KR102294504B1 - Test dummy for precision transfer position measurement of substrate - Google Patents

Abstract

Disclosed is a test dummy for measuring a substrate transfer position used in the field of semiconductor or display systems. The test dummy for measuring the substrate transfer position is a test dummy for measuring the substrate transfer position for measuring the position at which the substrate is transferred by a transfer robot that transfers the substrate, and has a size and shape corresponding to that of the substrate, and has a grid-shaped frame A base member having a shape, and a plurality of measurement modules detachably provided on the base member and provided to photograph the position of the end effector of the transfer robot while the base member is mounted on the transfer robot do.

Description

TEST DUMMY FOR PRECISION TRANSFER POSITION MEASUREMENT OF SUBSTRATE

The following description relates to a test dummy for measuring a substrate transfer position used in the field of a semiconductor or display system.

In a semiconductor or display manufacturing process, a transport robot for transporting a substrate according to each manufacturing process is provided.

Conventionally, a device for determining whether a board can be transferred to an appropriate position using a test board has been developed. However, in the existing apparatus, it is necessary to separately form a criterion for whether the substrate is properly transferred to the apparatus to which the substrate is to be transferred.

In addition, there is a conventional method of checking whether a jig provided according to the type of the substrate is properly positioned at a normal position, but in this method, a jig corresponding thereto must also be produced according to the type of the substrate. For example, when a substrate stored in a transport container for a substrate divided into the same slot is taken out by a transfer robot, the side surface of the substrate should not be damaged, but a device for detecting the side surface of the substrate has not been developed.

In addition, in the process of transferring the substrate, vibration applied to the manufacturing apparatus and the substrate must be sensed, or ambient environmental conditions such as temperature and humidity around the manufacturing apparatus and the substrate must be sensed. However, since the existing devices are not equipped with means for detecting such conditions, they must be provided with detection means separately from the manufacturing apparatus, thereby causing a cost increase and space utilization inefficiency. .

In addition, communication technology using Bluetooth is generally applied to existing devices, which is a short-distance communication compared to a wide facility environment, so it is difficult to apply to communication in the entire facility environment. there was

In addition, a test equipment capable of determining and confirming whether a rectangular substrate such as a flat panel display (FPD) or a photomask is transported to an appropriate position in the manufacturing process as well as a circular wafer was required.

The content described as the above background art is possessed or acquired by the inventor in the process of derivation of the present invention, and cannot necessarily be acknowledged as a known art disclosed to the general public prior to the filing of the present invention.

It is an object of an embodiment to provide a test dummy for measuring substrate transfer positions.

The problems to be solved in the embodiments are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

A test dummy for measuring a substrate transfer position according to an embodiment will be described.

The test dummy for measuring the substrate transfer position is a test dummy for measuring the substrate transfer position for measuring the position at which the substrate is transferred by the transfer robot that transfers the substrate, has a size and shape corresponding to the substrate, and has a grid shape (eg For example, a base member having a frame shape in which any one of polygons and circles including a rectangle and a rectangle is continuously connected), and a base member detachably provided on the base member, the base member is mounted on the transfer robot It is configured to include a plurality of measurement modules provided to measure the position of the mounting portion for the substrate to be seated in the state.

According to one side, the base member, a plurality of first frames disposed at a first interval in one direction, and a plurality of first frames disposed to intersect with the plurality of first frames at a plurality of positions and disposed at a second interval It may be formed to include a second frame. Here, the base member may be formed to adjust the distance between the plurality of first frames and the plurality of second frames so that the first gap and the second gap can be adjusted.

According to one side, the base member may have a lattice form in which any one of a polygon including a rectangle and a rectangle and a circle is continuously connected. In addition, the first and second frames may have any one of circular, polygonal, I-shaped and L-shaped cross-sections, and may have a solid cross-section or a hollow cross-section or a porous cross-section.

According to one side, a plurality of sag control members for adjusting the sag of the base member is further provided, and the plurality of sag control members are formed of a material different from the base member and a separate entity, so that it is detachable from the base member. can be formed. For example, the sagging control member may have a cross-section of any one of a circular shape, a polygonal shape, an I-shape, and an L-shape, and may have a solid cross-section or a hollow cross-section or a porous cross-section.

