KR20140139825A - Apparatus for bending substrate, apparatus and method for inspecting bended substrate - Google Patents

Abstract

Provided are a display device and a manufacturing method thereof. A substrate bending apparatus according to the present invention includes a stage on which a through hole is formed, a substrate chuck which supports an adjacent surface of a bending target region of the substrate and appears and disappears from the stage through the through hole, a lifting unit which relatively lifts the substrate chuck with regard to the stage, and a cover member which is closely attached to the stage while covering the substrate and bends the bending target region using a height difference between the substrate chuck and the stage.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate bending apparatus, a substrate bending apparatus,

The present invention relates to a substrate bending apparatus, a substrate bending inspection apparatus, and a substrate bending inspection method using the same.

2. Description of the Related Art Various flat panel display devices have been widely used not only for home-use display devices such as TVs and monitors, but also for portable display devices such as notebook computers, cell phones, and PMPs. Currently produced or developed flat panel display devices are liquid crystal display (LCD), electro luminescent display (LED), field emission display (FED), plasma display panel (PDP), and organic light emitting display (OLED).

In recent years, in order to improve the portability of IT devices and to realize various display forms, studies are being made on a flexible flat panel display device which can be bent or curled in a curved shape or rolled or stored.

In particular, flexible flat panel displays should be able to display images stably not only in a planar state but also in a curved surface state, and the ability of restoring the shape to its original shape and its ability to display an image even after repeated bending must be maintained.

Therefore, it is required to repeatedly perform a bending test on a flexible substrate in the production process of the product, an optical property inspection of the bending area, and an appearance inspection.

Accordingly, it is an object of the present invention to provide a substrate bending apparatus for bending a substrate, a substrate bending inspection apparatus for inspecting a bending region in a state where the substrate is bent, and a substrate bending inspection method using the same.

The technical objects of the present invention are not limited to the technical matters mentioned above, and other technical subjects not mentioned can be clearly understood by those skilled in the art from the following description.

According to another aspect of the present invention, there is provided a substrate bending apparatus including a stage having a through hole, a substrate supporting an adjacent surface of the substrate to be bent, And a cover member that is in close contact with the stage while covering the substrate and bends the bend target area using a height difference between the substrate chuck and the stage .

According to an aspect of the present invention, there is provided an apparatus for inspecting a substrate bend, including a stage, a substrate chuck protruding from the stage and supporting an adjacent surface of the substrate bending area, A cover member which is in close contact with the stage and bends the bendable area using the height difference between the substrate chuck and the stage, and a photographing unit which photographs the bendable area.

According to an aspect of the present invention, there is provided a substrate bending inspection method comprising: disposing an adjacent surface of a substrate bending area on a substrate chuck; Comprising the steps of: placing a cover member covering a substrate; bringing the cover member and the stage in close contact; raising the substrate chuck from the stage; and pressing the bending object region to the edge side of the substrate chuck, And bending the object area.

The embodiments of the present invention have at least the following effects.

It is possible to perform repetitive bending test on the local portion of the substrate with a constant external force and to effectively apply the minimal stress change to the local bending region through fine adjustment of the external force required for bending.

In addition, it is possible to measure minute changes in brightness of the bending area, as well as the bending test of the substrate, and at the same time to detect micro cracks in the bending area.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the specification.

1 is a schematic plan view of a substrate bending apparatus according to a first embodiment of the present invention.
2 is a schematic side cross-sectional view of a substrate bending apparatus according to a first embodiment of the present invention.
3 is a view showing a substrate placed on a substrate chuck.
4 and 5 are schematic operation diagrams of a substrate bending apparatus according to a first embodiment of the present invention.
Figure 6 is a schematic side view of a substrate chuck according to one embodiment of the present invention.
7 is a schematic side view of a substrate chuck according to another embodiment of the present invention.
8 is a schematic cross-sectional view of a substrate bending apparatus according to a second embodiment of the present invention.
9 is a schematic plan view of a substrate bending apparatus according to a third embodiment of the present invention.
10 is a schematic cross-sectional view of a substrate bending apparatus according to a fourth embodiment of the present invention.
11 is a schematic cross-sectional view of a substrate bending apparatus according to a second embodiment of the present invention.
12 is a block diagram of a photographing unit of a substrate bending test apparatus according to an embodiment of the present invention.
13 is a flowchart of a substrate bending test method according to an embodiment of the present invention.
14 to 16 are operation diagrams illustrating a substrate bending test process using the substrate bending test apparatus according to the embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of the components shown in the figures may be exaggerated for clarity of description.

