WO2022165775A1 - 芯片封装结构和电子设备 - Google Patents

芯片封装结构和电子设备 Download PDF

Info

Publication number
WO2022165775A1
WO2022165775A1 PCT/CN2021/075661 CN2021075661W WO2022165775A1 WO 2022165775 A1 WO2022165775 A1 WO 2022165775A1 CN 2021075661 W CN2021075661 W CN 2021075661W WO 2022165775 A1 WO2022165775 A1 WO 2022165775A1
Authority
WO
WIPO (PCT)
Prior art keywords
sensor chip
chip
ambient light
fingerprint
fingerprint sensor
Prior art date
Application number
PCT/CN2021/075661
Other languages
English (en)
French (fr)
Inventor
龙启博
武艳伟
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to PCT/CN2021/075661 priority Critical patent/WO2022165775A1/zh
Priority to CN202180005446.1A priority patent/CN114556452B/zh
Publication of WO2022165775A1 publication Critical patent/WO2022165775A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor

Definitions

  • the embodiments of the present application relate to the field of chip packaging, and more particularly, to a chip packaging structure and an electronic device.
  • ambient light sensors have become standard sensors for electronic devices.
  • the current distribution and installation size of ambient light sensors in electronic devices are not conducive to the development of thin and light electronic devices.
  • the embodiments of the present application provide a chip packaging structure and an electronic device, which are beneficial to the development of the electronic device in the direction of being light and thin.
  • a chip packaging structure which is suitable for an electronic device with a display screen and is fixedly arranged below the display screen, the chip packaging structure includes: a fingerprint sensor chip for receiving a human body passing through the upper part of the display screen. The fingerprint light signal returned by the finger is used to detect the fingerprint information of the finger; the ambient light sensor chip is used to receive the ambient light signal of the electronic device, and the ambient light signal is used to detect the ambient light intensity of the electronic device ; circuit board, the fingerprint sensor chip and the ambient light sensor chip are packaged on the circuit board; the blocking structure is arranged between the fingerprint sensor chip and the ambient light sensor chip, for preventing the fingerprint sensor chip and the ambient light Light crosstalk occurs between sensor chips.
  • the chip packaging structure further includes: a reinforcing plate disposed below the circuit board; the upper surface of the circuit board extends downward and penetrates the circuit board to form two openings, the The fingerprint sensor chip and the ambient light sensor chip are respectively fixed in the two openings.
  • the thickness of the chip packaging structure can be further reduced, so as to save the space occupied by the electronic equipment. space.
  • a protective layer is provided on the lower surface of the light-emitting layer of the display screen, the protective layer is provided with a window, the fingerprint sensor chip and the ambient light sensor chip are aligned with the window,
  • the blocking structure sequentially includes the circuit board and the foam layer from bottom to top, and the foam layer is fixed on the the lower surface of the light-emitting layer.
  • Using a display screen to open a window and increasing the thickness of the foam layer of the chip packaging structure to form a barrier structure can not only ensure the barrier effect, but also reduce the processing cost of the display screen.
  • a protective layer is provided on the lower surface of the light-emitting layer of the display screen, the protective layer is provided with two opening windows, and the fingerprint sensor chip and the ambient light sensor chip are respectively aligned with the two openings.
  • the window is arranged, so that the fingerprint sensor chip and the ambient light sensor chip receive the light signal transmitted through the display screen through the corresponding window, and the blocking structure sequentially includes the circuit board and the foam layer from bottom to top.
  • the layer is fixed to the lower surface of the protective layer.
  • the display screen is used to open two windows, so that the protective layer of the display screen and the foam in the chip packaging structure together form a barrier structure, which can not only ensure the barrier effect, but also does not need to increase the cost of the chip packaging structure.
  • the fingerprint sensor chip and the ambient light sensor chip have a common component arrangement area, and/or the fingerprint sensor chip and the ambient light sensor chip share a connector.
  • the chip packaging structure of the embodiment of the present application can further reduce the process cost by sharing the connector or the component arrangement area, which is more beneficial to the overall design of the electronic device and the electronic device. thinning development.
  • the chip package structure further includes: a light shielding layer formed on the upper surface of the edge region of the fingerprint sensor chip and the upper surface of the edge region of the ambient light sensor chip, respectively, wherein the light shielding layer Do not block the sensing area of the fingerprint sensor chip and the sensing area of the ambient light sensor chip, the light shielding layer is used to prevent the edge area of the fingerprint sensor chip from causing light crosstalk to the sensing area of the fingerprint sensor chip and the ambient light sensor chip. The edge area causes light crosstalk to the sensing area of the ambient light sensor chip.
  • the light crosstalk between the edge area and the sensing area can be reduced, so that the detection performance can be further improved.
  • the chip packaging structure further includes: a fingerprint driving chip, which is used to cooperate with the fingerprint sensor chip to perform fingerprint identification; wherein, the fingerprint driving chip is packaged on the circuit board.
  • the fingerprint driving chip and the fingerprint sensor chip are packaged on the same circuit board, which can save the space occupied by the electronic device, thereby facilitating the development of the electronic device toward the light and thin direction.
  • the fingerprint sensor chip further includes a fingerprint driving circuit.
  • Integrating the fingerprint driving function and the fingerprint detection function into one chip can further reduce the size of the chip package structure, make the chip package structure more concise, and thus have higher reliability.
  • the chip packaging structure further includes: an optical path layer disposed above the fingerprint sensor chip; the fingerprint sensor chip is configured to receive the returned finger from the human body above the display screen and pass through the optical path layer Guided fingerprint light signal.
  • the chip packaging structure further includes: a filter, which is arranged above the ambient light sensor chip and is used to transmit the wavelength band of the ambient light corresponding to the pixels in the ambient light sensor chip .
  • the width of the blocking structure ranges from 0.2 to 25 mm.
  • the width of the blocking structure is in the range of 0.6-5 mm.
  • a chip packaging structure which is suitable for an electronic device with a display screen and is arranged below the display screen, the chip packaging structure includes: a fingerprint sensor chip for receiving a human finger passing above the display screen The returned fingerprint light signal is used to detect the fingerprint information of the finger; the ambient light sensor chip is used to receive the ambient light signal of the electronic device, and the ambient light signal is used to detect the ambient light intensity of the electronic device; A circuit board, the fingerprint sensor chip and the ambient light sensor chip are packaged on the circuit board; wherein, the distance between the fingerprint sensor chip and the ambient light sensor chip is greater than or equal to a preset value, so that the fingerprint sensor chip and the No light crosstalk occurs between ambient light sensor chips.
  • the influence of crosstalk can be filtered through an algorithm, so that the cost of the chip packaging structure can be reduced while ensuring the detection performance.
  • the preset value is determined based on at least one of the following parameters: the size of the photosensitive area of the fingerprint sensor chip and the photosensitive area of the ambient light sensor chip, the required viewing angle of the fingerprint sensor chip Field angle FOV and the required distance of the ambient light sensor chip FOV, the avoidance FOV of the fingerprint sensor chip and the safety distance of the avoidance FOV of the ambient light sensor chip, the display screen to the upper surface of the fingerprint sensor chip and the display The distance from the screen to the upper surface of the ambient light sensor chip.
  • the preset value is 0.4-25mm.
  • the size of the chip package structure can be reduced as much as possible under the condition of preventing light crosstalk.
  • the chip packaging structure further includes: a reinforcing plate disposed below the circuit board; the upper surface of the circuit board extends downward and penetrates the circuit board to form two openings, the The fingerprint sensor chip and the ambient light sensor chip are respectively fixed in the two openings.
  • the fingerprint sensor chip and the ambient light sensor chip have a common component arrangement area, and/or the fingerprint sensor chip and the ambient light sensor chip share a connector.
  • the chip package structure further includes: a light shielding layer formed on the upper surface of the edge region of the fingerprint sensor chip and the upper surface of the edge region of the ambient light sensor chip, respectively, wherein the light shielding layer Do not block the sensing area of the fingerprint sensor chip and the sensing area of the ambient light sensor chip, the light shielding layer is used to prevent the edge area of the fingerprint sensor chip from causing light crosstalk to the sensing area of the fingerprint sensor chip and the ambient light sensor chip. The edge area causes light crosstalk to the sensing area of the ambient light sensor chip.
  • the chip packaging structure further includes: a fingerprint driving chip, which is used to cooperate with the fingerprint sensor chip to perform fingerprint identification; wherein, the fingerprint driving chip is packaged on the circuit board.
  • the fingerprint sensor chip further includes a fingerprint driving circuit.
  • an electronic device including: a display screen; the chip packaging structure according to the first aspect or any possible implementation manner of the first aspect, the chip packaging structure being fixedly disposed on the display screen below.
  • the display screen includes a transparent cover plate, a display panel, a buffer layer and a copper layer in sequence from top to bottom, wherein the display screen is provided with a window penetrating the buffer layer and the copper layer,
  • the chip packaging structure is aligned with the window, so that the fingerprint sensor chip and the ambient light sensor chip receive the light signal transmitted through the display screen through the window.
  • the electronic device further includes: a middle frame, a groove is formed on the upper surface of the middle frame extending downward, and the chip packaging structure is fixedly arranged in the groove of the middle frame.
  • an electronic device comprising: a display screen; the chip packaging structure as described in the second aspect or any possible implementation manner of the second aspect, the chip packaging structure being fixedly disposed on the display screen below.
  • the display screen includes a transparent cover plate, a display panel, a buffer layer and a copper layer in sequence from top to bottom, wherein the display screen is provided with a window penetrating the buffer layer and the copper layer,
  • the chip packaging structure is aligned with the window, so that the fingerprint sensor chip and the ambient light sensor chip receive the light signal transmitted through the display screen through the window.
  • the electronic device further includes: a middle frame, a groove is formed on the upper surface of the middle frame extending downward, and the chip packaging structure is fixedly arranged in the groove of the middle frame.
  • FIG. 1 shows a schematic diagram of an electronic device according to an embodiment of the present application.
  • FIG. 2 shows a schematic structural diagram of a chip package structure according to an embodiment of the present application.
  • FIG. 3 shows a schematic diagram of a crosstalk path between chips in an embodiment of the present application.
  • FIG. 4 shows a schematic diagram of a crosstalk path between chips in an embodiment of the present application.
  • FIG. 5 shows another schematic structural diagram of the chip packaging structure according to the embodiment of the present application.
  • FIG. 6 shows another schematic structural diagram of the chip package structure according to the embodiment of the present application.
  • FIG. 7 shows another schematic structural diagram of the chip packaging structure according to the embodiment of the present application.
  • FIG. 8 shows another schematic structural diagram of the chip packaging structure according to the embodiment of the present application.
  • FIG. 9 shows a top view of the chip package structure shown in FIG. 8 .
  • FIG. 10 shows a top view of the chip package structure shown in FIG. 5 .
  • FIG. 11 shows a top view of the chip package structure shown in FIG. 6 .
  • FIG. 12 shows a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • FIG. 13 shows a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • the technical solutions of the embodiments of the present application can be applied to smart phones, tablet computers, and other electronic devices with display screens. More specifically, in the above electronic devices, the chip packaging structure can be arranged in Local area below the display.
  • fingerprint sensors and ambient light sensors have become standard sensors in electronic devices.
  • the fingerprint sensor and ambient light sensor need to be placed under the display screen to achieve off-screen fingerprint recognition and ambient light detection.
  • a fingerprint sensor is a fingerprint sensor chip with an optical sensing array, wherein the optical sensing array includes a plurality of optical sensing units, and each optical sensing unit may specifically include a photodetector or a photoelectric sensor.
  • the fingerprint sensor may include a photo detector array (or referred to as a photo detector array, a photo sensor array), which includes a plurality of photo detectors distributed in an array.
  • the fingerprint sensor is used to receive the fingerprint light signal returned by the human finger above the display screen, so as to detect the fingerprint information of the finger.
  • the ambient light sensor may specifically be a light sensor, for example, the light sensor includes, but is not limited to, at least one photodiode. Specifically, the ambient light sensor is used to receive the ambient light signal after passing through the display screen to detect the ambient light intensity.
  • the module where the fingerprint sensor is located (such as an optical fingerprint module) is distributed in the under-screen area of the lower half of the electronic device, such as the area 101 shown in FIG. 1
  • the module where the ambient light sensor is located (such as the ambient light
  • the detection module) is mainly distributed in the upper half of the electronic device, for example, the "bangs", the narrow gap between the middle frame and the display screen, and the under-screen area above the display area 104, such as the areas 102 and 103 shown in FIG. 1 . .
  • the current ambient light detection module adopts the Land Grid Array (LGA) package or the Quad Flat No-leads (QFN) package, it is thicker in the thickness direction, generally larger than 0.5mm, which limits its application between the middle frame and the display screen.
  • LGA Land Grid Array
  • QFN Quad Flat No-leads
  • the embodiments of the present application provide a chip packaging structure, which encapsulates the fingerprint sensor chip and the ambient light sensor chip together, so as to save the space of the electronic device, reduce the difficulty of designing the whole structure of the electronic device, and is beneficial to the electronic device.
