L采集使用者的生物特征例如指纹特征，并将其传输至所述处理器923L进行比对，若匹配成功，则所述处理器923L操作所述锁体924L开启，若匹配失败，则所述处理器923L生成使所述锁体924L保持锁定状态的指令。
如图21是根据本发明的第四个优选实施例提供的电子设备90M，其中所述电子设备90M可以是一支付终端，例如POS机(Point Of Sales)等。所述电子设备90M包括一设备本体92M和一光学成像装置100M，所述光学成像装置100M可以采集使用者的生物特征例如指纹特征，以用于完成对账单的支付。
这样，在使用所述电子设备90M对账单进行支付时，所述光学成像装置100M可以采集使用者的生物特征例如指纹特征，此时，所述电子设备90M可以将采集的图像与预存于所述电子设备90M的图像进行比对，若匹配成功，则所述电子设备90M认为该使用者的身份合法，从而完成对账单的支付，若匹配是被，则所述电子设备90M认为该使用者的身份非法，从而对账单的支付失败。
如图22所示是根据本发明的第五个优选实施例提供的电子设备90N，其中所述电子设备90N可以是一快递终端，所述电子设备90N包括一设备本体92N和一光学成像装置100N所述光学成像装置100N可以采集使用者的生物特征例如指纹特征，以用于完成对快递件的签收。
如图23所示是根据本发明的第六个优选实施例提供的电子设备90S，其中所述电子设备90S是一医疗器械例如内窥镜等。在本发明的这个优选的实施例中，所述光学成像装置100S采集的图像不是被用于对使用者的身份进行识别，而是应用于医学诊断和治疗。
具体地说，所述电子设备90S包括一设备本体92S和所述光学成像装置100S，其中所述光学成像装置100S设置于所述设备本体92S，并且在所述设备本体92S的壳体形成所述光学成像装置100S的所述承载元件50，从而在所述设备本体92S的壳体外部形成所述光学成像装置100S的所述图像采集区域51S。这样，在所述电子设备90S被使用的过程中，贴近所述电子设备90S的所述设备本体92S的位置的特征都可以被所述光学成像装置100S采集，以在后续通过与所述电子设备90S通讯连接的电器显示图像。与现有技术的内窥镜相比，所述电子设备90S的所述光学成像装置100S的高度显著地降低，以使所述电子设备90S的体积能够同步地缩小，从而有利于扩大所述电子设备90S的应用范围。
如图24所示，本发明还提供一种通过一光学成像装置的成像方法，其特征在于，所述方法包括如下步骤：
(1)通过一光源13C产生光线；
(2)所述光源13C产生的光线辐射至一图像采集区域51C；
(3)所述光源13C产生的光线被置放于所述图像采集区域51C的一物体的表面反射，从而产生被反射光线；
(4)所述被反射光线穿过一通光孔41C进入一暗腔42C；以及
(5)所述被反射光线在进入所述暗腔42C后被一图像传感器30C接收，从 而生成与所述物体相关的图像。
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。

Claims (67)

  1. 一种光学成像系统，其特征在于，包括：
    一识别载体，其具有一透明的物方识别区域；
    一暗室壳体，其中所述暗室壳体形成一暗室，并具有一通孔，所述通孔与所述暗室相连通；
    一图像感应装置，其包括一图像传感器，所述图像传感器安装于所述暗室中；和
    一光源，其中所述光源安装于所述暗室壳体外部，其中当一识对对象放置于所述物方识别区域时，所述光源发出的发射光线射向所述物方识别区域并进一步地到达所述识别对象表面被反射，然后穿过所述通孔投射到所述图像传感器，从而藉由小孔成像原理使所述识别对象通过所述光学成像系统进行成像。
  2. 如权利要求1所述的光学成像系统，所述图像感应装置进一步包括一电路板，其中所述电路板连接于所述图像传感器。