Embodiments described herein will be described with reference to plan views and cross-sectional views, which are ideal schematics of the present invention. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in the shapes that are generated according to the manufacturing process. Thus, the regions illustrated in the figures have schematic attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific types of regions of the elements and are not intended to limit the scope of the invention.

FIG. 1 is a schematic plan view of a substrate bending apparatus according to a first embodiment of the present invention, FIG. 2 is a schematic side cross-sectional view of a substrate bending apparatus according to a first embodiment of the present invention, Fig.

1 and 2, a substrate bending apparatus 1 according to a first embodiment of the present invention includes a stage 10, a substrate chuck 20, a lift portion 30, and a cover member 40 .

The stage 10 is a flat plate on which a cover member 40 used for bending the substrate S and the substrate S is seated and has a through hole 15 through which the substrate chuck 20 can ascend and descend .

Further, the stage 10 may be provided with a suction unit for fixing the cover member 40. The suction unit includes a plurality of suction ports 11 formed on both sides of the through hole 15 at regular intervals and a suction flow path 12 formed inside the stage 10 so as to communicate with the plurality of suction ports 11. The suction passage 12 is connected to a vacuum pump (not shown) to provide a vacuum pressure to the suction port 11 side

3, the width of the upper surface of the substrate chuck 20 is narrower than the width or length of the substrate S, so that the substrate chuck 20 can support a part of the substrate S. Hereinafter, for convenience of explanation, the substrate S is divided into three regions, i.e., a seating area S1, a bending area S2, and a protruding area S3.

The bending object zone S2 is an area that is positioned at the edge of the substrate chuck 20 and bends using the edge of the substrate chuck 20 and the seating area S1 is located on one side of the adjacent surface of the bending object zone S2 And the protruding area S3 is an area located on the other one of the adjacent surfaces of the bending object area S2 as an area located on the outer side of the substrate chuck 20, . ≪ / RTI >

3, in the case where the substrate S2 is to be bent at the side edges of the substrate chuck 20, the area between the both side bending areas S2 is located in the seating area S1 And an area located opposite to the seating area S1 about the bending object area S2 may be defined as the protruding area S3.

The position of the substrate chuck 20 before and after the rise and fall can be determined by the distance between the upper surface of the stage 10 and the upper surface of the stage 10, The upper surface of the chuck 20 may be accommodated in the through hole 15 so as to be located on the same plane.

The elevating portion 30 includes a lift pin 32 for supporting the substrate chuck 20 and an elevation driving device 31 for raising and lowering the lift pin 32 provided at a lower portion of the substrate chuck 20 .

The elevation drive device 31 can raise and lower the substrate chuck 20 from the stage 10 by raising and lowering the lift pins 32. [ Further, the elevation drive device 31 can control the elevation height and / or the elevation speed of the elevation pins 32.

As the elevating / lowering drive device 31, a hydraulic cylinder for elevating / lowering the elevating pin 32 using a change in the hydraulic pressure may be used.

The lifting and lowering driving device 31 using the hydraulic cylinder can finely control the lifting height and / or lifting speed of the lifting pin 32. Accordingly, it is possible to provide various bending environments, and it is possible to effectively induce only minimal stress change in the bending area S2 by fine adjustment of the hydraulic pressure amount.

In addition, even when a strong restoring force is applied to the bent bending area S2, a strong upward force corresponding to the restoring force can be provided to the substrate chuck 20 by adjusting the hydraulic pressure.

The cover member 40 is a component for bending the substrate S in association with the rise of the substrate chuck 20 and covers the substrate S that is seated on the substrate chuck 20 and is located on the stage 10 .

 The cover member 40 is stretched in the process of lifting the substrate chuck 20 while the portion of the cover member 40 covering the substrate S is restored to its original state in the process of descending the substrate chuck 20 and returning to the through hole 15 For this purpose, the cover member 40 may be provided with a film of a material excellent in elongation and recovery stability.

Hereinafter, the operation of the substrate bending apparatus according to the first embodiment of the present invention will be described. 4 and 5 are schematic operation diagrams of a substrate bending apparatus according to a first embodiment of the present invention.

4, the substrate chuck 20 may be positioned in the through-hole 15 such that the upper surface of the substrate chuck 20 is coplanar with the upper surface of the stage 10. As shown in Fig. Hereinafter, this is referred to as the home position of the substrate chuck 20. [

The substrate S to be bent is disposed on the substrate chuck 20. [ As described above, the substrate S has a structure in which the bending area S2 is located at the edge of the substrate chuck 20, the seating area S1 is located on the upper surface of the substrate chuck 20, And may be disposed outside the chuck 20 (see FIG. 3).