  • Devices are developing towards thinness and lightness, and at the same time, the cost of electronic devices can be reduced.
  • the chip packaging structure provided by the embodiments of the present application is suitable for an electronic device having a display screen, and specifically, the chip packaging structure may be arranged below the display screen.
  • the display screen may be a self-luminous display screen, which uses display units having self-luminescence as display pixels.
  • the display screen may be an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display screen or a micro light-emitting diode (Micro-LED) display screen.
  • the display screen may be specifically a touch display screen, which can not only display a picture, but also detect a user's touch or pressing operation, thereby providing a human-computer interaction interface for the user.
  • the electronic device may include a touch sensor, and the touch sensor may specifically be a touch panel (Touch Panel, TP), which may be disposed on the surface of the display screen, or may be partially integrated or integrally integrated into the display screen 120 to form the touch display screen.
  • touch panel Touch Panel
  • FIG. 2 shows a schematic block diagram of a chip packaging structure provided by an embodiment of the present application.
  • the chip packaging structure includes:
  • the fingerprint sensor chip 201 is used to receive the fingerprint light signal returned by the human finger above the display screen 210, and the fingerprint light signal is used to detect the fingerprint information of the finger;
  • the ambient light sensor chip 202 is used to receive the ambient light signal of the electronic device, and the ambient light signal is used to detect the ambient light intensity of the electronic device;
  • the circuit board 203, the fingerprint sensor chip 201 and the ambient light sensor chip 202 are packaged on the circuit board 203;
  • the fingerprint sensor chip 201 and the ambient light sensor chip 202 are unpackaged bare chips (die), or may also be referred to as bare chips, both of which are packaged on the circuit board 203, that is, the fingerprint sensor chip 201 and the
  • the ambient light sensor chip 202 is electrically connected to the circuit board 203 .
  • the fingerprint sensor chip 201 and the ambient light sensor chip 202 may be electrically connected to the circuit board 203 through gold wires 209 .
  • the fingerprint sensor chip 201 and the ambient light sensor chip 202 can realize typical interconnection and signal transmission with other peripheral circuits or other elements in the electronic device through the circuit board 203 .
  • the fingerprint sensor chip 201 and the ambient light sensor chip 202 are packaged together, light crosstalk may occur between the fingerprint sensor chip 201 and the ambient light sensor chip 202.
  • the light signal reflected by the surface of the fingerprint sensor chip 201 may be received by the ambient light sensor chip 202, thereby affecting the detection of ambient light.
  • the light signal reflected by the surface of the ambient light sensor chip 202 may be received by the fingerprint sensor chip 201, thereby affecting fingerprint imaging.
  • the light signal P1 incident on the surface of the fingerprint sensor chip 201 is reflected to the display screen 210 , and the light signal P2 is reflected again by the display screen 210 .
  • the ambient light sensor chip 202 detects the ambient light intensity of the electronic device based on the light signal directly incident to the photosensitive area through the display screen 210, the light signal P2 will detect the ambient light cause interference.
  • the light signal P3 incident on the surface of the ambient light sensor chip 202 is reflected to the display screen 210 , and the light reflected by the display screen 210 again
  • the signal P4 is incident on the photosensitive area of the fingerprint sensor chip 201.
  • the fingerprint sensor chip 201 performs fingerprint detection based on the fingerprint light signal returned by the human finger above the display screen 210, the light signal P4 will interfere with the fingerprint detection.
  • the chip packaging structure provided by the embodiment of the present application further includes: a blocking structure 204 , which is disposed between the fingerprint sensor chip 201 and the ambient light sensor chip 202 and is used to prevent occurrence of occurrence between the fingerprint sensor chip 201 and the ambient light sensor chip 202 .
  • a blocking structure 204 which is disposed between the fingerprint sensor chip 201 and the ambient light sensor chip 202 and is used to prevent occurrence of occurrence between the fingerprint sensor chip 201 and the ambient light sensor chip 202 .
  • Light crosstalk is disposed between the fingerprint sensor chip 201 and the ambient light sensor chip 202 and is used to prevent occurrence of occurrence between the fingerprint sensor chip 201 and the ambient light sensor chip 202 .
  • the circuit board 203 may be a flexible circuit board, namely a flexible printed circuit (Flexible Printed Circuit, FPC). It is fixedly arranged above the reinforcement board 205 , for example, the lower surface of the circuit board 203 is fixed to the upper surface of the reinforcement board 205 by double-sided tape.
  • FPC Flexible Printed Circuit
  • the fingerprint sensor chip 201 and the ambient light sensor chip 202 may be fixedly disposed on the upper surface of the circuit board 203 , for example, the lower surfaces of the fingerprint sensor chip 201 and the ambient light sensor chip 202 are respectively fixed on the circuit board 203 through an adhesive layer. upper surface.
  • the circuit board 203 may also be provided with windows.
  • the upper surface of the circuit board 203 extends downward and penetrates the circuit board 203 to form two windows.
  • the fingerprint sensor chip 201 and the ambient light sensor chip 202 are respectively fixed on the in the two grooves of the circuit board 203 . That is to say, the fingerprint sensor chip 201 and the ambient light sensor chip are respectively fixed on the upper surface of the reinforcing plate 205, and the circuit board 203 is respectively arranged around the fingerprint sensor chip 201 and the ambient light sensor chip 202, for example, the fingerprint sensor chip 201 and the ambient light
  • the light sensor chip is fixed on the upper surface of the reinforcing plate 205 by die attach adhesive (Die Attach Film, DAF).
  • the circuit board 203 may be a substrate.
  • the substrate may include a first cover layer, a first conductive layer, a substrate layer, a second conductive layer and a second cover layer in order from top to bottom, and the upper surface of the substrate extends downward in the first region and penetrates through the first
  • the cover layer and the first conductive layer form two grooves, the fingerprint sensor chip 201 and the ambient light sensor chip 202 can be fixedly arranged in the two grooves respectively, and the upper surface of the substrate extends downward in the second area and penetrates the first
  • the cover layer is formed to form the pads of the substrate, and the fingerprint sensor chip 201 and the ambient light sensor chip 202 are respectively connected to the pads to realize electrical connection.
  • the number of pads on the substrate may be one, which is disposed between the fingerprint sensor chip 201 and the ambient light sensor chip 202 .
  • corresponding pads may also be provided for the fingerprint sensor chip 201 and the ambient light sensor chip 202 respectively.
  • the circuit board 203 may also be a printed circuit board (Printed Circuit Board, PCB) or other types of circuit boards.
  • PCB printed Circuit Board
  • the fingerprint sensor chip and the ambient light sensor chip are arranged in the opening, so that the thickness of the chip package structure can be reduced, and the thickness of the electronic device can be further saved.
  • the chip package structure provided by the implementation of the present application will be described in detail below with reference to FIGS. 5 to 8 , taking the chip package structure including a circuit board and a reinforcing plate as an example.
  • the chip packaging structure further includes: an optical path layer 230 .
  • the optical path layer 230 may be disposed above the fingerprint sensor chip 201 , and the fingerprint sensor chip 201 is used to receive the fingerprint light signal returned by the human finger above the display screen 210 and guided by the optical path layer 230 .
  • the optical path layer 230 includes a lens layer 233 and an optical path guide layer 232.
  • the lens layer 233 is used for condensing the optical signal returned by the human finger above the display screen to the optical path guide layer 232, and the optical path guide layer 232 connects the lens layer.
  • the condensed light signal 233 is directed to the fingerprint sensor chip 201 .
  • the lens layer 233 may have a microlens array formed by a plurality of microlenses, which may be formed over the sensing array of the fingerprint sensor chip 201 through a semiconductor growth process or other processes, and each microlens may respectively correspond to the sensing array of the sensing array. one or more of the induction units.
  • Other optical film layers such as a dielectric layer or a passivation layer, may also be formed between the lens layer 233 and the sensing unit. More specifically, a light blocking layer with microholes may also be formed between the lens layer 233 and the sensing unit.
  • the light blocking layer can block optical interference between adjacent sensing units and allow light to pass through the
  • the microlenses converge inside the microholes and are transmitted to the sensing units corresponding to the microlenses through the microholes, so as to perform optical fingerprint imaging.
  • the optical path layer 230 may also be an optical collimator layer with a high aspect ratio through hole array.
  • the optical collimator layer can be specifically a collimator layer fabricated on a semiconductor silicon wafer, which has a plurality of collimation units or micro-holes, and the collimation unit can be specifically a small hole, which is reflected from the finger.
  • the light perpendicularly incident to the collimation unit can pass through and be received by the sensor chip below it, while the light with an excessively large incident angle is attenuated after multiple reflections inside the collimation unit, so all the light is attenuated.
  • the sensor chip can basically only receive the reflected light reflected by the fingerprint pattern directly above it, which can effectively improve the image resolution and thus improve the fingerprint recognition effect.
  • optical path layers may be used alone or in combination, for example, a lens layer may be further provided under the optical collimator layer.
  • a lens layer may be further provided under the optical collimator layer.
  • the collimator layer is used in combination with the lens layer, its specific stack structure or optical path may need to be adjusted according to actual needs.
  • the chip package structure may further include a first filter, and the first filter may be disposed above the fingerprint sensor chip 201 , for example, the first filter may be disposed on the fingerprint sensor chip 201 surface.
  • the first filter may also be disposed between the fingerprint sensor chip 201 and the optical path layer 230, or may be disposed inside or above the optical path layer, which is not specifically limited in this application.
  • the chip package structure may further include a second optical filter 234, the second optical filter may be disposed above the ambient light sensor chip 202, for example, the second optical filter may be disposed on the ambient light sensor chip 202 on the upper surface.
  • the second optical filter may be disposed above the ambient light sensor chip 202, for example, the second optical filter may be disposed on the ambient light sensor chip 202 on the upper surface.
  • the first optical filter is used to reduce undesired ambient light in fingerprint sensing, so as to improve the optical sensing of the fingerprint sensor chip 201 to the received light signal.
  • the first filter can be used to filter out light of a specific wavelength, for example, near-infrared light and part of red light.
  • a specific wavelength for example, near-infrared light and part of red light.
  • human fingers absorb most of the energy of light with wavelengths below 580nm
  • the filters may include one or more optical filters, which may be configured, for example, as band-pass filters to allow transmission of light emitted by the OLED screen while blocking infrared from sunlight light and other light components.
  • the second filter 234 is used to transmit the wavelength band of the ambient light corresponding to the pixels included in the ambient light sensor chip 202 .
  • the second filter 234 is used to filter out visible light in ambient light and transmit infrared light in ambient light; if the ambient light sensor chip includes red light pixels, blue light Pixels and visible light pixels such as green pixels, the second filter 234 can be used to filter out infrared light in ambient light and transmit visible light in ambient light.
  • the filter can be implemented, for example, as an optical filter coating formed on one or more continuous interfaces, or can be implemented on one or more discrete interfaces.
  • the first filter may be a coating layer directly designed on the lens layer 233 to avoid the appearance of Newton's rings in the fingerprint image acquired by the fingerprint sensor chip 201 .
  • the light entrance surface of the filter may be provided with an optical inorganic coating or an organic blackening coating, so that the reflectivity of the light entrance surface of the filter is lower than a first threshold, such as 1%, so that the It is ensured that the fingerprint sensor chip 201 and the ambient light sensor chip 202 can receive enough light signals, thereby improving the fingerprint recognition effect and the ambient light detection effect.
  • the ambient light sensor chip 202 in this embodiment of the present application may also include other light path structures.
  • it includes the optical circuit layer applied in the fingerprint sensor chip 201 . This embodiment of the present application does not limit this.
  • the chip packaging structure further includes: a first foam layer 206 .
  • the first foam layer 206 can be fixedly disposed on the upper surface of the circuit board 203 .
  • the first foam layer 206 can be fixed on the upper surface of the circuit board 203 by fixing glue.
  • the fixing adhesive may be a double-sided adhesive.
  • the first foam layer 206 and the fixing glue can be combined into one layer.
  • an adhesive layer may be formed on the lower surface of the first foam layer 206 at the same time.
  • the first foam layer 206 when the first foam layer 206 is fixed on the upper surface of the circuit board by the double-sided tape, the first foam layer 206 may also be provided with two windows.
  • the two windows of the circuit board 203 can be aligned with the two windows of the circuit board 203 respectively.
  • the fingerprint sensor chip 201 and the ambient light sensor chip 202 can receive the light signal transmitted through the display screen 210 .
  • the window size of the two windows of the first foam layer 206 may be smaller than or equal to the window size of the two windows of the circuit board 203 .
  • the window sizes of the two windows of the first foam layer 206 may be respectively smaller than the window sizes corresponding to the windows of the circuit board 203 , and respectively greater than or equal to the size of the fingerprint sensor chip 201 located in the two windows of the circuit board 203 , respectively.
  • the size of the light surface and the size of the light entrance surface of the ambient light sensor chip 202 may be respectively smaller than the window sizes corresponding to the windows of the circuit board 203 , and respectively greater than or equal to the size of the fingerprint sensor chip 201 located in the two windows of the circuit board 203 , respectively.
