JP2006165586A - Substrate transportation apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a highly versatile substrate transportation apparatus capable of coping with various types of specifications by minimum design changes. <P>SOLUTION: A substrate transportation apparatus comprises a first transportation section 21 which takes out and stores a substrate 3 from and into a storing container 1a for storing the substrate 3, and a second transportation section 22 which transfers the substrate 3 to and from the first transportation section 21 and transfers the substrate 3 to and from apparatus units 42-1 to 42-n each of which performs a desired process for the substrate 3. The second transportation section 22 has rotary arms 34a, 34b, and 34c each of which is rotatably circulated through a substrate transfer position P1 of the first transportation section 21 and substrate transfer positions P2 and P3 of the apparatus unit. The first transportation section 21 is constructed separately and independently from the second transportation section 22. The first transportation section 21 is positioned in either of two different directions with respect to the second transportation section 22 in such a way that the substrate transfer position P1 of the rotary arm comes in different directions, but within a transportation stroke range of the first transportation section 21. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate transport apparatus that transports a substrate to an apparatus unit for inspecting and measuring a glass substrate of a flat panel display such as a semiconductor wafer or a liquid crystal display using visual observation or a microscope.

FIG. 20 is a configuration diagram of a semiconductor wafer appearance inspection apparatus. The wafer carrier 1 is provided on the appearance inspection apparatus base 2. The wafer carrier 1 is formed in a cassette.
The wafer carrier 1 includes an uninspected carrier 1a and an inspected carrier 1b. The uninspected carrier 1a accommodates an uninspected semiconductor wafer 3. As the semiconductor wafer 3, an uninspected semiconductor wafer is a semiconductor wafer 3a.
The transfer robot 4 is provided on the appearance inspection apparatus mount 2. The transfer robot 4 has an X movement axis 4a and a Y movement axis 4b. The Y movement axis 4b can move in the X axis direction on the X movement axis 4a. The robot arm 5 is provided on the Y movement axis 4b and is movable in the Y axis direction. The hand 5 a is provided on the robot arm 5. The hand 5 a holds the semiconductor wafer 3.

The three-arm transfer device 6 is provided between the transfer robot 4 and a micro inspection unit 9 described later. 3-arm carrying device 6, the semiconductor wafer 3, the wafer transfer position P _1, the macro inspection position P _2, it is circulated and conveyed to the micro inspection transfer position P _3.
In the three-arm transfer device 6, three transfer arms 6a, 6b, and 6c are provided at an equal angle with respect to the shaft 8, for example, every 120 degrees. These transfer arms 6a, 6b, 6c are provided with Y-shaped hands (with wafer chuck) 7a, 7b, 7c.
The micro inspection unit 9 is provided on the appearance inspection apparatus base 2. Microinspection section 9, the hand 7a which is positioning the micro inspection delivery position P _3, receives the semiconductor wafer 3 held on 7b or 7c, inspecting a semiconductor wafer 3 using a microscope.
The micro-inspection unit 9 can take an image of the semiconductor wafer 3 magnified with a microscope with a CCD camera or the like and observe it through the eyepiece 10.

  Next, the operation will be described.

In the macro inspection position P _2, the macro inspection is performed by visual inspection personnel against the semiconductor wafer 3.
At the micro inspection delivery position P ₃ , the semiconductor wafer 3 is delivered to the micro inspection portion 9. The micro inspection unit 9 enlarges an image of the semiconductor wafer 3 with an objective lens of a microscope and captures it with a CCD camera or the like. In the micro inspection unit 9, micro inspection is performed through the eyepiece 10 by the inspector.
When the macro inspection and the micro inspection are completed, the three-arm conveyance device 6 rotates about the shaft 8 counterclockwise on the drawing, for example. Thus, the hand 7a is positioning to the macro inspection position _{P 2.} Hand 7b is positioning the micro inspection delivery position _{P 3.} Hand 7c is positioning to the wafer transfer position _{P 1.}

The robot arm 5 is moved to the wafer transfer position P ₁ by the drive of the transfer robot 4 (shown by dashed lines). The robot arm 5 positions the hand 5a so as to enter the Y-shaped opening of the hand 7c, and receives the inspected semiconductor wafer 3b from the hand 7c.
Next, the robot arm 5 moves to a position corresponding to the inspected carrier 1b by driving the transfer robot 4, and stores the inspected semiconductor wafer 3b in the inspected carrier 1b.

  Subsequently, the robot arm 5 is moved to a position corresponding to the uninspected carrier 1a by driving the transfer robot 4, and the uninspected semiconductor wafer 3a (second semiconductor wafer) stored in the uninspected carrier 1a is moved. ).

Then, the robot arm 5, while holding the semiconductor wafer 3a uninspected, moves to a position corresponding to the wafer transfer position located P ₁ by the driving of the transfer robot 4.
Next, the robot arm 5 positions the hand 5a holding the semiconductor wafer 3a so as to enter the Y-shaped opening of the hand 7c, and transfers the semiconductor wafer 3a to the transfer arm 6c.
In the macro inspection position P _2, the macro inspection is performed by visual inspectors for the next semiconductor wafer 3.
At the micro inspection delivery position P ₃ , the next semiconductor wafer 3 is delivered to the micro inspection unit 9 and micro inspection is performed with a microscope.

Thereafter, in the wafer transfer position P ₁ is carried out passing the inspected semiconductor wafer 3b and the semiconductor wafer 3a uninspected, macro inspection is performed in the macro inspection position P _2, the micro inspection transfer position P ₃ Are sequentially transferred to the micro inspection unit 9.

  In the inspection process of a semiconductor manufacturing factory, the device layout and design specifications are changed due to line layout changes and various specifications (types). In the above-described apparatus, the wafer carrier 1, the transfer robot 4, the three-arm transfer device 6, the macro inspection unit, and the micro inspection unit 9 are integrally formed on the appearance inspection device base 2, and therefore, it is possible to easily cope with a change in specifications. I ca n’t.

For this reason, it is necessary to individually produce devices with different installation positions and the number of wafer carriers 1 according to the line layout and various specifications of the inspection process.
In addition, the design specifications of the devices differ according to the various specifications, and there are many non-common components among the components of each device.

  An object of the present invention is to provide a highly versatile substrate transfer apparatus that can cope with various specifications with minimal design changes.

  A substrate transfer apparatus according to a main aspect of the present invention transfers a substrate between a first transfer unit that takes out and stores a substrate from a storage container that stores the substrate, and the first transfer unit. And a second transfer unit that transfers to and from the apparatus unit that performs a desired process on the substrate. The second transfer unit includes a substrate transfer position of the first transfer unit and a substrate of the apparatus unit. The first transport unit is configured to be separated and independent from the second transport unit, and the first transport unit is different from the second transport unit. The transfer position of the rotary arm was set within the transport stroke range of the first transport unit in different directions so that it could be selectively arranged in two directions.

  According to the present invention, it is possible to respond to various specifications with a minimum design change and to provide a highly versatile substrate transport apparatus.

Hereinafter, a first embodiment of the present invention will be described in detail with reference to the drawings.
FIG. 1 is an overall configuration diagram of an appearance inspection apparatus provided in an inspection process of a semiconductor manufacturing factory.
The appearance inspection apparatus includes the substrate transfer apparatus 20 of the present invention. The device layout of the appearance inspection device corresponds to the first specification. In the first specification, the loader portion 21 is on the left side when viewed from the front side F, and the number of wafer carriers 1a is one.

In the wafer carrier 1a, a plurality of semiconductor wafers 3a and 3b are accommodated at a predetermined pitch in the vertical direction.
The substrate transport device 20 has a configuration in which a loader unit 21 and a macro inspection / transport unit 22 are separated and independent. The loader unit 21 corresponds to the first transport unit. The macro inspection / conveyance unit 22 corresponds to the second conveyance unit.
The loader unit 21 takes out the uninspected semiconductor wafer 3a accommodated in the wafer carrier 1a, passes it to the macro inspection / conveyance unit 22, and receives the inspected semiconductor wafer 3b from the macro inspection / conveyance unit 22 to receive the wafer carrier. A wafer transfer robot 23 stored in 1a is provided.

The loader unit 21 can be arranged in two delivery directions with respect to the macro inspection / conveyance unit 22. In the first delivery direction, the semiconductor wafer 3 is delivered from the left side A to the macro inspection / conveyance unit 22 when viewed from the front side F as shown in FIG.
In the second delivery direction, the semiconductor wafer 3 is delivered from the back side H of the macro inspection / transport unit 22 as shown in FIG. In this case, the loader unit 21 is disposed on the back side H of the macro inspection / conveyance unit 22.

