CN215644395U - Wafer tester - Google Patents
Wafer tester Download PDFInfo
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- CN215644395U CN215644395U CN202121711268.8U CN202121711268U CN215644395U CN 215644395 U CN215644395 U CN 215644395U CN 202121711268 U CN202121711268 U CN 202121711268U CN 215644395 U CN215644395 U CN 215644395U
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- wafer
- wafer tester
- lifter
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Abstract
In the wafer tester provided by the utility model, the carrying disc for placing the wafer to be tested is provided with the first table board and the second table board which are matched with the sliding block for use, so that the carrying disc can be used for placing two wafers with different sizes, and the utilization rate of the carrying disc is improved; secondly, a camera in the tester acquires a sample image, finds the position of the center of a circle of the wafer by combining a machine vision algorithm, and then sequentially tests other test points by taking the center of the circle of the wafer as a reference, so that the accuracy of the measurement result is improved; in addition, pressure sensors are uniformly distributed on the surface of the loading disc in the tester, the pressure sensors can feed the pressure of the probe to the wafer back to the controller, and the controller can further feed back and adjust the downward pressure of the probe, so that the pressure of the probe to each test point is balanced, and the wafer is prevented from being broken due to overlarge stress.
Description
Technical Field
The utility model relates to the technical field of semiconductor testing, in particular to a wafer tester.
Background
In the field of semiconductor manufacturing, the sheet resistance of a wafer is a very critical parameter, and therefore in actual production, the sheet resistance of the wafer needs to be measured, and a wafer tester is the most common instrument for measuring the sheet resistance of a wafer. However, the wafer tester in the prior art has the following defects: when in testing, the probe firstly needs to find the circle center of the wafer, and then finds other test points by taking the circle center as a reference, but the tester in the prior art cannot automatically find the circle center of the wafer, so that the measurement result has deviation; the carrying disc used for placing the wafer in the existing tester is often fixed in size, that is, the same tester can only test the wafer with one size; when a probe in an existing tester is used for testing the downward pressure of a test point on a wafer, the situation that the pressure of each test point is uneven may exist, and even the situation that the wafer is cracked due to the overlarge pressure may occur.
SUMMERY OF THE UTILITY MODEL
In view of the above disadvantages of the prior art, the utility model provides a wafer tester, in which a carrying disk for placing a wafer to be tested has a first table top and a second table top, and is used in cooperation with a slider, so that the carrying disk can place two wafers with different sizes, and the utilization rate of the carrying disk is improved; secondly, a camera in the tester acquires a sample image, finds the position of the center of a circle of the wafer by combining a machine vision algorithm, and then sequentially tests other test points by taking the center of the circle of the wafer as a reference, so that the accuracy of the measurement result is improved; in addition, pressure sensors are uniformly distributed on the surface of the loading disc in the tester, the pressure sensors can feed the pressure of the probe to the wafer back to the controller, and the controller can further feed back and adjust the downward pressure of the probe, so that the pressure of the probe to each test point is balanced, and the wafer is prevented from being broken due to overlarge stress.
To achieve the above and other related objects, the present invention provides a wafer tester, comprising:
a base;
the carrying disc is positioned above the base and comprises a first table top, a second table top and a first groove;
the slider comprises a first table top and a second table top, the slider can be placed in the first groove of the loading disc, the first table top of the slider and the first table top of the loading disc are flush to form a first circular disc, the second table top of the slider and the second table top of the loading disc are flush to form a second circular ring, the first circular disc is embedded in the second circular ring, and the diameter of the first circular disc is equal to the inner diameter of the second circular ring.
Optionally, still include the slip table, the slip table includes first direction slip table, second direction slip table and third direction slip table, wherein, first direction slip table set up in the surface of base, second direction slip table with the third direction slip table is located the base top and through the stand with the base links to each other.
Optionally, the lifting device is located on the third direction sliding table and can perform lifting motion along the third direction sliding table.
Optionally, the elevator further comprises a probe fixedly mounted on the elevator.
Optionally, the apparatus further comprises a calibration device located below the boat.
Optionally, pressure sensors are uniformly distributed on the first table top and the second table top of the carrying tray.
Optionally, the disc-shaped structure further comprises a lining sheet, the shape and size of the lining sheet are the same as those of the first disc, and when the lining sheet is placed on the surface of the first disc, the upper surface of the lining sheet is flush with the upper surface of the second circular ring.