  • the size of the light surface and the size of the light entrance surface of the ambient light sensor chip 202 may be respectively smaller than the window sizes corresponding to the windows of the circuit board 203 , and respectively greater than or equal to the size of the fingerprint sensor chip 201 located in the two windows of the circuit board 203 , respectively.
  • the size of the light surface and the size of the light entrance surface of the ambient light sensor chip 202 may be respectively smaller than the window sizes corresponding to the
  • the chip package structure further includes: a light shielding layer 208 .
  • the light shielding layer 208 may be formed at least on the upper surfaces of the edge regions of the fingerprint sensor chip 201 and the ambient light sensor chip 202, respectively, wherein the light shielding layer 208 partially shields the edge regions of the fingerprint sensor chip 201 and the ambient light sensor chip 202, And do not block the sensing areas of the fingerprint sensor chip 201 and the ambient light sensor chip 202, the light shielding layer 208 is used to prevent the edge area of the fingerprint sensor chip 201 from causing light crosstalk to the sensing area of the fingerprint sensor chip 201 and the edge area of the ambient light sensor chip 202. Light crosstalk is caused to the sensing area of the ambient light sensor chip 202 .
  • the light shielding layer 208 is used to prevent the non-sensing area of the fingerprint sensor chip 201 from causing light crosstalk to the sensing area of the fingerprint sensor chip 201 and the non-sensing area of the ambient light sensor chip 202 from causing light crosstalk to the sensing area of the ambient light sensor chip 202 .
  • the light-shielding layer 208 can partially wrap the edge area of the filter, so that the filter and the light-shielding layer can completely filter out the light signal of the non-target wavelength band, which is required to pass through the fingerprint sensor chip 201 and the ambient light sensor chip 202. Optical signal in the target band.
  • the light shielding layer 208 can also be replaced by a filter.
  • the light shielding layer 208 may be ink, or may also be other light shielding materials.
  • the chip package structure further includes: gold wires 209 , and the fingerprint sensor chip 201 and the ambient light sensor chip 202 are connected to the circuit board 203 through the gold wires 209 .
  • the fingerprint sensor chip 201 and the ambient light sensor chip 202 can be fixedly installed in the two openings of the circuit board 203 by fixing glue.
  • the fixing glue includes but is not limited to thermosetting glue.
  • the fixing glue can not only fix the fingerprint sensor chip 201 and the ambient light sensor chip 202 , but also can be used to encapsulate the gold wire 209 .
  • an adhesive layer 241 may be passed between the circuit board 203 and the reinforcing plate 205, for example, the adhesive layer 241 may be double-sided adhesive tape.
  • the fingerprint sensor chip 201 and the ambient light sensor chip 202 are packaged together, which can effectively reduce the assembly process, and can reduce the thickness of the chip packaging structure, especially for the ambient light sensor chip, which will be combined below.
  • Figures 5-8 and Table 1 schematically illustrate the thicknesses of each stack in the chip package structure at A-A, B-B, C-C, and D-D, respectively.
  • the thickness is not specified, it can be adjusted according to customer needs and actual production needs.
  • the display screen 210 may be a soft screen or a hard screen.
  • the finger When the finger is placed on top of the bright OLED screen, the finger will reflect the light emitted by the OLED screen. The reflected light needs to penetrate the OLED screen until the fingerprint sensor chip 201, or the ambient light needs to penetrate the OLED screen until the ambient light sensor chip 202.
  • a protective layer will be set under the light-emitting layer of the OLED screen, and the protective layer is an opaque material.
  • the protective layer In order to guide the above-mentioned reflected light and ambient light to the fingerprint sensor chip 201 and the ambient light sensor chip 202 respectively, the protective layer needs to be A window is provided at the installation position of the fingerprint sensor chip 201 and the ambient light sensor chip 202, so that the reflected light and the ambient light can reach the fingerprint sensor chip 201 and the ambient light sensor chip 202, respectively.
  • the fingerprint sensor chip 201 and the ambient light sensor chip 202 in the embodiments of the present application are packaged on the same circuit board 203 , the fingerprint sensor chip 201 and the ambient light sensor chip 202 may have a common arrangement of components Areas, such as those used to place passive components such as capacitors, resistors, and inductors.
  • the fingerprint sensor chip 201 and the ambient light sensor chip 202 may also have the same connector.
  • a connector may be provided at one end of the circuit board 203, and the connector 294 may be used to connect with an external device or other components of the electronic device (such as a mainboard), thereby realizing communication with the external device or all communication with other components of the electronic device.
  • the connector 294 can be used to connect to the processor of the electronic device, so that the processor of the electronic device can receive the fingerprint information detected by the fingerprint sensor chip 201, and perform processing based on the processed fingerprint information. Fingerprint recognition.
  • the chip packaging structure of the embodiment of the present application can further reduce the process cost, which is more conducive to the overall design of electronic equipment and the development of thin and light electronic equipment.
  • FIG. 5 shows a schematic structural diagram of a chip packaging structure according to an embodiment of the present application.
  • the protective layer is provided with a window
  • the fingerprint sensor chip 201 and the ambient light sensor chip 202 are aligned with the window
  • the blocking structure 204 can be fixed on the upper surface of the reinforcing plate 205 .
  • the blocking structure 204 sequentially includes a circuit board 203 and a foam layer from bottom to top, and the foam layer is fixed on the lower surface of the light-emitting layer of the display screen 210 .
  • the foam layer in the barrier structure 204 may be formed by the first foam layer 206 extending upward to the lower surface of the light-emitting layer, or a second foam layer may be provided on the upper surface of the first foam layer 206.
  • the foam layer such as the second foam layer 231 shown in FIG. 5 , optionally, the second foam layer 231 may not be a foam material, but may be a light-blocking material of other materials such as rubber.
  • FIG. 6 shows a schematic structural diagram of another chip packaging structure according to an embodiment of the present application.
  • the protective layer is provided with two windows, the fingerprint sensor chip 201 and the ambient light sensor chip 202 are respectively aligned with the two windows, and the blocking structure 204 can be fixed on the reinforcing plate. 205 , and the blocking structure 204 sequentially includes a circuit board 203 and a foam first foam layer from bottom to top, and the first foam layer is fixed on the lower surface of the protective layer of the display screen 210 .
  • the chip package structure further includes: a fingerprint driving chip 207 , and the fingerprint driving chip 207 is used to cooperate with the fingerprint sensor chip 201 to perform fingerprint identification.
  • the fingerprint driving chip 207 is also packaged on the circuit board 203 .
  • the fingerprint driver chip 207 and the fingerprint sensor chip 201 can be arranged in the same opening.
  • the fingerprint driver chip 207 can be fixedly arranged on the upper surface of the reinforcing plate 205 and electrically connected to the circuit board through the gold wire 209 203 , so that the fingerprint driver chip 207 is connected to the fingerprint sensor chip 201 .
  • the chip package structure may also not include the fingerprint driving chip 207, but integrate the fingerprint driving circuit in the fingerprint sensor chip 201.
  • the fingerprint sensor chip 201 can realize the function of fingerprint driving. , and can realize the function of fingerprint recognition.
  • the width of the blocking structure 204 is in the range of 0.2-25 mm, and further, the width of the blocking structure is in the range of 0.6-5 mm.
  • width range of the blocking structure within a certain range can better reduce the cost as much as possible under the condition of preventing light crosstalk, thereby improving the performance of the electronic device.
  • FIG. 8 shows a schematic structural diagram of another chip packaging structure according to an embodiment of the present application.
  • the barrier structure 204 is not included, but the distance between the fingerprint sensor chip 201 and the ambient light sensor chip 202 is designed to be greater than or equal to a preset value, so that the fingerprint sensor chip 201 and the No light crosstalk occurs between ambient light sensor chips 202 .
  • the preset value may be determined based on at least one of the parameters shown in FIG. 3 and FIG. 4 : the size A of the photosensitive area of the fingerprint sensor chip and the photosensitive area of the ambient light sensor chip, The required angle of view (FOV) of the fingerprint sensor chip and the distance C of the FOV required by the ambient light sensor chip, the avoidance FOV of the fingerprint sensor chip and the safety of the avoidance FOV of the ambient light sensor chip Distance B, the distance D from the display screen to the upper surface of the fingerprint sensor chip and the display screen to the upper surface of the ambient light sensor chip.
  • the size A of the photosensitive area of the fingerprint sensor chip and the photosensitive area of the ambient light sensor chip the required angle of view (FOV) of the fingerprint sensor chip and the distance C of the FOV required by the ambient light sensor chip
  • the avoidance FOV of the fingerprint sensor chip and the safety of the avoidance FOV of the ambient light sensor chip Distance B, the distance D from the display screen to the upper surface of the fingerprint sensor chip and the display screen to the upper surface of the ambient light
  • the range of the preset value is between 0.4-25mm, for example, the preset value is 4.28.
  • the crosstalk illuminance accounts for a certain percentage of the total illuminance after passing through the screen. The closer the distance between the chips, the larger the proportion. From the perspective of the path, the large-angle light passing through the edge of the window of the display screen is most likely to cause crosstalk. The reflection distance of this kind of light through the surface of the chip is farther. The less light crosstalk between them.
  • the barrier structure 204 may not be added, and a feasible distance can be increased between the fingerprint sensor chip 201 and the ambient light sensor chip 202. Further, the influence of crosstalk can be filtered through an algorithm, so as to ensure the detection The cost of the chip package structure can be reduced while improving the performance.
  • FIG. 9 is a top view of the chip package structure shown in FIG. 8
  • FIG. 10 is a top view of the chip package structure shown in FIG. 5
  • FIG. 11 is a top view of the chip package structure shown in FIG. 6 .
  • the width of the blocking structure 204 between the fingerprint sensor chip 201 and the ambient light sensor chip 202 is 2 mm.
  • the minimum foam width of the blocking structure 204 is 0.8 mm.
  • the distance between the fingerprint sensor chip 201 and the ambient light sensor chip 202 is 4.28.
  • the side length of the chip package structure may range from 10 to 50 mm.
  • the chip package structure has a length of 22.98 mm and a width of 13.78 mm.
  • baffle structure in the embodiments of the present application is not limited to the shape shown in the drawings.
  • plan view of the baffle structure may be circular or square.
  • the chip package structure provided by the embodiment of the present application may be placed at any position below the display screen.
  • the placement between chips is not limited.
  • the photosensitive area of the fingerprint sensor chip can be placed in the center of the display screen, while the fingerprint driver chip and the ambient light sensor chip can be placed anywhere on the fingerprint sensor chip. side. Different positional relationships have little impact on performance, and the main impact is the size of the chip package structure and the structural environment limited by the application of the whole machine.
  • an embodiment of the present application further provides an electronic device, including a display screen 210 and the chip packaging structure provided in the above-mentioned various embodiments, wherein the chip packaging structure is fixedly disposed below the display screen 210 .
  • the electronic device further includes a middle frame 220 , wherein the chip package structure is fixed between the display screen 210 and the middle frame 220 .
  • FIG. 12 and FIG. 13 are schematic structural diagrams of electronic devices according to embodiments of the present application.
  • the chip package structure is fixed on the lower surface of the display screen 210 by the fixing glue.
  • the upper surface of the foam layer 206 in the chip packaging structure is fixedly bonded to the lower surface of the display screen.
  • the chip package structure is also fixed on the upper surface of the middle frame 220 by a fixing glue.
  • the reinforcing plate 205 in the chip packaging structure is fixedly bonded to the upper surface of the middle frame 220 of the electronic device.
  • a groove is formed on the upper surface of the middle frame 220 extending downward, and the lower surface of the chip package structure is fixed in the groove of the middle frame 220 .
  • the space of the electronic device can be saved, which is beneficial to the development of the electronic device toward the direction of lightness and thinness.
  • the chip package structure provided by the embodiment of the present application is relatively light and thin, when the chip package structure needs to be arranged in the groove of the middle frame, the depth of the groove of the middle frame will not be too large and the strength of the middle frame will not be reduced.
  • the display screen 210 further includes a light-emitting layer 211 and a protective layer, wherein the light-emitting layer 211 includes a transparent cover plate and a display panel, and the protective layer may include a buffer layer 212 and a copper layer 214 That is, the display screen 210 includes a transparent cover plate, a display panel, a buffer layer and a copper layer in sequence from top to bottom, wherein the buffer layer 212 and the copper layer 214 can be fixed by glue 213 .
  • the display screen 210 is provided with a window penetrating through the buffer layer 330 and the copper layer 340 .
  • the display screen may be an OLED organic light-emitting panel made of low temperature polysilicon technology (Low Temperature Poly-silicon, LTPS), which has ultra-thin thickness, light weight, and low power consumption, and can be used to provide a clearer display. image.
  • the middle frame 220 may be used to carry or support various devices or components in the electronic device 300.
  • the devices or components include but are not limited to batteries, cameras, antennas, motherboards and the display screen.
  • the buffer layer 212 may also be referred to as a screen print layer or an embossed layer, and the screen print layer may have graphics and texts, and the graphics and texts may be used as logos such as trademark patterns.
  • the buffer layer 212 may be a black flake layer or a printed layer for shielding light.
  • the buffer layer 212 may be a layered structure formed of a foam material.
  • the copper layer 214 may also be referred to as a heat dissipation layer (used to reduce the temperature of the display screen) or an anti-radiation layer.
  • the buffer layer 212 and the copper layer 214 may be combined to form the rear panel of the display screen, or the copper layer 214 may be referred to as the rear panel of the display screen.

