TW201445122A - Apparatus for bending substrate, apparatus and method for inspecting bended substrate - Google Patents

Abstract

This invention provides a display device and its manufacturing method. An apparatus for bending a substrate according to the present invention comprises: a working platform with through holes; a substrate suction disc supporting the adjacent side of the object bending area and allowing passage via the through holes from the working platform; a lifting part for lifting or lowering the substrate suction disc relative to the working platform; and a covering member tightly adhered to the working platform by covering the substrate, such that the height difference between the substrate suction disc and the platform can be provided to bend the object bending area.

Description

Substrate bending device, substrate bending inspection device and method

The present invention relates to a substrate bending apparatus, a substrate bending inspection apparatus, and a substrate bending inspection method using the substrate bending inspection apparatus.

Various flat panel display devices are widely used as home display devices such as televisions and displays, and portable display devices such as notebook computers, mobile phones, and PMPs are lighter and thinner. The flat panel display device currently produced or developed includes a liquid crystal display (LCD), an electroluminescent display (LED), a field emission display (FED), and a plasma display device (plasma). Display panel: PDP), Organic Light Emitting Display (OLED), etc.

In recent years, in order to facilitate carrying of IT equipment and to realize various display forms, a flexible flat panel display device capable of being carried or stored in a curved state or wound into a roll type has been researched and developed.

In particular, the flexible flat panel display device is not only in a planar state, but also The image can be stably displayed in the curved state, and it is necessary to have the ability to restore the original state and the image display capability even if it is repeatedly bent.

Therefore, in the process of producing a product, it is necessary to repeatedly perform a bending test on the flexible substrate, and perform optical property inspection and visual inspection of the curved region.

Accordingly, an object of the present invention is to provide a substrate bending apparatus for bending a substrate, a substrate bending inspection apparatus for inspecting a curved region in a state where the substrate is bent, and a substrate bending inspection method using the substrate bending inspection apparatus.

The technical problem of the present invention is not limited to the above-described technical problems, and those skilled in the art can clearly understand the other technical problems that are not mentioned.

In order to achieve the technical problem of the present invention, a substrate bending apparatus according to an embodiment of the present invention includes: a table formed with a through hole; a substrate chuck that supports an abutting surface of a curved object region of the substrate, through which the through hole is operated And a lifting portion that raises or lowers the substrate chuck relative to the table; and a covering member that is in close contact with the table in a state of covering the substrate, and is bent by a difference between a height of the substrate chuck and the table The curved object area.

In order to achieve the technical problem, a substrate bending inspection apparatus according to an embodiment of the present invention includes: a table; a substrate suction cup protruding from the table for supporting an abutting surface of a curved object region of the substrate; and a covering member to cover The state of the substrate is in close contact with the table, and the curved object region is bent by the difference between the substrate chuck and the height of the table; and the imaging portion is configured to capture the curved object region.

In order to attain the technical problem, a substrate bending inspection method according to an embodiment of the present invention includes a step of arranging an abutting surface of a curved object region of a substrate on a substrate chuck, and arranging a cover on a surface of a table accommodating the substrate chuck a step of covering the member of the substrate; a step of adhering to the cover member and the table; and lifting the substrate chuck from the table, the cover member pressing the curved object region toward a corner side of the substrate chuck, thereby The step of bending the curved object area.

According to the present invention, at least the following effects are obtained.

The portion of the substrate can be repeatedly subjected to a bending test by a predetermined external force, and the external force required for bending can be finely adjusted, whereby a minimum stress change can be effectively applied to the curved partial region.

Further, while performing the bending test of the substrate, the fine brightness change of the curved region or the like is measured, and at the same time, fine cracking or the like of the curved region can be inspected.

The effects according to the present invention are not limited to the contents described above, and a variety of effects are included in the present specification.

1,2,3,4‧‧‧Substrate bending device

5‧‧‧Substrate bending inspection device

10‧‧‧Workbench

11‧‧‧ attracting mouth

12‧‧‧Attracting the flow path

13‧‧‧Retainer

15‧‧‧through hole

16‧‧‧ accommodating slot

20,201,202‧‧‧ substrate suction cup

30‧‧‧ Lifting Department

31‧‧‧ Lifting drive

32‧‧‧lifting pin

40‧‧‧ Covering components

50‧‧‧Photography inspection department

51‧‧‧Image Acquisition Department

52‧‧‧ Computing Department

53‧‧‧Display Department

52a‧‧‧Image Processing Department

52b‧‧‧Brightness measurement department

52c‧‧‧Visual Inspection Department

52d‧‧‧Processing Department

S‧‧‧Substrate

S1‧‧‧Installation area

S2‧‧‧Bending object area

S3‧‧‧ highlighted area

1 is a schematic plan view of a substrate bending apparatus according to a first embodiment of the present invention.

2 is a schematic side sectional view of a substrate bending apparatus according to a first embodiment of the present invention.

3 is a schematic view of a substrate disposed on a substrate chuck.

4 and 5 are schematic operation views of a substrate bending apparatus according to a first embodiment of the present invention.

Figure 6 is a schematic side view of a substrate chuck in accordance with a first embodiment of the present invention.