  3. 如权利要求2所述的光学成像系统，所述物方识别区域使用具有高透过率的无机或有机材料制作。
  4. 如权利要求3所述的光学成像系统，制作所述暗室壳体的无机或有机材料阻挡光线通过而形成所述暗室。
  5. 如权利要求4所述的光学成像系统，其中在所述暗室壳体外部形成一容纳腔室，所述光源安装于所述腔室内部的一个或多个位置。
  6. 如权利要求5所述的光学成像系统，所述光源单独或同时发射紫外、红外或可见光，所述图像传感器适合于感应紫外、红外或可见光。
  7. 如权利要求4至6中任一所述的光学成像系统，所述电路板连接于所述暗室壳体的底壁或作为所述暗室壳体的底壁，以形成所述暗室。
  8. 如权利要求7所述的光学成像系统，所述光学成像系统组装于一指纹设别设备。
  9. 如权利要求7所述的光学成像系统，所述光学成像系统集成于一智能电子设备，所述识别对象为指纹，从而为所述智能电子设备提供指纹识别功能。
  10. 如权利要求7所述的光学成像系统，所述光学成像系统组装于一内窥镜。
  11. 一种光学成像方法，其特征在于，包括以下步骤：
    (a)一光源发射光线；
    (b)一透明的物方识别区域接收所述光源的发射光线，并被放置于所述物方识别区域的识别对象将光线反射；
    (c)所述反射光线通过一通孔投射到一图像传感器，从而藉由小孔成像原理使所述识别对象进行成像。
  12. 如权利要求11所述的光学成像方法，在所述步骤(c)中，所述光源射向所述通孔之外的光线被所述暗室壳体所阻挡，从而所述光源发出的光线只能被反射后通过所述通孔到达所述图像传感器。
  13. 如权利要求12所述的光学成像方法，所述图像传感器安装于所述暗室壳体的一暗室中，所述光源安装于所述暗室外部，所述物方识别区域和所述通孔平行设置，并保持一间距。
  14. 如权利要求13所述的光学成像方法，所述通孔的孔径、所述通孔到所述物方识别区域和所述图像传感器的距离以及所述图像传感器的尺寸根据小孔成像原理来确定。
  15. 如权利要求14所述的光学成像方法，所述物方识别区域使用具有高透 过率的无机或有机材料制作。
  16. 如权利要求10至15中任一所述的光学成像方法，所述光源单独或同时发射紫外、红外或可见光，所述图像传感器能够感应紫外、红外或可见光。
  17. 一种利用小孔成像原理制定光学成像系统的方法，其特征在于，所述方法包括以下步骤：
    (A)制定整个光学成像系统的总高；
    (B)定义物方识别区域所需的感应面积U；
    (C)定义出一通孔的孔径Φ、所述通孔到一感应面的距离W以及所述通孔到一图像传感器的距离X及相应公差；
    (D)选择合适的图像传感器；和
    (E)选择满足系统所需的至少一光源。
  18. 如权利要求17所述的方法，进一步包括一步骤(F)检验所得识别对象是否达到终端系统可判定要求，如果达到判定要求，则完成，如果达不到判定要求，则返回步骤(C)分析失败原因，直至合格为止，其中所述步骤(F)位于所述步骤(E)之后。
  19. 如权利要求17所述的方法，在所述步骤(C)中，根据公式F＝Φ(W/X+1)，计算出孔径Φ及其公差，其中F表示屏幕上的点所对应的被成像物的范围。
  20. 如权利要求18所述的方法，在所述步骤(C)中，根据公式F＝Φ(W/X+1)，计算出孔径Φ及其公差，其中F表示屏幕上的点所对应的被成像物的范围。
  21. 如权利要求19所述的方法，由公式V＝[UX+Φ(W+X)]/W，计算出像高V及其公差，其中所述图像传感器的尺寸根据像高V来选择。
  22. 如权利要求20所述的方法，由公式V＝[UX+Φ(W+X)]/W，计算出像高V及其公差，其中所述图像传感器的尺寸根据像高V来选择。