According to one side, the measurement module includes a camera, a PCB on which a circuit and a power supply for operation of the camera are mounted, and an image and location information (pre-stored reference information and current location are compared and calculated) data) and a communication unit that wirelessly communicates any one or more information of surrounding environment information including temperature and humidity, vibration, slope, wind speed, pollution, and pressure. The camera may be installed through the base member to photograph the mounting portion when the base member is mounted on the end effector, or may be installed in a portion of the base member without a frame. The measurement module may be formed by modularizing the camera, the PCB, and the communication unit as one device. The measurement module may be mounted at a position not in contact with the end effector. The measurement module is, when the base member is transported by the transfer robot and seated on the mounting unit, at a position corresponding to a lift pin or a lift pin hole of some of the plurality of lift pins in the base member, or at the outside of the mounting unit. It can be mounted in a corresponding position. In addition, the measurement module, along with the camera, may further include a camera at any one or more positions of front, back, left, and upper portions of the test dummy. According to one side, a level sensor, a vibration sensor, and a temperature/humidity sensor , a wind speed sensor, a pollution level sensor, and at least one sensor of a pressure sensor may further include a sensing unit for measuring the surrounding environment of the manufacturing apparatus and the substrate. The sensing unit may be provided integrally with the measurement module or may be provided on the base member at a location separate from the measurement module.

As seen above, according to the embodiments, the test dummy for measuring the substrate transfer position can be formed in a grid shape to prevent deflection, and by measuring the deflection and vibration caused by the downstream airflow inside the manufacturing facility, the actual It is possible to prevent or prevent a problem from occurring during the transfer of the substrate.

In addition, since the measurement module is modularized with the camera, power supply, PCB, and communication unit integrally and can be attached to and detached from the test dummy, even if the transfer robot changes, only the attachment position of the measurement module needs to be adjusted without changing the design of the test dummy. And it can be easily applied to the mounting part.

In addition, since the test dummy is provided with a sag control member and can be adjusted similarly to the weight of the substrate, it is easy to simulate the substrate to confirm the position of the actual substrate transfer, and to detect and adjust the sag.

Effects of the test dummy for measuring the substrate transfer position according to an embodiment are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

1 is a perspective view of a test dummy for measuring a substrate transfer position according to an exemplary embodiment;
FIG. 2 is an exploded perspective view of a deflection adjusting member in the test dummy of FIG. 1 ;
3 is a view illustrating a shape of a base member according to various modified embodiments in a test dummy for measuring a substrate transfer position according to an embodiment.
4 and 5 are views illustrating cross-sections of first and second frames or deflection adjustment members according to embodiments.
FIG. 6A is a perspective view illustrating a state in which the test dummy of FIG. 1 is transferred to the mounting unit in a state in which the test dummy of FIG. 1 is mounted on the transfer robot and the measurement module is waiting for measurement.
6B is a perspective view illustrating a state in which a lift pin of the mounting unit is raised in FIG. 6A .
7 is a block diagram of a measurement module according to an embodiment.

Hereinafter, embodiments will be described in detail with reference to exemplary drawings. In adding reference numerals to the components of each drawing, it should be noted that the same components are given the same reference numerals as much as possible even though they are indicated on different drawings. In addition, in the description of the embodiment, if it is determined that a detailed description of a related known configuration or function interferes with the understanding of the embodiment, the detailed description thereof will be omitted.

In addition, in describing the components of the embodiment, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the components from other components, and the essence, order, or order of the components are not limited by the terms. When it is described that a component is “connected”, “coupled” or “connected” to another component, the component may be directly connected or connected to the other component, but another component is between each component. It will be understood that may also be "connected", "coupled" or "connected".

Components included in one embodiment and components having a common function will be described using the same names in other embodiments. Unless otherwise stated, a description described in one embodiment may be applied to another embodiment, and a detailed description in the overlapping range will be omitted.