Figure 7 is a schematic side view of a substrate chuck in accordance with other embodiments of the present invention.

Figure 8 is a schematic cross-sectional view of a substrate bending apparatus according to a second embodiment of the present invention.

Figure 9 is a schematic plan view of a substrate bending apparatus according to a third embodiment of the present invention.

Figure 10 is a schematic cross-sectional view of a substrate bending apparatus according to a fourth embodiment of the present invention.

Figure 11 is a schematic cross-sectional view of a substrate bending apparatus according to a second embodiment of the present invention.

Fig. 12 is a block diagram of a photographing portion of a substrate bending inspection device according to an embodiment of the present invention.

FIG. 13 is a sequence diagram of a substrate bending inspection method according to an embodiment of the present invention.

14 to 16 are operational views of a substrate bending inspection process using a substrate bending inspection device according to an embodiment of the present invention.

Advantages, features, and methods for achieving the same will be apparent from the drawings and the embodiments described hereinafter. However, the present invention is not limited to the embodiments described below, and can be embodied in various different forms. This embodiment is provided to make the invention more complete and to provide a scope of the invention to those skilled in the art to which the invention belongs. The invention is only determined by the scope of the patent application. For the sake of clarity, expandable means the size and relative size of the constituent elements in the drawings.

The embodiments described in the present specification will be described with reference to the plan views and the interface drawings of the preferred schematic drawings of the present invention. Therefore, the form of the example diagram can be modified according to manufacturing techniques and/or tolerances and the like. Further, the embodiments of the present invention are not limited to the specific embodiments shown in the drawings, and include morphological changes due to manufacturing engineering. Therefore, the regions shown in the drawings have the general attributes, and the shapes of the regions shown in the drawings are specific examples of the regions of the elements, and are not intended to limit the scope of the invention.

1 is a schematic plan view of a substrate bending apparatus according to a first embodiment of the present invention, FIG. 2 is a schematic side sectional view of a substrate bending apparatus according to a first embodiment of the present invention, and FIG. 3 is a substrate disposed on a substrate chuck schematic diagram.

As shown in FIGS. 1 and 2, a substrate bending apparatus 1 according to the present invention includes a table 10, a substrate chuck 20, a lifting portion 30, and a covering member 40.

The table 10 is a flat plate for mounting the substrate S and the covering member 40, and the covering member 40 is for bending the substrate S, and a through hole 15 for raising and lowering the substrate chuck 20 is formed at the center of the table.

Further, the table may be provided with an adsorption unit for fixing the cover member 40. The adsorption unit includes a plurality of suction ports 11 formed on both sides of the through hole 15 at predetermined intervals, and a suction flow path 12 formed on the inner side of the table 10 and communicating with the plurality of suction ports 11. The suction flow path 12 is connected to a vacuum pump (not shown) to supply vacuum pressure to the suction port 11 side.

As shown in FIG. 3, the substrate chuck 20 is formed such that its upper surface is narrower than the width or length of the substrate S, and can support a portion of the substrate S. Hereinafter, for convenience of explanation, the substrate S is divided into three regions of the mounting region S1, the curved object region S2, and the protruding region S3.

The curved object region S2 is a region which is located at the corner of the substrate chuck 20 and is bent by the corners of the substrate chuck 20, and the mounting region S1 is a region located on one side of the abutting faces of the curved article region S2, which is located at the substrate chuck 20 The upper region, the protruding region S3 is a region on the other side of the abutting faces of the curved article region S2, and is a region located outside the substrate chuck 20.

As shown in FIG. 3, when the curved object region S2 of each substrate S is located at both side corners of the substrate chuck 20, the region between the curved object regions S2 on both sides can be defined as the mounting region S1, centered on the curved object region S2. The area on the opposite side of the mounting area S1 may be defined as the protruding area S3.

On the one hand, the substrate chuck 20 is disposed so as to be able to enter and exit the upper portion of the table 10 through the through hole 15, so that the upper surface of the table 10 and the upper surface of the substrate chuck 20 are located on the same plane, and the substrate chuck 20 before and after the rise is accommodated in the pass. The state of the hole 15.

The lifting portion 30 is formed at a lower portion of the substrate chuck 20, and may include a lift pin 32 for supporting the substrate chuck 20 and a lift driving device 31 for raising and lowering the lift pin 32.

The elevation drive unit 31 raises and lowers the lift pins 32, so that the substrate chuck 20 can be moved in and out of the table 10. Further, the elevation drive unit 31 can control the elevation height and/or the elevation speed of the lift pins 32.

As the elevation drive device 31, a hydraulic cylinder that lifts and lowers the lift pin 32 by a change in hydraulic pressure can be used.

The lifting height and/or the lifting speed of the lift pins 32 can be finely controlled by the elevation drive unit 31 of the hydraulic cylinder. Thereby, various bending environments can be provided, and by precisely adjusting the amount of hydraulic pressure, it is possible to effectively induce a minimum stress change to the curved object region S2.

Moreover, when a strong restoring force is applied to the curved curved object region S2, the substrate suction cup 20 can also be provided with a restoring force by adjusting the hydraulic pressure. Very strong rise.

