CN101726442A - In situ evaluation system and method of reliability of thin-film materials on flexible electronic substrate - Google Patents
In situ evaluation system and method of reliability of thin-film materials on flexible electronic substrate Download PDFInfo
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Abstract
The invention relates to establishment for a test device and a test method for the bending fracture performance of thin-film materials, in particular to an in situ evaluation system and a method of the mechanical reliability of a layer or a plurality of layers of thin-film materials with the micron to nanometer thickness on a flexible electronic substrate. The system comprises a high-precision micrometer caliper, a balance spring, a translational slide block, a freely supported beam fixed end, a freely supported beam movable end, and the like, wherein a composite beam comprising the micrometer caliper and a flexible substrate exerts precise and controllable step displacement to implement freely supported beam bending experiments; real-time exerted strain corresponding to a freely supported beam span is computed according to parameters and geometrical relationship of the freely supported beam span, sample sizes, and the like; and the bending fracture performance and critical cracking strain of the kind of thin film are tested and evaluated by combining in situ microscopic observation and subsequent scanning electron microscope characterization. The invention does not need to consider the electroconductibility of the thin-film materials, and is still adaptable for non-conductive thin-film materials. The experiment operation is simple and fast, in situ real-time positioning observation and analysis can be carried out on samples.
Description
Technical field
The present invention relates to foundation to various membraneous material bend fracture performance testing devices and method of testing, be specially a kind of reliability of thin-film materials on flexible electronic substrate original position evaluation system and method, be specially adapted to preparation on flexible electronic substrate, have an evaluation of fracture property of the single or multiple lift membraneous material of micron, sub-micron and nano thickness.
Background technology
Flexible electronic device is with a wide range of applications, as the LCD that can curl, and the flexible solar battery panel, and Electronic Paper etc.Attached to the individual layer and the multilayered film material that have micron, sub-micron and nano thickness on the flexible substrate medium, be widely used in the wiring of circuit interconnection body and restraining barrier in the above-mentioned device.Load such as above-mentioned device often bears bending, stretches or reverses in actual military service process, so the mechanical property of membraneous material usually is the above-mentioned device dependability of influence and the key factor in life-span in the device.Critical Cracking strain in the film during crack initiation is one of important parameter of above-mentioned device reliability design, simultaneously also be the important parameter that calculates the membraneous material fracture toughness, and the reflection of fracture toughness value is membraneous material opposing crackle unstable propagation and the ability of the brittle fracture of causing danger.Therefore, the Critical Cracking strain when testing crack initiation in the above-mentioned membraneous material all has great importance to the theoretical research of the reliability design in the practical application of membraneous material device, failure analysis and thin film material mechanics performance characterization.
At present, people adopt the cracking strain of resistance measurement membraneous material more.Electric-resistivity method is applicable to the membraneous material with electric conductivity, by membraneous material is applied tensile load, the monitoring sheet resistance is with the variation that applies tensile strain, resistance when obtaining to crack in the film is the do not ftracture intersection point of resistance linear change section of the section of increasing and film sharply, the counter Critical Cracking strain of releasing film.Yet, this method is in the resistance process of the measurement sub-micron especially membraneous material of nanometer scale thickness, because problems such as electrode contact can influence the measurement result precision usually, and the randomness of resistance sharp increase section linear fit is bigger, and the anti-thus membraneous material cracking strain error of releasing is bigger; In addition, can not be suitable for for nonconductor membraneous material electric-resistivity method.
Summary of the invention
The object of the present invention is to provide a kind of single or multiple lift reliability of thin-film materials original position evaluation system and the method for micron that have on the flexible electronic substrate accurately, simply, efficiently to nano thickness, critical strain when this in-situ test system and method for testing characterize membraneous material damage germinating, it is bigger to solve the membraneous material cracking strain error that exists in the prior art, and for problems such as nonconductor membraneous material electric-resistivity method can not be suitable for.Because the membraneous material practical work process suffers the frequency of bending load effect will be more than suffering other load, and this method of testing to load that sample is executed is and the corresponding to bending load of membraneous material actual condition, has advantages such as specimen preparation is easy, measuring accuracy is higher, quick simultaneously.