Hereinafter, the test dummy 100 for measuring the substrate transfer position will be described with reference to FIGS. 1 to 7 . For reference, FIG. 1 is a perspective view of a test dummy 100 for measuring a substrate transfer position according to an exemplary embodiment, and FIG. 2 is an exploded perspective view in which the sagging control member 120 is disassembled from the test dummy 100 of FIG. 1 . . And FIG. 3 is a diagram illustrating a grid shape of the base member 110 according to modified embodiments. 4 is a view showing cross-sections of the first and second frames 111 and 112 or the sag control member 120 according to embodiments, and FIG. 5 is a sag control member 120 according to modified embodiments. Alternatively, it is a view showing cross-sections of the frames 111 and 112 for reducing the weight of the base member 110 . FIG. 6A is a perspective view illustrating a state in which the test dummy 100 of FIG. 1 is transported from the state mounted on the transfer robot 10 to the mounting unit 20 and the measurement module 130 is waiting for measurement, and FIG. 6B is FIG. It is a perspective view of the state in which the lift pin 21 of the mounting part 20 is raised in 6a. 7 is a block diagram of a measurement module 130 according to an embodiment.

Referring to the drawings, the test dummy 100 for measuring the position of the substrate transfer is configured to include a base member 110 and a measurement module 130 .

Here, the "substrate" in this embodiment is a transparent substrate including glass for a flat panel display (FPD) such as a liquid crystal display (LCD) and a plasma display panel (PDP), and has a rectangular shape. It is a board with However, the substrate is not limited thereto, and may include a silicon wafer for manufacturing a semiconductor device, and may have a circular shape.

The base member 110 has a size and shape corresponding to that of the substrate, and is formed in a lattice form by arranging a plurality of frames 111 and 112 to cross each other. The base member 110 is a grid in the horizontal direction, a plurality of first frames 111 arranged along the vertical direction, and a vertical grid intersecting the first frame 111 at approximately right angles, arranged in the horizontal direction. It consists of a plurality of second frames 112 .

Here, the "vertical direction" is a direction parallel to the direction in which the test dummy 100 is mounted on the transfer robot 10, and the "horizontal direction" is a direction perpendicular to the vertical direction.

On the other hand, in the present embodiment, it is exemplified that the grid shape of the base member 110 is vertically crossed and a plurality of square or rectangular shapes are continuous. However, the grid shape of the base member 110 is not limited to a quadrangle, and a plurality of circular or polygonal shapes may be continuously formed. For example, in the base member 110 , as shown in FIG. 3A , a lattice in which a plurality of frames cross each other diagonally to form a continuous lattice in a rhombus shape may be formed. Alternatively, as shown in (b) to (d) of Figure 3, the base member 110, polygons such as hexagons, triangles, trapezoids, etc. may be continuously arranged to form a grid. Alternatively, as shown in (e) to (f) of FIG. 3 , the base member 110 may be formed by continuously disposing a plurality of circles. That is, in the present embodiments, a form in which a plurality of openings are formed while a plurality of frames intersect each other in the base member 110 as described above is referred to as a lattice form, and a shape in which frames intersect or a shape of an opening formed by intersecting frames is defined as a lattice type. A shape in which a polygon or a circle including a plurality of rectangles, squares, triangles, and pentagons is continuously arranged is referred to as a lattice form.

According to the present embodiment, the weight of the base member 110 may be reduced by forming the base member 110 in a grid shape in which the plurality of frames 111 and 112 intersect each other. In addition, in general, the downstream airflow is used inside the manufacturing facility, and since the substrate is formed in a flat plate shape, vibration and sagging may occur even by the airflow. However, since the base member 110 according to the present embodiment is formed to be opened so that an airflow can pass therethrough by forming a grid-shaped frame, it is possible to prevent shaking and sagging due to a downstream airflow.