The covering member 40 is a constituent element that rises and bends the substrate S as the substrate chuck 20 rises, and covers the substrate S attached to the substrate chuck 20 so as to be located on the upper surface of the table 10.

The covering member 40 is preferably configured such that a portion covering the substrate S is elongated during the rise of the substrate chuck 20, and is restored to the original state during the process in which the substrate 20 is lowered and returned into the through hole 15, and for this, the covering member 40 may be elongated. And the film composition of materials with excellent stability.

Hereinafter, the operation of the substrate bending apparatus according to the first embodiment of the present invention will be described. 4 and 5 are schematic operation views of a substrate bending apparatus according to a first embodiment of the present invention.

As shown in FIG. 4, the substrate chuck 20 can be positioned in the through hole 15 such that the upper surface of the substrate chuck 20 is in the same plane as the upper surface of the table 10. Hereinafter, this is referred to as the home position of the substrate chuck 20.

The substrate S of the curved article is disposed on the upper surface of the substrate chuck 20. As described above, the substrate S can be disposed such that the curved object region S2 is located at the corner of the substrate chuck 20, the mounting region S1 is located above the substrate chuck 20, and the protruding region S3 is located outside the substrate chuck 20 (refer to FIG. 3).

The cover member 40 may be disposed on the substrate S disposed on the substrate chuck 20. The area of the covering member 40 may correspond to the area of the table 10, cover the front surface of the substrate S and the suction port 11 formed on the table 10, and may be mounted on the table 10.

The substrate S and the covering member 40 are sequentially disposed on the substrate chuck 20 and After the stage 10 is placed, the vacuum is exhausted by the suction port 11 and the suction flow path 12 formed on the table 10. Thereby, a vacuum pressure is formed between the covering member 40 and the table 10, so that both sides of the covering member 40 can be in close contact with the table 10 centering on the substrate S.

As shown in FIG. 5, after the cover member 40 is in close contact with the table 10, the elevation drive unit 31 raises the lift pins 32 to raise the substrate chuck 20.

By the rise of the substrate chuck 20, a height difference is generated between the upper surface of the substrate chuck 20 and the upper surface of the table 10, and the portions of the substrate S covering the center with the both sides of the cover member 40 in close contact with the table 10 follow The substrate chuck 20 is raised and elongated.

The elastic reaction force generated by the elongation of the covering member 40 can pressurize the substrate S toward the substrate chuck 20 side.

Further, the covering member 40 abuts the protruding portion S3 of the substrate S against the side surface side of the substrate chuck 20 by the difference in height between the both sides of the table 10 and the central portion of the cover substrate S, and bends the substrate S. The object area is pressed toward the corner side of the substrate chuck 20 so that the curved object area S2 can be bent along the corners.

After the elevation drive unit 31 raises the lift pin 32 to the lift height input in advance, the lift pin 32 is lowered again to return the substrate chuck 20 to the home position.

When the substrate chuck 20 is returned to the original position, as shown in FIG. 4, the covering member 40 can be restored to its flat state initially mounted on the table 10 and the substrate S by its own elasticity.

As the covering member 40 returns to the initial state, the substrate S can also be restored to its flat state initially mounted on the substrate chuck 20 by its own elastic force.

Then, as shown in FIG. 5, after the lift driving device 31 raises the substrate chuck 20 again to bend the curved object region S2 of the substrate S, as shown in FIG. 4, the substrate chuck 20 is returned to the original position again to return to the flat state. By repeating this process, the bending test of the substrate S can be performed.

Hereinafter, a substrate chuck according to an embodiment of the present invention will be described.

Figure 6 is a schematic side view of a substrate chuck in accordance with an embodiment of the present invention.

As shown in FIG. 6, a substrate chuck 201 according to an embodiment of the present invention can utilize a porous chuck.

The porous chuck is a vacuum chuck that adsorbs and fixes a substrate by vacuum pressure, and is generally produced by using a porous ceramic mainly composed of SiC powder. Therefore, the porous chuck has a plurality of pores formed on the surface thereof, and the substrate or the like mounted on the surface can be adsorbed and fixed by the vacuum pressure supplied through the pores.

As in the present embodiment, when a porous porous chuck is used as the substrate chuck 201, the substrate S can be stably supported by supplying a vacuum pressure to the upper surface of the substrate chuck 201.

The vacuum pressure can also be supplied to the side surface by the plurality of air holes formed on the side surface of the substrate chuck 201, and therefore, the protruding portion S3 folded to the side surface of the substrate chuck 201 can be closely attached to the substrate by the covering member 40 during the bending process. The side of the suction cup 201.

During the bending process, the mounting area S1 of the substrate S located on the upper surface of the substrate chuck 201 and the protruding area of the substrate S located on the side surface of the substrate chuck 201 can be closely fixed to the substrate chuck 201, and thus, the mounting area S1 and the protruding area The curved object region S2 between S3 can maintain the bent state more stably by the corners of the substrate chuck 201.

According to the substrate chuck 201 of the present embodiment, in the process of returning to the home position after rising, the curved object region S2 and the protruding region S33 are restored to the same plane as the mounting region S1, and the pores provided from the surface can be cut off. Vacuum pressure.