The cover member 40 may be disposed above the substrate S disposed on the substrate chuck 20. [ The area of the cover member 40 may correspond to the area of the stage 10 and may be placed on the stage 10 so as to cover the entire surface of the substrate S and the suction port 11 formed in the stage 10. [

After the substrate S and the cover member 40 are sequentially placed on the substrate chuck 20 and the stage 10, a vacuum is generated through the suction port 11 and the suction flow path 12 provided in the stage 10, Exhaust can be done. A vacuum pressure is formed between the cover member 40 and the stage 10 so that both sides of the cover member 40 can be brought into close contact with the stage 10 with respect to the substrate S. [

5, after the cover member 40 is tightly fixed to the stage 10, the lifting and lowering driving device 31 can raise the lifting pins 32 to raise the substrate chuck 20 .

The height difference between the upper surface of the substrate chuck 20 and the upper surface of the stage 10 is generated by the rise of the substrate chuck 20 and both sides of the cover member 40 are held in close contact with the stage 10 S is stretched with the rise of the substrate chuck 20.

 The elastic reaction force in accordance with the elongation of the cover member 40 can press the substrate S toward the substrate chuck 20 side.

The cover member 40 is formed by closely contacting the protruding region S3 of the substrate S to the side surface of the substrate chuck 20 by the difference in height between the both sides of the substrate 10 that are in close contact with the stage 10 and the center portion that covers the substrate S So that the area S2 to be bent of the substrate S is pressed toward the edge of the substrate chuck 20 so that the area S2 to be bent is bent along the edge.

The elevating pin 32 is lowered again to return the substrate chuck 20 to the home position after the elevating / lowering drive device 31 has raised the elevating pin 32 to the previously entered elevating height.

When the substrate chuck 20 returns to the home position, the cover member 40 can be restored to a flat state that has been seated on the original stage 10 and the substrate S by self-elasticity, as shown in Fig. 4 .

As the cover member 40 recovers to its initial state, the substrate S can also be restored to its flat state, which was also rested on the original substrate chuck 20 by its own elasticity.

5, the elevation driving apparatus 31 re-raises the substrate chuck 20 to bend the area S2 to be bent of the substrate S, and thereafter, as shown in FIG. 4, The process of returning the substrate chuck 20 to the home position and restoring the substrate S to a flat state is repeated and the bending test for the substrate S can be performed.

Hereinafter, a substrate chuck according to an embodiment of the present invention will be described.

Figure 6 is a schematic side view of a substrate chuck according to one embodiment of the present invention.

As shown in FIG. 6, a substrate chuck 201 according to an embodiment of the present invention may be a porous chuck.

Porous chuck is a vacuum chuck for adsorbing and fixing a substrate by using vacuum pressure. Generally, porous chuck is made of porous ceramics with SiC powder as main material. Therefore, the porous chuck can include a plurality of pores on its surface, and adsorb and fix the substrate or the like that is seated on the surface by using the vacuum pressure provided through the pores.

When the porous porous chuck is used as the substrate chuck 201 as in the present embodiment, vacuum pressure is applied to the upper surface of the substrate chuck 201 to stably support the substrate S.

Since the vacuum can be applied to the side surface of the substrate chuck 201 through the plurality of pores formed in the side surface of the substrate chuck 201, the protruding area S3 folded by the cover member 40 to the side surface of the substrate chuck 201 during the bending process And can be tightly fixed to the side surface of the substrate chuck 201.

In the bending process, the seating area S1 of the substrate S positioned on the upper surface of the substrate chuck 201 and the protruding area S3 of the substrate S positioned on the side of the substrate chuck 201 are simultaneously chucked The state in which the bending area S2 between the seating area S1 and the projection area S3 is bent by using the edge of the substrate chuck 201 can be more stably maintained.

The substrate chuck 201 according to the present embodiment is moved in the process of returning to the home position by the punch of the surface such that the bending area S2 and the protruding area S3 are recovered to the same plane as the seating area S1 The provided vacuum pressure can be shut off.

7 is a schematic side view of a substrate chuck according to another embodiment of the present invention.

As shown in Fig. 7, the substrate chuck 202 according to the present embodiment is formed into a curved surface having a predetermined curvature at an edge of an upper surface on which the substrate S is placed.

Therefore, at the time of substrate bending, the area to be bent S2 is in close contact with the edge of the substrate chuck 202 having a predetermined curvature, and can be bent along the curvature of the edge.

Therefore, in the case where the bending test is to be carried out with the specific curvature of the bending area S2, the substrate chuck 202 according to the present embodiment can be used.

Also, the substrate chuck 202 according to the present embodiment may be provided with a plurality of substrate chucks 202 having different curvatures at corners, so that the bending test can be performed while varying the curvature of the corners.

