CN110168712A - For semiconductor or field of display systems transmitting place measurement test model and utilize the accurate transfer measurement method for semiconductor or the transmitting place measurement test model of field of display systems - Google Patents
For semiconductor or field of display systems transmitting place measurement test model and utilize the accurate transfer measurement method for semiconductor or the transmitting place measurement test model of field of display systems Download PDFInfo
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- CN110168712A CN110168712A CN201780077231.4A CN201780077231A CN110168712A CN 110168712 A CN110168712 A CN 110168712A CN 201780077231 A CN201780077231 A CN 201780077231A CN 110168712 A CN110168712 A CN 110168712A
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- transmitting place
- slit
- measurement
- pin hole
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Abstract
The invention discloses the transmitting place measurement test models for semiconductor or field of display systems, including model ontology, pin hole radiographic measurement component, slit radiographic measurement component and cpu, so as to prevent test object body collision keeping box in slit mode measuring slit height, even if the datum mark being not formed into, also judged using pin hole is lifted in the manufacturing apparatus, the position transfer whether test object body is normally transferred to needs.
Description
Technical field
The present invention relates to for semiconductor or field of display systems transmitting place measurement test model and utilization described in
The accurate transfer measurement method of transmitting place measurement test model.
Background technique
Tens of thousands of extremely billions of a electronic component semiconductor elements are formed in minimum chip.
The important materials for being used to form this semiconductor element are wafer.Wherein, wafer is to pass through silicon, GaAs (GaAs)
The plate of the circular plate shape of the single crystals for waiting growth to obtain etc..
This wafer is passed through for manufacturing a variety of manufacturing processes of semiconductor element to form transistor and two poles on surface
The material of pipe etc. simultaneously can arrange several hundred a chips.
During this manufacturing process, transfer machine is used in order to accordingly transfer wafer with each manufacturing step
People.
Wherein, in the past, the method for judging whether that wafer is transplanted on appropriate location using test wafer is developed
Or device, the document proposed as this example (title of invention: pass through for KR published patent the 10-2010-0054908th
The vehicle teaching origin measurement method of camera view) and KR published patent the 10-2003-00806976th, (the name of invention
Claim: the fixture of the chuck height measurement for wafer test).
But the method for transporting or device of the previous wafer including above patent document, it needs to independently form for crystalline substance
The datum mark whether member is suitably transferred to transfer device.
Wherein, need to manufacture additional datum mark in the device of not formed datum mark, manufacturing cost and time can increase as a result,
Add.
Also, previous, whether the fixture that there is the type of confirmation and wafer accordingly to provide is positioned exactly at appropriate location
Method, still, in this approach, firstly, it is necessary to additionally produce fixture corresponding with the type of wafer.
Also, for example, in the state of the wafer divided by identical slit operation container keeping wafer, when will take care of
Wafer when being taken out from transfer robot, prevent the side of wafer impaired, still, not yet develop the side to prevent this wafer
The device that is detected of mode.
Also, during transferring wafer, needing to detect the vibration applied to manufacturing device or manufacturing device week
In the case where the temperature humidity on side, in the past, the unit that can detect this condition needs and is not formed at the manufacturing device, because
This, needs to independently form detection unit with the manufacturing device, occurs based on the expense rising independently formed and space efficiency.
Also, in described device and method, in general, being suitable for the system based on Bluetooth communication, with wide equipment ring
Border is compared, and can not carry out short haul connection, and can not transmit a large amount of data.
Also, it is only limited in the content and illustrates wafer, but needed to have when the photo illiteracy for using square shape
The test whether transfer of other manufacturing processes of version (Photo mask) or liquid crystal display panel (LCD Panel) etc. is also normally transferred
Device.
Summary of the invention
Technical problem
The present invention be confirmed using image measuring device test object body whether the experimental rig of normal movement, to prevent
The height of the mode measuring slit of test object body collision keeping and interior slit, utilizes lifting for not formed additional datum mark
Pin hole judges in the manufacturing apparatus, the position transfer whether test object body normally transfer to needs for semiconductor or aobvious
Show the transmitting place measurement test model of system regions and the accurate transfer using the transmitting place measurement test model
Measurement method.
The means solved the problems, such as
The transmitting place measurement of an embodiment of the present invention test model is suitable for including following device in semiconductor
Or equipment used in field of display systems: keeping box, for loading test object body；Subject fixes device, including is used for
The fixed cell of the fixed test object body；And transfer robot, for taking care of box to fixed cell transfer is described
In the test object body characterized by comprising model ontology, size are identical as the size of the test object body；Needle
Hole radiographic measurement component can recognize or shoot the multiple guidance pin holes for being formed in the fixed cell；Slit radiographic measurement component,
In the model ontology keeping in the state of keeping box, it can recognize or shoot can measure and be configured at the model ontology
The mode at the interval between the slit and the model ontology of the keeping box of upper end is configured at the model ontology upper end
The slit of the keeping box；And cpu, it can transmit to pre-prepd image processing computer by described
The information of pin hole radiographic measurement component measurement.
