CN104181057A - Substrate bending device, substrate bending detection device, and substrate bending detection method - Google Patents
Substrate bending device, substrate bending detection device, and substrate bending detection method Download PDFInfo
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- CN104181057A CN104181057A CN201310399086.5A CN201310399086A CN104181057A CN 104181057 A CN104181057 A CN 104181057A CN 201310399086 A CN201310399086 A CN 201310399086A CN 104181057 A CN104181057 A CN 104181057A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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Abstract
The present invention provides a substrate bending device, a substrate bending detection device, and a substrate bending detection method. The substrate bending device comprises a work bench, at which a through hole is formed; a substrate absorbing disc, for supporting an adjacent surface of a bending object region of the substrate, and going in and out of the workbench through the through hole; a lifting portion, which allows the substrate absorbing disc to move up and down in relative to the workbench; and a covering member, which clings to the workbench tightly in such a way that the covering member covers the substrate, and bens the bending object region by employing the height difference of the substrate absorbing disc and the workbench.
Description
Technical field
The present invention relates to a kind of curved substrate device, curved substrate testing fixture and utilize the curved substrate inspection method of this curved substrate testing fixture.
Background technology
Along with the family expenses such as televisor and display display device, and lightweight and the ultrathin of the portable display apparatus such as notebook computer, mobile phone and PMP, be widely used various panel display apparatus.The panel display apparatus of producing now or develop has liquid crystal indicator (liquid crystal display:LCD), el display device (electro luminescent display:LED), field emission display device (field emission display:FED) plasma display system (plasma display panel:PDP), organic light-emitting display device (Organic Light Emitting Display:OLED) etc.
In recent years, in order to be convenient for carrying information technoloy equipment, and realize various demonstration forms, the flexible flat display device that research and development can be carried or take care of with the bending of curved surface state or coiling cartridge type.
Especially, flexible flat display device, not only, under flat state, also can stably show image, and even if need to possess alternating bending, its shape is ability and the image display capability etc. of resilient state also under curved surface state.
Therefore,, producing in the process of product, need to repeatedly carry out crooked test to flexible base, board, optical characteristics inspection and the visual examination in the line bend region of going forward side by side.
Summary of the invention
Therefore, problem to be solved by this invention is, provides a kind of for the curved substrate device of curved substrate, under the state of curved substrate, checks the curved substrate testing fixture of bending area and utilizes the curved substrate inspection method of this curved substrate testing fixture.
Technical task of the present invention is not limited to above-described technical task, and for NM other technologies problem, those skilled in the art can will clearly understand by following record.
For reaching technical task of the present invention, according to the curved substrate device of one embodiment of the invention, comprising: worktable, is formed with through hole; Substrate sucker, the adjacent surface in the curved object region of supporting substrate, and pass in and out from described worktable by described through hole; Lifting unit, makes described substrate sucker rise or decline with respect to described worktable; And covering member, be close to described worktable to cover the state of described substrate, utilize the bending described curved object of the difference region of the height of described substrate sucker and described worktable.
For reaching described technical task, according to the curved substrate testing fixture of one embodiment of the invention, comprising: worktable; Substrate sucker, outstanding from described worktable, for the adjacent surface in the curved object region of supporting substrate; Covering member, is close to described worktable to cover the state of described substrate, utilizes the difference of height of described substrate sucker and described worktable and bending described curved object region; And image pickup part, for taking described curved object region.
For reaching described technical task, according to the curved substrate inspection method of one embodiment of the invention, comprising: the adjacent surface in the curved object region of substrate is configured in to the step on substrate sucker; On the worktable that holds described substrate sucker, configuration covers the step of the covering member of described substrate; Be close to the step of described covering member and described worktable; And make described substrate sucker increase from described worktable, and described covering member is towards the edge side of the described substrate sucker described curved object region of pressurizeing, thus the step in bending described curved object region.
At least there is following effect according to the present invention.
Can repeatedly carry out crooked test by predetermined external force to the part of substrate, required external force when fine adjusting bending, thereby, can effectively apply minimal STRESS VARIATION to bending regional area.
And, when carrying out the crooked test of substrate, measure the fine brightness variation of bending area etc., fine break etc. that can also check bending area simultaneously.
Effect according to the present invention is not limited to above-described content, comprises in this manual more various effect.
Brief description of the drawings
Fig. 1 is according to the approximate vertical view of the curved substrate device of the first embodiment of the present invention.
Fig. 2 is according to the summary sectional side view of the curved substrate device of the first embodiment of the present invention.
Fig. 3 is the schematic diagram that is configured in the substrate of substrate sucker.
Fig. 4 and Fig. 5 are according to the summary action diagram of the curved substrate device of the first embodiment of the present invention.
Fig. 6 is according to the summary side elevation of the substrate sucker of the first embodiment of the present invention.
Fig. 7 is the summary side elevation of substrate sucker according to other embodiments of the invention.
Fig. 8 is the summary section of curved substrate device according to a second embodiment of the present invention.
Fig. 9 is the approximate vertical view of the curved substrate device of a third embodiment in accordance with the invention.
Figure 10 is the summary section of the curved substrate device of a fourth embodiment in accordance with the invention.
Figure 11 is the summary section of curved substrate device according to a second embodiment of the present invention.
Figure 12 is the block diagram of the photography inspection portion of curved substrate testing fixture according to an embodiment of the invention.