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Biology (AREA)
  • Evolutionary Computation (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Artificial Intelligence (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

本申请实施例提供了一种芯片封装结构和电子设备，该芯片封装结构包括：指纹传感器芯片，用于接收经由该显示屏上方的人体手指返回的指纹光信号，该指纹光信号用于检测该手指的指纹信息；环境光传感器芯片，用于接收该电子设备的环境光信号，该环境光信号用于检测该电子设备的环境光强度；电路板，该指纹传感器芯片和该环境光传感器芯片封装于该电路板；隔挡结构，设置于该指纹传感器芯片和该环境光传感器芯片之间，用于阻止该指纹传感器芯片与该环境光传感器芯片之间发生光线串扰。

Description

芯片封装结构和电子设备 技术领域
本申请实施例涉及芯片封装领域，并且更具体地，涉及一种芯片封装结构和电子设备。
背景技术
随着移动通讯设备的发展，环境光传感器成为电子设备标配的传感器。但目前的环境光传感器在电子设备中的分布以及安装尺寸不利于电子设备朝着轻薄化的方向发展。
发明内容
本申请实施例提供了一种芯片封装结构和电子设备，有利于电子设备朝着轻薄化的方向发展。
第一方面，提供了一种芯片封装结构，适用于具有显示屏的电子设备并且固定设置于该显示屏的下方，该芯片封装结构包括：指纹传感器芯片，用于接收经由该显示屏上方的人体手指返回的指纹光信号，该指纹光信号用于检测该手指的指纹信息；环境光传感器芯片，用于接收该电子设备的环境光信号，该环境光信号用于检测该电子设备的环境光强度；电路板，该指纹传感器芯片和该环境光传感器芯片封装于该电路板；隔挡结构，设置于该指纹传感器芯片和该环境光传感器芯片之间，用于阻止该指纹传感器芯片与该环境光传感器芯片之间发生光线串扰。
通过将指纹传感器芯片和环境光传感器芯片封装在一起，无需单独的环境光检测模组，从而可以起到节约电子设备空间，减少电子设备的整机结构设计的难度，有利于电子设备朝着轻薄化的方向发展，同时可以降低电子设备的成本。
同时通过在指纹传感器芯片和环境光传感器芯片之间设置隔挡结构，可以阻止指纹传感器芯片和环境光传感器芯片之间的光线串扰，尤其是在强光下的光线串扰，从而可以提高检测性能。
在一种可能的实现方式中，该芯片封装结构还包括：补强板，设置于该电路板的下方；该电路板的上表面向下延伸并贯通该电路板以形成两个开窗， 该指纹传感器芯片和该环境光传感器芯片分别固定设置于该两个开窗内。
通过在电路板设置两个开窗，并将指纹传感器芯片和环境光传感器芯片固定设置于电路板的两个凹槽内，从而可以进一步减薄芯片封装结构的厚度，以节约所占电子设备的空间。
在一种可能的实现方式中，该显示屏的发光层的下表面设置有保护层，该保护层设置有一个开窗，该指纹传感器芯片和该环境光传感器芯片对准该一个开窗设置，以便该指纹传感器芯片和该环境光传感器芯片通过该一个开窗接收透过该显示屏的光信号，该隔挡结构从下到上依次包括该电路板和泡棉层，该泡棉层固定于该发光层的下表面。
采用显示屏开一个窗，增加芯片封装结构的泡棉层的厚度来形成隔挡结构，既可以保证隔挡效果，又可以减少显示屏的加工成本。
在一种可能的实现方式中，该显示屏的发光层的下表面设置有保护层，该保护层设置有两个开窗，该指纹传感器芯片和该环境光传感器芯片分别对准该两个开窗设置，以便该指纹传感器芯片和该环境光传感器芯片通过对应的开窗接收透过该显示屏的光信号，该隔挡结构从下到上依次包括该电路板和泡棉层，该泡棉层固定于该保护层的下表面。
采用显示屏开两个窗，使得显示屏的保护层与芯片封装结构中的泡棉共同形成隔挡结构，既可以保证隔挡效果，又不需要增加芯片封装结构的成本。
在一种可能的实现方式中，该指纹传感器芯片和该环境光传感器芯片具有公共的元器件布置区域，和/或该指纹传感器芯片和该环境光传感器芯片共用一个连接器。
相比于将环境光传感器芯片单独设置的方案，本申请实施例的芯片封装结构通过共用连接器或元器件布置区域，可以进一步降低工艺成本，从而更有利于电子设备的整机设计和电子设备的轻薄化发展。
在一种可能的实现方式中，该芯片封装结构还包括：遮光层，分别形成在该指纹传感器芯片的边缘区域的上表面和该环境光传感器芯片的边缘区域的上表面，其中，该遮光层不遮挡该指纹传感器芯片的感应区域和该环境光传感器芯片的感应区域，该遮光层用于阻止该指纹传感器芯片的边缘区域对该指纹传感器芯片的感应区域造成光线串扰以及该环境光传感器芯片的边缘区域对该环境光传感器芯片的感应区域造成光线串扰。
通过在芯片上表面的边缘区域设置遮光层，以此来降低边缘区域对感应 区域的光线串扰，从而可以进一步提高检测性能。
在一种可能的实现方式中，该芯片封装结构还包括：指纹驱动芯片，用于配合该指纹传感器芯片进行指纹识别；其中，该指纹驱动芯片封装于该电路板。
将指纹驱动芯片和指纹传感器芯片封装于同一电路板，可以节约占用电子设备的空间，从而有利于电子设备朝着轻薄化的方向发展。
在一种可能的实现方式中，该指纹传感器芯片还包括指纹驱动电路。
将指纹驱动功能和指纹检测功能集成在一个芯片中，能够进一步减小芯片封装结构的尺寸，使得芯片封装结构更加简洁，从而具有更高的可靠性。
在一种可能的实现方式中，该芯片封装结构还包括：光路层，设置于该指纹传感器芯片的上方；该指纹传感器芯片用于接收经由该显示屏上方的人体手指返回的并通过该光路层引导的指纹光信号。
在一种可能的实现方式中，该芯片封装结构还包括：滤光片，设置于该环境光传感器芯片的上方，用于透过该环境光中与该环境光传感器芯片中的像素对应的波段。
在一种可能的实现方式中，该隔挡结构的宽度范围为0.2-25mm。
将隔挡结构的宽度范围设置在0.2-25mm之间，可以在满足阻止光线串扰的情况下，尽可能的减少物料，从而减少电子设备的成本以及降低电子设备整机的设计难度。
在一种可能的实现方式中，该隔挡结构的宽度范围为0.6-5mm。
将隔挡结构的宽度范围设置在0.6-5mm，能够更优地在满足阻止光线串扰的情况下，尽可能的降低成本，从而提高电子设备的性能。
第二方面，提供了一种芯片封装结构，适用于具有显示屏的电子设备并且设置于该显示屏的下方，该芯片封装结构包括：指纹传感器芯片，用于接收经由该显示屏上方的人体手指返回的指纹光信号，该指纹光信号用于检测该手指的指纹信息；环境光传感器芯片，用于接收该电子设备的环境光信号，该环境光信号用于检测该电子设备的环境光强度；电路板，该指纹传感器芯片和该环境光传感器芯片封装于该电路板；其中，该指纹传感器芯片和该环境光传感器芯片之间的距离大于或等于预设值，以使得该指纹传感器芯片与该环境光传感器芯片之间不发生光线串扰。
通过在指纹传感器芯片和环境光传感器芯片之间增加可行的距离，进一 步地，可以通过算法过滤串扰影响，从而在保证检测性能的同时可以减少芯片封装结构的成本。
在一种可能的实现方式中，该预设值基于以下参数中的至少一种确定：该指纹传感器芯片的感光区域和该环境光传感器芯片的感光区域的尺寸、该指纹传感器芯片所需的视场角FOV和该环境光传感器芯片所需的FOV的距离、该指纹传感器芯片的避让FOV和该环境光传感器芯片的避让FOV的安全距离、该显示屏到该指纹传感器芯片的上表面以及该显示屏到该环境光传感器芯片的上表面的距离。
在一种可能的实现方式中，该预设值为0.4-25mm。
通过将预设值设置在0.4-25mm之间，可以在满足阻止光线串扰的情况下，尽可能的减小芯片封装结构的尺寸。
在一种可能的实现方式中，该芯片封装结构还包括：补强板，设置于该电路板的下方；该电路板的上表面向下延伸并贯通该电路板以形成两个开窗，该指纹传感器芯片和该环境光传感器芯片分别固定设置于该两个开窗内。
在一种可能的实现方式中，该指纹传感器芯片和该环境光传感器芯片具有公共的元器件布置区域，和/或该指纹传感器芯片和该环境光传感器芯片共用一个连接器。
在一种可能的实现方式中，该芯片封装结构还包括：遮光层，分别形成在该指纹传感器芯片的边缘区域的上表面和该环境光传感器芯片的边缘区域的上表面，其中，该遮光层不遮挡该指纹传感器芯片的感应区域和该环境光传感器芯片的感应区域，该遮光层用于阻止该指纹传感器芯片的边缘区域对该指纹传感器芯片的感应区域造成光线串扰以及该环境光传感器芯片的边缘区域对该环境光传感器芯片的感应区域造成光线串扰。
在一种可能的实现方式中，该芯片封装结构还包括：指纹驱动芯片，用于配合该指纹传感器芯片进行指纹识别；其中，该指纹驱动芯片封装于该电路板。
在一种可能的实现方式中，该指纹传感器芯片还包括指纹驱动电路。
第三方面，提供了一种电子设备，包括：显示屏；如第一方面或第一方面中任一种可能的实现方式中该的芯片封装结构，该芯片封装结构固定设置于该显示屏的下方。
在一种可能的实现方式中，该显示屏从上到下依次包括透明盖板、显示 面板、缓冲层和铜层，其中，该显示屏设置有贯通该缓冲层和该铜层的开窗，该芯片封装结构对准该开窗设置，以便该指纹传感器芯片和该环境光传感器芯片通过该开窗接收透过该显示屏的光信号。
在一种可能的实现方式中，该电子设备还包括：中框，该中框的上表面向下延伸形成有凹槽，该芯片封装结构固定设置于该中框的凹槽内。
第四方面，提供了一种电子设备，包括：显示屏；如第二方面或第二方面中任一种可能的实现方式中该的芯片封装结构，该芯片封装结构固定设置于该显示屏的下方。
在一种可能的实现方式中，该显示屏从上到下依次包括透明盖板、显示面板、缓冲层和铜层，其中，该显示屏设置有贯通该缓冲层和该铜层的开窗，该芯片封装结构对准该开窗设置，以便该指纹传感器芯片和该环境光传感器芯片通过该开窗接收透过该显示屏的光信号。
在一种可能的实现方式中，该电子设备还包括：中框，该中框的上表面向下延伸形成有凹槽，该芯片封装结构固定设置于该中框的凹槽内。
附图说明
图1示出了本申请实施例的电子设备的示意图。
图2示出了本申请实施例的芯片封装结构的示意性结构图。
图3示出了本申请实施例中芯片之间的串扰路径的示意图。
图4示出了本申请实施例中芯片之间的串扰路径的示意图。
图5示出了本申请实施例的芯片封装结构的另一示意性结构图。
图6示出了本申请实施例的芯片封装结构的再一示意性结构图。
图7示出了本申请实施例的芯片封装结构的再一示意性结构图。
图8示出了本申请实施例的芯片封装结构的再一示意性结构图。
图9示出了图8所示的芯片封装结构的俯视图。
图10示出了图5所示的芯片封装结构的俯视图。
图11示出了图6所示的芯片封装结构的俯视图。
图12示出了本申请实施例的电子设备的示意性结构图。
图13示出了本申请实施例的电子设备的示意性结构图。
具体实施方式
下面将结合附图，对本申请实施例中的技术方案进行描述。
作为一种常见的应用场景，本申请实施例的技术方案可以应用于智能手机、平板电脑以及其他具有显示屏的电子设备中，更具体地，在上述电子设备中，该芯片封装结构可以设置在显示屏下方的局部区域。
需要说明的是，为便于说明，在本申请的实施例中，相同的附图标记表示相同的部件，并且为了简洁，在不同实施例中，省略对相同部件的详细说明。应理解，附图示出的本申请实施例中的各种部件的厚度、长宽等尺寸，以及集成装置的整体厚度、长宽等尺寸仅为示例性说明，而不应对本申请构成任何限定。
随着移动通讯设备的发展，指纹传感器和环境光传感器(Ambient Light Sensors，ALS)成为电子设备标配的传感器。随着全面屏时代的到来，指纹传感器和环境光传感器需要设置在显示屏下方以实现屏下指纹识别以及环境光检测。