Accurate transfer measurement method using the transmitting place measurement test model of the invention, wherein the shifting
It send measurement test model in position to be suitable for the equipment used in semiconductor or field of display systems including following device: protecting
Pipe box, for loading test object body；Subject fixes device, including the fixed cell for fixing the test object body；
And transfer robot, for transferring the test object body in the keeping box, the transfer position to the fixed cell
Setting measurement test model includes: model ontology, and size is identical as the size of the test object body；Pin hole radiographic measurement portion
Part can recognize or shoot the multiple guidance pin holes for being formed in the fixed cell；Slit radiographic measurement component, in the model sheet
Body keeping be can recognize or be shot can measure the guarantor for being configured at the model ontology upper end in the state of keeping box
The mode at the interval between the slit of pipe box and the model ontology is configured at the keeping box of the upper end of the model ontology
The slit；And cpu, it can transmit to pre-prepd image processing computer and be surveyed by the pin hole image
The information of component or slit radiographic measurement component measurement is measured, it is described to be moved using the precision of transmitting place measurement test model
Location measurement method is sent to be characterised by comprising: step (1), transmitting place measurement examination of the keeping in the keeping box
It tests model and is placed in the transfer robot；Step (2), the transfer robot in the step (1) is to described fixed single
Transfer the transmitting place measurement test model in the upper end of member；Step (3), in the step (2) to described solid
The transmitting place measurement of the upper end transfer of order member with for test model, the pin hole radiographic measurement component identification or
Shoot the guidance pin hole of the fixed cell；Step (4), Xiang Suoshu cpu are transmitted in the step (3)
The image of identification or shooting；Step (5), Xiang Suoshu image processing computer are transmitted in step (4) to the central processing department
The image of part transmission；And step (6), according to the institute transmitted in the step (5) to the image processing computer
Image is stated to judge whether the transmitting place measurement test model can be placed in the preassigned position of the fixed cell
It sets, whether the center that can grasp the transmitting place measurement test model is accurately aligned with the center of the guidance pin hole.
Invention effect
Of the invention measures for semiconductor or the transmitting place of field of display systems with test model and the utilization shifting
The accurate transfer measurement method of position measurement test model is sent to be suitable for leading in conductor or display system including following device
Equipment used in domain: keeping box, for being mounted in test object body；Subject fixes device, including for fixing the detection
The fixed cell of subject；And transfer robot, for transferring the detection in the keeping box to the fixed cell
Subject, the transmitting place measurement test model includes: model ontology, identical as the size of the test object body；Needle
Hole radiographic measurement component can recognize or shoot the multiple guidance pin holes for being formed in the fixed cell；Slit radiographic measurement component,
In the model ontology keeping in the state of keeping box, identifies or shoot with measuring configuration in the model ontology upper end
The keeping box slit and the model ontology between the mode at interval be configured at the keeping of the model ontology upper end
The slit of box；And cpu, it can transmit to pre-prepd image processing computer by the pin hole image
Measuring part or the information of slit radiographic measurement component measurement, test object body are confirmed using image measuring device whether
The experimental rig of normal movement, the height of measuring slit in a manner of preventing the slit in test object body collision keeping box, i.e.,
Make the datum mark being not formed into, also judged using pin hole is lifted in the manufacturing apparatus, whether test object body is normally to needs
It transfers the position of transfer.
Detailed description of the invention
Fig. 1 is to schematically illustrate the drag-over unit for preparing the transmitting place measurement test model using first embodiment of the invention
The perspective view of the environment of device people and processing chamber housing.
Fig. 2 is the transmitting place measurement of the first embodiment of the invention seen from above figure of test model.
Fig. 3 is the top view in the transmitting place measurement test model of front observation first embodiment of the invention.
Fig. 4 is the figure inside the processing chamber housing of first embodiment of the invention seen from above.
Fig. 5 is to schematically illustrate the pin hole radiographic measurement component identification guidance pin hole of first embodiment of the invention and be transfer
The figure at the center of position measurement test model and the different state in center for the guidance pin hole for being formed in fixed cell.
Fig. 6 is to schematically illustrate the hole radiographic measurement component identification guidance pin hole of first embodiment of the invention and be transmitting place
The figure at the center of measurement test model and the different state in center for the guidance pin hole for being formed in fixed cell.
Fig. 7 be schematically illustrate first embodiment of the invention transmitting place measurement test model it is in place identification draw
The figure of the state of guide pinhole.
Fig. 8 be schematically illustrate first embodiment of the invention slit radiographic measurement component identification side slit and the other side it is narrow
The figure of the state of seam.
Fig. 9 is the transmitting place measurement test mould that box will be taken care of using the transfer robot of first embodiment of the invention
The flow chart for the method that the position that type is safely put into extraction on the outside of keeping box or internally accurately confirms.
Figure 10 is the transmitting place survey for measuring the transfer robot of first embodiment through the invention and transferring to fixed cell
The center of amount test model whether with the center of the guidance pin hole for being formed in fixed cell accurately identical fixture position
The method set.
Figure 11 is the enlarged drawing of the part A of Fig. 8 of first embodiment of the invention.
Figure 12 is the transmitting place survey for being viewed from the front the pollution detection camera for being formed with second embodiment of the invention
The amount top view of test model.
Figure 13 is the state that the pin hole imaging sensor for shooting of third embodiment of the invention is in contact with fixed cell
Enlarged drawing.
Figure 14 is the enlarged drawing for the state that the screen unit of fourth embodiment of the invention is in contact with fixed cell.
Figure 15 is that the transmitting place of the front camera parts viewed from above including fifth embodiment of the invention measures use
The figure of test model.
Specific embodiment
Hereinafter, illustrating surveying for semiconductor or the transmitting place of field of display systems for the embodiment of the present invention referring to attached drawing
Amount test model and the accurate transfer measurement method that test model is used using transmitting place measurement.
Fig. 1 is to schematically illustrate the transfer robot for preparing the transmitting place measurement test model using the embodiment of the present invention
And the perspective view of the environment of processing chamber housing.Fig. 2 is the transmitting place measurement test model of first embodiment seen from above
Figure.Fig. 3 is the top view in the transmitting place measurement test model of front observation first embodiment of the invention.Fig. 4 is from upper
Figure inside the processing chamber housing of side's viewing first embodiment of the invention.Fig. 5 is the pin hole for schematically illustrating first embodiment of the invention
Radiographic measurement component identification guidance pin hole and for transmitting place measurement test model center and be formed in fixed cell
The figure of the different state in center of the guidance pin hole.Fig. 6 is the hole radiographic measurement for schematically illustrating first embodiment of the invention
Component identification guides pin hole and is the center of transmitting place measurement test model and the guidance needle for being formed in fixed cell
The figure of the different state in the center in hole.Fig. 7 is the transmitting place measurement test mould for schematically illustrating first embodiment of the invention
The figure of the state of type identification guidance pin hole in place.Fig. 8 is the slit image survey for schematically illustrating first embodiment of the invention
Measure the figure of the state of component identification side slit and other side slit.Fig. 9 is the transfer machine using first embodiment of the invention
The position that the transmitting place measurement for taking care of box is safely put into extraction on the outside of keeping box or internally by people with test model
Set the flow chart of the method accurately confirmed.Figure 10 is the transfer robot of measurement first embodiment through the invention to fixed cell
Whether the center of the transmitting place measurement test model of transfer is quasi- with the center for the guidance pin hole for being formed in fixed cell
Really the method for identical chucking position.Figure 11 is the enlarged drawing of the A of Fig. 8 of first embodiment of the invention.