Figure 7 is a schematic side view of a substrate chuck in accordance with other embodiments of the present invention.

As shown in FIG. 7, the substrate chuck 202 according to the present embodiment is formed as a curved surface having a predetermined curvature for the upper corner of the mounting substrate S.

Therefore, when the substrate is bent, the curved object region S2 is in close contact with the corner of the substrate chuck 202 having a predetermined curvature, and can be bent according to the curvature of the corner.

Also, when the bending object region S2 is subjected to a bending test with a specific curvature, the substrate chuck 202 according to the present embodiment can be utilized.

Further, the substrate chuck 202 according to the present embodiment is formed as a plurality of substrate chucks 202 having mutually different curvatures, and the bending test can be performed while changing the curvature of the corners.

For example, when performing the initial bending test on the same substrate S, in the plurality of substrate chucks 202, the substrate chuck 202 having the corner having the largest curvature is mounted on the substrate bending device, and then sequentially replaced with corners having a small curvature. Substrate suction cup 202 and perform a bending test.

By the bending test as described, data of the boundary curvature according to the number of times of bending of the substrate S can be accumulated.

The porous chuck can also be used according to the substrate chuck 202 of the present embodiment. At this time, by bending the mounting region S1 and the protruding region S3 to the upper surface and the side surface of the substrate chuck 202, respectively, the curved object region S2 can pass through the corners. The curvature is stably maintained in a curved state.

Hereinafter, a substrate bending apparatus according to other embodiments of the present invention will be described.

For the convenience of description, the same portions as those of the first embodiment are denoted by the same reference numerals, and the description of the portions common to the first embodiment will be omitted.

Figure 8 is a schematic cross-sectional view of a substrate bending apparatus according to a second embodiment of the present invention.

As shown in FIG. 8, the substrate bending apparatus 2 according to the present invention may be provided with a plurality of substrate chucks 20.

According to the substrate bending apparatus 2 of the present embodiment, two or more substrate chucks 20 are arranged in a line at predetermined intervals, or four or more substrate chucks 20 are arranged at a predetermined interval in an array of N*M.

A plurality of through holes 15 may be formed on the table 10 at predetermined intervals to correspond to the plurality of substrate chucks 20.

The cover member 40 may be configured to cover the substrate S and the work table 10 The front surface or a plurality of covering members are disposed on the respective substrate chucks 20 so as to cover the size of the vicinity of each of the substrate chucks 20.

The lift pins 32 may be provided in plurality to support the respective substrate chucks 20, and the elevation drive device 31 controls the lift pins 32 to be simultaneously raised or lowered, or the lift height and/or the rise speed of each of the lift pins 32 may be individually controlled.

As shown in FIG. 8, the substrate bending apparatus 2 according to the present embodiment can use a method in which a plurality of substrates S can be bent at one time by using a plurality of substrate chucks 20.

Alternatively, the substrate bending apparatus 2 according to the present embodiment may also use a method of bending one substrate S at a plurality of locations at a time by using a plurality of substrate chucks 20.

At this time, the elevation drive device 31 collectively controls the ascending height and/or the ascending speed of each of the lift pins 32, so that the plurality of points can be bent in the same manner.

Alternatively, the elevation drive unit 31 individually controls the ascending height and/or the ascending speed of each of the lift pins 32 to bend the plurality of points in different forms. When the rising height and/or the rising speed of the substrate chuck 20 are controlled to be different from each other, the substrate S is distorted. Therefore, the twist test of the substrate S can be performed while performing the bending test on the substrate S.

Fig. 9 is a schematic plan view of a substrate bending apparatus according to a third embodiment of the present invention.

As shown in FIG. 9, the substrate bending device 3 according to the present embodiment may further include a holder 13 on both sides of the table 10.

At least two pairs of holders 13 can be provided on both sides of the table 10, from However, both ends of the covering member 40 can be fixed to the table 10.

The covering member 40 is in close contact with the table 10 by the vacuum pressure supplied from the plurality of suction ports 11 formed on the table 10, but the substrate suction cup 20 is applied to both sides of the covering member 40 during the rise of the substrate chuck 20. Side tension. Therefore, when the vacuum pressure between the covering member 40 and the table 10 is weaker than the tension, the covering member 40 is pulled to the side of the substrate chuck 20 during the rise of the substrate chuck 20.

According to the substrate bending apparatus 3 of the present embodiment, both ends of the covering member 40 are fixed to the table 10 by the holder 13, so that the covering member 40 can be further stabilized in a state where the substrate chuck 20 is raised and the covering member 40 is extended. The ground is fixed to the workbench 10.

Figure 10 is a schematic cross-sectional view of a substrate bending apparatus according to a fourth embodiment of the present invention.

As shown in FIG. 10, according to the substrate bending apparatus 4 of the present embodiment, the receiving groove 16 accommodating the substrate chuck 20 can be formed on the table 10.

The depth of the accommodating groove 16 corresponds to the height of the substrate chuck 20, and if the substrate chuck 20 is mounted on the bottom surface of the accommodating groove 16, the upper surface of the substrate chuck 20 may be located on the same plane as the upper surface of the table 10.