指纹传感器，是具有光学感应阵列的指纹传感器芯片，其中，光学感应阵列包括多个光学感应单元，每个光学感应单元可以具体包括光探测器或者光电传感器。或者说，指纹传感器可以包括光探测器(Photo detector)阵列(或称为光电探测器阵列、光电传感器阵列)，其包括多个呈阵列式分布的光探测器。具体地，该指纹传感器用于接收经由显示屏上方的人体手指返回的指纹光信号，以检测手指的指纹信息。
环境光传感器，具体可以是光感测器，例如，该光感测器包括但不限于是至少一个光电二极管。具体地，该环境光传感器用于接收穿过显示屏后的环境光信号，以检测环境光强度。
通常，指纹传感器所在的模组(例如光学指纹模组)分布在电子设备的下半部的屏下区域，如图1中所示的区域101，而环境光传感器所在的模组(例如环境光检测模组)主要分布在电子设备的上半部，例如，“刘海”、中框与显示屏之间的窄缝、显示区域104上方的屏下区域，如图1所示的区域102和103。由于目前的环境光检测模组采用平面网格阵列(Land Grid Array，LGA)封装方式或者方形扁平无引脚(Quad Flat No-leads，QFN)封装方式，其在厚度方向上较厚，一般大于0.5mm，限制了其在中框与显示屏之间的应用，另外，由于在电子设备的整机设计时，会优先考虑摄像头，主板，扬声器，振动马达等较大元件的布置，因此环境光传感器的布置比较受限，从而 不利于电子设备朝着轻薄化的方向发展。
因此，本申请实施例提供了一种芯片封装结构，将指纹传感器芯片和环境光传感器芯片封装在一起，从而可以起到节约电子设备空间，减少电子设备的整机结构设计的难度，有利于电子设备朝着轻薄化的方向发展，同时可以降低电子设备的成本。
本申请实施例所提供的芯片封装结构适用于具有显示屏的电子设备中，具体地，该芯片封装结构可以设置在显示屏的下方。可选地，显示屏可以为自发光显示屏，其采用具有自发光的显示单元作为显示像素。比如显示屏可以为有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏或者微型发光二极管(Micro-LED)显示屏。此外，显示屏还可以具体为触控显示屏，其不仅可以进行画面显示，还可以检测用户的触摸或者按压操作，从而为用户提供一个人机交互界面。比如，在一种实施例中，电子设备可以包括触摸传感器，所述触摸传感器可以具体为触控面板(Touch Panel，TP)，其可以设置在所述显示屏表面，也可以部分集成或者整体集成到所述显示屏120内部，从而形成所述触控显示屏。
图2示出了本申请实施例提供的一种芯片封装结构的示意性框图。具体地，如图2所示，该芯片封装结构包括：
指纹传感器芯片201，用于接收经由显示屏210上方的人体手指返回的指纹光信号，指纹光信号用于检测所述手指的指纹信息；
环境光传感器芯片202，用于接收电子设备的环境光信号，该环境光信号用于检测电子设备的环境光强度；
电路板203，指纹传感器芯片201和环境光传感器芯片202封装于电路板203；
在本申请实施例中，指纹传感器芯片201和环境光传感器芯片202为未封装的裸芯片(die)，或者也可以称为裸晶片，二者均封装于电路板203，即指纹传感器芯片201和环境光传感器芯片202电连接至电路板203。例如，指纹传感器芯片201和环境光传感器芯片202可以通过金线209电连接至电路板203。换句话说，指纹传感器芯片201和环境光传感器芯片202可以通过电路板203实现与其他外围电路或者电子设备中的其他元件的典型互连和信号传输。
如果将指纹传感器芯片201和环境光传感器芯片202封装在一起，指纹 传感器芯片201和环境光传感器芯片202之间可能会发生光线串扰。例如，指纹传感器芯片201的表面反射的光信号可能会被环境光传感器芯片202接收到，从而对检测环境光造成影响。类似地，环境光传感器芯片202的表面反射的光信号可能会被指纹传感器芯片201接收到，从而对指纹成像造成影响。
如图3所示，当指纹传感器芯片201不工作，而环境传感器芯片202工作时，入射到指纹传感器芯片201表面的光信号P1反射至显示屏210，经过显示屏210再次反射之后的光信号P2入射到环境光传感器芯片202的感光区域，当环境光传感器芯片202基于透过显示屏210直接入射到其感光区域的光信号进行电子设备的环境光强度检测时，光信号P2会对环境光检测造成干扰。
如图3所示，当环境光传感器芯片202不工作，而指纹传感器芯片201工作时，入射到环境光传感器芯片202表面的光信号P3反射至显示屏210，经过显示屏210再次反射之后的光信号P4入射到指纹传感器芯片201的感光区域，当指纹传感器芯片201基于由显示屏210上方的人体手指返回的指纹光信号进行指纹检测时，光信号P4会对指纹检测造成干扰。
因此，本申请实施例提供的芯片封装结构还包括：隔挡结构204，设置于指纹传感器芯片201和环境光传感器芯片202之间，用于阻止指纹传感器芯片201和环境光传感器芯片202之间发生光线串扰。
在一种实施例中，该电路板203可以是柔性电路板，即柔性印制电路(Flexible Printed Circuit，FPC)，进一步地，该芯片封装结构还可以包括：补强板205，电路板203可以固定设置于补强板205的上方，例如，电路板203的下表面通过双面胶固定于补强板205的上表面。
可选地，指纹传感器芯片201和环境光传感器芯片202可以固定设置于电路板203的上表面，例如，指纹传感器芯片201和环境光传感器芯片202的下表面分别通过胶层固定于电路板203的上表面。
可选地，电路板203还可以设置有开窗，例如，电路板203的上表面向下延伸并贯通电路板203以形成两个开窗，指纹传感器芯片201和环境光传感器芯片202分别固定在电路板203的两个凹槽中。也就是说，指纹传感器芯片201和环境光传感器芯片分别固定在补强板205的上表面，而电路板203分别围绕指纹传感器芯片201和环境光传感器芯片202设置，例如，指纹传 感器芯片201和环境光传感器芯片通过芯片贴合胶(Die Attach Film，DAF)固定于补强板205的上表面。
在另一种实施例中，该电路板203可以是基板。例如，该基板从上到下依次可以包括第一覆盖层、第一导电层、基材层、第二导电层以及第二覆盖层，基板的上表面在第一区域向下延伸并贯通第一覆盖层和第一导电层以形成两个凹槽，指纹传感器芯片201和环境光传感器芯片202可以分别固定设置于两个凹槽内，基板的上表面在第二区域向下延伸并贯通第一覆盖层以形成基板的焊盘，指纹传感器芯片201和环境光传感器芯片202分别连接到焊盘，以实现电连接。
可选地，基板的焊盘数量可以是一个，设置在指纹传感器芯片201和环境光传感器芯片202之间。或者，也可以为指纹传感器芯片201和环境光传感器芯片202分别设置对应的焊盘。
在另一种实施例中，该电路板203还可以是印制电路板(Printed Circuit Board，PCB)或者是其他类型的电路板。
通过将电路板开窗或者将基板的部分层开窗，以使得指纹传感器芯片和环境光传感器芯片设置于开窗内，从而可以减薄芯片封装结构的厚度，进一步地可以节约电子设备的厚度。
下面将结合图5-图8以芯片封装结构包括电路板和补强板为例详细描述本申请实施提供的芯片封装结构。
可选地，在本申请实施例中，该芯片封装结构还包括：光路层230。
光路层230可以设置在该指纹传感器芯片201的上方，该指纹传感器芯片201用于接收经过显示屏210上方的人体手指返回的并通过光路层230引导的指纹光信号。
可选地，光路层230包括透镜层233和光路引导层232，透镜层233用于将经由所述显示屏上方的人体手指返回的光信号会聚至光路引导层232，光路引导层232将透镜层233会聚的光信号引导至指纹传感器芯片201。
透镜层233可以具有由多个微透镜形成的微透镜阵列，其可以通过半导体生长工艺或者其他工艺形成在指纹传感器芯片201的感应阵列上方，并且每一个微透镜可以分别对应于所述感应阵列的其中一个或多个感应单元。透镜层233和所述感应单元之间还可以形成其他光学膜层，比如介质层或者钝化层，更具体地，透镜层233和所述感应单元之间还可以包括具有微孔的挡 光层(例如，光路引导层232)，其中所述微孔形成在其对应的微透镜和感应单元之间，所述挡光层可以阻挡相邻感应单元之间的光学干扰，并使光线通过所述微透镜汇聚到所述微孔内部并经由所述微孔传输到所述微透镜对应的感应单元，以进行光学指纹成像。
可选地，该光路层230还可以是具有高深宽比的通孔阵列的光学准直器(Collimator)层。所述光学准直器层可以具体为在半导体硅片制作而成的准直器层，其具有多个准直单元或者微孔，所述准直单元可以具体为小孔，从手指反射回来的反射光中，垂直入射到所述准直单元的光线可以穿过并被其下方的传感器芯片接收，而入射角度过大的光线在所述准直单元内部经过多次反射被衰减掉，因此所述传感器芯片基本只能接收到其正上方的指纹纹路反射回来的反射光，能够有效提高图像分辨率，进而提高指纹识别效果。
需要说明的是，上述光路层的几种实现方案可以单独使用也可以结合使用，比如，可以在所述光学准直器层下方进一步设置透镜层。当然，在所述准直器层与所述透镜层结合使用时，其具体叠层结构或者光路可能需要按照实际需要进行调整。
可选地，该芯片封装结构还可以包括第一滤光片，该第一滤光片可以设置在指纹传感器芯片201的上方，例如，该第一滤光片可以设置在指纹传感器芯片201的上表面。再例如，该第一滤光片还可以设置在指纹传感器芯片201与光路层230之间，也可以设置在光路层内部或上方，本申请对此不作具体限定。
可选地，该芯片封装结构还可以包括第二滤光片234，该第二滤光片可以设置在环境光传感器芯片202的上方，例如，该第二滤光片可以设置在环境光传感器芯片202的上表面。
在本申请实施例中，第一滤光片用于来减少指纹感应中的不期望的环境光，以提高指纹传感器芯片201对接收到的光信号的光学感应。第一滤光片具体可以用于过滤掉特定波长的光，例如，近红外光和部分的红光等。例如，人类手指吸收波长低于580nm的光的能量中的大部分，如果一个或多个光学过滤器或光学过滤层被设计为过滤波长从580nm至红外的光，则可以大大减少环境光对指纹感应中的光学检测的影响。在具体实现中，滤光片可以包括一个或多个光学过滤器，一个或多个光学过滤器可以配置为例如带通过滤器，以允许OLED屏发射的光的传输，同时阻挡太阳光中的红外光等其他光组分。
第二滤光片234则用来透过环境光中与环境光传感器芯片202包括的像素所对应的波段。例如，若环境光传感器芯片包括红外光像素，那么第二滤光片234用来过滤掉环境光中的可见光，并透过环境光中的红外光；若环境光传感器芯片包括红光像素、蓝光像素以及绿光像素等可见光像素，那么第二过滤片234可以用来过滤掉环境光中的红外光，并透过环境光中的可见光。
滤光片可以实现为例如光学过滤涂层，光学过滤涂层形成在一个或多个连续界面上，或可以实现为一个或多个离散的界面上。例如，第一滤光片可以是直接设计在透镜层233上的涂层，以避免指纹传感器芯片201获取的指纹图像中出现牛顿环。可选地，此外，滤光片的进光面可以设置有光学无机镀膜或有机黑化涂层，以使得滤光片的进光面的反射率低于第一阈值，例如1％，从而能够保证指纹传感器芯片201和环境光传感器芯片202能够接收到足够的光信号，进而提升指纹识别效果和环境光检测效果。
可选地，对于本申请实施例中的环境光传感器芯片202来说，也可以包括其他光路结构。例如，包括与指纹传感器芯片201中所应用的光路层。本申请实施例对此不作限定。
可选地，在本申请实施例中，该芯片封装结构还包括：第一泡棉层206。该第一泡棉层206可以固定设置于电路板203的上表面。例如，该第一泡棉层206可以通过固定胶固定设置在电路板203的上表面。可选地，固定胶可以是双面胶。在其他可替代的实施例中，该第一泡棉层206和固定胶可以合并为一层。例如，在制作该第一泡棉层206的过程中，可以同时在第一泡棉层206的下表面形成胶层。