Figure 13 is the precedence diagram of curved substrate inspection method according to an embodiment of the invention.
Figure 14 to Figure 16 utilizes the action schematic diagram of the curved substrate checking process of curved substrate testing fixture according to an embodiment of the invention.
Symbol description: 1,2,3,4: curved substrate device 5: curved substrate testing fixture
10: worktable 11: suction port
12: attract stream 13: fixator
15: through hole 16: holding tank
20,201,202: substrate sucker 30: lifting unit
40: covering member 50: shooting inspection portion
51: image obtaining section
Embodiment
Advantage of the present invention, feature and can will understand clearly by accompanying drawing and embodiment described later for the method for reaching these.But the present invention is not limited to the embodiment of the following stated, can be presented as various form.The present embodiment is for making the present invention more complete, and provides invention category to provide to those skilled in the art in the invention.The present invention only determines by claim scope.In order to clearly state, size and the relative size of composed component in expansible expression accompanying drawing.
Vertical view and sectional view with reference to desirable skeleton diagram of the present invention illustrate the embodiment recording in this instructions.Therefore, can be according to the form of the modified example such as manufacturing technology and/or permissible error figure.And embodiments of the invention are not limited to illustrated specific modality, also comprise the metamorphosis producing because of manufacturing process.So the region shown in figure has the attribute of summary, and the form in the region shown in figure is the specific modality that illustrates the region of element, is not used for limiting category of the present invention.
Fig. 1 is according to the approximate vertical view of the curved substrate device of the first embodiment of the present invention, and Fig. 2 is according to the summary sectional side view of the curved substrate device of the first embodiment of the present invention, and Fig. 3 is the schematic diagram that is configured in the substrate of substrate sucker.
As shown in Figures 1 and 2, curved substrate device 1 according to the present invention comprises: worktable 10, substrate sucker 20, lifting unit 30 and covering member 40.
Worktable 10 is the flat boards for installation base plate S and covering member 40, and covering member 40, for curved substrate S, is formed with in the central authorities of described worktable the through hole 15 that substrate sucker 20 rises and declines.
And worktable 10 can possess the absorbing unit for fixing covering member 40.Absorbing unit, comprising: multiple suction ports 11, are formed on the both sides of through hole 15 with predetermined space; Attract stream 12, be formed on the inner side of worktable 10, and be communicated with multiple suction ports 11.Attract stream 12 be connected and can provide vacuum pressure towards suction port 11 sides with vacuum pump (omitting diagram).
As shown in Figure 3, it is narrow that substrate sucker 20 is formed as amplitude or the length of Amplitude Ratio substrate S above it, part that can supporting substrate S.Below, for convenience of description, substrate S is divided into installation region S1, curved object region S2 and tri-regions of outburst area S3 describe.
Curved object region S2 is the edge that is positioned at substrate sucker 20, and the edge that utilizes substrate sucker 20 carries out bending region, installation region S1 is the region that is arranged in a side of the adjacent surface of curved object region S2, it is the region above that is positioned at substrate sucker 20, outburst area S3 is the region that is arranged in the opposite side of the adjacent surface of curved object region S2, is the region that is positioned at the outside of substrate sucker 20.
As shown in Figure 3, when the curved object region S2 of each substrate S is positioned at the both sides of the edge of substrate sucker 20, region between the S2 of curved object region, both sides may be defined as installation region S1, and the region that is positioned at the opposition side of installation region S1 centered by the S2 of curved object region may be defined as outburst area S3.
On the one hand, substrate sucker 20 is set to pass in and out by through hole 15 top of worktable 10, and the substrate sucker 20 before rising and after declining becomes the state that is contained in through hole 15, makes the upper surface of worktable 10 and the upper surface of substrate sucker 20 be positioned at identical plane.
Lifting unit 30 is formed at the bottom of substrate sucker 20, can comprise for the lifter pin 32 of supporting substrate sucker 20 and the lifting drive 31 that makes lifter pin 32 rise and decline.
Lifting drive 31 makes lifter pin 32 rise and decline, thereby can make substrate sucker 20 pass in and out from worktable 10.And, adjustable height and/or the rising or falling speed of lifting drive 31 lifting controllable pins 32.
Can use the hydraulic cylinder of the variation lifting lifter pin 32 that utilizes hydraulic pressure as lifting drive 31.
Utilize the lifting drive 31 of hydraulic cylinder can control imperceptibly adjustable height and/or the rising or falling speed of lifter pin 32.Thus, various bending environment can be provided, by fine adjustment hydraulic pressure amount, minimal STRESS VARIATION can be effectively induced to curved object region S2.
And, when in the time that bending curved object region S2 applies very strong recuperability, also can, by adjusting hydraulic pressure amount, provide the very strong raising force corresponding to recuperability to substrate sucker 20.
Covering member 40 is the also composed components of curved substrate S that rise along with the rising of substrate sucker 20, and its covering is installed on the substrate S of substrate sucker 20, and can be positioned at above worktable 10.
In the process that the part of covered substrate S of being preferably configured to covering member 40 rises at substrate sucker 20, extend, and decline and in getting back to the process in through hole 15, return to previous status at substrate 20, for this reason, covering member 40 can be made up of the film extending and recover the material that stability is outstanding.
Below, illustrate according to the action of the curved substrate device of the first embodiment of the present invention.Fig. 4 and Fig. 5 are according to the summary action diagram of the curved substrate device of the first embodiment of the present invention.