Further, the lift pins 32 extend through the bottom surface of the accommodating groove 16 to support the substrate chuck 20, and can lift and lower the substrate chuck 20 from the accommodating groove 16.

According to the substrate bending apparatus 4 of the present embodiment, when the substrate chuck 20 is in the home position, the bottom surface of the housing groove 16 supports the substrate chuck 20.

Therefore, the burden on the lift pin 32 and the elevation drive unit 31 to continuously support the substrate chuck 20 is reduced, and the original position is kept predetermined by the bottom surface of the housing groove 16, so that the substrate chuck can be raised from the table 10 even if the substrate chuck 20 is repeatedly raised and lowered. 20 maintain the specified height.

As described above, according to the substrate bending apparatus of the various embodiments of the present invention, the bending test is repeatedly performed with the same external force on the specific region of the curved object region S2 by the corners of the substrate chuck 20.

Further, by controlling the ascending speed, the ascending height, the ascending force, and the like of the substrate chuck 20, various bending environments can be caused, and by minimizing the external force required for bending, only a minimal stress change can be effectively applied to the curved region.

Hereinafter, a substrate bending inspection device according to an embodiment of the present invention will be described.

11 is a schematic cross-sectional view of a substrate bending inspection device according to an embodiment of the present invention, and FIG. 12 is a block diagram of an image pickup portion of a substrate bending inspection device according to an embodiment of the present invention.

As shown in FIG. 11, a substrate bending inspection device 5 according to an embodiment of the present invention includes a table 10, a substrate chuck 20, a lifting portion 30, a covering member 40, and an imaging inspection portion 50.

According to the substrate bending inspection device 5 of the present embodiment, since the descriptions of the table 10, the substrate chuck 20, the lifting portion 30, and the covering member 40 overlap with the contents, the detailed description thereof will be omitted. .

As shown in FIG. 11, the substrate bending inspection device 15 according to the present invention The imaging inspection unit 50 may include an image acquisition unit 51, a calculation unit 52, and a display unit 53.

The image acquisition unit 51 is an original component for capturing the curved object region S2 of the substrate S, and may include a CCD (Charge Coupled Device) camera and a luminance meter for measuring the brightness of the curved object region S2.

The image acquisition unit 51 is provided to point to the position of the curved object region S2 of the curved substrate S. For example, as shown in FIG. 11, the upper portion of the corner portion of the substrate chuck 20 is disposed vertically downward, or is disposed obliquely at the upper portion of the table 11 to point to the curved and curved article region S2.

The image obtaining portion 51 is provided to be movable to the XYZ axis, to scan and photograph the curved object region S2 while moving along the corner of the substrate chuck 20, or to photograph the curved object region on the side where one side corner of the substrate chuck 20 is curved. After S2 is moved to point to the other side corner of the substrate chuck 20, then, the other side curved object region S2 at which the other side corner of the substrate chuck 20 is bent can be taken.

Alternatively, the image acquisition section 51 may include a pair of cameras that are respectively directed to both side corner portions of the substrate chuck 20. Thereby, both side images of the curved object region S2 bent by the both side corners of the substrate chuck 20 can be simultaneously obtained.

As shown in FIG. 12, the calculation unit 52 may include an image processing unit 52a, a brightness measurement unit 52b, an appearance inspection unit 52c, and a processing unit 52d.

The image processing unit 52a receives the image captured by the image acquisition unit 51 and processes it into an image that is easy to inspect.

For example, the captured image received from the image acquisition unit 51 is converted into a digital image, or only the image of the curved object region S2 is separated in the captured image. Arrangement after the inspection area, or processing to remove noise or the like due to illumination or the like.

The brightness measuring unit 52b receives the processed image from the image processing unit 52a and measures the brightness of the curved object region S2.

When the substrate S is bent, since the circuit pattern formed on the substrate S is also bent together, the circuit characteristics such as the resistance of the circuit become large, and thus the brightness of the displayed image changes.

The brightness measuring unit 52b can measure the change in brightness before and after the bending of the curved object region S2 and/or the change in brightness in the bending of the curved object region S2.

In order to accurately measure the brightness, the image acquisition unit 51 includes a luminance meter, and the luminance meter is connected to the luminance measurement unit 52b, and can measure the luminance and luminance change of the curved object region S2.

Further, the visual inspection unit 52c receives the processed image from the image processing unit 52a, and checks whether or not the curved object region S2 is defective.

The visual inspection unit 52c can detect defects such as breakage on the surface or inside and/or short circuits and disconnections of the circuit formed on the substrate S in the image of the curved object region S2.

The appearance inspection unit 52c stores the reference image as a reference for the failure determination, and compares the reference image with the image transmitted from the image processing unit 52a, so that the defective element existing in the curved object region S2 can be inspected.

The reference image is a substrate image having no defective elements, and the curved object region captured by the image acquisition unit 51 may be at the same place as the curved object region S2. image.

In addition, the processing unit 52d is connected to the brightness measuring unit 52b and the visual inspection unit 52c, and can determine whether or not the substrate S is defective based on the measurement/inspection results of the brightness measuring unit 52b and the visual inspection unit 52c.