For example, the initial bending test for the same substrate S may be performed by mounting a substrate chuck 202 having the largest curvature edge of the plurality of substrate chucks 202 to the substrate bending apparatus, The bending test can be carried out while changing to the substrate chuck 202 having the edge of the substrate chuck 202.

Through this bending test, it is possible to accumulate data on the limit curvature in accordance with the number of times the substrate S is bent.

The substrate chuck 202 according to the present embodiment can also use the above-described porous chuck. In this case, the seating area S1 and the protruding area S3 are closely fixed to the upper surface and the side surface of the substrate chuck 202, The bending object region S2 can stably maintain the bending state according to the curvature of the corner.

Hereinafter, a substrate bending apparatus according to another embodiment of the present invention will be described. For convenience of description, the same reference numerals as those in the first embodiment denote the same reference numerals, and a description of components common to those in the first embodiment will be omitted.

 8 is a schematic cross-sectional view of a substrate bending apparatus according to a second embodiment of the present invention.

As shown in FIG. 8, the substrate bending apparatus 2 according to the present embodiment may include a plurality of substrate chucks 20.

In the substrate bending apparatus 2 according to the present embodiment, two or more substrate chucks 20 are spaced apart from each other by a predetermined distance, or four or more substrate chucks 20 are spaced apart from each other by a predetermined distance, .

A plurality of through-holes 15 may be formed in the stage 10 at predetermined intervals corresponding to a plurality of substrate chucks 20.

The cover member 40 is disposed so as to cover the entire surface of the substrate S and the stage 10 or a plurality of the cover members 40 are arranged for each substrate chuck 20 so as to cover the substrate chuck 20 Or the like.

A plurality of elevating pins 32 may be provided to support the respective substrate chucks 20. The elevating and lowering driving device 31 may control the elevating pins 32 to raise or lower the elevating pins 32 uniformly, 32 can be individually controlled.

As shown in Fig. 8, the substrate bending apparatus 2 according to the present embodiment may be used in such a manner that bending is performed on a plurality of substrates S at a time using a plurality of substrate chucks 20. Fig.

Alternatively, the substrate bending apparatus 2 according to the present embodiment may attempt to bend at one time a plurality of points with respect to one substrate S by using a plurality of substrate chucks 20.

In this case, the elevation driving device 31 can uniformly control the elevation height and / or the elevation speed of each of the elevation pins 32 to advance the bending of the plural points in the same form.

Alternatively, the elevation driving device 31 may individually control the elevation height and / or the elevation speed of each of the elevation pins 32 so that bending of the plurality of points proceeds in different forms. When the elevation height and / or the elevation speed of the substrate chuck 20 are controlled differently, the twisting of the substrate S can be induced. Accordingly, the torsion test on the substrate S can be performed in parallel with the bending test on the substrate S.

9 is a schematic plan view of a substrate bending apparatus according to a third embodiment of the present invention.

As shown in FIG. 9, the substrate bending apparatus 3 according to the present embodiment may further include clamps 13 on both sides of the stage 10.

At least one pair of clamps 13 may be provided on both sides of the stage 10 and both ends of the cover member 40 may be fixed to the stage 10. [

The cover member 40 is brought into close contact with the stage 10 through the vacuum pressure provided by the plurality of suction openings 11 formed in the stage 10, A tensile force is applied to the substrate chuck 20 side. Therefore, when the vacuum pressure between the cover member 40 and the stage 10 is weaker than the tensile force, the cover member 40 may be pulled toward the substrate chuck 20 during the rise of the substrate chuck .

The substrate bending apparatus 3 according to the present embodiment is configured such that the clamp 13 clamps both ends of the cover member 40 to the stage 10 so that the substrate chuck 20 rises and the cover member 40 is extended The cover member 40 can be more stably fixed to the stage 10.

10 is a schematic cross-sectional view of a substrate bending apparatus according to a fourth embodiment of the present invention.

10, the substrate bending apparatus 4 according to the present embodiment may include a receiving groove 16 for receiving the substrate chuck 20 on the stage 10. [

The depth of the receiving groove 16 is formed to correspond to the height of the substrate chuck 20 so that when the substrate chuck 20 is seated on the bottom surface of the receiving groove 16, As shown in FIG.

The lift pin 32 also penetrates the bottom surface of the receiving groove 16 to support the substrate chuck 20 and can raise and lower the substrate chuck 20 from the receiving groove 16.

The substrate bending apparatus 4 according to the present embodiment supports the substrate chuck 20 with the bottom surface of the receiving groove 16 when the substrate chuck 20 is in the home position.