As shown in Figure 4, substrate sucker 20 can be positioned at through hole 15 so that the upper surface of the upper surface of substrate sucker 20 and worktable 10 is positioned at same plane.Below, be referred to as former (home) position of substrate sucker 20.
The substrate S of curved object be disposed at substrate sucker 20 above.As mentioned above, substrate S can be configured to curved object region S2 and is positioned at the edge of substrate sucker 20, installation region S1 be positioned at substrate sucker 20 above, outburst area S3 is positioned at the outside (with reference to Fig. 3) of substrate sucker 20.
Be configured in configurable covering member 40 above the substrate S on substrate sucker 20.The area of covering member 40 can be corresponding to the area of worktable 10, its covered substrate S above and be formed on the suction port 11 of worktable 10, and can be installed on above worktable 10.
After substrate S and covering member 40 are configured on substrate sucker 20 and worktable 10 successively, can be by being formed at the suction port 11 of worktable 10 and attracting stream 12 to carry out vacuum exhaust.Thus, between covering member 40 and worktable 10, form vacuum pressure, thereby worktable 10 can be close in the both sides of covering member 40 centered by substrate S.
As shown in Figure 5, after covering member 40 is close to and is fixed on worktable 10, lifting drive 31 rises lifter pin 32 and can make substrate sucker 20 increase.
By the rising of substrate sucker 20, between the upper surface of substrate sucker 20 and the upper surface of worktable 10, produce difference in height, the both sides of covering member 40 cover the part of central substrate S and extend along with the rising of substrate sucker 20 under the state of worktable 10 to be close to.
The elastic reactance being produced by the elongation of covering member 40 can pressurize substrate S towards substrate sucker 20 sides.
And, by being close to height poor of the both sides of worktable 10 and the central portion of covered substrate S, covering member 40 is close to the outburst area S3 of substrate S the side of substrate sucker 20, and the edge side pressurization towards substrate sucker 20 by the curved object region S2 of substrate S, thereby can be along curved edge curved object region S2.
Lifting drive 31 makes after lifter pin 32 rises to till the adjustable height of prior input, lifter pin 32 is declined again and substrate sucker 20 is returned to former (home) position.
In the time that substrate sucker 20 returns to original position, as shown in Figure 4, covering member 40 can be returned to and is arranged at first worktable 10 and the average state above substrate S by self elasticity.
Along with covering member 40 returns to A-stage, substrate S also can be by the average state of self spring return above being arranged at first substrate sucker 20.
Then, as shown in Figure 5, lifting drive 31 rises substrate sucker 20 and after the curved object region S2 of curved substrate S again, as shown in Figure 4, make substrate sucker 20 again return to original position and return to average state, by described process repeatedly, can carry out the crooked test to substrate S.
Below, substrate sucker is according to an embodiment of the invention described.
Fig. 6 is according to the summary side elevation of the substrate sucker of one embodiment of the invention.
As shown in Figure 6, can utilize porous sucker according to the substrate sucker 201 of one embodiment of the invention.
Porous sucker is the vacuum cup that utilizes vacuum pressure absorption fixing base, general, utilizes the poriness porous ceramics taking SiC powder as main material to manufacture.Therefore, porous sucker, forms multiple pores on its surface, and the vacuum pressure providing by pore is provided, and can adsorb and be fixedly mounted on surperficial substrate etc.
As the present embodiment, while using poriness porous sucker as substrate sucker 201, the supporting substrate S stably by provide vacuum pressure above substrate sucker 201.
Multiple pores of the side by being formed on substrate sucker 201 also can provide vacuum pressure to side, therefore, in BENDING PROCESS, can the outburst area S3 of the side that is folded to substrate sucker 201 be close to the side of being fixed on substrate sucker 201 by covering member 40.
In BENDING PROCESS, can be simultaneously close to and be fixed on substrate sucker 201 being positioned at the installation region S1 of substrate S above of substrate sucker 201 and the outburst area S3 that is positioned at the substrate S of the side of substrate sucker 201, therefore, the curved object region S2 between installation region S1 and outburst area S3 utilizes the edge of substrate sucker 201 and can more stably keep the state being bent.
According to the substrate sucker 201 of the present embodiment, in order to return to after rising in the process of original position, to make curved object region S2 and outburst area S33 return to the plane identical with installation region S1, and the vacuum pressure providing from surperficial pore can be provided.
Fig. 7 is the summary side elevation of substrate sucker according to other embodiments of the invention.
As shown in Figure 7, be formed as having for the edge above of installation base plate S the curved surface of predetermined curvature according to the substrate sucker 202 of the present embodiment.
Therefore, in the time of curved substrate, curved object region S2 is close to the edge of the substrate sucker 202 with predetermined curvature, and can carry out bending according to the curvature at edge.
And, when curved object region S2 is carried out to crooked test with specific curvature, can utilize the substrate sucker 202 according to the present embodiment.
And, will be formed as the mutually different multiple substrate suckers 202 of curvature according to the substrate sucker 202 of the present embodiment, thus curvature that can change edge, limit, and crooked test is carried out on limit.
For example, when identical substrate S is carried out to initial crooked test, in multiple substrate suckers 202, the substrate sucker 202 at the edge with curvature maximum is arranged on to curved substrate device, then, replace with successively the line bend test of going forward side by side of the substrate sucker 202 with the edge that curvature is little.