  23. 如权利要求17至22中任一所述的方法，所述感应面位于所述物方识别区域，其中所述感应面积U为所述物方识别区域感应的识别对象的面积。
  24. 如权利要求23所述的方法，根据所述通孔到所述感应面的距离W以及所述通孔到所述图像传感器的距离X制定所述光学成像系统，将所述通孔设于一通孔壁上，其中所述物方识别区域和所述图像传感器按照W和X的距离安装于所述通孔壁的相对的两侧。
  25. 如权利要求24所述的方法，所述传感器安装于一暗室中，形成所述暗室的一暗室壳体得以使所述光源发出的射向所述暗室壳体的光线被所述暗室壳体阻挡或吸收。
  26. 如权利要求17至22中任一所述的方法，在所述步骤(D)中，选择出规格大小、像素值及像素点大小均合适的图像传感器作为所述光学成像系统的图像传感器。
  27. 如权利要求17至22中任一所述的方法，在所述步骤(E)中，选择合适发光波长及光强的光源，以满足所述光学成像系统的亮度和解像力要求。
  28. 一种指纹识别系统，以应用于识别一指纹，其特征在于，包括：
    一识别载体，其具有一透明的物方识别区域；
    一暗室壳体，其中所述暗室壳体形成一暗室，并具有一通孔，所述通孔与所述暗室相连通；
    一图像感应装置，其包括一图像传感器，所述图像传感器安装于所述暗室中；
    一光源，其中所述光源安装于所述暗室壳体外部；和
    一指纹识别终端，其耦接于所述图像感应装置，其中当有手指或脚指置于所述物方识别区域时，所述光源发出的发射光线射向所述物方识别区域并进一步地到达所述手指或脚指表面被反射，然后穿过所述通孔投射到所述图像传感器，从而藉由小孔成像原理使所述识别对象通过所述光学成像系统进行成像，所述指纹 识别终端对所述指纹的成像进行判定和识别。
  29. 如权利要求28所述的指纹识别系统，所述暗室壳体采用不透光材料制作。
  30. 如权利要求29所述的指纹识别系统，所述通孔与所述图像传感器平行设置。
  31. 如权利要求28至30中任一所述的指纹识别系统，所述图像传感器连接于一电路板，其中所述电路板连接于所述暗室壳体的底壁，从而用于形成所述暗室。
  32. 如权利要求28至30中任一所述的指纹识别系统，所述图像感应装置与所述指纹识别终端共用一电路板。
  33. 如权利要求28至30中任一所述的指纹识别系统，其中所述指纹识别系统适合于制作独立的指纹识别装置，或集成于一智能电子设备中。
  34. 一种光学成像装置，其特征在于，所述光学成像装置包括一图像传感器和一光源，所述光学成像装置具有一图像采集区域、一暗腔以及一通光孔；
    其中所述通光孔连通于所述暗腔与所述暗腔的外部环境，所述图像传感器位于所述暗腔，并且所述通光孔对应于所述图像传感器的感光面，所述光源位于所述暗腔的外部环境，所述图像采集区域位于所述图像传感器的感光路径；
    其中当一物体置放于所述图像采集区域时，所述光源产生的光线在辐射至所述物体后被所述物体的表面反射，被所述物体的表面反射的光线穿过所述通光孔进入所述暗腔并进一步被所述图像传感器的感光面接受，从而所述光学成像装置采集物体的图像。
  35. 如权利要求34所述的光学成像装置，其中所述通光孔对应于所述图像传感器的感光面的中心位置。
  36. 如权利要求34所述的光学成像装置，还包括一壳体，其中所述壳体具有所述暗腔和所述通光孔，所述图像传感器被容纳于所述壳体，所述光源邻近地设置于所述壳体。
  37. 如权利要求34所述的光学成像装置，还包括一壳体和一基板，其中所述壳体设置于所述基板，以在所述壳体和所述基板之间形成所述暗腔，所述光源邻近地设置于所述壳体。
  38. 如权利要求37所述的光学成像装置，还包括一线路板，其中所述图像传感器贴装于所述线路板，所述线路板贴装于所述基板。