Technical scheme of the present invention is:
This original position evaluation system is made up of loading section, sample support part and observation and measure portion three parts, and is specific as follows:
(1) sample support part, comprise the free beam movable end, the free beam stiff end, pedestal and fixed block, the pedestal inboard is relatively set with the translation slide block, fixed block, fixed block is fixedlyed connected with pedestal, translation slide block and pedestal are and are slidingly connected, the free beam movable end is installed on the translation slide block, the free beam stiff end is installed on the translation slide block and is relatively fixed on the piece, corresponding with the free beam movable end that the translation slide block links to each other with the free beam stiff end that links to each other with fixed block, between free beam movable end and the free beam stiff end sample is installed, one end of sample is placed on the free beam stiff end that links to each other with pedestal, and the other end of sample places the free beam movable end;
(2) sample loading section comprises micrometer caliper, balancing spring, translation slide block, back-up roller, and micrometer caliper is connected by the inboard translation slide block that is provided with of back-up roller and pedestal, and the translation slide block is connected with pedestal by balancing spring;
(3) measure and the observation part, comprise Powerful Light Microscope and the computing machine that is attached thereto, Powerful Light Microscope is corresponding with sample.
2, reliability of thin-film materials on flexible electronic substrate original position evaluation method of the present invention is utilized above-mentioned test macro, and concrete steps are as follows: (1) is according to sample original length L
0Regulate the spacing between free beam stiff end and the free beam movable end, the high-precision spiral mircrometer gauge applies the step-wise displacement that precision is 1 μ m by back-up roller with the two balancing springs pair translation slide block that links to each other with the free beam movable end, drive the free beam movable end and move, apply bending load to sample.(2) according to free beam span L, sample original length L
0, draw the relational expression between each parameter and the free beam radius of curvature R:
The free beam span is less than a certain critical value 2L
0During/π, the free beam radius-of-curvature equals L/2; , calculate and the corresponding size that applies strain stress in real time of free beam span in conjunction with the composite beam theory by the free beam radius-of-curvature:
Wherein, η is the thickness ratio of film and matrix material, and χ is the modular ratio of film and matrix material, d
fAnd d
sBe respectively the thickness of film and matrix; (3) Powerful Light Microscope is carried out the original position Real Time Observation and is shot with video-corder picture specimen surface pattern and surface crack evolutionary process, the overall process of evolution takes place by CCD probe real time record specimen surface, and with the real-time sample evolutionary process digital picture of gathering of Powerful Light Microscope, by computer realization Flame Image Process and quantification calculating and analysis fast.By measuring the specimen surface crack density, draw crack density and apply strain relation, the strain value that correspondence applies when adopting anti-pushing manipulation to obtain crack density to be zero is with the Critical Cracking strain that is this membraneous material of this dependent variable value defined.
Membraneous material of the present invention is various at present known physics and the single or multiple lift membraneous material with micron, sub-micron or nano thickness of chemical technology preparation on flexible electronic substrate.
Tested membraneous material of the present invention has electric conductivity or dielectric membraneous material for preparation on flexible electronic substrate.
Characteristics of the present invention are:
1, the present invention applies more bending load near the membraneous material actual condition to sample.
2, measuring accuracy is higher.Method of testing of the present invention broken away from electric-resistivity method for little, nano thickness thin film owing to contact problems can't solve the indeterminable drawback of the resistance value that causes, by the high-precision spiral mircrometer gauge sample is applied the step-wise displacement of bending load, can improve measuring accuracy.
3, the present invention need not to consider the electric conductivity of membraneous material, all can adopt this method to test for conduction and non-conductive film material.
4, specimen preparation is easy.For the single or multiple lift membraneous material of preparation on flexible base, board, the present invention can be processed into the sample yardstick that has in the test macro permission range of size and just can test.