By as described in crooked test, can accumulate according to the data of the boundary curvature of the number of bends of substrate S.
Also can use described porous sucker according to the substrate sucker 202 of the present embodiment, now, by installation region S1 and outburst area S3 are close to be respectively fixed on substrate sucker 202 above and side, thereby curved object region S2 can stably keep case of bending by the curvature at edge.
Below, curved substrate device is according to other embodiments of the invention described.
For convenience of description, to marking identical symbol with the similar part of the first embodiment, and omit and the explanation of the common part of the first embodiment.
Fig. 8 is the summary section of curved substrate device according to a second embodiment of the present invention.
As shown in Figure 8, curved substrate device 2 according to the present invention can possess multiple substrate suckers 20.
According in the curved substrate device 2 of the present embodiment, 2 above substrate suckers 20 separate and are arranged in row with predetermined space, or 4 above substrate suckers 20 separate and are arranged in N × M ranks with predetermined space.
On worktable 10, can form multiple through holes 15 with corresponding with multiple substrate suckers 20 with predetermined space.
Covering member 40 can configure one come covered substrate S and worktable 10 before, or to be covered to the size till each substrate sucker 20 vicinity, multiple covering members are configured in respectively each substrate sucker 20.
Lifter pin 32 can possess multiple in order to support each substrate sucker 20, lifting drive 31 is controlled each lifter pin 32 and risen simultaneously or decline, or, can control separately lifting height and/or the ascending velocity of each lifter pin 32.
As shown in Figure 8, can use following mode according to the curved substrate device 2 of the present embodiment, utilize multiple substrate suckers 20 can the multiple substrate S of first order buckling.
Or, can also use following mode according to the curved substrate device 2 of the present embodiment, utilize multiple substrate suckers 20 at substrate S of multiple places first order buckling.
Now, unified lifting height and/or the ascending velocity of controlling each lifter pin 32 of lifting drive 31, thus can carry out with identical form the bending in multiple places.
Or lifting drive 31 is controlled separately the lifting height of each lifter pin 32 and/or ascending velocity and can be carried out with different forms the bending in multiple places.When by the lifting height of substrate sucker 20 and/ascending velocity control is while being different, can cause substrate S distortion.Therefore when, carrying out the crooked test to substrate S, can carry out the distortion test to substrate S.
Fig. 9 is the approximate vertical view of the curved substrate device of the third embodiment of the present invention.
As shown in Figure 9, according to the curved substrate device 3 of the present embodiment, can further comprise fixator 13 in the both sides of worktable 10.
Both sides at worktable 10 can at least possess a pair of fixator 13, thereby, the two ends of covering member 40 can be fixed on to worktable 10.
Covering member 40 is close to worktable 10 by the vacuum pressure providing from the multiple suction ports 11 that are formed on worktable 10, still, in the process rising, the both sides of covering member 40 is applied to the tension force of substrate sucker 20 laybacks at substrate sucker 20.Therefore,, when the vacuum pressure between covering member 40 and worktable 10 is weaker than tension force, in the process that substrate sucker 20 rises, can there is covering member 40 and be pulled to the situation of substrate sucker 20 sides.
According to the curved substrate device 3 of the present embodiment, the two ends of covering member 40 are fixed on to worktable 10 with fixator 13, thereby substrate sucker 20 rises and under state that covering member 40 extends, also covering member 40 more stably can be fixed on to worktable 10.
Figure 10 is the summary section of the curved substrate device of a fourth embodiment in accordance with the invention.
As shown in figure 10, according to the curved substrate device 4 of the present embodiment, can form the holding tank 16 that holds substrate sucker 20 at worktable 10.
The degree of depth of holding tank 16 is corresponding to the height of substrate sucker 20, if substrate sucker 20 is installed in the bottom surface of holding tank 16, the upper surface of substrate sucker 20 can be positioned at the plane identical with the upper surface of worktable 10.
And lifter pin 32 runs through the bottom surface of holding tank 16 and supporting substrate sucker 20, and can make substrate sucker 20 rise and decline from holding tank 16.
According to the curved substrate device 4 of the present embodiment, in the time that substrate sucker 20 is positioned at original position, the bottom supporting substrate sucker 20 of holding tank 16.
Thereby, alleviate the burden that lifter pin 32 and lifting drive 31 continue supporting substrate sucker 20, original position remains predetermined by the bottom surface of holding tank 16, therefore, even if substrate sucker 20 lifting repeatedly, also can make the substrate sucker 20 rising from worktable 10 keep specified altitude.
As mentioned above, curved substrate device according to various embodiments of the present invention, utilizes the edge of substrate sucker 20 repeatedly to concentrate and implement crooked test with identical external force the specific region of curved object region S2.
And, control ascending velocity, lifting height and the raising force etc. of substrate sucker 20 and can cause various bending environment, adjust bending required external force by fine, can only effectively apply minimal STRESS VARIATION to bending area.
Below, curved substrate testing fixture is according to an embodiment of the invention described.
Figure 11 is the summary section of curved substrate testing fixture according to an embodiment of the invention, and Figure 12 is the block diagram of the shooting inspection portion of curved substrate testing fixture according to an embodiment of the invention.
As shown in figure 11, curved substrate testing fixture 5 comprises worktable 10, substrate sucker 20, lifting unit 30, covering member 40 and shooting inspection portion 50 according to an embodiment of the invention.
