CN110168712B - Test model for measuring transfer position in semiconductor or display system field and precise transfer measurement method - Google Patents
Test model for measuring transfer position in semiconductor or display system field and precise transfer measurement method Download PDFInfo
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- CN110168712B CN110168712B CN201780077231.4A CN201780077231A CN110168712B CN 110168712 B CN110168712 B CN 110168712B CN 201780077231 A CN201780077231 A CN 201780077231A CN 110168712 B CN110168712 B CN 110168712B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Abstract
A test model for measuring a transfer position in the field of a semiconductor or a display system includes a model body, a pinhole image measuring unit, a slit image measuring unit, and a central processing unit, whereby the height of a slit can be measured so as to prevent a detection object from colliding with the slit in a storage box, and even if a reference point is not formed, it is determined whether or not the detection object is normally transferred to a position to be transferred in a manufacturing apparatus by lifting a pinhole.
Description
Technical Field
The present invention relates to a test model for measuring a transfer position in the field of semiconductors or display systems, and a precise transfer measurement method using the test model for measuring a transfer position.
Background
Tens of thousands to billions of electronic component semiconductor elements are formed on very small chips.
An important material for forming such semiconductor devices is a wafer. The wafer is a disk-shaped plate of a single crystal or the like obtained by growing silicon, gallium arsenide (GaAs), or the like.
Such a wafer is subjected to various manufacturing processes for manufacturing semiconductor elements to form materials such as transistors and diodes on the surface and can arrange hundreds of chips.
In such a manufacturing process, a transfer robot is used to transfer wafers corresponding to each manufacturing step.
Among them, conventionally, a method or apparatus for judging whether or not to transfer a wafer to a proper position by using a test wafer has been developed, and as such an example, there are proposed korean patent publication No. 10-2010-0054908 (name of the invention: an automobile teaching origin measuring method through a camera field of view) and korean patent publication No. 10-2003-00806976 (name of the invention: a jig for measuring a height of a chuck for wafer test).
However, the conventional wafer transfer method and apparatus including the above patent document are required to separately form a reference point for whether or not the wafer is properly transferred to the transfer apparatus.
In which devices where fiducial marks are not formed require the fabrication of additional fiducial marks, thereby increasing manufacturing costs and time.
In addition, although there has been conventionally a method of confirming whether or not a jig provided in accordance with the kind of the wafer is accurately positioned, in this method, first, it is necessary to additionally produce a jig in accordance with the kind of the wafer.
For example, in a state in which wafers are stored in the wafer-use operation container divided by the same slit, when the stored wafers are taken out from the transfer robot, the side surfaces of the wafers are prevented from being damaged, but a device for detecting the side surfaces of such wafers so as to prevent the side surfaces of the wafers has not been developed.
In addition, in the case where it is necessary to detect vibration applied to a manufacturing apparatus or temperature and humidity around the manufacturing apparatus during transfer of a wafer, conventionally, a unit capable of detecting such a condition is not required to be formed in the manufacturing apparatus, and therefore, it is necessary to separately form a detection unit with the manufacturing apparatus, and an increase in cost and space efficiency due to the separate formation occur.
In addition, in the above-described apparatus and method, in general, the system is applied to a bluetooth communication system, and short-range communication is not possible in comparison with a wide device environment, and a large amount of data cannot be transmitted.
In the above description, although only the wafer is described, it is necessary to provide a test apparatus for determining whether or not the wafer is normally transferred even when a Photo mask (Photo mask) having a rectangular shape or other manufacturing processes such as a liquid crystal Panel (LCD Panel) are used.
Disclosure of Invention
Technical problem
The present invention relates to a test apparatus for confirming whether a test object moves normally by using an image measuring apparatus, wherein the height of a slit is measured so as to prevent the test object from colliding with the slit stored and in the test apparatus, and whether the test object is normally transferred to a position to be transferred in a manufacturing apparatus is judged by using a lift pin hole without forming an additional reference point, a test model for transferring position measurement used in the field of a semiconductor or a display system, and a precision transfer measurement method using the test model for transferring position measurement.
Means for solving the problems
The test model for transfer position measurement according to an embodiment of the present invention is suitable for an apparatus used in the field of a semiconductor or display system, including: a storage case for loading a detection object; an object fixing device including a fixing unit for fixing the detection object; and a transfer robot for transferring the detection object in the storage box to the fixing unit, the transfer robot comprising: the size of the model body is the same as that of the detection object body; a pinhole image measuring unit for identifying or photographing a plurality of guide pinholes formed in the fixing unit; a slit image measuring unit configured to recognize or photograph a slit of the storage box disposed at an upper end of the model body so as to measure a gap between the slit of the storage box disposed at the upper end of the model body and the model body in a state where the model body is stored in the storage box; and a central processing unit for transmitting the information measured by the pinhole image measuring unit to an image processing computer prepared in advance.