The apparatus layout shown in FIG. 2 corresponds to the second specification in which the loader unit 21 is arranged on the rear side H of the macro inspection / conveyance unit 22 and the number of wafer carriers 1a is one.
Therefore, the substrate transfer apparatus 20 of the present invention can cope with the apparatus layouts of the first and second specifications.
The wafer transfer robot 23 is an articulated type formed by connecting three connecting arms 24 to 26. The arms of the robot are configured by connecting these connecting arms 24 to 26.

That is, one end of the connecting arm 24 is rotatably connected to the rotating shaft 27. The other end of the connecting arm 24 is rotatably connected to one end of the connecting arm 25. The other end of the connecting arm 25 is rotatably connected to one end of the connecting arm 26. A plate-like hand 28 is connected to the other end of the connecting arm 26.
As shown in FIG. 3, the plate-like hand 28 has a U-shaped escape portion 29 and a suction portion 30 formed in a quadrilateral shape.
A plurality of suction holes (with suction pads) 31 are formed concentrically on the suction portion 30. These suction holes 31 are formed on the surface of the suction part 30 on the side where the semiconductor wafer 3 is placed, and communicate with a suction pump (not shown).

  The configuration of the escape portion 29 will be described later.

The wafer transfer robot 23 expands and contracts by rotating at the joints of the connecting arms 24 to 26. The movement range of the hand 28 becomes the transfer stroke range by the expansion / contraction operation of the wafer transfer robot 23.
Accordingly, the wafer transfer robot 23 supplies / discharges the semiconductor wafer 3 from the left side (arrow A direction) with respect to the macro inspection / transfer unit 22 in the first specification shown in FIG.
Further, the wafer transfer robot 23 supplies / discharges the semiconductor wafer 3 from the back side (in the direction of arrow H) with respect to the macro inspection / transfer unit 22 in the second specification shown in FIG.
A wafer transfer device 32 is provided on the gantry of the macro inspection / transfer unit 22. The wafer transfer device 32 includes a rotating shaft 33 that rotates about the axial direction. The rotation shaft 33 is provided with three transfer arms 34a, 34b, and 34c at equal angles (for example, 120 degrees).

These transfer arms 34a, 34b, and 34c are respectively provided with L-shaped L-shaped hands (with wafer chuck) 35a, 35b, and 35c.
These L-shaped hands 35a, 35b, and 35c are formed in a substantially L shape as shown in FIG. FIG. 3 shows only the L-type hand 35a. The L-shaped hand 35a includes a hand bottom 35-1 and fingertips 35-2 and 35-3 formed at both ends of the hand bottom 35-1.

One fingertip 35-3 is formed shorter than the other fingertip 35-2. That is, when the plate-like hand 28 of the wafer transfer robot 23 is inserted from the second delivery direction from the back side H of the macro inspection / transfer unit 22, the fingertip 35-3 is connected to the plate-like hand 28 as shown in FIG. It is formed short so as not to interfere.
In the L-type hand 35a, a plurality of suction holes (with suction pads) 35-4 are formed at predetermined intervals. These suction holes 35-4 communicate with a suction pump (not shown).
The other L-type hands 35b and 35c have the same configuration as the L-type hand 35a, and a description thereof will be omitted.

Wafer transfer device 32, rotates about, for example, the drawing counterclockwise rotation shaft 33 (the arrow direction), the carrier arms 34a, 34b, the wafer transfer position _{P 1} 34c, respectively, macro inspection position _{P 2,} the micro inspection delivery circulating transport between positions P _3.
Center position of the wafer transfer position P ₁ is from a left wall surface E ₁ of the macro inspection and conveying unit 22 back side wall surface E ₂ Metropolitan equidistant. The center position of the wafer transfer position P ₁ is such that the distance from the left wall surface E ₁ and the rear side wall surface E ₂ to the rotation shaft 27 of the wafer transfer robot 23 is within the transfer stroke range of the wafer transfer robot 23. That's fine.
Further, the center position of the wafer transfer position P ₁ can also be stretchable direction of the connecting arm 24 to 26 which enters from the left wall surface E ₁ rear side wall surface E ₂ Metropolitan is set to the point of intersection.

The wafer transfer position P _1, the non-contact position sensor 36 to 39 for alignment of the semiconductor wafer 3 as shown in FIG. 3 are provided.
The non-contact position sensors 36 to 39 are arranged at respective positions corresponding to the outer peripheral edges (hereinafter referred to as wafer edges) of a plurality of semiconductor wafers 3 having different outer diameters, for example, each of the semiconductor wafers 3 having outer diameters of 200 mm and 300 mm. Has been.
A semiconductor wafer having an outer diameter of 200 mm is referred to as 3A, and a semiconductor wafer having an outer diameter of 300 mm is referred to as 3B.

The non-contact position sensors 36 to 39 detect the wafer edge of the semiconductor wafer 3A or 3B. The non-contact position sensors 36 to 39 are configured by arranging a plurality of solid-state imaging devices (CCD) in a plurality of rows, for example, one row, and arranging slits 36 a to 39 a on the front side of the CCD. The slits 36a to 39a are provided in parallel with the CCD arrangement direction.
Specifically four non-contact position sensor 36 to 39 are arranged concentrically at a position corresponding to the wafer edge position of the semiconductor wafer 3B outer diameter 300mm and the wafer transfer position P ₁ in the center.

Two non-contact position sensors 36 and 37 are combined as one set, and the other two non-contact position sensors 38 and 39 are combined as another set.
A non-contact position sensor 36 and 37 of each of these pairs, the non-contact position sensors 38 and 39, when the semiconductor wafer 3B outer diameter 300mm is positioning to the wafer transfer position _{P 1,} the four points of the semiconductor wafer 3B Wafer edge is detected.
On the other hand, when the semiconductor wafer 3A of the outer diameter of 200mm is positioning to the wafer transfer position _{P 1,} the semiconductor wafer 3A is between by the wafer transfer robot 23 and the non-contact position sensor 36 and 37 and the non-contact position sensors 38 and 39 Move back and forth.

When the semiconductor wafer 3A moves to the upper right, one non-contact position sensor 36, 37 detects two wafer edges of the semiconductor wafer 3A.
When the semiconductor wafer 3A moves to the lower left, the other two non-contact position sensors 38 and 39 detect two opposite wafer edges.
At this time, the non-contact position sensors 36 to 39 for alignment are plates for the first delivery direction from the left side A corresponding to the first specification and the second delivery direction from the back side H corresponding to the second specification. The arrangement relationship is such that it does not overlap with the hand 28.

The description returns to the plate-like hand 28. As shown in FIG. 3, the escape portion 29 of the plate-like hand 28 is the length of the L-type hands 35a, 35b, 35c when the plate-like hand 28 for delivering the semiconductor wafer 3 in the first delivery direction moves up and down. It is formed in a shape that avoids interference with the fingertip 35-2 of the scale.
When the semiconductor wafer 3 is transferred, the suction part 30 of the plate-like hand 28 enters the substantially L-shaped space of the L-type hand 35a as shown in FIG. At this time, the fingertip 35-2 of the L-shaped hand 35a enters the escape portion 29 of the plate-like hand 28. Further, the escape portion 29 avoids the detection visual field of the four non-contact position sensors 36 to 39.
The shape of the suction portion 30 of the plate-like hand 28 does not interfere with the L-type hand 35a (35b, 35c) in the first delivery direction and the second delivery direction as shown in FIGS. Is formed in a substantially square shape.

The shape of the suction portion 30 may be a circle as shown in FIG. 4 in addition to a square.
Further, the L-shaped hand 35a (35b, 35c) may be L-shaped as shown in FIG.
A positional relationship when the semiconductor wafer 3 is delivered between the circular hand 64 and the L-type hand 70a will be described with reference to FIG.
The circular hand 64 includes an escape portion 65 and a suction portion 66. A plurality of suction holes 67 with suction pads are formed in the suction part 66.
The L-type hand 70a is formed with one finger. The suction hole 71 has a suction pad.
This figure shows a state in which the circular hand 64 is inserted from an oblique direction into the L-shaped space of the L-type hand 70a. The oblique direction is to insert the circular hand 64 with respect to the axial direction K of the L-type hand 70a.

  In order to stabilize the delivery operation of the semiconductor wafer 3, the circular hand 64 and the L-type hand 70a are arranged in the following positional relationship.

Let m be the line connecting the tips S ₁ and S ₂ of the fingertips of the L-type hand 70a. In the state where the semiconductor wafer 3 is sucked and held on the suction portion 66 of the circular hand 64, the wafer center position of the semiconductor wafer 3 is F.
The circular hand 64 and the L-type hand 70a are arranged so that the position of the wafer center F is inside the hand with respect to the line m.
Distance _{K 1} to the wafer center F is the wafer inward from the line m, for example, the outer diameter 200mm semiconductor wafer 3, 6mm or more, it is desirable to be at least the semiconductor wafer 3 10 mm outside diameter 300 mm.