Therefore, the burden of the lifting pin 32 and the lifting and driving apparatus 31 to continuously support the substrate chuck 20 is alleviated, and since the groove position is kept constant by the bottom surface of the receiving groove 16, The elevation height of the substrate chuck 20 from the stage 10 can be kept constant even when the chuck 20 is lifted or lowered.

As described above, the substrate bending apparatus according to the various embodiments of the present invention intensively performs repetitive bending tests with the same external force with respect to an area specified as the bending area S2 by using the edge of the substrate chuck 20 .

In addition, various bending environments can be created by controlling the rising speed, the elevation height, and the upward force of the substrate chuck 20, and only the minimum stress change can be effectively applied to the bending region by fine adjustment of the external force required for bending.

Hereinafter, a substrate bending test apparatus according to an embodiment of the present invention will be described.

FIG. 11 is a schematic cross-sectional view of a substrate bending test apparatus according to an embodiment of the present invention, and FIG. 12 is a block diagram of a photographing unit of a substrate bending test apparatus according to an embodiment of the present invention.

11, the substrate bending inspection apparatus 5 according to the embodiment of the present invention includes a stage 10, a substrate chuck 20, a lift unit 30, a cover member 40, and a photographing inspection unit 50 ).

The substrate bending inspection apparatus 5 according to the present embodiment uses the above-described substrate bending apparatus. The description of the stage 10, the substrate chuck 20, the elevating section 30, and the cover member 40 is the same as the above- And the description thereof will be omitted.

The imaging inspection unit 50 of the substrate bending inspection apparatus 5 according to the present embodiment may include an image acquisition unit 51, an operation unit 52, and a display unit 53, as shown in FIG.

The image acquiring unit 51 may include a CCD (Charge Coupled Device) camera as a component for photographing the area S2 to be bent of the substrate S and may measure the luminance of the area S2 to be bent For example.

The image obtaining section 51 may be installed so as to direct the position where the bending area S2 of the substrate S is bent. For example, as shown in FIG. 11, the substrate chuck 20 may be vertically downwardly directed at an upper portion of a corner portion of the substrate chuck 20, or may be provided at an upper portion of the stage 10 to be bent And may be provided at an angle to direct the bent position.

The image acquiring unit 51 is provided movably in the XYZ axis and scans and photographs the bending object area S2 while moving along the edge of the substrate chuck 20, After the one bending area S2 is photographed, the bending target area S2 may be moved toward the other edge of the substrate chuck 20 to photograph the other bending area S2 bent at the other edge of the substrate chuck 20.

Or the image acquiring unit 51 may include a pair of cameras each of which directs both side edge portions of the substrate chuck 20. In this case, the images of the bending area S2 on both sides bent by both side edges of the substrate chuck 20 can be acquired at the same time.

As shown in Fig. 12, the operation unit 52 may include an image reading unit 52a, a luminance measurement unit 52b, an appearance inspection unit 52c, and a processing unit 52d.

The image processing unit 52a receives the photographed image photographed by the image obtaining unit 51 and processes the photographed image into an image that is easy for inspection.

For example, the photographed image received from the image obtaining unit 51 may be converted into a digital image, or only the image of the bending area S2 may be separated into a check area and then sorted, And the like can be performed.

On the other hand, the luminance measuring unit 52b receives the processed image from the image reader 52a and measures the luminance of the bending area S2.

When the substrate S is bent, the circuit formed on the substrate S is also bent together, so that the circuit characteristics may be slightly changed, such as the resistance of the circuit is increased, and thus the luminance of the displayed image may be changed.

Therefore, the brightness measuring unit 52b can measure the brightness change before and after bending the bending area S2 and / or the brightness change during the bending of the bending area S2.

The image obtaining unit 51 may include a luminance meter and the luminance measuring unit 52b may measure luminance and luminance changes of the bending area S2 in conjunction with the luminance meter.

On the other hand, the appearance inspection unit 52c receives the processed image from the image reading unit 52a and checks whether the bending area S2 is defective or not.

The appearance inspecting section 52c can detect defects such as cracks existing on the surface or inside of the image of the bending area S2 and / or short circuit / break of the circuit formed on the substrate S.

The appearance inspecting unit 52c may store a reference image serving as a criterion of defect judgment and may detect a defective element existing in the bending area S2 by comparing the reference image and the image transferred from the studying unit 52a .

The reference image may be a substrate image having no defective elements, and may be an image for the same point as the bending area S2 photographed by the image obtaining unit 51. [

The processing unit 52d is connected to the luminance measuring unit 52b and the appearance inspecting unit 52c to judge whether or not the substrate S is defective according to the measurement / inspection results of the luminance measuring unit 52b and the appearance inspecting unit 52c can do.