The present invention provides a precise transfer measurement method using the test model for transfer position measurement, wherein the test model for transfer position measurement is suitable for an apparatus used in the field of a semiconductor or a display system, including: a storage case for loading a detection object; an object fixing device including a fixing unit for fixing the detection object; and a transfer robot configured to transfer the detection object in the storage box to the fixing unit, the transfer position measurement test model including: the size of the model body is the same as that of the detection object body; a pinhole image measuring unit for identifying or photographing a plurality of guide pinholes formed in the fixing unit; a slit image measuring unit configured to recognize or photograph a slit of the storage box disposed at an upper end of the model body so as to measure a gap between the slit of the storage box disposed at the upper end of the model body and the model body in a state where the model body is stored in the storage box; and a central processing unit configured to transmit information measured by the pinhole image measuring unit or the slit image measuring unit to an image processing computer prepared in advance, wherein the precise transfer position measuring method using the test model for transfer position measurement includes: a step (1) of placing the test model for measuring the transfer position stored in the storage box on the transfer robot; a step (2) of transferring the test model for transfer position measurement to an upper end portion of the fixing unit by the transfer robot in the step (1); a step (3) of the pinhole image measuring device identifying or capturing the guide pinholes of the fixing unit for the test model for measurement of the transfer position transferred to the upper end portion of the fixing unit in the step (2); a step (4) of transmitting the image recognized or photographed in the step (3) to the central processing unit; a step (5) of transmitting the image transmitted to the central processing unit in the step (4) to the image processing computer; and (6) determining whether the test pattern for transfer position measurement can be placed at a predetermined position of the fixing unit based on the image transferred to the image processing computer in the step (5), and grasping whether or not the center of the test pattern for transfer position measurement is accurately aligned with the center of the guide pin hole.
Effects of the invention
The test model for transfer position measurement used in the field of semiconductor or display systems and the precise transfer measurement method using the test model for transfer position measurement according to the present invention are applicable to an apparatus used in the field of conductors or display systems, which includes: a storage case for mounting on a detection object; an object fixing device including a fixing unit for fixing the detection object; and a transfer robot configured to transfer the detection object in the storage box to the fixing unit, the transfer position measurement test model including: a model body having the same size as the detection object body; a pinhole image measuring unit for identifying or photographing a plurality of guide pinholes formed in the fixing unit; a slit image measuring unit that recognizes or photographs a slit of the storage box disposed at an upper end of the model body so as to measure a gap between the slit of the storage box disposed at the upper end of the model body and the model body in a state where the model body is stored in the storage box; and a central processing unit for transmitting information measured by the pinhole image measuring unit or the slit image measuring unit to a pre-prepared image processing computer, wherein the image measuring unit is used to confirm whether the detection object moves normally or not by the test device, the height of the slit is measured in such a manner that the detection object is prevented from colliding with the slit in the storage box, and even if the detection object is not formed as a reference point, the detection object is judged whether to move normally to a position to be moved by lifting the pinhole in the manufacturing device.
Drawings
Fig. 1 is a perspective view schematically showing an environment of a transfer robot and a process chamber, which are prepared to use a test model for transfer position measurement according to a first embodiment of the present invention.
Fig. 2 is a view of a test model for transfer position measurement according to the first embodiment of the present invention from above.
Fig. 3 is a plan view of a test model for measuring a transfer position according to a first embodiment of the present invention, as seen from the front.
Fig. 4 is a view of the interior of the processing chamber of the first embodiment of the invention from above.
Fig. 5 is a diagram schematically showing a state in which the pinhole image measuring device according to the first embodiment of the present invention recognizes a guide pinhole and the center of the test model for transfer position measurement is different from the center of the guide pinhole formed in the fixing unit.
Fig. 6 is a diagram schematically showing a state in which the hole image measuring means according to the first embodiment of the present invention recognizes a guide pinhole and the center of the test model for transfer position measurement is different from the center of the guide pinhole formed in the fixing unit.
Fig. 7 is a diagram schematically showing a state in which a test model for transfer position measurement according to the first embodiment of the present invention recognizes a guide pin hole at an appropriate position.
Fig. 8 is a diagram schematically showing a state in which the slit image measurement component of the first embodiment of the present invention recognizes one side slit and the other side slit.
Fig. 9 is a flowchart of a method for accurately confirming the position of a test model for measuring the transfer position of a storage box, which is safely drawn out of the storage box or put in the storage box by using the transfer robot according to the first embodiment of the present invention.
Fig. 10 is a method of measuring whether or not the center of a test pattern for measuring a transfer position transferred to a fixed unit by a transfer robot according to the first embodiment of the present invention is exactly the same as the center of the guide pin hole formed in the fixed unit.
Fig. 11 is an enlarged view of a portion a of fig. 8 according to the first embodiment of the present invention.
Fig. 12 is a plan view of a test model for measuring a transfer position in which a contamination detection camera according to a second embodiment of the present invention is formed, as viewed from the front.
Fig. 13 is an enlarged view of a state in which an image sensor for pinhole photographing according to the third embodiment of the present invention is in contact with a fixed unit.
Fig. 14 is an enlarged view of a state in which a screen member of the fourth embodiment of the present invention is in contact with a fixing unit.
Fig. 15 is a diagram of a test model for transfer position measurement including a front camera component according to a fifth embodiment of the present invention, as viewed from above.
Detailed Description
Hereinafter, a test model for measuring a transfer position and a precise transfer measurement method using the test model for measuring a transfer position according to an embodiment of the present invention will be described with reference to the drawings.