5, equipment is simple, applied range.The present invention does not need special mechanical property experimental machine can realize on the flexible base, board film sample being applied bending load, can estimate different derogatory behaviours and the Critical Cracking strain value thereof of membraneous material under stretching strain that bending load causes and compressive strain effect.
6, can fix a point to sample, location, real-time monitored and analysis.Can carry out fine motion in two dimensional surface to sample in the experimentation of the present invention regulates, convenient to a certain point of fixity of sample fix a point, position observation, the Powerful Light Microscope by placing the sample top can be carried out real-time in-situ to sample surfaces pattern and surface crack evolutionary process and be observed and analyze.
7, the present invention can carry out Flame Image Process and quantification calculating and analysis fast by computing machine for the digital picture of the real-time evolutionary process of sample of Powerful Light Microscope collection.
Description of drawings
Fig. 1 is the principle schematic of flexible base, board upper film reliability of material evaluation system.
Among the figure, 1 micrometer caliper; 2 balancing springs; 3 translation slide blocks; 4 back-up roller; 5 free beam movable end; 6 samples; 7 free beam stiff ends; 8 pedestals; 9 optical microscopes; 10 computing machines; 11 fixed blocks.
Fig. 2 is free beam span and a free beam radius-of-curvature graph of a relation in the forward crooked experiment (sample tensile strain); (a) be the preceding sample of bending test; (b) be the positive curve sample; (c) be the contraflexure sample.Wherein, 12 films; 13 matrixes; 14 neutral surfaces; 15 freely-supporteds point.
Fig. 3 is the light micrograph that Cu-Ni multilayer film sample develops at this original position evaluation system upper film surface crack on the 125 μ m thick polyimide matrixes.Wherein (a) and (b) be respectively that to apply strain be 0.39% and the optical microphotograph picture of 0.70% o'clock specimen surface pattern.
Fig. 4 is the thick Cu-Ni multilayer film of 1 a μ m crack density and the relation curve that applies strain on the 125 μ m thick polyimide matrixes.The corresponding Critical Cracking strain of the point of arrow indication.
Fig. 5 is the light micrograph of surface damage when the thick Cu-Ta multilayer film of 1 μ m sample bears compressive strain on this test macro upper film surface on the 125 μ m thick polyimide matrixes.
Embodiment
Below in conjunction with drawings and Examples in detail the present invention is described in detail.
As shown in Figure 1, this original position evaluation system is made up of three parts: (1) loading section; (2) sample support part; (3) observation and measure portion.
1, sample support part comprises free beam movable end 5, free beam stiff end 7, pedestal 8 and fixed block 11 etc., is responsible for fixing and the support sample.Pedestal 8 inboards are relatively set with translation slide block 3, fixed block 11, fixed block 11 is fixedlyed connected with pedestal 8, translation slide block 3 is with pedestal 8 and is slidingly connected, free beam movable end 5 is installed on the translation slide block 3, free beam stiff end 7 is installed on translation slide block 3 and is relatively fixed on the piece 11, corresponding with the free beam movable end 5 that translation slide block 3 links to each other with the free beam stiff end 7 that links to each other with fixed block 11, sample 6 is installed between free beam movable end 5 and the free beam stiff end 7, one end of sample 6 is placed on the free beam stiff end 7 that links to each other with pedestal, and the other end of sample 6 places free beam movable end 5.
When sample 6 is installed, at first free beam movable end 5 and freely-supported stiff end 7 spacings are adjusted to the suitable distance place according to specimen length, then sample 6 is positioned over the freely-supported point between free beam movable end 5 and the free beam stiff end 7, makes sample parallel, form a free beam sample with the loading axle.Drive 3 motions of translation slide block by high-precision spiral mircrometer gauge 1 and balancing spring 2, drive sample and carry out tangential movement, thereby sample is applied constant strain along free beam movable end 5.
2, sample loading section comprises micrometer caliper 1, balancing spring 2, translation slide block 3, back-up roller 4 etc., is responsible for applying bending load to sample.Micrometer caliper 1 is connected with the pedestal 8 inboard translation slide blocks 3 that are provided with by back-up roller 4, and translation slide block 3 is connected with pedestal 8 by two balancing springs 2; High-precision spiral mircrometer gauge 1 applies the step-wise displacement that precision is 1 μ m by 2 pairs of translation slide blocks 3 that link to each other with free beam movable end 5 of back-up roller 4 and two balancing springs, drives free beam movable end 5 and moves, and applies bending load for sample 6.