For example, the first and second frames 111 and 112 may have an I-shaped cross-section or an L-shaped cross-section, as shown in FIG. 4 . Alternatively, the first and second frames 111 and 112 may have a polygonal cross-sectional shape or a circular cross-sectional shape. In addition, in order to reduce the weight of the base member 110 , the first and second frames 111 and 112 may have a solid or hollow cross-section, or porous, as shown in FIG. 5 . Here, FIG. 5 is a view partially illustrating the cross-sectional shapes of the first and second frames 111 and 112 or the sag control member 120 , and is not limited by the drawings. In addition, even when the first and second frames 111 and 112 have an I-shaped or L-shaped cross section shown in FIG. 4 , as shown in FIG. 5 , a hollow or porous structure may be formed therein. .

The plurality of first frames 111 are disposed at predetermined intervals along the vertical direction, and the plurality of second frames 112 are disposed at predetermined intervals along the horizontal direction. Here, the interval between the plurality of first frames 111 is referred to as a “first interval G1”, and the interval between the plurality of second frames 112 is referred to as a “second interval G2”.

According to the present embodiment, by disposing the first frame 111 and the second frame 112 at a predetermined interval, the position where the sagging in the horizontal and vertical directions occurs in the base member 110 is determined by the first frame 111 . and the position of the second frame 112, the user can intuitively know. That is, even without a separate measuring device, it is possible to check the position of the longitudinal drooping of the base member 110 through the first gap G1, and the horizontal direction of the base member 110 through the second gap G1. You can check the location of the deflection.

Alternatively, the sizes of the first gap G1 and the second gap G2 may be different from each other. That is, in the base member 110 , the grid size in the vertical direction and the grid size in the horizontal direction may be different from each other. In addition, the distance between the first frame 111 and the second frame 112 in the base member 110 may be formed so that a user can arbitrarily adjust it. For example, the interval may be adjusted by sliding the first frame 111 or the second frame 112 within the entire rim of the base member 110 .

According to the present embodiment, by forming the intervals G1 and G2 of the plurality of first frames 111 and the second frames 112 uniformly or differently from each other, the deflection of the base member 110 is more effectively measured or can be implemented

The base member 110 is formed to be adjustable in size. That is, by attaching a plurality of base members 110 having a predetermined size to the side surfaces to be on the same plane, the overall size can be adjusted and changed. For example, compared to the size of the 6th generation substrate, the 8th generation substrate has 4 times the size, and if four base members 110 corresponding to the 6th generation substrate are attached together, a base member applicable to the 8th generation substrate is formed. can do. However, this is only an example, and the size of the base member 110 is not only added in units of the base member 110, but also formed in a smaller size (for example, a size smaller than the size of the 6th generation substrate). By adding the thus formed unit sizes in the horizontal/vertical directions, the base member 110 may be formed to have a desired size.

On the other hand, since the test dummy 100 for measuring the substrate transfer position is to measure or implement not only the transfer position of the substrate but also the deflection using the transfer robot 10, the weight of the substrate and the deflection thereof are applied to the base member 110. A sag control member 120 may be provided to simulate.

The sagging control member 120 may have a predetermined weight and may be formed of a material having a specific gravity different from that of the base member 110 . In addition, the sag adjustment member 120 is formed to be detachably attached to the base member 110 , so that the strength of the base member 110 can be reinforced as it is mounted on the base member 110 . In addition, by mounting the sag control member 120 on the base member 110 , the sag occurring in the actual substrate may be more similarly simulated. Through this, location information or surrounding environment information that can be measured in the actual substrate can be more accurately obtained, and it is possible to easily check the location of the deflection and detect and adjust the amount of deflection. Here, the position of the sagging control member 120 may be uniformly disposed on the base member 110 or may be disposed only at a position where sagging occurs. In addition, the number and position of the sagging control members 110 may be appropriately changed as necessary.

The sag control member 120 is formed to be attached to the first frame 111 or the second frame 112 , for example, corresponding to the shape of the first frame 111 or the second frame 112 . It may have a bar shape. In addition, as shown in FIG. 4 , the sag control member 120 may have an I-shaped cross-section or an L-shaped cross-section. Alternatively, the sag control member 120 may have a polygonal or circular cross-section. In addition, the sag control member 120 may have a solid cross-section, a hollow shape, or a porous shape, as shown in FIG. 5 , to reduce weight. However, FIGS. 4 and 5 are views partially illustrating a cross-sectional shape of the sagging control member 120 , and are not limited thereto. In addition, even when the sagging control member 120 has an I-shaped or L-shaped cross section shown in FIG. 4 , as shown in FIG. 5 , a hollow or porous body may be formed therein.