Referring to figs. 1 to Figure 11, the transmitting place measurement test model 100 for semiconductor or field of display systems is suitable
For including equipment used in the semiconductor or field of display systems of following device: keeping box 10, user load detection pair
As body 50；Subject fixes device 25, including the fixed cell 27 for fixing the test object body 50；And transfer machine
People 30, for transferring the test object body 50 of the keeping box 10 to the fixed cell 27, comprising: model ontology 110,
It is identical as the size of the test object body 50；Pin hole radiographic measurement component 120, can recognize or shooting is formed in the fixed list
Multiple guidance pin holes 22 of member 27；And cpu 140, it transmits to pre-prepd image processing computer 60 by institute
State the information of the measurement of pin hole radiographic measurement component 120.
Transmitting place measurement test model 100 makes suitable for the semiconductor or field of display systems for including following device
Equipment: keeping box 10, for loading test object body 50；Subject fixes device 25, including for fixing the detection
The fixed cell 27 of subject 50；And transfer robot 30, for transferring the keeping box 10 to the fixed cell 27
The test object body 50 characterized by comprising model ontology 110, the size phase of size and the test object body 50
Together；Slit radiographic measurement component 130, the model ontology 110 keeping it is described keeping box 10 in the state of, can identify or
Shooting with can measuring configuration in 110 upper end of model ontology it is described keeping box 10 slit 11,12 and the model sheet
The mode at the interval between body 110 be configured at the upper end of the model ontology 110 it is described keeping box 10 the slit 11,
12；And cpu 140, for transmitting to pre-prepd image processing computer 60 by the pin hole radiographic measurement
The information that component 120 measures.
The transmitting place measurement test model 100 may include model ontology 110, pin hole radiographic measurement component 120, in
Processing component 140 or model ontology 110, slit radiographic measurement component 130 and cpu 140 are entreated, may each comprise model
Ontology 110, pin hole radiographic measurement component 120, slit radiographic measurement component 130 and cpu 140.Hereinafter, for side
Just illustrate, to include model ontology 110, pin hole radiographic measurement component 120, slit radiographic measurement component 130 and central processing
It is illustrated for the transmitting place measurement test model 100 of component 140.
Referring to figs. 1 to Figure 11, the embodiment of the present invention transmitting place measurement test model 100 include model ontology 110,
Pin hole radiographic measurement component 120, slit radiographic measurement component 130 and cpu 140.
This transmitting place measurement test model 100 may also include detection part 150.
The transmitting place measurement confirms that test object body 50 is using image measuring device method with test model 100
The experimental rig of no normal movement, can detect whether the test object body 50 is normally transferred.
The test object body 50 is usually the wafer shape formed by circular sheet in the present embodiment, still, according to
Purpose, or the light shield or liquid crystal display panel of rectangle.
This transmitting place measurement is suitable for semiconductor or display system including following device with test model 100
Equipment used in field: keeping box 10, for loading test object body 50；Subject fixes device 25, including for fixing
The fixed cell 27 of the test object body 50；And transfer robot 30, for transferring the guarantor to the fixed cell 27
The test object body 50 of pipe box 10.
The keeping box 10 is the slit 11,12 for being divided into same widths, and each of same widths slit 11,12 is distinguished
The single test object body 50 of keeping, transfer container of the test object body 50 to keeping before the transfer of other devices
(FOUP, Front Opening Unified Pod).
The fixed device 25 of the subject is configured at the space for being mounted on as the test object body 50 and carrying out process
Processing chamber housing 20, be formed with the fixed cell 27 of the fixed test object body 50.
For example, when the test object body 50 be wafer when, this fixed cell 27 can for by electrostatic force come
The electrostatic chuck (ESC, Electro static chuck) of the fixed test object body 50 or the fixed form based on engagement
Clamping (Clamping) device etc..
Guidance pin hole 22 is formed in the lower part of this fixed cell 27, it is described fixed single in the guidance pin hole 22
Member 27 extends specific length, is thus in contact with the bottom faces of the test object body 50 to support the test object body 50.
In general, this fixed cell 27 is there are 3 or more, and need and the center of multiple fixed cells 27 is put
The center for being placed in the test object body 50 of the fixed cell 27 is identical, can make the test object body 50 accurately
It is formed, to reduce defective products in process.
Moreover, if the center of multiple fixed cells 27 not with the test object that is placed in the fixed cell 27
The center of body 50 is identical, then the improper formation of the test object body 50, so that a large amount of defective products occur in process.
The model ontology 110 replace the test object body 50 confirm the test object body 50 whether normal movement
And there is identical size with the test object body 50, for example, if the test object body 50 is wafer and rounded thin
Plate, then the model ontology 110 is also at circular sheet.
When this model ontology 110 edge keeping it is described keeping box 10 when, can be placed in the slit 11,
12。
The pin hole radiographic measurement component 120 can recognize or shooting is formed in multiple institutes that the subject fixes device 25
Guidance pin hole 22 is stated, multiple pinhole cameras 121,122,123 by measuring multiple guidance pin holes 22 respectively are formed.
Identification range or the bat of the guidance pin hole are preset in the pin hole camera 121,122,123 for shooting
Range is taken the photograph, appended drawing reference 124,125,126 shown in fig. 5 is the pin hole identification of camera 121,122,123 difference for shooting
The identification range or coverage of the corresponding guidance pin hole 22.