As described above, the operation of placing the position of the wafer center F of the semiconductor wafer 3 inside the line m of the L-type hand 70a is performed by, for example, expanding and contracting and rotating the connecting arms 24 to 26 of the wafer transfer robot 23.
When the operation of the wafer transfer robot 23 to position the semiconductor wafer 3 on the wafer transfer position P _1, the wafer center F of the semiconductor wafer 3 alignment based on the four detection results of the non-contact position sensor 36 to 39.
With this alignment, the position of the wafer center F of the semiconductor wafer 3 is arranged inside the L-type hand 70a.
Thus, when the semiconductor wafer 3 is delivered between the circular hand 64 and the L-type hand 70a, for example, the circular hand 64 with respect to the line m connecting the tips S ₁ and S ₂ of the fingertips of the L-type hand 70a. The wafer center F of the semiconductor wafer 3 adsorbed on the wafer is always located inside the line m.

Accordingly, there is no wobbling or flapping of the semiconductor wafer 3 between the circular hand 64 and the L-type hand 70a, so that it can be stably transported and delivered.
Further, when the wafer is delivered, the position of the wafer center F of the semiconductor wafer 3 is always located inside the hand by a distance K _{1 with} respect to the line m connecting the tips S ₁ and S ₂ of each fingertip of the L-type hand 22a. The semiconductor wafer 3 can be stably sucked and held on the hand 70a.
As shown in FIG. 5, an L-type hand 70a having fingertips 73 and 74 having different lengths may be used.
The fingertip 73 is formed longer than the fingertip 74. These fingertips 73 and 74 are formed in parallel to each other. The fingertips 73 and 74 are provided with a plurality of suction holes 76 with pads 75.

The delivery of the semiconductor wafer 3 is performed by inserting the circular hand 64 into the L-shaped space of the L-type hand 70a from an oblique direction.
At this time, the tips S ₃ and S ₄ of the fingertips 73 and 74 of the L-type hand 70a are connected by a line m.
The circular hand 64 and the L-type hand 70a are arranged as follows in order to stabilize the delivery operation of the semiconductor wafer 3.
In the L-type hand 70a, the position of the wafer center F of the semiconductor wafer 3 adsorbed on the circular hand 17 with respect to the line m is arranged inside the hand.
At this time, the wafer center F is disposed only on the wafer interior distance K ₁ than line m.

FIG. 6 shows another hand combination. The hand of the wafer transfer robot 23 is an L-type hand 77. The hand of the wafer transfer device 68 is an L-type hand 70a having fingertips 73 and 74 having different lengths.
The L-shaped hand 77 has two fingertips 78 and 79 that are orthogonal to each other. The L-type hand 77 is inserted in an oblique direction with respect to the axial direction K of the L-type hand 70a.
At this time, in the L-type hand 77, one fingertip 78 is arranged in parallel to the fingertip 74 of the L-type hand 70a, and the other fingertip 79 is arranged in parallel to the bottom 80 of the L-type hand 70a.
The delivery of the semiconductor wafer 3 is performed by inserting the L-type hand 77 into the L-type hand 70a from an oblique direction.

The L-type hand 77 and the L-type hand 70a are arranged as follows in order to stabilize the delivery operation of the semiconductor wafer 3.
A line m connecting the tips S ₃ and S ₄ of the fingertips 73 and 74 of the L-type hand 70a is assumed.
The semiconductor wafer 3 is held by suction on the L-type hand 77. The position of the wafer center F of the semiconductor wafer 3 is disposed only on the inner side of the L-type hand 70a distance K ₁ than line m.
At the same time, a line n connecting the tips S ₅ and S ₆ of the fingertips 78 and 79 of the L-type hand 77 is assumed.

Position of the wafer center F of the semiconductor wafer 3 is disposed only on the inner side of the L-type hand 77 Distance K ₂ than the line n.
These distances K ₁ and K ₂ are desirably 6 mm or more for the semiconductor wafer 3 having an outer diameter of 200 mm and 10 mm or more for the semiconductor wafer 3 having an outer diameter of 300 mm, for example.

The macro inspection position P ₂ is provided with a macro inspection swing mechanism 40 that swings while holding the semiconductor wafer 3 and macro-inspects the front and back surfaces of the semiconductor wafer 3 with the eyes of an inspector.
Above this macro inspection position P _2, the illumination device 53 (FIG. 8) is arranged for macro examination for illuminating the surface of the semiconductor wafer 3.
The monitor 41 is provided at a position that does not interfere with the macro inspection around the line-of-sight range θ where the inspector Q observes the semiconductor wafer 3 on the macro inspection swing mechanism 40.
The monitor 41 has an enlarged image of the semiconductor wafer 3 imaged by the imaging device 47, an inspection result of a macro inspection or a micro inspection, a screen for inputting the inspection result, and a plurality of inspection apparatus units 42-1 described later. Data regarding the operations of .about.42-n are displayed.

The monitor 41 is, for example, a CRT display or a liquid crystal display.
In the present embodiment, the monitor 41 is provided on the left side of the line-of-sight range θ of the inspector Q during the macro inspection. Thus, for example, the eyepiece 48 and the monitor 41 of the inspection apparatus unit 42-1 are arranged close to each other on the left and right with the macro inspection rocking mechanism 40 having a high observation frequency as a center.
The height position of the monitor 41 is substantially the same as the height position of the eyepiece lens 48, that is, when the inspector Q is positioned in front of the operation unit 45 of the inspection apparatus unit 42-1, It becomes the same height position as the height position.
The right side wall _{E 3} macro inspection and conveying section 22, the inspection apparatus units 42-1 to 42-n adapted to the inspection item of the plurality of test equipment units 42-1 to 42-n are incorporated.
These inspection units 42-1 to 42-n are various inspection units such as an inspection unit 42-1 for micro inspection of the semiconductor wafer 3 and an inspection unit 42-n for film thickness measurement of the semiconductor wafer 3.

The inspection unit 42-1 for micro inspection includes a micro inspection unit 44 and an operation unit 45 on the gantry 43.
Micro inspection 44, the hand 34a, which is positioning the micro inspection transfer position P _3, receives the semiconductor wafer 3 held on 34b or 34c, the semiconductor wafer 3 to the micro test using a microscope 46.
The micro inspection unit 44 includes a substrate adsorption unit 44a. The substrate suction portion 44 a is provided on the micro inspection XY stage 44 b of the micro inspection portion 44.
The substrate suction unit 44 a sucks and holds the semiconductor wafer 3 received from the L-type hand 35 a, 35 b, or 35 c and sets it in the micro inspection unit 44.
Position of the substrate attracting portion 44a is, L-type hand 35a is positioning the micro inspection transfer position _{P 3,} and is movable to a position of 35b or 35c.
In the micro-inspection unit 44, the image of the semiconductor wafer 3 magnified by the microscope 46 can be imaged by an imaging device 47 such as a CCD camera or can be observed through an eyepiece 48.
The operation unit 45 performs a macro inspection operation, a micro inspection operation, an operation for inputting these inspection results, and an operation for inputting various data such as data relating to the operation of the entire appearance inspection apparatus. .

The inspection unit 42-n for film thickness measurement includes a film thickness measurement unit 50 and an operation unit 51 on a gantry 49.
The film thickness measuring unit 50 measures the film thickness of the thin film formed on the surface of the semiconductor wafer 3. The film thickness measuring unit 50 is provided with an observation window 52 on the front side.
The operation unit 51 receives various data such as a macro inspection operation, a film thickness measurement operation, an operation for inputting each result of the macro inspection and the film thickness measurement, and data relating to the operation of the entire appearance inspection apparatus. Input operation.

Next, the operation of the apparatus configured as described above will be described.
First, the case where the inspection unit 42-1 is incorporated in the first specification of the apparatus layout will be described with reference to FIG.
FIG. 8 shows a front view of the device in the first specification. The macro inspection illumination device 53 is provided above the macro inspection swing mechanism 40.
Here, for example, a hand 34a of the wafer transfer device 32 is positioning the wafer transfer position P _1. Hand 34b is positioning the macro inspection position _{P 2.} L-type hand 35c is positioning to the micro inspection transfer position P _3.