In addition, the plurality of sag control members 120 may be formed to have the same weight and the same shape. In this case, the user can intuitively and easily know the added weight through the number to which the sagging control member 120 is attached.

Alternatively, the sag control member 120 may be formed to have different weights so that the sag of the base member 110 can be finely and precisely adjusted. In this case, the added weight can be more precisely controlled by combining and attaching the sag control members 120 having different weights, and by adding different weights at different positions in the base member 110, the Deflection can be controlled more precisely.

In addition, the sag control member 120 may be formed to be adjustable in position by sliding while being mounted on the first frame 111 or the second frame 112 .

A fixing part (not shown) is formed in the base member 110 in order to fix the sagging control member 120 . For example, the fixing unit may be a bracket or a holder capable of gripping the sag control member 120 . Alternatively, the sagging control member 120 may be fixed to the base member 110 using a fixing member that is a fastening member such as a bolt. Alternatively, a fixing part may be formed on the sagging control member 120 itself.

In addition, the shape of the fixing part may be used in various shapes capable of physically fastening and coupling the sagging control member 120 to the base member 110 .

6A to 7 , the measurement module 130 includes a camera 131, a circuit for operating the camera 131 and a PCB 132 on which the power source 133 is mounted, and a communication unit 134, a mounting unit ( 20), it is configured to include a control unit 136 for comparing and calculating the position information (pre-stored reference information) of the lift pin hole 22 with the current position.

In addition, the measurement module 130, the camera 131, the power source 133, the PCB 132, and the communication unit 134 are modularized as a single device is formed to be detachably attached to the base member (110).

The measurement module 130 is capable of teaching (centering) while the user confirms the correct position by using the image captured by the camera 131, but pre-entered mounting unit 20 information (numerical values and lift pin hole 22 position, etc.) ), the degree of distortion (coordinates) can be directly expressed numerically by comparing it with the measured value in the measurement module mounted on the board.

The position of the measurement module 130 is that when the test dummy 100 is mounted on the end effector 11 of the transfer robot 10, the camera 131 is mounted on the mounting unit 20 or the lift pin ( 21), it is provided to photograph the outside of the lift pin hole 22 or the mounting unit 20 . For example, the measurement module 130 may be provided on the edge of the base member 110 . Alternatively, a plurality of measurement modules 130 may be provided along the periphery of the base member 110 , and a plurality of positions corresponding to the lift pins 21 or lift pin holes 22 located inside the mounting unit 20 . can be provided in That is, if the measurement module 130 is provided at a position corresponding to two or more of the lift pin 21 or the lift pin hole 22 inside the mounting unit 20 , it is possible to determine the exact position of the substrate. And, if the measurement module 130 is provided at two or more positions among the corners symmetrical to each other in the base member 110, it is possible to determine the position of the substrate. In addition, the measurement module 130 is mounted at a position where the measurement module 130 and the end effector 11 do not contact when the test dummy 100 is mounted on the transfer robot 10 .

On the other hand, the test dummy 100 is not actually mounted on the mounting unit 20 , but moves to a position where the substrate is seated on the mounting unit 20 , and then the measurement module 130 is spaced apart from the top of the mounting unit 20 . After measuring the mounting portion 20 or the lift pin 21 or the lift pin hole 22 of the In detail, as shown in FIG. 6A , the test dummy 100 is moved from the upper portion of the mounting unit 20 to a position where the substrate is seated in a state in which the test dummy 100 is mounted on the transfer robot 10 . Next, as shown in FIG. 6B , as the lift pins 21 of the mounting unit 20 rise, the test dummy 100 is mounted on the lift pins 21 or spaced apart from the lift pins 21 by a predetermined distance. In this state, the measurement module 130 measures the lift pin 21 or the lift pin hole 22 .