In the present embodiment, the guidance pin hole 22 forms 3, in order to identify this guidance pin hole 22, the needle
Hole radiographic measurement component 120 may include the first pin hole camera 121 for shooting, the second pin hole camera 122 for shooting and third
Pin hole camera 123 for shooting.But the guidance pin hole 22 can also form multiple, the pin hole camera for shooting
121,122,123 can also be formed it is multiple.
In detail, first pin hole identification of camera 121 for shooting or shooting portion corresponding with the first range 124
Point, the second pin hole camera 122 for shooting identifies or shooting part corresponding with the second range 125, the third needle
The hole identification of camera 123 for shooting or shooting part corresponding with third range 126.
In the state of the formation, by the transfer robot 30, if to the upper of the fixed device 25 of the subject
The transmitting place measurement test model 100 is transferred in end, then pin hole camera 121,122,123 for shooting shoots institute
State the first range 124, the second range 125 and third range 126.
Wherein, each range 124,125,126 position adjacent for the guidance pin hole 22 corresponding thereto.
As described above, if the image that transmission is shot from the cpu 140 to image processing computer 60,
Then the image processing computer 60 calculates the positional value of the guidance pin hole 22 and utilizes the position of this guidance pin hole 22
Value is set to calculate the center 23 of the guidance pin hole.
Wherein, the shadow of first range 124 and second range 125 and the third range 126 in shooting
Identify that the guidance pin hole 22 is to utilize vision (Vision) technology for distinguishing color light and shade as in.
The guidance pin hole 22 shows the color than periphery relative shadow, therefore, each first range 124,
In the image shot in second range 125 and the third range 126, relative shadow part can be judged as to the guidance
The position of pin hole 22.
Wherein, it will shoot in each first range 124, second range 125 and the third range 126
The position of the guidance pin hole 22 is exported with positional value, and the center of the guidance pin hole is calculated using each institute's location value
23。
If the center of test model 100 is used in the center 23 of the guidance pin hole as described above and transmitting place measurement
127 is identical, then the transmitting place measurement is accurately transferred to the fixed cell 27 with test model 100.
But as shown in Figure 5 or Figure 6, if the center 23 of the guidance pin hole obtained using the vision technique not
It is identical as the center 127 of the transmitting place measurement test model, then it is judged as the transmitting place measurement test model
100 inaccurately transfer to the fixed cell 27.In turn, the connection transfer is found out in the image processing computer 60
The gradient of the line segment of 23 two o'clock of center of the center 127 of position measurement test model and the guidance pin hole, can count as a result,
Calculate the positional value for the modification that the transmitting place measurement test model 100 is accurately transferred to the fixed cell 27.
Specifically, for example, when the coordinate value at the center 127 of transmitting place measurement test model 100 is set to (0,
0) when, (x1, the y1) of the positional value of the guidance pin hole 22 measured in first range 124 is measured as (- 2.3), institute
(x2, the y2) for stating the positional value of the guidance pin hole 22 measured in the second range 125 is measured as (2,5), the third model
When (x3, the y3) for enclosing the positional value of the guidance pin hole 22 measured in 126 is (0, -2), the positional value of the guidance pin hole 22
(x0, y0) by way of finding out weight centerTo find out.If being found out using the formula described
The positional value for guiding pin hole 22, then pass through(0,2) is found out, so as to find out the center of the guidance pin hole
23.In turn, if (0,0) of coordinate value at the center 127 of transmitting place measurement test model 100 and the described of calculating are drawn
(0,2) of the coordinate value at the center 23 of guide pinhole is found out gradient by line segment connection and finds out distance, then can be calculated described
The positional value for the modification that transmitting place measurement is accurately transferred with test model 100 to the fixed cell 27.
In the present embodiment, the guidance pin hole 22 be 3, the pin hole camera 121,122,123 for shooting also by
3 are limited to, its center can also be calculated even if identification 2 or more the guidance pin holes 22, therefore, the guidance pin hole 22
May exist different number with pin hole camera for shooting to calculate center.
The slit radiographic measurement component 130 the model ontology 110 be stored in it is described keeping box 10 in the state of with
Measuring configuration is between the slit 11,12 and the model ontology 110 of the keeping box 10 of 110 upper end of model ontology
The mode at interval identifies or shoots the slit 11,12 for being configured at the keeping box 10 of 110 upper end of model ontology, shape
The diameter line of model ontology 110 described in Cheng Yu.
In detail, the slit radiographic measurement component 130 includes that can identify to be configured at the two of the model ontology 110 respectively
The side slit 11 of side upper end and the side slit camera 131 of other side slit 12 and other side slit camera 132, it is described
It is preset with the side slit 11 and institute respectively in side slit camera 131 and the other side slit camera 132
State the identification range or coverage of other side slit 12.
In general, a pair of side slit 11 and the other side slit 12 are located at horizontal line, correspondingly, described one
Side slit camera 131 and the other side slit camera 132 are present in identical horizontal line.
In the present embodiment, a side direction is with the center of the transmitting place measurement test model 100 shown in Fig. 8
On the basis of 127, the side of the side slit camera 131 is formed.
Appended drawing reference 133 is the side identification range that the side slit camera 131 can recognize or shoot, appended drawing reference
134 other side identification ranges that can recognize or shoot for the other side slit camera 132.
As described above, as shown in figure 8, the if transmitting place measurement test model taken care of in the keeping box 10
100 bottom faces are inserted into the transfer robot 30, then the transmitting place measurement test model 100 are lifted regulation height
Degree, the identification of side slit camera 131 or shooting are configured at the side slit of the side upper end of the model ontology 110
11, and the image shot to the cpu 140 transmission.Also, the identification of other side slit camera 132 is clapped
Take the photograph the other side slit 12 for the other side upper end for being configured at the model ontology 110, and to the cpu 140
Transmit the image of shooting.
Then, it is passed using the Wireless Fidelity communication of the cpu 140 to the image processing computer 60
Send the image.