The processing unit 52d analyzes the brightness and the amount of change in luminance before and after the bending of the curved object region S2 transmitted from the luminance measuring unit 52b, and/or the amount of change in brightness and brightness of the corresponding substrate S. Further, by storing the data by checking the amount of change in the brightness and the brightness of the object substrate S, the average brightness change amount can be calculated in accordance with the degree of bending.

Further, the processing unit 52d can determine whether or not the corresponding substrate S is defective based on the information of the defective element existing in the curved object region S2 transmitted from the visual inspection unit 52c.

The processing unit 52d can determine whether or not the corresponding substrate S is defective by integrating the defective element such as the damage of the memory object in the curved object region S2, the damage size, and the short circuit/breakage of the circuit.

The display unit 53 can be connected to the image acquisition unit 51 and the calculation unit 52, and can display information such as the image of the curved object region S2 and the brightness, the amount of change in brightness, and the defective element of the curved object region S2.

Specifically, the display unit 53 can display an image before and after the bending of the curved object region S2, an image during bending, and the like, and in each state, the brightness measuring unit 52b can display the measured brightness and the amount of change in brightness, in each state. Next, the defective element detected by the appearance detecting unit 52c can be displayed on the image of the curved object region S2.

Further, the display unit 53 can display whether or not the substrate S determined by the processing unit 52d is defective.

Thus, according to the substrate bending inspection device 5 of the embodiment of the present invention, the substrate S is repeatedly subjected to the bending test, and the optical inspection of the curved object region S2 and the optical inspection such as brightness can be simultaneously performed.

Further, the bending test can be repeatedly performed with the same external force on the specific region of the curved object region S2 by the corners of the substrate chuck 20, so that the reliability of the bending test and the inspection can be ensured.

Hereinafter, a substrate bending inspection method using the substrate bending inspection device according to the embodiment of the present invention will be described.

13 is a sequence diagram of a substrate bending inspection method according to an embodiment of the present invention, and FIGS. 14 to 16 are operation diagrams of a substrate bending inspection process using a substrate bending inspection device according to an embodiment of the present invention.

As shown in FIG. 13, a substrate bending inspection method according to an embodiment of the present invention includes: a substrate arranging step (S101); a covering member arranging step (S102); a substrate and a covering member absorbing step (S103); and a substrate chucking portion a rising step (S104); an imaging step of the curved object region (S105); a brightness and appearance inspection step of the curved object region (S106); a descending step of the substrate chuck (S107, S110); a step of determining the number of repeated bendings (S108) and The counting step (S109).

The substrate arranging step (S101) is a step of arranging the opposite substrate S to be subjected to the bending inspection on the substrate chuck 20, and as shown in FIG. 14, a portion of the substrate S can be disposed on the substrate chuck 20. At this time, the substrate S can be configured as a curved object area The field S2 is located at a corner portion of the substrate chuck 20, and one of the abutting faces of the curved object region S2 is defined as a mounting region S1 disposed on the substrate chuck 20, and the other side of the abutting faces of the curved object region S2 It may be defined as a protruding region that protrudes toward the outside of the substrate chuck 20 (Fig. 3).

The step of arranging the covering member (S102) performed after the substrate arranging step (S101) is a step of arranging the covering member 40 to cover the front surface of the substrate S. As shown in FIG. 15, the covering member 40 may be disposed such that the central portion thereof covers the substrate S. And the workbench 10 is covered on both sides extended from the center.

The covering member 40 can utilize a film of a material that elongates and restores excellent stability.

The adsorption step (S103) of the substrate and the covering member is a step of fixing the substrate S to the substrate chuck 20 and fixing the covering member 40 to the table 10. As shown in FIG. 15, the substrate chuck 20 provides an attractive force toward the upper surface. A vacuum pressure is formed between the substrate S and the upper surface of the substrate chuck 20 so that the substrate S can be fixed to the substrate chuck 20, and the table 10 provides an attractive force toward the upper surface between the both sides of the covering member 40 and the upper surface of the table 10. A vacuum pressure is formed to fix the covering member 40 to the table 10.

The step of raising the substrate chuck (S104) is a step of bending the substrate S by the rise of the substrate chuck 20. As shown in FIG. 16, the elevation driving device 31 raises the lift pins 32 of the support substrate chuck 20 so as to be movable on the substrate chuck 20. A height difference is formed between the upper surface and the upper surface of the table 10.

The mounting area S1 of the substrate S is supported on the substrate chuck 20 In a state in which both sides of the cover member 40 are in close contact with the upper surface of the table 10, the central portion of the cover substrate S is raised by the substrate chuck 20.

By the height difference between the both sides of the table 10 and the central portion of the cover substrate S, the covering member 40 abuts against the protruding portion S3 of the substrate S toward the side surface side of the substrate chuck 20, and presses toward the corner side of the substrate chuck 20 The curved object region S2 of the substrate S, whereby the curved object region S2 can be bent along the corners.