Utilize described curved substrate device according to the curved substrate testing fixture 5 of the present embodiment, because explanation and the described content of worktable 10, substrate sucker 20, lifting unit 30 and covering member 40 are overlapping, therefore, omit detailed description thereof at this.
As shown in figure 11, can comprise image obtaining section 51, operational part 52 and display part 53 according to the shooting inspection portion 50 of curved substrate testing fixture 15 of the present invention.
Image obtaining section 51 is the composed components of the curved object region S2 for taking substrate S, can comprise CCD(lotus coupled apparatus, Charge Coupled Device) camera and for measuring the nitometer of brightness of curved object region S2.
Image obtaining section 51 is set to the position of the curved object region S2 that points to curved substrate S.For example, as shown in figure 11, be arranged on the top of marginal portion of substrate sucker 20 and directed in orthogonal below, or be arranged on obliquely the top of worktable 11 and point to the position that curved object region S2 is bent.
Image obtaining section 51 is arranged to move to XYZ axle, thereby in the time that moving, the edge of substrate sucker 20 scans and takes curved object region S2, or move and the opposite side edge of sensing substrate sucker 20 after taking the curving subject area S2 being bent at a lateral edges of substrate sucker 20, then, can take the opposite side curved object region S2 being bent at the opposite side edge of substrate sucker 20.
Or image obtaining section 51 can comprise a pair of camera of the both sides of the edge part of pointing to respectively substrate sucker 20.Thereby can obtain the image of the both sides of the curved object region S2 of the both sides of the edge bending by substrate sucker 20 simultaneously.
As shown in figure 12, operational part 52 can comprise image processing department 52a, the 52b of brightness measuring portion, the 52c of visual examination portion and handling part 52d.
Image processing department 52a receives the image of taking from image obtaining section 51, and is processed into the image of easy inspection.
For example, the captured image receiving from image obtaining section 51 is converted to digital picture, or in photographed images, only the separation of images of curved object region S2 is arranged after inspection area, or remove the process because of the noises that occur such as illumination etc.
The 52b of brightness measuring portion measures the brightness of curved object region S2 through the image of processing from image processing department 52a reception.
In the time that substrate S is bent, owing to being formed on the also bending together of circuit diagram of substrate S, therefore, the resistance of circuit becomes the large circuit characteristic that waits and changes, and thus, the brightness meeting of shown image changes.
The brightness that the 52b of brightness measuring portion can measure in the bending of brightness variation before and after curved object region S2 bending and/or curved object region S2 changes.
In order correctly to measure brightness, image obtaining section 51 possesses nitometer, and described nitometer is connected with the 52b of brightness measuring portion, and brightness and the brightness that can measure curved object region S2 change.
In addition, the 52c of visual examination portion receives the image through processing from image processing department 52a, and checks whether defectiveness of curved object region S2.
The breakage that the 52c of visual examination portion can detect on surface in the image of curved object region S2 or inside exists and/or the bad key element that is formed on short circuit and the broken string etc. of the circuit of substrate S.
The 52c of visual examination portion storage, as the reference picture of the benchmark of bad judgement, is compared reference picture and transmits and next image from image processing department 52a, thereby can check the existing bad key element of curved object region S2.
Reference picture is the substrate image that there is no bad key element, can be the image with the S2 same place, curved object region of taking in image obtaining section 51.
In addition, handling part 52d is connected in the 52b of brightness measuring portion and the 52c of visual examination portion, can judge according to mensuration/check result of the 52b of brightness measuring portion and the 52c of visual examination portion whether substrate S is bad.
Handling part 52d analyzes brightness and the brightness variable quantity etc. from bending front and back and/or the bending of the curved object region S2 of the 52b of brightness measuring portion transmission, and can judge whether the brightness of counterpart substrate S and brightness variable quantity remain in normal range.And storage is accumulated data for checking the brightness of substrate S of object and brightness variable quantity, thereby can be according to degree of crook arithmetic average brightness variable quantity.
And the information of existing bad key element, can judge whether counterpart substrate S is bad the curved object region S2 that handling part 52d comes based on transmitting from the 52c of visual examination portion.
The breakage existing in the comprehensive curved object of handling part 52d region S2 whether, the bad key element such as the short circuit of damaged size, circuit/whether break and can judge whether counterpart substrate S is bad.
Display part 53 can be connected in image obtaining section 51 and operational part 52, and can show the information such as the image of curved object region S2 and the brightness of curved object region S2, brightness variable quantity, bad key element.
Particularly, display part 53 can show the image in image, the bending before and after curved object region S2 bending etc., and may be displayed on brightness and brightness variable quantity that under each state, the 52b of brightness measuring portion measures, and the bad key element that outward appearance test section 52c under each state can be detected is presented on the image of curved object region S2.
And display part 53 may be displayed on whether the substrate S that handling part 52d judges is bad information.
Thus, curved substrate testing fixture 5 according to an embodiment of the invention when substrate S is carried out to crooked test repeatedly, can carry out the optical check such as breakage and brightness of curved object region S2 simultaneously.
And, utilize the edge of substrate sucker 20 can repeatedly concentrate and carry out crooked test with identical external force the specific region of curved object region S2, therefore, can guarantee the reliability of crooked test and inspection.
Below, illustrate and utilize the curved substrate inspection method of curved substrate testing fixture according to an embodiment of the invention.