The processing unit 52d analyzes the luminance and the luminance variation amount before and after bending and / or bending of the bending area S2 transmitted from the luminance measurement unit 52b and determines whether the luminance and luminance variation of the substrate S is within the normal range It can be judged whether or not it is maintained within a predetermined range.

In addition, the luminance and luminance variation of the substrates S to be inspected may be stored and the average luminance variation may be calculated according to the degree of bending.

The processing unit 52d can also determine whether the substrate S is defective based on the information on the defective elements existing in the bending area S2 transmitted from the appearance inspection unit 52c.

The processing unit 52d can determine whether or not the substrate S is defective based on the presence or absence of cracks in the bending area S2, the size of the cracks, and whether the circuit is short-circuited or disconnected.

The display unit 53 may be connected to the image obtaining unit 51 and the calculating unit 52 and may display information about the image of the bending area S2 and the brightness, .

Specifically, the display unit 53 can display images before and after bending the bending area S2, images during bending, etc., and can display the luminance / luminance variation measured by the luminance measuring unit 52b in each state And the defective elements detected by the appearance inspection unit 52c in each state can be displayed on the image of the bending area S2.

Further, the display unit 53 can display information on whether or not the substrate S has been judged by the processing unit 52d.

Accordingly, the substrate bending inspection apparatus 5 according to the embodiment of the present invention performs repetitive bending test on the substrate S and simultaneously performs optical inspection such as crack and brightness of the bending area S2 .

Also, it is possible to intensively perform repetitive bending tests with the same external force on the region specified as the bending object area S2 by using the edge of the substrate chuck 20, and reliability of the bending test and inspection can be ensured.

Hereinafter, a substrate bending test method using the substrate bending test apparatus according to the embodiment of the present invention will be described.

FIG. 13 is a flowchart of a substrate bending test method according to an embodiment of the present invention, and FIGS. 14 to 16 are operation diagrams illustrating a substrate bending test process using the substrate bending test apparatus according to an embodiment of the present invention.

As shown in FIG. 13, the substrate bending inspection method according to the embodiment of the present invention includes a substrate placement step S101, a cover member placement step S102, a substrate and cover member absorption step S103, (Step S104), a bending area photographing step S105, a brightness and appearance inspection step S106 of the bending area, a substrate chuck lowering step S107 and S110, a bending repeat number determination step S108, and a counting step S109 do.

The substrate placement step S101 is a step of arranging the substrate S to be subjected to the bending inspection on the substrate chuck 20 so that a part of the substrate S is held on the substrate chuck 20 As shown in FIG. At this time, the substrate S can be arranged such that the bending area S2 is positioned at the edge of the substrate chuck 20, and one side of the bending area S2 is adjacent to the substrate chuck 20 And the other side of the adjacent surface of the bending object area S2 may be defined as a protruding area protruding outward of the substrate chuck 20 (see FIG. 3).

The step of arranging the cover member (S102) after the step of arranging the substrate (S101) is a step of disposing the cover member (40) so as to cover the entire surface of the substrate (S) 40 may be arranged so that the center portion covers the substrate S and the both sides extending from the center portion cover the stage 10. [

As the cover member 40, a film having excellent elongation and recovery stability may be used.

The substrate and cover member adsorption step S103 is a step of fixing the substrate S to the substrate chuck 20 and fixing the cover member 40 to the stage 10, 20 can secure the substrate S to the substrate chuck 20 by providing a suction force on the upper surface to form a vacuum between the substrate S and the upper surface of the substrate chuck 20, The cover member 40 can be fixed to the stage 10 by providing the suction force to the stage 10 by forming vacuum pressure between both sides of the cover member 40 and the upper surface of the stage 10. [

The substrate chuck lifting step S104 is a step of bending the substrate S through the rise of the substrate chuck 20 so that the lifting and driving apparatus 31 supports the substrate chuck 20 The height difference can be formed between the upper surface of the substrate chuck 20 and the upper surface of the stage 10 by raising the lift pins 32. [

The seating area S1 of the substrate S is supported and raised by the substrate chuck 20 so that both sides of the cover member 40 are in contact with the upper surface of the stage 10, Is raised by the substrate chuck 20.

The cover member 40 adheres the protruding region S3 of the substrate S to the side surface of the substrate chuck 20 by the height difference between both sides of the substrate S close to the stage 10 and the center portion covering the substrate S, The area S2 to be bent of the substrate S may be pressed toward the edge of the substrate chuck 20 so that the area S2 to be bent is bent along the edge.