Then, it using the image, is found out using subsequent calculating method and using the slit radiographic measurement component 130
The interval of test model 100 is used in the slit 11,12 and transmitting place measurement.
Then, it is passed using the Wireless Fidelity communication of the cpu 140 to the image processing computer 60
Send image.
Then, it using the image, is found out using subsequent calculating method and using the slit radiographic measurement component 130
The interval of test model 100 is used in the slit 11,12 and transmitting place measurement.
H shown in Figure 11 is using the value measured using the slit radiographic measurement component 130 come and calculating as follows
At value, the spacing value of the slit 11,12 and the transmitting place measurement test model 100 and be pre-stored within the shadow
As the normal fiducial value H' of processing computer 60 is compared.
That is, it is judged that as it is described measurement calculation height value the H value whether with the H' pre-entered
Value it is identical, thus judge whether using it is described transfer robot 30 come safely to it is described keeping box 10 outside take out or to
Inside is put into the transmitting place measurement test model 100 of the keeping box 10.
H1 is the vision technique using the image processing computer 60 to clap in the side slit camera 131
11 bottom faces of side slit and the model sheet that the image for the side identification range 133 taken the photograph is handled to extract
Perpendicular separation value between body 110.
D1 is the horizontal distance from the inside face for taking care of box 10 to the side slit camera 131, and described value is
It is prior-entered at the value of the image processing computer 60.
H4 is a half value of 11 height of side slit, and described value is prior-entered at the image processing computer 60
Value.
H5 is the vertical range that the center of camera 131 is measured from the upper end of the model ontology 110 to the side,
Described value is the value inputted in advance to the image processing computer 60.
Θ is in 90 °, except from the virtual center line in the direction of the side measurement shooting of camera 131 to the model
Calculation value except the angle of the shooting of ontology 110, described value are prior-entered at the image processing computer 60.
H2 is the height value removed from the h1, is asked using the θ pre-entered by the formula of h2=d1*tan (180- θ)
Interval out, the d1 and the θ for the formula are the value pre-entered, and therefore, the h2 is also the value pre-entered.
H3 removes the value of the h2 from h1, is found out by formula h3=h1-h2.
Value as described above is substituted into following mathematical expression to calculate the H.
H=h3+h4+h5
If the H value of the calculation and the described value pre-entered, the transmitting place measurement test mould
When type 100 takes out or be put into the keeping box 10 from the keeping box 10 by the transfer robot 30, it is judged as progress
The work of safety.
In the present embodiment, the example of the measurement method using the side slit camera 131 has been lifted, it is still, described another
Side slit camera 132 is also suitable measurement method identical with the mode of the side slit camera 131.
As described above, if comparing the H value calculated in the side slit camera side and in the other side slit
The calculated value H of camera side measurement, then can determine whether the side and the other side for the transmitting place measurement test model 100
Gradient it is whether parallel.
Also, in the H value of the calculating of the side slit camera 131 measurement and in other side slit camera
The difference of the H value of survey calculation can also calculate in 132, be based on this, can determine whether that the transmitting place measurement test model 100 is
It is no accurately to move.
The cpu 140 can be to the pre-prepd transmission of image processing computer 60 by the pin hole shadow
As the information that measuring part 120 or the slit radiographic measurement component 130 measure, the storage sky that can store the information is provided
Between, it is built-in with the Wireless Fidelity communication module (not shown) that the information can be transmitted to the image processing computer 60.
As described above, can be carried out by Wireless Fidelity when transmitting the information to the image processing computer 60
Communication, compared with the communication based on previous bluetooth (bluetooth), can carry out telecommunication and can transmit a large amount of numbers rapidly
According to.
In the present embodiment, it is shot in the pin hole radiographic measurement component 120 or the slit radiographic measurement component 130
Image and the measured value measured in the detection part 150 transmit to the cpu 140 and at the images
Computer 60 is managed to transmit.But each camera 121 of the pin hole radiographic measurement component 120,122,123, the slit shadow
As each camera 131,132 of measuring part 130 and each sensor of the detection part 150 are built-in with can be individual
The Wireless Fidelity chip for carrying out Wireless Fidelity communication is measured respectively or is shot even without the cpu 140
Information also in the form of independent to the image processing computer 60 transmit.
Also, in the present embodiment, for confirm the transmitting place measurement test model 100 whether normal movement
Calculation realizes that still, the cpu 140 itself calculates, and only drills in the image processing computer 60
The value of calculation is sent to the image processing computer 60.
In the present embodiment, the communication between the cpu 140 and the image processing computer 60
Cheng Zhong can carry out Wireless Fidelity communication, but it is also possible to use other wireless communications such as bluetooth, radio frequency (RF).
The detection part 150 can measure the surrounding enviroment of the transmitting place measurement test model 100 variation and
The transmitting place measurement gradient of test model 100 itself.
Wherein, the gradient of the transmitting place measurement test model 100 itself may be that the transmitting place is surveyed
The amount gradient of test model 100.
This detection part 150 is formed in the model ontology 110, can measure the model ontology 110 itself
The inclination sensor of the gradient of the vibrating sensor of vibration, the measurement transmitting place measurement test model 100 itself,
It can measure humidity temperature pickup, the measurement transmitting place measurement examination of the temperature humidity on 110 periphery of model ontology
The gas of gas sensor, measurement 100 periphery of transmitting place measurement test model whether testing the gas on 100 periphery of model
The multiple sensors such as the baroceptor of pressure are formed as one module to be built in the detection part 150, in this each biography
The measured value measured in sensor comes to the cpu 140 transmission to image processing computer 60 or other communication devices
Transmission.
As described above, measuring the transmitting place during transmitting place measurement is transferred with test model 100
The vibration of measurement test model 100 or the device of contact, can measure the periphery of the transmitting place measurement test model 100
Therefore the maintenance of surrounding enviroment conditions constant or sudden surge or external environment variation occur for temperature humidity etc..