Figure 13 is the precedence diagram of curved substrate inspection method according to an embodiment of the invention, and Figure 14 to Figure 16 utilizes the action diagram of the curved substrate checking process of curved substrate testing fixture according to an embodiment of the invention.
As shown in figure 13, curved substrate inspection method according to an embodiment of the invention, comprising: substrate configuration step (S101); The configuration step (S102) of covering member; The adsorption step (S103) of substrate and covering member; The up step (S104) of substrate sucker; The shooting step (S105) in curved object region; The brightness in curved object region and visual examination step (S106); The decline step (S107, S110) of substrate sucker; Judge step (S108) and the counting step (S109) of alternating bending frequency.
Substrate configuration step (S101) is the step that will carry out the bending subtend substrate S checking and be configured in substrate sucker 20, as shown in figure 14, and can be by the local configuration of substrate S on substrate sucker 20.Now, substrate S can be configured to curved object region S2 and be positioned at the marginal portion of substrate sucker 20, a side in the adjacent surface of curved object region S2 is defined as being disposed at the installation region S1 on substrate sucker 20, and opposite side in the adjacent surface of curved object region S2 can be defined as the outburst area outstanding towards the outside of substrate sucker 20 (Fig. 3).
The configuration step (S102) of the covering member carrying out after substrate configuration step (S101) is the step above that covering member 40 is configured in to covered substrate S, as shown in figure 15, covering member 40 can be configured to its central portion covered substrate S, and the both sides of extending from central portion cover worktable 10.
Covering member 40 can utilize the film that extends and recover the material that stability is outstanding.
The adsorption step (S103) of substrate and covering member is that substrate S is fixed on to substrate sucker 20, and covering member 40 is fixed on to the step of worktable 10, as shown in figure 15, substrate sucker 20, provide attractive force in the above and form vacuum pressure at substrate S with between above substrate sucker 20, thereby substrate S can be fixed on to substrate sucker 20, worktable 10 provides attractive force in the above and forms vacuum pressure in the both sides of covering member 40 with between above worktable 10, thereby covering member 40 is fixed on to worktable 10.
The up step (S104) of substrate sucker is the step of curved substrate S by the rising of substrate sucker 20, as shown in figure 16, lifting drive 31 rises the lifter pin 32 of supporting substrate sucker 20, thus can be between the upper surface of substrate sucker 20 and the upper surface of worktable 10 height of formation poor.
The installation region S1 of substrate S is supported on substrate sucker 20 and rises, and under the state on worktable 10 is close in the both sides of covering member 40, the central portion of covered substrate S rises by substrate sucker 20.
By being close to the difference in height of the both sides of worktable 10 and the central portion of covered substrate S, covering member 40 is close to the outburst area S3 of substrate S towards the side of substrate sucker 20, towards the curved object region S2 of the edge side pressurization substrate S of substrate sucker 20, thereby, can be along curved edge curved object region S2.
Also, while providing absorption affinity to the side of substrate sucker 20, because the outburst area S3 of the substrate S that knows the side of being close to substrate sucker 20 is also fixed on substrate sucker 20, therefore curved object region S2 can stably keep case of bending.
Lifting drive 31 is controlled ascending velocity and the height of lifter pin 32, and various bending environment can be provided.
In the shooting step (S105) in curved object region, as shown in Figure 14 to 16, point to the image obtaining section 51 of the marginal portion of substrate sucker 20 and can take curved object region S2.
Image obtaining section 51 can comprise CCD camera for taking curved object region S2 and for measuring the nitometer of brightness of curved object region S2.
CCD camera can make a video recording bending before and after and the image of curved object region S2 in bending, nitometer also can measure bending before and after and the brightness of curved object region S2 in bending.
Image obtaining section 51 is arranged to move to XYZ axle, thereby in the time that moving, the edge of substrate sucker 20 scans and takes curved object region S2, or move and the opposite side edge of sensing substrate sucker 20 after taking the curving subject area S2 being bent at a lateral edges of substrate sucker 20, then, can take the opposite side curved object region S2 being bent at the opposite side edge of substrate sucker 20.
Or image obtaining section 51 possesses a pair of camera of the both sides of the edge part of pointing to respectively substrate sucker 20, thereby can obtain the both sides image of the curved object region S2 of the both sides of the edge bending by substrate sucker 20 simultaneously.
In the brightness and visual examination step (S106) in curved object region, image and the monochrome information of the curved object region S2 that operational part 52 manuscripts are made a video recording and measured as obtaining section 51, and the information of processing can be shown by display part 53.
Operational part 52 can comprise image processing department 52a, the 52b of brightness measuring portion, the 52c of visual examination portion and handling part 52d.
The photographed images receiving from image obtaining section 51 is converted to digital picture by image processing department 52a, or only the separation of images of curved object region S2 is arranged after inspection area in photographed images, or remove the process because of the noises that occur such as illumination etc., thereby receive the photographed images of making a video recording from image obtaining section 51, and be processed into the image of easy inspection.
The 52b of brightness measuring portion receives the monochrome information of measuring from the image of image processing department 52a processing or the nitometer of image obtaining section 51, and the brightness that can measure in the bending of brightness variation before and after curved object region S2 bending and/or curved object region S2 changes.
The 52c of visual examination portion receives the image through processing from image processing device 52a, and can detect surface or inner existing breakage and/or be formed on the bad key element of short circuit and the broken string etc. of the circuit of substrate S at the image of curved object region S2.