Fig. 1 is a perspective view schematically showing an environment of a transfer robot and a process chamber, which are prepared to use a test model for transfer position measurement according to an embodiment of the present invention. Fig. 2 is a view of the test model for transfer position measurement according to the first embodiment as viewed from above. Fig. 3 is a plan view of a test model for measuring a transfer position according to a first embodiment of the present invention, as seen from the front. Fig. 4 is a view of the interior of the processing chamber of the first embodiment of the invention from above. Fig. 5 is a diagram schematically showing a state in which the pinhole image measuring device according to the first embodiment of the present invention recognizes a guide pinhole and the center of the test model for transfer position measurement is different from the center of the guide pinhole formed in the fixing unit. Fig. 6 is a diagram schematically showing a state in which the hole image measuring means according to the first embodiment of the present invention recognizes a guide pinhole and the center of the test model for transfer position measurement is different from the center of the guide pinhole formed in the fixing unit. Fig. 7 is a diagram schematically showing a state in which a test model for transfer position measurement according to the first embodiment of the present invention recognizes a guide pin hole at an appropriate position. Fig. 8 is a diagram schematically showing a state in which the slit image measurement component of the first embodiment of the present invention recognizes one side slit and the other side slit. Fig. 9 is a flowchart of a method for accurately confirming the position of a test model for measuring the transfer position of a storage box, which is safely drawn out of the storage box or put in the storage box by using the transfer robot according to the first embodiment of the present invention. Fig. 10 is a method of measuring whether or not the center of a test pattern for measuring a transfer position transferred to a fixed unit by a transfer robot according to the first embodiment of the present invention is exactly the same as the center of the guide pin hole formed in the fixed unit. Fig. 11 is an enlarged view of a of fig. 8 according to the first embodiment of the present invention.
Referring to fig. 1 to 11, a test model 100 for transfer position measurement used in the field of a semiconductor or display system is an apparatus suitable for use in the field of a semiconductor or display system including: a storage box 10 in which a user loads a detection object 50; an object fixing device 25 including a fixing unit 27 for fixing the detection object 50; and a transfer robot 30 for transferring the detection object 50 of the storage box 10 to the fixing unit 27, the transfer robot including: a model body 110 having the same size as the detection object 50; a pinhole image measuring unit 120 for identifying or photographing a plurality of guide pinholes 22 formed in the fixing unit 27; and a central processing unit 140 for transmitting the information measured by the pinhole image measuring unit 120 to the image processing computer 60 prepared in advance.
The test model 100 for transfer position measurement is suitable for use in a device used in the field of a semiconductor or display system including: a storage case 10 for loading a detection object 50; an object fixing device 25 including a fixing unit 27 for fixing the detection object 50; and a transfer robot 30 for transferring the detection object 50 of the storage box 10 to the fixing unit 27, the transfer robot including: a model body 110 having the same size as the detection object 50; a slit image measuring unit 130 that can identify or capture the slits 11, 12 of the storage box 10 disposed at the upper end of the model body 110 so as to measure the distance between the slits 11, 12 of the storage box 10 disposed at the upper end of the model body 110 and the model body 110 in a state where the model body 110 is stored in the storage box 10; and a central processing unit 140 for transmitting the information measured by the pinhole image measuring unit 120 to the image processing computer 60 prepared in advance.
The test model 100 for transfer position measurement may include a model body 110, a pinhole image measuring unit 120, a central processing unit 140, or the model body 110, a slit image measuring unit 130, and a central processing unit 140, and may include the model body 110, the pinhole image measuring unit 120, the slit image measuring unit 130, and the central processing unit 140. Hereinafter, for convenience of explanation, the test model 100 for measuring the transfer position, which includes the model body 110, the pinhole image measuring unit 120, the slit image measuring unit 130, and the central processing unit 140, will be described as an example.
Referring to fig. 1 to 11, the test model 100 for measuring a transfer position according to the present embodiment includes a model body 110, a pinhole image measuring unit 120, a slit image measuring unit 130, and a central processing unit 140.
The test model 100 for measuring the transfer position may further include a detection unit 150.
The test model 100 for measuring the transfer position can detect whether the object 50 is transferred normally by using a test apparatus for confirming whether the object 50 is transferred normally by using an image measuring apparatus method.
The detection object 50 is usually in the shape of a wafer formed of a circular thin plate in the present embodiment, but may be a rectangular mask or a liquid crystal panel according to the purpose.
Such a test model 100 for transfer position measurement is suitable for use in a device used in the field of a semiconductor or display system including: a storage case 10 for loading a detection object 50; an object fixing device 25 including a fixing unit 27 for fixing the detection object 50; and a transfer robot 30 for transferring the detection object 50 of the storage box 10 to the fixing unit 27.
The storage box 10 is divided into slits 11, 12 having the same width, and each slit 11, 12 having the same width stores the individual detection object 50, and the detection object 50 is transferred to another apparatus by a transfer container (FOUP, front Opening Unified Pod) stored before transfer.
The object fixing device 25 is disposed in the processing chamber 20 installed in a space where the process is performed as the detection object 50, and the fixing means 27 for fixing the detection object 50 is formed.
For example, when the object 50 is a wafer, such a fixing unit 27 may be an electrostatic chuck (ESC, electro static chuck) for fixing the object 50 by electrostatic force, a Clamping (chucking) device based on a fastening method of engagement, or the like.
A guide pinhole 22 is formed in a lower portion of the fixing unit 27, and the fixing unit 27 is extended by a predetermined length in the guide pinhole 22, thereby being in contact with a bottom surface of the detection object 50 to support the detection object 50.
In general, there are 3 or more such fixing units 27, and it is necessary to be identical to the center of the detection object 50 in which a plurality of fixing units 27 are placed in the fixing unit 27, so that the detection object 50 can be formed accurately, thereby reducing defective products during the process.
If the centers of the plurality of fixing units 27 are not the same as the centers of the detection object 50 placed on the fixing units 27, the detection object 50 is abnormally formed, and thus a large number of defective products occur during the process.