Hereinafter, accurate transfer measurement method of the explanation using transmitting place measurement test model 100.Executing this
During kind of explanation, it will omit and the content repeat description recorded in the present invention.
It is taken out described in the keeping box 10 outward hereinafter, explanation is accurately measured using the transfer robot 30
The method (step S100) of transmitting place measurement test model test object body 50 or the chucking position being internally put into.
Firstly, the transfer robot 30 lifts the transmitting place measurement test mould in keeping box 10 keeping
Type 100 (step S110).
Later, in the step S110, the slit radiographic measurement component 130 identifies or shoots the transfer position lifted
Set the slit 11, the 12 (steps of 110 upper end of the model ontology 110 and the model ontology of measurement test model 100
S120)。
Wherein, in the step S120, the image (step of the transmission of Xiang Suoshu cpu 140 identification or shooting
S130)。
Then, in the step S130, Xiang Suoshu image processing computer 60 is transmitted to the cpu 140
The image (step S140) of transmission.
Then, in the step S140, institute is calculated by the image transmitted to the image processing computer 60
The interval of model ontology 110 and the slit 11,12 is stated to measure the position (step S150) of the model ontology 110.
As described above, measuring the mould by calculating the interval between the model ontology 110 and the slit 11,12
The position of type ontology 110, when the transmitting place measurement with test model 100 by the transfer robot 30 from the keeping
When box 10 takes out, the interval of measuring slit 11,12 in a manner of preventing from colliding the slit 11,12 in the keeping box 10.
That is, the transmitting place measurement test model 100 replaces the test object body 50 to prevent from colliding the guarantor
Interval between the mode measuring slit 11,12 of slit 11,12 in pipe box 10, later, when pass through the transfer robot 30
When taking out the test object body 50 in the keeping box 10, the keeping box 10 or internally is steadily taken out outward
It is put into measure.
Hereinafter, illustrating that measurement makes the transmitting place transferred by the transfer robot 30 to the fixed cell 27
100 center 127 of measurement test model folder identical with the center 23 of the guidance pin hole of the fixed cell 27 is formed in
Has the method (step S200) of position.
Firstly, keeping box 10 keeping the transmitting place measurement with test model 100 to the processing chamber housing
20 transfer and are placed in the transfer robot 30 (step S210).
Later, in the step S210, it is placed in the transmitting place measurement test of the transfer robot 30
Model 100 transfers (step S220) to the upper end of the fixed cell 27.
Later, it in the step S220, is surveyed in the transmitting place transferred to the upper end of the fixed cell 27
In amount test model 100, the identification of pin hole radiographic measurement component 120 or the guidance needle for shooting the fixed cell 27
Hole 22 (step S230).
In this step S230, the image (step S240) of the transmission of Xiang Suoshu cpu 140 identification or shooting.
Later, in step S240, Xiang Suoshu image processing computer 60 is transmitted to be transmitted to the cpu 140
The image (step S250).
Later, in step s 250, the transmitting place is judged by the image that the image processing computer 60 transmits
Whether measurement is placed in the preassigned position (step S260) of the fixed cell 27 with test model 100.
In the past, in order to confirm the transmitting place measurement test model 100 whether to the appropriate of the fixed cell 27
Position transfer and be additionally formed datum mark, as described above, the pin hole radiographic measurement component 120 identification be generally formed in it is described solid
The guidance pin hole 22 of order member 27 is used come the center 23 for judging the guidance pin hole and transmitting place measurement and tests mould
Whether 100 center 127 of type is consistent and the measurement transmitting place measures the transmitting place for using test model 100, it is therefore not necessary to volume
It is outer to form the datum mark.
The embodiment of invention
Hereinafter, illustrating the transmitting place measurement test model of another embodiment of the present invention referring to attached drawing.It is this executing
During explanation, it will omit and the content repeat description recorded in advance in the first embodiment of the invention.
Figure 12 is the transmitting place survey for being viewed from the front the pollution detection camera for being formed with second embodiment of the invention
The amount top view of test model.
Referring to Fig.1 2, in 210 upper end of model ontology of the embodiment of the present invention transmitting place measurement test model 200
Form pollution detection camera 260.
The pollution detection does not block pin hole radiographic measurement component 220 and slit radiographic measurement component 230 with camera 260
The range of shooting is formed in the upper end of the model ontology 210, when being worked, can shoot the model ontology 210
In front of upper end, transmitted to the image of cpu transmission shooting, or to image processing computer.
The transmitting place measurement is confirmed with the image that camera 260 is shot as described above, reading the pollution detection
With the substance of the pollution on 100 periphery of test model.For example, if shooting chamber by pollution detection camera 260, it can
It is confirmed whether internally to enter polluter.
Figure 13 is the state that the pin hole imaging sensor for shooting of third embodiment of the invention is in contact with fixed cell
Enlarged drawing.
Referring to Fig.1 3, pin hole is formed in the pin hole radiographic measurement component of the transmitting place measurement test model of the present embodiment
Imaging sensor 328 for shooting.
The pin hole imaging sensor 328 for shooting is formed in the bottom faces of the model ontology 310, shoots fixed cell
The state of 27 contacts, converts light to electric signal.
As shown in figure 13, if pin hole imaging sensor 328 for shooting shoots the fixed cell 27 and the pin hole
The state of 328 face contact of imaging sensor for shooting, then light is without the imaging sensor 328 for shooting of pin hole described in normal direction and described solid
The pin hole imaging sensor 328 for shooting of the part of order 27 face contacts of member projects, and light can only be projected to periphery.Therefore,
The part of 27 face contact of fixed cell is relatively dimmed.Therefore, shade is exported with positional value using vision technique,
Described value is judged as to the position of the fixed cell 27.
By the mode, other multiple described fixed cells 27 can also utilize this position with output position value
Value come calculate it is identical with the center of the fixed cell 27 guidance pin hole center, the transfer is judged using the value of calculating
Whether position measurement is accurately transferred to the fixed cell 27 with test model.