3, measurement and observation part comprise and Powerful Light Microscope 9 and the computing machine 10 that is attached thereto.Powerful Light Microscope 9 is corresponding with sample 6, Powerful Light Microscope 9 can be carried out the real-time in-situ Real Time Observation and shoot with video-corder picture specimen surface pattern and surface crack evolutionary process, the overall process that develops can the real time record specimen surface takes place by CCD probe, and, realize Flame Image Process and quantification calculating and analysis fast by computing machine 10 with the sample evolutionary process digital picture that Powerful Light Microscope is gathered in real time.
Shown in Fig. 2 it (a), the sample before the bending test is the film 12 of matrix 13 surface attachment single or multiple lifts, L
0Be the sample original length; d
fAnd d
sBe respectively the thickness of film 12 and matrix 13, L is the free beam span, and R is the radius-of-curvature of sample neutral surface 14 when bending.
Wherein, neutral surface is meant the null plane of strain, and according to beam pure bending theory, under the forward case of bending, the above material of neutral surface bears tension; Under the back-flexing state, the above material of neutral surface bears compressive stress.
Flexible base, board upper film reliability of material evaluation method of the present invention is utilized above-mentioned test macro, and concrete steps are as follows:
(1) according to sample original length (L
0) regulate the spacing between free beam stiff end 7 and the free beam movable end 5;
(2) promote free beam movable end 5 by high-precision spiral mircrometer gauge 1 and balancing spring 2, move horizontally along movable end thereby drive sample 6;
(3) according to free beam span (L), sample original length (L
0) etc. parameter, and, draw the relational expression (1) between each parameter and the free beam radius-of-curvature (R) in conjunction with geometric relationship shown in Figure 2:
(4) when the free beam span less than a certain critical value (2L
0/ π) time, the free beam radius-of-curvature equals L/2;
(5) can calculate and the corresponding size that applies strain stress in real time of free beam span in conjunction with the composite beam theory by the free beam radius-of-curvature:
Wherein, η is the thickness ratio of film and matrix material, and χ is the modular ratio of film and matrix material, d
fAnd d
sBe respectively the thickness of film and matrix;
(6) adopt Powerful Light Microscope that tested film surface appearance is carried out Real Time Observation and shoots with video-corder picture;
(7) by measuring the specimen surface crack density, draw crack density and apply strain relation, adopt anti-pushing manipulation obtain crack density by zero the time the strain value that applies of correspondence, with the Critical Cracking strain that is this membraneous material of this dependent variable value defined.
Anti-pushing manipulation is specially: crack density (ρ) and apply between the strain (ε) the approximate exponential increasing relation that satisfies:
Wherein, ρ
0Be saturated crack density, A and ε
0Be fitting constant.
At first, through type (3) to the crack density of experiment measuring with apply strain curve and carry out match, obtain fitting constant A and ε
0Numerical value makes following formula crack density ρ=0 then, and the strain value when calculating corresponding crack density and be zero according to known parameters is defined as this strain the Critical Cracking strain of film.
The membraneous material that the present invention tested is for preparing the film on flexible electronic substrate by technology such as various physics and chemistry.
The schematic diagram of original position evaluation system of the present invention as shown in Figure 1.