The model body 110 has the same size as the detection object 50 in place of the detection object 50 to confirm whether the detection object 50 is moving normally, for example, if the detection object 50 is a wafer and is a circular thin plate, the model body 110 is also a circular thin plate.
When such an edge of the mold body 110 is stored in the storage box 10, it can be placed in the slits 11, 12.
The pinhole image measuring unit 120 can recognize or photograph the plurality of guide pinholes 22 formed in the object fixing device 25, and is formed by a plurality of pinhole cameras 121, 122, 123 that measure the plurality of guide pinholes 22, respectively.
The pinhole imaging cameras 121, 122, 123 are preset with the recognition ranges or imaging ranges of the guide pinholes, and reference numerals 124, 125, 126 shown in fig. 5 are used to identify the recognition ranges or imaging ranges of the guide pinholes 22 corresponding to the pinhole imaging cameras 121, 122, 123, respectively.
In the present embodiment, 3 guide pinholes 22 are formed, and in order to identify such guide pinholes 22, the pinhole image measuring unit 120 may include a first pinhole imaging camera 121, a second pinhole imaging camera 122, and a third pinhole imaging camera 123. However, a plurality of guide pinholes 22 may be formed, and a plurality of pinhole imaging cameras 121, 122, 123 may be formed.
In detail, the first pinhole-shooting camera 121 recognizes or shoots a portion corresponding to the first range 124, the second pinhole-shooting camera 122 recognizes or shoots a portion corresponding to the second range 125, and the third pinhole-shooting camera 123 recognizes or shoots a portion corresponding to the third range 126.
In the formed state, when the transfer robot 30 transfers the test model 100 for transfer position measurement to the upper end portion of the object fixing device 25, the pinhole capturing cameras 121, 122, 123 capture the first, second, and third ranges 124, 125, 126.
Wherein each of the ranges 124, 125, 126 is a position adjacent to its corresponding guide pinhole 22.
As described above, when the captured image is transferred from the central processing unit 140 to the image processing computer 60, the image processing computer 60 calculates the position value of the guide pinhole 22 and calculates the center 23 of the guide pinhole using the position value of the guide pinhole 22.
Wherein, the first range 124, the second range 125 and the third range 126 identify the guide pinhole 22 in the captured image by using a visual (Vision) technique for distinguishing color shading.
The guide pin hole 22 exhibits a darker color than the surrounding area, and thus, a relatively darker portion can be determined as the position of the guide pin hole 22 in the images captured in the respective first, second, and third ranges 124, 125, 126.
The positions of the guide pinholes 22 captured in the first, second, and third ranges 124, 125, 126 are output as position values, and the center 23 of the guide pinhole is calculated using the position values.
If the center 23 of the guide pin hole is the same as the center 127 of the test pattern 100 for transfer position measurement, the test pattern 100 for transfer position measurement is accurately transferred to the fixing unit 27.
However, as shown in fig. 5 or 6, if the center 23 of the guide pin hole obtained by the vision technique is not the same as the center 127 of the test pattern for transfer position measurement, it is determined that the test pattern 100 for transfer position measurement is not accurately transferred to the fixing unit 27. Further, by determining the inclination of a line segment connecting the center 127 of the test pattern for transfer position measurement and the center 23 of the guide pin hole in the image processing computer 60, it is possible to calculate a modified position value at which the test pattern 100 for transfer position measurement is accurately transferred to the fixing unit 27.
Specifically, for example, when the coordinate value of the center 127 of the test model 100 for transfer position measurement is (0, 0), the (x 1, y 1) of the position value of the guide pinhole 22 measured in the first range 124 is measured as (-2.3), the (x 2, y 2) of the position value of the guide pinhole 22 measured in the second range 125 is measured as (2, 5), and the (x 3, y 3) of the position value of the guide pinhole 22 measured in the third range 126 is (0, -2), the (x 0, y 0) of the position value of the guide pinhole 22 is calculated by calculating the weight center 
To obtain the product. If the position value of the guide pinhole 22 is obtained by using the expression, the position value is obtained by +.>
By obtaining (0, 2), the center 23 of the guide pin hole can be obtained. Further, if the inclination is obtained by connecting (0, 0) of the coordinate value of the center 127 of the test pattern 100 for transfer position measurement and (0, 2) of the calculated coordinate value of the center 23 of the guide pinhole by a line segment, and the distance is obtained, a modified position value of the test pattern 100 for transfer position measurement to the fixing unit 27 can be calculated accurately.
In the present embodiment, the number of the guide pinholes 22 is 3, and the number of the pinhole photographing cameras 121, 122, 123 is limited to 3, so that the centers of the guide pinholes 22 can be calculated even if more than 2 guide pinholes 22 are recognized, and thus, the number of the guide pinholes 22 and the number of the pinhole photographing cameras can be different to calculate the centers.
The slit image measuring means 130 recognizes or photographs the slits 11 and 12 of the storage box 10 disposed at the upper end of the model body 110 so as to measure the distance between the slits 11 and 12 of the storage box 10 disposed at the upper end of the model body 110 and the model body 110 in a state where the model body 110 is stored in the storage box 10, and forms a diameter line of the model body 110.
In detail, the slit image measuring part 130 includes one side slit cameras 131 and the other side slit cameras 132 capable of recognizing the one side slit 11 and the other side slit 12 disposed at the upper ends of the two sides of the mold body 110, and recognition ranges or photographing ranges of the one side slit 11 and the other side slit 12 are preset in the one side slit cameras 131 and the other side slit cameras 132, respectively.