Figure 14 is the enlarged drawing for the state that the screen unit of fourth embodiment of the invention is in contact with fixed cell.
Referring to Fig.1 4, the pin hole radiographic measurement component of the transmitting place measurement test model of the present embodiment includes being formed in
The bottom faces of model ontology 410, bottom faces are in contact with fixed cell 27, the screen that can export the part of contact with coordinate value
Component 429.
The screen unit 429 can be touch screen, if described in touching in multiple fixed cells 27 of different location
Screen unit 429, then the part is exported respectively with coordinate value, and the fixed cell 27 is calculated using the coordinate value of output
Center judges whether the center of the fixed cell 27 calculated and the center of the transmitting place measurement test model are consistent
To judge whether the transmitting place measurement test model is accurately transferred to the fixed cell 27.
Figure 15 is that the transmitting place of the front camera parts viewed from above including fifth embodiment of the invention measures use
The figure of test model.
Referring to Fig.1 5, the embodiment of the present invention transmitting place measurement test model 500 includes model ontology 510, pin hole
Radiographic measurement component 520, slit radiographic measurement component 530, cpu 540 and front camera parts 560.
The front camera parts 560 are can observe the mobile road of the transmitting place measurement test model 500
The mode of diameter is installed on the model ontology 510, it is preferable that as shown in figure 15, is installed on the model ontology 510 diametrically
Both ends.
The front camera parts 560 shoot the front of the transmitting place measurement test model 500, and make work
Personnel transmit with confirming the image of shooting to pre-prepd image system.Wherein, the image system can be smart phone
Application or the system with the monitor that can confirm filmed image etc..
As described above, the transmitting place measurement test model can be observed in real time using the front camera parts
500 movement routine, therefore, can transmitting place measurement test model 500 described in real-time confirmation it is whether accurately mobile.Therefore,
The transmitting place measurement examination is placed with by the movement routine measurement judgement of the transmitting place measurement test model 500
Whether the robot for testing model 500 works normally.
More than, the present invention relatively shows and illustrates with specific embodiment, as long as the technical field of the invention is general
Logical technical staff, can be right in the range of thought and the region of the invention recorded in range are claimed without departing from above invention
The present invention carries out a variety of modification and deformation.But this modification and deformation and structure belong to invention of the invention and are claimed
In range.
Industrial availability
Test mould is used in measuring for semiconductor or the transmitting place of field of display systems according to an embodiment of the present invention
Type and accurate transfer measurement method using transmitting place measurement test model, by using image measuring device come true
Regular inspection survey subject whether the experimental rig of normal movement, with prevent test object body will not collide keeping box in slit side
Formula adjusts the height of slit, even if not forming additional datum mark, judges detection pair in the manufacturing apparatus using pin hole is lifted
As the position transfer whether body is normally transferred to needs, therefore, INDUSTRIAL APPLICABILITY is high.
Claims (11)
1. a kind of transmitting place measurement test model, suitable for include following device, in semiconductor or field of display systems
Used in equipment: keeping box, for loading test object body；Subject fixes device, including for fixing the detection pair
As the fixed cell of body；And transfer robot, for transferring the detection pair in the keeping box to the fixed cell
As body characterized by comprising
Model ontology, size are identical as the size of the test object body；
Pin hole radiographic measurement component can identify or shoot the multiple guidance pin holes for being formed in the fixed cell；And
Cpu, for being measured to the transmission of pre-prepd image processing computer by the pin hole radiographic measurement component
Information.
2. transmitting place measurement test model according to claim 1, which is characterized in that pin hole radiographic measurement portion
Part is by multiple pin holes camera structure for shooting for measuring the multiple guidance pin holes formed in the fixed cell respectively
At,
The identification range or coverage of the guidance pin hole are preset in pin hole camera for shooting.
3. transmitting place measurement test model according to claim 2, which is characterized in that the pin hole camera shooting for shooting
Head is formed in the bottom faces of the model ontology, and is formed the coverage pair with the preset guidance pin hole
It answers, and the state that pin hole camera for shooting is in contact with the fixed cell can be shot.
4. transmitting place measurement test model according to claim 1, which is characterized in that pin hole radiographic measurement portion
Part includes screen unit, and the screen unit is formed in the bottom faces of the model ontology, can be connected with the fixed cell
Touching, contacted part is exported by coordinate value.
5. a kind of transmitting place measurement test model, suitable for including following device semiconductor or field of display systems
The equipment used: keeping box, for loading test object body；Subject fixes device, including for fixing the test object
The fixed cell of body；And transfer robot, for transferring the test object in the keeping box to the fixed cell
Body characterized by comprising
Model ontology, size are identical as the size of the test object body；
Slit radiographic measurement component, the model ontology keeping it is described keeping box in the state of, can identify or shoot with
It is capable of the side at interval of the measuring configuration between the slit and the model ontology of the keeping box of the model ontology upper end
Formula is configured at the slit of the keeping box of the model ontology upper end；And
Cpu can be transmitted to pre-prepd image processing computer and be measured by the slit radiographic measurement component
Information.
6. transmitting place measurement test model according to claim 5, which is characterized in that
The slit radiographic measurement component includes that can identify that the side for the two sides upper end for being configured at the model ontology is narrow respectively
The side slit camera and other side slit camera of seam and other side slit,
The side slit and described is preset in the side slit camera and the other side slit camera
The identification range or coverage of other side slit.
7. transmitting place measurement test model according to claim 1, which is characterized in that the transmitting place measurement is used
Test model includes detection part, and the detection part can measure the surrounding enviroment of the transmitting place measurement test model
Variation and the transmitting place measurement use test model itself gradient.
8. transmitting place measurement test model according to claim 5, which is characterized in that the transmitting place measurement is used
Test model includes detection part, and the detection part can measure the surrounding enviroment of the transmitting place measurement test model
Variation and the transmitting place measurement use test model itself gradient.