进一步地，所述第一泡棉层206通过所述双面胶固定在所述电路板的上表面时，所述第一泡棉层206还可以设置有两个窗口，第一泡棉层206的两个窗口可以分别对准电路板203的两个窗口设置。由此，指纹传感器芯片201和环境光传感器芯片202可以接收到透过显示屏210的光信号。更进一步地，第一泡棉层206的两个窗口的窗口尺寸可以小于或等于电路板203的两个窗口的窗口尺寸。例如，第一泡棉层206的两个窗口的窗口尺寸可以分别小于对应于电路板203的窗口的窗口尺寸，且分别大于或等于位于电路板203的两个窗口内的指纹传感器芯片201的进光面的尺寸和环境光传感器芯片202的进光面的尺寸。
可选地，在本申请实施例中，该芯片封装结构还包括：遮光层208。
可选地，遮光层208可以至少分别形成在指纹传感器芯片201和环境光传感器芯片202的边缘区域的上表面，其中，遮光层208部分遮挡指纹传感器芯片201和环境光传感器芯片202的边缘区域，并且不遮挡指纹传感器芯片201和环境光传感器芯片202的感应区域，遮光层208用于阻止指纹传感器芯片201的边缘区域对指纹传感器芯片201的感应区域造成光线串扰以及环境光传感器芯片202的边缘区域对环境光传感器芯片202的感应区域造成光线串扰。具体地，遮光层208用于阻止指纹传感器芯片201的非感应区域对指纹传感器芯片201的感应区域造成光线串扰以及环境光传感器芯片202的非感应区域对环境光传感器芯片202的感应区域造成光线串扰。
可选地，遮光层208可以部分包裹滤光片的边缘区域，以使得滤光片和遮光层能够完全滤除非目标波段的光信号，透过指纹传感器芯片201和环境光传感器芯片202所需的目标波段的光信号。
当然，在其他可替代实施例中，也可以利用滤光片替代所述遮光层208。
可选地，遮光层208可以是油墨，或者也可以是其他遮光材料。
可选地，在本申请实施例中，该芯片封装结构还包括：金线209，指纹传感器芯片201和环境光传感器芯片202通过金线209连接到电路板203。
可选地，指纹传感器芯片201和环境光传感器芯片202可以通过固定胶固定安装于电路板203的两个开窗内。该固定胶包括但不限于热固胶。该固定胶不仅可以固定指纹传感器芯片201和环境光传感器芯片202，还可以用于封装金线209。
需要说明的是，用于环境光传感器芯片与电路板之间电连接的金线并未在附图中示意出来，也就是说，附图仅仅是用来示意性阐述本申请技术方案，并不用于限定。
可选地，电路板203和补强板205之间可以通过胶层241，例如，该胶层241可以是双面胶。
本申请实施例中将指纹传感器芯片201和环境光传感器芯片202封装在一起，可以有效地降低组装工序，并且可以减少该芯片封装结构的厚度，尤其是针对环境光传感器芯片而言，下面将结合图5-图8以及表1，示意性说明一下该芯片封装结构中的各叠层分别在A-A、B-B、C-C以及D-D处的厚度。
表1
Figure PCTCN2021075661-appb-000001
其中，未说明厚度的，可以根据客户需求及实际生产需求调整。
可选地，在本申请实施例中，以显示屏210为OLED屏为例，显示屏210可以是软屏也可以是硬屏。当手指放于亮屏的OLED屏上方，手指就会反射OLED屏发出的光，此反射光需要穿透OLED屏直到指纹传感器芯片201，或者环境光也需要穿透OLED屏直到环境光传感器芯片202，由于OLED屏的发光层下方会设置保护层，该保护层为不透光材料，为了能将上述反射光和环境光分别引导至指纹传感器芯片201和环境光传感器芯片202，则需要将保护层在指纹传感器芯片201和环境光传感器芯片202的安装位置处设置开窗，以使得上述反射光和环境光能分别到达指纹传感器芯片201和环境光传感器芯片202。
可选地，由于本申请实施例中的指纹传感器芯片201和环境光传感器芯片202封装于同一个电路板203，因此，该指纹传感器芯片201和该环境光传感器芯片202可以具有公共的元器件布置区域，例如用于放置电容、电阻和电感等被动元件的区域。可选地，该指纹传感器芯片201和该环境光传感器芯片202也可以具有同一个连接器。例如，可以在电路板203的一端设置连接器，所述连接器294可以用于与外部装置或者所述电子设备的其它部件(例如主板)进行连接，进而实现与所述外部装置的通信或者所述电子设备的其它部件的通信。例如，所述连接器294可以用于连接所述电子设备的处理器，以便于所述电子设备的处理器接收经过指纹传感器芯片201检测到的指纹信息，并基于所述处理过的指纹信息进行指纹识别。
相比于将环境光传感器芯片单独设置的方案，本申请实施例的芯片封装结构可以进一步降低工艺成本，从而更有利于电子设备的整机设计和电子设备的轻薄化发展。
图5示出了本申请实施例的一种芯片封装结构的示意性结构图。
可选地，如图5所示，该保护层设置有一个开窗，指纹传感器芯片201和环境光传感器芯片202对准该一个开窗设置，隔挡结构204可以固定于补强板205上表面，并且隔挡结构204从下到上依次包括电路板203和泡棉层，该泡棉层固定于显示屏210的发光层的下表面。
可选地，隔挡结构204中的泡棉层可以是上述第一泡棉层206向上延伸至发光层的下表面形成，也可以是在上述第一泡棉层206的上表面再设置第二泡棉层，如图5中所示的第二泡棉层231，可选地，该第二泡棉层231也可以不是泡棉材料，可以是橡胶等其他材质的挡光材料。
图6示出了本申请实施例的另一种芯片封装结构的示意性结构图。
可选地，如图6所示，该保护层设置有两个开窗，指纹传感器芯片201和环境光传感器芯片202分别对准该两个开窗设置，隔挡结构204可以固定于补强板205上表面，并且隔挡结构204从下到上依次包括电路板203和泡第一泡棉层，该第一泡棉层固定于显示屏210的保护层的下表面。
通过在指纹传感器芯片和环境光传感器芯片之间设置隔挡结构，可以阻止指纹传感器芯片和环境光传感器芯片之间的光线串扰，从而可以提高检测性能。
可选地，如图5和图6所示，该芯片封装结构还包括：指纹驱动芯片207，该指纹驱动芯片207用于配合指纹传感器芯片201进行指纹识别。该指纹驱动芯片207也封装于电路板203。
其中，该指纹驱动芯片207可以与指纹传感器芯片201设置在同一个开窗内，例如，该指纹驱动芯片207可以固定设置于补强板205的上表面，并且通过金线209电连接至电路板203，以使得指纹驱动芯片207连接至指纹传感器芯片201。
可选地，如图7所示，该芯片封装结构也可以不包括指纹驱动芯片207，而在指纹传感器芯片201中集成指纹驱动电路，换句话说，指纹传感器芯片201既可以实现指纹驱动的功能，又能实现指纹识别的功能。
可选地，在本申请实施例中，隔挡结构204的宽度范围为0.2-25mm，进一步地，该隔挡结构的宽度范围为0.6-5mm。
将隔挡结构的宽度范围设置一定范围内，能够更优地在满足阻止光线串扰的情况下，尽可能的降低成本，从而提高电子设备的性能。
图8示出了本申请实施例的另一种芯片封装结构的示意性结构图。
在图8所示的芯片封装结构中，不包括隔挡结构204，而是通过设计指纹传感器芯片201和环境光传感器芯片202之间的距离大于或等于预设值，以使得指纹传感器芯片201和环境光传感器芯片202之间不发生光线串扰。
可选地，该预设值可以基于如图3和图4所示的参数中的至少一种确定：所述指纹传感器芯片的感光区域和所述环境光传感器芯片的感光区域的尺寸A、所述指纹传感器芯片所需的视场角(angleofview,FOV)和所述环境光传感器芯片所需的FOV的距离C、所述指纹传感器芯片的避让FOV和所述环境光传感器芯片的避让FOV的安全距离B、所述显示屏到所述指纹传感器芯片的上表面以及所述显示屏到所述环境光传感器芯片的上表面的距离D。
可选地，该预设值的范围在0.4-25mm之间，例如，该预设值为4.28。
环境光传感器芯片和指纹传感器芯片之间的光线串扰，串扰光照度与经过屏幕后的总照度占比，成一定的百分比，芯片之间的距离越近，占比越大。从路径上看，透过显示屏开窗边缘光线的大角度光最容易产生串扰，这种光经过芯片表面的反射距离更远，从光路形成的角度说明，芯片之间距离越远，芯片之间的光线串扰越小。
图8所示的芯片封装结构，可以不增加隔挡结构204，通过在指纹传感器芯片201和环境光传感器芯片202之间增加可行的距离，进一步地，可以通过算法过滤串扰影响，从而在保证检测性能的同时可以减少芯片封装结构的成本。
图9为图8所示的芯片封装结构的俯视图，图10为图5所示的芯片封装结构的俯视图，图11为图6所示的芯片封装结构的俯视图。可选地，如图9和图10所示，指纹传感器芯片201和环境光传感器芯片202之间的隔挡结构204的宽度为2mm。可选地，该隔挡结构204的极限泡棉宽度最小为0.8mm。可选地，如图9-图11所示，指纹传感器芯片201和环境光传感器芯片202之间的距离为4.28。
可选地，该芯片封装结构的边长范围可以是10-50mm，例如，如图9-11所示，该芯片封装结构的长22.98mm，宽13.78mm。
需要说明的是，上述尺寸仅仅是示意性描述，当处于不同应用环境时，上述尺寸均可以调整。
另外，本申请实施例中的隔挡结构也不限于附图所示的形状，例如，该 隔挡结构的俯视图可以是圆形或者方形。
可选地，本申请实施例提供的芯片封装结构可以放置在显示屏下方的任意位置。并且芯片与芯片之间的摆放位置也不受限，例如，可以将指纹传感器芯片的感光区域放置在显示屏的中心位置，而指纹驱动芯片和环境光传感器芯片可以放置在指纹传感器芯片的任意侧。不同位置关系在性能上影响极小，主要会产生的影响在于芯片封装结构的尺寸大小以及受限于整机应用的结构环境。
可选地，本申请实施例还提供了一种电子设备，包括显示屏210和上述各种实施例提供的芯片封装结构，其中，芯片封装结构固定设置于显示屏210的下方。
可选地，该电子设备还包括中框220，其中芯片封装结构固定于显示屏210和中框220之间。
图12和图13示出了本申请实施例的电子设备的示意性结构图。
如图12所示，芯片封装结构通过固定胶固定于显示屏210的下表面。例如，芯片封装结构中的泡棉层206的上表面与显示屏的下表面固定粘接。
如图13所示，芯片封装结构还通过固定胶固定于中框220的上表面。例如，芯片封装结构中的补强板205与电子设备的中框220的上表面固定粘接。可选地，中框220的上表面向下延伸形成有凹槽，芯片封装结构的下表面固定于中框220的凹槽内。
通过将芯片封装结构固定于中框凹槽内，可以节约电子设备的空间，从而有利于电子设备朝着轻薄化的方向发展。
由于本申请实施例提供的芯片封装结构比较轻薄，在需要将芯片封装结构设置于中框的凹槽中时不至于中框的凹槽深度过大而降低中框强度。
可选地，如图12和图13所示，该显示屏210还包括发光层211和保护层，其中该发光层211包括透明盖板和显示面板，保护层可以包括缓冲层212和铜层214，也就是说，该显示屏210从上到下依次包括透明盖板、显示面板、缓冲层和铜层，其中缓冲层212和铜层214之间可以通过胶213固定。所述显示屏210设置有贯通所述缓冲层330和所述铜层340的开窗。可选地，所述显示屏可以是采用低温多晶硅技术(Low Temperature Poly-silicon，LTPS)制成的OLED有机发光面板，其厚度超薄、重量轻、低耗电，可以用于提供较为清晰的影像。所述中框220可以用于承载或支撑所述电子设备300中的 各个器件或部件。所述器件或部件包括但不限于电池、摄像头、天线、主板以及所述显示屏。
缓冲层212也可以称为屏幕印刷(screen print)层或压花层，所述屏幕印刷层可以带有图文，所述图文可以用作商标图案等标识。所述缓冲层212可以是用于遮蔽光的黑色片状层或者印刷层。例如，所述缓冲层212可以是由泡棉材料形成层结构。铜层214也可以称为散热层(用作降低所述显示屏的温度)或者防辐射层。所述缓冲层212和所述铜层214可以合成为所述显示屏的后面板，或者所述铜层214称为所述显示屏的后面板。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (26)