In general, the pair of the one-side slit 11 and the other-side slit 12 are positioned on the same horizontal line, and the one-side slit camera 131 and the other-side slit camera 132 are positioned on the same horizontal line.
In the present embodiment, the one-side direction is the side of the one-side slit camera 131 formed with reference to the center 127 of the test pattern 100 for measuring transfer position shown in fig. 8.
As described above, as shown in fig. 8, when the transfer robot 30 is inserted into the bottom surface of the test pattern 100 for transfer position measurement stored in the storage box 10, the test pattern 100 for transfer position measurement is lifted up to a predetermined height, and the one-side slit camera 131 recognizes or photographs the one-side slit 11 disposed at the one-side upper end of the pattern body 110 and transmits the photographed image to the central processing unit 140. The other slit camera 132 recognizes or photographs the other slit 12 disposed at the other upper end of the model body 110, and transmits the photographed image to the central processing unit 140.
The image is then transmitted to the image processing computer 60 using wireless fidelity communication of the central processing unit 140.
Next, the interval between the slit 11, 12 and the test model 100 for measuring the transfer position is obtained by using the image and the slit image measuring unit 130 by using the subsequent calculation method.
The image is then transmitted to the image processing computer 60 using wireless fidelity communication of the central processing unit 140.
Next, the interval between the slit 11, 12 and the test model 100 for measuring the transfer position is obtained by using the image and the slit image measuring unit 130 by using the subsequent calculation method.
H shown in fig. 11 is a value calculated by using the value measured by the slit image measuring unit 130, and the interval value between the slits 11, 12 and the test model 100 for transfer position measurement is compared with a normal comparison value H' stored in advance in the image processing computer 60.
That is, it is determined whether or not the value of H, which is the height value calculated by the measurement, is the same as the value of H' inputted in advance, and it is determined whether or not the transfer robot 30 is used to safely take out the storage box 10 from the outside or put in the test model 100 for transfer position measurement of the storage box 10 into the inside.
h1 is a vertical interval value between the bottom surface of the one-side slit 11 and the model body 110, which is extracted by processing the image of the one-side recognition range 133 photographed in the one-side slit camera 131 by using the visual technique of the image processing computer 60.
d1 is a horizontal distance from the inner surface of the storage box 10 to the one-side slit camera 131, and the value is inputted in advance to the image processing computer 60.
h4 is a half value of the height of the one-side slit 11, and is inputted in advance into the image processing computer 60.
h5 is a vertical distance from the upper end of the model body 110 to the center of the one-side measurement camera 131, and the value is a value input to the image processing computer 60 in advance.
Θ is an operation value of 90 ° excluding the angle from the virtual center line of the direction of photographing by the one-side measurement camera 131 to photographing by the model body 110, and the operation value is input in advance to the image processing computer 60.
h2 is a height value removed from the h1, and the interval obtained by the expression h2=d1 tan (180- θ) is used by the previously inputted θ, and the d1 and θ used for the expression are previously inputted values, and therefore, the h2 is also a previously inputted value.
h3 is obtained by removing the value of h2 from h1 and by the formula h3=h1-h 2.
The H is calculated by substituting the values described above into the following mathematical expression.
H＝h3+h4+h5
When comparing the calculated H value with the value inputted in advance, the transfer position measurement test model 100 determines that a safe operation is performed when the transfer robot 30 takes out the storage box 10 from or puts it into the storage box 10.
In the present embodiment, the example of the measurement method using the one-side slit camera 131 is described, but the other-side slit camera 132 is also applicable to the same measurement method as that of the one-side slit camera 131.
As described above, by comparing the H value calculated on the one slit camera side with the calculated value H measured on the other slit camera side, it is possible to determine whether or not the inclinations of the one side and the other side of the test model 100 for transfer position measurement are parallel.
The difference between the calculated H value measured by the one-side slit camera 131 and the calculated H value measured by the other-side slit camera 132 may be calculated, and based on this, it may be determined whether the transfer position measurement test model 100 has moved accurately.
The central processing unit 140 may transmit information measured by the pinhole image measuring unit 120 or the slit image measuring unit 130 to the image processing computer 60 prepared in advance, and may provide a storage space in which the information may be stored, and may include a wireless fidelity communication module (not shown) capable of transmitting the information to the image processing computer 60.
As described above, when the information is transmitted to the image processing computer 60, communication can be performed by wireless fidelity, and compared with communication based on conventional bluetooth (blue), remote communication can be performed and a large amount of data can be transmitted promptly.
In the present embodiment, the images photographed in the pinhole image measuring unit 120 or the slit image measuring unit 130 and the measured values measured in the detecting unit 150 are transferred to the central processing unit 140 and transferred to the image processing computer 60. However, the cameras 121, 122, 123 of the pinhole image measuring unit 120, the cameras 131, 132 of the slit image measuring unit 130, and the sensors of the detecting unit 150 each have a built-in wireless fidelity chip capable of performing wireless fidelity communication, and information measured or photographed by each camera is transmitted to the image processing computer 60 in an independent form without passing through the central processing unit 140.
In the present embodiment, the calculation for confirming whether or not the test model 100 for measuring the transfer position is normally moved is performed in the image processing computer 60, but only the calculated value is transmitted to the image processing computer 60 by the central processing unit 140 itself.