The substrate chuck 20 is fixed to the substrate chuck 20 up to the protruding area S3 of the substrate S which is brought into close contact with the side surface of the substrate chuck 20, S2) can stably maintain the bending state.

Further, the elevation driving device 31 can control the ascending speed and height of the elevation pins 32 and can provide various bending environments.

14 to 16, the image obtaining unit 51 provided for directing the edge portion of the substrate chuck 20 can photograph the bending area S2 in the bending target area photographing step S105 have.

The image obtaining unit 51 may include a CCD camera for photographing the bending area S2 and a luminance meter for measuring the brightness of the area to be bent S2.

The CCD camera can take an image of the bending area S2 before and after bending and bending, and the brightness meter can measure the brightness of the bending area S2 before and after bending.

The image acquiring unit 51 is provided movably in the XYZ axis and scans and photographs the bending object area S2 while moving along the edge of the substrate chuck 20, After the one bending area S2 is photographed, the bending target area S2 may be moved toward the other edge of the substrate chuck 20 to photograph the other bending area S2 bent at the other edge of the substrate chuck 20.

Or the image acquiring unit 51 includes a pair of cameras each of which directs both side edge portions of the substrate chuck 20 so that the bending target regions S2 of both sides bent by both side edges of the substrate chuck 20 Images can be acquired simultaneously.

In the brightness and appearance inspection step S106 of the bend target area, the calculation unit 52 processes the image and luminance information of the bend target area S2 taken / measured by the image obtaining unit 51, and displays the processed information on the display unit 53).

The calculation unit 52 may include an image processing unit 52a, a luminance measurement unit 52b, an appearance inspection unit 52c, and a processing unit 52d.

The image studying unit 52a converts the photographed image received from the image obtaining unit 51 into a digital image, separates only the image of the bending area S2 from the photographed image into the inspection area, And the generated noise is removed, so that the captured image captured by the image obtaining unit 51 is received and processed into an image that is easy to be inspected.

The luminance measuring unit 52b receives the luminance information measured by the luminance meter of the image or image obtaining unit 51 processed by the image sensor 52a from the luminance measuring unit 52b, It is possible to measure the change in luminance before and / or after the bending and / or the change in luminance during bending of the bending area S2.

The appearance inspection unit 52c receives the processed image from the image reading unit 52a. It is possible to detect defects such as cracks existing on the surface or inside of the image of the bend area S2 and / or short circuit / break of the circuit formed on the substrate S.

The processing unit 52d can determine whether the substrate S is defective by integrating the measurement / inspection results of the luminance measurement unit 52b and the appearance inspection unit 52c.

That is, the processing unit 52d analyzes the luminance and the luminance variation amount before and after bending and / or bending of the bending area S2 transmitted from the luminance measurement unit 52b, and determines whether the luminance and luminance variation of the substrate S is It is possible to determine whether or not the substrate S is held within the normal range and to determine whether or not the substrate S is defective based on the presence or absence of cracks in the bending area S2, the size of the crack, Can be determined.

The display unit 53 can display the image and luminance of the bending area S2 photographed by the image obtaining unit 51 and can display the image of the bending area S2 processed by the calculating unit 52, The information on the brightness, the amount of change in brightness, the defective element, and the like in the display area S2 can be displayed.

Specifically, the display unit 53 can display images before and after bending the bending area S2, images during bending, etc., and can display the luminance / luminance variation measured by the luminance measuring unit 52b in each state And the defective elements detected by the appearance inspection unit 52c in each state can be displayed on the image of the bending area S2.

Further, the display unit 53 can display information on whether or not the substrate S has been judged by the processing unit 52d.

In the substrate chuck descent steps S107 and S110, the raised substrate chuck 20 can be lowered to the home position to release the bending state of the substrate S.

The cover member 40 and the substrate S are moved in the initial stage 10 or the substrate S by the self-elasticity when the lifting / lowering drive device 31 moves down the lifting pin 32 to return the substrate chuck 20 to the home position. S) in a flat state.

Thereafter, in the step of determining the number of times of bending repetition (S108), the number of times of rising and falling of the substrate chuck 20 can be compared with the predetermined number of times of bending.

The number of times the substrate chuck 20 is lifted and lowered corresponds to the number of bending times of the substrate S and when the number of times of rise and fall of the substrate chuck 20 does not reach the preset number of bending cycles, The substrate chuck lift step S104, the bending area photographing step S105, the brightness and appearance inspection step S106 of the bending object area, and the substrate chuck lowering step S107 are repeated.