  1. 一种芯片封装结构，其特征在于，适用于具有显示屏的电子设备并且固定设置于所述显示屏的下方，所述芯片封装结构包括：
    指纹传感器芯片，用于接收经由所述显示屏上方的人体手指返回的指纹光信号，所述指纹光信号用于检测所述手指的指纹信息；
    环境光传感器芯片，用于接收所述电子设备的环境光信号，所述环境光信号用于检测所述电子设备的环境光强度；
    电路板，所述指纹传感器芯片和所述环境光传感器芯片封装于所述电路板；
    隔挡结构，设置于所述指纹传感器芯片和所述环境光传感器芯片之间，用于阻止所述指纹传感器芯片与所述环境光传感器芯片之间发生光线串扰。
  2. 根据权利要求1所述的芯片封装结构，其特征在于，所述芯片封装结构还包括：
    补强板，设置于所述电路板的下方；
    所述电路板的上表面向下延伸并贯通所述电路板以形成两个开窗，所述指纹传感器芯片和所述环境光传感器芯片分别固定设置于所述两个开窗内。
  3. 根据权利要求2所述的芯片封装结构，其特征在于，所述显示屏的发光层的下表面设置有保护层，所述保护层设置有一个开窗，所述指纹传感器芯片和所述环境光传感器芯片对准所述一个开窗设置，以便所述指纹传感器芯片和所述环境光传感器芯片通过所述一个开窗接收透过所述显示屏的光信号，所述隔挡结构从下到上依次包括所述电路板和泡棉层，所述泡棉层固定于所述发光层的下表面。
  4. 根据权利要求2所述的芯片封装结构，其特征在于，所述显示屏的发光层的下表面设置有保护层，所述保护层设置有两个开窗，所述指纹传感器芯片和所述环境光传感器芯片分别对准所述两个开窗设置，以便所述指纹传感器芯片和所述环境光传感器芯片通过对应的开窗接收透过所述显示屏的光信号，所述隔挡结构从下到上依次包括所述电路板和泡棉层，所述泡棉层固定于所述保护层的下表面。
  5. 根据权利要求1所述的芯片封装结构，其特征在于，所述指纹传感器芯片和所述环境光传感器芯片具有公共的元器件布置区域，和/或所述指纹传感器芯片和所述环境光传感器芯片共用一个连接器。
  6. 根据权利要求1所述的芯片封装结构，其特征在于，所述芯片封装结构还包括：
    遮光层，分别形成在所述指纹传感器芯片的边缘区域的上表面和所述环境光传感器芯片的边缘区域的上表面，其中，所述遮光层不遮挡所述指纹传感器芯片的感应区域和所述环境光传感器芯片的感应区域，所述遮光层用于阻止所述指纹传感器芯片的边缘区域对所述指纹传感器芯片的感应区域造成光线串扰以及所述环境光传感器芯片的边缘区域对所述环境光传感器芯片的感应区域造成光线串扰。
  7. 根据权利要求1所述的芯片封装结构，其特征在于，所述芯片封装结构还包括：
    指纹驱动芯片，用于配合所述指纹传感器芯片进行指纹识别；
    其中，所述指纹驱动芯片封装于所述电路板。
  8. 根据权利要求1所述的芯片封装结构，其特征在于，所述指纹传感器芯片还包括指纹驱动电路。
  9. 根据权利要求1所述的芯片封装结构，其特征在于，所述芯片封装结构还包括：
    光路层，设置于所述指纹传感器芯片的上方；
    所述指纹传感器芯片用于接收经由所述显示屏上方的人体手指返回的并通过所述光路层引导的指纹光信号。
  10. 根据权利要求1所述的芯片封装结构，其特征在于，所述芯片封装结构还包括：
    滤光片，设置于所述环境光传感器芯片的上方，用于透过所述环境光中与所述环境光传感器芯片中的像素对应的波段。
  11. 根据权利要求1所述的芯片封装结构，其特征在于，所述隔挡结构的宽度范围为0.2-25mm。
  12. 根据权利要求11所述的芯片封装结构，其特征在于，所述隔挡结构的宽度范围为0.6-5mm。
  13. 一种芯片封装结构，其特征在于，适用于具有显示屏的电子设备并且设置于所述显示屏的下方，所述芯片封装结构包括：
    指纹传感器芯片，用于接收经由所述显示屏上方的人体手指返回的指纹光信号，所述指纹光信号用于检测所述手指的指纹信息；
    环境光传感器芯片，用于接收所述电子设备的环境光信号，所述环境光信号用于检测所述电子设备的环境光强度；
    电路板，所述指纹传感器芯片和所述环境光传感器芯片封装于所述电路板；
    其中，所述指纹传感器芯片和所述环境光传感器芯片之间的距离大于或等于预设值，以使得所述指纹传感器芯片与所述环境光传感器芯片之间不发生光线串扰。
  14. 根据权利要求13所述的芯片封装结构，其特征在于，所述预设值基于以下参数中的至少一种确定：所述指纹传感器芯片的感光区域和所述环境光传感器芯片的感光区域的尺寸、所述指纹传感器芯片所需的视场角FOV和所述环境光传感器芯片所需的FOV的距离、所述指纹传感器芯片的避让FOV和所述环境光传感器芯片的避让FOV的安全距离、所述显示屏到所述指纹传感器芯片的上表面以及所述显示屏到所述环境光传感器芯片的上表面的距离。
  15. 根据权利要求13所述的芯片封装结构，其特征在于，所述预设值的范围为0.4-25mm。
  16. 根据权利要求13所述的芯片封装结构，其特征在于，所述芯片封装结构还包括：
    补强板，设置于所述电路板的下方；
    所述电路板的上表面向下延伸并贯通所述电路板以形成两个开窗，所述指纹传感器芯片和所述环境光传感器芯片分别固定设置于所述两个开窗内。
  17. 根据权利要求13所述的芯片封装结构，其特征在于，所述指纹传感器芯片和所述环境光传感器芯片具有公共的元器件布置区域，和/或所述指纹传感器芯片和所述环境光传感器芯片共用一个连接器。
  18. 根据权利要求13所述的芯片封装结构，其特征在于，所述芯片封装结构还包括：
    遮光层，分别形成在所述指纹传感器芯片的边缘区域的上表面和所述环境光传感器芯片的边缘区域的上表面，其中，所述遮光层不遮挡所述指纹传感器芯片的感应区域和所述环境光传感器芯片的感应区域，所述遮光层用于阻止所述指纹传感器芯片的边缘区域对所述指纹传感器芯片的感应区域造成光线串扰以及所述环境光传感器芯片的边缘区域对所述环境光传感器芯 片的感应区域造成光线串扰。
  19. 根据权利要求13所述的芯片封装结构，其特征在于，所述芯片封装结构还包括：
    指纹驱动芯片，用于配合所述指纹传感器芯片进行指纹识别；
    其中，所述指纹驱动芯片封装于所述电路板。
  20. 根据权利要求13所述的芯片封装结构，其特征在于，所述指纹传感器芯片还包括指纹驱动电路。
  21. 一种电子设备，其特征在于，包括：
    显示屏；
    如权利要求1至12中任一项所述的芯片封装结构，固定设置于所述显示屏下方。
  22. 根据权利要求21所述的电子设备，其特征在于，所述显示屏从上到下依次包括透明盖板、显示面板、缓冲层和铜层，其中，所述显示屏设置有贯通所述缓冲层和所述铜层的开窗，所述芯片封装结构对准所述开窗设置，以便所述指纹传感器芯片和所述环境光传感器芯片通过所述开窗接收透过所述显示屏的光信号。
  23. 根据权利要求21或22所述的电子设备，其特征在于，所述电子设备还包括：
    中框，所述中框的上表面向下延伸形成有凹槽，所述芯片封装结构固定设置于所述中框的凹槽内。
  24. 一种电子设备，其特征在于，包括：
    显示屏；
    如权利要求13至20中任一项所述的芯片封装结构，设置于所述显示屏下方。
  25. 根据权利要求24所述的电子设备，其特征在于，所述显示屏从上到下依次包括透明盖板、显示面板、缓冲层和铜层，其中，所述显示屏设置有贯通所述缓冲层和所述铜层的开窗，所述芯片封装结构对准所述开窗设置，以便所述指纹传感器芯片和所述环境光传感器芯片通过所述开窗接收透过所述显示屏的光信号。
  26. 根据权利要求24或25所述的电子设备，其特征在于，所述电子设备还包括：
    中框，所述中框的上表面向下延伸形成有凹槽，所述芯片封装结构固定设置于所述中框的凹槽内。
PCT/CN2021/075661 2021-02-05 2021-02-05 芯片封装结构和电子设备 WO2022165775A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2021/075661 WO2022165775A1 (zh) 2021-02-05 2021-02-05 芯片封装结构和电子设备
CN202180005446.1A CN114556452B (zh) 2021-02-05 2021-02-05 芯片封装结构和电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/075661 WO2022165775A1 (zh) 2021-02-05 2021-02-05 芯片封装结构和电子设备