When the suction force is also supplied to the side surface of the substrate chuck 20, since the protruding region S3 of the substrate S that is in close contact with the side surface side of the substrate chuck 20 is also fixed to the substrate chuck 20, the curved object region S2 can be stably maintained in a curved state.

The elevation drive unit 31 controls the ascending speed and height of the lift pins 32 to provide a variety of bending environments.

In the imaging step (S105) of the curved object region, as shown in FIGS. 14 to 16, the image obtaining portion 51 directed to the corner portion of the substrate chuck 20 can take the curved object region S2.

The image acquisition section 51 may include a CCD camera for photographing the curved object region S2 and a luminance meter for measuring the brightness of the curved object region S2.

The CCD camera can image an image of the curved object region S2 before and after bending and bending, and the brightness meter can also measure the brightness of the curved object region S2 before and after bending and during bending.

The image obtaining portion 51 is provided to be movable to the XYZ axis, to scan and photograph the curved object region S2 while moving along the corner of the substrate chuck 20, or to photograph the curved object region on the side where one side corner of the substrate chuck 20 is curved. Move after S2 Pointing to the other side corner of the substrate chuck 20, then, the other side curved object region S2 at which the other side corner of the substrate chuck 20 is bent can be taken.

Alternatively, the image acquisition unit 51 includes a pair of cameras that are directed to both side corner portions of the substrate chuck 20, so that both side images of the curved object region S2 that are bent by both side corners of the substrate chuck 20 can be simultaneously obtained.

In the brightness and appearance inspection step (S106) of the curved object region, the calculation unit 52 processes the image and the brightness information of the curved object region S2 imaged and measured by the image acquisition unit 51, and passes the processed information to the display unit 53. display.

The calculation unit 52 may include an image processing unit 52a, a brightness measurement unit 52b, an appearance inspection unit 52c, and a processing unit 52d.

The image processing unit 52a converts the captured image received from the image acquisition unit 51 into a digital image, or separates only the image of the curved object region S2 into the inspection region in the captured image, or performs the removal. In the processing such as noise generated by illumination or the like, the captured image captured by the image acquisition unit 51 is received and processed into an image that is easy to inspect.

The brightness measuring unit 52b receives the image processed from the image processing unit 52a or the brightness information measured by the luminance meter of the image obtaining unit 51, and can measure the change in brightness before and after the bending of the curved object region S2 and/or the curved object region S2. The change in brightness during bending.

The visual inspection unit 52c receives the processed image from the image processing apparatus 52a, and the image in the curved object region S2 can detect damage on the surface or inside and/or short circuit and disconnection of the circuit formed on the substrate S. Bad elements such as.

The processing unit 52d can determine whether or not the substrate S is defective by integrating the measurement/inspection results of the brightness measuring unit 52b and the appearance inspection unit 52c.

In other words, the processing unit 52d analyzes the brightness and the amount of change in brightness before and after the bending of the curved object region S2 received from the brightness measuring unit 52b, and whether or not the brightness and the amount of change in brightness of the corresponding substrate S are maintained in the normal range. It is possible to determine whether or not the corresponding substrate S is defective by the failure of the integrated curved object region S2 memory, the damage size, the short circuit of the circuit, or the disconnection.

The display unit 53 can display the image and the brightness of the curved object region S2 imaged by the image acquisition unit 51, and can display the image of the curved object region S2 processed by the computing unit 52, the brightness of the curved object region S2, and the amount of change in luminance. , bad elements and other information.

Specifically, the display unit 53 can display an image before and after the bending of the curved object region S2, an image during bending, and the like, and in each state, the brightness measuring unit 52b can display the measured brightness and the amount of change in brightness, in each state. Next, the defective element detected by the appearance detecting unit 52c can be displayed on the image of the curved object region S2.

Further, the display unit 53 can display whether or not the substrate S determined by the processing unit 52d is defective.

In the substrate chuck lowering step (S107, S110), the raised substrate chuck 20 is lowered to the original position, thereby releasing the bent state of the substrate S.

When the elevation driving device 31 lowers the lift pins 32 to return the substrate chuck 20 to the original position, the covering member 40 and the substrate S are restored to their flat state initially mounted on the table 10 or the substrate S by their own elastic force.

Then, in the step of determining the number of times of repeated bending (S108), the number of times of lifting and lowering of the substrate chuck 20 and the set number of repeated bendings can be compared.

The number of times of lifting and lowering of the substrate chuck 20 corresponds to the number of times of bending of the substrate S. When the number of times of lifting and lowering of the substrate chuck 20 does not reach the set number of repeated bendings, the substrate chuck 20 is raised again, and the substrate chuck raising step (S104) and the curved object are repeated. The area imaging step (S105), the brightness and appearance inspection step of the curved object area (S106), and the substrate chuck lowering step (S107).

The counting step (S109) is a step of calculating the number of times of bending of the substrate S, and the first N value is set to 1, and the step of determining the number of times of repeated bending after the substrate S is first bent (S108), and if it is determined that the value of N has not reached the set value When the number of times of bending is repeated, the number of bending of the substrate S is calculated by increasing the value of N by one.

After the substrate S is repeatedly bent, if the N value reaches the set number of repeated bendings, the final substrate chuck 20 is lowered (S110), and the substrate bending inspection is ended.