In the counting step S109, the number of bending of the substrate S is counted. The initial value of N is set to 1, and the value of N in the bending repetition number determining step (S108) If it is determined that the number of repetitions of bending is less than the set number of times of bending, the number of bending of the substrate S can be counted by increasing the value of N by 1.

After the bending of the substrate S is repeated, when the value of N reaches the predetermined number of bending cycles, the substrate chuck 20 may be finally lowered (S110) and the substrate bending test may be terminated.

Accordingly, the substrate bending inspection method according to the embodiment of the present invention can perform the repeated bending test on the substrate S and concurrently perform optical inspection such as crack and brightness of the bending area S2.

Also, it is possible to intensively perform repetitive bending tests with the same external force on the region specified as the bending object area S2 by using the edge of the substrate chuck 20, and reliability of the bending test and inspection can be ensured.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is to be understood that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

1, 2, 3, 4: substrate bending device 5: substrate bending inspection device
10: stage 11: inlet
12: Suction flow path 13: Clamp
15: through hole 16: receiving groove
20, 201, 202: substrate chuck 30:
40: cover member 50: photographing inspection section
51: Image acquiring unit

Claims (20)

A stage having a through hole formed therein;
A substrate chuck supporting an adjacent surface of the substrate to be bent, and protruding and retracting from the stage through the through hole;
An elevating portion for elevating and lowering the substrate chuck relative to the stage; And
And a cover member that is in close contact with the stage while covering the substrate and bends the bend target area using a height difference between the substrate chuck and the stage. The method according to claim 1,
Wherein the stage includes a suction portion that provides a vacuum between the cover member and the stage so that the cover member is in close contact with the stage. The method according to claim 1,
Wherein the stage includes at least a pair of clamps for fixing both sides of the cover member. The method according to claim 1,
And a photographing unit photographing the area to be bent. 5. The method of claim 4,
Wherein the photographing unit includes a brightness measuring unit for measuring a brightness of the area to be bent. 5. The method of claim 4,
Wherein the photographing unit includes an appearance inspection unit for checking the appearance of the area to be bent. The method according to claim 1,
Wherein the substrate chuck is a porous chuck for vacuum adsorbing the substrate, one side adjacent surface of the bending area is vacuum adsorbed on the upper surface of the porous chuck, and the other adjacent surface of the bending object area is vacuum- Bending device. 8. The method of claim 7,
Wherein the porous chuck has a curved surface having the predetermined radius of curvature between the top surface and the side surface so that the bending area is bent while maintaining a certain radius of curvature. stage;
A substrate chuck protruding from the stage and supporting an adjacent surface of the substrate bending area;
A cover member which is in close contact with the stage while covering the substrate and bends the bendable area using a height difference between the substrate chuck and the stage; And
And a photographing inspection section for photographing the area to be bent. 10. The method of claim 9,
And the photographing and inspecting unit includes a brightness measuring unit for measuring the brightness of the area to be bent. 10. The method of claim 9,
Wherein the photographing and inspecting unit includes an appearance inspecting unit for inspecting the appearance of the area to be bent. 10. The method of claim 9,
Further comprising a lift portion for lifting the substrate chuck so that the substrate chuck is projected to an upper portion of the stage. 10. The method of claim 9,
Wherein the stage includes a suction portion for providing a vacuum between the cover member and the stage so that the cover member is in close contact with the stage. 10. The method of claim 9,
Wherein the stage includes at least a pair of clamps for fixing both sides of the cover member. 10. The method of claim 9,
Wherein the substrate chuck is a porous chuck for vacuum adsorbing the substrate, one side adjacent surface of the bending area is vacuum adsorbed on the upper surface of the porous chuck, and the other adjacent surface of the bending object area is vacuum- Bending test equipment. 16. The method of claim 15,
Wherein the porous chuck has a curved surface having the predetermined radius of curvature between the top surface and the side surface so that the bending area is bent while maintaining a certain radius of curvature. Disposing an abutting surface of the substrate to be bent on a substrate chuck;
Disposing a cover member covering the substrate on an upper surface of a stage for accommodating the substrate chuck;
Adhering the cover member to the stage; And
Elevating the substrate chuck from the stage and the cover member pressing the bend target area toward the edge of the substrate chuck and bending the bend target area. 18. The method of claim 17,
Further comprising the step of adsorbing the bend target area, which is pressed toward the edge side of the substrate chuck and the adjacent surface disposed on the substrate chuck, to the substrate chuck. 18. The method of claim 17,
Further comprising measuring the brightness of the area to be bent which is pushed to the edge side of the substrate chuck. 18. The method of claim 17,
Further comprising the step of inspecting the appearance of the area to be bent which is pushed to the edge side of the substrate chuck

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