Mensuration/check result of the comprehensive brightness measuring 52b of portion of handling part 52d and the 52c of visual examination portion and can judge whether substrate S is bad.
; handling part 52d analyzes brightness and the brightness variable quantity etc. from bending front and back and/or the bending of the curved object region S2 of the 52b of brightness measuring portion reception; and can judge whether the brightness of counterpart substrate S and brightness variable quantity remain in normal range, the breakage existing in comprehensive curved object region S2 whether, the bad key element such as the short circuit of damaged size, circuit/whether break and can judge whether counterpart substrate S is bad.
Display part 53 can show image and the brightness of the curved object region S2 that image obtaining section 51 makes a video recording, and can show the information such as the brightness, brightness variable quantity, bad key element of image, the curved object region S2 of the curved object region S2 processing by operational part 52.
Particularly, display part 53 can show the image in image, the bending before and after curved object region S2 bending etc., and may be displayed on brightness and brightness variable quantity that under each state, the 52b of brightness measuring portion measures, and the bad key element that outward appearance test section 52c under each state can be detected is presented on the image of curved object region S2.
And display part 53 may be displayed on whether the substrate S that handling part 52d judges is bad information.
In substrate sucker decline step (S107, S110), make the substrate sucker 20 rising drop to original position, thereby remove the case of bending of substrate S.
In the time that lifting drive 31 declines lifter pin 32 and substrate sucker 20 is returned to original position, covering member 40 and substrate S are returned to and are arranged at first worktable 10 or the average state above substrate S by self elasticity.
Then, judge the step of alternating bending frequency (S108), can compare the lifting number of times of substrate sucker 20 and the alternating bending frequency setting.
The lifting number of times of substrate sucker 20 is corresponding to the number of bends of substrate S, when the lifting number of times of substrate sucker 20 does not reach the alternating bending frequency of having set, make substrate sucker 20 again increase and repeatedly carry out brightness and visual examination step (S106) and the substrate sucker decline step (S107) in described substrate sucker up step (S104), curved object region shooting step (S105), curved object region.
Counting step (S109) is to calculate the step of the number of bends of substrate S, initial N value is set as to 1, the step (S108) of the judgement alternating bending frequency after initial curved substrate S, do not reach if be judged as N value the alternating bending frequency of having set, each N value increase by 1 is calculated to the number of bends of substrate S.
After alternating bending substrate S, if N value reaches the alternating bending frequency of having set, final substrate sucker 20 declines (S110), and finishes curved substrate inspection.
Thus, curved substrate inspection method according to an embodiment of the invention when substrate S is carried out to crooked test repeatedly, can be carried out the optical check of breakage and the brightness etc. of curved object region S2 simultaneously.
And, utilize the edge of substrate sucker 20, the specific region of curved object region S2 is repeatedly concentrated and carried out crooked test by identical external force, thereby can guarantee the reliability of crooked test and inspection.
Above, though with reference to the accompanying drawings of embodiments of the invention, but, the present invention is not limited to described embodiment, can be fabricated to different forms, those skilled in the art in the invention should understand the concrete form that may be embodied as other in the situation that not changing technological thought of the present invention or essential feature.Therefore, above-described embodiment is used for illustrating in all respects, does not limit the present invention.
Claims (20)
1. a curved substrate device, is characterized in that, comprising:
Worktable, is formed with through hole;
Substrate sucker, the adjacent surface in the curved object region of supporting substrate, and pass in and out from described worktable by described through hole;
Lifting unit, makes described substrate sucker rise or decline with respect to described worktable; And
Covering member, is close to described worktable to cover the state of described substrate, utilizes the bending described curved object of the difference region of the height of described substrate sucker and described worktable.
2. curved substrate device according to claim 1, is characterized in that, described worktable comprises to the suction unit that vacuum pressure is provided between described covering member and described worktable, so that described covering member is close to described worktable.
3. curved substrate device according to claim 1, is characterized in that, described worktable comprises at least one pair of fixator for the both sides of fixing described covering member.
4. curved substrate device according to claim 1, is characterized in that, further comprises the image pickup part for taking described curved object region.
5. curved substrate device according to claim 4, is characterized in that, described image pickup part comprises the brightness measuring portion of the brightness for measuring described curved object region.
6. curved substrate device according to claim 4, is characterized in that, described image pickup part comprises the visual examination portion of the outward appearance for checking described curved object region.
7. curved substrate device according to claim 1, it is characterized in that, described substrate sucker is the porous sucker of substrate described in vacuum suction, the one side adjacent surface vacuum suction in described curved object region is above described porous sucker, and the opposite side adjacent surface vacuum suction in described curved object region is in the side of described porous sucker.
8. curved substrate device according to claim 7, it is characterized in that, described porous sucker, possesses the curved surface with predetermined bend radius on described and between described side, so that described curved object region is to keep the state bending of described predetermined bend radius.
9. a curved substrate testing fixture, is characterized in that, comprising:
Worktable;
Substrate sucker, outstanding from described worktable, for the adjacent surface in the curved object region of supporting substrate;
Covering member, is close to described worktable to cover the state of described substrate, utilizes the difference of height of described substrate sucker and described worktable and bending described curved object region; And
Shooting inspection portion, for taking described curved object region.
10. curved substrate testing fixture according to claim 9, is characterized in that, described shooting inspection portion comprises the brightness measuring portion of the brightness for measuring described curved object region.