Thus, according to the substrate bending inspection method of the embodiment of the present invention, the substrate S can be subjected to the bending test repeatedly, and the optical inspection of the curved object region S2 and the optical inspection can be simultaneously performed.

Further, by using the corners of the substrate chuck 20, the bending test is repeatedly performed on the specific region of the curved object region S2 by the same external force, thereby ensuring the reliability of the bending test and the inspection.

The embodiments of the present invention have been described above with reference to the drawings, but the present invention is not limited to the embodiments, and can be manufactured in different forms, and those skilled in the art to which the present invention pertains should understand that the technology of the present invention is not changed. Thought or necessity In the case of the sign, it can be implemented in other specific forms. Therefore, the above-described embodiments are to be considered in all respects as illustrative and not restrictive.

1‧‧‧Substrate bending device

10‧‧‧Workbench

11‧‧‧ attracting mouth

12‧‧‧Attracting the flow path

15‧‧‧through hole

20‧‧‧Substrate suction cup

30‧‧‧ Lifting Department

31‧‧‧ Lifting drive

32‧‧‧lifting pin

40‧‧‧ Covering components

S‧‧‧Substrate

Claims (20)

A substrate bending device comprising: a working table formed with a through hole; a substrate suction cup, an abutting surface of the curved object region of the supporting substrate, through which the inlet and the exit are accessed; and a lifting portion for the substrate suction cup relative to the working table And raising or lowering; and covering the member to adhere to the table in a state of covering the substrate, and bending the curved object region by using a difference between the height of the substrate chuck and the table. The substrate bending apparatus according to claim 1, wherein the table includes a suction portion that supplies a vacuum pressure between the covering member and the table so that the covering member abuts against the table. The substrate bending apparatus according to claim 1, wherein the table includes at least one pair of holders for fixing both sides of the covering member. The substrate bending device according to claim 1, further comprising an image pickup portion for photographing the curved object region. The substrate bending device according to claim 4, wherein the imaging unit includes a brightness measuring unit that measures brightness of the curved object region. The substrate bending apparatus according to claim 4, wherein the imaging unit includes an appearance inspection unit for inspecting an appearance of the curved object region. The substrate bending device according to claim 1, wherein the substrate chuck is true The porous suction cup of the substrate is vacantly adsorbed, and one side abutting surface of the curved object region is vacuum-adsorbed on the porous suction cup, and the other side abutting surface of the curved object region is vacuum-adsorbed to the side of the porous suction cup. The substrate bending apparatus according to claim 7, wherein the porous chuck has a curved surface having the predetermined radius of curvature between the upper surface and the side surface so that the curved object region is curved in a state of maintaining a predetermined radius of curvature. A substrate bending inspection device includes: a table; a substrate suction cup protruding from the table for supporting an abutting surface of a curved object region of the substrate; and a covering member covering the substrate to be in close contact with the table, The curved object region is bent by a difference between a height of the substrate chuck and the table; and an image inspection portion for photographing the curved object region. The substrate bending inspection device according to claim 9, wherein the imaging inspection unit includes a brightness measuring unit for measuring the brightness of the curved object region. The substrate bending inspection device according to claim 9, wherein the imaging inspection portion includes an appearance inspection portion for inspecting an appearance of the curved object region. The substrate bending inspection apparatus according to claim 9, further comprising a lifting portion for lifting the substrate chuck so that the substrate chuck protrudes to an upper portion of the table. The substrate bending inspection device according to claim 9, wherein the table package A suction portion is provided to provide a vacuum pressure between the cover member and the table so that the cover member abuts against the table. The substrate bending inspection apparatus according to claim 9, wherein the table includes at least one pair of holders for fixing both sides of the covering member. The substrate bending inspection device according to claim 9, wherein the substrate suction cup is a porous suction cup that vacuum-adsorbs the substrate, and one side abutting surface of the curved object region is vacuum-adsorbed on the porous suction cup, and the curved object region is further One side abutting surface is vacuum-adsorbed to the side of the porous chuck. The substrate bending inspection apparatus according to claim 15, wherein the porous chuck has a curved surface having the predetermined radius of curvature between the upper surface and the side surface so that the curved object region is curved in a state of maintaining a predetermined radius of curvature. A substrate bending inspection method comprising: a step of arranging an abutting surface of a curved object region of a substrate on a substrate chuck; a step of arranging a covering member covering the substrate on a surface of a table accommodating the substrate chuck; and adhering to the covering member And a step of the table; and lifting the substrate chuck from the table, the covering member pressing the curved object region toward the corner side of the substrate chuck to bend the curved object region. The substrate bending inspection method according to claim 17, further comprising pressurizing the abutting surface disposed on the substrate chuck and the corner side facing the substrate chuck The step of the curved object region is adsorbed on the substrate chuck. The substrate bending inspection method according to claim 17, further comprising the step of measuring the brightness of the curved object region pressed toward the corner side of the substrate chuck. The substrate bending inspection method according to claim 17, further comprising the step of inspecting an appearance of the curved object region pressed toward a corner side of the substrate chuck.