In the wafer transfer position P _1, the wafer transport robot 23, facing arm rotates about an axis of rotation 27 in the installation direction of the wafer carrier 1a.
Next, the wafer transfer robot 23 sucks and holds the uninspected semiconductor wafer 3a accommodated in the wafer carrier 1a by extending the connecting arms 24 to 26.
Next, the wafer transfer robot 23 contracts each of the connecting arms 24 to 26 and the plate-like hand 28, and then, for example, rotates counterclockwise by 90 degrees counterclockwise, and stops in the wafer transfer position P ₁ direction of the macro inspection / transfer unit 22. Turn your arm to.

Next, the wafer transport robot 23, the connection arms 14 to 16 and the plate-like hand 28 extended in the direction of arrow A again, by inserting the plate-like hand 28 from the left side wall surface E ₁ of the macro inspection and conveying section 22, the wafer stopping on the transfer position P _1.
At this time, the plate-like hand 28 of the wafer transfer robot 23 is positioned within the L-shaped opening of the L-type hand 35a of the wafer transfer device 32 as shown in FIG.
A non-contact position sensor 36 and 37, the non-contact position sensor 38 and 39, for example, when the semiconductor wafer 3B outer diameter 300mm is positioning to the wafer transfer position _{P 1,} detects the wafer edge at four positions of the semiconductor wafer 3B To do.
On the other hand, when the semiconductor wafer 3A of the outer diameter of 200mm is positioning to the wafer transfer position P _1, by the wafer transfer robot 23 is reciprocated a semiconductor wafer 3A to two pairs of non-contact position sensor direction, the non-contact position sensor 36 and 37 The four wafer edges of the semiconductor wafer 3A are detected by the non-contact position sensors 38 and 39.

Of these four edge position signals, the wafer center position of the semiconductor wafer 3B or 3A is calculated from a known circle equation from three edge positions that do not overlap the orientation flat or notch.
Based on this calculation result, the wafer transfer robot 23 is controlled and aligned so that the wafer center of the semiconductor wafer 3B or 3A coincides with the center position of the wafer delivery position P1.

Next, the wafer transfer robot 23 releases the suction to the semiconductor wafer 3a and transfers the semiconductor wafer 3a on the plate-like hand 28 to the L-type hand 35a.
That is, the wafer transfer robot 23 places the plate-like hand 28 that holds the semiconductor wafer 3a above the hand 34a, and then lowers and hands the aligned semiconductor wafer 3a to the L-type hand 35a.
At this time, as shown in FIG. 3, the plate-like hand 28 of the wafer transfer robot 23 enters the substantially L-shape of the L-type hand 35 a of the wafer transfer device 32, and the length of the L-type hand 35 a extends to the escape portion 29. The fingertip 35-2 of the side enters.

In macro inspection position P _2, the semiconductor wafer 3 is attracted and held by the L-type hand 35b are passed to the macro inspection oscillating mechanism 40.
At this time, the L-type hand 35b releases the suction to the semiconductor wafer 3.
The macro inspection rocking mechanism 40 moves, for example, from the lower side to the upper side of the L-type hand 35b and receives the semiconductor wafer 3 held by the L-type hand 35b.
The macro inspection swing mechanism 40 swings while holding the semiconductor wafer 3. The semiconductor wafer 3 is irradiated with illumination light from the illumination device 53 for macro inspection at a predetermined incident angle.
The inspector Q performs macro inspection by visually observing scattered light from the surface of the oscillating semiconductor wafer 3.

When the macro inspection is completed, the macro inspection swing mechanism 40 transfers the semiconductor wafer 3 to the L-type hand 35b. At this time, the macro inspection swing mechanism 40 moves, for example, from the upper side to the lower side of the L-type hand 35b, and transfers the semiconductor wafer 3 to the L-type hand 35b.
In microinspection transfer position P _3, the inspection unit 42-1 for micro inspection is accurate by aligner while placed receives the semiconductor wafer 3 is held on the L-type hand 35c in the substrate attracting portion 44a Align.
The substrate suction portion 44 a sucks and holds the semiconductor wafer 3 received from the L-type hand 35 c and sets it in the micro inspection portion 44.
The micro inspection unit 44 moves the microscope 46 in the XY directions to scan the entire surface of the semiconductor wafer 3. Thereby, the semiconductor wafer 3 is magnified by the objective lens of the microscope 46, and the magnified image is captured by a CCD camera or the like.
At the same time, an enlarged image of the semiconductor wafer 3 is observed by the inspector Q through the eyepiece lens 48. The inspector Q observes an enlarged image of the semiconductor wafer 3 through the eyepiece lens 48 and performs micro inspection.

  When the micro-inspection is completed, the inspection unit 42-1 takes out the inspected semiconductor wafer 3b from the inside and transfers it onto the L-type hand 35c.

During the macro inspection and the micro inspection, the inspector Q observes the semiconductor wafer 3 placed on the macro inspection swing mechanism 40 by moving the line of sight slightly to the left from the front in front of the macro inspection / conveying unit 22. And perform a macro inspection.
At the same time, the inspector Q performs micro inspection by observing the enlarged image of the semiconductor wafer 3 displayed on the monitor 41 by moving the line of sight slightly to the left side of the macro inspection swing mechanism 40.

  At the time of macro inspection, the defect data and defect image extracted in the previous process are displayed on the monitor 41, so that the noticeable defect extracted in the previous process can be easily recognized, and a new defect generated in this process Can be easily found.

When the inspector Q actually wants to observe an enlarged image of the semiconductor wafer 3, the inspector Q can perform micro observation with the eyepiece 48 by moving the line of sight to the front.
When the macro inspection and the micro inspection are completed, the wafer transfer device 32 rotates again around the rotation shaft 33, for example, counterclockwise on the drawing.
Thus, L-type hand 35a of the wafer transfer device 32 is positioning the macro inspection position _{P 2,} L-type hand 35b is positioning the micro inspection transfer position _{P 3,} L-type hand 35c is positioning to the wafer transfer position _{P 1} The

In the wafer transfer position P _1, while running the macro inspection and micro inspection, the inspected semiconductor wafer 3b is returned by the wafer transfer robot 23 to the wafer carrier 1a, the semiconductor wafer 3a untested wafer carrier 1a withdrawn, in the same manner as described above, is positioned at the wafer transfer position P _1.
Thereafter, the wafer transfer device 32 rotates the three transfer arms 34a, 34b, and 34c at equal angles (for example, 120 degrees).

The three transfer arms 34a, 34b, and 34c are circulated and transferred between the wafer delivery position P ₁ , the macro inspection position P ₂ , and the micro inspection delivery position P ₃ .
However, in the wafer transfer position P ₁ passing between the inspected semiconductor wafer 3b and the semiconductor wafer 3a untested performed.
In macro inspection position P _2, the macro inspection of the semiconductor wafer 3 is performed.
In microinspection transfer position P _3, macro inspection of the semiconductor wafer 3 is performed.

Next, a case where the apparatus layout is the second specification and the inspection unit 42-1 is incorporated will be described with reference to FIG.
In the configuration corresponding to the second specification, the delivery direction of the semiconductor wafer 3 to and from the macro inspection / transfer unit 22 by the loader unit 21 is performed from the rear side H direction of the macro inspection / transfer unit 22.
The macro inspection and micro inspection operations in the macro inspection / conveyance unit 22 are the same as those in the first specification, and a detailed description thereof will be omitted.

The delivery direction of the semiconductor wafer 3 between the loader unit 21 and the macro inspection / conveyance unit 22 is a direction (arrow H) different from the delivery direction (arrow A direction) of the first specification shown in FIG. Direction).
The wafer carrier 1a is integrally provided on the left side of the loader unit 21.
Note that the wafer carrier 1 a may be provided on the right side of the loader unit 21, and can be arranged by being rotated 180 degrees around the rotation shaft 27 of the wafer transfer robot 29.
Next, differences in the delivery of the semiconductor wafer 3 between the loader unit 21 and the macro inspection / conveyance unit 22 from the first specification apparatus shown in FIG. 7 will be described.

In the wafer transfer position P _1, the wafer transport robot 23 is in a state in which the wafer carrier 1a taken out of the semiconductor wafer 3a uninspected, extend the connection arms 24 to 26 and the plate-like hand 28 in the direction of arrow H, the plate-like hand 28 is inserted from the left side wall surface E ₂ of the macro inspection and conveying unit 22, is stopped on the wafer transfer position P _1.
At this time, the plate-like hand 28 of the wafer transfer robot 23 is positioned within the L-shaped opening of the L-type hand 35 a of the wafer transfer device 32.
In the first and second specifications described with reference to FIGS. 7 and 9, the case where the inspection unit 42-1 for micro inspection is incorporated has been described.
In the first embodiment, instead of a micro inspection unit incorporating an optical microscope, an inspection unit for micro observation such as AFM (Atomic Force Microscope) or LSM (Laser Laser Scanning Microscope), film thickness measurement or line width measurement, etc. The inspection unit can be incorporated.
For example, when incorporating the inspection unit 42-n for the film thickness measurement shown in FIGS. 1 and 2, (a film thickness measurement position in this case) micro inspection transfer position at P _3, it is formed on the semiconductor wafer 3 surface on Measure the thickness of the thin film.
At this time, the inspector Q performs the macro inspection operation, the film thickness measurement operation, the operation for inputting the results of the macro inspection and the film thickness measurement, and the entire appearance inspection apparatus. The operation to input various data such as data relating to the operation.