In the present embodiment, wireless fidelity communication is performed during the communication between the central processing unit 140 and the image processing computer 60, but other wireless communication such as bluetooth, radio Frequency (RF) or the like may be used.
The detecting unit 150 may measure a change in the surrounding environment of the test pattern 100 for measuring the transfer position and an inclination of the test pattern 100 itself for measuring the transfer position.
The inclination of the transfer position measurement test model 100 itself may be the inclination of the transfer position measurement test model 100.
The detection means 150 is formed in the mold body 110, and is incorporated in the detection means 150 as an integral module of a plurality of sensors such as a vibration sensor capable of measuring the vibration of the mold body 110 itself, an inclination sensor capable of measuring the inclination of the test mold 100 itself for measuring the transfer position, a temperature/humidity sensor capable of measuring the temperature/humidity of the periphery of the mold body 110, a gas sensor for measuring whether the periphery of the test mold 100 for measuring the transfer position is gas or not, and a gas pressure sensor for measuring the gas pressure of the periphery of the test mold 100 for measuring the transfer position, and the measurement values measured by the respective sensors are transferred to the central processing means 140 and transferred to the image processing computer 60 or other communication means.
As described above, in the course of transferring the transfer position measurement test model 100, the vibration of the transfer position measurement test model 100 or the device in contact is measured, and the ambient temperature, humidity, and the like of the transfer position measurement test model 100 can be measured, so that the ambient environmental condition is constantly maintained or sudden impact or external environmental change occurs.
Hereinafter, a precise transfer measurement method using the test model 100 for transfer position measurement will be described. In performing such description, description repeated with what has been described in the present invention will be omitted.
Next, a method of accurately measuring the position of the jig placed inside or the test model for measuring the transfer position of the storage box 10 taken out from the outside by the transfer robot 30 (step S100) will be described.
First, the transfer robot 30 lifts the test model 100 for measuring the transfer position stored in the storage box 10 (step S110).
Then, in the step S110, the slit image measuring unit 130 recognizes or photographs the model body 110 of the lifted transfer position measurement test model 100 and the slits 11, 12 at the upper end of the model body 110 (step S120).
In step S120, the recognized or photographed image is transmitted to the central processing unit 140 (step S130).
Next, in the step S130, the image transferred to the central processing unit 140 is transferred to the image processing computer 60 (step S140).
Next, in the step S140, the position of the model body 110 is measured by calculating the interval between the model body 110 and the slits 11, 12 from the image transmitted to the image processing computer 60 (step S150).
As described above, the position of the model body 110 is measured by calculating the distance between the model body 110 and the slits 11, 12, and when the transfer position measurement test model 100 is taken out from the storage box 10 by the transfer robot 30, the distance between the slits 11, 12 is measured so as to prevent collision with the slits 11, 12 in the storage box 10.
That is, the test model 100 for transfer position measurement measures the gap between the slits 11 and 12 so as to prevent collision with the slits 11 and 12 in the storage box 10 instead of the detection object 50, and then, when the detection object 50 in the storage box 10 is taken out by the transfer robot 30, the storage box 10 is taken out stably or is put into the inside for measurement.
Next, a method of measuring the same jig position as the center 23 of the guide pin hole formed in the fixing unit 27 with respect to the center 127 of the test pattern 100 for measuring the transfer position transferred to the fixing unit 27 by the transfer robot 30 (step S200) will be described.
First, the test model 100 for measurement of the transfer position stored in the storage box 10 is transferred to the process chamber 20 and placed in the transfer robot 30 (step S210).
Then, in the step S210, the test model 100 for measuring the transfer position placed on the transfer robot 30 is transferred to the upper end portion of the fixing unit 27 (step S220).
Then, in the test model 100 for measuring the transfer position transferred to the upper end portion of the fixing unit 27 in the step S220, the pinhole image measuring unit 120 recognizes or photographs the guide pinhole 22 of the fixing unit 27 (step S230).
In this step S230, the recognized or photographed image is transmitted to the central processing unit 140 (step S240).
Then, in step S240, the image transferred to the central processing unit 140 is transferred to the image processing computer 60 (step S250).
Then, in step S250, it is determined whether or not the transfer position measurement test model 100 is placed at a predetermined position of the fixing unit 27 based on the image transferred from the image processing computer 60 (step S260).
Conventionally, in order to confirm whether or not the test pattern 100 for measurement of the transfer position is transferred to the appropriate position of the fixing unit 27, a reference point is additionally formed, and as described above, the pinhole image measuring unit 120 recognizes the guide pinhole 22 generally formed in the fixing unit 27 to determine whether or not the center 23 of the guide pinhole coincides with the center 127 of the test pattern 100 for measurement of the transfer position and to measure the transfer position of the test pattern 100 for measurement of the transfer position, it is not necessary to additionally form the reference point.
Mode for carrying out the invention
Hereinafter, a test model for transfer position measurement according to another embodiment of the present invention will be described with reference to the drawings. In performing such a description, a description repeated with what is described in advance in the first embodiment of the present invention will be omitted.
Fig. 12 is a plan view of a test model for measuring a transfer position in which a contamination detection camera according to a second embodiment of the present invention is formed, as viewed from the front.
Referring to fig. 12, a contamination detection camera 260 is formed at the upper end of the model body 210 of the test model 200 for transfer position measurement according to the present embodiment.
The contamination detection camera 260 is formed at the upper end of the model body 210 so as not to block the ranges of the pinhole image measuring unit 220 and the slit image measuring unit 230, and can take the front of the upper end of the model body 210 when operating, and transmit the taken image to a central processing unit or to an image processing computer.