  39. 如权利要求37所述的光学成像装置，还包括一线路板，其中所述图像传感器贴装于所述线路板，所述基板具有一接受腔，所述线路板被容纳于所述接受腔。
  40. 如权利要求37所述的光学成像装置，还包括一线路板，其中所述图像传感器和所述线路板分别贴装于所述基板的不同侧，并且所述图像传感器电连接于所述线路板。
  41. 如权利要求39所述的光学成像装置，其中所述壳体包括一上壳部和至少一侧壳部，每所述侧壳部分别弯曲地从所述上壳部的边缘延伸至所述基板，从而在所述上壳部、每所述侧壳部和所述基板之间形成所述暗腔。
  42. 如权利要求34所述的光学成像装置，还包括一壳体和一线路板，所述壳体设置于所述线路板，以在所述壳体和所述线路板之间形成所述暗腔，所述图像传感器贴装于所述线路板。
  43. 如权利要求42所述的光学成像装置，其中所述壳体包括一上壳部和至少一侧壳部，每所述侧壳部分别弯曲地从所述上壳部的边缘延伸至所述线路板， 从而在所述上壳部、每所述侧壳部和所述线路板之间形成所述暗腔。
  44. 如权利要求34所述的光学成像装置，还包括一壳体、一基板和一支撑元件，其中所述支撑元件设置于所述基板，所述壳体的四周分别延伸至所述支撑元件，从而在所述基板、所述支撑元件和所述壳体之间形成所述暗腔，所述壳体具有所述通光孔以连通于所述暗腔与所述暗腔的外部环境。
  45. 如权利要求44所述的光学成像装置，还包括一线路板，其中所述图像传感器贴装于所述线路板，所述线路板贴装于所述基板。
  46. 如权利要求44所述的光学成像装置，还包括一线路板，其中所述图像传感器贴装于所述线路板，所述基板具有一接受腔，所述线路板被容纳于所述接受腔。
  47. 如权利要求44所述的光学成像装置，还包括一线路板，其中所述图像传感器和所述线路板分别贴装于所述基板的不同侧，并且所述图像传感器电连接于所述线路板。
  48. 如权利要求34所述的光学成像装置，还包括一壳体、一线路板和一支撑元件，其中所述支撑元件设置于所述线路板，所述壳体的四周分别延伸至所述支撑元件，从而在所述支撑元件、所述线路板和所述壳体之间形成所述暗腔，所述图像传感器贴装于所述线路板，所述壳体具有所述通光孔以连通于所述暗腔与所述暗腔的外部环境。
  49. 如权利要求36至48中任一所述的光学成像装置，还包括一承载元件，其中所述承载元件间隔地设置于所述壳体，并且所述承载元件的侧部形成所述图像采集区域。
  50. 如权利要求49所述的光学成像装置，其中所述图像传感器的感光面所在的平面与所述承载元件所在的平面平行。
  51. 一种电子设备，其特征在于，包括一光学成像装置，其中所述光学成像装置包括一图像传感器和一光源，所述光学成像装置具有一图像采集区域、一暗腔以及一通光孔；其中所述通光孔连通于所述暗腔和所述暗腔的外部环境，所述图像传感器位于所述暗腔，并且所述通光孔对应于所述图像传感器的感光面，所述光源位于所述暗腔的外部环境，所述图像采集区域位于所述图像传感器的感光路径。
  52. 如权利要求51所述的电子设备，其中所述光学成像装置供采集使用者的生物特征；其中当使用者的被采集图像的位置置放于所述图像采集区域时，所述光源产生的光线在辐射至所述被采集图像的位置后、被所述被采集图像的位置反射，被所述被采集图像的位置反射后的光线穿过所述通光孔进入所述暗腔并进一步被所述图像传感器的感光面接受，从而所述光学成像装置采集使用者的生物特征。
  53. 如权利要求52所述的电子设备，其中所述生物特征的类型选自指纹、掌纹和脚纹组成的类型组。
  54. 如权利要求51至53中任一所述的电子设备，其中所述电子设备是一生物特征采集装置，并且所述电子设备还包括一连接装置，所述光学成像装置可通信地连接于所述连接装置，所述连接装置适于可通信地连接于一电器。