More specifically, the inspector Q moves the line of sight slightly to the left from the front of the film thickness measurement unit 41-n and observes the semiconductor wafer 3a on the macro inspection swing mechanism 40 to perform the macro inspection. I do.
The inspector Q can move the line of sight slightly to the left from the direction of observing the macro inspection swing mechanism 40 and observe the semiconductor wafer 3a being measured from the image displayed on the monitor 41.
The inspector Q can observe the actual semiconductor wafer 3a through the observation window 52, and can reduce the trouble of observation by reducing the movement of the line of sight during the inspection.
The inspector Q inputs the inspection results of the macro inspection and the film thickness measurement from the operation unit 45 or 51. However, the inspector Q can reduce the moving range of the line of sight and can reduce the troublesome observation.

As described above, according to the first embodiment, the substrate transfer device 20 is configured such that the loader unit 21 and the macro inspection / transfer unit 22 are separated and independent, and the wafer transfer position of the macro inspection / transfer unit 22 is set. The center position of P ₁ is set within the transfer stroke range of the wafer transfer robot 23 with respect to the left wall surface E ₁ and the back side wall surface E ₂ .
By adopting such a configuration, the loader unit 21 can be easily arranged with respect to the macro inspection / conveying unit 22 in the two delivery directions which are the first and second specifications.
Preferably, the center position of the wafer transfer position P _1, by setting the same distance the left wall E ₁ macro inspection and conveying unit 22 and to the back side wall surface E _2, without changing the design of the loader unit 21 The arrangement position can be changed.
Therefore, for example, when the conveyance path in the facility is on the left side or the back side of the appearance inspection device, or in accordance with the shape of the space in the facility where the appearance inspection device is installed, the device layout of the first or second specification. Can be easily accommodated.

Even when the specification of the device layout in the inspection process of the semiconductor manufacturing factory is changed to one of the first and second specifications, the direction in which the semiconductor wafer 3 is supplied / discharged to / from the macro inspection / transfer unit 22 is changed. The macro inspection / conveying section 22 can be easily changed in the direction from the left side or the back side.
Even if the specification is changed to the first or second specification, there are many common components, and it does not take time to change the specification.
Furthermore, the first or second specification can be dealt with with a minimum design change, and can be highly versatile.
Further, various micro observation inspection units or various measurement inspection units can be easily incorporated in accordance with the inspection items for the semiconductor wafer 3.
The plate-like hand 28 of the wafer transfer robot 23 integrally forms a square-shaped escape portion 29 and a suction portion 30 in which a plurality of suction holes 31 for sucking the semiconductor wafer 3 are formed.

Relief portion 29 is formed in a shape to avoid the non-contact position sensor 36 to 39 for alignment disposed in transfer position P ₁ of the semiconductor wafer 3 in the macro inspection and conveying section 22.

On the other hand, the L-shaped hands 35a, 35b, and 35c of the wafer transfer device 32 are substantially L-shaped, with one fingertip 35-2 being long and the other fingertip 35-3 being short.
Accordingly, the plate-like hand 28 of the wafer transfer robot 23 can enter the L-type hands 35a, 35b, 35c of the wafer transfer device 32 from two directions, and the semiconductor wafer 3 corresponding to the first and second specifications. Can be delivered.
The center position of the semiconductor wafer 3 is aligned when the semiconductor wafer 3 is delivered. At this time, the detection operations of the four non-contact position sensors 36 to 39 for alignment are not blocked.

A monitor 41 for both macro inspection and micro inspection is provided around the line-of-sight range θ in which the inspector Q observes the semiconductor wafer 3 on the macro inspection rocking mechanism 40, and the macro inspection rocking mechanism 40 with high observation frequency is the center. In addition, the eyepiece 47 of the inspection unit 42-1 for micro inspection and the monitor 41 are arranged close to each other.
As a result, the inspector Q can move the line of sight slightly from the front in front of the operation unit 45 and observe the semiconductor wafer 3 on the macro inspection swing mechanism 40 to perform the macro inspection. The inspector Q can move the line of sight slightly to the left side and input various information while viewing the macro inspection result on the monitor 41.

At the same time, the inspector Q can perform the micro inspection by observing the enlarged image of the semiconductor wafer 3 displayed on the monitor 41 during the micro inspection.
Furthermore, an enlarged image of the actual semiconductor wafer 3 can be observed through the eyepiece 48. Thereby, when performing micro observation in detail over time, the inspector Q only needs to move the line of sight to the front. The inspector Q can reduce the troublesome observation by reducing the movement of the line of sight during the inspection.

Next, a second embodiment of the present invention will be described with reference to the drawings. The same parts as those in FIG. 7 are denoted by the same reference numerals, and detailed description thereof is omitted.
FIG. 10 is an overall configuration diagram of an appearance inspection apparatus provided in an inspection process of a semiconductor manufacturing factory.

The appearance inspection apparatus integrates the macro inspection / conveying unit 22 and the inspection unit 42-1 for micro inspection shown in FIG.
The inspection unit 50 includes a macro inspection / conveying unit 22 and a micro inspection unit 42-1 on an inspection unit base 51.
Therefore, the loader unit 21 and the inspection unit 50 are separated and independent from each other.

  The loader unit 21 can be arranged in two delivery directions with respect to the inspection unit 50. In the first delivery direction, the semiconductor wafer 3 is delivered to the inspection unit 50 from the left side when viewed from the front side F as shown in FIG.

This apparatus layout has a third specification in which there is a delivery place of the semiconductor wafer 3 on the left side, the number of installed wafer carriers 1a is one, and the macro inspection / transfer unit 22 and the inspection unit 42-1 are integrated. It corresponds.
In the second delivery direction, the semiconductor wafer 3 is delivered from the back side H of the inspection unit 50 as shown in FIG. In this case, the loader unit 21 is disposed on the back side H of the inspection unit 50.
In this apparatus layout, the loader unit 21 is arranged on the back side H of the inspection unit 50, the number of wafer carriers 1a is one, and the macro inspection / transfer unit 22 and the inspection unit 42-1 are integrated. It corresponds to the fourth specification.

Even if the inspection unit 50 integrates the macro inspection / conveyance unit 22 and the inspection unit 42-1, the arrangement relationship between the macro inspection / conveyance unit 22 and the inspection unit 42-1 is the same as that in the first embodiment. It is the composition.
Center position of the wafer transfer position P ₁ is from a left wall surface E ₁ of the inspection unit 50 the rear side wall surface E ₂ Metropolitan equidistant. In addition, the center position of the wafer transfer position P ₁ is such that the distance to the rotating shaft 29 of the wafer transfer robot 23 is within the transfer stroke range of the wafer transfer robot 23.
The operation of the apparatus configured in this way is the same as that of the apparatus shown in FIGS. 7 and 9, and the description thereof is omitted because it is redundant.

As described above, according to the second embodiment, the loader unit 21 and the inspection unit 50 are separated and independent, and the loader unit 21 has the third and fourth specifications for the inspection unit 50. It can be arranged in the direction of direction transfer.
Therefore, for example, when the conveyance path in the facility is on the left side or the back side of the appearance inspection device, or in accordance with the shape of the space in the facility where the appearance inspection device is installed, the device layout of the third or fourth specification. Can be easily accommodated.
Since the inspection unit 50 integrates the macro inspection / conveyance unit 22 and the inspection unit 42-1 for micro inspection, it is necessary to adjust the alignment when the inspection unit 42-1 is incorporated into the macro inspection / conveyance unit 22. There is no.
Further, according to the second embodiment, the same effect as that of the first embodiment can be obtained.

Next, a third embodiment according to the present invention will be described with reference to the drawings. The same parts as those in FIG. 10 are denoted by the same reference numerals, and detailed description thereof is omitted.
FIG. 12 is an overall configuration diagram of an appearance inspection apparatus provided in an inspection process of a semiconductor manufacturing factory. The inspection unit 50 according to the third embodiment is the same as that shown in FIG. 10 and has a structure in which the loader unit 54 is different.