Optionally, the device further comprises a camera, wherein the camera is located above the probe and is fixedly installed on the lifter.
Optionally, the system further comprises a sheet resistance meter, and the sheet resistance meter is electrically connected with the probe.
Optionally, the lifting device further comprises a controller, and the controller is in communication connection with the pressure sensor, the sliding table and the lifter.
Optionally, the probe is a four-probe.
Optionally, the first disk has a diameter of 8 inches and the second ring has an outer diameter of 12 inches.
Optionally, an infrared sensor is respectively disposed at the edge of the first disk and the edge of the second ring, and a connection line of the infrared sensors passes through a center of the first disk.
Optionally, the first groove is of a long strip structure, and the first groove is provided with a through hole, and the circle center of the through hole coincides with the circle center of the first disc.
Optionally, the carrying disc further comprises a second groove, and the second groove is located on the outer side of the second circular ring.
Optionally, the slider is of a rectangular structure, and the length of the slider is greater than that of the first groove.
Optionally, a moving member is arranged above the first direction sliding table, and the moving member can move on the first direction sliding table along a first direction.
Optionally, the calibration device includes a lifter fixedly installed at a middle position of the surface of the moving member, and a rotator located above the lifter.
Optionally, a connecting piece is further formed on the surface of the moving piece, the connecting piece is formed on two sides of the lifter, and the carrying disc is connected with the moving piece through the connecting piece.
The wafer tester provided by the utility model at least has the following technical effects:
in the wafer tester provided by the utility model, the carrying disc for placing the wafer to be tested is provided with the first table board and the second table board which are matched with the sliding block for use, so that the carrying disc can be used for placing two wafers with different sizes, and the utilization rate of the carrying disc is improved; secondly, a camera in the tester acquires a sample image, finds the position of the center of a circle of the wafer by combining a machine vision algorithm, and then sequentially tests other test points by taking the center of the circle of the wafer as a reference, so that the accuracy of the measurement result is improved; in addition, pressure sensors are uniformly distributed on the surface of the loading disc in the tester, the pressure sensors can feed the pressure of the probe to the wafer back to the controller, and the controller can further feed back and adjust the downward pressure of the probe, so that the pressure of the probe to each test point is balanced, and the wafer is prevented from being broken due to overlarge stress.
Drawings
Fig. 1 is a schematic structural diagram of a wafer tester according to an embodiment.
Fig. 2 is a top view of a boat in a wafer tester.
FIG. 3a is a top view of the slider placed in the first recess of the carrier disk shown in FIG. 2.
Fig. 3b shows a cross-sectional view along a-a of fig. 3 a.
Figure 4a shows a top view of the carrier plate shown in figure 3a with a spacer sheet placed on the surface of the carrier plate.
Fig. 4b shows a cross-sectional view along a-a of fig. 4 a.
FIG. 5 is a schematic diagram showing a specific structure of forming a boat on a base.
Description of the element reference numerals
20 carry dish 41 first direction slip table
21 first table surface 42 second direction sliding table of carrying disc
22 second table 43 third direction sliding table of carrying disc
23 pressure sensor 50 lifter
24 infrared sensor 60 probe
200 through hole 70 alignment device
201 first groove 71 lifter
202 second groove 72 rotator
30 slide block 80 column
31 slider first table 90 liner sheet
32 slider second tabletop 100 camera
310 first disc 101 moving member
320 second ring 102 connector
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The utility model is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity, position relationship and proportion of the components in actual implementation can be changed freely on the premise of implementing the technical solution of the present invention, and the layout form of the components may be more complicated.
Examples
The present embodiment provides a wafer tester, as shown in fig. 1 to 2, the wafer tester includes: the device comprises a base 10, a carrying disc 20, a sliding block 30, a sliding table 40, a lifter 50, a probe 60 and a calibration device 70.
As shown in fig. 1, the sliding table 40 is located above the base 10, and the sliding table 40 includes a first direction sliding table 41, a second direction sliding table 42, and a third direction sliding table 43, in this embodiment, the first direction sliding table 41, the second direction sliding table 42, and the third direction sliding table 43 are respectively along an X axis, a Y axis, and a Z axis, wherein the first direction sliding table 41 is disposed on the surface of the base 10 along the X axis; the second direction sliding table 42 is arranged above the base 10 along the Y axis and is connected with the base 10 through the upright column 80; the third direction slide table 43 is located on the second direction slide table 42, and is capable of reciprocating on the second direction slide table 42 along the Y axis.