As described above, the contaminated material around the transfer position measurement test model 100 is confirmed by reading the image captured by the contamination detection camera 260. For example, if the chamber is photographed by the contamination detection camera 260, it is possible to confirm whether or not the contamination substance has entered into the inside.
Fig. 13 is an enlarged view of a state in which an image sensor for pinhole photographing according to the third embodiment of the present invention is in contact with a fixed unit.
Referring to fig. 13, a pinhole image sensor 328 for pinhole imaging is formed in the pinhole image measuring device of the test model for transfer position measurement according to the present embodiment.
The pinhole imaging image sensor 328 is formed on the bottom surface of the mold body 310, and converts light into an electrical signal in a state where the imaging fixing unit 27 is in contact.
As shown in fig. 13, when the pinhole imaging image sensor 328 images a state in which the fixing unit 27 is in surface contact with the pinhole imaging image sensor 328, light cannot be projected onto the pinhole imaging image sensor 328 at a portion where the pinhole imaging image sensor 328 and the fixing unit 27 are in surface contact with each other, and light can only be projected onto the periphery. Therefore, the portion of the fixing unit 27 in surface contact is relatively darkened. Accordingly, the dark portion is output as a position value by using a visual technique, and the value is judged as the position of the fixing unit 27.
In this way, the plurality of other fixing units 27 may output a position value, calculate the center of the guide pinhole identical to the center of the fixing unit 27 using the position value, and determine whether or not the test model for transfer position measurement is accurately transferred to the fixing unit 27 using the calculated value.
Fig. 14 is an enlarged view of a state in which a screen member of the fourth embodiment of the present invention is in contact with a fixing unit.
Referring to fig. 14, the pinhole image measuring device of the test model for transfer position measurement according to the present embodiment includes a screen member 429 formed on the bottom surface of the model body 410, the bottom surface being in contact with the fixing unit 27, and outputting the contacted portion as coordinate values.
The screen member 429 may be a touch panel, and if the plurality of fixing units 27 at different positions touch the screen member 429, the parts are respectively outputted in coordinate values, the center of the fixing unit 27 is calculated using the outputted coordinate values, and whether the calculated center of the fixing unit 27 and the center of the test model for transfer position measurement coincide or not is determined to determine whether the test model for transfer position measurement is accurately transferred to the fixing unit 27.
Fig. 15 is a diagram of a test model for transfer position measurement including a front camera component according to a fifth embodiment of the present invention, as viewed from above.
Referring to fig. 15, the test model 500 for transfer position measurement according to the present embodiment includes a model body 510, a pinhole image measuring unit 520, a slit image measuring unit 530, a central processing unit 540, and a front camera unit 560.
The front camera member 560 is attached to the model body 510 so as to be able to observe the movement path of the test model 500 for transfer position measurement, and is preferably attached to both ends of the model body 510 in diameter, as shown in fig. 15.
The front camera unit 560 captures the front of the transfer position measurement test model 500, and transmits the captured image to a pre-prepared imaging system with the operator confirming the captured image. The image system can be an application of a smart phone or a system with a monitor capable of confirming shooting images.
As described above, since the movement path of the test pattern 500 for measuring the transfer position can be observed in real time by the front camera member, whether or not the test pattern 500 for measuring the transfer position is accurately moved can be confirmed in real time. Therefore, it is determined whether or not the robot having the transfer position measurement test model 500 placed thereon is operating normally by the movement path measurement of the transfer position measurement test model 500.
While the present invention has been shown and described with respect to the specific embodiments, it will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit and scope of the invention described in the above claims. Such modifications, variations and structures, however, are intended to be within the scope of the present invention.
Industrial applicability
According to the test model for transfer position measurement and the precision transfer measurement method using the test model for transfer position measurement in the semiconductor or display system field of an embodiment of the present invention, the image measurement device is used to determine whether or not the object to be inspected is moving normally, and the height of the slit is adjusted so as to prevent the object to be inspected from colliding with the slit in the storage box, and even if no additional reference point is formed, it is determined whether or not the object to be inspected is moving normally to the position to be transferred in the manufacturing device by using the lift pin hole, so that the present invention has high industrial applicability.