The appearance inspection apparatus is compatible with the fifth specification in which the semiconductor wafer 3 is delivered from the left side of the inspection unit 50 and the number of wafer carriers 1a and 1b is two.
The loader unit 54 is disposed on the left side as viewed from the front side F of the inspection unit 50. The loader unit 54 is provided with a shift mechanism 55. The wafer transfer robot 56 is provided on the shift mechanism 55.

The shift mechanism 55 moves the wafer transfer robot 56 in a direction (arrow C direction) that reciprocates between the front side F and the back side H of the inspection unit 50.
The wafer transfer robot 56 supplies / discharges the semiconductor wafer 3 to / from the inspection unit 50 from the left surface side (arrow A direction) of the inspection unit 50.
The wafer transfer robot 56 has the same configuration as the wafer transfer robot 23 used in the first and second embodiments. That is, the wafer transfer robot 23 is a multi-joint type in which three connecting arms 24 to 26 are connected to form an arm.

The loader unit 54 includes two wafer carriers 1a and 1b. These wafer carriers 1 a and 1 b are placed on the left side of the loader unit 54.
In these wafer carriers 1a, uninspected semiconductor wafers 3a are accommodated. Inspected semiconductor wafer 3b is accommodated in wafer carrier 1b.

In the device layout corresponding to the fifth specification, the delivery direction of the semiconductor wafer 3 to the inspection unit 50 by the loader unit 54 is performed from the left side (arrow A direction) of the inspection unit 50.
As shown in FIG. 13 or FIG. 14, the loader unit 54 can change the installation direction or installation position with respect to the inspection unit 50 according to the apparatus layout.

The apparatus layout shown in FIG. 13 is a sixth layout in which the semiconductor wafer 3 is delivered from the left side of the inspection unit 50, two wafer carriers 1a and 1b are juxtaposed with the inspection unit 50, and the number of installations is two. It corresponds to the specification.
In the loader unit 54, the wafer transfer robot 56 moves in the left-right direction (arrow C direction) by driving the shift mechanism 55.
The two wafer carriers 1a and 1b are placed on the loader unit 54 on the front side.

The apparatus layout shown in FIG. 14 corresponds to the seventh specification in which the semiconductor wafer 3 is transferred from the back surface side H of the inspection unit 50 and two wafer carriers 1a and 1b are arranged on the back side of the loader unit 54.
The loader unit 54 is disposed on the back side H of the inspection unit 50. In the loader unit 54, the wafer transfer robot 56 moves in the left-right direction (arrow C direction) by driving the shift mechanism 55.
The wafer transfer robot 56 supplies / discharges the semiconductor wafer 3 from the back side (in the direction of arrow H) of the inspection unit 50.
Two wafer carriers 1 a and 1 b are mounted on the loader unit 54 on the back side of the loader unit 54.
The operations of the macro inspection and the micro inspection in the inspection unit 50 are the same as those in the third and fourth specifications, and detailed description thereof is omitted.

Next, delivery of the semiconductor wafer 3 to the inspection unit 50 by the loader unit 54 in the fifth specification shown in FIG. 12 will be described.
The wafer transfer robot 56 is moved to a position corresponding to the wafer delivery position P ₁ by driving the shift mechanism 55.
Thereafter, the wafer transport robot 56 is stretched in the direction of the arrow A from the left side of the inspection unit 50 to the connection arms 24 to 26 and the plate-like hand 28, to position the plate-like hand 28 to the wafer transfer position P ₁ (dashed line Indicated by).

Transfer of the semiconductor wafer 3 at the wafer transfer position _{P 1,} macro inspection in macro inspection position _{P 2,} the macro inspection is finished in microinspection transfer position _{P 3,} the wafer transfer device 32, the three transport arms 34a, 34b, 34c Are circulated between the wafer delivery position P ₁ , the macro inspection position P ₂ , and the micro inspection delivery position P ₃ .

At this time, the plate-like hand 28 of the wafer transfer robot 56 is positioned within the L-shaped opening of the L-type hand 35c of the transfer arm 34c, and receives the inspected semiconductor wafer 3b from the L-type hand 35c.
Next, the wafer transfer robot 56 contracts the connecting arms 24 to 26 and the plate-like hand 28 in the direction of arrow A from the left side of the inspection unit 50 while holding the semiconductor wafer 3b.
Next, the wafer transfer robot 56 stops by rotating, for example, clockwise by 180 degrees, and extends the connecting arms 25 to 28 and the plate-like hand 28 again to store the semiconductor wafer 3b in the wafer carrier 1b.

  Subsequently, the wafer transfer robot 56 moves to a position corresponding to the wafer carrier 1a by driving the shift mechanism 55 in a state where the connection arms 24 to 26 and the plate-like hand 28 are contracted.

Next, the wafer transfer robot 56 stretches each of the connecting arms 24 to 26 and the plate-like hand 28 to suck and hold the uninspected semiconductor wafer 3a stored in the wafer carrier 1a.
Next, the wafer transfer robot 56 contracts each of the connecting arms 24 to 26 and the plate-like hand 28 and stops, for example, by rotating 180 degrees counterclockwise and driving the shift mechanism 55 to a position corresponding to the wafer delivery position P _1. Move to.
Next, the wafer transport robot 56 extends the connection arms 24 to 26 and the plate-like hand 28 in the arrow A direction from the left side of the inspection unit 50 again moves the plate-like hand 28 to the wafer transfer position P _1, Not The semiconductor wafer 3a for inspection is transferred to the L-type hand 35c.

Next, delivery of the semiconductor wafer 3 to the inspection unit 50 by the loader unit 54 in the sixth specification shown in FIG. 13 will be described.
The wafer transfer robot 56 moves to the inspection unit 50 side (right side) by driving the shift mechanism 55.
Transfer of the semiconductor wafer 3 at the wafer transfer position _{P 1,} macro inspection in macro inspection position _{P 2,} the macro inspection is finished in microinspection transfer position _{P 3,} the wafer transfer device 32, the three transport arms 34a, 34b, 34c Are circulated between the wafer delivery position P ₁ , the macro inspection position P ₂ , and the micro inspection delivery position P ₃ .

Next, the wafer transport robot 56 is stretched in the direction of the arrow A from the left side of the inspection unit 50 to the connection arms 24 to 26 and the plate-like hand 28, to position the plate-like hand 28 to the wafer transfer position P ₁ (dashed line Indicated by).
At this time, the plate-like hand 28 of the wafer transfer robot 56 is positioned within the L-shaped opening of the L-type hand 35c of the transfer arm 34c, and receives the inspected semiconductor wafer 3b from the L-type hand 35c.
Next, the wafer transfer robot 56 shrinks each of the connecting arms 24 to 26 and the plate-like hand 28 in the direction of arrow A from the left side of the inspection unit 50 while holding the semiconductor wafer 3b.

Next, the wafer transfer robot 56 moves to a position corresponding to the wafer carrier 1 b by driving the shift mechanism 55.
Next, the wafer transfer robot 56 extends the connecting arms 24 to 26 and the plate-like hand 28 again to store the semiconductor wafer 3b in the wafer carrier 1b.
Next, the wafer transfer robot 56 moves to a position corresponding to the wafer carrier 1a by driving the shift mechanism 55 in a state in which the connection arms 24 to 26 and the plate-like hand 28 are contracted.
Next, the wafer transfer robot 56 extends each of the connecting arms 24 to 26 and the plate-like hand 28, and sucks and holds the uninspected semiconductor wafer 3a stored in the wafer carrier 1a.

  Next, the wafer transfer robot 56 contracts the connecting arms 24 to 26 and the plate-like hand 28 and moves to the inspection unit 50 side (right side) by driving the shift mechanism 55.

Next, the wafer transport robot 56 is at a position corresponding to the wafer transfer position P _1, the movement by the shift mechanism 55 is stopped.
Next, the wafer transport robot 56 is stretched in the direction of the arrow A from the left side of the inspection unit 50 to the connection arms 24 to 26 and the plate-like hand 28 again to move the plate-like hand 28 to the wafer transfer position P _1.
Then, the wafer transfer robot 56 transfers the uninspected semiconductor wafer 3a to the L-type hand 35c.

Next, delivery of the semiconductor wafer 3 to the inspection unit 50 by the loader unit 54 in the seventh specification shown in FIG. 14 will be described.
The wafer transfer robot 56 moves to the left side of the inspection unit 50 by driving the shift mechanism 55. Then, the wafer transport robot 56 is positioned at a position corresponding to the wafer transfer position P _1.

Transfer of the semiconductor wafer 3 at the wafer transfer position _{P 1,} macro inspection in macro inspection position _{P 2,} the macro inspection is finished in microinspection transfer position _{P 3,} the wafer transfer device 32, the three transport arms 34a, 34b, 34c Are circulated between the wafer delivery position P ₁ , the macro inspection position P ₂ , and the micro inspection delivery position P ₃ .