As shown in fig. 1, the lifter 50 is located on the third direction slide table 43, and is capable of lifting movement along the Z axis on the third direction slide table 43. The probe 60 is fixed on the lifter 50, that is, the probe 60 can move up and down along with the lifter 50 on the third direction sliding table 43, and in this embodiment, the probe is a four-probe.
As an example, the boat 20 is positioned above the base 10. Referring to fig. 1 to 2, the carrying tray 20 includes a first table surface 21, a second table surface 22, and a first groove 201 and a second groove 202, and pressure sensors 23 are uniformly distributed on the first table surface 21 and the second table surface 22 of the carrying tray; the edges of the first and second lands 21, 22 of the boat each have an infrared sensor 24 for aligning the initial position of the wafer before testing begins. In this embodiment, the first groove 201 is a long strip structure and has a through hole 200, the second groove 202 is a rectangle for placing a silver block, the silver block is pure silver with 99.9996% purity, and is used for calibrating the sheet resistance meter before measurement, namely, eliminating the resistance inside the sheet resistance meter.
As shown in FIGS. 3 a-3 b, the slider 30 is placed in the first groove 201 of the carrier disk and covers the through hole 200 of the first groove. The slider 30 is a rectangular structure, the length of the slider 30 is greater than that of the first groove 201, the slider 30 comprises a first table surface 31 and a second table surface 32, when the slider 30 is placed in the first groove 201 of the carrier disc, the first table surface 31 of the slider is aligned with the first table surface 21 of the carrier disc to form a first circular disc 310, the second table surface 32 of the slider is aligned with the second table surface 22 of the carrier disc to form a second circular ring 320, wherein the center of the first circular disc 310 coincides with the center of the carrier disc through hole 200, the first circular disc 310 is embedded in the second circular ring 320, and the diameter of the first circular disc 310 is equal to the inner diameter of the second circular ring 320. In this embodiment, the first circular disk 310 has a diameter of 8 inches and the second circular ring 320 has an outer diameter of 12 inches.
As an example, the wafer tester provided in this embodiment further includes a pad sheet 90, the shape and size of the pad sheet 90 are the same as those of the first circular disk 310, that is, the diameter of the pad sheet 90 is 8 inches in this embodiment, and when the pad sheet 90 is placed on the surface of the first circular disk 310, the upper surface of the pad sheet 90 is flush with the upper surface of the second circular ring 320, as shown in fig. 4a to 4 b. In this embodiment, when testing a 12-inch wafer, the pad sheet 90 is placed on the surface of the first circular disc 310, and the upper surface of the pad sheet 90 and the upper surface of the second circular ring 320 form a complete circular disc, which has a size of 12 inches and can be used to place the 12-inch wafer to be tested.
As shown in fig. 5, a moving member 101 is provided above the first direction slide table 41, and the moving member 101 is movable in a first direction (i.e., X-axis direction) on the first direction slide table 41. Connecting pieces 102 are further formed at two ends of the moving piece 101, and are used for connecting the moving piece 101 and the boat 20, so that the boat 20 can be driven by the moving piece 101 to move on the first direction sliding table 41 along the first direction (i.e. the X-axis direction).
As shown in fig. 5, a calibration device 70 is fixedly mounted on the surface of the moving member 101, and the calibration device 70 includes a lifter 71 and a rotator 72. As an example, the lifter 71 is fixedly installed on the surface of the moving member 101, the rotator 72 is located above the lifter 71, and the lifter 71 can push the rotator 72 to do ascending motion and can also drive the rotator 72 to fall back to the surface of the lifter 71; the upper surface of the rotator 72 is circular, and the rotator 72 can rotate on a horizontal plane around the center of the circle, in this embodiment, the difference between the diameter of the upper surface of the rotator 72 and the diameter of the through hole 200 of the boat is 2mm, so that the rotator 72 can pass through the through hole 200 of the boat under the pushing of the lifter 71. Before the testing process begins, a wafer to be tested is placed on the boat, and the calibration device 70 can adjust the position of the wafer to be tested so that the alignment mark of the wafer is aligned with the infrared sensor 24 on the surface of the boat.