Publications (1)

Publication Number Publication Date
WO2022165775A1 true WO2022165775A1 (zh) 2022-08-11

Family

ID=81669942

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/075661 WO2022165775A1 (zh) 2021-02-05 2021-02-05 芯片封装结构和电子设备

Country Status (2)

Country Link
CN (1) CN114556452B (zh)
WO (1) WO2022165775A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116233286B (zh) * 2022-12-30 2023-12-01 哈尔滨海格科技发展有限责任公司 一种光接收模组、光电传感装置和电子设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1752912A2 (en) * 2001-08-21 2007-02-14 Sony Corporation Fingerprint detection device and method of its manufacture, and apparatus for f orming a projective film
CN106537315A (zh) * 2016-08-09 2017-03-22 深圳信炜科技有限公司 电容式传感器、电容式传感装置、和电子设备
CN107068627A (zh) * 2016-02-10 2017-08-18 台湾积体电路制造股份有限公司 装置封装件以及用于形成装置封装件的方法
CN207123851U (zh) * 2017-09-21 2018-03-20 广东欧珀移动通信有限公司 后置指纹识别组件及移动终端

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN208940022U (zh) * 2018-10-30 2019-06-04 维沃移动通信有限公司 一种屏下指纹采集结构及移动终端
CN209297322U (zh) * 2018-12-13 2019-08-23 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN110770749B (zh) * 2019-03-21 2021-09-03 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN209729912U (zh) * 2019-06-20 2019-12-03 信利光电股份有限公司 一种设有屏下光学指纹模组的oled显示装置
CN210864756U (zh) * 2019-11-04 2020-06-26 深圳市汇顶科技股份有限公司 光学指纹装置和电子设备
CN211427367U (zh) * 2020-02-17 2020-09-04 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN214477442U (zh) * 2021-02-05 2021-10-22 深圳市汇顶科技股份有限公司 芯片封装结构和电子设备

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1752912A2 (en) * 2001-08-21 2007-02-14 Sony Corporation Fingerprint detection device and method of its manufacture, and apparatus for f orming a projective film
CN107068627A (zh) * 2016-02-10 2017-08-18 台湾积体电路制造股份有限公司 装置封装件以及用于形成装置封装件的方法
CN106537315A (zh) * 2016-08-09 2017-03-22 深圳信炜科技有限公司 电容式传感器、电容式传感装置、和电子设备
CN207123851U (zh) * 2017-09-21 2018-03-20 广东欧珀移动通信有限公司 后置指纹识别组件及移动终端

Also Published As

Publication number Publication date
CN114556452A (zh) 2022-05-27
CN114556452B (zh) 2023-05-02

Similar Documents

Publication Publication Date Title
EP3731137B1 (en) Fingerprint recognition apparatus and electronic device
EP3770802B1 (en) Fingerprint recognition device and electronic device
EP3267359A1 (en) Fingerprint sensor, fingerprint sensing system, and sensing system using light sources of display panel
EP3739508B1 (en) Fingerprint identification apparatus and electronic device
KR20180005588A (ko) 디스플레이 패널의 광원들을 이용한 지문 센서, 지문 센서 패키지 및 지문 센싱 시스템
EP3842991B1 (en) Optical fingerprint apparatus and electronic device
EP3889828B1 (en) Fingerprint recognition apparatus and electronic device
EP3913523B1 (en) Fingerprint recognition apparatus and electronic device
WO2020150939A1 (zh) 指纹识别装置和电子设备
WO2020243926A1 (zh) 光学指纹装置和电子设备
CN214477442U (zh) 芯片封装结构和电子设备
WO2020177032A1 (zh) 指纹识别装置和电子设备
CN210072654U (zh) 显示面板及电子设备
WO2022165775A1 (zh) 芯片封装结构和电子设备
EP3789913B1 (en) Fingerprint detection apparatus and electronic device
CN211529180U (zh) 指纹检测装置和电子设备
EP3780092B1 (en) Chip packaging structure and electronic device
CN209911987U (zh) 指纹识别装置和电子设备
CN216250726U (zh) 芯片封装结构和电子设备
CN111788576A (zh) 指纹检测装置和电子设备
WO2019119245A1 (zh) 光学通路调制器及制造方法、图像识别传感器和电子设备
WO2020244082A1 (zh) 光学指纹装置、制作方法和电子设备
CN115705740A (zh) 光学指纹芯片及其加工方法、电子设备
KR20220017015A (ko) 지문 센서와 그를 포함한 표시 장치

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21923790

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21923790

Country of ref document: EP

Kind code of ref document: A1