Thereafter, the wafer transport robot 56 is stretched in the direction of arrow B from the rear surface side of the inspection unit 50 to the connection arms 24 to 26 and the plate-like hand 28, to position the plate-like hand 28 to the wafer transfer position P ₁ (dashed line Indicated by).
At this time, the plate-like hand 28 of the wafer transfer robot 56 is positioned within the L-shaped opening of the L-type hand 35c of the transfer arm 34c, and receives the inspected semiconductor wafer 3b from the L-type hand 35c.

Next, the wafer transfer robot 56 contracts each of the connecting arms 24 to 26 and the plate-like hand 28 in the arrow B direction while holding the semiconductor wafer 3b by suction.
Next, the wafer transfer robot 56 moves to the right side by driving the shift mechanism 55 and stops at a position corresponding to the wafer carrier 1b.
Next, the wafer transfer robot 56 extends the connecting arms 24 to 26 and the plate-like hand 28 again to store the semiconductor wafer 3b in the wafer carrier 1b.

Next, the wafer transfer robot 56 moves to the left side by driving the shift mechanism 55 in a state where the connection arms 24 to 26 and the plate-like hand 28 are contracted.
Next, the wafer transfer robot 56 stops at a position corresponding to the wafer carrier 1a.
Next, the wafer transfer robot 56 extends each of the connecting arms 24 to 26 and the plate-like hand 28, and sucks and holds the uninspected semiconductor wafer 3a stored in the wafer carrier 1a.
Next, the wafer transfer robot 56 contracts each of the connecting arms 24 to 26 and the plate-like hand 28, and then rotates 180 degrees counterclockwise, for example.

Next, the wafer transport robot 56 is positioned at a position corresponding arm orientation to the wafer transfer position P _1.
Next, the wafer transport robot 56 to move the plate-like hand 28 is extended in the direction of arrow B from the rear side H of the inspection unit 50 to the connection arms 24 to 26 and the plate-like hand 28 to the wafer transfer position P ₁ again .
Then, the wafer transfer robot 56 transfers the uninspected semiconductor wafer 3a to the L-type hand 35c.

As described above, in the third embodiment, the inspection unit 50 for performing the macro inspection and the micro inspection and the loader unit 54 for supplying and discharging the semiconductor wafer 3 to the inspection unit 50 are separated. Provided independently.
Thereby, even when the specification of the device layout in the inspection process of the semiconductor manufacturing factory is changed to any of the fifth to seventh specifications, the supply / discharge direction of the semiconductor wafer 3 is set to the left side of the inspection unit 50. Or it can change easily in the direction from the back side.
Therefore, even in the third embodiment, the same effects as in the first embodiment can be obtained.

Note that the third embodiment may be modified as follows.
In the third embodiment, the macro inspection rocking mechanism 40 is provided for macro inspection, but a digital macro inspection device 57 may be used instead, as shown in FIG.
The digital macro inspection apparatus 57 includes line illumination and a line sensor. The digital macro inspection apparatus 57 acquires image data of the entire surface of the semiconductor wafer 3 while moving in the arrow D direction, and performs a macro inspection of the semiconductor wafer 3 from the image data.

Next, a fourth embodiment of the present invention will be described with reference to the drawings. The same parts as those in FIG. 10 are denoted by the same reference numerals, and detailed description thereof is omitted.
FIG. 16 is an overall configuration diagram of an appearance inspection apparatus using a substrate transfer apparatus. This appearance inspection apparatus uses a thin monitor 58 made of, for example, a liquid crystal display as a flat panel display instead of the monitor 41 made of a CRT display.
The monitor 58 is formed with a very short depth compared to a CRT display having the same screen size. The monitor 58 is used for both macro inspection and micro inspection.
Therefore, the monitor 58 can be disposed below the line-of-sight range θ between the macro inspection rocking mechanism 40 and the eyepiece 48 of the micro inspection unit 42-1.
The monitor 58 may be disposed in front of the macro illumination device 53 or above the eyepiece lens 48.

  Compared to the first embodiment, the monitor 58 can be closer to the eyepiece 48. As a result, when the inspector Q performs the macro inspection and the micro inspection, when the microscopic observation of the actual semiconductor wafer 3a is performed through the eyepiece 48, and when the inspection result of the macro inspection and the micro inspection is input. The troublesomeness of observation can be reduced by reducing the movement range of the line of sight of the worker Q.

In the fourth embodiment, the monitor 58 is disposed on the left side adjacent to the macro inspection swing mechanism 40, but the position of the monitor 58 is not limited to this.
In the first to fourth embodiments, the eyepiece 48 of the microscope 46 may be eliminated, and a monitor 41 made of a CRT display or a monitor 58 made of a liquid crystal display may be provided at this position.
The inspector Q can perform the micro inspection by observing the semiconductor wafer 3a on the macro inspection swing mechanism 40 and observing the enlarged image of the semiconductor wafer 3a displayed on the monitor 41 or 58. . The inspector Q can further narrow the movement range of the line of sight.

In FIG. 17, a monitor 58 composed of a liquid crystal display as a flat panel display is provided in the movable mechanism 60. The movable mechanism 60 is provided so that the monitor 58 is movable above the macro inspection swing mechanism 40.
The movable mechanism 60 is formed by connecting, for example, two link arms 61 and 62, and a monitor 58 is provided at the tip. The movable mechanism 60 moves the screen position of the monitor 58 in the vertical and horizontal directions.
The inspector Q can adjust the screen position of the monitor 58 to an optimal position where it can be easily seen.

  Since the position of the monitor 58 can be moved in this way, the inspector Q can freely arrange the screen position of the monitor 58 at a position where it can be easily observed when performing the macro inspection of the semiconductor wafer 3.

FIG. 18 is a diagram showing an arrangement position of another monitor 58. The monitor 58 is disposed on the operation unit 45 below the swing mechanism 40 for macro inspection. The operation unit 45 performs operation inputs related to macro inspection and micro inspection operations.
The monitor 58 displays operation functions for macro inspection and micro inspection. That is, the monitor 58 has a touch panel function, for example. The monitor 58 displays an operation screen (displaying operation switches) 63 for macro inspection and micro inspection, and performs macro inspection and micro inspection operations by the touch operation of the inspector Q.

The present invention is not limited to the first to fourth embodiments described above, and various modifications can be made without departing from the scope of the invention at the stage of implementation.
Furthermore, the first to fourth embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed structural requirements. For example, even if some constituent elements are deleted from all the constituent elements shown in the embodiment, the problem described in the column of the problem to be solved by the invention can be solved, and is described in the column of the effect of the invention. If the effect is obtained, a configuration from which this configuration requirement is deleted can be extracted as an invention.

The first to fourth embodiments may be modified as follows.
For example, in the first to fourth embodiments, the case where the substrate transfer apparatus is applied to the appearance inspection apparatus has been described. However, the present invention is not limited thereto, and any semiconductor manufacturing apparatus can be used as long as the substrate such as the semiconductor wafer 3 is delivered. The present invention can be applied to all of various line manufacturing apparatuses and various inspection apparatuses.

As the articulated wafer transfer robot 23, a biaxial linear motion robot that moves linearly in the XY directions can also be used. The wafer transfer robot 23 may be replaced with a single arm or double arm multi-joint manipulator.
The wafer transfer device 32 is not limited to the one using the three transfer arms 34a, 34b, and 34c, and can be applied to a plurality of transfer arms such as two arms and four arms.
The shape of the hand of the wafer transfer robot 23 and the wafer transfer apparatus 32 is not limited to a substantially L shape in which an orthogonal portion where two sides are orthogonal is curved. , And can also be formed in a half-moon shape with two sides directly connected by a curve.

The wafer transfer robot 23 takes out and stores the semiconductor wafer 3 from the wafer carriers 1a and 1b, but may directly take out or return the semiconductor wafer 3 flowing in the line of the semiconductor manufacturing factory. .
The direction in which the semiconductor wafer 3 is delivered to the macro inspection / conveyance unit 22 or the inspection unit 50 is not limited to any one of the two directions of the left side and the back side of the macro inspection / conveyance unit 22 or the inspection unit 50, both For example, it may be transferred alternately. If the external shape of the macro inspection / conveyance unit 22 or the inspection unit 50 is changed, the semiconductor wafer 3 can be delivered from two or more directions.

  The substrate to be inspected is not limited to the semiconductor wafer 3 but may be a glass substrate of a liquid crystal display.

  As shown in FIG. 19, the micro inspection unit 44 includes a substrate suction unit 44a of a micro inspection XY stage 44b. The substrate suction unit 44a delivers the semiconductor wafer 3 to, for example, the L-type hand 35c of the transfer arm 34c.