As shown in fig. 1, the wafer tester provided in this embodiment further includes a camera 100, wherein the camera 100 is fixed on the surface of the lifter 50 and located above the probe 60, and is used for collecting a sample image during the testing process.
As an example, the wafer tester provided in this embodiment further includes an impedance meter and a controller (not shown in the drawings), where the impedance meter is electrically connected to the signal output terminal of the probe and is used for acquiring information output by the probe; the controller is in communication connection with the pressure sensor 23 on the surface of the carrying disc, the sliding table 40 and the lifter 50, and is used for collecting feedback signals of the pressure sensor 23 and controlling the movement of the sliding table 40 and the lifter 50 according to the feedback signals.
The wafer tester provided by the utility model is used for testing 8-inch wafers, and the method specifically comprises the following steps:
step 1: adsorbing the back surface of the wafer by using a vacuum suction pen, slowly placing the wafer on the first table surface 21 of the carrying disc by the vacuum suction pen along the first groove 201 of the carrying disc, and removing the vacuum suction pen when the alignment mark of the wafer is observed to be basically near the infrared sensor 24;
step 2: the infrared sensor 24 automatically detects whether the wafer alignment mark is aligned with the infrared sensor 24 (the infrared sensor 24 emits an infrared signal after being electrified, if the signal is blocked, it is indicated that the wafer alignment mark is not aligned with the infrared sensor 24, otherwise, if the signal is not blocked, it is indicated that the wafer alignment mark is aligned with the infrared sensor 24), if not, the lifter 71 pushes the rotator 72 to ascend, the rotator 72 pushes the wafer to ascend to a position about 2mm higher than the carrier disc, the rotator 72 drives the wafer to rotate until the infrared sensor is aligned with the wafer alignment mark, after the alignment is completed, the lifter 71 drives the rotator 72 to return, and the slider 30 is placed in the first groove 201;
and step 3: starting a calibration program to enable the probe of the probe 60 to be in contact with the silver block placed in the second groove 202, and if the square resistance meter displays 0.00m omega, indicating that the probe 60 has no internal resistance; otherwise, if the probe 60 has internal resistance, pressing a zero clearing button on the touch screen of the lower resistance meter to complete zero clearing of the internal resistance of the probe;
and 4, step 4: the camera 100 acquires an image of the carrier disc on which the wafer is placed, obtains a position matrix of the wafer relative to the camera, and performs operation with the known position matrix of the probe relative to the camera to obtain the position matrix of the wafer relative to the probe, and sends position information to the controller, and the controller drives the sliding table 40 to enable the probe 60 to move to the upper part of the circle center of the wafer;
and 5: the lifter 50 drives the probe 60 to descend to the surface of the wafer along the third direction (Z-axis direction) to measure the square resistance value of the center position of the wafer;
step 6: and testing other test points by taking the center of the wafer as a reference until the test of all the test points is finished.
It should be noted that, during the testing process, the pressure sensor 23 on the surface of the carrier plate can transmit the pressure of the probe 60 on the wafer to the controller in real time, and the controller can drive the slide table 40 and the lifter 50, so as to control the pressure of the probe 60 on the wafer.
The steps of testing a 12-inch wafer by using the wafer tester provided by the utility model are the same as the steps of testing an 8-inch wafer, and are not repeated, but the difference is that in the step 1, the gasket sheet 90 is firstly placed on the first table surface 21 of the carrying disc, then the wafer is slowly placed on the gasket sheet 90 by using a vacuum suction pen, and the vacuum suction pen is removed when the alignment mark position of the wafer is basically observed to be positioned near the infrared sensor 24; in step 2, the rotator 72 pushes the pad sheet 90 and the wafer to rotate upward until the infrared sensor 24 is aligned with the alignment mark of the wafer.