9. a kind of transmitting place measurement test model, suitable for including following device semiconductor or field of display systems
The equipment used: keeping box, for loading test object body；Subject fixes device, including for fixing the test object
The fixed cell of body；And transfer robot, for transferring the test object in the keeping box to the fixed cell
Body characterized by comprising
Model ontology, size are identical as the size of the test object body；
Pin hole radiographic measurement component can identify or shoot the multiple guidance pin holes for being formed in the fixed cell；
Slit radiographic measurement component, the model ontology keeping it is described keeping box in the state of, can identify or shoot with
It is capable of the side at interval of the measuring configuration between the slit and the model ontology of the keeping box of the model ontology upper end
Formula is configured at the slit of the keeping box of the model ontology upper end；And
Cpu can be transmitted to pre-prepd image processing computer by the pin hole radiographic measurement component or institute
State the information of slit radiographic measurement component measurement.
10. a kind of accurate transmitting place measurement method using transmitting place measurement test model, the transmitting place measurement
Be suitable for the equipment used in semiconductor or field of display systems including following device with test model: keeping box is used for
Load test object body；Subject fixes device, including the fixed cell for fixing the test object body；And drag-over unit
Device people, for transferring the test object body in the keeping box, the transmitting place measurement examination to the fixed cell
Testing model includes: model ontology, and size is identical as the size of the test object body；Pin hole radiographic measurement component, can identify
Or shooting is formed in multiple guidance pin holes of the fixed cell；Slit radiographic measurement component exists in model ontology keeping
It is described keeping box in the state of, can identify or shoot with can measuring configuration in the model ontology upper end it is described keeping box
Slit and the model ontology between interval mode be configured at the model ontology upper end it is described keeping box institute
State slit；And cpu, it can transmit to pre-prepd image processing computer by the pin hole radiographic measurement
Component or the information of slit radiographic measurement component measurement, it is described to be transferred using the precision of transmitting place measurement test model
Location measurement method is characterized in that,
Include:
Step (1), keeping are placed in the transfer robot with test model in the transmitting place measurement of the keeping box；
Step (2), the transfer robot in the step (1) transfer the transfer position to the upper end of the fixed cell
Set measurement test model；
Step (3) measures the transmitting place transferred to the upper end of the fixed cell in the step (2) and uses
For test model, the pin hole radiographic measurement component identification or the guidance pin hole for shooting the fixed cell；
Step (4), Xiang Suoshu cpu are transmitted in the image of identification or shooting in the step (3)；
Step (5), Xiang Suoshu image processing computer are transmitted in the shadow transmitted in step (4) to the cpu
Picture；And
Step (6) judges the shifting according to the image transmitted in the step (5) to the image processing computer
The preassigned position for sending measurement test model in position whether can be placed in the fixed cell,
Will appreciate that whether the center of the transmitting place measurement test model is accurately right with the center of the guidance pin hole
Together.
11. the accurate transmitting place measurement method according to claim 10 using transmitting place measurement test model,
It is characterized in that,
Include:
Step (a), the transfer robot lift keeping in the transmitting place measurement test model of the keeping box；
Step (b), the slit radiographic measurement component identification or shooting upborne transmitting place in the step (a)
The model ontology of measurement test model and the slit of the model ontology upper end；
Step (c), Xiang Suoshu cpu are transmitted in the image of identification or shooting in the step (b)；
Step (d), Xiang Suoshu image processing computer are transmitted in the shadow transmitted in step (c) to the cpu
Picture；And
Step (e), can by the step (d) to the image processing computer transmit the image to calculate
It states the interval between model ontology and the slit and measures the position of the model ontology,
So as to accurately measure can using it is described transfer robot come safely to it is described keeping box outside take out or
Person is internally put into the position of the transmitting place measurement test model in the keeping box.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0015003 | 2017-02-02 | ||
| KR1020170015003A KR101987895B1 (en) | 2017-02-02 | 2017-02-02 | Test dummy for precision transfer position measurement using the semiconductor system or display system and precision transfer position measurement method using the test dummy |
| PCT/KR2017/002240 WO2018143506A1 (en) | 2017-02-02 | 2017-03-02 | Transfer location-measuring test dummy used in semiconductor or display system field and precise transfer measuring method using transfer location-measuring test dummy used in semiconductor or display system field |
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| Publication Number | Publication Date |
|---|---|
| CN110168712A true CN110168712A (en) | 2019-08-23 |
| CN110168712B CN110168712B (en) | 2023-05-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201780077231.4A Active CN110168712B (en) | 2017-02-02 | 2017-03-02 | Test model for measuring transfer position in semiconductor or display system field and precise transfer measurement method |
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| Country | Link |
|---|---|
| KR (1) | KR101987895B1 (en) |
| CN (1) | CN110168712B (en) |
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| WO (1) | WO2018143506A1 (en) |
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| KR102034288B1 (en) * | 2019-06-25 | 2019-10-18 | 최치원 | Apparatus for inspecting wafer loading using image |
| US11908722B2 (en) * | 2019-09-09 | 2024-02-20 | Kla Corporation | Automatic teaching of substrate handling for production and process-control tools |
| KR102221447B1 (en) * | 2019-09-24 | 2021-03-02 | 주식회사 커미조아 | Method and apparatus for detecting defects of plate |
| KR102294504B1 (en) * | 2019-12-30 | 2021-08-31 | (주) 예스티 | Test dummy for precision transfer position measurement of substrate |
| KR102240911B1 (en) * | 2020-01-29 | 2021-04-15 | 주식회사 투윈테크 | Position measurement test unit for alignment of gas distribution plate applied to semiconductor or display manufacturing and center alignment method using the position measurement test unit |
| KR102351993B1 (en) * | 2020-02-24 | 2022-01-18 | 주식회사 에스에스엠 | A dummy wafer |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20180090066A (en) | 2018-08-10 |
| KR101987895B1 (en) | 2019-06-12 |
| TWI665749B (en) | 2019-07-11 |
| TW201842606A (en) | 2018-12-01 |
| WO2018143506A1 (en) | 2018-08-09 |
| CN110168712B (en) | 2023-05-12 |
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