Adopting magnetically controlled sputter method is that the preparation gross thickness is the Cu-Ni multilayer film that 1 μ m, thickness in monolayer are 50nm on the polyimide matrix of 125 μ m at thickness.Sample is cut into the rectangle that is of a size of 12mm * 2mm.At first the free beam movable end and the free beam stiff end spacing of test macro is adjusted to the suitable distance place that is complementary with specimen size according to the sample original length.According to the laying state shown in Fig. 2 it (b), sample is positioned on the freely-supported point 15, drive the 3 occurred level fine motions of translation slide block by micrometer caliper 1 and balancing spring 2, positive curve takes place in sample 6, thereby the Cu-Ni multilayer film on the polyimide matrix is applied constant stretching strain.Record freely-supported dot spacing, and gather the image of specimen surface morphology change this moment by Powerful Light Microscope and CCD probe simultaneously.Keep continuing after 30 seconds to load, and record freely-supported dot spacing and the corresponding feature image of specimen surface constantly.Specimen surface pattern optical imagery is observed and is shown that with the increase that applies strain, the specimen surface crack spacing reduces gradually, and new crackle is easy to germinating and expansion between established crackle.Shown in Fig. 3 it (a), applying strain is 0.39% o'clock, and the crack spacing of crackle 1～3 is bigger; Shown in Fig. 3 it (b), apply strain and be increased at 0.70% o'clock, crackle 5 and crackle 6 germinate respectively between crackle 1～2 and crackle 2～3.After applying strain and surpassing 1.54%, crack density no longer increases, the value of reaching capacity.Crack density and the relation curve that applies strain are as shown in Figure 4.According to crack density with apply strain curve, anti-when being pushed into crack density and being zero, promptly the critical strain values during crack initiation is 0.3%.
Adopting magnetically controlled sputter method is that the preparation gross thickness is the Cu-Ta multilayer film that 1 μ m, thickness in monolayer are 50nm on the polyimide matrix of 125 μ m at thickness.Sample is cut into the rectangle that is of a size of 12mm * 2mm.At first the free beam movable end and the free beam stiff end spacing of test macro is adjusted to the suitable distance place according to the sample original length, shown in Fig. 2 it (c), this laying state is positioned over sample on the freely-supported point, drive 3 tangential movements of translation slide block by micrometer caliper 1 and balancing spring 2, contraflexure takes place in sample 6, thereby the Cu-Ta multilayer film on the polyimide matrix is applied constant compressive strain.Record freely-supported dot spacing L, and gather the image of specimen surface pattern at this moment by Powerful Light Microscope and CCD probe simultaneously.Keep continuing after 30 seconds to load, and record freely-supported dot spacing and corresponding specimen surface feature image constantly.Specimen surface pattern optical imagery is observed and is shown, will produce warping phenomenon when the Cu-Ta multilayer film bear compressive strain, shown in arrow among Fig. 5.Warpage spacing and warpage width are respectively 93 ± 26 μ m and 27 ± 4 μ m.According to film surface appearance is analyzed with applying the strain evolutionary process, the critical strain values during this Cu-Ta multilayer film generation warpage is 0.5%.
Embodiment result shows, the composite beam that the present invention forms to film and flexible substrate by micrometer caliper applies accurately controlled step-wise displacement and carries out the free beam crooked experiment, according to parameter and geometric relationships such as free beam span and specimen sizes, calculate corresponding with the free beam span strain value that applies in real time, characterize in conjunction with the microscopic observation of original position and scanning electron microscope subsequently, and by measuring the specimen surface crack density, draw crack density and apply strain relation, adopt anti-pushing manipulation obtain crack density by zero the time the Critical Cracking strain value that applies of correspondence, estimate different derogatory behaviours and the Critical Cracking strain value thereof of membraneous material under stretching strain that positive curve that takes place under the bending load effect and contraflexure cause respectively and compressive strain effect, membraneous material bend fracture performance is estimated; The present invention need not to consider the electric conductivity of membraneous material, the experimental implementation simple and fast, and can carry out original position fixed point, location, real-time monitored and analysis to sample.