Claims (5)
1. A test model for transfer position measurement, suitable for use in an apparatus used in the field of semiconductor or display systems, comprising: a storage case for loading a detection object; an object fixing device including a fixing unit for fixing the detection object; and a transfer robot for transferring the detection object in the storage box to the fixing unit, the transfer robot comprising:
the size of the model body is the same as that of the detection object body;
a pinhole image measuring unit capable of recognizing or photographing a plurality of guide pinholes formed in the fixing unit;
a slit image measuring unit configured to recognize or photograph a slit of the storage box disposed at an upper end of the model body so as to measure a gap between the slit of the storage box disposed at the upper end of the model body and the model body in a state where the model body is stored in the storage box; a kind of electronic device with high-pressure air-conditioning system
A central processing unit for transmitting information measured by the pinhole image measuring unit and the slit image measuring unit, respectively, to an image processing computer prepared in advance;
the slit image measuring part comprises a slit camera and a slit camera which can respectively identify a slit arranged at one side and a slit arranged at the other side of the upper end of the two sides of the model body,
The one side slit camera and the other side slit camera exist on the same horizontal line,
when the transfer robot is inserted into the bottom surface of the test model for transfer position measurement stored in the storage box, the one slit camera picks up the one slit arranged at the upper end of one side of the model body and the other slit camera picks up the other slit arranged at the upper end of the other side of the model body,
determining whether the slit and the transfer position measurement test model have the same interval value (H) as a normal comparison value (H') inputted in advance by using a value calculated by the slit image measuring means, thereby determining whether the transfer robot is used to take out the transfer position measurement test model of the storage box from the outside or put in the transfer position measurement test model of the storage box from the inside,
the interval value (H) is calculated from h=h3+h4+h5,
wherein h4 is half of the height of the slit on one side and is a value stored in the image processing computer in advance,
h5 is a vertical distance from the upper end of the model body to the center of the one-side slit camera, and is a value stored in advance in the image processing computer,
h3 is a value obtained by the formula h3=h1-h 2,
wherein h1 is a vertical interval value between the one side slit bottom surface and the model body extracted by processing the image of the one side recognition range photographed in the one side slit camera by using a visual technique of the image processing computer,
h2 is a height value removed from h1, and is a value obtained by the formula h2=d1×tan (90- θ) using θ input in advance,
wherein d1 is a horizontal distance from the inner surface of the storage box to the one-side slit camera, and is a value stored in the image processing computer in advance,
θ is an operation value in 90 ° excluding an angle from a virtual center line of a direction of photographing by the one-side slit camera to photographing of the model body, and is a value inputted in advance in the image processing computer,
by comparing the interval value (H) on the one side slit camera side calculated in the above manner with the interval value (H) on the other side slit camera side calculated in the same manner as the interval value (H) on the one side slit camera side, it is determined whether or not the inclinations of the one side and the other side of the transfer position measurement test model are parallel.
2. The test model for transfer position measurement according to claim 1, wherein the pinhole image measuring means is constituted by a plurality of pinhole cameras for measuring the plurality of guide pinholes formed in the fixing unit, respectively,
the pinhole imaging camera is provided with a recognition range or an imaging range of the guide pinhole in advance.
3. The transfer position measurement test model according to claim 2, wherein the pinhole camera is formed on a bottom surface of the model body, is formed so as to correspond to a predetermined imaging range of the guide pinhole, and is capable of imaging a state in which the pinhole camera is in contact with the fixing unit.
4. The test model for transfer position measurement according to claim 1, wherein the pinhole image measurement means comprises a screen member formed on a bottom surface of the model body, the screen member being capable of contacting the fixing means, and outputting the contacted portion by coordinate values.
5. The transfer position measurement test model according to claim 1, wherein the transfer position measurement test model includes a detection means capable of measuring a change in the surrounding environment of the transfer position measurement test model and an inclination of the transfer position measurement test model itself.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
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| KR10-2017-0015003 | 2017-02-02 | ||
| KR1020170015003A KR101987895B1 (en) | 2017-02-02 | 2017-02-02 | Test dummy for precision transfer position measurement using the semiconductor system or display system and precision transfer position measurement method using the test dummy |
| PCT/KR2017/002240 WO2018143506A1 (en) | 2017-02-02 | 2017-03-02 | Transfer location-measuring test dummy used in semiconductor or display system field and precise transfer measuring method using transfer location-measuring test dummy used in semiconductor or display system field |
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| CN110168712A CN110168712A (en) | 2019-08-23 |
| CN110168712B true CN110168712B (en) | 2023-05-12 |
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| CN201780077231.4A Active CN110168712B (en) | 2017-02-02 | 2017-03-02 | Test model for measuring transfer position in semiconductor or display system field and precise transfer measurement method |
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| KR (1) | KR101987895B1 (en) |
| CN (1) | CN110168712B (en) |
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| KR102162253B1 (en) | 2018-08-01 | 2020-10-06 | 주식회사 미코바이오메드 | Preparation apparatus and operation method thereof |
| KR102034288B1 (en) * | 2019-06-25 | 2019-10-18 | 최치원 | Apparatus for inspecting wafer loading using image |
| US11908722B2 (en) * | 2019-09-09 | 2024-02-20 | Kla Corporation | Automatic teaching of substrate handling for production and process-control tools |
| KR102221447B1 (en) * | 2019-09-24 | 2021-03-02 | 주식회사 커미조아 | Method and apparatus for detecting defects of plate |
| KR102294504B1 (en) * | 2019-12-30 | 2021-08-31 | (주) 예스티 | Test dummy for precision transfer position measurement of substrate |
| KR102240911B1 (en) * | 2020-01-29 | 2021-04-15 | 주식회사 투윈테크 | Position measurement test unit for alignment of gas distribution plate applied to semiconductor or display manufacturing and center alignment method using the position measurement test unit |
| KR102351993B1 (en) * | 2020-02-24 | 2022-01-18 | 주식회사 에스에스엠 | A dummy wafer |
| CN113138894B (en) * | 2021-04-14 | 2022-07-15 | 哈尔滨工业大学 | Experimental equipment monitoring method based on power parameter monitoring and screen information identification |
| KR102598788B1 (en) * | 2022-07-11 | 2023-11-07 | 오세덕 | Substrate transfer system |
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| Publication number | Publication date |
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| KR20180090066A (en) | 2018-08-10 |
| TW201842606A (en) | 2018-12-01 |
| KR101987895B1 (en) | 2019-06-12 |
| TWI665749B (en) | 2019-07-11 |
| WO2018143506A1 (en) | 2018-08-09 |
| CN110168712A (en) | 2019-08-23 |
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