  55. 如权利要求51至53中任一所述的电子设备，其中所述电子设备是一移动电子设备，并且所述电子设备还包括一设备本体，所述光学成像装置可通信地连接于所述设备本体；其中所述光学成像装置采集的使用者的所述生物特征被传输至所述设备本体，以与预存于所述设备本体的生物特征进行比对，若匹配成功，则所述设备本体认为被采集所述生物特征的使用者身份合法，若匹配失败，则所述设备本体认为被采集所述生物特征的使用者身份非法。
  56. 如权利要求55所述的电子设备，其中所述设备本体包括一按钮，所述 光学成像装置设置于所述设备本体，并且所述按钮形成所述图像采集区域。
  57. 如权利要求55所述的电子设备，其中所述设备本体包括一显示屏幕，所述光学成像装置设置于所述设备本体，并且所述显示屏幕形成所述图像采集区域。
  58. 如权利要求55所述的电子设备，其中所述电子设备的类型选自手机、平板电脑、笔记本电脑、电纸书和个人数字助理组成的类型组。
  59. 如权利要求51至53中任一所述的电子设备，其中所述电子设备是一门禁系统或者保险柜安全锁；其中所述电子设备包括一设备本体，所述光学成像装置可通信地连接于所述设备本体；其中所述光学成像装置采集的使用者的所述生物特征被传输至所述设备本体，以与预存于所述设备本体的生物特征进行比对，若匹配成功，则所述设备本体认为被采集所述生物特征的使用者身份合法，若匹配失败，则所述设备本体认为被采集所述生物特征的使用者身份非法。
  60. 如权利要求59所述的电子设备，其中所述设备本体包括一处理器和一锁体，所述光学成像装置可通信地连接于所述处理器，所述处理器可操作地连接于所述锁体，并且所述处理器得以控制所述锁体的状态。
  61. 如权利要求51至53中任一所述的电子设备，其中所述电子设备是一支付终端，以供对账单进行支付。
  62. 如权利要求51至53中任一所述的电子设备，其中所述电子设备是一快递终端，以供对快递件进行签收。
  63. 如权利要求51至53中任一所述的电子设备，其中所述电子设备是一内窥镜；其中所述电子设备包括一设备本体，所述光学成像装置可通信地连接于所述设备本体，并且所述光学成像装置设置于所述设备本体，以使所述设备本体形成所述图像采集区域。
  64. 一种光学成像装置，其特征在于，所述光学成像装置包括一图像传感器，所述光学成像装置具有一图像采集区域、一暗腔以及一通光孔；其中所述图像传感器设置于所述暗腔，所述通光孔连通于所述暗腔与所述暗腔的外部环境，并且所述通光孔对应于所述图像传感器的感光面，所述图像采集区域位于所述图像传感器的感光路径；
    其中设定所述光学成像装置的成像物范围参数为F，设定所述光学成像装置的所述通光孔的孔径参数为Φ，设定所述光学成像装置的像距参数为X，设定所述光学成像装置的物距参数为W；其中所述光学成像装置的成像物范围与所述光学成像装置的孔径、物距和像距的关系满足函数表达式：F＝Φ(W/X+1)。
  65. 如权利要求64所述的光学成像装置，其中设定所述光学成像装置的物高参数为U，设定所述光学成像装置的像高参数为V；其中所述光学成像装置的像高与所述光学成像装置的物高、孔径、物距和像距的关系满足函数表达式：V＝[UX+Φ(W+X)]/W。
  66. 如权利要求65所述的光学成像装置，还包括一光源，所述光源位于所述暗腔的外部环境，其中当一物体置放于所述图像采集区域时，所述光源产生的光线在辐射至所述物体后被所述物体的表面反射，被所述物体的表面反射的光线穿过所述通光孔进入所述暗腔并进一步被所述图像传感器的感光面接收，从而所述光学成像装置采集物体的图像。
  67. 如权利要求66所述的光学成像装置，其中所述通光孔对应于所述图像传感器的感光面的中心位置
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