Claims (8)
1. a reliability of thin-film materials on flexible electronic substrate original position evaluation system is characterized in that, this original position evaluation system is made up of loading section, sample support part and observation and measure portion three parts, and is specific as follows:
(1) sample support part, comprise the free beam movable end, the free beam stiff end, pedestal and fixed block, the pedestal inboard is relatively set with the translation slide block, fixed block, fixed block is fixedlyed connected with pedestal, translation slide block and pedestal are and are slidingly connected, the free beam movable end is installed on the translation slide block, the free beam stiff end is installed on the translation slide block and is relatively fixed on the piece, corresponding with the free beam movable end that the translation slide block links to each other with the free beam stiff end that links to each other with fixed block, between free beam movable end and the free beam stiff end sample is installed, one end of sample is placed on the free beam stiff end that links to each other with pedestal, and the other end of sample places the free beam movable end;
(2) sample loading section comprises micrometer caliper, balancing spring, translation slide block, back-up roller, and micrometer caliper is connected by the inboard translation slide block that is provided with of back-up roller and pedestal, and the translation slide block is connected with pedestal by balancing spring;
(3) measure and the observation part, comprise Powerful Light Microscope and the computing machine that is attached thereto, Powerful Light Microscope is corresponding with sample.
2. according to the described reliability of thin-film materials on flexible electronic substrate original position of claim 1 evaluation system, it is characterized in that, the high-precision spiral mircrometer gauge applies the step-wise displacement that precision is 1 μ m by back-up roller with the two balancing springs pair translation slide block that links to each other with the free beam movable end, drive the free beam movable end and move, apply bending load to sample.
3. according to the described reliability of thin-film materials on flexible electronic substrate original position of claim 1 evaluation system, it is characterized in that, Powerful Light Microscope is carried out the original position Real Time Observation and is shot with video-corder picture specimen surface pattern and surface crack evolutionary process, the overall process that develops can the real time record specimen surface takes place by CCD probe, and with the real-time sample evolutionary process digital picture of gathering of Powerful Light Microscope, by computer realization Flame Image Process and quantification calculating and analysis fast.
4. according to the described reliability of thin-film materials on flexible electronic substrate original position of claim 1 evaluation system, it is characterized in that sample is the single or multiple lift film of flexible electronic substrate surface attachment.
5. according to the described reliability of thin-film materials on flexible electronic substrate original position of claim 1 evaluation method, it is characterized in that it is as follows to utilize described original position to estimate concrete grammar:
(1) according to sample original length L
0Regulate the spacing between free beam stiff end and the free beam movable end;
(2) promote the free beam movable end by high-precision spiral mircrometer gauge and balancing spring, move horizontally along movable end thereby drive sample;
(3) according to free beam span L, sample original length L
0, draw the relational expression between each parameter and the free beam radius of curvature R:
(4) when the free beam span less than a certain critical value 2L
0During/π, the free beam radius-of-curvature equals L/2;
(5) can calculate and the corresponding size that applies strain stress in real time of free beam span in conjunction with the composite beam theory by the free beam radius-of-curvature:
Wherein, η is the thickness ratio of film and matrix material, and χ is the modular ratio of film and matrix material, d
fAnd d
sBe respectively the thickness of film and matrix;
(6) adopt Powerful Light Microscope that tested film surface appearance is carried out Real Time Observation and shoots with video-corder picture;
(7) by measuring the specimen surface crack density, draw crack density and apply strain relation, the strain value that correspondence applies when adopting anti-pushing manipulation to obtain crack density to be zero is with the Critical Cracking strain that is this membraneous material of this dependent variable value defined.
6. according to the described reliability of thin-film materials on flexible electronic substrate original position of claim 5 evaluation method, it is characterized in that: can estimate different derogatory behaviours and the Critical Cracking strain value thereof of membraneous material under stretching strain that positive curve that takes place under the bending load effect and contraflexure cause respectively and compressive strain effect.
7. according to the described reliability of thin-film materials on flexible electronic substrate original position of claim 5 evaluation method, it is characterized in that: the prepared film material is various at present known physics and the membraneous material with micron, sub-micron or nano thickness of chemical technology preparation on flexible electronic substrate.
8. according to the described reliability of thin-film materials on flexible electronic substrate original position of claim 7 evaluation method, it is characterized in that: tested membraneous material is for having electric conductivity or dielectric material.
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Family Cites Families (4)
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-
2008
- 2008-10-24 CN CN2008102282543A patent/CN101726442B/en not_active Expired - Fee Related
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