11. curved substrate testing fixtures according to claim 9, is characterized in that, described shooting inspection portion comprises the visual examination portion of the outward appearance for checking described curved object region.
12. curved substrate testing fixtures according to claim 9, is characterized in that, further comprise the lifting unit for substrate sucker described in lifting, so that described substrate sucker is projected into the top of described worktable.
13. curved substrate testing fixtures according to claim 9, is characterized in that, described worktable comprises to the suction unit that vacuum pressure is provided between described covering member and described worktable, so that described covering member is close to described worktable.
14. curved substrate testing fixtures according to claim 9, is characterized in that, described worktable comprises at least one pair of fixator for the both sides of fixing described covering member.
15. curved substrate testing fixtures according to claim 9, it is characterized in that, described substrate sucker is the porous sucker of substrate described in vacuum suction, the one side adjacent surface vacuum suction in described curved object region is above described porous sucker, and the opposite side adjacent surface vacuum suction in described curved object region is in the side of described porous sucker.
16. curved substrate testing fixtures according to claim 15, it is characterized in that, described porous sucker, possesses the curved surface with predetermined bend radius on described and between described side, so that described curved object region is to keep the state bending of described predetermined bend radius.
17. 1 kinds of curved substrate inspection methods, is characterized in that, comprising:
The adjacent surface in the curved object region of substrate is configured in to the step on substrate sucker;
On the worktable that holds described substrate sucker, configuration covers the step of the covering member of described substrate;
Be close to the step of described covering member and described worktable; And
Make described substrate sucker increase from described worktable, described covering member is towards the edge side of the described substrate sucker described curved object region of pressurizeing, thus the step in bending described curved object region.
18. curved substrate inspection methods according to claim 17, it is characterized in that, further comprise and will be configured in the described adjacent surface on described substrate sucker and be adsorbed on the step of described substrate sucker towards the pressurized described curved object region of the edge side of described substrate sucker.
19. curved substrate inspection methods according to claim 17, is characterized in that, further comprise the step of measuring towards the brightness in the pressurized described curved object region of the edge side of described substrate sucker.
20. curved substrate inspection methods according to claim 17, is characterized in that, further comprise the step checking towards the outward appearance in the pressurized described curved object region of the edge side of described substrate sucker.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0060422 | 2013-05-28 | ||
| KR1020130060422A KR102072061B1 (en) | 2013-05-28 | 2013-05-28 | Apparatus for bending substrate, apparatus and method for inspecting bended substrate |
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| Publication Number | Publication Date |
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| CN104181057A true CN104181057A (en) | 2014-12-03 |
| CN104181057B CN104181057B (en) | 2018-12-11 |
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| CN201310399086.5A Active CN104181057B (en) | 2013-05-28 | 2013-09-05 | Substrate bending apparatus, substrate bending check device and substrate are bent inspection method |
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| Country | Link |
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| KR (1) | KR102072061B1 (en) |
| CN (1) | CN104181057B (en) |
| TW (1) | TWI615603B (en) |
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| CN105807212A (en) * | 2016-05-26 | 2016-07-27 | 深圳市华星光电技术有限公司 | Device and method for testing circuit boards |
| CN107036525A (en) * | 2017-05-23 | 2017-08-11 | 京东方科技集团股份有限公司 | Flexible screen bending detection device and method, flexible screen |
| CN107162399A (en) * | 2017-07-19 | 2017-09-15 | 安徽云融信息技术有限公司 | A kind of glass processing system and processing method |
| CN108492718A (en) * | 2014-03-28 | 2018-09-04 | 乐金显示有限公司 | Display device and the bending apparatus for manufacturing the device |
| CN109326217A (en) * | 2017-07-31 | 2019-02-12 | 亚威科股份有限公司 | Flexible base board bending apparatus |
| CN109983321A (en) * | 2016-11-25 | 2019-07-05 | Ａｇｃ株式会社 | Substrate evaluation method and curved glass evaluating apparatus |
| CN110864969A (en) * | 2019-11-29 | 2020-03-06 | 昆山国显光电有限公司 | Bending stiffness testing method and device and testing method of display panel |
| CN112485109A (en) * | 2020-11-06 | 2021-03-12 | 昆山国显光电有限公司 | Testing device and system for display panel |
| CN112504823A (en) * | 2021-02-04 | 2021-03-16 | 浙江荷清柔性电子技术有限公司 | Flexible chip bending capability testing device, testing method and flexible carrier |
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| CN109326217A (en) * | 2017-07-31 | 2019-02-12 | 亚威科股份有限公司 | Flexible base board bending apparatus |
| CN110864969A (en) * | 2019-11-29 | 2020-03-06 | 昆山国显光电有限公司 | Bending stiffness testing method and device and testing method of display panel |
| CN112485109A (en) * | 2020-11-06 | 2021-03-12 | 昆山国显光电有限公司 | Testing device and system for display panel |
| CN112504823A (en) * | 2021-02-04 | 2021-03-16 | 浙江荷清柔性电子技术有限公司 | Flexible chip bending capability testing device, testing method and flexible carrier |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102072061B1 (en) | 2020-02-03 |
| TWI615603B (en) | 2018-02-21 |
| KR20140139825A (en) | 2014-12-08 |
| TW201445122A (en) | 2014-12-01 |
| CN104181057B (en) | 2018-12-11 |
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