The measurement module 130 may be mounted to the base member 110 by bolting. For example, the measurement module 130 is mounted on the base member 110 by basic bolting, and can fine-tune the position of the camera 131 by fine-tuning the position in the X-Y direction by fine bolting. However, the mounting method of the measurement module 130 is not limited thereto, and if the measurement module 130 can be detachably attached to the base member 110 , and fine adjustment of the position is possible while mounted on the base member 110 . Various methods can be used.

The camera 131 including the light may be mounted on the base member 110 and a small camera capable of modularizing the measurement module 130 is used. In addition, the measurement module 130 is mounted on the base member 110 , the camera 131 may be installed through the base member 110 .

The power source 133 supplies power for the operation of the camera 131 and the measurement module 130 , and may be, for example, a battery.

The PCB 132 has a circuit for operating the camera 131 , and a power source 133 is mounted thereon to electrically connect the camera 131 and the power source 133 .

According to this embodiment, the measurement module 130 includes a camera 131 including lighting, a PCB 132 , and a power source 133 as one device and is formed in a small size, so it is easy to install on the base member 110 . , it is possible to freely change the position to be mounted on the base member 110 according to the transfer robot (10). That is, even if the transfer robot 10 is changed, the degree of freedom of design can be increased because only the position of the measurement module 130 can be changed and attached without changing the design of the base member 110 .

The communication unit 134 is provided in the measurement module 130 and communicates using a large-capacity long-distance wireless communication (eg, Wi-Fi, etc.). The communication unit 134 uses wireless communication to enable long-distance communication compared to Bluetooth or the like, and large-capacity communication is possible. In addition, the measurement module 130 includes, along with the image captured by the camera, position information of the measurement module 130 and information measured by the sensing unit 135 to be described later, for example, a test dummy for measuring a substrate transfer position ( 100) wirelessly communicates any one or more of the surrounding environment information including temperature and humidity, vibration, slope, wind speed, pollution level, and pressure.

The control unit 135 compares and calculates reference information about the plurality of lift pins 21 and lift pin holes 22 and the outer shape of the pre-stored mounting unit 20 with information measured by the measurement module 130 . . In addition, the communication unit 134 wirelessly communicates the degree of distortion calculated through the result calculated by the control unit 136 .

Since the measurement module 130 is a device for photographing the lift pins 21 or the lift pin holes 22 using a camera 131 including lighting, environmental information around the test dummy 100 in addition to the measurement module 130 The sensor may further include a sensing unit 135 including at least one of a level sensor, a vibration sensor, a temperature/humidity sensor, a wind speed sensor, a pollution level sensor, and a pressure sensor to measure the .

The sensing unit 135 may be formed by being provided with a plurality of sensors integrally with the measurement module 130 .

Alternatively, the sensing unit 135 may be provided at a location separate from the measurement module 130 . For example, a plurality of sensors (at least one sensor in a level sensor, a vibration sensor, a temperature/humidity sensor, a wind speed sensor, a pollution level sensor, a pressure sensor, etc.) may be provided at a plurality of locations in the base member 110 . In addition, at least one sensor may be provided to sense the vibration, level, or movement of the transfer robot 10 and the end effector 11 directly on or around the transfer robot 10 . In addition, at least one or more inside the manufacturing facility to measure the environment (eg, temperature, humidity, airflow, vibration, slope, wind speed, pollution degree, pressure, etc.) on the path where the transfer robot 10 is located and transfers the substrate A sensor may be provided.

In addition, in addition to the camera 131 integrally provided in the measurement module 130 , it is also possible to further include an additional camera (not shown) at at least one of the front, rear, left, right, and upper portions of the test dummy 100 .

Meanwhile, the test dummy 100 may be accommodated and stored in a storage member (not shown) when not in use.

For example, the storage member may correspond to the size and shape of the test dummy 100 , may have a frame shape surrounding the outer edge of the base member 110 , and may be formed of a PC material. And for the convenience of storage and movement, a fastening member or a handle may be formed on the storage member.

However, the storage member is not limited to the above-described example, and its shape and material may be substantially changed in various ways, and it is also possible to omit the storage member.