In summary, the utility model provides a wafer tester, in which a carrying disk for placing a wafer to be tested has a first table top and a second table top, and is used in cooperation with a slider, so that the carrying disk can be used for placing two wafers with different sizes, and the utilization rate of the carrying disk is improved; secondly, a camera in the tester acquires a sample image, the position of the center of a circle of the wafer is found through operation, and other test points are found by taking the center of the circle of the wafer as a reference, so that the accuracy of the measurement result is improved; in addition, pressure sensors are uniformly distributed on the surface of the loading disc in the tester, the pressure sensors can feed the pressure of the probe to the wafer back to the controller, and the controller can further adjust the downward pressure of the probe, so that the pressure of the probe to each test point is ensured to be equal, and the wafer is prevented from being broken due to overlarge stress.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the utility model. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (19)
1. A wafer tester, comprising:
a base;
the carrying disc is positioned above the base and comprises a first table top, a second table top and a first groove;
the slider comprises a first table top and a second table top, the slider can be placed in the first groove of the loading disc, the first table top of the slider and the first table top of the loading disc are flush to form a first circular disc, the second table top of the slider and the second table top of the loading disc are flush to form a second circular ring, the first circular disc is embedded in the second circular ring, and the diameter of the first circular disc is equal to the inner diameter of the second circular ring.
2. The wafer tester of claim 1, further comprising a slide table, wherein the slide table comprises a first direction slide table, a second direction slide table and a third direction slide table, wherein the first direction slide table is disposed on the surface of the base, and the second direction slide table and the third direction slide table are located above the base and connected to the base through a column.
3. The wafer tester of claim 2, further comprising a lifter, wherein the lifter is located on the third direction slide table and can move up and down along the third direction slide table.
4. The wafer tester of claim 3, further comprising a probe fixedly mounted on the lifter.
5. The wafer tester of claim 2, further comprising a calibration device positioned below the boat.
6. The wafer tester as claimed in claim 3, wherein the first and second mesas of the susceptor have pressure sensors uniformly distributed thereon.
7. The wafer tester of claim 1, further comprising a pad sheet having a shape and a size identical to those of the first disk, wherein an upper surface of the pad sheet is flush with an upper surface of the second ring when the pad sheet is placed on the surface of the first disk.
8. The wafer tester of claim 4, further comprising a camera positioned above the probe and fixedly mounted on the lifter.
9. The wafer tester of claim 4, further comprising an sheet resistance meter electrically connected to the probe.
10. The wafer tester of claim 6, further comprising a controller communicatively coupled to the pressure sensor, the slide, and the lifter.
11. The wafer tester of claim 4, wherein the probe head is a four-probe head.
12. The wafer tester of claim 1, wherein the first disk has a diameter of 8 inches and the second ring has an outer diameter of 12 inches.
13. The wafer tester as claimed in claim 1, wherein an infrared sensor is provided at each of the edge of the first disk and the edge of the second ring, and the connection line of the infrared sensors passes through the center of the first disk.
14. The wafer tester as claimed in claim 1, wherein the first groove has a strip shape and has a through hole, and the center of the through hole coincides with the center of the first disk.
15. The wafer tester of claim 1, wherein the boat further comprises a second groove, the second groove being located outside the second ring.
16. The wafer tester of claim 1, wherein the slider is a rectangular structure and the length of the slider is greater than the length of the first groove.
17. The wafer tester as claimed in claim 5, wherein a moving member is provided above the first direction slide, and the moving member is capable of moving in a first direction on the first direction slide.
18. The wafer tester of claim 17, wherein the calibration device comprises a lifter fixedly mounted at a middle position on the surface of the moving member and a rotator located above the lifter.
19. The wafer tester as claimed in claim 18, wherein the moving member further has a connecting member formed on a surface thereof, the connecting member being formed on both sides of the lifter, the susceptor being connected to the moving member via the connecting member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121711268.8U CN215644395U (en) | 2021-07-27 | 2021-07-27 | Wafer tester |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121711268.8U CN215644395U (en) | 2021-07-27 | 2021-07-27 | Wafer tester |
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| Publication Number | Publication Date |
|---|---|
| CN215644395U true CN215644395U (en) | 2022-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202121711268.8U Active CN215644395U (en) | 2021-07-27 | 2021-07-27 | Wafer tester |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114487789A (en) * | 2022-04-02 | 2022-05-13 | 浙江清华柔性电子技术研究院 | Wafer detection probe and wafer detection system |
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2021
- 2021-07-27 CN CN202121711268.8U patent/CN215644395U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114487789A (en) * | 2022-04-02 | 2022-05-13 | 浙江清华柔性电子技术研究院 | Wafer detection probe and wafer detection system |
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