The substrate suction portion 44c is movable within the movable range W.
Thereby, the L-type hand 35c may be positioned so as to be within the movable range W.

The present invention is applied to an apparatus for inspecting and measuring a glass substrate of a flat panel display such as a semiconductor wafer or a liquid crystal display, for example, by visual observation or using a microscope, and includes a loader unit 21 and a macro inspection / conveying unit 22. The loader unit 21 can be arranged in two delivery directions, which are the first and second specifications, with respect to the macro inspection / conveying unit 22.
According to the present invention, it is possible to easily cope with apparatus layouts of various specifications, for example, corresponding to the arrangement of the conveyance path in the facility or the shape of the space in the facility.

BRIEF DESCRIPTION OF THE DRAWINGS The whole block diagram of the external appearance inspection apparatus of the 1st specification using 1st Embodiment of the board | substrate conveyance apparatus of this invention. The whole block diagram of the external appearance inspection apparatus of the 2nd specification using 1st Embodiment of the board | substrate conveyance apparatus of this invention. The figure which shows the positional relationship of the hand and non-contact position sensor in 1st Embodiment of the board | substrate conveyance apparatus of this invention. The figure which shows the modification of the circular hand and L-type hand in 1st Embodiment of the board | substrate conveyance apparatus of this invention. The figure which shows the modification of the circular hand and L-type hand in 1st Embodiment of the board | substrate conveyance apparatus of this invention. The figure which shows the modification of the L-type hand and L-type hand in 1st Embodiment of the board | substrate conveyance apparatus of this invention. BRIEF DESCRIPTION OF THE DRAWINGS The whole block diagram of the external appearance inspection apparatus of the 1st specification using 1st Embodiment of the board | substrate conveyance apparatus of this invention. BRIEF DESCRIPTION OF THE DRAWINGS The front block diagram of the external appearance inspection apparatus of the 1st specification using 1st Embodiment of the board | substrate conveyance apparatus of this invention. The whole block diagram of the external appearance inspection apparatus of the 2nd specification using 1st Embodiment of the board | substrate conveyance apparatus of this invention. The whole block diagram of the appearance inspection apparatus of the 3rd specification using the 2nd embodiment of the substrate conveyance device of the present invention. The whole block diagram of the external appearance inspection apparatus of the 4th specification using the 2nd embodiment of the substrate conveyance device of the present invention. The whole block diagram of the external appearance inspection apparatus of 5th specification using 3rd Embodiment of the board | substrate conveyance apparatus of this invention. The whole block diagram of the external appearance inspection apparatus of the 6th specification using 3rd Embodiment of the board | substrate conveyance apparatus of this invention. The whole block diagram of the external appearance inspection apparatus of the 7th specification using 3rd Embodiment of the board | substrate conveyance apparatus of this invention. The block diagram which shows the modification of 3rd Embodiment of the board | substrate conveyance apparatus of this invention. The front view of the external appearance inspection apparatus using 4th Embodiment of the board | substrate conveyance apparatus of this invention. The block diagram which shows the modification in the board | substrate conveyance apparatus of this invention. The block diagram which shows the modification in the board | substrate conveyance apparatus of this invention. The figure which shows the movable range of the board | substrate adsorption | suction part in the board | substrate conveyance apparatus of this invention. The block diagram of the conventional external appearance inspection apparatus.

Explanation of symbols

  20: substrate transfer device, 21: loader unit, 1a: wafer carrier, 3a, 3b: semiconductor wafer, 22: macro inspection / transfer unit, 23: wafer transfer robot, 24-26: connecting arm, 27: rotating shaft, 28 : Plate-like hand, 29: escape portion, 30: suction portion, 31: suction hole (with suction pad), 32: wafer transfer device, 33: rotating shaft, 34a, 34b, 34c: transfer arm, 35a, 35b, 35c : L-type hand (with wafer chuck), 35-1: Hand bottom, 35-2, 35-3: Fingertip, 35-4: Suction hole (with suction pad), 36-39: Non-contact position sensor, 36a- 39a: slit, 40: swing mechanism for macro inspection, 41: monitor, 42-1 to 42-n: inspection device unit, 43: mount, 44: micro inspection section, 44a: substrate suction section, 44b: micro inspection XY stage, 45: operation unit, 46: microscope, 47: imaging device, 48: eyepiece, 50: film thickness measurement unit, 51: operation unit, 52: observation window, 53: illumination device for macro inspection, 54: Loader section, 55: shift mechanism, 56: wafer transfer robot, 58: monitor, 60: movable mechanism, 61, 62: link arm, 63: operation screen (displays operation switches), 64: circular hand, 65: escape Part, 66: suction part, 67: suction hole, 70a: L-type hand, 71: suction hole, 73, 74: fingertip, 75: pad, 76: suction hole, 77: L-type hand, 78, 79: fingertip.

Claims (8)

A first transport unit for taking out and storing the substrate from a storage container for storing the substrate;
A second transfer unit that transfers the substrate to and from the first transfer unit and transfers to and from an apparatus unit that performs a desired process on the substrate;
The second transport unit has a rotating arm that forwards between the substrate transfer position of the first transfer unit and the substrate transfer position of the apparatus unit,
In addition, the first transport unit is configured to be separated and independent from the second transport unit, and the rotary arm can selectively arrange the first transport unit in two different directions with respect to the second transport unit. The substrate transfer apparatus is characterized in that the delivery position of the first transfer unit is set within a transfer stroke range of the first transfer unit in different directions. The substrate transfer apparatus according to claim 1, wherein
The second transport unit is integrated with the device unit, sets the transfer position of the rotary arm at the same distance from two adjacent side surfaces of the device unit, and moves the first transport unit to the two adjacent side surfaces. It is possible to arrange in. The substrate transfer apparatus according to claim 1, wherein
An interval between the first transport unit and the delivery position of the rotary arm is set within a transport stroke range of the first transport unit. The substrate transfer apparatus according to claim 1, wherein
An alignment sensor for detecting an outer peripheral edge of the substrate for performing alignment of the center position of the substrate is disposed at the substrate transfer position of the second transport unit. The substrate transfer apparatus according to claim 1, wherein
The arm of the first or second transport unit has a hand formed in a substantially L shape for sucking and holding the substrate, and the substantially L shaped hand has a line connecting suction holes provided at both ends. It is located outside the center of the substrate. The substrate transfer apparatus according to claim 1, wherein
Each arm of the first and second transport units has a hand formed in a substantially L shape for sucking and holding the substrate, and the first transport unit from the two different directions at the transfer position of the substrate. The hand of the second transport unit is arranged so as not to interfere with the insertion of the hand, and each hand has a line connecting suction holes provided at both ends positioned outside the center of the substrate. . The substrate transfer apparatus according to claim 1, wherein
The first transport unit is an articulated transport robot having a plurality of connecting arms,
A first hand that is bent and provided at the tip of the connecting arm of the transfer robot, and holds the substrate by suction;
A second hand connected to the tip of the rotating arm and formed in a substantially L shape having a delivery space into which the first hand enters from the two directions, and holds the substrate by suction;
When the first hand delivers the substrate from the long side of the second hand in the insertion direction, an escape portion is formed to avoid interference with the long side of the second hand. . In the macro observation for visually inspecting the defects on the substrate and the substrate transfer device used for performing various inspections and measurements on the substrate,
A first transport unit for taking out and storing the substrate into a storage container for storing the substrate;
A second transfer unit that transfers the substrate to and from the first transfer unit and transfers to and from an apparatus unit that performs a desired process on the substrate;
The first transport unit includes a multi-joint arm that extends and contracts by connecting a plurality of arms, and a first hand that is bent with respect to the tip of the multi-joint arm and holds the substrate by suction. Consists of
The second transport unit is provided in a substantially L-shape having a rotation shaft that rotates about the axial direction, and an equiangular interval with respect to the rotation shaft, and having a delivery space into which the first hand enters. Formed of three transfer arms formed with a second hand for sucking and holding the substrate;
The three transfer arms rotate around the rotation axis, respectively, and transfer positions with the first transfer unit, macro observation positions, and transfer positions with the second transfer unit. Circulated between and
The first and second transport units are configured to be separated and independent from each other, and the first transport unit has a first delivery direction with respect to the second transport unit or the first delivery direction. Is provided in a second delivery direction that is approximately 90 degrees different from
The apparatus unit is a variety of units including a micro inspection unit that magnifies the substrate with a microscope and observes an enlarged image thereof, and a film thickness measurement unit that measures a film thickness formed on the substrate. Any one of the units is incorporated into the second transport unit,
A substrate transfer apparatus.

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