As described above, although the embodiments have been described with reference to the limited drawings, various modifications and variations are possible from the above description by those of ordinary skill in the art. For example, the described techniques are performed in an order different from the described method, and/or the described components of structures, devices, etc. are combined or combined in a different form than the described method, or other components or equivalents are used. Appropriate results can be achieved even if substituted or substituted by

Therefore, the spirit of the present invention should not be limited to the described embodiments, and not only the claims described below, but also all of the claims and all equivalents or equivalent modifications will fall within the scope of the spirit of the present invention.

10: transfer robot
11: End Effector
20: mount
21: lift pin
22: lift pin hole
100: test dummy
110: base member
111, 112: frame
120: sag control member
130: measurement module
131: camera
132: PCB
133: power
134: communication department
135: sensing unit
136: control unit

Claims (12)

In a test dummy for measuring a substrate transfer position for measuring a position at which the substrate is transferred by a transfer robot for transferring the substrate,
a base member having a size and shape corresponding to that of the substrate, and having a frame shape in the form of a grid;
a plurality of deflection adjustment members formed as a separate entity from the base member and detachably formed on the base member, the plurality of deflection adjustment members adjusting the weight, amount of deflection, and deflection position of the base member; and
a plurality of measurement modules detachably provided on the base member and provided to measure a position of a mounting portion for mounting the substrate in a state in which the base member is mounted on the transfer robot;
A test dummy for measuring the position of substrate transfer comprising a.
According to claim 1,
The base member is
a plurality of first frames disposed at first intervals along one direction; and
a plurality of second frames disposed to intersect the plurality of first frames at a plurality of positions and disposed at a second interval having a size equal to or different from the first interval;
A test dummy for measuring the position of substrate transfer comprising a.
3. The method of claim 2,
The base member is
A test dummy for measuring a substrate transfer position formed so as to be able to adjust an interval between the plurality of first frames and the plurality of second frames.
3. The method of claim 2,
The base member is a test dummy for measuring a substrate transfer position having a lattice shape in which any one of polygons and circles including a rectangle, a rectangle, and a circle are continuously continuous.
3. The method of claim 2,
The first and second frames have a cross section of any one of circular, polygonal, I-shaped and L-shaped, and also have a solid cross-section, a hollow cross-section, or a porous cross-section for measuring a substrate transfer position dummy.
According to claim 1,
The plurality of sag control members is a test dummy for measuring a substrate transfer position formed of a material different from that of the base member or a material having a different specific gravity.
7. The method of claim 6,
The sag control member has a cross section of any one of a circular shape, a polygonal shape, an I-shape, and an L-shape, and a cross section is a test dummy for measuring a substrate transfer position in which a solid section or a hollow section or a porous section is formed.
According to claim 1,
The measurement module is
camera;
a PCB on which a circuit and a power supply for operating the camera are mounted; and
a communication unit for wirelessly communicating any one or more information of the surrounding environment information including the image captured by the camera, location information, temperature and humidity, vibration, slope, wind speed, pollution level, and pressure;
A test dummy for measuring the position of the substrate transfer comprising a.
9. The method of claim 8,
The measurement module is a test dummy for measuring the position of the substrate transfer further provided with a camera at any one or more positions of the front, rear, left, right, and upper portions of the test dummy.
9. The method of claim 8,
A plurality of lift pins and a plurality of lift pin holes through which the plurality of lift pins pass are formed in the mounting portion,
The measurement module is
When the base member is transported by the transfer robot and seated on the mounting unit, the base member is mounted at a position corresponding to some lift pins or a position corresponding to some lift pin holes or a position corresponding to the outside of the mounting unit in the base member. A test dummy for measuring the substrate transfer position.
According to claim 1,
A level sensor, a vibration sensor, a temperature/humidity sensor, a wind speed sensor, a pollution level sensor, and a pressure sensor.
12. The method of claim 11,
The sensing unit is provided integrally with the measurement module, or
The sensing unit is a test dummy for measuring a substrate transfer position provided on the base member at a position separate from the measurement module.

Images